GMT G914A 300ma high psrr, low-noise ldo regulator Datasheet

G914X
Global Mixed-mode Technology Inc.
300mA High PSRR, Low-Noise LDO Regulators
Features
General Description
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The G914X is a low supply current, high PSRR low
dropout linear regulator that comes in a space saving
SOT-23-5 package. The supply current at no-load is
55µA. In the shutdown mode, the maximum supply
current is less than 1µA. Operating voltage range of
the G914X is from 2.5V to 5.5V. The over-current protection limit is set at 500mA typical and 400mA minimum. An over- temperature protection circuit is built-in
in the G914X to prevent thermal overload. These
power saving features make the G914X ideal for use
in the battery-powered applications such as notebook
computers, cellular phones, and PDA’s.
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Ultra Low Output Noise⎯30µV (rms)
Ultra Low 55µA No-Load Supply Current
Ultra Low Dropout 70mV @ 50mA Load
Guarantee 300mA Output Current
Over-Temperature and Short-Circuit Protection
Fixed Mode: 2.70V (G914A), 2.80V (G914B)
3.00V (G914C), 3.30V (G914D)
2.50V (G914E), 2.85V (G914F)
1.50V (G914G), 1.80V (G914H)
Adjustable Mode: from 1.25V to 5.50V (G914Z)
PSRR=70dB
Max. Supply Current in Shutdown Mode < 1µA
Stable with low cost ceramic capacitors
Applications
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Notebook Computers
Cellular Phones
PDA
Hand-Held Devices
Battery-Powered Application
Ordering Information
ORDER
NUMBER
ORDER NUMBER
(Pb free)
MARKING
VOLTAGE
TEMP.
RANGE
PACKAGE
G914A
G914B
G914C
G914D
G914E
G914F
G914G
G914H
G914Z
G914Af
G914Bf
G914Cf
G914Df
G914Ef
G914Ff
G914Gf
G914Hf
G914Zf
4Axx
4Bxx
4Cxx
4Dxx
4Exx
4Fxx
4Gxx
4Hxx
4Zxx
2.70V
2.80V
3.00V
3.30V
2.50V
2.85V
1.50V
1.80V
Adjustable
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
-40°C~ +85°C
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
SOT-23-5
Pin Configuration
Typical Application Circuit
G914A~G914H
IN
1
GND
2
G914A~G914H
5
IN
OUT
OUTPUT
VOLTAGE
OUT
+
BATTERY
CIN
- 1µF
BYP
CBYP
10nF
GND
SHDN
3
4
BYP
SOT-23-5
Fixed mode
G914Z
G914Z
IN
IN
1
COUT
4.7µF
SHDN
5
OUTPUT
VOLTAGE
OUT
OUT
R1
+
GND
CIN
1µF
BATTERY -
2
SET
SHDN
GND
SHDN 3
4
R2
COUT
4.7µF
SET
SOT-23-5
Adjustable mode
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Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
VIN to GND. . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +7V
Output Short-Circuit Duration. . . . . . . . . . .. . . . . .Infinite
All Other Pins to GND. . . . . . . . . . .-0.3V to (VIN + 0.3V)
Thermal Resistance Junction to Ambient, (θJA)
SOT-23-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C/W
Operating Temperature Range. . . . . . .-40°C to +85°C
Juction Temperature. . . . . . . . . . . . . . . . . . . . .+150°C
Storage Temperature Range. . . . . . . -65°C to +160°C
Reflow Temperature (soldering, 10sec) . . . . . . 260°C
Note (1): See Recommended Minimum Footprint
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN=VOUT(STD)+1V, V SHDN =VIN, TA=TJ =25°C, unless otherwise noted.) (Note 1)
PARAMETER
Input Voltage (Note 2)
Output Voltage Accuracy
SYMBOL
CONDITIONS
VIN
VOUT
5.5
-2
---
2
---
3
VIN =3.6V
IOUT = 150mA
VDROP
IOUT =300mA
---
4
300
---
mA
mA
---
500
---
55
120
ILOAD = 50mA
---
145
---
ILOAD = 300mA
---
265
---
---
2
---
---
70
---
VO (NOM) ≥ 3.0V
---
230
---
2.5V≤VO (NOM) ≤2.85V
---
250
---
VO (NOM) = 1.8V
---
380
---
VO (NOM) = 1.5V
---
510
---
VO (NOM) ≥ 3.0V
---
450
600
2.5V≤VO (NOM) ≤2.85V
---
500
660
VO (NOM) = 1.8V
---
760
1500
VO (NOM) = 1.5V
%
-4
---
IOUT = 50mA, VOUT ≥ 2.7V Version
V
--ILOAD = 0mA
IOUT = 1mA
Dropout Voltage (Note 4)
MAX UNITS
-3
ILIM
IQ
---
For G914H, IOUT=1mA
For G914G, IOUT=1mA
Ground Pin Current
TYP
Variation from specified VOUT, IOUT=1mA,VOUT≥2.5V version
Maximum Output Current
Current Limit (Note 3)
MIN
Note2
µA
mV
---
910
1800
Line Regulation
ΔVLNR
VIN=VOUT+100mV to 5.5V, IOUT = 1mA
---
0.1
0.28
%/V
Load Regulation (Note 5)
ΔVLDR
IOUT = 10mA to 300mA
---
0.1
1
%
Power Supply Rejection Ratio
PSRR
IOUT = 10mA CBYP = 10nF, f = 120HZ
---
70
---
dB
---
30
---
ppm/°C
Output Voltage Temperature
Coefficient
ΔVO/ΔT IOUT = 50mA, TJ = 25°C to 125°C
Output Voltage Noise
(10Hz to 100kHz)
(G914H)
en
VIN=VOUT+1V
COUT = 1µF, IOUT = 150mA, CBYP=1nF
---
52
---
COUT = 1µF, IOUT = 150mA, CBYP=10nF
---
35
---
COUT = 1µF, IOUT = 150mA, CBYP = 100nF
---
30
---
COUT = 1µF, IOUT = 1mA, CBYP = 10nF
---
26
---
µVRMS
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Electrical Characteristics
(VIN=VOUT(STD)+1V, V SHDN =VIN, TA=TJ =25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
SHUTDOWN
SHDN Input Threshold
VIH
Regulator enabled
1.5
---
---
VIL
Regulator shutdown
---
---
0.4
V SHDN = VIN
TA = +25°C
---
0.003
0.1
VOUT = 0V
TA = +25°C
---
---
1
TSHDN
---
150
---
°C
ΔTSHDN
---
15
---
°C
1.225
1.25
1.275
V
---
5
30
nA
SHDN Input Bias Current
ISHDN
Shutdown Supply Current
IQ SHDN
V
µA
THERMAL PROTECTION
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
SET INPUT
SET Reference Voltage
VSET
VIN = 2.5V to 5.5V,IOUT = 1mA
SET Input Leakage Current
ISET
VSET = 1.3V
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Limits is 100% production tested at T A = +25°C. Low duty pulse techniques are used during test to maintain
junction temperature as close to ambient as possible.
VIN (min)=VOUT (STD)+VDROPOUT
Not tested. For design purposes, the current limit should be considered 400mA minimum to 600mA maximum.
The dropout voltage is defined as (VIN - VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +1V. The performance of every G914X version, see “Typical Performance Characteristics”.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load
regulation in the load range from 1mA to 300mA. Changes in output due to heating effects are covered by the thermal
regulation specification.
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Typical Performance Characteristics
(VIN = V O+1V, CIN=1µF, COUT=1µF, V SHDN = VIN, G914D, TA =25°C, unless otherwise noted.)
Output Voltage vs. Load Current
Ground Current vs. Load Current
3.340
400
3.330
G914D
Ground Current (µA)
350
Output Voltage (V)
3.320
3.310
3.300
3.290
3.280
3.270
VIN=3.6V
No Load
300
250
200
150
100
3.260
50
3.250
3.240
0
0
50
100
150
200
250
300
0
50
Output Voltage vs. Input Voltage
150
200
250
300
Supply Current vs. Input Voltage
3.5
400
350
3.0
ILOAD=300mA
No Load
300
2.5
Supply Current (µA)
Output Voltage (V)
100
Load Current (mA)
Load Current (mA)
2.0
1.5
1.0
250
200
ILOAD=50mA
150
100
0.5
50
0.0
0
ILOAD=0mA
0
1
2
3
4
5
0
6
1
2
3
4
5
6
Input Voltage (V)
Input Voltage (V)
Ouptut Noise 10HZ to 100kHZ
Dropout Voltage vs. Load Current
1000
TA=25°C
Dropout Voltage (mV)
900
800
G914E
G914H
700
600
G914G
500
400
Top to down
G914A
G914B
G914F
G914C
G914D
300
200
100
0
0
50
100
150
200
250
300
Loading (mA)
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Typical Performance Characteristics (continued)
SHDN Input Bias Current vs. Temperature
Ground Current vs. Temperature
0.20
G914D
VIN = 4.3V
IOUT =0A
80
SHDN Input Bias Current (µA)
Ground Current (µA)
100
60
40
20
0.10
0.00
-0.10
-0.20
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
Junction Temperature TJ (°C)
Shutdown Supply Current vs. Temperature
Output Voltage vs. Temperature
1.00
3.36
G914D
VIN = 4.3V
0.60
3.34
Output Voltage (V)
Shutdown Supply Current(µA)
G914D
VIN=4.3V
VSHDN=VIN
0.20
-0.20
-0.60
G914D
ILOAD=1mA
VIN=5.5V
3.32
3.30
VIN=4.3V
3.28
VIN=3.4V
3.26
3.24
-1.00
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
Junction Temperature TJ (°C)
Dropout Voltage vs. Temperature
400
Dropout Voltage (mV)
350
G914D
300
ILOAD=150mA
250
200
150
ILOAD=50mA
100
50
ILOAD=0mA
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13
0 0 0 0
Junction Temperature TJ (°C)
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Typical Performance Characteristics (continued)
Line Transient
Load Transient
Load Transient
Power Supply Rejection Ripple
90
ILOAD =10mA
80
PSRR (dB)
70
60
50
ILOAD=150mA
40
30
20
G914E
V IN =5V
10
0
0.01
0.1
1
100
10
Frequency (KHz)
Output Noise vs. Bypass Capacitance
Output Noise vs. Load Current
70
70
G914H
VIN=2.8V
TA=25°C
50
COUT=1µF
40
30
20
10
50
COUT=1µF
40
30
20
10
0
0.001
G914H
VIN=2.8V
TA=25°C
60
Output Noise (µVrms)
Output Noise (µVrms)
60
0
0.01
0.1
1
10
100
1000
Load Current (mA)
Bypass Capacitance (µF)
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Typical Performance Characteristics (continued)
Power On Response Waveform
Power Off Response Waveform
Shutdown Delay Waveform
Shutdown Delay Waveform
Turn-Off Time vs. Bypass Capacitance
Turn-On Time vs. Bypass Capacitance
100000
1000
Propagation Delay Time
Propagation Delay Time
Time (µs)
Time (µs)
10000
1000
100
10
Rise Time
G914D
ILOAD =150mA
CIN=COUT=1µF
VIN=4.3V power already
VSHDN=0 to 4.3V
100
Fall Time
10
1
G914D
ILOAD =150mA
CIN=COUT=1µF
VIN=4.3V power already
VSHDN=4.3V to 0V
1
0.1
1
10
100
0.1
Bypass Capactor (nF)
1
10
100
Bypass Capacitor (nF)
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G914X
Pin Description
PIN
G914A~H G914Z
NAME
FUNCTION
1
1
IN
2
2
GND
Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board
ground plane to maximize thermal dissipation.
3
3
SHDN
Active-Low Shutdown Input. A logic low reduces the supply current to less than 1µA. Connect to IN
for normal operation.
4
---
BYP
This is a reference bypass pin. It should connect external 10nF capacitor to GND to reduce
output noise. Bypass capacitor must be no less than 1nF. (CBYP≥ 1nF)
---
4
SET
5
5
OUT
Regulator Input. Supply voltage can range from +2.5V to +6.0V. Bypass with 1µF to GND
Feedback Input for Setting the Output Voltage. Connect to GND to set the output voltage to
the preset output voltage. Connect to an external resistor divider for adjustable-output operation. The adjustable output voltage, VOUT, is then given by the following equation: VOUT =
1.25 (1 + R1/R2), Reference to Typical Application Circuit in Page 1.
Regulator Output. Sources up to 300mA. Bypass with a 4.7µF, <0.2Ω typical ESR capacitor to GND.
Detailed Description
1.25V, the error amplifier causes the output PMOS to
conduct more current to pull the feedback voltage up
to 1.25V. Thus, through this feedback action, the error
amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback
voltage force to be the same as the 1.25V bandgap
reference. The output voltage, VOUT, is then given by
the following equation:
VOUT = 1.25 (1 + R1/R2).
(1)
Alternatively, the relationship between R1 and R2 is
given by:
R1 = R2 (VOUT / 1.25 + 1).
(2)
For the output voltage versions of G914X, the output
voltages are 2.7V for G914A, 2.8V for G914B, 3.0V for
G914C, 3.3V for G914D, and 2.5V for G914E, 2.85V
for G914F, 1.50V for G914G and 1.80V for G914H.
The block diagram of the G914X is shown in Figure 1.
It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, shutdown logic, over current protection
circuit, and over temperature protection circuit.
The internal feedback voltage divider’s central tap is
connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input
with the 1.25V bandgap reference. If the feedback
voltage is higher than 1.25V, the error amplifier’s output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (VGS). This
reduces the current carrying capability of the PMOS
output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V.
Similarly, when the feedback voltage is less than
IN
SHDN
-
OVER CURRENT
PROTECT & DYNAMIC
FEEDBACK
ERROR
AMP
SHUTDOWN
LOGIC
+
OUT
BYP
R1
OVER TEMP.
PROTECT
CBYP
1.25V
Vref
R2
GND
Figure 1. Functional Diagram
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G914X
The die attachment area of the G914X’s lead frame is
connected to pin 2, which is the GND pin. Therefore,
the GND pin of G914X can carry away the heat of the
G914X die very effectively. To improve the power dissipation, connect the GND pin to ground using a large
ground plane near the GND pin.
Over Current Protection
The G914X use a current mirror to monitor the output
current. A small portion of the PMOS output transistor’s
current is mirrored onto a resistor such that the voltage
across this resistor is proportional to the output current.
This voltage is compared against the 1.25V reference.
Once the output current exceeds the limit, the PMOS
output transistor is turned off. Once the output transistor
is turned off, the current monitoring voltage decreases
to zero, and the output PMOS is turned on again. If the
over current condition persist, the over current protection circuit will be triggered again. Thus, when the output
is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical
over current limit of the G914X is set to 500mA. Note
that the input bypass capacitor of 1µF must be used in
this case to filter out the input voltage spike caused by
the surge current due to the inductive effect of the
package pin and the printed circuit board’s routing wire.
Otherwise, the actual voltage at the IN pin may exceed
the absolute maximum rating.
Applications Information
Capacitor Selection and Regulator Stability
Normally, use a 1µF capacitor on the input and a 4.7µF
capacitor on the output of the G914X. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A highervalue input capacitor (10µF) may be necessary if large,
fast transients are anticipated and the device is located
several inches from the power source. For stable operation over the full temperature range, with load currents
up to 120mA, a minimum of 4.7µF is recommended.
Power-Supply Rejection and Operation from
Sources Other than Batteries
The G914X is designed to deliver low dropout voltages
and low quiescent currents in battery powered systems. Power-supply rejection is 70dB at low frequencies as the frequency increases above 20kHz; the
output capacitor is the major contributor to the rejection of power-supply noise.
Over Temperature Protection
To prevent abnormal temperature from occurring, the
G914X has a built-in temperature monitoring circuit.
When it detects the temperature is above 150°C, the
output transistor is turned off. When the IC is cooled
down to below 135°C, the output is turned on again. In
this way, the G914X will be protected against abnormal junction temperature during operation.
When operating from sources other than batteries,
improve supply-noise rejection and transient response
by increasing the values of the input and output capacitors, and using passive filtering techniques.
Shutdown Mode
When the SHDN pin is connected a logic low voltage,
the G914X enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has
no load at all, the output voltage will be discharged to
ground through the internal resistor voltage divider.
Load Transient Considerations
The G914X load-transient response graphs show two
components of the output response: a DC shift of the
output voltage due to the different load currents, and
the transient response. Typical overshoot for step
changes in the load current from 0mA to 100mA is
12mV. Increasing the output capacitor’s value and
decreasing its ESR attenuates transient spikes.
Operating Region and Power Dissipation
Since the G914X is a linear regulator, its power dissipation is always given by P = IOUT (VIN – VOUT). The
maximum power dissipation is given by:
Input-Output (Dropout) Voltage
A regulator’s minimum input-output voltage differential
(or dropout voltage) determines the lowest usable
supply voltage. In battery-powered systems, this will
determine the useful end-of-life battery voltage. Because the G914X use a P-channel MOSFET pass
transistor, their dropout voltage is a function of RDS(ON)
multiplied by the load current cause the G914X use a
P-channel MOSFET pass transistor, their dropout
voltage is a function of RDS(ON) multiplied by the load
current.
PDMAX = (TJ – TA)/θJA = (150-25) / 240 = 520mW
Where (TJ – TA) is the temperature difference the
G914X die and the ambient air, θJA, is the thermal
resistance of the chosen package to the ambient air.
For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the
PC board and its copper traces. In the case of a
SOT-23-5 package, the thermal resistance is typically
240°C/Watt. (See Recommended Minimum Footprint).
Refer to Figure 2 is the G914X valid operating region
(Safe Operating Area) & refer to Figure 3 is maximum
power dissipation of SOT-23-5.
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of the package pin and the printed circuit board’s routing wire. Otherwise, the actual voltage at the IN pin
may exceed the absolute maximum rating.
The output capacitor also must be located a distance
of not more than 1cm from output to a clean analog
ground. Because it can filter out the output spike
caused by the surge current due to the inductive effect
of the package pin and the printed circuit board’s routing wire. Figure 4 is G914X PCB recommended layout.
Layout Guide
An input capacitance of ≅ 1µF is required between the
G914X input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than
1cm from the input and return to a clean analog
ground.
Input capacitor can filter out the input voltage spike
caused by the surge current due to the inductive effect
Maximum Power Dissipation of SOT-23-5
Safe Operating Area [Power Dissipation Limit]
0.7
400
Maximum Recommended Output Current
350
0.6
300
0.5
Power Dissipation (W)
Output Current (mA)
Still Air
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum footprint (RθJA=240°C/W)
Still air
250
TA=85°
200
TA=55°C
150
TA=25°C
100
1oz Copper on SOT-23-5 Package
Mounted on recommended mimimum
footprint (RJA=240°C/W)
50
0.4
0.3
0.2
0.1
0
0
0.1
0.4
0.7
1.0
1.3
1.6
1.9
25
2.2
35
45
55
65
75
85
95
105
115
125
Amibent Temperature TA (°C)
Input-Output Voltage Differential VIN-VOUT (V)
Note: VIN(max) <= 5.5V
Figure 3. Power Dissipation vs. Temperature
Figure 2. Safe Operating Area
Recommended Minimum Footprint
SOT-23-5
Figure 4. Fixed Mode
*Distance between pin & capacitor must no more than 1cm
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10
G914X
Global Mixed-mode Technology Inc.
Package Information
C
D
L
H
E
θ1
e
e1
A
A2
A1
b
Note:
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
3. Coplanarity: 0.1000mm
4. Dimension L is measured in gage plane
MIN.
DIMENSION IN MM
NOM.
MAX.
MIN.
DIMENSION IN INCH
NOM.
MAX.
A
1.00
1.10
1.30
0.039
0.043
0.051
A1
A2
0.00
0.70
----0.80
0.10
0.90
0.000
0.028
----0.031
0.004
0.035
b
C
D
E
e
0.35
0.10
2.70
1.40
-----
0.40
0.15
2.90
1.60
0.95
0.50
0.25
3.10
1.80
-----
0.014
0.004
0.106
0.055
-----
0.016
0.006
0.114
0.063
0.037
0.020
0.010
0.122
0.071
-----
e1
H
L
θ1
----2.60
0.37
1.90 (TYP)
2.80
------
----3.00
-----
----0.102
0.015
0.075 (TYP)
0.110
-----
----0.118
-----
1°
5°
9°
1°
5°
9°
SYMBOL
Taping Specification
PACKAGE
Q’TY/REEL
SOT-23-5
3,000 ea
Feed Direction
SOT-23-5 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 1.8
Jul 24, 2007
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