Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC2592 SWRS159 – FEBRUARY 2014 CC2592 2.4-GHz Range Extender 1 Introduction 1.1 Features 1 • Seamless Interface to 2.4-GHz Low-Power RF Devices from Texas Instruments • +22-dBm Output Power • 3-dB Typical Improved Sensitivity on CC2520, CC253X, and CC85XX • Very Few External Components – Integrated Switches – Integrated Matching Network – Integrated Balun – Integrated Inductors – Integrated PA – Integrated LNA 1.2 • • • • Applications All 2.4-GHz ISM Band Systems Wireless Sensor Networks Wireless Industrial Systems IEEE 802.15.4 and ZigBee® Metering Systems 1.3 • Digital Control of LNA Gain by HGM Terminal • 100 nA in Power Down (LNA_EN = PA_EN = 0) • Low-Transmit Current Consumption – 155 mA at 3 V for +22 dBm, PAE = 34% • Low-Receive Current Consumption – 4.0-mA for High-Gain Mode – 1.9-mA for Low-Gain Mode • 4.7-dB LNA Noise Figure, Including T/R Switch and External Antenna Match • RoHS Compliant 4-mm × 4-mm QFN-16 Package • 2.0-V to 3.7-V Operation • –40°C to +125°C Operation • • • IEEE 802.15.4 and ZigBee Gateways Wireless Consumer Systems Wireless Audio Systems Description The CC2592 device is a cost-effective and high-performance RF front end for low-power and low-voltage 2.4-GHz wireless applications. The CC2592 device is a range extender for all CC25XX 2.4-GHz low-power RF transceivers, transmitters, and system-on-chip products from Texas Instruments. To increase the link budget, the CC2592 device provides a power amplifier for increased output power and an LNA with a low-noise figure for improved receiver sensitivity. The CC2592 device provides a very small size, high-output power RF design with its 4-mm × 4-mm QFN16 package. The CC2592 device contains PA, LNA, switches, RF-matching, and balun for simple design of highperformance wireless applications. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2592 SWRS159 – FEBRUARY 2014 1.4 www.ti.com Functional Block Diagram Figure 1-1 shows a simplified block diagram of the CC2592 device. VDD_LNA VDD_PA VDD_BIAS ANT PA PREAMP EN BALUN RF_P EN RF_N LNA EN PA_EN BIAS LOGIC BIAS LNA_EN HGM Figure 1-1. CC2592 Simplified Block Diagram 2 Introduction Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com SWRS159 – FEBRUARY 2014 Revision History Date Literature Number Changes February 2014 SWRS159 Initial release Introduction Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 3 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 2 Device Characteristics 2.1 Absolute Maximum Ratings Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. Parameter Conditions Supply voltage All supply terminals must have the same voltage Voltage on any digital terminal Input RF level 2.2 Value Unit –0.3 to 3.8 V –0.3 to VDD+0.3, max 3.8 V +10 dBm Handling Ratings Under no circumstances must the handling ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. Parameter Conditions Value Unit –50 to 150 °C Human Body Model 2000 V Charge Device Model 1000 V Storage temperature range ESD 2.3 Recommended Operating Conditions The operating conditions for the CC2592 device are listed below. Parameter Min Max Unit Ambient temperature range –40 125 °C Operating supply voltage 2.0 3.7 V 2400 2483.5 MHz Operating frequency range 4 Conditions Device Characteristics Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com 2.4 SWRS159 – FEBRUARY 2014 Electrical Characteristics Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz (unless otherwise noted). Measured on CC2592EM reference design including external matching components. Parameter Test Conditions Receive current, high-gain mode HGM = 1 Receive current, low-gain mode Min Typ Max Unit 4 mA HGM = 0 1.9 mA POUT = 20 dBm 123 POUT = 22 dBm 155 Transmit current No input signal 50 Power down current EN = 0 High-input level (control terminals) PA_EN, LNA_EN, HGM Low-input level (control terminals) PA_EN, LNA_EN, HGM Transmit current 0.1 1.3 mA mA 0.3 µA Vdd V 0.3 V Power down - Receive mode switching time 1 µs Power down - Transmit mode switching time 1 µs RF Receive Gain, high-gain mode HGM = 1 11 dB Gain, low-gain mode HGM = 0 6 dB Gain variation over frequency 2400 to 2483.5 MHz, HGM = 1 2 dB Gain variation over power supply 2.0 V to 3.7 V, HGM = 1 1.5 dB Gain variation over temperature –40°C to 85°C, HGM = 1 1.7 dB Gain variation over temperature 85°C to 125°C, HGM = 1 1 dB Noise figure, high-gain mode HGM = 1, including internal T/R switch and external antenna match 4.7 dB Input 1-dB compression, high-gain mode HGM = 1 –18 dBm Input IP3, high-gain mode HGM = 1 –9 dBm Input reflection coefficient, S11 HGM = 1, measured at antenna port –15 dB 24 dB PIN = 0.0 dBm 20.3 PIN = 4.0 dBm 21.9 POUT = 22 dBm 34 % 15 dBm RF Transmit Gain Output power, POUT Power added efficiency, PAE Output 1-dB compression Output power variation over frequency 0.5 dB Output power variation over power supply 2.0 V to 3.7 V, PIN = 4 dBm 3.8 dB Output power variation over temperature –40°C to 125°C, PIN = 4 dBm 1.7 Second harmonic power FCC requirement –41.2 dBm Third harmonic power FCC requirement –41.2 dBm VSWR 2400 to 2483.5 MHz, PIN = 4 dBm dBm No damage 20:1 Stability 7.5:1 dB Device Characteristics Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 5 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 3 Device Information 3.1 Terminal and I/O Configuration GND VDD_PA VDD_BIAS VDD_LNA Figure 3-1 and Table 3-1, provide the terminal layout and description for the CC2592 device. 16 15 14 13 GND 1 12 GND RF_N 2 11 GND QFN-16 4x4mm GND 4 9 GND 5 6 7 8 BIAS ANT HGM 10 LNA_EN 3 PA_EN RF_P Figure 3-1. Terminal Top View 6 Device Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com SWRS159 – FEBRUARY 2014 Table 3-1. Terminal Functions Terminal Type Description No. Name – GND Ground The exposed die attach pad must be connected to a solid ground plane. See CC2592EM reference design for the recommended layout. 1, 4, 9, 11, 12, 16 GND Ground Ground connections. Only terminals 9, 11, and 12 should be shorted to the die attach pad on the top PCB layer. 2 RF_N RF RF interface toward CC25xx device 3 RF_P RF RF interface toward CC25xx device 5 PA_EN Digital input Digital control terminal. See Table 9-1 for details. 6 LNA_EN Digital input Digital control terminal. See Table 9-1 or details. 7 HGM Digital input Digital control terminal HGM = 1 → Device in High Gain Mode HGM = 0 → Device in Low Gain Mode 8 BIAS Analog Biasing input. Resistor between this node and ground sets bias current for PA and LNA. 10 ANT RF 13 VDD_LNA Power Antenna interface 2.0- to 3.7-V power 14 VDD_BIAS Power 2.0- to 3.7-V power 15 VDD_PA Power 2.0- to 3.7-V power Device Information Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 7 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 4 Sensitivity Improvement Example CC2592 CC2520 NF = 4.7 dB NF = 8 dB Gain = 11 dB Figure 4-1. The noise factor of a system consisting of the CC2592 device and a CC2520 device, as seen in Figure 41 is given by: 4.7 F 8 F 1 1010 1 F1 2 10 10 11 G1 1010 The noise figure is: NF 10log(F) 10log(3.37) 3.37 (1) 5.28 dB (2) The noise figure is reduced from 8 dB for the CC2520 standalone to 5.28 dB for the CC2592 and CC2520 device combination, leading to a 2.72-dB theoretical improvement in sensitivity. In practice, tests on the CC2592 and CC25XX devices show around 3-dB improvement in sensitivity. For the CC2538 and CC2592 devices, the improvement is almost 4 dB (approximately –97 dBm to –101 dBm) 8 Sensitivity Improvement Example Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com SWRS159 – FEBRUARY 2014 5 CC2592EM Evaluation Module Figure 5-1 shows an evaluation module circuit of the CC2592 device. VDD VDD C151 C131 C106 L101 VDD_PA C107 VDD_LNA C108 VDD_BIAS VDD LDB182G4520C-110 RF_P RF_P RF_P Balun RXTX RXTX SMA C109 L103 L102 C103 RF_N RF_N PA_EN PA_EN LNA_EN LNA_EN C101 BIAS C105 C152 RF_N CC2592 ANT SMA C21 HGM HGM R81 Figure 5-1. CC2592 Evaluation Module Table 5-1 lists the materials in the CC2592 evaluation module circuit. Table 5-1. List of Materials Device Function Value L101 PA bias inductor 4.7 nH, Multilayer chip inductor L102 Part of antenna match 1 nH, Multilayer chip inductor L103 Part of antenna match 1.8 nH, Multilayer chip inductor C101 Part of antenna match 2.2-pF 0402 Chip capacitor C103 Part of antenna match 2.2-pF 0402 Chip capacitor C105 Part of antenna match 0.1-pF 0402 Chip capacitor C106 Decoupling 12-pF 0402 Chip capacitor C107 Decoupling 1-nF 0402 Chip capacitor C108 Decoupling 1-µF 0402 Chip capacitor C109 DC block 18-pF 0402 Chip capacitor C21 Balun matching capacitor 0.2-pF 0402 Chip capacitor C152 Balun matching capacitor 0.3-pF 0402 Chip capacitor C131 Decoupling 1-nF 0402 Chip capacitor C151 Decoupling 12-pF 0402 Chip capacitor R81 Bias resistor 3.9 kΩ, 0402 resistor CC2592EM Evaluation Module Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 9 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 6 Typical Characteristics spacer 12 5.1 11 11 5.0 10 10 4.9 9 4.8 8 4.7 7 4.6 6 4.5 5 4.4 5 4 4.3 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 4 7 6 5 4 80 100 Temperature (C) 180 28 160 24 140 20 120 16 100 12 80 8 60 Pout PAE Ivdd ±8 ±4 Input Power (dBm) 0 4 40 3.8 C002 34 180 170 32 160 30 150 28 140 26 130 24 120 22 110 20 100 C007 36 180 34 170 32 160 30 150 28 140 26 130 24 120 22 110 Pout PAE Ivdd 20 18 20 8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 Power Supply (V) C004 Figure 5. Output Power, PAE, and Current Consumption Versus Input Power 10 3.6 Frequency (MHz) Current Consumption (mA) Output Power (dBm) and PAE (%) 200 32 ±12 3.4 Figure 4. Output Power, PAE, and Current Consumption Versus Frequency Input Power Level = +4 dBm 36 0 3.2 Pout PAE Ivdd C001 Figure 3. LNA Gain Versus Temperature 4 3.0 18 90 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 120 Output Power (dBm) and PAE (%) 60 2.8 Current Consumption (mA) Gain (dB) 8 ±16 2.6 36 9 ±20 2.4 Figure 2. LNA Gain Versus Power Supply 10 40 2.2 Power Supply (V) Output Power (dBm) and PAE (%) 11 20 HGM LGM 2.0 HGM LGM 0 7 C003 12 ±20 8 6 Figure 1. LNA Gain and Noise Figure Versus Frequency ±40 9 3.4 3.6 Current Consumption (mA) Gain (dB) Frequency (MHz) Gain (dB) HGM LGM NF HGM 12 Noise Figure (dB) 5.2 13 100 90 3.8 C005 Figure 6. Output Power, PAE, and Current Consumption Versus Power Supply Input Power Level = +4 dBm Typical Characteristics Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com SWRS159 – FEBRUARY 2014 160 Pout PAE Ivdd 34 158 32 156 30 154 28 152 26 150 24 148 22 146 20 144 18 Current Consumption (mA) Output Power (dBm) and PAE (%) 36 142 ±40 ±20 0 20 40 60 80 100 Temperature (C) 120 140 C006 Figure 7. Output Power, PAE, and Current Consumption Versus Temperature Input Power Level = +4 dBm Typical Characteristics Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 11 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 7 Controlling the Output Power from CC2592 The output power of the CC2592 device is controlled by controlling the input power. The CC2592 PA is designed to work in compression (class AB). Driving the CC2592 device too far into saturation might result in spurious emissions and harmonics above regulatory limits. This caution should especially be considered for systems targeting a wide operating temperature range, where a combination of low temperature, low supply voltage, and a transceiver that increases output power (drive level) at low temperature, can result in high spurious emissions. Figure 7-1 shows the maximum recommended drive level versus temperature and supply voltage. Figure 7-1. Maximum Recommended Drive Level 8 Input Levels on Control Terminals The three digital control terminals (PA_EN, LNA_EN, and HGM) have built-in level-shifting functionality, meaning that if the CC2592 device operates off a 3.7-V supply voltage, the control terminals still sense 1.6- to 1.8-V signals as a logical 1. However, the input voltages should not have a logical 1 level that is higher than the supply. 12 Input Levels on Control Terminals Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 CC2592 www.ti.com SWRS159 – FEBRUARY 2014 9 Connecting the CC2592 Device to a CC25xx Device Table 9-1 shows the control logic for connecting CC2592 to a CC25xx device. Table 9-1. Control Logic for Connecting CC2592 to a CC25xx Device PA_EN LNA_EN HGM 0 0 X Mode of Operation Power Down X 1 0 RX Low-Gain Mode X 1 1 RX High-Gain Mode 1 0 X TX Figure 9-1 shows the application circuit for the CC2592 and CC253X devices. VDD VDD C131 C151 C106 L101 VDD_PA C107 VDD_LNA C108 VDD_BIAS VDD RF_P RF_P RF_P RF_P RXTX RXTX SMA C109 L103 RF_N L102 CC2592 ANT C103 PA_EN P1.1 LNA_EN P1.0 HGM P0.7 CC2530 C101 BIAS C105 RF_N RF_N RF_N R81 Alternatively to VDD/GND/MCU Figure 9-1. Application Circuit Example for CC2530 + CC2592 Copyright © 2014, Texas Instruments Incorporated Connecting the CC2592 Device to a CC25xx Device Submit Documentation Feedback Product Folder Links: CC2592 13 CC2592 SWRS159 – FEBRUARY 2014 www.ti.com 10 Device and Documentation Support 10.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 10-1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY CC2592 Click here Click here Click here Click here Click here 10.2 Trademarks ZigBee is a registered trademark of ZigBee Alliance. 10.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 14 Device and Documentation Support Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2592 PACKAGE OPTION ADDENDUM www.ti.com 15-May-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC2592RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 CC2592 CC2592RGVT ACTIVE VQFN RGV 16 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-2-260C-1 YEAR -40 to 125 CC2592 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-May-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 13-Mar-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC2592RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 CC2592RGVT VQFN RGV 16 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Mar-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2592RGVR VQFN RGV 16 2500 338.1 338.1 20.6 CC2592RGVT VQFN RGV 16 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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