CM1223 Industry First Low Capacitance ESD Protection Arrays w/Backdrive Protection Features Product Description • The CM1223 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, absorbing positive ESD strikes and also providing ESD protection for the VP rail. An additional diode is added in this device to serve as backdrive current protection. The CM1223 will protect against ESD pulses up to ±8kV per the IEC 61000-4-2 standard and using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of greater than ±15kV. • • • • • • • • • • 2, 4, and 8 channels of ESD protection with integrated backdrive protection on all lines Provides ESD protection to IEC61000-4-2 Level 4 - 8kV contact discharge - 15kV air discharge Low channel input capacitance of 1.0pF typical Minimal capacitance change with temperature and voltage Channel I/O to Gnd capacitance difference of 0.02pF typical is ideal for differential signalsl Mutual capacitance between signal pin and adjacent signal pin - 0.11pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Pin compatible with CM1213-02, -04, and -08 Each I/O pin can withstand over 1000 ESD strikes Available in SOT, and MSOP packages Lead-free version available Applications • • • • • • • These devices are particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. USB2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire® ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays UDI and Displayport Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection The CM1223 family of devices is available with optional lead-free finishing. Electrical Schematics VP CH1 CH4 VP CH3 CH8 CH1 VN CH2 CH1 CH7 CH6 VP CH5 CH2 VN CM1223-02ST/SO CM1223-04ST/SO CM1223-02SS/SR CM1223-04MS/MR CH2 VN CH3 CH4 CM1223-08MS/MR © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1223 PACKAGE / PINOUT DIAGRAMS VN VP 4 1 CH1 CH2 2 CH2 4-Lead SOT143-4 3 CH4 6 VP 5 CH3 4 6-Lead SOT23-6 1 CH1 3 VP 10 CH8 2 9 CH7 CH3 3 8 VN CH4 4 VP 5 4 CH2 CH6 6 CH5 NC 1 10 NC 2 9 CH4 VP 3 8 VN CH2 4 7 NC NC 5 6 CH3 5-Lead SOT23-5 7 10-Lead MSOP-10 CH1 D328 / D338 2 5 D324/ D334 VN 1 CH2 Top View Top View NC CH1 D326/ D336 VN 3 2 1 D325/ D335 D327/ D337 CH1 Top View Top View Top View 10-Lead MSOP-10 Note: These drawings are not to scale. Pin Descriptions PIN DESCRIPTIONS 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE PIN NAME TYPE 1 VN GND 2 CH1 I/O 3 CH2 I/O 4 VP PWR 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE PIN PIN NAME TYPE Negative voltage supply rail 1 CH1 I/O ESD Channel 2 NC NAME TYPE ESD Channel No connect ESD Channel 3 VP PWR Positive voltage supply rail 4 CH2 I/O 5 NC DESCRIPTION 6 CH3 No connect 7 NC Negative voltage supply rail 8 VN GND I/O 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE PIN DESCRIPTION Positive voltage supply rail ESD Channel No connect I/O ESD Channel No connect 1 NC 2 VN GND 3 CH1 I/O ESD Channel 9 CH4 4 CH2 I/O ESD Channel 10 NC 5 VP PWR PIN NAME TYPE 1 CH1 I/O ESD Channel 2 CH2 I/O ESD Channel 3 CH3 I/O ESD Channel 4 CH4 I/O 5 VP PWR 6 CH5 I/O 7 CH6 I/O 8 VN GND NAME TYPE 1 CH1 I/O 2 VN GND 3 CH2 I/O 4 CH3 I/O 5 VP PWR CH4 I/O 6 ESD Channel No connect 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE Positive voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGE PIN Negative voltage supply rail DESCRIPTION ESD Channel Negative voltage supply rail ESD Channel ESD Channel Positive voltage supply rail ESD Channel DESCRIPTION ESD Channel Positive voltage supply rail ESD Channel ESD Channel Negative voltage supply rail 9 CH7 I/O ESD Channel 10 CH8 I/O ESD Channel © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 Backdrive protection Backdrive protection is needed to block against backdrive current flowing from a high potential voltage node toward a lower potential voltage node through the interface cable. For example, consider a DVD player connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when "off", if there is very little parasitic shunt resistance and as little as a few VDD_SOURCE Discrete Backdrive Protection Diode HOST ASIC To avoid this situation, the CM1223 with integrated backdrive protection diode was designed to block backdrive current, guaranteeing no more than 5μA on any I/O pin when the I/O pin voltage is greater than the CM1223 supply voltage. Integrated Backdrive Protection Diode VDD_SOURCE VDD_SINK One Channel CM1213 “Off CBULK milliamps of "backdrive" current flowing back into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-on-reset (POR) voltage level of some of the integrated circuits, the DVD player may not reset properly when the DVD player is turned back on. “Off CBULK + D1 I/O IBACKDRIVE = 0 D2 Peripheral ASIC VDD_SINK One Channel CM1223 + D1 HOST ASIC I/O D2 IBACKDRIVE = 0 Peripheral ASIC Figure 1. Backdrive Protection Diagram. © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1223 Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish # of Channels Leads Package Ordering Part Number1 Part Marking Ordering Part Number1 2 5 SOT23-5 CM1223-02ST D324 CM1223-02SO D334 2 4 SOT143-4 CM1223-02SS D327 CM1223-02SR D337 4 6 SOT23-6 CM1223-04ST D325 CM1223-04SO D335 4 10 MSOP-10 CM1223-04MS D328 CM1223-04MR D338 8 10 MSOP-10 CM1223-08MS D326 CM1223-08MR D336 Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V -40 to +85 °C -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT143-4 Package (CM1223-02SS/SR) SOT23-5 Package (CM1223-02ST/SO) SOT23-6 Package (CM1223-04ST/SO) MSOP-10 Package (CM1223-04MS/MR) MSOP-10 Package (CM1223-08MS/MR) RATING UNITS -40 to +85 °C 225 225 225 400 400 mW mW mW mW mW © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 3.3 5.5 V 8.0 μA VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VSCL Signal Clamp Voltage Positive Transients Negative Transients IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V ±0.1 ±1.0 μA CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 1.0 1.5 pF ΔCIN Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 0.02 pF CMUTUAL Mutual Capacitance between signal pin and adjacent signal pin At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 0.11 pF VESD ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MIL-STD-883, Method 3015 6.7 0.60 V V Notes 2, 4 & 5; TA=25°C ±8 kV Notes 2, 3 & 5; TA=25°C ±15 kV VCL Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20uS; Notes 2 & 5 RDYN Dynamic Resistance Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20uS Any I/O pin to Ground; Notes 2 & 5 Note 1: Note 2: Note 3: Note 4: Note 5: 8.2 0.80 +8.8 -1.4 V V 0.7 0.4 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP (VP floating). © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1223 Performance Information Input Channel Capacitance Performance Curves Input Capacitance (pF) 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 Input Voltage (V) Typical Variation of CIN vs. VIN Input Capacitance (pF) (f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN, 25°C) 1.25 1.20 1.15 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0V DC Input Bias 1.65V DC Input Bias -50 -25 0 25 50 75 100 Temperature (°C) Typical Variation of CIN vs. Temp (f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) TEST CIRCUIT P1 P2 VP (3.3v) I/On GND Figure 2. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-8 Package) TEST CIRCUIT P1 P2 VP (3.3v) I/On GND Figure 3. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V, MSOP-8 Package) © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1223 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) TEST CIRCUIT P1 P2 VP (3.3v) I/On GND Figure 4. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V, MSOP-10 Package) TEST CIRCUIT P1 P2 VP (3.3v) I/On GND Figure 5. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 6, which illustrates an example of a positive 8kV ESD pulse striking an input channel. The 8kV ESD current pulse will divert along the path as indicated in Figure 4, through the D1 diode and the Zener diode back to the ground rail. The CM1223 has an integrated backdrive diode between VP and VN to prevent backdrive current flow from the powered sources. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.cmd.com. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. The CM1223 has a fast response time of less than 1ns and low clamp voltage to handle this pulse. Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. VCC POSITIVE SUPPLY VP One Channel of CM1223 LINE BEING PROTECTED 30A PATH OF POSITIVE ESD CURRENT PULSE IESD D1 0A SYSTEM OR CIRCUITRY BEING 8kV ESD Pulse I/O pin D2 PATH OF NEGATIVE ESD VN GROUND RAIL CHASSIS GROUND Figure 6. Application of Positive ESD Pulse between Input Channel and Ground © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 CM1223 Mechanical Details The CM1223 is available in SOT143-4, SOT23-5, SOT23-6, and MSOP-10 packages with a lad-free finishing option. The various package drawings are presented below. Mechanical Package Diagrams TOP VIEW SOT143 Mechanical Specifications e Dimensions for CM1223-02SS/SR devices supplied in 4-pin SOT143 packages are presented below. 4 3 For complete information on the SOT143, see the California Micro Devices SOT143 Package Information document. E1 E 1 2 e1 PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions SIDE VIEW D Millimeters Inches Min Max Min Max A 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 0.047 0.055 e 1.92 BSC 0.075 BSC e1 0.20 BSC 0.008 BSC L 0.4 L1 # per tape and reel 0.6 0.54 REF 0.016 A b2 b A1 END VIEW c L1 L 0.024 0.021 REF Package Dimensions for SOT143. 3000 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications Mechanical Package Diagrams Dimensions for CM1223-02ST/SO devices packaged in 5-pin SOT23 packages are presented below. For complete information on the SOT23-5 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 e 5 4 E1 E PACKAGE DIMENSIONS Package SOT23-5 (JEDEC name is MO-178) Pins 5 Dimensions 1 Inches Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC 0.30 L1 0.60 0.60 REF # per tape and reel 3 b Millimeters Min L 2 0.0118 SIDE VIEW D A A1 END VIEW 0.0236 c 0.0236 REF L1 L 3000 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11 CM1223 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1223-04ST/SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. Mechanical Package Diagrams For complete information on the SOT23-6 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 6 PACKAGE DIMENSIONS SOT23-6 (JEDEC name is MO-178) Pins 6 Min Max Min Max -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC 0.30 L1 # per tape and reel 0.60 0.60 REF 0.0118 2 3 b Inches A L 4 E1 E 1 Millimeters 5 Pin 1 Marking Package Dimensions e SIDE VIEW D A A1 END VIEW 0.0236 0.0236 REF 3000 pieces c L1 L Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2006 California Micro Devices Corp. All rights reserved. 12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 08/02/06 CM1223 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications CM1223-04MS/MR and CM1223-08MS/MR devices are packaged in 10-pin MSOP packages. Dimensions are presented below. Mechanical Package Diagrams TOP VIEW For complete information on the MSOP-10 package, see the California Micro Devices MSOP Package Information document. D 10 9 8 6 7 PACKAGE DIMENSIONS Package MSOP Pins 10 Dimensions Millimeters Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.17 0.27 0.007 0.011 0.18 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 0.50 BSC 0.0196 BSC H 4.80 5.00 0.187 0.197 L 0.40 0.70 0.0137 0.029 # per tape and reel 1 2 3 5 4 SIDE VIEW 0.007 D e Pin 1 Marking Inches Min C E H A A1 SEATING PLANE B e END VIEW 4000 C Controlling dimension: millimeters L Package Dimensions for MSOP-10 © 2006 California Micro Devices Corp. All rights reserved. 08/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 13