SPECIFICATIONS MODEL Infrared LAMP LED PART NO. LI520C [Contents] 1. Devices ------------------------------------------------ 1 2. Outline Dimensions --------------------------------- 1 3. Absolute Maximum Ratings ----------------------- 2 4. Electro-Optical Characteristics -------------------- 3 5. Reliability Tests -------------------------------------- 4 6. Characteristic Diagrams ---------------------------- 5 7. Bin Code Description ------------------------------- 6 8. Packing ------------------------------------------------ 7 9. Soldering Profile ------------------------------------- 10 10. Reference --------------------------------------------- 11 11. Precaution For Use ---------------------------------- 12 Rev : 0.0 1. Devices Lens Part Number LI520C Source Color Diffusion Dice Source Color Blue -Risen Non-Diffused GaAlAs/GaAs Infrared 2. Outline Dimensions 1.0 MAX1.0 4.98±0.2 2.5±0.05 2.5±0.2 5.00±0.2 1.0±0.2 28.0MIN 8.72±0.2 Notes : 1. All dimensions are in millimeters. 2. Protruded epoxy is 1.0mm maximum. 1 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 5.90±0.2 DETAIL -0.1 0.5 +0.2 0.5±0.05 CATHODE 1.8±0.2 3. Absolute Maximum Ratings (at Ta = 25ºC) Item Symbol Value Unit DC Forward Current IF 100 mA Forward Peak Pulse Current IFM*1 1000 mA Reverse Voltage VR 5 V Power Dissipation PD 150 mW Operating Temperature Topr -20 ~ +80 ºC Storage Temperature Tstg -30 ~ +100 ºC Solder Temperature TS 260 ºC for 5 second*2 ºC Notes :*1. t ≤ 0.01ms, D = 1/100 *2. 3mm bellow seating plane 2 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 4. Electro-Optical Characteristics (at IF = 100mA, Ta = 25ºC) Value Item Symbol Unit Min. Typ. Max. Radiant Intensity Ie 30 65 130 mW/sr Peak Wavelength λp - 940 - nm Spectrum Radiation Bandwidth ∆λ - 50 - nm Forward Voltage VF - 1.2 1.55 V View Angle 2θ½ 24 deg. Reverse Current (at VR = 5V) IR 10 µA Note : 1. Radiant Intensity Tolerance ± 10% 3 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 5. RELIABLITY TESTS Item Condition Ta = RT, Life Test IF = 100mA Note Failures 1000 hrs 0/22 High Temperature Operating Ta = 85ºC, IF = 25mA 1000 hrs 0/22 Low Temperature Operating Ta = -40ºC, IF = 100mA 1000 hrs 0/22 Thermal Shock Ta = -30ºC ~ +100º (Transfer time : 5sec , 1 Cycle =1hr) 100 cycles 0/22 Temperature Cycle Ta = -20ºC ~ +80ºC (Transfer time : 5min , 1 Cycle =1hr) 100 cycles 0/22 Resistance to soldering Heat Ts = 260 ± 5ºC, t = 10 ± 1 sec 1 time 0/22 ESD (Human Body Model) 1 kV, 1.5 kΩ ; 100 pF 1 time 0/22 High Temperature Storage Ta = 100ºC 1000 hrs 0/22 Low Temperature Storage Ta = -30ºC 1000 hrs 0/22 Temperature Humidity Storage Ta = +85ºC,RH=85% 1000hrs 0/22 Temperature Humidity Operating Ta = +85ºC,RH=85% IF = 25mA 100hrs 0/22 < Judging Criteria For Reliability Tests > VF USL 1 X 1.2 IR USL X 2.0 IV LSL 2 X 0.5 Notes : 1.USL : Upper Standard Level 2.LSL : Lower Standard Level. 4 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 6. Characteristic Diagrams Irel = f (θ ), Ta= 25ºC IF = f (VF), Ta= 25ºC 1.0 100 Forward Current IF [mA] Relative Luminous Intensity 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 10 1 90 1.00 Off Axis Angle [deg.] 1.15 1.20 1.25 1.30 Forward Voltage vs. Forward Current IV = f (IF), Ta= 25ºC 120 120 100 100 Forward Current IF [mA] Radiant Intensity [mW/sr] 1.10 Forward Voltage VF [V] Off Axis Angle vs. Relative Radiant Intensity 80 60 40 20 0 1.05 IF = f (Ta), Ta= 25ºC 80 60 40 20 20 40 60 80 100 0 -20 120 Forward Current IF [mA] 0 20 40 60 80 100 o Ambient Temperature Ta [ C] Forward Current vs. Radiant Intensity Ambient Temperature vs. Forward Current 5 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 1.35 7. Bin Code Description ** BIN CODE Radiant Intensity Radiant Intensity (Ie) @ IF = 100mA BIN CODE Min. Max. A 30 55 B 55 65 C 65 70 D 70 130 Peak Wavelength Forward Voltage Dominant Wavelength (nm) @ IF = 100mA 1 940 Forward Voltage (V) @ IF = 100mA BIN CODE Min. Max. 1 1.2 1.55 ** Note : Binning range can be changed by customer’s requirement. 6 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 8. PACKING 1) Bulk Packing (1) Antistatic poly vinyl bag apply Poly bag: 5φ Lamp Series : 500pcs 3φ Lamp Series : 500pcs (2) Inner box structure SEOUL SEMICONDUCTOR CO.,LTD 170mm TEL : (02) 3281-6269 97.0mm P/O No. Lot No 70mm Box : 2 poly bags 260mm (3) Outer box structure 315.0mm Box : 27 boxes 485.0mm 7 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 2) Tapping Outline Dimensions P 0±1.3 0±2.0 W Wo W2 Ho W1 F Do Po Package Dimensions (unit : mm) Ho* P 12.7±0.5 W 18.0 +1.0 -0.5 Po 12.7±0.3 Wo 13.0±0.3 F 2.54±0.5 W1 1.0±0.5 Do φ4.0±0.5 W2 9.0±0.5 1 Box contain quantity. * Remark : Ho - users define. ∗ 3φ Lamp Series : 3000pcs * 5φ Lamp Series : 2000pcs 8 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 3) Forming Outline Dimensions Po W Wo W2 Ho H F W1 H1 P Do Package Dimensions (unit : mm) H* W2 9.0±0.5 Ho * P 12.7±0.5 H1 * Po 12.7±0.3 W 18.0 +1.0 -0.5 F 5.0±0.5 Wo 13.0±0.3 Do φ4.0±0.5 W1 1.0±0.5 1 Box contain quantity. ∗ 3φ Lamp Series : 2000pcs * Remark : H / Ho / H1- users define. * 5φ Lamp Series : 1500pcs 9 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 9. SOLDERING PROFILE 1) Wave Soldering Conditions / Profile • Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max). • Soldering heat to be at 235 ºC (260ºC max) for 5 seconds (10 seconds max.) • Soak time above 200 ºC is 5 seconds 250 PEAK 5s (10s Max) O Temperature [ C] 200 235 ºC(260 ºC Max) 150 PREHEAT 100 20s (60s Max) 85 ºC(120 ºC max) 50 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 T im e [s ] 2) Hand Soldering conditions • Not more than 5 seconds at max. 300ºC, under Soldering iron. Note : In case the soldered products are reused in soldering process, we don’t guarantee the products. 10 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 34 36 10. PART NUMBERING SYSTEM 1 2 3 4 5 6 7 8 A B C L* * * * * * * - * * * 1) Lamp LED initial 2) Color U: Ultra Violet, B : Blue (460~490), C : Cyan (490~510), T : True Green (510~540), G : Yellow-Green (540~580) Y : Yellow (580~600) O : Orange (600~620) R : Red (620~700) W : White M : Warm I : Infrared 3) If the products have 2 or 3chips GR : Green + Red ( according to wavelength), FL : Full color 4) Outline type 1 : 3x2(square), 2 : 5x2(square), 6 : 3Phi Oval, 7 : 5Phi Oval 3 : Phi3, 5 : Phi 5 , 5) Half angle 1: ~14O, 2: 15~24O , 3: 25~34O, 4: 35~44O, 5 : 45~54O… 0 : more than 100O 6) 1st Development according to a chip 7) 2nd Development (other material) D : diffused C : colored Z : zener chip attached 8) Stand off type A, B, C : Bin cord description A: IV, B: WD C: VF 11 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 11. PRECAUTION FOR USE 1) In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccators) with a desiccant . 2) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12Hr, at 60±5℃. 3) In case of supposed the components is humid, shall be dried dip-solder just before, 12Hr at 80±5℃ or 10Hr at 100±5℃. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. 5) Quick cooling shall not be avoid. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products listed here in. 8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. 12 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430