IDT IDT74SSTVF16859NLG 13-bit to 26-bit registered buffer with sstl i/o Datasheet

IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED
BUFFER WITH SSTL I/O
FEATURES:
DESCRIPTION:
•
•
•
•
•
•
•
•
•
1:2 register buffer
Meets or exceeds JEDEC standard SSTVF16859
2.3V to 2.7V Operation for PC1600, PC2100, and PC2700
2.5V to 2.7V Operation for PC3200
SSTL_2 Class I style data inputs/outputs
Differential CLK input
RESET control compatible with LVCMOS levels
Latch-up performance exceeds 100mA
ESD >2000V per MIL-STD-883, Method 3015; >200V using
machine model (C = 200pF, R = 0)
• Available in 56 pin VFQFPN and 64 pin TSSOP packages
The SSTVF16859 is a 13-bit to 26-bit registered buffer designed for
2.3V-2.7V VDD for PC1600 - PC2700 and 2.5V-2.7V VDD for PC3200, and
supports low standby operation. All data inputs and outputs are SSTL_2
level compatible with JEDEC standard for SSTL_2.
RESET is an LVCMOS input since it must operate predictably during the
power-up phase. RESET, which can be operated independent of CLK and
CLK, must be held in the low state during power-up in order to ensure
predictable outputs (low state) before a stable clock has been applied.
RESET, when in the low state, will disable all input receivers, reset all
registers, and force all outputs to a low state, before a stable clock has been
applied. With inputs held low and a stable clock applied, outputs will remain
low during the Low-to-High transition of RESET.
APPLICATIONS:
• Along with CSPT857C, Zero Delay PLL Clock buffer, provides
complete solution for DDR1 DIMMs
FUNCTIONAL BLOCK DIAGRAM
RESET
CLK
CLK
VREF
D1
51
48
49
45
35
16
1D
Q1A
C1
R
32
Q1B
TO 12 OTHER CHANNELS
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL TEMPERATURE RANGE
AUGUST 2003
1
c
2003 Integrated Device Technology, Inc.
DSC-6194/13
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
Q7A
VDDQ
43 D11
VDD
D13
D12
VDDQ
GND
Q12A
Q13A
Q11A
Q10A
Q9A
VDDQ
56 Q8A
PIN CONFIGURATIONS
42 D10
1
Q13A
1
64
VDDQ
Q12A
2
63
GND
Q11A
3
62
D13
Q10A
4
61
D12
Q9A
5
60
VDD
VDDQ
6
59
VDDQ
Q6A
D9
GND
7
58
GND
Q5A
D8
Q8A
8
57
D11
Q4A
D7
Q7A
9
56
D10
Q3A
RESET
Q6A
10
55
D9
Q2A
GND
Q5A
11
54
GND
Q4A
12
53
D8
Q3A
13
52
D7
Q1A
CLK
GND
Q13B
CLK
VDDQ
VDDQ
Q12B
VDD
Q2A
14
51
RESET
GND
15
50
GND
CLK
Q11B
VREF
Q10B
D6
Q1A
16
49
Q9B
D5
Q13B
17
48
CLK
29 D4
VDDQ
18
47
VDDQ
Q12B
19
46
VDD
Q11B
20
45
VREF
Q10B
21
44
D6
Q9B
22
43
GND
Q8B
23
42
D5
Q7B
24
41
D4
Q6B
25
40
D3
GND
26
39
GND
VDDQ
27
38
VDDQ
Q5B
28
37
VDD
Q4B
29
36
D2
Q3B
30
35
D1
Q2B
31
34
GND
Q1B
32
33
VDDQ
D3 28
VDD
VDDQ
D2
D1
Q1B
VDDQ
Q2B
Q3B
Q4B
Q5B
VDDQ
Q6B
Q7B 15
Q8B 14
VFQFPN
TOP VIEW
ABSOLUTE MAXIMUM RATINGS (1)
Symbol
VDD or VDDQ
Description
Supply Voltage Range
Max.
Unit
–0.5 to 3.6
V
VI(2)
Input Voltage Range
–0.5 to VDD +0.5
V
VO(3)
Output Voltage Range
–0.5 to VDDQ +0.5
V
IIK
Input Clamp Current, VI < 0
–50
mA
IOK
Output Clamp Current,
±50
mA
±50
mA
±100
mA
–65 to +150
°C
TSSOP
TOP VIEW
VO < 0 or VO > VDDQ
IO
Continuous Output Current,
FUNCTION TABLE (1)
VO = 0 to VDDQ
VDD
Continuous Current through each
Input
VDD, VDDQ or GND
TSTG
Storage Temperature Range
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative voltage ratings may be exceeded if the ratings of the
I/P and O/P clamp current are observed.
3. The output current will flow if the following conditions are observed:
a) Output in HIGH state
b) VO = VDDQ
RESET
CLK
CLK
D
Q Outputs
H
↑
↓
L
L
H
↑
↓
H
H
H
L or H
L or H
X
Qo(2)
L
X
X
X
L
NOTES:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
↑ = LOW to HIGH
↓ = HIGH to LOW
2. Qo = Output level before the indicated steady-state conditions were established.
2
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
PIN DESCRIPTION
Pin Names
Q1 - Q13
Description
Data Output
GND
Ground
VDDQ
Output-stage drain power voltage
VDD
Logic power voltage
Asynchronous reset input - resets registers and disables data and clock differential input recievers
Input reference voltage
Positive master clock input
Negative master clock input
Data Input - clocked in on the crossing of the rising edge of CLK and the falling edge of CLK
Ground (MLF package only)
RESET
VREF
CLK
CLK
D1 - D13
Center PAD
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE FOR PC1600 PC2700
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: TA = 0°C to +70°C, VDD = 2.5V ±0.2V, VDDQ = 2.5V ±0.2V
Symbol
VIK
Parameter
Test Conditions
Control Inputs
VDD = 2.3V, II= −18mA
Min.
VDD = 2.3V to 2.7V, IOH = -100µA
VOH
VDD = 2.3V, IOH = -8mA
VOL
II
IDD
Typ.
Max.
Unit
—
—
–1.2
V
VDD – 0.2
—
—
V
1.95
—
—
VDD = 2.3V to 2.7V, IOL = 100µA
—
—
0.2
VDD = 2.3V, IOL = 8mA
—
—
0.35
All Inputs
VDD = 2.7V,VI = VDD or GND
—
—
±5
µA
Static Standby
IO = 0, VDD = 2.7V, RESET = GND
—
—
0.01
mA
Static Operating
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC)
—
—
20
Dynamic Operating (Clock Only)
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),
—
6
—
CLK and CLK Switching 50% Duty Cycle.
IDDD
Dynamic Operating
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),
(Per Each Data Input)(1)
CLK and CLK Switching 50% Duty Cycle. One Data Input
Data Inputs
VDD = 2.5V, VI = VREF ± 310mV
2
—
3
CLK and CLK
VICR = 1.25V, VI (PP) = 360mV
2
—
3
RESET
VI = VDD or GND
2
—
3
NOTE:
1. Power dissipation levels will allow operation at DDR333 speeds without excessive die temperature.
3
µA/Clock
MHz
—
43
—
µA/Clock
MHz/Data
Switching at Half Clock Frequency, 50% Duty Cycle.
CI
V
Input
pF
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE FOR PC3200
Following Conditions Apply Unless Otherwise Specified:
Operating Condition: TA = 0°C to +70°C, VDD = 2.6V ±0.1V, VDDQ = 2.6V ±0.1V
Symbol
VIK
Parameter
Test Conditions
Control Inputs
VDD = 2.5V, II= −18mA
VOH
VDD = 2.5V to 2.7V, IOH = -100µA
VDD = 2.5V, IOH = -8mA
II
Typ.
Max.
Unit
—
—
–1.2
V
V
VDD – 0.2
—
—
1.95
—
—
VDD = 2.5V to 2.7V, IOL = 100µA
—
—
0.2
VDD = 2.5V, IOL = 8mA
—
—
0.35
All Inputs
VDD = 2.7V,VI = VDD or GND
—
—
±5
µA
Static Standby
IO = 0, VDD = 2.7V, RESET = GND
—
—
0.01
mA
VOL
IDD
Min.
Static Operating
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC)
—
—
20
Dynamic Operating (Clock Only)
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),
—
6
—
µA/Clock
Dynamic Operating
IO = 0, VDD = 2.7V, RESET = VDD, VI = VIH (AC) or VIL (AC),
—
43
—
µA/Clock
(Per Each Data Input)(1)
CLK and CLK Switching 50% Duty Cycle. One Data Input
CLK and CLK Switching 50% Duty Cycle.
IDDD
MHz
MHz/Data
Switching at Half Clock Frequency, 50% Duty Cycle.
CI
V
Input
Data Inputs
VDD = 2.6V, VI = VREF ± 310mV
2
—
3
CLK and CLK
VICR = 1.3V, VI (PP) = 360mV
2
—
3
RESET
VI = VDD or GND
2
—
3
pF
NOTE:
1. Power dissipation levels will allow operation at DDR400 speeds without excessive die temperature.
OPERATING CHARACTERISTICS, TA = 25ºC (1)
Parameter
Min.
Typ.(1)
Max.
Unit
VDD
Supply Voltage
VDDQ
—
2.7
V
VDDQ
Output Supply Voltage
PC1600-PC2700
2.3
2.5
2.7
V
PC3200
2.5
2.6
2.7
PC1600-PC2700
1.15
1.25
1.35
PC3200
1.25
1.3
1.35
VREF– 40mV
VREF
VREF+ 40mV
V
0
—
VDD
V
Symbol
VREF
V TT
Reference Voltage (VREF= VDDQ/2)
Termination Voltage
VI
Input Voltage
VIH
AC High-Level Input Voltage
Data Inputs
VREF+ 310mV
—
—
V
VIL
AC Low-Level Input Voltage
Data Inputs
—
—
VREF– 310mV
V
VIH
DC High-Level Input Voltage
Data Inputs
VREF+ 150mV
—
—
V
VIL
DC Low-Level Input Voltage
Data Inputs
—
—
VREF– 150mV
V
VIH
High-Level Input Voltage
RESET
1.7
—
—
V
VIL
Low-Level Input Voltage
RESET
—
—
0.7
V
VICR
Common-Mode Input Range
CLK, CLK
0.97
—
1.53
V
VI (PP)
Peak-to-Peak Input Voltage
CLK, CLK
360
—
—
mV
IOH
High-Level Output Current
—
—
– 16
mA
IOL
Low-Level Output Current
—
—
16
TA
Operating Free-Air Temperature
0
—
+70
NOTE:
1.
V
The RESET input of the device must be held at VDD or GND to ensure proper device operation.
4
°C
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
TIMING REQUIREMENTS OVER RECOMMENDED OPERATING FREE-AIR
TEMPERATURE RANGE
PC1600 - PC2700
Symbol
CLOCK
Parameter
PC3200
Min.
Max.
Min.
Max.
Unit
Clock Frequency
—
200
—
220
MHz
tw
Pulse Duration, CLK, CLK HIGH or LOW
2.5
—
2.5
—
ns
tACT
Differential Inputs Active Time(1)
—
22
—
22
ns
tINACT
Differential Inputs Inactive Time
tSU
Setup Time, Fast Slew Rate(3, 5)
Data Before CLK↑, CLK↓
Setup Time, Slow Slew Rate(4, 5)
tH
—
22
—
22
ns
0.65
—
0.65
—
ns
0.75
—
0.75
—
ns
0.75
—
0.65
—
ns
0.9
—
0.8
—
ns
(2)
Hold Time, Fast Slew Rate(3,5)
Hold Time, Slow Slew Rate
Data Before CLK↑, CLK ↓
(2,5)
NOTES:
1. Data inputs must be low a minimum time of tACT max., after RESET is taken HIGH.
2. Data and clock inputs must be held at valid levels (not floating) a minimum time of tINACT max., after RESET is taken LOW.
3. For data signal input slew rate is ≥1V/ns.
4. For data signal input slew rate is ≥0.5V/ns and <1V/ns.
5. CLK, CLK signal input slew rates are ≥1V/ns.
SWITCHING CHARACTERISTICS OVER RECOMMENDED FREE-AIR OPERATING
RANGE (UNLESS OTHERWISE NOTED)
PC1600 - PC2700
Symbol
fMAX
tPDM
tPDMSS
tPHL
Parameter
CLK and CLK to Q
CLK and CLK to Q (simultaneous switching)
RESET to Q
Min.
200
1.1
—
—
5
Max.
—
2.6
2.9
5
PC3200
Min.
220
1.1
—
—
Max.
—
2.4
2.68
5
Unit
MHz
ns
ns
ns
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
TEST CIRCUITS AND WAVEFORMS
FOR PC1600 - PC2700, VDD = 2.5V ± 0.2V
FOR PC3200, VDD = 2.6V ± 0.1V
VTT
RL = 50Ω
From output
under test
Test Point
CL = 30 pF
(see note 1)
Load Circuit
LVCMOS
RESET
Input
VDD
VDD/2
VDD/2
tINACT
IDD
Timing
Input
0V
tACT
tPLH
90%
10%
VICR
VICR
Output
VI(PP)
tPHL
VTT
VTT
VOH
VOL
(see note 2)
Voltage and Current Waveforms
Inputs Active and Inactive Times
Voltage Waveforms - Propagation Delay Times
LVCMOS
RESET
Input
VIH
VDD/2
VIL
tPHL
tW
VOH
VIH
Input
VREF
VREF
Output
VIL
VICR
tSU
VOL
Voltage Waveforms - Propagation Delay Times
Voltage Waveforms - Pulse Duration
Timing
Input
VTT
VI(PP)
tH
VIH
Input
VREF
VREF
VIL
Voltage Waveforms - Setup and Hold Times
NOTES:
1. CL includes probe and jig capacitance.
2. IDD tested with clock and data inputs held at VDD or GND, and IO = 0mA.
3. All input pulses are supplied by generators having the following characteristics: PRR ≤10MHz, ZO = 50Ω, input slew rate = 1 V/ns ±20% (unless otherwise specified).
4. The outputs are measured one at a time with one transition per measurement.
5. VTT = VREF = VDDQ/2
6. VIH = VREF + 310mV (AC voltage levels) for differential inputs. VIH = VDD for LVCMOS input.
7. VIL = VREF - 310mV (AC voltage levels) for differential inputs. VIL = GND for LVCMOS input.
8. tPDM is tPD with one output switching. tPDMSS is tPD with all outputs switching.
6
IDT74SSTVF16859
13-BIT TO 26-BIT REGISTERED BUFFER WITH SSTL I/O
COMMERCIAL TEMPERATURE RANGE
ORDERING INFORMATION
IDT74SSTVF
XX
Family
XXX
Device Type
XX
Package
XX
Process
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
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0°C to +70°C (Commercial)
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NL
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Thin Shrink Small Outline Package
TSSOP - Green
Thermally Enhanced Plastic Very Fine Pitch
Quad Flat No Lead Package
VFQFPN - Green
859
13-Bit to 26-Bit Registered Buffer with SSTL I/O
16
Double-Density
for SALES:
800-345-7015 or 408-727-6116
fax: 408-492-8674
www.idt.com
7
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[email protected]
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