ISSI IS61LV25616L 256K x 16 HIGH SPEED ASYNCHRONOUS CMOS STATIC RAM WITH 3.3V SUPPLY ® JUNE 2002 DESCRIPTION The ISSI IS61LV25616L is a high-speed, 4,194,304-bit FEATURES • High-speed access time: — 10, 12, and 15 ns • Low Active Power — Less than 90mA (typ.) Active Current • Low standby power: — Less than 1 mA (typ.) CMOS standby • TTL compatible interface levels • Single 3.3V power supply • Fully static operation: no clock or refresh required • Three state outputs • Data control for upper and lower bytes • Industrial temperature available static RAM organized as 262,144 words by 16 bits. It is fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative circuit design techniques, yields high-performance and low power consumption devices. When CE is HIGH (deselected), the device assumes a standby mode at which the power dissipation can be reduced down with CMOS input levels. Easy memory expansion is provided by using Chip Enable and Output Enable inputs, CE and OE. The active LOW Write Enable (WE) controls both writing and reading of the memory.A data byte allows Upper Byte (UB) and Lower Byte (LB) access. The IS61LV25616L is packaged in the JEDEC standard 44-pin 400-mil SOJ, 44-pin TSOP Type II, 44-pin LQFP and 48-pin Mini BGA (8mm x 10mm). FUNCTIONAL BLOCK DIAGRAM A0-A17 DECODER 256K x 16 MEMORY ARRAY VCC GND I/O0-I/O7 Lower Byte I/O DATA CIRCUIT I/O8-I/O15 Upper Byte COLUMN I/O CE OE WE CONTROL CIRCUIT UB LB Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 1 ISSI IS61LV25616L ® PIN CONFIGURATIONS 44-Pin TSOP (Type II) and SOJ 48-Pin mini BGA 1 2 A17 A16 A15 OE UB LB I/O15 I/O14 I/O13 I/O12 GND Vcc I/O11 I/O10 I/O9 I/O8 NC A14 A13 A12 A11 A10 A17 A16 A15 A14 A13 A12 A11 A10 OE UB LB 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 CE I/O0 I/O1 I/O2 I/O3 Vcc GND I/O4 I/O5 I/O6 I/O7 44 43 42 41 40 39 38 37 36 35 34 33 1 32 2 31 3 30 4 29 5 TOP VIEW 28 6 27 7 26 8 25 9 24 10 23 11 12 13 14 15 16 17 18 19 20 21 22 I/O15 I/O14 I/O13 I/O12 GND Vcc I/O11 I/O10 I/O9 I/O8 NC WE A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A0 A1 A2 A3 A4 CE I/O0 I/O1 I/O2 I/O3 Vcc GND I/O4 I/O5 I/O6 I/O7 WE A5 A6 A7 A8 A9 44-Pin LQFP PIN DESCRIPTIONS 2 3 4 5 6 A0-A17 Address Inputs I/O0-I/O15 Data Inputs/Outputs CE Chip Enable Input OE Output Enable Input A1 A2 N/C WE Write Enable Input A3 A4 CE I/O0 LB Lower-byte Control (I/O0-I/O7) I/O10 A5 A6 I/O1 I/O2 UB Upper-byte Control (I/O8-I/O15) I/O11 A17 A7 I/O3 Vcc NC No Connection I/O12 NC A16 I/O4 GND Vcc Power I/O14 I/O13 A14 A15 I/O5 I/O6 GND Ground G I/O15 NC A12 A13 WE I/O7 H NC A8 A9 A10 A11 NC A LB OE A0 B I/O8 UB C I/O9 D GND E Vcc F Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 ISSI IS61LV25616L ® TRUTH TABLE I/O PIN I/O0-I/O7 I/O8-I/O15 WE CE OE LB UB Mode 1 Vcc Current Not Selected X H X X X High-Z High-Z ISB1, ISB2 Output Disabled H X L L H X X H X H High-Z High-Z High-Z High-Z I CC Read H H H L L L L L L L H L H L L DOUT High-Z DOUT High-Z DOUT DOUT I CC Write L L L L L L X X X L H L H L L DIN High-Z DIN High-Z DIN DIN I CC 2 3 4 5 ABSOLUTE MAXIMUM RATINGS(1) Symbol Parameter Value Unit –0.5 to Vcc+0.5 V VTERM Terminal Voltage with Respect to GND TBIAS Temperature Under Bias –45 to +90 °C VCC Vcc Related to GND –0.3 to +4.0 V TSTG Storage Temperature –65 to +150 °C PT Power Dissipation 1.0 W 6 7 8 Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 9 10 OPERATING RANGE Range Commercial Industrial Ambient Temperature 10 ns VCC 12 ns, 15 ns VCC 0°C to +70°C 3.3V +10%, -5% 3.3V ± 10% –40°C to +85°C 3.3V +10%, -5% 3.3V ± 10% Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 11 12 3 ISSI IS61LV25616L ® DC ELECTRICAL CHARACTERISTICS (Over Operating Range) Symbol Parameter Test Conditions Min. Max. Unit VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 — V VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA — 0.4 V VIH Input HIGH Voltage 2.0 VCC + 0.3 V VIL Input LOW Voltage(1) –0.3 0.8 V ILI Input Leakage GND ≤ VIN ≤ VCC Com. Ind. –1 –5 1 5 µA ILO Output Leakage GND ≤ VOUT ≤ VCC, 4 Outputs Disabled Com. Ind. –1 –5 1 5 µA Notes: 1. VIL (min.) = –2.0V for pulse width less than 10 ns. POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range) -10 -12 Min. Max. -15 Symbol Parameter Test Conditions Min. Max. Min. Max. Unit ICC Vcc Dynamic Operating Supply Current VCC = Max., Com. IOUT = 0 mA, f = fMAX Ind. — — 125 135 — — 115 125 — — 105 115 mA ISB TTL Standby Current (TTL Inputs) VCC = Max., VIN = VIH or VIL CE ≥ VIH, f = fMAX. Com. Ind. — — 65 70 — — 55 60 — — 45 50 mA ISB1 TTL Standby Current (TTL Inputs) VCC = Max., VIN = VIH or VIL CE ≥ VIH, f = 0 Com. Ind. — — 15 20 — — 15 20 — — 15 20 mA ISB2 CMOS Standby Current (CMOS Inputs) VCC = Max., Com. CE ≥ VCC – 0.2V, Ind. VIN ≥ VCC – 0.2V, or VIN ≤ 0.2V, f = 0 — — 5 10 — — 5 10 — — 5 10 mA Note: 1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change. Shaded area product in development CAPACITANCE(1) Symbol Parameter CIN Input Capacitance COUT Input/Output Capacitance Conditions Max. Unit VIN = 0V 6 pF VOUT = 0V 8 pF Note: 1. Tested initially and after any design or process changes that may affect these parameters. 4 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 ISSI IS61LV25616L ® READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range) Symbol tRC tAA tOHA tACE tDOE tHZOE(2) tLZOE(2) tHZCE(2 tLZCE(2) tBA tHZB(2) tLZB(2) tPU tPD -10 Min. Max. Parameter -12 Min. Max. -15 Min. Max. 1 Unit Read Cycle Time 10 — 12 — 15 — ns Address Access Time — 10 — 12 — 15 ns Output Hold Time 3 — 3 — 3 — ns CE Access Time — 10 — 12 — 15 ns OE Access Time — 4 — 5 — 7 ns OE to High-Z Output — 4 — 5 0 6 ns OE to Low-Z Output 0 — 0 — 0 — ns CE to High-Z Output 0 4 0 6 0 8 ns CE to Low-Z Output 3 — 3 — 3 — ns LB, UB Access Time — 4 — 5 — 7 ns LB, UB to High-Z Output 0 3 0 4 0 5 ns LB, UB to Low-Z Output 0 — 0 — 0 — ns Power Up Time 0 — 0 — 0 — ns Power Down Time — 10 — 12 — 15 ns 2 3 4 5 Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Shaded area product in development 6 7 AC TEST CONDITIONS Parameter Input Pulse Level Input Rise and Fall Times Input and Output Timing and Reference Level Output Load Unit 0V to 3.0V 3 ns 1.5V 8 See Figures 1 and 2 9 AC TEST LOADS 10 319 Ω 319 Ω 3.3V 3.3V OUTPUT OUTPUT 11 30 pF Including jig and scope Figure 1 353 Ω 5 pF Including jig and scope 12 Figure 2 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 353 Ω 5 ISSI IS61LV25616L ® AC WAVEFORMS READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL) t RC ADDRESS t AA t OHA t OHA DOUT DATA VALID PREVIOUS DATA VALID READ1.eps READ CYCLE NO. 2(1,3) tRC ADDRESS tAA tOHA OE tHZOE tDOE tLZOE CE tACE tHZCE tLZCE LB, UB DOUT VCC HIGH-Z tBA tLZB tHZB tRC DATA VALID tPU tPD 50% Supply Current ICC 50% ISB UB_CEDR2.eps Notes: 1. WE is HIGH for a Read Cycle. 2. The device is continuously selected. OE, CE, UB, or LB = VIL. 3. Address is valid prior to or coincident with CE LOW transition. 6 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 ISSI IS61LV25616L ® WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range) Symbol Parameter -10 Min. Max. -12 Min. Max. -15 Min. Max. 1 Unit tWC Write Cycle Time 10 — 12 — 15 — ns tSCE CE to Write End 8 — 8 — 10 — ns tAW Address Setup Time to Write End 8 — 8 — 10 — ns tHA Address Hold from Write End 0 — 0 — 0 — ns tSA Address Setup Time 0 — 0 — 0 — ns tPWB LB, UB Valid to End of Write 8 — 8 — 10 — ns tPWE1 WE Pulse Width 8 — 8 — 10 — ns tPWE2 WE Pulse Width (OE = LOW) 10 — 12 — 12 — ns tSD Data Setup to Write End 6 — 6 — 7 — ns tHD Data Hold from Write End 0 — 0 — 0 — ns tHZWE(2) WE LOW to High-Z Output — 5 — 6 — 7 ns tLZWE WE HIGH to Low-Z Output 2 — 2 — 2 — ns (2) 2 3 4 5 6 Notes: 1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V and output loading specified in Figure 1. 2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested. 3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write. Shaded area product in development 7 8 9 10 11 12 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 7 ISSI IS61LV25616L ® AC WAVEFORMS WRITE CYCLE NO. 1 (CE Controlled, OE is HIGH or LOW) (1 ) t WC VALID ADDRESS ADDRESS t SA t SCE t HA CE t AW t PWE1 t PWE2 WE t PBW UB, LB t HZWE DOUT DATA UNDEFINED t LZWE HIGH-Z t SD DIN t HD DATAIN VALID UB_CEWR1.eps Notes: 1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one of the LB and UB inputs being in the LOW state. 2. WRITE = (CE) [ (LB) = (UB) ] (WE). 8 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 ISSI IS61LV25616L ® AC WAVEFORMS WRITE CYCLE NO. 2 (WE Controlled. OE is HIGH During Write Cycle) (1,2) 1 t WC ADDRESS VALID ADDRESS 2 t HA OE CE 3 LOW t AW t PWE1 WE t SA 4 t PBW UB, LB t HZWE DOUT t LZWE 5 HIGH-Z DATA UNDEFINED t SD t HD DATAIN VALID DIN 6 UB_CEWR2.eps 7 WRITE CYCLE NO. 3 (WE Controlled. OE is LOW During Write Cycle) (1) t WC ADDRESS OE 8 VALID ADDRESS t HA LOW 9 CE LOW t AW 10 t PWE2 WE t SA t PBW 11 UB, LB t HZWE DOUT DATA UNDEFINED t LZWE HIGH-Z t SD DIN 12 t HD DATAIN VALID UB_CEWR3.eps Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 9 ISSI IS61LV25616L ® AC WAVEFORMS WRITE CYCLE NO. 4 (LB, UB Controlled, Back-to-Back Write) t WC ADDRESS (1,3) t WC ADDRESS 1 ADDRESS 2 OE t SA CE LOW t HA t SA WE UB, LB t HA t PBW t PBW WORD 1 WORD 2 t HZWE DOUT t LZWE HIGH-Z DATA UNDEFINED t HD t SD DIN DATAIN VALID t HD t SD DATAIN VALID UB_CEWR4.eps Notes: 1. The internal Write time is defined by the overlap of CE = LOW, UB and/or LB = LOW, and WE = LOW. All signals must be in valid states to initiate a Write, but any can be deasserted to terminate the Write. The t SA, t HA, t SD, and t HD timing is referenced to the rising or falling edge of the signal that terminates the Write. 2. Tested with OE HIGH for a minimum of 4 ns before WE = LOW to place the I/O in a HIGH-Z state. 3. WE may be held LOW across many address cycles and the LB, UB pins can be used to control the Write function. 10 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 ISSI IS61LV25616L ® ORDERING INFORMATION Commercial Range: 0°C to +70°C Speed (ns) Order Part No. Package 10 IS61LV25616L-10T IS61LV25616L-10K IS61LV25616L-10LQ IS61LV25616L-10B TSOP (Type II) 400-mil SOJ LQFP Mini BGA (8mm x 10mm) 12 IS61LV25616L-12T IS61LV25616L-12K IS61LV25616L-12LQ IS61LV25616L-12B 15 IS61LV25616L-15T IS61LV25616L-15K 1 Industrial Range: –40°C to +85°C Speed (ns) Order Part No. Package 10 IS61LV25616L-10TI IS61LV25616L-10KI IS61LV25616L-10LQI IS61LV25616L-10BI TSOP (Type II) 400-mil SOJ LQFP Mini BGA (8mm x 10mm) TSOP (Type II) 400-mil SOJ LQFP Mini BGA (8mm x 10mm) 12 IS61LV25616L-12TI IS61LV25616L-12KI IS61LV25616L-12LQI IS61LV25616L-12BI TSOP (Type II) 400-mil SOJ LQFP Mini BGA (8mm x 10mm) TSOP (Type II) 400-mil SOJ 15 IS61LV25616L-15TI IS61LV25616L-15KI TSOP (Type II) 400-mil SOJ 2 3 4 5 6 7 8 9 10 11 12 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 Rev. B 06/28/02 11