TI MSP430F663X Mixed signal microcontroller Datasheet

MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
MIXED SIGNAL MICROCONTROLLER
FEATURES
•
•
•
•
•
•
•
•
•
•
Low Supply Voltage Range, 1.8 V to 3.6 V
Ultralow Power Consumption
– Active Mode (AM): TBD
– Standby Mode (LPM3 WDT Mode): TBD
– Off Mode (LPM4 RAM Retention): TBD
– Shutdown Mode (LPM3.5 RTC Mode): TBD
– Shutdown Mode (LPM4.5): TBD
Wake-Up From Standby Mode in Less Than
5 µs
16-Bit RISC Architecture, Extended Memory,
up to 20-MHz System Clock
Flexible Power Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring,
and Brownout
Unified Clock System
– FLL Control Loop for Frequency
Stabilization
– Low Power/Low Frequency Internal Clock
Source (VLO)
– Low Frequency Trimmed Internal Reference
Source (REFO)
– 32-kHz Crystals (XT1)
– High-Frequency Crystals Up to 32 MHz
(XT2)
16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TA2, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TB0, Timer_B With Seven
Capture/Compare Shadow Registers
•
•
•
•
•
•
•
•
•
•
•
•
Two Universal Serial Communication
Interfaces
– USCI_A0 and USCI_A1 Each Supporting
– Enhanced UART supporting
Auto-Baudrate Detection
– IrDA Encoder and Decoder
– Synchronous SPI
– USCI_B0 and USCI_B1 Each Supporting
– I2CTM
– Synchronous SPI
Full-Speed Universal Serial Bus (USB)
– Integrated USB-PHY
– Integrated 3.3-V/1.8-V USB Power System
– Integrated USB-PLL
– Eight Input, Eight Output Endpoints
12-Bit Analog-to-Digital (A/D) Converter With
Internal Shared Reference, Sample-and-Hold,
and Autoscan Feature
Dual 12-Bit Digital-to-Analog (D/A) Converters
With Synchronization
Comparator
Integrated LCD Driver With Contrast Control
for up to 160 Segments
Hardware Multiplier Supporting 32-Bit
Operations
Flash Memory
– Serial Onboard Programming, No External
Programming Voltage Needed
Six-Channel Internal DMA
Real-Time Clock Module With Supply Voltage
Backup Switch
Family Members are Summarized in Table 1
For Complete Module Descriptions, See the
MSP430x5xx/MSP430x6xx Family User's Guide
(SLAU208)
DESCRIPTION
The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 5 µs.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2010, Texas Instruments Incorporated
PRODUCT PREVIEW
1
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
The MSP430F663x series are microcontroller configurations with four 16-bit timers, a high performance 12-bit
analog-to-digital (A/D) converter, two universal serial communication interfaces (USCI), hardware multiplier,
DMA, real-time clock module with alarm capabilities, comparator, USB 2.0, and up to 74 I/O pins.
Typical applications for this device include analog and digital sensor systems, digital motor control, remote
controls, thermostats, digital timers, hand-held meters, etc.
Family members available are summarized in Table 1.
Table 1. Family Members
USCI
Device
Flash
(KB)
SRAM
(KB) (1)
Timer_A
PRODUCT PREVIEW
Channel A:
UART/IrDA/
SPI
Channel B:
SPI/I2C
ADC12_A
(Ch)
DAC12_A
(Ch)
Comp_B
(Ch)
I/O
Package
Type
MSP430F6638
256
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F6637 (4)
192
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F6636 (4)
128
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
2
12
74
100 PZ,
113 ZQW
MSP430F6635 (4)
256
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F6634 (4)
192
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F6633 (4)
128
16 + 2
5, 3, 3
7
2
2
12 ext /
4 int
-
12
74
100 PZ,
113 ZQW
MSP430F6632 (4)
256
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
MSP430F6631 (4)
192
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
MSP430F6630 (4)
128
16 + 2
5, 3, 3
7
2
2
-
-
12
74
100 PZ,
113 ZQW
(1)
(2)
(3)
(4)
(2)
Timer_B
(3)
The additional 2 KB USB SRAM that is listed can be used as general purpose SRAM when USB is not in use.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Product Preview
Ordering Information (1)
TA
–40°C to 85°C
PACKAGED DEVICES (2)
PLASTIC 100-PIN TQFP (PZ)
PLASTIC 113-BALL BGA (ZQW)
MSP430F6638IPZ (3)
MSP430F6638IZQW (3)
MSP430F6637IPZ (3)
MSP430F6637IZQW (3)
MSP430F6636IPZ
(3)
MSP430F6636IZQW (3)
MSP430F6635IPZ
(3)
MSP430F6635IZQW (3)
MSP430F6634IPZ (3)
MSP430F6634IZQW (3)
MSP430F6633IPZ
(3)
MSP430F6633IZQW (3)
MSP430F6632IPZ
(3)
MSP430F6632IZQW (3)
MSP430F6631IPZ (3)
MSP430F6631IZQW (3)
(3)
MSP430F6630IZQW (3)
MSP430F6630IPZ
(1)
(2)
(3)
2
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/package.
Product preview.
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Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
Functional Block Diagram, MSP430F6638, MSP430F6637, MSP430F6636
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
16KB
RAM
ACLK
SMCLK
256KB
192KB
128KB
Flash
MCLK
Power
Management
SYS
Watchdog
+2KB RAM
USB Buffer
+8B Backup
RAM
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
DMA
MPY32
Port PJ
Timer_A
5 CC
Registers
PJ.x
2 Timer_A
each with
3 CC
Registers
ADC12_A
RTC_B
TB0
Timer_B
7 CC
Registers
CRC16
Comp_B
Battery
Backup
System
12 Bit
200 KSPS
16 Channels
(12 ext/4 int)
Autoscan
LCD_B
DAC12_A
REF
12 bit
2 channels
voltage out
Reference
1.5V, 2.0V,
2.5V
6 Channel
160
Segments
PRODUCT PREVIEW
TA0
JTAG/
SBW
Interface/
TA1 and
TA2
Functional Block Diagram, MSP430F6635, MSP430F6634, MSP430F6633
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
MCLK
ACLK
SMCLK
256KB
192KB
128KB
Flash
16KB
RAM
Power
Management
+2KB RAM
USB Buffer
+8B Backup
RAM
SYS
Watchdog
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
JTAG/
SBW
Interface/
Port PJ
DMA
TA0
MPY32
Timer_A
5 CC
Registers
PJ.x
Copyright © 2010, Texas Instruments Incorporated
TA1 and
TA2
2 Timer_A
each with
3 CC
Registers
ADC12_A
LCD_B
RTC_B
TB0
Timer_B
7 CC
Registers
CRC16
Battery
Backup
System
Comp_B
12 Bit
200 KSPS
16 Channels
(12 ext/4 int)
Autoscan
REF
Reference
1.5V, 2.0V,
2.5V
6 Channel
160
Segments
Submit Documentation Feedback
3
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Functional Block Diagram, MSP430F6632, MSP430F6631, MSP430F6630
XIN XOUT
DVCC
DVSS
AVCC
AVSS
RST/NMI
P1.x
XT2IN
XT2OUT
Unified
Clock
System
MCLK
ACLK
SMCLK
256KB
192KB
128KB
Flash
16KB
RAM
Power
Management
+2KB RAM
USB Buffer
+8B Backup
RAM
SYS
Watchdog
LDO
SVM/SVS
Brownout
P2 Port
Mapping
Controller
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
Capability
I/O Ports
P3/P4
2×8 I/Os
Interrupt
Capability
I/O Ports
P5/P6
2×8 I/Os
PA
1×16 I/Os
PB
1×16 I/Os
PC
1×16 I/Os
P7.x
PD
P8.x
I/O Ports
P7/P8
1×6 I/Os
1×8 I/Os
PD
1×14 I/Os
P9.x
I/O Ports
P9
1×8 I/Os
PE
1×8 I/Os
USCI0,1
Ax: UART,
IrDA, SPI
USB
Full-speed
Bx: SPI, I2C
CPUXV2
and
Working
Registers
EEM
(L: 8+2)
JTAG/
SBW
Interface/
Port PJ
DMA
TA0
MPY32
Timer_A
5 CC
Registers
PRODUCT PREVIEW
PJ.x
4
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TA1 and
TA2
2 Timer_A
each with
3 CC
Registers
LCD_B
RTC_B
REF
TB0
Timer_B
7 CC
Registers
CRC16
Battery
Backup
System
Comp_B
Reference
1.5V, 2.0V,
2.5V
6 Channel
160
Segments
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MSP430F6638
MSP430F6637
MSP430F6636
PZ PACKAGE
(TOP VIEW)
P9.7/S0
P9.6/S1
P9.5/S2
P9.4/S3
P9.3/S4
P9.2/S5
P9.1/S6
P9.0/S7
P8.7/S8
P8.6/UCB1SOMI/UCB1SCL/S9
P8.5/UCB1SIMO/UCB1SDA/S10
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE/S11
P8.3/UCA1RXD/UCA1SOMI/S12
P8.2/UCA1TXD/UCA1SIMO/S13
P8.1/UCB1STE/UCA1CLK/S14
P8.0/TB0CLK/S15
P4.7/TB0OUTH/SVMOUT/S16
P4.6/TB0.6/S17
P4.5/TB0.5/S18
P4.4/TB0.4/S19
P4.3/TB0.3/S20
P4.2/TB0.2/S21
P4.1/TB0.1/S22
P5.2/R23
LCDCAP/R33
COM0
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P1.0/TA0CLK/ACLK/S39
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
P3.0/TA1CLK/CBOUT/S31
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.4/TA2CLK/SMCLK/S27
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
P4.0/TB0.0/S23
DVSS1
VCORE
CAUTION: LCDCAP/R33 must be connected to DVSS if not used.
Copyright © 2010, Texas Instruments Incorporated
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5
PRODUCT PREVIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6/R03
P2.7/P2MAP7/LCDREF/R13
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Pin Designation, MSP430F6638IPZ, MSP430F6637IPZ, MSP430F6636IPZ
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MSP430F6635
MSP430F6634
MSP430F6633
P9.7/S0
P9.6/S1
P9.5/S2
P9.4/S3
P9.3/S4
P9.2/S5
P9.1/S6
P9.0/S7
P8.7/S8
P8.6/UCB1SOMI/UCB1SCL/S9
P8.5/UCB1SIMO/UCB1SDA/S10
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE/S11
P8.3/UCA1RXD/UCA1SOMI/S12
P8.2/UCA1TXD/UCA1SIMO/S13
P8.1/UCB1STE/UCA1CLK/S14
P8.0/TB0CLK/S15
P4.7/TB0OUTH/SVMOUT/S16
P4.6/TB0.6/S17
P4.5/TB0.5/S18
P4.4/TB0.4/S19
P4.3/TB0.3/S20
P4.2/TB0.2/S21
P4.1/TB0.1/S22
P5.2/R23
LCDCAP/R33
COM0
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P1.0/TA0CLK/ACLK/S39
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
P3.0/TA1CLK/CBOUT/S31
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.4/TA2CLK/SMCLK/S27
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
P4.0/TB0.0/S23
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
PZ PACKAGE
(TOP VIEW)
DVSS1
VCORE
PRODUCT PREVIEW
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14
P7.7/CB11/A15
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/ADC12CLK/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6/R03
P2.7/P2MAP7/LCDREF/R13
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Pin Designation, MSP430F6635IPZ, MSP430F6634IPZ, MSP430F6633IPZ
CAUTION: LCDCAP/R33 must be connected to DVSS if not used.
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
MSP430F6632
MSP430F6631
MSP430F6630
PZ PACKAGE
(TOP VIEW)
P9.7/S0
P9.6/S1
P9.5/S2
P9.4/S3
P9.3/S4
P9.2/S5
P9.1/S6
P9.0/S7
P8.7/S8
P8.6/UCB1SOMI/UCB1SCL/S9
P8.5/UCB1SIMO/UCB1SDA/S10
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE/S11
P8.3/UCA1RXD/UCA1SOMI/S12
P8.2/UCA1TXD/UCA1SIMO/S13
P8.1/UCB1STE/UCA1CLK/S14
P8.0/TB0CLK/S15
P4.7/TB0OUTH/SVMOUT/S16
P4.6/TB0.6/S17
P4.5/TB0.5/S18
P4.4/TB0.4/S19
P4.3/TB0.3/S20
P4.2/TB0.2/S21
P4.1/TB0.1/S22
P5.2/R23
LCDCAP/R33
COM0
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P1.0/TA0CLK/ACLK/S39
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
P3.0/TA1CLK/CBOUT/S31
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.4/TA2CLK/SMCLK/S27
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
P4.0/TB0.0/S23
DVSS1
VCORE
CAUTION: LCDCAP/R33 must be connected to DVSS if not used.
Copyright © 2010, Texas Instruments Incorporated
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7
PRODUCT PREVIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P6.4/CB4
P6.5/CB5
P6.6/CB6
P6.7/CB7
P7.4/CB8
P7.5/CB9
P7.6/CB10
P7.7/CB11
P5.0/VREF+/VeREF+
P5.1/VREF−/VeREF−
AVCC1
AVSS1
XIN
XOUT
AVSS2
P5.6/DMAE0
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6/R03
P2.7/P2MAP7/LCDREF/R13
DVCC1
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
P6.3/CB3
P6.2/CB2
P6.1/CB1
P6.0/CB0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS3
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
Pin Designation, MSP430F6632IPZ, MSP430F6631IPZ, MSP430F6630IPZ
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Pin Designation, MSP430F6638IZQW, MSP430F6637IZQW, MSP430F6636IZQW,
MSP430F6635IZQW, MSP430F6634IZQW, MSP430F6633IZQW, MSP430F6632IZQW,
MSP430F6631IZQW, MSP430F6630IZQW
ZQW PACKAGE
(TOP VIEW)
PRODUCT PREVIEW
8
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
C1
C2
C3
C11
C12
D1
D2
D4
D5
D6
D7
D8
D9
D11
D12
E1
E2
E4
E5
E6
E7
E8
E9
E11
E12
F1
F2
F4
F5
F8
F9
F11
F12
G1
G2
G4
G5
G8
G9
G11
G12
H1
H2
H4
H5
H6
H7
H8
H9
H11
H12
J1
J2
J4
J5
J6
J7
J8
J9
J11
J12
K1
K2
K11
K12
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
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Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Terminal Functions
TERMINAL
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P6.4/CB4/A4
1
A1
I/O
General-purpose digital I/O
Comparator_B input CB4
Analog input A4 – ADC (not available on '6632, '6631, '6630 devices)
P6.5/CB5/A5
2
B2
I/O
General-purpose digital I/O
Comparator_B input CB5
Analog input A5 – ADC (not available on '6632, '6631, '6630 devices)
P6.6/CB6/A6/DAC0
3
B1
I/O
General-purpose digital I/O
Comparator_B input CB6
Analog input A6 – ADC (not available on '6632, '6631, '6630 devices)
DAC12.0 output (not available on '6635, '6634, '6633, '6632, '6631, '6630 devices)
P6.7/CB7/A7/DAC1
4
C2
I/O
General-purpose digital I/O
Comparator_B input CB7
Analog input A7 – ADC (not available on '6632, '6631, '6630 devices)
DAC12.1 output (not available on '6635, '6634, '6633, '6632, '6631, '6630 devices)
P7.4/CB8/A12
5
C1
I/O
General-purpose digital I/O
Comparator_B input CB8
Analog input A12 –ADC (not available on '6632, '6631, '6630 devices)
P7.5/CB9/A13
6
C3
I/O
General-purpose digital I/O
Comparator_B input CB9
Analog input A13 – ADC (not available on '6632, '6631, '6630 devices)
P7.6/CB10/A14/DAC0
7
D2
I/O
General-purpose digital I/O
Comparator_B input CB10
Analog input A14 – ADC (not available on '6632, '6631, '6630 devices)
DAC12.0 output (not available on '6635, '6634, '6633, '6632, '6631, '6630 devices)
P7.7/CB11/A15/DAC1
8
D1
I/O
General-purpose digital I/O
Comparator_B input CB11
Analog input A15 – ADC (not available on '6632, '6631, '6630 devices)
DAC12.1 output (not available on '6635, '6634, '6633, '6632, '6631, '6630 devices)
P5.0/VREF+/VeREF+
9
D4
I/O
General-purpose digital I/O
Output of reference voltage to the ADC
Input for an external reference voltage to the ADC
P5.1/VREF-/VeREF-
10
E4
I/O
General-purpose digital I/O
Negative terminal for the ADC's reference voltage for both sources, the internal
reference voltage, or an external applied reference voltage
AVCC1
11
E1,
E2
AVSS1
12
F2
XIN
13
F1
I
Input terminal for crystal oscillator XT1
XOUT
14
G1
O
Output terminal of crystal oscillator XT1
AVSS2
15
G2
P5.6/ADC12CLK/DMAE0
16
H1
I/O
General-purpose digital I/O
Conversion clock output ADC (not available on '6632, '6631, '6630 devices)
DMA external trigger input
P2.0/P2MAP0
17
G4
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave transmit enable; USCI_A0 clock input/output
P2.1/P2MAP1
18
H2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave in/master out; USCI_B0 I2C data
P2.2/P2MAP2
19
J1
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 SPI slave out/master in; USCI_B0 I2C clock
P2.3/P2MAP3
20
H4
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave transmit enable
P2.4/P2MAP4
21
J2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in/master out
P2.5/P2MAP5
22
K1
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: USCI_A0 UART receive data; USCI_A0 slave out/master in
(1)
PRODUCT PREVIEW
NAME
Analog power supply
Analog ground supply
Analog ground supply
I = input, O = output, N/A = not available on this package offering
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SLAS566A – JUNE 2010 – REVISED JULY 2010
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Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P2.6/P2MAP6/R03
23
K2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: no secondary function
Input/output port of lowest analog LCD voltage (V5)
P2.7/P2MAP7/LCDREF/R13
24
L2
I/O
General-purpose digital I/O with port interrupt and map-able secondary function
Default mapping: no secondary function
External reference voltage input for regulated LCD voltage
Input/output port of third most positive analog LCD voltage (V3 or V4)
DVCC1
25
L1
Digital power supply
DVSS1
26
M1
Digital ground supply
27
M2
Regulated core power supply (internal usage only, no external current loading)
P5.2/R23
28
L3
I/O
General-purpose digital I/O
Input/output port of second most positive analog LCD voltage (V2)
LCDCAP/R33
29
M3
I/O
LCD capacitor connection
Input/output port of most positive analog LCD voltage (V1)
CAUTION: LCDCAP/R33 must be connected to DVSS if not used.
COM0
30
J4
O
LCD common output COM0 for LCD backplane
P5.3/COM1/S42
31
L4
I/O
General-purpose digital I/O
LCD common output COM1 for LCD backplane
LCD segment output S42
P5.4/COM2/S41
32
M4
I/O
General-purpose digital I/O
LCD common output COM2 for LCD backplane
LCD segment output S41
P5.5/COM3/S40
33
J5
I/O
General-purpose digital I/O
LCD common output COM3 for LCD backplane
LCD segment output S40
P1.0/TA0CLK/ACLK/S39
34
L5
I/O
General-purpose digital I/O with port interrupt
Timer TA0 clock signal TACLK input
ACLK output (divided by 1, 2, 4, or 8)
LCD segment output S39
P1.1/TA0.0/S38
35
M5
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
LCD segment output S38
P1.2/TA0.1/S37
36
J6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
LCD segment output S37
P1.3/TA0.2/S36
37
H6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR2 capture: CCI2A input, compare: Out2 output
LCD segment output S36
P1.4/TA0.3/S35
38
M6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR3 capture: CCI3A input compare: Out3 output
LCD segment output S35
P1.5/TA0.4/S34
39
L6
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR4 capture: CCI4A input, compare: Out4 output
LCD segment output S34
P1.6/TA0.1/S33
40
J7
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR1 capture: CCI1B input, compare: Out1 output
LCD segment output S33
P1.7/TA0.2/S32
41
M7
I/O
General-purpose digital I/O with port interrupt
Timer TA0 CCR2 capture: CCI2B input, compare: Out2 output
LCD segment output S32
VCORE
PRODUCT PREVIEW
(2)
10
(2)
VCORE is for internal usage only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE.
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Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Terminal Functions (continued)
TERMINAL
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P3.0/TA1CLK/CBOUT/S31
42
L7
I/O
General-purpose digital I/O with port interrupt
Timer TA1 clock input
Comparator_B output
LCD segment output S31
P3.1/TA1.0/S30
43
H7
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
LCD segment output S30
P3.2/TA1.1/S29
44
M8
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
LCD segment output S29
P3.3/TA1.2/S28
45
L8
I/O
General-purpose digital I/O with port interrupt
Timer TA1 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
LCD segment output S28
P3.4/TA2CLK/SMCLK/S27
46
J8
I/O
General-purpose digital I/O with port interrupt
Timer TA2 clock input
SMCLK output
LCD segment output S27
P3.5/TA2.0/S26
47
M9
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
LCD segment output S26
P3.6/TA2.1/S25
48
L9
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
LCD segment output S25
P3.7/TA2.2/S24
49
M10
I/O
General-purpose digital I/O with port interrupt
Timer TA2 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
LCD segment output S24
P4.0/TB0.0/S23
50
J9
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR0: CCI0A/CCI0B input, compare: Out0 output
LCD segment output S23
P4.1/TB0.1/S22
51
M11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR1: CCI1A/CCI1B input, compare: Out1 output
LCD segment output S22
P4.2/TB0.2/S21
52
L10
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR2: CCI2A/CCI2B input, compare: Out2 output
LCD segment output S21
P4.3/TB0.3/S20
53
M12
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR3: CCI3A/CCI3B input, compare: Out3 output
LCD segment output S20
P4.4/TB0.4/S19
54
L12
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR4: CCI4A/CCI4B input, compare: Out4 output
LCD segment output S19
P4.5/TB0.5/S18
55
L11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR5: CCI5A/CCI5B input, compare: Out5 output
LCD segment output S18
P4.6/TB0.6/S17
56
K11
I/O
General-purpose digital I/O with port interrupt
Timer TB0 capture CCR6: CCI6A/CCI6B input, compare: Out6 output
LCD segment output S17
P4.7/TB0OUTH/SVMOUT/S16
57
K12
I/O
General-purpose digital I/O with port interrupt
Timer TB0: Switch all PWM outputs high impedance
SVM output
LCD segment output S16
P8.0/TB0CLK/S15
58
J11
I/O
General-purpose digital I/O
Timer TB0 clock input
LCD segment output S15
P8.1/UCB1STE/UCA1CLK/S14
59
J12
I/O
General-purpose digital I/O
USCI_B1 SPI slave transmit enable; USCI_A1 clock input/output
LCD segment output S14
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PRODUCT PREVIEW
NAME
11
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Terminal Functions (continued)
TERMINAL
NAME
I/O (1)
NO.
DESCRIPTION
PRODUCT PREVIEW
PZ
ZQW
P8.2/UCA1TXD/UCA1SIMO/S13
60
H11
I/O
General-purpose digital I/O
USCI_A1 UART transmit data; USCI_A1 SPI slave in/master out
LCD segment output S13
P8.3/UCA1RXD/UCA1SOMI/S12
61
H12
I/O
General-purpose digital I/O
USCI_A1 UART receive data; USCI_A1 SPI slave out/master in
LCD segment output S12
P8.4/UCB1CLK/UCA1STE/S11
62
G11
I/O
General-purpose digital I/O
USCI_B1 clock input/output; USCI_A1 SPI slave transmit enable
LCD segment output S11
DVSS2
63
G12
Digital ground supply
DVCC2
64
F12
Digital power supply
P8.5/UCB1SIMO/UCB1SDA/S10
65
F11
I/O
General-purpose digital I/O
USCI_B1 SPI slave in/master out; USCI_B1 I2C data
LCD segment output S10
P8.6/UCB1SOMI/UCB1SCL/S9
66
G9
I/O
General-purpose digital I/O
USCI_B1 SPI slave out/master in; USCI_B1 I2C clock
LCD segment output S9
P8.7/S8
67
E12
I/O
General-purpose digital I/O
LCD segment output S8
P9.0/S7
68
E11
I/O
General-purpose digital I/O
LCD segment output S7
P9.1/S6
69
F9
I/O
General-purpose digital I/O
LCD segment output S6
P9.2/S5
70
D12
I/O
General-purpose digital I/O
LCD segment output S5
P9.3/S4
71
D11
I/O
General-purpose digital I/O
LCD segment output S4
P9.4/S3
72
E9
I/O
General-purpose digital I/O
LCD segment output S3
P9.5/S2
73
C12
I/O
General-purpose digital I/O
LCD segment output S2
P9.6/S1
74
C11
I/O
General-purpose digital I/O
LCD segment output S1
P9.7/S0
75
D9
I/O
General-purpose digital I/O
LCD segment output S0
VSSU
76
B11
and
B12
PU.0/DP
77
A12
I/O
General-purpose digital I/O - controlled by USB control register
USB data terminal DP
PUR
78
B10
I/O
USB pull-up resistor pin (open drain)
PU.1/DM
79
A11
I/O
General-purpose digital I/O - controlled by USB control register
USB data terminal DM
VBUS
80
A10
USB LDO input (connect to USB power source)
VUSB
81
A9
USB LDO output
V18
82
B9
USB regulated power (internal usage only, no external current loading)
AVSS3
83
A8
Analog ground supply
P7.2/XT2IN
84
B8
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT2
P7.3/XT2OUT
85
B7
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT2
VBAK
86
A7
Chip internal backup subsystem
VBAT
87
D8
Backup supply voltage
12
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USB PHY ground supply
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
Terminal Functions (continued)
TERMINAL
I/O (1)
NO.
DESCRIPTION
PZ
ZQW
P5.7/RTCCLK
88
D7
DVCC3
89
A6
Digital power supply
DVSS3
90
A5
Digital ground supply
TEST/SBWTCK
91
B6
I
PJ.0/TDO
92
B5
I/O
General-purpose digital I/O
Test data output port
PJ.1/TDI/TCLK
93
A4
I/O
General-purpose digital I/O
Test data input or test clock input
PJ.2/TMS
94
E7
I/O
General-purpose digital I/O
Test mode select
PJ.3/TCK
95
D6
I/O
General-purpose digital I/O
Test clock
RST/NMI/SBWTDIO
96
A3
I/O
Reset input active low
Non-maskable interrupt input
Spy-bi-wire data input/output
P6.0/CB0/A0
97
B4
I/O
General-purpose digital I/O
Comparator_B input CB0
Analog input A0 – ADC (not available on '6632, '6631, '6630 devices)
P6.1/CB1/A1
98
B3
I/O
General-purpose digital I/O
Comparator_B input CB1
Analog input A1 – ADC (not available on '6632, '6631, '6630 devices)
P6.2/CB2/A2
99
A2
I/O
General-purpose digital I/O
Comparator_B input CB2
Analog input A2 – ADC (not available on '6632, '6631, '6630 devices)
P6.3/CB3/A3
100
D5
I/O
General-purpose digital I/O
Comparator_B input CB3
Analog input A3 – ADC (not available on '6632, '6631, '6630 devices)
N/A
E5
E6
E8
F4
F5
F8
G5
G8
H5
H8
H9
Reserved
Copyright © 2010, Texas Instruments Incorporated
I/O
General-purpose digital I/O
RTCCLK output
Test mode pin – select digital I/O on JTAG pins
Spy-bi-wire input clock
PRODUCT PREVIEW
NAME
Reserved BGA package balls. It is recommended to connect to ground
(DVSS/AVSS).
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MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
SHORT-FORM DESCRIPTION
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
General-Purpose Register
R10
General-Purpose Register
R11
Instruction Set
General-Purpose Register
R12
The instruction set consists of the original 51
instructions with three formats and seven address
modes and additional instructions for the expanded
address range. Each instruction can operate on word
and byte data. Table 2 shows examples of the three
types of instruction formats; the address modes are
listed in Table 3.
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator, respectively. The remaining
registers are general-purpose registers.
PRODUCT PREVIEW
Table 2. Instruction Word Formats
Dual operands, source-destination
e.g., ADD
Single operands, destination only
e.g., CALL
Relative jump, un/conditional
e.g., JNE
R4,R5
R8
R4 + R5 → R5
PC → (TOS), R8 → PC
Jump-on-equal bit = 0
Table 3. Address Mode Descriptions
ADDRESS MODE
(1)
14
S
(1)
D
(1)
SYNTAX
EXAMPLE
OPERATION
Register
+
+
MOV Rs,Rd
MOV R10,R11
R10 → R11
MOV 2(R5),6(R6)
M(2+R5) → M(6+R6)
Indexed
+
+
MOV X(Rn),Y(Rm)
Symbolic (PC relative)
+
+
MOV EDE,TONI
M(EDE) → M(TONI)
Absolute
+
+
MOV &MEM, &TCDAT
M(MEM) → M(TCDAT)
Indirect
+
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) → M(Tab+R6)
Indirect auto-increment
+
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) → R11
R10 + 2 → R10
Immediate
+
MOV #X,TONI
MOV #45,TONI
#45 → M(TONI)
S = source, D = destination
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Operating Modes
The MSP430 has one active mode and seven software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
Copyright © 2010, Texas Instruments Incorporated
PRODUCT PREVIEW
The following seven operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active, MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active, MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 3.5 (LPM3.5)
– Internal regulator disabled
– No data retention
– RTC enabled and clocked by low-frequency oscillator
– Wakeup from RST/NMI, RTC_B, P1, P2, P3, and P4
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wakeup from RST/NMI, RTC_B, P1, P2, P3, and P4
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 4. Interrupt Sources, Flags, and Vectors of MSP430F663x Configurations
INTERRUPT SOURCE
INTERRUPT FLAG
System Reset
Power-Up, External Reset
Watchdog Timeout, Key Violation
Flash Memory Key Violation
WDTIFG, KEYV (SYSRSTIV) (1)
(2)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG, BUSIFG
(SYSUNIV) (1) (2)
(Non)maskable
0FFFAh
61
Maskable
0FFF8h
60
Comparator B interrupt flags (CBIV) (1)
Comp_B
Timer TB0
PRODUCT PREVIEW
Timer TB0
TB0CCR0 CCIFG0
Maskable
0FFF6h
59
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TBIV) (1) (3)
Maskable
0FFF4h
58
WDTIFG
Maskable
0FFF2h
57
Maskable
0FFF0h
56
Maskable
0FFEEh
55
Maskable
0FFECh
54
Maskable
0FFEAh
53
Maskable
0FFE8h
52
Watchdog Interval Timer Mode
USCI_A0 Receive/Transmit
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1)
USCI_B0 Receive/Transmit
UCB0RXIFG, UCB0TXIFG (UCAB0IV) (1)
ADC12_A (4)
ADC12IFG0 to ADC12IFG15 (ADC12IV) (1)
Timer TA0
Timer TA0
TA0CCR0 CCIFG0
(3)
(3)
Maskable
0FFE6h
51
DMA
DMA0IFG, DMA1IFG, DMA2IFG, DMA3IFG,
DMA4IFG, DMA5IFG (DMAIV) (1) (3)
Maskable
0FFE4h
50
Timer TA1
TA1CCR0 CCIFG0 (3)
Maskable
0FFE2h
49
Timer TA1
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
Maskable
0FFE0h
48
Maskable
0FFDEh
47
Maskable
0FFDCh
46
Maskable
0FFDAh
45
Maskable
0FFD8h
44
Maskable
0FFD6h
43
Maskable
0FFD4h
42
Maskable
0FFD2h
41
P1IFG.0 to P1IFG.7 (P1IV)
(1) (3)
(1) (3)
USCI_A1 Receive/Transmit
UCA1RXIFG, UCA1TXIFG (UCA1IV)
USCI_B1 Receive/Transmit
UCB1RXIFG, UCB1TXIFG (UCB1IV) (1)
I/O Port P2
P2IFG.0 to P2IFG.7 (P2IV) (1)
(3)
(3)
LCD_B Interrupt Flags (LCDBIV) (1)
LCD_B
RTC_B
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG, RTCOFIFG (RTCIV) (1)
DAC12_A (5)
DAC12_0IFG, DAC12_1IFG (1)
Timer TA2
TA2CCR0 CCIFG2
(3)
(3)
(3)
Maskable
0FFD0h
40
Timer TA2
TA2CCR1 CCIFG1 to TA2CCR2,
TA2IFG (TA2IV) (1) (3)
Maskable
0FFCEh
39
I/O Port P3
P3IFG.0 to P3IFG.7 (P3IV) (1)
(3)
Maskable
0FFCCh
38
(1) (3)
Maskable
0FFCAh
37
I/O Port P4
16
(3)
(3)
USB interrupts (USBIV) (1)
I/O Port P1
(3)
(4)
(5)
(3)
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
USB_UBM
(1)
(2)
(3)
(3)
P4IFG.0 to P4IFG.7 (P4IV)
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Only on devices with peripheral module ADC12_A, otherwise reserved.
Only on devices with peripheral module DAC12_A, otherwise reserved.
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Table 4. Interrupt Sources, Flags, and Vectors of MSP430F663x Configurations (continued)
(6)
INTERRUPT SOURCE
INTERRUPT FLAG
Reserved
Reserved (6)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
0FFC8h
36
⋮
⋮
0FF80h
0, lowest
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatability with other devices, it is recommended to reserve these locations.
Memory Organization
Memory (flash)
Main: interrupt vector
Main: code memory
RAM
USB RAM (2)
Information memory
(flash)
Bootstrap loader (BSL)
memory (flash)
Peripherals
(1)
(2)
MSP430F6636
MSP430F6633
MSP430F6630
MSP430F6637
MSP430F6634
MSP430F6631
MSP430F6638
MSP430F6635
MSP430F6632
128KB
00FFFFh–00FF80h
192KB
00FFFFh–00FF80h
256KB
00FFFFh–00FF80h
Bank 3
N/A
N/A
64 KB
047FFF-038000h
Bank 2
N/A
64 KB
037FFF-028000h
64 KB
037FFF-028000h
Bank 1
64 KB
027FFF-018000h
64 KB
027FFF-018000h
64 KB
027FFF-018000h
Bank 0
64 KB
017FFF-008000h
64 KB
017FFF-008000h
64 KB
017FFF-008000h
Sector 3
4 KB
0063FFh–005400h
4 KB
0063FFh–005400h
4 KB
0063FFh–005400h
Sector 2
4 KB
0053FFh–004400h
4 KB
0053FFh–004400h
4 KB
0053FFh–004400h
Sector 1
4 KB
0043FFh–003400h
4 KB
0043FFh–003400h
4 KB
0043FFh–003400h
Sector 0
4 KB
0033FFh–002400h
4 KB
0033FFh–002400h
4 KB
0033FFh–002400h
Size
RAM
2KB
0023FFh-001C00h
2KB
0023FFh-001C00h
2KB
0023FFh-001C00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
Size
4KB
000FFFh–000000h
4KB
000FFFh–000000h
4KB
000FFFh–000000h
Total Size
PRODUCT PREVIEW
Table 5. Memory Organization (1)
N/A = Not available.
USB RAM can be used as general purpose RAM when not used for USB operation.
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using a UART serial interface. Access to the
device memory via the BSL is protected by user-defined password. For complete description of the features of
the BSL and its implementation, see the MSP430 Memory Programming User's Guide, TI literature number
SLAU265.
Table 6. BSL Functions
BSL FUNCTION
DEVICE OUTPUT SIGNAL
Data transmit
P1.1
Data receive
P1.2
Flash Memory
PRODUCT PREVIEW
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the
flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also
called information memory.
• Segment A can be locked separately.
RAM Memory
The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage,
however all data is lost. Features of the RAM memory include:
• RAM memory has n sectors. The size of a sector can be found in the Memory Organization section.
• Each sector 0 to n can be complete disabled, however data retention is lost.
• Each sector 0 to n automatically enters low power retention mode when possible.
• For Devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.
Backup RAM Memory
The Backup RAM provides a limited number of bytes of RAM that are retained during LPMx.5 and during
operation from a backup supply in case the Battery Backup System module is implemented.
There are 8 bytes of Backup RAM available on MSP430F663x. It can be wordwise accessed via the control
registers BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.
Peripherals
Peripherals are connected to the CPU through data, address, and control busses and can be handled using all
instructions. For complete module descriptions, see the MSP430x5xx/MSP430x6xx Family User's Guide,
literature number SLAU 208.
Digital I/O
There are up to nine 8-bit I/O ports implemented: P1 through P9 are complete and port PJ contains four
individual I/O ports.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Programmable pullup or pulldown on all ports.
• Programmable drive strength on all ports.
• Edge-selectable interrupt input capability for all the eight bits of ports P1, P2, P3, and P4.
• Read/write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P9) or word-wise in pairs (PA through PD).
18
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Port Mapping Controller
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P2.
Table 7. Port Mapping, Mnemonics and Functions
PxMAPy MNEMONIC
INPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT
-
Comparator_B output
1
2
PM_TB0CLK
Timer TB0 clock input
-
PM_ADC12CLK
-
ADC12CLK
PM_DMAE0
DMAE0 Input
-
PM_SVMOUT
-
SVM output
PM_TB0OUTH
Timer TB0 high impedance input
TB0OUTH
-
4
PM_TB0CCR0B
Timer TB0 CCR0 capture input CCI0B
Timer TB0: TB0.0 compare output Out0
5
PM_TB0CCR1B
Timer TB0 CCR1 capture input CCI1B
Timer TB0: TB0.1 compare output Out1
6
PM_TB0CCR2B
Timer TB0 CCR2 capture input CCI2B
Timer TB0: TB0.2 compare output Out2
7
PM_TB0CCR3B
Timer TB0 CCR3 capture input CCI3B
Timer TB0: TB0.3 compare output Out3
8
PM_TB0CCR4B
Timer TB0 CCR4 capture input CCI4B
Timer TB0: TB0.4 compare output Out4
9
PM_TB0CCR5B
Timer TB0 CCR5 capture input CCI5B
Timer TB0: TB0.5 compare output Out5
10
PM_TB0CCR6B
Timer TB0 CCR6 capture input CCI6B
Timer TB0: TB0.6 compare output Out6
3
11
12
13
14
15
16
PM_UCA0RXD
USCI_A0 UART RXD (Direction controlled by USCI - input)
PM_UCA0SOMI
USCI_A0 SPI slave out master in (direction controlled by USCI)
PM_UCA0TXD
USCI_A0 UART TXD (Direction controlled by USCI - output)
PM_UCA0SIMO
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK
USCI_A0 clock input/output (direction controlled by USCI)
PM_UCB0STE
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input)
PM_UCB0SOMI
USCI_B0 SPI slave out master in (direction controlled by USCI)
PM_UCB0SCL
USCI_B0 I2C clock (open drain and direction controlled by USCI)
PM_UCB0SIMO
USCI_B0 SPI slave in master out (direction controlled by USCI)
PM_UCB0SDA
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK
USCI_B0 clock input/output (direction controlled by USCI)
PM_UCA0STE
USCI_A0 SPI slave transmit enable (direction controlled by USCI - input)
17
PM_MCLK
18
Reserved
19
Reserved
20 - 30
Reserved
31 (0FFh) (1)
(1)
OUTPUT PIN FUNCTION
PM_ANALOG
-
MCLK
None
DVSS
PRODUCT PREVIEW
VALUE
Disables the output driver as well as the input Schmitt-trigger to prevent parasitic cross
currents when applying analog signals.
The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are
ignored resulting in a read out value of 31.
Table 8. Default Mapping
PIN
PxMAPy MNEMONIC
P2.0/P2MAP0
PM_UCB0STE/PM_UCA0
CLK
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input) /
USCI_A0 clock input/output (direction controlled by USCI)
P2.1/P2MAP1
PM_UCB0SIMO/PM_UCB
0SDA
USCI_B0 SPI slave in master out (direction controlled by USCI) / USCI_B0 I2C
data (open drain and direction controlled by USCI)
P2.2/P2MAP2
PM_UCB0SOMI/PM_UCB
0SCL
USCI_B0 SPI slave out master in (direction controlled by USCI) / USCI_B0 I2C
clock (open drain and direction controlled by USCI)
P2.3/P2MAP3
PM_UCB0CLK/PM_UCA0
STE
USCI_B0 clock input/output (direction controlled by USCI) / USCI_A0 SPI slave
transmit enable (direction controlled by USCI - input)
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INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
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Table 8. Default Mapping (continued)
PIN
PxMAPy MNEMONIC
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
P2.4/P2MAP4
PM_UCA0TXD/PM_UCA0 USCI_A0 UART TXD (direction controlled by USCI - output) / USCI_A0 SPI slave
SIMO
in master out (direction controlled by USCI)
P2.5/P2MAP5
PM_UCA0RXD/PM_UCA0
SOMI
P2.6/P2MAP6/R03
PM_NONE
-
DVSS
P2.7/P2MAP7/LCDREF/R1
3
PM_NONE
-
DVSS
USCI_A0 UART RXD (direction controlled by USCI - input) / USCI_A0 SPI slave
out master in (direction controlled by USCI)
Oscillator and System Clock
PRODUCT PREVIEW
The clock system in the MSP430F663x family of devices is supported by the Unified Clock System (UCS)
module that includes support for a 32 kHz watch crystal oscillator (XT1 LF mode - XT1 HF mode not supported),
an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO),
an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator XT2. The UCS
module is designed to meet the requirements of both low system cost and low-power consumption. The UCS
module features digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator,
stabilizes the DCO frequency to a programmable multiple of the watch crystal frequency. The internal DCO
provides a fast turn-on clock source and stabilizes in less than 5 µs. The UCS module provides the following
clock signals:
• Auxiliary clock (ACLK), sourced from a 32 kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal
digitally-controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
Power Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The
SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs operations with
32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations.
Real-Time Clock (RTC_B)
The RTC_B module can be configured for real-time clock (RTC) and calendar mode providing seconds, minutes,
hours, day of week, day of month, month, and year. Calendar mode integrates an internal calendar which
compensates for months with less than 31 days and includes leap year correction. The RTC_B also supports
flexible alarm functions and offset-calibration hardware. The implementation on this device supports operation in
LPM3.5 mode and operation from a backup supply.
Watchdog Timer (WDT_A)
The primary function of the watchdog timer (WDT_A) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
20
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System Module (SYS)
The SYS module handles many of the system functions within the device. These include power on reset and
power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap
loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data
exchange mechanism via JTAG called a JTAG mailbox that can be used in the application.
Table 9. System Module Interrupt Vector Registers
SYSRSTIV , System Reset
INTERRUPT EVENT
WORD ADDRESS
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (BOR)
04h
DoBOR (BOR)
06h
LPM5 wakeup (BOR)
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
SVMH_OVP (POR)
019Eh
SYSUNIV, User NMI
WDT timeout (PUC)
16h
WDT key violation (PUC)
18h
KEYV flash key violation (PUC)
1Ah
FLL unlock (PUC)
1Ch
Peripheral area fetch (PUC)
1Eh
PMM key violation (PUC)
20h
Reserved
22h to 3Eh
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
DLYLIFG
06h
SYSBERRIV, Bus Error
0Ch
0Eh
VLRLIFG
10h
VLRHIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIFG
02h
Highest
06h
Reserved
0Ah to 1Eh
No interrupt pending
00h
0198h
Lowest
04h
08h
Reserved
Copyright © 2010, Texas Instruments Incorporated
019Ah
BUSIFG
USB wait state timeout
Highest
0Ah
JMBINIFG
OFIFG
Lowest
08h
019Ch
JMBOUTIFG
ACCVIFG
Highest
12h
14h
VMAIFG
PRIORITY
10h
DoPOR (POR)
DLYHIFG
SYSSNIV , System NMI
OFFSET
PRODUCT PREVIEW
INTERRUPT VECTOR
REGISTER
Lowest
02h
Highest
04h to 1Eh
Lowest
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DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU intervention. For
example, the DMA controller can be used to move data from the ADC12_A conversion memory to RAM. Using
the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system
power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or
from a peripheral.
The USB timestamp generator also utilizes the channel 0, 1, and 2 DMA trigger assignments described in
Table 10.
Table 10. DMA Trigger Assignments (1)
Trigger
Channel
0
PRODUCT PREVIEW
22
3
DMAREQ
1
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
6
TA2CCR2 CCIFG
7
TBCCR0 CCIFG
8
TBCCR2 CCIFG
9
Reserved
10
Reserved
11
Reserved
12
Reserved
13
Reserved
14
Reserved
15
Reserved
16
UCA0RXIFG
17
UCA0TXIFG
18
UCB0RXIFG
19
UCB0TXIFG
20
UCA1RXIFG
21
UCA1TXIFG
22
UCB1RXIFG
23
UCB1TXIFG
24
ADC12IFGx (2)
25
DAC12_0IFG (3)
26
DAC12_1IFG (3)
27
USB FNRXD
28
USB ready
29
MPY ready
DMA5IFG
31
(2)
(3)
2
0
30
(1)
1
DMA0IFG
DMA1IFG
DMA2IFG
4
5
DMA3IFG
DMA4IFG
DMAE0
Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not
cause any DMA trigger event when selected.
Only on devices with peripheral module ADC12_A. Reserved on devices without ADC.
Only on devices with peripheral module DAC12_A. Reserved on devices without DAC.
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Universal Serial Communication Interface (USCI)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,
A and B.
The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3 or 4 pin) or I2C.
The MSP430F663x series includes two complete USCI modules (n = 0 to 1).
Timer TA0
Timer TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 11. Timer TA0 Signal Connections
PZ
ZQW
DEVICE
INPUT
SIGNAL
34-P1.0
L5-P1.0
TA0CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
34-P1.0
L5-P1.0
TA0CLK
TACLK
35-P1.1
M5-P1.1
TA0.0
CCI0A
DVSS
CCI0B
DVSS
GND
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
PZ
ZQW
35-P1.1
M5-P1.1
TA0.0
DVCC
VCC
36-P1.2
J6-P1.2
TA0.1
CCI1A
36-P1.2
J6-P1.2
40-P1.6
J7-P1.6
TA0.1
CCI1B
40-P1.6
J7-P1.6
DVSS
GND
DVCC
VCC
CCR1
TA1
TA0.1
ADC12_A (internal) (1)
ADC12SHSx = {1}
37-P1.3
H6-P1.3
TA0.2
CCI2A
37-P1.3
H6-P1.3
41-P1.7
M7-P1.7
TA0.2
CCI2B
41-P1.7
M7-P1.7
DVSS
GND
DVCC
VCC
TA0.3
CCI3A
38-P1.4
M6-P1.4
DVSS
CCI3B
DVSS
GND
39-P1.5
L6-P1.5
38-P1.4
39-P1.5
(1)
MODULE
INPUT
SIGNAL
M6-P1.4
L6-P1.5
DVCC
VCC
TA0.4
CCI4A
DVSS
CCI4B
DVSS
GND
DVCC
VCC
CCR2
CCR3
CCR4
TA2
TA3
TA4
PRODUCT PREVIEW
INPUT PIN NUMBER
TA0.2
TA0.3
TA0.4
Only on devices with peripheral module ADC12_A.
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Timer TA1
Timer TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 12. Timer TA1 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
DEVICE
INPUT
SIGNAL
42-P3.0
L7-P3.0
TA1CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
42-P3.0
L7-P3.0
TA1CLK
TACLK
43-P3.1
H7-P3.1
TA1.0
CCI0A
DVSS
CCI0B
DVSS
GND
44-P3.2
PRODUCT PREVIEW
45-P3.3
(1)
24
MODULE
INPUT
SIGNAL
M8-P3.2
L8-P3.3
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
PZ
ZQW
43-P3.1
H7-P3.1
M8-P3.2
TA1.0
DVCC
VCC
TA1.1
CCI1A
44-P3.2
CBOUT
(internal)
CCI1B
(1)
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
CCR1
TA1
TA1.1
DAC12_A
DAC12_0, DAC12_1
(internal)
45-P3.3
CCR2
TA2
L8-P3.3
TA1.2
Only on devices with peripheral module DAC12_A.
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Timer TA2
Timer TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 13. Timer TA2 Signal Connections
PZ
ZQW
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
46-P3.4
J8-P3.4
TA2CLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
46-P3.4
J8-P3.4
TA2CLK
TACLK
47-P3.5
M9-P3.5
TA2.0
CCI0A
DVSS
CCI0B
DVSS
GND
48-P3.6
49-P3.7
L9-P3.6
M10-P3.7
DVCC
VCC
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA2.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
Copyright © 2010, Texas Instruments Incorporated
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
CCR2
TA0
TA1
TA2
OUTPUT PIN NUMBER
PZ
ZQW
47-P3.5
M9-P3.5
48-P3.6
L9-P3.6
49-P3.7
M10-P3.7
TA2.0
PRODUCT PREVIEW
INPUT PIN NUMBER
TA2.1
TA2.2
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Timer TB0
Timer TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. It can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts may
be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 14. Timer TB0 Signal Connections
INPUT PIN NUMBER
PZ
ZQW
58-P8.0
P2MAPx (1)
J11-P8.0
P2MAPx (1)
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TB0CLK
TB0CLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
PZ
ZQW
ACLK
ACLK
SMCLK
SMCLK
J11-P8.0
P2MAPx (1)
TB0CLK
TB0CLK
50-P4.0
J9-P4.0
TB0.0
CCI0A
50-P4.0
J9-P4.0
P2MAPx (1)
P2MAPx (1)
TB0.0
CCI0B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
58-P8.0
P2MAPx (1)
CCR0
TB0
TB0.0
ADC12 (internal) (2)
ADC12SHSx = {2}
PRODUCT PREVIEW
DVCC
VCC
51-P4.1
M11-P4.1
TB0.1
CCI1A
51-P4.1
M11-P4.1
P2MAPx (1)
P2MAPx (1)
TB0.1
CCI1B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
DVCC
VCC
CCR1
TB1
TB0.1
ADC12 (internal) (2)
ADC12SHSx = {3}
52-P4.2
L10-P4.2
TB0.2
CCI2A
52-P4.2
L10-P4.2
P2MAPx (1)
P2MAPx (1)
TB0.2
CCI2B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
53-P4.3
P2MAPx
(1)
54-P4.4
P2MAPx
(1)
M12-P4.3
P2MAPx
(1)
L12-P4.4
P2MAPx
(1)
DVCC
VCC
TB0.3
CCI3A
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
TB0.4
CCI4A
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
CCR2
TB2
TB0.2
DAC12_A (3)
DAC12_0, DAC12_1
(internal)
53-P4.3
CCR3
TB3
TB0.3
P2MAPx
(1)
54-P4.4
CCR4
TB4
TB0.4
P2MAPx
(1)
M12-P4.3
P2MAPx (1)
L12-P4.4
P2MAPx (1)
55-P4.5
L11-P4.5
TB0.5
CCI5A
55-P4.5
L11-P4.5
P2MAPx (1)
P2MAPx (1)
TB0.5
CCI5B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
CCR5
TB5
TB0.5
DVCC
VCC
56-P4.6
K11-P4.6
TB0.6
CCI6A
56-P4.6
K11-P4.6
P2MAPx (1)
P2MAPx (1)
TB0.6
CCI6B
P2MAPx (1)
P2MAPx (1)
DVSS
GND
DVCC
VCC
(1)
(2)
(3)
26
CCR6
TB6
TB0.6
Timer functions selectable via the port mapping controller.
Only on devices with peripheral module ADC12_A.
Only on devices with peripheral module DAC12_A.
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Comparator_B
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
ADC12_A
The ADC12_A module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR
core, sample select control, reference generator and a 16 word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any
CPU intervention.
CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
REF Voltage Reference
The reference module (REF) is responsible for generation of all critical reference voltages that can be used by
the various analog peripherals in the device.
The LCD_B driver generates the segment and common signals required to drive a Liquid Crystal Display (LCD).
The LCD_B controller has dedicated data memories to hold segment drive information. Common and segment
signals are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported. The
module can provide a LCD voltage independent of the supply voltage with its integrated charge pump. It is
possible to control the level of the LCD voltage and thus contrast by software. The module also provides an
automatic blinking capability for individual segments.
USB Universal Serial Bus
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module
supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO,
PHY, and PLL. The PLL is highly-flexible and can support a wide range of input clock frequencies. USB RAM,
when not used for USB communication, can be used by the system.
Embedded Emulation Module (EEM)
The Embedded Emulation Module (EEM) supports real-time in-system debugging. The L version of the EEM
implemented on all devices has the following features:
• Eight hardware triggers/breakpoints on memory access
• Two hardware triggers/breakpoints on CPU register write access
• Up to ten hardware triggers can be combined to form complex triggers/breakpoints
• Two cycle counters
• Sequencer
• State storage
• Clock control on module level
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PRODUCT PREVIEW
LCD_B
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Peripheral File Map
Table 15. Peripherals
PRODUCT PREVIEW
(1)
28
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS RANGE
Special Functions (refer to Table 16)
0100h
000h - 01Fh
PMM (refer to Table 17)
0120h
000h - 00Fh
Flash Control (refer to Table 18)
0140h
000h - 00Fh
CRC16 (refer to Table 19)
0150h
000h - 007h
RAM Control (refer to Table 20)
0158h
000h - 001h
Watchdog (refer to Table 21)
015Ch
000h - 001h
UCS (refer to Table 22)
0160h
000h - 01Fh
SYS (refer to Table 23)
0180h
000h - 01Fh
Shared Reference (refer to Table 24)
01B0h
000h - 001h
Port Mapping Control (refer to Table 25)
01C0h
000h - 003h
Port Mapping Port P2 (refer to Table 25)
01D0h
000h - 007h
Port P1/P2 (refer to Table 26)
0200h
000h - 01Fh
Port P3/P4 (refer to Table 27)
0220h
000h - 01Fh
Port P5/P6 (refer to Table 28)
0240h
000h - 00Bh
Port P7/P8 (refer to Table 29)
0260h
000h - 00Bh
Port P9 (refer to Table 30)
0280h
000h - 00Bh
Port PJ (refer to Table 31)
0320h
000h - 01Fh
Timer TA0 (refer to Table 32)
0340h
000h - 02Eh
Timer TA1 (refer to Table 33)
0380h
000h - 02Eh
Timer TB0 (refer to Table 34)
03C0h
000h - 02Eh
Timer TA2 (refer to Table 35)
0400h
000h - 02Eh
Battery Backup (refer to Table 36)
0480h
000h - 01Fh
RTC_B (refer to Table 37)
04A0h
000h - 01Fh
32-bit Hardware Multiplier (refer to Table 38)
04C0h
000h - 02Fh
DMA General Control (refer to Table 39)
0500h
000h - 00Fh
DMA Channel 0 (refer to Table 39)
0510h
000h - 00Ah
DMA Channel 1 (refer to Table 39)
0520h
000h - 00Ah
DMA Channel 2 (refer to Table 39)
0530h
000h - 00Ah
DMA Channel 3 (refer to Table 39)
0540h
000h - 00Ah
DMA Channel 4 (refer to Table 39)
0550h
000h - 00Ah
DMA Channel 5 (refer to Table 39)
0560h
000h - 00Ah
USCI_A0 (refer to Table 40)
05C0h
000h - 01Fh
USCI_B0 (refer to Table 41)
05E0h
000h - 01Fh
USCI_A1 (refer to Table 42)
0600h
000h - 01Fh
USCI_B1 (refer to Table 43)
0620h
000h - 01Fh
ADC12_A (refer to Table 44)
0700h
000h - 03Fh
DAC12_A (refer to Table 45)
0780h
000h - 01Fh
Comparator_B (refer to Table 46)
08C0h
000h - 00Fh
USB configuration (refer to Table 47)
0900h
000h - 014h
USB control (refer to Table 48)
0920h
000h - 01Fh
LCD_B control (refer to Table 49)
0A00h
000h - 05Fh
(1)
For a detailed description of the individual control register offset addresses, see the MSP430F5xx and MSP430F6xx Family User's
Guide (SLAU208).
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Table 16. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 17. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
Table 18. Flash Control Registers (Base Address: 0140h)
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
PRODUCT PREVIEW
REGISTER DESCRIPTION
Table 19. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC result
CRC16INIRES
04h
Table 20. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 21. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 22. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
UCS control 8
UCSCTL8
10h
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Table 23. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 24. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
PRODUCT PREVIEW
Table 25. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P4: 01D0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping password register
PMAPPWD
00h
Port mapping control register
PMAPCTL
02h
Port P2.0 mapping register
P2MAP0
00h
Port P2.1 mapping register
P2MAP1
01h
Port P2.2 mapping register
P2MAP2
02h
Port P2.3 mapping register
P2MAP3
03h
Port P2.4 mapping register
P2MAP4
04h
Port P2.5 mapping register
P2MAP5
05h
Port P2.6 mapping register
P2MAP6
06h
Port P2.7 mapping register
P2MAP7
07h
Table 26. Port P1/P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
30
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Table 26. Port P1/P2 Registers (Base Address: 0200h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 27. Port P3/P4 Registers (Base Address: 0220h)
REGISTER
OFFSET
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup/pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P3 interrupt vector word
P3IV
0Eh
Port P3 interrupt edge select
P3IES
18h
Port P3 interrupt enable
P3IE
1Ah
Port P3 interrupt flag
P3IFG
1Ch
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup/pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
Port P4 interrupt vector word
P4IV
1Eh
Port P4 interrupt edge select
P4IES
19h
Port P4 interrupt enable
P4IE
1Bh
Port P4 interrupt flag
P4IFG
1Dh
PRODUCT PREVIEW
REGISTER DESCRIPTION
Port P3 input
Table 28. Port P5/P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup/pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup/pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
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Table 29. Port P7/P8 Registers (Base Address: 0260h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P7 input
P7IN
00h
Port P7 output
P7OUT
02h
Port P7 direction
P7DIR
04h
Port P7 pullup/pulldown enable
P7REN
06h
Port P7 drive strength
P7DS
08h
Port P7 selection
P7SEL
0Ah
Port P8 input
P8IN
01h
Port P8 output
P8OUT
03h
Port P8 direction
P8DIR
05h
Port P8 pullup/pulldown enable
P8REN
07h
Port P8 drive strength
P8DS
09h
Port P8 selection
P8SEL
0Bh
Table 30. Port P9 Register (Base Address: 0280h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PRODUCT PREVIEW
Port P9 input
P9IN
00h
Port P9 output
P9OUT
02h
Port P9 direction
P9DIR
04h
Port P9 pullup/pulldown enable
P9REN
06h
Port P9 drive strength
P9DS
08h
Port P9 selection
P9SEL
0Ah
Table 31. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup/pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Table 32. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
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Table 33. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Table 34. TB0 Registers (Base Address: 03C0h)
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
PRODUCT PREVIEW
REGISTER DESCRIPTION
Table 35. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
Capture/compare control 2
TA2CCTL2
06h
TA2 counter register
TA2R
10h
Capture/compare register 0
TA2CCR0
12h
Capture/compare register 1
TA2CCR1
14h
Capture/compare register 2
TA2CCR2
16h
TA2 expansion register 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
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Table 36. Battery Backup Registers (Base Address: 0480h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Battery Backup Memory 0
BAKMEM0
00h
Battery Backup Memory 1
BAKMEM1
02h
Battery Backup Memory 2
BAKMEM2
04h
Battery Backup Memory 3
BAKMEM3
06h
Battery Backup Control
BAKCTL
1Ch
Battery Charger Control
BAKCHCTL
1Eh
Table 37. Real Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PRODUCT PREVIEW
RTC control register 0
RTCCTL0
00h
RTC control register 1
RTCCTL1
01h
RTC control register 2
RTCCTL2
02h
RTC control register 3
RTCCTL3
03h
RTC prescaler 0 control register
RTCPS0CTL
08h
RTC prescaler 1 control register
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds
RTCSEC
10h
RTC minutes
RTCMIN
11h
RTC hours
RTCHOUR
12h
RTC day of week
RTCDOW
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
Binary-to-BCD conversion register
BIN2BCD
1Ch
BCD-to-binary conversion register
BCD2BIN
1Eh
Table 38. 32-bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
34
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Table 38. 32-bit Hardware Multiplier Registers (Base Address: 04C0h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
Table 39. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h)
REGISTER
OFFSET
DMACTL0
00h
DMA General Control: DMA module control 1
DMACTL1
02h
DMA General Control: DMA module control 2
DMACTL2
04h
DMA General Control: DMA module control 3
DMACTL3
06h
DMA General Control: DMA module control 4
DMACTL4
08h
DMA General Control: DMA interrupt vector
DMAIV
0Ah
DMA Channel 0 control
DMA0CTL
00h
DMA Channel 0 source address low
DMA0SAL
02h
DMA Channel 0 source address high
DMA0SAH
04h
DMA Channel 0 destination address low
DMA0DAL
06h
DMA Channel 0 destination address high
DMA0DAH
08h
DMA Channel 0 transfer size
DMA0SZ
0Ah
DMA Channel 1 control
DMA1CTL
00h
DMA Channel 1 source address low
DMA1SAL
02h
DMA Channel 1 source address high
DMA1SAH
04h
DMA Channel 1 destination address low
DMA1DAL
06h
DMA Channel 1 destination address high
DMA1DAH
08h
DMA Channel 1 transfer size
DMA1SZ
0Ah
DMA Channel 2 control
DMA2CTL
00h
DMA Channel 2 source address low
DMA2SAL
02h
DMA Channel 2 source address high
DMA2SAH
04h
DMA Channel 2 destination address low
DMA2DAL
06h
DMA Channel 2 destination address high
DMA2DAH
08h
DMA Channel 2 transfer size
DMA2SZ
0Ah
DMA Channel 3 control
DMA3CTL
00h
DMA Channel 3 source address low
DMA3SAL
02h
DMA Channel 3 source address high
DMA3SAH
04h
DMA Channel 3 destination address low
DMA3DAL
06h
DMA Channel 3 destination address high
DMA3DAH
08h
DMA Channel 3 transfer size
DMA3SZ
0Ah
DMA Channel 4 control
DMA4CTL
00h
DMA Channel 4 source address low
DMA4SAL
02h
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PRODUCT PREVIEW
REGISTER DESCRIPTION
DMA General Control: DMA module control 0
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Table 39. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA
Channel 4: 0550h, DMA Channel 5: 0560h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA Channel 4 source address high
DMA4SAH
04h
DMA Channel 4 destination address low
DMA4DAL
06h
DMA Channel 4 destination address high
DMA4DAH
08h
DMA Channel 4 transfer size
DMA4SZ
0Ah
DMA Channel 5 control
DMA5CTL
00h
DMA Channel 5 source address low
DMA5SAL
02h
DMA Channel 5 source address high
DMA5SAH
04h
DMA Channel 5 destination address low
DMA5DAL
06h
DMA Channel 5 destination address high
DMA5DAH
08h
DMA Channel 5 transfer size
DMA5SZ
0Ah
Table 40. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PRODUCT PREVIEW
USCI control 0
UCA0CTL0
00h
USCI control 1
UCA0CTL1
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
Table 41. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 0
UCB0CTL0
00h
USCI synchronous control 1
UCB0CTL1
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
36
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Table 42. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 0
UCA1CTL0
00h
USCI control 1
UCA1CTL1
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
REGISTER
PRODUCT PREVIEW
Table 43. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
OFFSET
USCI synchronous control 0
UCB1CTL0
00h
USCI synchronous control 1
UCB1CTL1
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
Table 44. ADC12_A Registers (Base Address: 0700h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Control register 0
ADC12CTL0
00h
Control register 1
ADC12CTL1
02h
Control register 2
ADC12CTL2
04h
Interrupt-flag register
ADC12IFG
0Ah
Interrupt-enable register
ADC12IE
0Ch
Interrupt-vector-word register
ADC12IV
0Eh
ADC memory-control register 0
ADC12MCTL0
10h
ADC memory-control register 1
ADC12MCTL1
11h
ADC memory-control register 2
ADC12MCTL2
12h
ADC memory-control register 3
ADC12MCTL3
13h
ADC memory-control register 4
ADC12MCTL4
14h
ADC memory-control register 5
ADC12MCTL5
15h
ADC memory-control register 6
ADC12MCTL6
16h
ADC memory-control register 7
ADC12MCTL7
17h
ADC memory-control register 8
ADC12MCTL8
18h
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Table 44. ADC12_A Registers (Base Address: 0700h) (continued)
REGISTER DESCRIPTION
REGISTER
OFFSET
PRODUCT PREVIEW
ADC memory-control register 9
ADC12MCTL9
19h
ADC memory-control register 10
ADC12MCTL10
1Ah
ADC memory-control register 11
ADC12MCTL11
1Bh
ADC memory-control register 12
ADC12MCTL12
1Ch
ADC memory-control register 13
ADC12MCTL13
1Dh
ADC memory-control register 14
ADC12MCTL14
1Eh
ADC memory-control register 15
ADC12MCTL15
1Fh
Conversion memory 0
ADC12MEM0
20h
Conversion memory 1
ADC12MEM1
22h
Conversion memory 2
ADC12MEM2
24h
Conversion memory 3
ADC12MEM3
26h
Conversion memory 4
ADC12MEM4
28h
Conversion memory 5
ADC12MEM5
2Ah
Conversion memory 6
ADC12MEM6
2Ch
Conversion memory 7
ADC12MEM7
2Eh
Conversion memory 8
ADC12MEM8
30h
Conversion memory 9
ADC12MEM9
32h
Conversion memory 10
ADC12MEM10
34h
Conversion memory 11
ADC12MEM11
36h
Conversion memory 12
ADC12MEM12
38h
Conversion memory 13
ADC12MEM13
3Ah
Conversion memory 14
ADC12MEM14
3Ch
Conversion memory 15
ADC12MEM15
3Eh
Table 45. DAC12_A Registers (Base Address: 0780h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DAC12_A channel 0 control register 0
DAC12_0CTL0
00h
DAC12_A channel 0 control register 1
DAC12_0CTL1
02h
DAC12_A channel 0 data register
DAC12_0DAT
04h
DAC12_A channel 0 calibration control register
DAC12_0CALCTL
06h
DAC12_A channel 0 calibration data register
DAC12_0CALDAT
08h
DAC12_A channel 1 control register 0
DAC12_1CTL0
10h
DAC12_A channel 1 control register 1
DAC12_1CTL1
12h
DAC12_A channel 1 data register
DAC12_1DAT
14h
DAC12_A channel 1 calibration control register
DAC12_1CALCTL
16h
DAC12_A channel 1 calibration data register
DAC12_1CALDAT
18h
DAC12_A interrupt vector word
DAC12IV
1Eh
Table 46. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
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Table 47. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USB key/ID
USBKEYID
00h
USB module configuration
USBCNF
02h
USB PHY control
USBPHYCTL
04h
USB power control
USBPWRCTL
08h
USB power voltage setting
USBPWRVSR
0Ah
USB PLL control
USBPLLCTL
10h
USB PLL divider
USBPLLDIV
12h
USB PLL interrupts
USBPLLIR
14h
Table 48. USB Control Registers (Base Address: 0920h)
REGISTER
OFFSET
IEPCNF_0
00h
Input endpoint #0 byte count
IEPCNT_0
01h
Output endpoint#0 configuration
OEPCNF_0
02h
Output endpoint #0 byte count
OEPCNT_0
03h
Input endpoint interrupt enables
IEPIE
0Eh
Output endpoint interrupt enables
OEPIE
0Fh
Input endpoint interrupt flags
IEPIFG
10h
Output endpoint interrupt flags
OEPIFG
11h
USB interrupt vector
USBIV
12h
USB maintenance
MAINT
16h
Time stamp
TSREG
18h
USB frame number
USBFN
1Ah
USB control
USBCTL
1Ch
USB interrupt enables
USBIE
1Dh
USB interrupt flags
USBIFG
1Eh
Function address
FUNADR
1Fh
PRODUCT PREVIEW
REGISTER DESCRIPTION
Input endpoint#0 configuration
Table 49. LCD_B Registers (Base Address: 0A00h)
REGISTER DESCRIPTION
REGISTER
OFFSET
LCD_B control register 0
LCDBCTL0
000h
LCD_B control register 1
LCDBCTL1
002h
LCD_B blinking control register
LCDBBLKCTL
004h
LCD_B memory control register
LCDBMEMCTL
006h
LCD_B voltage control register
LCDBVCTL
008h
LCD_B port control register 0
LCDBPCTL0
00Ah
LCD_B port control register 1
LCDBPCTL1
00Ch
LCD_B port control register 2
LCDBPCTL2
00Eh
LCD_B charge pump control register
LCDBCTL0
012h
LCD_B interrupt vector word
LCDBIV
01Eh
LCD_B memory 1
LCDM1
020h
LCD_B memory 2
LCDM2
021h
LCD_B memory 22
LCDM22
035h
LCD_B blinking memory 1
LCDBM1
040h
LCD_B blinking memory 2
LCDBM2
041h
...
...
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Table 49. LCD_B Registers (Base Address: 0A00h) (continued)
REGISTER DESCRIPTION
LCD_B blinking memory 22
REGISTER
LCDBM22
OFFSET
055h
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
–0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18) (2)
–0.3 V to VCC + 0.3 V
Diode current at any device pin
Storage temperature range, Tstg
±2 mA
(3)
–55°C to 105°C
Maximum junction temperature, TJ
(1)
(2)
(3)
95°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
PRODUCT PREVIEW
Recommended Operating Conditions
MIN
Supply voltage during program execution and flash
programming (AVCC1 = DVCC1 = DVCC2 = DVCC3
= DVCC = VCC) (1)
VCC
VCC, USB
Supply voltage during USB operation, USB PLL
disabled
USB_EN = 1, UPLLEN = 0
Supply voltage during USB operation, USB PLL
enabled (2)
USB_EN = 1, UPLLEN = 1
VSS
Supply voltage (AVSS1 = AVSS2 = AVSS3 = DVSS1 =
DVSS2 = DVSS3 = VSS)
VBAT,RTC
Backup-supply voltage with RTC operational
VBAT,MEM
NOM
MAX
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 2
2.2
3.6
PMMCOREVx = 2, 3
2.4
3.6
0
UNIT
V
V
V
TA = 0°C to 85°C
1.55
3.6
TA = –40°C to 85°C
1.70
3.6
Backup-supply voltage with backup memory retained.
TA = –40°C to 85°C
1.20
3.6
V
TA
Operating free-air temperature
I version
–40
85
°C
TJ
Operating junction temperature
I version
–40
85
°C
CBAK
Capacitance at pin VBAK
10
nF
CVCORE
Capacitor at VCORE
CDVCC/CVCORE
Capacitor ratio of DVCC to VCORE
(1)
(2)
40
1
4.7
470
V
nF
10
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
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Recommended Operating Conditions (continued)
MIN
fSYSTEM
Processor frequency (maximum MCLK frequency) (3)
(see Figure 1)
fSYSTEM_USB
Minimum processor frequency for USB operation
USB_wait
Wait state cycles during USB operation
(3)
(4)
(4)
NOM
MAX
PMMCOREVx = 0,
1.8 V ≤ VCC ≤ 3.6 V
(default condition)
0
8.0
PMMCOREVx = 1, 2
V ≤ VCC ≤ 3.6 V
0
12.0
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
0
16.0
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
20.0
1.5
UNIT
MHz
MHz
16
cycles
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
Modules may have a different maximum input clock specification. Refer to the specification of the respective module in this data sheet.
PRODUCT PREVIEW
25
System Frequency - MHz
20
3
16
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 1. Frequency vs Supply Voltage
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Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
EXECUTION
MEMORY
VCC
PMMCOREVx
1 MHz
TYP
IAM,
IAM,
(1)
(2)
(3)
PRODUCT PREVIEW
42
Flash
RAM
Flash
RAM
3V
3V
8 MHz
MAX
0.40
TYP
2.14
12 MHz
MAX
TYP
0
0.32
1
0.36
2.42
3.60
2
0.38
2.58
3.83
3
0.39
0
0.18
1
0.20
1.18
1.74
2
0.22
1.33
1.97
3
0.23
1.41
2.16
1.03
TYP
UNIT
MAX
2.40
2.70
0.21
MAX
20 MHz
4.00
4.00
mA
6.70
1.25
1.90
mA
3.60
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
PARAMETER
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
DT
0
73
73
95
73
73
95
3V
3
79
79
105
79
79
105
2.2 V
0
5.9
5.9
16
5.9
5.9
16
3V
3
6.1
6.1
18
6.1
6.1
18
0
1.5
1.9
3.0
2.5
5.0
10.5
1
1.6
2.0
2.7
5.3
2
1.7
2.0
2.8
5.4
3
1.7
2.1
3.3
2.8
5.5
12.2
0
1.8
2.1
3.5
2.8
5.2
10.8
1
1.8
2.1
2.9
5.5
2
1.9
2.3
3.1
5.7
3
2.0
2.3
3.1
5.8
0
1.0
1.3
1.9
4.3
1
1.0
1.3
2.0
4.5
2
1.0
1.4
2.1
4.6
3
1.0
1.4
2.2
4.7
0
0.9
1.2
1.8
4.2
1
0.9
1.2
1.9
4.4
2
1.0
1.3
2.0
4.6
3V
TYP
MAX
TYP
Low-power mode 4 (8) (4)
3V
1.0
1.3
Low-power mode 3.5
(LPM3.5) current with
active RTC into primary
supply pin DVCC (9)
2.2 V
0.25
0.30
3V
0.29
0.34
Low-power mode 3.5
ILPM3.5,RTC, (LPM3.5) current with
active RTC into backup
VBAT
supply pin VBAT (10)
2.2 V
0.44
0.53
3V
0.61
0.67
ILPM4
3
ILPM3.5,RTC,
VCC
85°C
2.2 V
Low-power mode 3,
crystal mode (6) (4)
Low-power mode 3,
VLO mode, Watchdog
enabled (7) (4)
60°C
PMMCOREVx
3V
ILPM3,VLO,W
25°C
VCC
2.2 V
ILPM3,XT1LF
-40°C
(2)
MAX
3.5
2.5
2.6
0.6
0.8
TYP
MAX
TYP
2.0
4.6
0.37
0.57
0.41
0.63
0.58
0.64
0.72
0.78
MAX
UNIT
µA
µA
µA
12.6
µA
PRODUCT PREVIEW
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
11.0
µA
12.0
1.2
1.4
µA
µA
(1)
(2)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance are chosen to closely match the required 9 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
(4) Current for brownout included. Low side supervisor and monitors disabled (SVSL, SVML). High side supervisor and monitor disabled
(SVSH, SVMH). RAM retention enabled.
(5) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO
setting = 1 MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0)
(6) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(7) Current for watchdog timer clocked by VLO included.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
(9) VVBAT = VCC - 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active
(10) VVBAT = VCC - 0.2 V, fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no
current drawn on VBAK
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER
ILPM3.5,RTC,
TOT
ILPM4.5
Total Low-power mode
3.5 (LPM3.5) current
with active RTC (11)
Low-power mode 4.5 (12)
VCC
PMMCOREVx
-40°C
TYP
2.2 V
MAX
25°C
TYP
60°C
MAX
TYP
MAX
85°C
TYP
MAX
UNIT
0.83
3V
1.41
2.2 V
0.24
0.30
0.37
0.57
3V
0.29
0.34
0.42
0.63
2.0
µA
µA
(11) fDCO = fMCLK = fSMCLK = 0 MHz, fACLK = 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no current drawn on VBAK
(12) Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
PRODUCT PREVIEW
44
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Low-Power Mode with LCD Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(2)
Temperature (TA)
VCC
PMMCOREVx
-40°C
TYP
ILPM3
LCD,
ext. bias
ILPM3
LCD,
int. bias
Low-power mode 3
(LPM3) current, LCD
4-mux mode, external
biasing (3) (4)
Low-power mode 3
(LPM3) current, LCD
4-mux mode, internal
biasing, charge pump
disabled (3) (5)
3V
3V
2.2 V
ILPM3
LCD,CP
(1)
(2)
(3)
(4)
(5)
(6)
Low-power mode 3
(LPM3) current, LCD
4-mux mode, internal
biasing, charge pump
enabled (3) (6)
3V
MAX
25°C
TYP
MAX
60°C
TYP
85°C
MAX
TYP
0
2.0
2.3
TBD
6.8
1
2.1
2.4
TBD
7.1
2
2.2
2.5
TBD
7.4
3
2.2
2.6
TBD
7.4
0
2.4
2.8
TBD
7.3
1
2.4
2.9
TBD
7.6
2
2.5
3.0
TBD
7.8
3
2.5
3.0
TBD
7.9
0
4.0
1
4.1
2
4.2
0
4.2
1
4.3
2
4.5
3
4.5
UNIT
MAX
µA
µA
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance are chosen to closely match the required 9 pF.
Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
Current for brownout included. Low side supervisor and monitors disabled (SVSL, SVML). High side supervisor and monitor disabled
(SVSH, SVMH). RAM retention enabled.
LCDMx = 11 (4-mux mode), LCDREXT = 1, LCDEXTBIAS = 1 (external biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump
disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)
Current through external resistors not included (voltage levels are supplied by test equipment).
Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.
LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump
disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)
Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.
LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 1 (charge pump
enabled), VLCDx = 1000 (VLCD = 3 V, typ.), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)
Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.
Schmitt-Trigger Inputs – General Purpose I/O (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup/pulldown resistor
For pullup: VIN = VSS
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
VCC
MIN
1.8 V
0.80
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.8
3V
0.4
1.0
20
TYP
35
MAX
50
5
UNIT
V
V
V
kΩ
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
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PRODUCT PREVIEW
PARAMETER
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
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Inputs – Ports P1, P2, P3, and P4 (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
t(int)
(1)
(2)
PARAMETER
TEST CONDITIONS
VCC
External interrupt timing (2)
Port P1, P2, P3, P4: P1.x to P4.x, External trigger pulse
width to set interrupt flag
2.2 V/3 V
MIN
MAX
20
UNIT
ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter
than t(int).
Leakage Current – General Purpose I/O
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.x)
(1)
(2)
TEST CONDITIONS
VCC
(1) (2)
High-impedance leakage current
MIN
1.8 V/3 V
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
Outputs – General Purpose I/O (Full Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PRODUCT PREVIEW
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA (1)
VOH
High-level output voltage
I(OHmax) = –10 mA (2)
I(OHmax) = –5 mA
I(OLmax) = 3 mA (1)
Low-level output voltage
I(OLmax) = 10 mA (2)
I(OLmax) = 5 mA (1)
I(OLmax) = 15 mA (2)
(1)
(2)
1.8 V
(1)
I(OHmax) = –15 mA (2)
VOL
VCC
3V
1.8 V
3V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
UNIT
V
VSS VSS + 0.25
VSS VSS + 0.60
VSS VSS + 0.25
V
VSS VSS + 0.60
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
Outputs – General Purpose I/O (Reduced Drive Strength)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (2)
VOH
High-level output voltage
I(OHmax) = –3 mA (3)
I(OHmax) = –2 mA
I(OLmax) = 1 mA (2)
Low-level output voltage
I(OLmax) = 3 mA (3)
I(OLmax) = 2 mA (2)
I(OLmax) = 6 mA (3)
(1)
(2)
(3)
46
1.8 V
(2)
I(OHmax) = –6 mA (3)
VOL
VCC
3V
1.8 V
3V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
UNIT
V
VSS VSS + 0.25
VSS VSS + 0.60
VSS VSS + 0.25
V
VSS VSS + 0.60
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
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Output Frequency – Ports P1, P2 and P3
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fPx.y
fPort_CLK
(1)
(2)
Port output frequency
(with load)
P3.4/TA2CLK/SMCLK/S27
CL = 20 pF, RL = 1 kΩ (1) or 3.2 kΩ (2)
Clock output frequency
P1.0/TA0CLK/ACLK/S39
P3.4/TA2CLK/SMCLK/S27
P2.0/P2MAP0 (P2MAP0 = PM_MCLK )
CL = 20 pF (3)
(3)
MIN
MAX
VCC = 1.8 V
PMMCOREVx = 0
8
VCC = 3 V
PMMCOREVx = 3
20
VCC = 1.8 V
PMMCOREVx = 0
8
VCC = 3 V
PMMCOREVx = 3
20
UNIT
MHz
MHz
Full drive strength of port: A resistive divider with 2 × 0.5 kΩ between VCC and VSS is used as load. The output is connected to the
center tap of the divider.
Reduced drive strength of port: A resistive divider with 2 × 1.6 kΩ between VCC and VSS is used as load. The output is connected to the
center tap of the divider.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
PRODUCT PREVIEW
(3)
TEST CONDITIONS
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Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
ΔIDVCC,LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
0.170
32768
XTS = 0, XT1BYPASS = 0
fXT1,LF,SW
XT1 oscillator logic-level
square-wave input frequency,
LF mode
XTS = 0, XT1BYPASS = 1 (2)
Oscillation allowance for
LF crystals (4)
3V
0.290
XT1 oscillator crystal frequency,
LF mode
(3)
10
PRODUCT PREVIEW
Integrated effective load
capacitance, LF mode (5)
210
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
LF mode
fFault,LF
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
48
Startup time, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C,
CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C,
CL,eff = 12 pF
µA
Hz
50
kHz
2
5.5
Duty cycle
UNIT
kΩ
XTS = 0, XCAPx = 1
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
tSTART,LF
32.768
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
XTS = 0, XCAPx = 0 (6)
CL,eff
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
fXT1,LF0
OALF
TYP
pF
30
70
%
10
10000
Hz
1000
3V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,ef f ≤ 6 pF.
(b) For XT1DRIVEx = 1, 6 pF ≤ CL,ef f ≤ 9 pF.
(c) For XT1DRIVEx = 2, 6 pF ≤ CL,ef f ≤ 10 pF.
(d) For XT1DRIVEx = 3, CL,ef f ≥ 6 pF.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
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Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
TEST CONDITIONS
VCC
MIN
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C
IDVCC,XT2
XT2 oscillator crystal current
consumption
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
TA = 25°C
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C
TYP
MAX
UNIT
200
260
3V
µA
325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal frequency,
mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal frequency,
mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal frequency,
mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal frequency,
mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level
square-wave input frequency
XT2BYPASS = 1 (4)
1.5
32
MHz
OAHF
tSTART,HF
CL,eff
Oscillation allowance for
HF crystals (5)
Startup time
Integrated effective load
capacitance, HF mode (6)
(3)
(4)
(5)
(6)
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C,
CL,eff = 15 pF
0.5
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 3,
TA = 25°C,
CL,eff = 15 pF
Ω
3V
ms
0.3
1
(1)
Duty cycle
(1)
(2)
(3)
Measured at ACLK, fXT2,HF2 =
20 MHz
40
50
pF
60
%
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
Maximum frequency of operation of the entire device cannot be exceeded.
When XT2BYPASS is set, the XT2 circuit is automatically powered down.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
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PRODUCT PREVIEW
PARAMETER
(2)
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
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Crystal Oscillator, XT2 (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER
fFault,HF
(7)
(8)
Oscillator fault frequency
TEST CONDITIONS
(7)
XT2BYPASS = 1
VCC
(8)
MIN
TYP
30
MAX
UNIT
300
kHz
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
Measured at ACLK (2)
1.8 V to 3.6 V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
MIN
TYP
MAX
6
9.4
14
0.5
kHz
%/°C
4
40
UNIT
%/V
50
60
TYP
MAX
%
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
Internal Reference, Low-Frequency Oscillator (REFO)
PRODUCT PREVIEW
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IREFO
TEST CONDITIONS
VCC
MIN
REFO oscillator current
consumption
TA = 25°C
1.8 V to 3.6 V
3
32768
UNIT
µA
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
fREFO
REFO absolute tolerance
calibrated
Full temperature range
1.8 V to 3.6 V
dfREFO/dT
REFO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.01
%/°C
dfREFO/dVCC
REFO frequency supply voltage
drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
%/V
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO startup time
40%/60% duty cycle
1.8 V to 3.6 V
tSTART
(1)
(2)
TA = 25°C
Hz
±3.5
3V
±1.5
40
50
60
25
%
%
%
µs
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
PARAMETER
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
50
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TEST CONDITIONS
MIN
TYP
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
DCO Frequency (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
40
50
60
%
dfDCO/dT
DCO frequency temperature drift
fDCO = 1 MHz,
0.1
%/°C
dfDCO/dVCC
DCO frequency voltage drift
fDCO = 1 MHz
1.9
%/V
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
PRODUCT PREVIEW
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 2. Typical DCO frequency
PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT–)
BORH on voltage,
DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage,
DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys)
BORH hysteresis
tRESET
Pulse length required at
RST/NMI pin to accept a
reset
MIN
0.80
TYP
1.30
60
MAX
UNIT
1.45
V
1.50
V
250
mV
2
µs
PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active
mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
1.90
V
VCORE2(AM)
Core voltage, active
mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 21 mA
1.80
V
VCORE1(AM)
Core voltage, active
mode, PMMCOREV = 1
2 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 17 mA
1.60
V
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MSP430F663x
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PMM, Core Voltage (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCORE0(AM)
Core voltage, active
mode, PMMCOREV = 0
VCORE3(LPM)
TEST CONDITIONS
MIN
1.8 V ≤ DVCC ≤ 3.6 V, 0 mA ≤ I(VCORE) ≤ 13 mA
TYP
MAX
UNIT
1.40
V
Core voltage, low-current
2.4 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 3
1.94
V
VCORE2(LPM)
Core voltage, low-current
2.2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 2
1.84
V
VCORE1(LPM)
Core voltage, low-current
2 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 1
1.64
V
VCORE0(LPM)
Core voltage, low-current
1.8 V ≤ DVCC ≤ 3.6 V, 0 µA ≤ I(VCORE) ≤ 30 µA
mode, PMMCOREV = 0
1.44
V
PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
SVS current consumption
PRODUCT PREVIEW
V(SVSH_IT–)
V(SVSH_IT+)
tpd(SVSH)
t(SVSH)
SVSH off voltage level (1)
SVSH propagation delay
SVSH on/off delay time
dVDVCC/dt
(1)
SVSH on voltage level (1)
TYP
MAX
0
UNIT
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
200
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
2.0
µA
SVSHE = 1, SVSHRVL = 0
1.59
1.64
1.69
SVSHE = 1, SVSHRVL = 1
1.79
1.84
1.91
SVSHE = 1, SVSHRVL = 2
1.98
2.04
2.11
SVSHE = 1, SVSHRVL = 3
2.10
2.16
2.23
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.81
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.01
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.21
SVSHE = 1, SVSMHRRL = 3
2.20
2.26
2.33
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.48
SVSHE = 1, SVSMHRRL = 5
2.56
2.70
2.84
SVSHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVSHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
SVSHE = 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
20
V
V
µs
SVSHE = 0→1,
SVSHFP = 1
12.5
SVSHE = 0→1,
SVSHFP = 0
100
µs
DVCC rise time
0
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. Please refer to the Power Management Module and Supply
Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208) on recommended settings and usage.
PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
52
SVMH current consumption
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MIN
TYP
MAX
UNIT
0
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0
200
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
2.0
µA
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
PMM, SVM High Side (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
V(SVMH)
SVMH on/off voltage level
TEST CONDITIONS
(1)
MIN
TYP
MAX
SVMHE = 1, SVSMHRRL = 0
1.65
1.74
1.86
SVMHE = 1, SVSMHRRL = 1
1.85
1.94
2.02
SVMHE = 1, SVSMHRRL = 2
2.02
2.14
2.22
SVMHE = 1, SVSMHRRL = 3
2.18
2.26
2.35
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.48
SVMHE = 1, SVSMHRRL = 5
2.56
2.70
2.84
SVMHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVMHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
SVMHE = 1, SVMHOVPE = 1
tpd(SVMH)
t(SVMH)
(1)
SVMH propagation delay
SVMH on/off delay time
UNIT
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
2.5
µs
SVMHE = 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
20
µs
SVMHE = 0→1,
SVSMFP = 1
12.5
µs
SVMHE = 0→1,
SVMHFP = 0
100
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. Please refer to the Power Management Module and
Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide (SLAU208) on recommended settings and usage.
PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSLE = 0, PMMCOREV = 2
I(SVSL)
tpd(SVSL)
t(SVSL)
SVSL current consumption
SVSL propagation delay
SVSL on/off delay time
TYP
MAX
0
UNIT
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
2.0
µA
SVSLE = 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
20
µs
SVSLE = 0→1,
SVSLFP = 1
12.5
SVSLE = 0→1,
SVSLFP = 0
100
µs
PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SVMLE = 0, PMMCOREV = 2
I(SVML)
tpd(SVML)
t(SVML)
SVML current consumption
SVML propagation delay
SVML on/off delay time
Copyright © 2010, Texas Instruments Incorporated
MIN
TYP
MAX
UNIT
0
nA
SVMLE = 1, PMMCOREV = 2, SVMLFP = 0
200
nA
SVMLE = 1, PMMCOREV = 2, SVMLFP = 1
2.0
µA
SVMLE = 1, dVCORE/dt = 10 mV/µs,
SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs,
SVMLFP = 0
20
µs
SVMLE = 0→1,
SVMLFP = 1
12.5
SVMLE = 0→1,
SVMLFP = 0
100
µs
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PRODUCT PREVIEW
PARAMETER
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Wake-up from Low Power Modes
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
PMMCOREV = 0, SVSMLRRL = 0,
SVSLFP = 1
tFAST-WAKEUP
Wake-up time from LPM2, LPM3, or
LPM4 to active mode (1)
PMMCOREV = 1, SVSMLRRL = 1,
SVSLFP = 1
PMMCOREV = 2, SVSMLRRL = 2,
SVSLFP = 1
5
2.2 V/3 V
µs
5
5
PMMCOREV = 0, SVSMLRRL = 0,
SVSLFP = 0
UP
Wake-up time from LPM2, LPM3 or
LPM4 to active mode (2)
PMMCOREV = 1, SVSMLRRL = 1,
SVSLFP = 0
PMMCOREV = 2, SVSMLRRL = 2,
SVSLFP = 0
150
150
2.2 V/3 V
µs
150
PMMCOREV = 3, SVSMLRRL = 3,
SVSLFP = 0
tWAKE-UP
PRODUCT PREVIEW
LPM5
tWAKE-UPRESET
(1)
(2)
(3)
Wake-up time from LPM5 to active
mode (3)
UNIT
5
PMMCOREV = 3, SVSMLRRL = 3,
SVSLFP = 1
tSLOW-WAKE-
MAX
150
2.2 V/3 V
Wake-up time from RST or BOR
event to active mode (3)
2
3
ms
2
3
ms
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. Please refer to the Power Management Module and Supply Voltage Supervisor chapter in the
MSP430x5xx Family User's Guide (SLAU208).
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. Please refer to the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx Family User's Guide
(SLAU208).
This value represents the time from the wakeup event to the reset vector execution.
Timer_A, Timers TA0, TA1, and TA2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK
Duty cycle = 50% ± 10%
tTA,cap
Timer_A capture timing
All capture inputs.
Minimum pulse width required for
capture.
VCC
1.8 V/ 3 V
1.8 V/ 3 V
MIN
TYP
MAX
UNIT
20
MHz
20
ns
Timer_B, Timer TB0
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTB
Timer_B input clock frequency
Internal: SMCLK, ACLK
External: TBCLK
Duty cycle = 50% ± 10%
1.8 V/ 3 V
tTB,cap
Timer_B capture timing
All capture inputs.
Minimum pulse width required for
capture.
1.8 V/ 3 V
54
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MIN
20
TYP
MAX
UNIT
20
MHz
ns
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
Battery-Backup
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VBAT = 1.7 V
DVCC not
connected
RTC running
IVBAT
Current into VBAT terminal in case
no primary battery is connected.
VBAT = 2.2 V
DVCC not
connected
RTC running
VBAT = 3 V
DVCC not
connected
RTC running
VCC
MIN
TYP
TA = -40°C
0.43
TA = 25°C
0.52
TA = 60°C
0.58
TA = 85°C
0.64
TA = -40°C
0.50
TA = 25°C
0.59
TA = 60°C
0.64
TA = 85°C
0.71
TA = -40°C
0.68
TA = 25°C
0.75
TA = 60°C
0.79
TA = 85°C
MAX
UNIT
µA
µA
µA
0.86
General
VSVSH_I
T-
Switch over level (VCC to VBAT)
RON_VBAT
On-resistance of switch between
VBAT and VBAK
VBAT3
VBAT to ADC:
VBAT divide. VBAT3 ≠ VBAT /3
tSample,VBA
CVCC = 4.7 µF
1.59
1.69
SVSHRL = 1
1.79
1.91
SVSHRL = 2
1.98
2.11
SVSHRL = 3
2.10
VBAT = 1.8 V
5
1.8 V
0.6
±5%
3V
1.0
±5%
3.6 V
1.2
±5%
0V
VBAT to ADC: Sampling time
required if VBAT3 selected.
ADC12ON = 1, Error of conversion
result ≤ 1 LSB
1000
VCHVx
Charger end voltage
CHVx = 2
2.65
RCHARGE
Charge limiting resistor
2.23
350
T3
V
PRODUCT PREVIEW
VSWITCH
SVSHRL = 0
kΩ
V
ns
2.7
2.9
CHCx = 1
5
CHCx = 2
10
CHCx = 3
20
V
kΩ
USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
tt
UART receive deglitch time (1)
(1)
TEST CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
TYP
MAX
UNIT
fSYSTEM
MHz
1
MHz
2.2 V
50
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
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USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 3 and )
PARAMETER
fUSCI
TEST CONDITIONS
VCC
USCI input clock frequency
PMMCOREV = 0
tSU,MI
SOMI input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,MI
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
PRODUCT PREVIEW
tHD,MO
(1)
(2)
(3)
SIMO output data valid time (2)
SIMO output data hold time
MIN
SMCLK, ACLK
Duty cycle = 50% ± 10%
(3)
1.8 V
55
3V
38
2.4 V
30
3V
25
1.8 V
0
3V
0
2.4 V
0
3V
0
TYP
MAX
UNIT
fSYSTEM
MHz
ns
ns
ns
ns
UCLK edge to SIMO valid,
CL = 20 pF
PMMCOREV = 0
1.8 V
20
3V
18
UCLK edge to SIMO valid,
CL = 20 pF
PMMCOREV = 3
2.4 V
16
3V
15
CL = 20 pF
PMMCOREV = 0
1.8 V
-10
3V
-8
CL = 20 pF
PMMCOREV = 3
2.4 V
-10
3V
-8
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) refer to the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. Refer to the timing
diagrams in Figure 3 and .
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. Refer to the timing diagrams in
Figure 3 and .
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 3. SPI Master Mode, CKPH = 0
56
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1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
PRODUCT PREVIEW
Figure 4. SPI Master Mode, CKPH = 1
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USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 5 and Figure 6)
PARAMETER
TEST CONDITIONS
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to SOMI data out
PMMCOREV = 3
PMMCOREV = 0
PRODUCT PREVIEW
STE disable time, STE high to SOMI high
impedance
tSTE,DIS
PMMCOREV = 3
PMMCOREV = 0
tSU,SI
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
tHD,SO
(1)
(2)
(3)
58
SOMI output data valid time
(2)
SOMI output data hold time (3)
VCC
MIN
1.8 V
11
3V
8
2.4 V
7
3V
6
1.8 V
3
3V
3
2.4 V
3
3V
3
TYP
MAX
ns
ns
ns
ns
1.8 V
66
3V
50
2.4 V
36
3V
30
1.8 V
30
3V
23
2.4 V
16
3V
13
1.8 V
5
3V
5
2.4 V
2
3V
2
1.8 V
5
3V
5
2.4 V
5
3V
5
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
UCLK edge to SOMI valid,
CL = 20 pF
PMMCOREV = 0
1.8 V
76
3V
60
UCLK edge to SOMI valid,
CL = 20 pF
PMMCOREV = 3
2.4 V
44
3V
40
CL = 20 pF
PMMCOREV = 0
1.8 V
18
3V
12
CL = 20 pF
PMMCOREV = 3
2.4 V
10
3V
8
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master) refer to the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. Refer to the timing
diagrams in Figure 5 and Figure 6.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. Refer to the timing diagrams in
Figure 5 and Figure 6.
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
PRODUCT PREVIEW
Figure 5. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 6. SPI Slave Mode, CKPH = 1
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USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V/3 V
0
ns
tSU,DAT
Data setup time
2.2 V/3 V
250
ns
2.2 V/3 V
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
tSU,STO
Setup time for STOP
tSP
Pulse width of spikes suppressed by input filter
fSCL > 100 kHz
tSU,STA
tHD,STA
2.2 V/3 V
2.2 V/3 V
2.2 V/3 V
0
4.0
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
PRODUCT PREVIEW
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 7. I2C Mode Timing
60
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LCD_B Recommended Operating Conditions
CONDITIONS
MIN
NOM
MAX
UNIT
Supply voltage range,
LCDCPEN = 1, 0000 < VLCDx ≤ 1111 (charge
charge pump
pump enabled, VLCD≤3.6 V)
enabled, VLCD≤3.6 V
2.2
3.6
V
Supply voltage range,
LCDCPEN = 1, 0000 < VLCDx ≤ 1100 (charge
charge pump
pump enabled, VLCD≤3.3V)
enabled, VLCD≤3.3V
2.0
3.6
V
Supply voltage range,
VCC,LCD_B,int. bias internal biasing,
LCDCPEN = 0, VLCDEXT = 0
charge pump disabled
2.4
3.6
V
Supply voltage range,
external biasing,
LCDCPEN = 0, VLCDEXT = 0
charge pump disabled
2.4
3.6
V
Supply voltage range,
external LCD voltage,
internal or external
LCDCPEN = 0, VLCDEXT = 1
biasing, charge pump
disabled
2.0
3.6
V
VLCDCAP/R33
External LCD voltage
at LCDCAP/R33,
internal or external
biasing, charge pump
disabled
2.4
3.6
V
CLCDCAP
Capacitor on
LCDCPEN = 1, VLCDx > 0000 (charge pump
LCDCAP when
enabled)
charge pump enabled
10
µF
fFrame
LCD frame frequency
range
100
Hz
fACLK,in
ACLK input frequency
range
40
kHz
CPanel
Panel capacitance
100-Hz frame frequency
10000
pF
VR33
Analog input voltage
at R33
LCDCPEN = 0, VLCDEXT = 1
VCC+0.2
V
VR23,1/3bias
Analog input voltage
at R23
LCDREXT = 1, LCDEXTBIAS = 1, LCD2B = 0
VR03 +
VR13 2/3*(VR33
-VR03)
VR33
V
VR13,1/3bias
Analog input voltage
at R13 with 1/3
biasing
LCDREXT = 1, LCDEXTBIAS = 1, LCD2B = 0
VR03 +
VR03 1/3*(VR33
-VR03)
VR23
V
VR13,1/2bias
Analog input voltage
at R13 with 1/2
biasing
LCDREXT = 1, LCDEXTBIAS = 1, LCD2B = 1
VR03 +
VR03 1/2*(VR33
-VR03)
VR33
V
VR03
Analog input voltage
at R03
R0EXT = 1
VSS
VLCD-VR03
Voltage difference
between VLCD and
R03
LCDCPEN = 0, R0EXT = 1
2.4
VLCDREF/R13
External LCD
reference voltage
applied at
LCDREF/R13
VLCDREFx = 01
0.8
VCC,LCD_B,CP
en,3.6
VCC,LCD_B,CP
en,3.3
VCC,LCD_B,ext.
bias
VCC,LCD_B,VLCDE
XT
LCDCPEN = 0, VLCDEXT = 1
fLCD = 2 × mux × fFRAME with mux = 1 (static), 2, 3,
4.
4.7
0
30
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4.7
32
2.4
PRODUCT PREVIEW
PARAMETER
V
1.2
VCC+0.2
V
1.5
V
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LCD_B Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VLCD
TEST CONDITIONS
LCD voltage
VCC
MIN
TYP
MAX
UNIT
PRODUCT PREVIEW
VLCDx = 0000, VLCDEXT = 0
2.4 V - 3.6 V
VCC
V
LCDCPEN = 1, VLCDx = 0001
2 V - 3.6 V
2.60
V
LCDCPEN = 1, VLCDx = 0010
2 V - 3.6 V
2.66
V
LCDCPEN = 1, VLCDx = 0011
2 V - 3.6 V
2.72
V
LCDCPEN = 1, VLCDx = 0100
2 V - 3.6 V
2.78
V
LCDCPEN = 1, VLCDx = 0101
2 V - 3.6 V
2.84
V
LCDCPEN = 1, VLCDx = 0110
2 V - 3.6 V
2.90
V
LCDCPEN = 1, VLCDx = 0111
2 V - 3.6 V
2.96
V
LCDCPEN = 1, VLCDx = 1000
2 V - 3.6 V
3.02
V
LCDCPEN = 1, VLCDx = 1001
2 V - 3.6 V
3.08
V
LCDCPEN = 1, VLCDx = 1010
2 V - 3.6 V
3.14
V
LCDCPEN = 1, VLCDx = 1011
2 V - 3.6 V
3.20
V
LCDCPEN = 1, VLCDx = 1100
2 V - 3.6 V
3.26
V
LCDCPEN = 1, VLCDx = 1101
2.2 V - 3.6 V
3.32
V
LCDCPEN = 1, VLCDx = 1110
2.2 V - 3.6 V
3.38
LCDCPEN = 1, VLCDx = 1111
2.2 V - 3.6 V
3.44
V
3.6
V
ICC,Peak,CP
Peak supply currents due to
charge pump activities
LCDCPEN = 1, VLCDx = 1111
2.2 V
200
µA
tLCD,CP,on
Time to charge CLCD when
discharged
CLCD = 4.7µF, LCDCPEN =
0→1, VLCDx = 1111
2.2 V
100
ICP,Load
Maximum charge pump load
current
LCDCPEN = 1, VLCDx = 1111
2.2 V
RLCD,Seg
LCD driver output impedance,
segment lines
LCDCPEN = 1, VLCDx = 1000,
ILOAD = ±10µA
2.2 V
10
kΩ
RLCD,COM
LCD driver output impedance,
common lines
LCDCPEN = 1, VLCDx = 1000,
ILOAD = ±10µA
2.2 V
10
kΩ
MAX
UNIT
500
ms
50
µA
12-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC12 analog input pins Ax
IADC12_A
Operating supply current into
AVCC terminal (3)
fADC12CLK = 5.0 MHz, ADC12ON = 1,
REFON = 0, SHT0 = 0, SHT1 = 0,
ADC12DIV = 0
CI
Input capacitance
Only one terminal Ax can be selected at one
time
RI
Input MUX ON resistance
0 V ≤ VAx ≤ AVCC
(1)
(2)
(3)
VCC
MIN
TYP
2.2
3.6
V
0
AVCC
V
2.2 v
125
155
3V
150
220
2.2 V
20
25
pF
200
1900
Ω
10
µA
The leakage current is specified by the digital I/O input leakage.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. If the
reference voltage is supplied by an external source or if the internal voltage is used and REFOUT = 1, then decoupling capacitors are
required. See REF, External Reference and REF, Built-In Reference.
The internal reference supply current is not included in current consumption parameter IADC12.
12-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fADC12CLK
62
TEST CONDITIONS
For specified performance of ADC12 linearity
parameters
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VCC
MIN
TYP
MAX
UNIT
2.2 V/3 V
0.45
4.8
5.4
MHz
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12-Bit ADC, Timing Parameters (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fADC12OSC
tCONVERT
TEST CONDITIONS
Internal ADC12
oscillator (1)
Conversion time
VCC
MIN
TYP
MAX
UNIT
ADC12DIV = 0, fADC12CLK = fADC12OSC
2.2 V/3 V
4.2
4.8
5.4
MHz
REFON = 0, Internal oscillator,
fADC12OSC = 4.2 MHz to 5.4 MHz
2.2 V/3 V
2.4
Turn on settling time of
the ADC
See
tSample
Sampling time
RS = 400 Ω, RI = 200 Ω, CI = 20 pF,
t = [RS + RI] × CI (4)
(2)
(3)
(4)
(2)
(3)
100
2.2 V/3 V
1000
ns
ns
The ADC12OSC is sourced directly from MODOSC inside the UCS. At supply voltages below 2.2 V the ADC12OSC clock needs to be
divided by 2.
13 × ADC12DIV × 1/fADC12CLK
The condition is that the error in a conversion started after tADC12ON is less than ±0.5 LSB. The reference and input signal are already
settled.
Approximately ten Tau (t) are needed to get an error of less than ±0.5 LSB:
tSample = ln(2n+1) x (RS + RI) × CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance
12-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
EI
Integral
linearity error
1.4 V ≤ (VeREF+ – VREF–/VeREF–)min ≤ 1.6 V
ED
Differential
linearity error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
2.2 V/3 V
EO
Offset error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
Internal impedance of source RS < 100 Ω, CVREF+ = 20 pF
2.2 V/3 V
EG
Gain error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
ET
Total unadjusted
error
(VeREF+ – VREF–/VeREF–)min ≤ (VeREF+ – VREF–/VeREF–),
CVREF+ = 20 pF
1.6 V < (VeREF+ – VREF–/VeREF–)min ≤ VAVCC
MIN
TYP
MAX
±2
2.2 V/3 V
±1.7
UNIT
LSB
±1
LSB
±1
±3.5
LSB
2.2 V/3 V
±1.1
±2
LSB
2.2 V/3 V
±2
±5
LSB
TYP
MAX
UNIT
12-Bit ADC, Temperature Sensor and Built-In VMID (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VSENSOR
See
(2)
TCSENSOR
TEST CONDITIONS
ADC12ON = 1, INCH = 0Ah,
TA = 0°C
ADC12ON = 1, INCH = 0Ah
VCC
MIN
2.2 V
680
3V
680
2.2 V
2.25
±3%
3V
2.25
±3%
mV
tSENSOR(sample)
Sample time required if
channel 10 is selected (3)
ADC12ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
2.2 V
30
3V
30
VMID
AVCC divider at channel 11
ADC12ON = 1, INCH = 0Bh,
VMID is ~0.5 × VAVCC
2.2 V
1.06
1.1
1.14
3V
1.46
1.5
1.54
tVMID(sample)
Sample time required if
channel 11 is selected (4)
ADC12ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
2.2 V/3 V
1000
(1)
(2)
(3)
(4)
mV/°C
µs
V
ns
The temperature sensor is provided by the REF module. Please refer to the REF module parametric, IREF+, regarding the current
consumption of the temperature sensor.
The temperature sensor offset can be as much as ±20°C. A single-point calibration is recommended in order to minimize the offset error
of the built-in temperature sensor. The TLV structure contains calibration values for 30°C ± 3°C and 85°C ± 3°C for each of the available
reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR * (Temperature,°C) + VSENSOR, where TCSENSOR
and VSENSOR can be computed from the calibration values for higher accuracy. See also the MSP430x5xx Family User's Guide
(SLAU208).
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
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PRODUCT PREVIEW
(1)
µs
External fADC12CLK from ACLK, MCLK or SMCLK,
ADC12SSEL ≠ 0
tADC12ON
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Typical Temperature Sensor Voltage - mV
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature - ˚C
PRODUCT PREVIEW
Figure 8. Typical Temperature Sensor Voltage
REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
MAX
UNIT
VeREF+
Positive external reference voltage input
PARAMETER
VeREF+ > VREF–/VeREF–
(2)
1.4
AVCC
V
VREF–/VeREF–
Negative external reference voltage input
VeREF+ > VREF–/VeREF–
(3)
0
1.2
V
(VeREF+ –
VREF–/VeREF–)
Differential external reference voltage
input
VeREF+ > VREF–/VeREF–
(4)
1.4
AVCC
V
TBD
µA
TBD
µA
TBD
µA
IVeREF+ ,
IVREF–/VeREF–
Static input current
IVeREF+
Peak input current
CVREF+/-
Capacitance at VREF+/- terminal
(1)
(2)
(3)
(4)
(5)
64
TEST CONDITIONS
VCC
1.4 V ≤ VeREF+ ≤ VAVCC ,
VeREF– = 0 V, fADC12CLK = 5
MHz, ADC12SHTx = 1h,
Conversion rate 200 ksps
2.2 V/3 V
1.4 V ≤ VeREF+ ≤ VAVCC ,
VeREF– = 0 V, fADC12CLK = 5
MHZ, ADC12SHTx = 8h,
Conversion rate 20 ksps
2.2 V/3 V
MIN
TYP
TBD
0 V ≤ VeREF+ ≤ VAVCC
(5)
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx Family User's Guide (SLAU208).
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REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
VREF+
Positive built-in
reference voltage
output
TEST CONDITIONS
VCC
Operating supply
current into AVCC
terminal (2) (3)
TYP MAX UNIT
REFVSEL = {2} for 2.5 V
REFON = REFOUT = 1
IVREF+ = 0 A
3V
2.5
±1%
REFVSEL = {1} for 2 V
REFON = REFOUT = 1
IVREF+ = 0 A
3V
2.0
±1%
REFVSEL = {0} for 1.5 V
REFON = REFOUT = 1
IVREF+ = 0 A
2.2 V / 3
V
1.5
±1%
REFVSEL = {0} for 1.5 V
AVCC minimum voltage,
AVCC(min) Positive built-in
REFVSEL = {1} for 2 V
reference active
REFVSEL = {2} for 2.5 V
IREF+
MIN
2.2
2.3
V
2.8
fADC12CLK = 5 MHz,
REFON = 1, REFOUT = 0, REFBURST = 0
3V
TBD
fADC12CLK = 5 MHZ,
REFON = 1, REFOUT = 1, REFBURST = 0
3V
TBD
IL(VREF+)
Load-current
regulation, VREF+
terminal (4)
REFVSEL = {0, 1, 2}
IVREF+ = +10 µA / -1000 µA
AVCC = AVCC(min) for each reference level. REFVSEL = {0, 1,
2}, REFON = REFOUT = 1
CVREF+
Capacitance at VREF+
terminal
REFON = REFOUT = 1, (5)
0 mA ≤ IVREF+ ≤ IVREF+(max)
TCREF+
Temperature coefficient IVREF+ is a constant in the range of
of built-in reference (6)
0 mA ≤ IVREF+ ≤ –1 mA
µA
2.2 V/3 V
REFOUT = 0
2.2 V/3 V
20
PSRR_A
C
AVCC = AVCC(min) - AVCC(max)
TA = 25°C
REFVSEL = {0, 1, 2}, REFON = 1, REFOUT = 0 or 1
TBD
AVCC = AVCC(min) - AVCC(max)
REFVSEL = {0, 1, 2}, REFOUT = 0, REFON = 0 → 1
75
AVCC = AVCC(min) - AVCC(max)
CVREF = CVREF(max)
REFVSEL = {0, 1, 2}, REFOUT = 1, REFON = 0 → 1
75
(1)
(2)
(3)
(4)
(5)
(6)
(7)
100
pF
ppm/
°C
TBD µV/V
TBD
tSETTLE
µV/m
A
TBD
AVCC = AVCC(min) - AVCC(max)
TA = 25°C
REFVSEL = {0, 1, 2}, REFON = 1, REFOUT = 0 or 1
Settling time of
reference voltage (7)
TBD
TBD
PSRR_D Power Supply
C
Rejection Ratio (DC)
Power Supply
Rejection Ratio (AC)
V
mV/
V
µs
The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one
smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as,
used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference
for the conversion and utilizes the smaller buffer.
The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a
conversion is active. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current
contribution of the larger buffer without external load.
The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with REFON
= 1 and REFOUT = 0.
Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc.
Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external
reference source if it is used for the ADC12_A. See also the MSP430x5xx Family User's Guide (SLAU208).
Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C – (–40°C)).
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB. The settling time depends on the external
capacitive load when REFOUT = 1.
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PRODUCT PREVIEW
PARAMETER
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
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12-Bit DAC, Supply Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
AVCC
TEST CONDITIONS
Analog supply voltage
MIN
AVCC = DVCC, AVSS = DVSS = 0 V
DAC12AMPx = 2, DAC12IR = 0,
DAC12IOG = 1
DAC12_xDAT = 0800h
VeREF+ = VREF+ = 1.5V
Supply current, single DAC
channel (1) (2)
IDD
VCC
TYP
2.20
3V
DAC12AMPx = 2, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
DAC12AMPx = 5, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
UNIT
3.60
V
65
110
65
110
µA
2.2 V/3 V
300
DAC12AMPx = 7, DAC12IR = 1,
DAC12_xDAT = 0800h,
VeREF+ = VREF+ = AVCC
(1)
(2)
MAX
1000
No load at the output pin, DAC12_0 or DAC12_1, assuming that the control bits for the shared pins are set properly.
Current into reference terminals not included. If DAC12IR = 1 current flows through the input divider; see Reference Input specifications.
12-bit DAC, Linearity Specifications (See Figure 9)
PRODUCT PREVIEW
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Resolution
INL
Integral nonlinearity (1)
DNL
Differential nonlinearity (1)
TEST CONDITIONS
EG
Gain error
dE(G)/dT
Gain temperature
coefficient (1)
tOffset_Cal
Time for offset
calibration (3)
2.2 V
±2
TBD
3V
±2
±4
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
2.2 V
±0.4
TBD
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
3V
±0.4
±1
(1) (2)
(1) (2)
VeREF+ = 1.5 V,
DAC12AMPx = 7,
DAC12IR = 1
2.2 V
±21
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
3V
±21
VeREF+ = 1.5 V,
DAC12AMPx = 7,
DAC12IR = 1
2.2 V
±1.5
VeREF+ = 2.5 V,
DAC12AMPx = 7,
DAC12IR = 1
3V
±1.5
With calibration
2.2 V/3 V
VeREF+ = 1.5 V
2.2 V
VeREF+ = 2.5 V
3V
2.2 V/3 V
DAC12AMPx = 3, 5
DAC12AMPx = 4, 6, 7
(2)
(3)
66
LSB
LSB
mV
DAC12AMPx = 2
(1)
bits
VeREF+ = 2.5 V, DAC12AMPx = 7, DAC12IR = 1
With calibration
Offset error temperature
coefficient (1)
TYP MAX UNIT
12
Offset voltage
dE(O)/dT
MIN
VeREF+ = 1.5 V, DAC12AMPx = 7, DAC12IR = 1
Without calibration
EO
VCC
12-bit monotonic
µV/°
C
±10
±2.5 %FS
R
±2.5
ppm
of
FSR/
°C
10
165
2.2 V/3 V
66
ms
16.5
Parameters calculated from the best-fit curve from 0x0F to 0xFFF. The best-fit curve method is used to deliver coefficients “a” and “b” of
the first-order equation: y = a + bx. VDAC12_xOUT = EO + (1 + EG) × (VeREF+/4095) × DAC12_xDAT, DAC12IR = 1.
The offset calibration works on the output operational amplifier. Offset Calibration is triggered setting bit DAC12CALON
The offset calibration can be done if DAC12AMPx = {2, 3, 4, 5, 6, 7}. The output operational amplifier is switched off with DAC12AMPx =
{0, 1}. It is recommended that the DAC12 module be configured prior to initiating calibration. Port activity during calibration may effect
accuracy and is not recommended.
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SLAS566A – JUNE 2010 – REVISED JULY 2010
DAC VOUT
DAC Output
VR+
RLoad = ¥
Ideal transfer
function
AVCC
2
Offset Error
CLoad = 100 pF
Gain Error
Positive
Negative
DAC Code
Figure 9. Linearity Test Load Conditions and Gain/Offset Definition
12-Bit DAC, Output Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS
VCC
No load, VeREF+ = AVCC, DAC12_xDAT = 0h,
DAC12IR = 1, DAC12AMPx = 7
No load, VeREF+ = AVCC, DAC12_xDAT = 0FFFh,
DAC12IR = 1, DAC12AMPx = 7
Output voltage
range (1) (see
Figure 10)
VO
RLoad = 3 kΩ, VeREF+ = AVCC, DAC12_xDAT =
0h, DAC12IR = 1, DAC12AMPx = 7
2.2 V/3 V
RLoad = 3 kΩ, VeREF+ = AVCC, DAC12_xDAT =
0FFFh, DAC12IR = 1, DAC12AMPx = 7
CL(DAC12)
Maximum DAC12 load
capacitance
2.2 V/3 V
IL(DAC12)
DAC12AMPx = 2, DAC12xDAT = 0FFFh,
Maximum DAC12 load VO/P(DAC12) > AVCC – 0.3
current
DAC12AMPx = 2, DAC12xDAT = 0h,
VO/P(DAC12) < 0.3 V
2.2 V/3 V
Output resistance
(see Figure 10)
TYP
MAX
0
0.005
AVCC
– 0.05
AVCC
0
0.1
AVCC
– 0.13
AVCC
V
100
pF
mA
1
RLoad = 3 kΩ, VO/P(DAC12) > AVCC – 0.3 V,
DAC12_xDAT = 0FFFh
2.2 V/3 V
150
250
150
250
RLoad = 3 kΩ,
0.3 V ≤ VO/P(DAC12) ≤ AVCC – 0.3 V
(1)
UNIT
–1
RLoad = 3 kΩ, VO/P(DAC12) < 0.3 V,
DAC12AMPx = 2, DAC12_xDAT = 0h
RO/P(DAC12)
MIN
PRODUCT PREVIEW
PARAMETER
Ω
6
Data is valid after the offset calibration of the output amplifier.
RO/P(DAC12_x)
Max
RLoad
ILoad
AVCC
DAC12
2
O/P(DAC12_x)
CLoad = 100 pF
Min
AVCC – 0.3 V
0.3
VOUT
AVCC
Figure 10. DAC12_x Output Resistance Tests
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12-bit DAC, Reference Input Specifications
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
DAC12IR = 0 (1)
VeREF+
VCC
MIN
(2)
Reference input voltage range
2.2 V/3 V
DAC12IR = 1 (3)
TYP
MAX
AVCC/
3
AVCC
+ 0.2
AVCC
AVCC
+ 0.2
(4)
DAC12_0 IR = DAC12_1 IR = 0
20
(1)
(2)
(3)
(4)
(5)
(6)
Reference input resistance (5)
V
MΩ
DAC12_0 IR = 1, DAC12_1 IR = 0
Ri(VREF+),
Ri(VeREF+)
UNIT
48
DAC12_0 IR = 0, DAC12_1 IR = 1
48
2.2 V/3 V
kΩ
DAC12_0 IR = DAC12_1 IR = 1,
DAC12_0 SREFx = DAC12_1
SREFx (6)
24
For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).
The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / [3 × (1 + EG)].
For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).
The maximum voltage applied at reference input voltage terminal VeREF+ = [AVCC – VE(O)] / (1 + EG).
This impedance depends on tradeoff in power savings. Current devices have 48 kΩ for each channel when divide is enabled. Can be
increased if performance can be maintained.
When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel
reducing the reference input resistance.
PRODUCT PREVIEW
12-bit DAC, Dynamic Specifications
VREF = VCC, DAC12IR = 1 (see Figure 11 and Figure 12)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tON
TEST CONDITIONS
MIN
DAC12AMPx = 0 → {2, 3,
4}
DAC12_xDAT = 800h,
ErrorV(O) < ±0.5 LSB (1)
(see Figure 11)
DAC12 on time
VCC
DAC12AMPx = 0 → {5, 6}
2.2 V/3 V
DAC12AMPx = 0 → 7
DAC12AMPx = 2
tS(FS)
DAC12_xDAT =
80h → F7Fh → 80h
Settling time, full scale
DAC12AMPx = 3, 5
2.2 V/3 V
DAC12AMPx = 4, 6, 7
tS(C-C)
DAC12AMPx = 2
DAC12_xDAT =
Settling time, code to code 3F8h → 408h → 3F8h,
BF8h → C08h → BF8h
2.2 V/3 V
DAC12AMPx = 3, 5
DAC12_xDAT =
800h → 7FFh → 800h
(1)
(2)
15
30
6
12
100
200
40
80
15
30
µs
µs
µs
1
2.2 V/3 V
DAC12AMPx = 4, 6, 7
Glitch energy
120
2
DAC12AMPx = 4, 6, 7
DAC12_xDAT =
80h → F7Fh → 80h (2)
Slew rate
60
5
DAC12AMPx = 3, 5
DAC12AMPx = 2
SR
TYP MAX UNIT
DAC12AMPx = 7
0.05
0.35
0.35
1.10
1.50
5.20
2.2 V/3 V
35
V/µs
nV-s
RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 11.
Slew rate applies to output voltage steps ≥ 200 mV.
Conversion 1
VOUT
DAC Output
ILoad
RLoad = 3 kW
Conversion 2
Conversion 3
±1/2 LSB
Glitch
Energy
AVCC
2
RO/P(DAC12.x)
±1/2 LSB
CLoad = 100 pF
tsettleLH
tsettleHL
Figure 11. Settling Time and Glitch Energy Testing
68
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Conversion 1
Conversion 2
Conversion 3
VOUT
90%
90%
10%
10%
tSRHL
tSRLH
Figure 12. Slew Rate Testing
12-bit DAC, Dynamic Specifications (Continued)
(TA = 25°C unless otherwise noted)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS
VCC
MIN
DAC12AMPx = {2, 3, 4},
DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
BW–3dB
3-dB bandwidth,
VDC = 1.5 V,
VAC = 0.1 VPP (see Figure 13)
DAC12AMPx = {5, 6}, DAC12SREFx
= 2,
DAC12IR = 1, DAC12_xDAT = 800h
Channel-to-channel crosstalk (1)
(see Figure 14)
(1)
DAC12_0DAT = 80h ↔ F7Fh, RLoad =
3 kΩ,
DAC12_1DAT = 800h, No load,
fDAC12_0OUT = 10 kHz at 50/50 duty
cycle
MAX
UNIT
40
2.2 V/3 V
DAC12AMPx = 7, DAC12SREFx = 2,
DAC12IR = 1, DAC12_xDAT = 800h
DAC12_0DAT = 800h, No load,
DAC12_1DAT = 80h ↔ F7Fh, RLoad =
3 kΩ,
fDAC12_0OUT = 10 kHz at 50/50 duty
cycle
TYP
kHz
180
550
–80
2.2 V/3 V
dB
–80
RLoad = 3 kΩ, CLoad = 100 pF
RLoad = 3 kW
ILoad
VeREF+
AVCC
DAC12_x
AC
DACx
2
CLoad = 100 pF
DC
Figure 13. Test Conditions for 3-dB Bandwidth Specification
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PRODUCT PREVIEW
PARAMETER
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
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RLoad
ILoad
AVCC
DAC12_0
DAC12_xDAT 080h
2
DAC0
080h
7F7h
7F7h
080h
VOUT
CLoad = 100 pF
VREF+
VDAC12_yOUT
RLoad
ILoad
AVCC
DAC12_1
VDAC12_xOUT
2
DAC1
fToggle
CLoad = 100 pF
Figure 14. Crosstalk Test Conditions
Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
Supply voltage
MIN
TYP
1.8
3.6
1.8 V
PRODUCT PREVIEW
IAVCC_COMP
Comparator operating supply
current into AVCC terminal.
Excludes reference resistor
ladder.
MAX
UNIT
V
40
CBPWRMD = 00
2.2 V
30
50
3V
40
65
CBPWRMD = 01
2.2 V / 3 V
10
30
CBPWRMD = 10
2.2 V / 3 V
0.1
0.5
µA
IAVCC_REF
Quiescent current of local
reference voltage amplifier into
AVCC terminal.
VIC
Common mode input range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
Series input resistance
GV
Open loop voltage gain
CBPWRMD = 00, CBF = 0
450
tPD
Propagation delay, response time CBPWRMD = 01, CBF = 0
600
ns
CBPWRMD = 10, CBF = 0
50
µs
Propagation delay with filter
active
tPD,filter
CBREFACC = 1, CBREFLx = 01
0
22
µA
VCC- 1
V
CBPWRMD = 00
±20
CBPWRMD = 01, 10
±10
5
ON - switch closed
OFF - switch opened
3
mV
pF
4
kΩ
50
MΩ
80
dB
ns
CBPWRMD = 00, CBON = 1, CBF =
1, CBFDLY = 00
0.35
0.6
1.0
µs
CBPWRMD = 00, CBON = 1, CBF =
1, CBFDLY = 01
0.6
1.0
1.8
µs
CBPWRMD = 00, CBON = 1, CBF =
1, CBFDLY = 10
1.0
1.8
3.4
µs
CBPWRMD = 00, CBON = 1, CBF =
1, CBFDLY = 11
1.8
3.4
6.5
µs
tEN_CMP
Comparator enable time, settling
time
CBON = 0 to CBON = 1
CBPWRMD = 00, 01, 10
1
2
µs
tEN_REF
Resistor reference enable time
CBON = 0 to CBON = 1
0.3
1.5
µs
TCREF
Temperature coefficient
reference (1)
50
ppm/°
C
VCB_REF
Reference voltage for a given tap
(1)
70
VIN = reference into resistor ladder.
n = 0 to 31
VIN*(n
+1)/32
V
Internal Data. The TC of the reference voltage buffer comes on top of reference's TC. The total TC should be below the limit specified.
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Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VUSB = 3.3 V ± 10%, IOH = -25 mA
VOL
Low-level output voltage
VUSB = 3.3 V ± 10%, IOL = 25 mA
VIH
High-level input voltage
VUSB = 3.3 V ± 10%
VIL
Low-level input voltage
VUSB = 3.3 V ± 10%
VCC
MIN
TYP
MAX
2.4
UNIT
V
0.4
2.0
V
V
0.8
V
MAX
UNIT
USB-Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST CONDITIONS
D+, D- single ended
USB 2.0 load conditions
VOL
D+, D- single ended
USB 2.0 load conditions
Z(DRV)
D+, D- impedance
Including external series resistor of 27 Ω
tRISE
Rise time
tFALL
Fall time
VCC
MIN
TYP
2.8
3.6
V
0
0.3
V
28
44
Ω
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
USB-Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
2.5
UNIT
V(CM)
Differential input common mode range
0.8
Z(IN)
Input impedance
300
V
VCRS
Crossover voltage
1.3
VIL
Static SE input logic low level
0.8
VIH
Static SE input logic high level
2.0
V
VDI
Differential input voltage
0.2
V
kΩ
2.0
V
V
USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VLAUNCH
VBUS detection threshold
VBUS
USB bus voltage
VUSB
USB LDO output voltage
3.3
V18
Internal USB voltage (1)
1.8
IUSB_EXT
Maximum external current from VUSB
terminal (2)
IDET
USB LDO current overload detection
Normal operation
3.76
USB LDO is on
(3)
60
USB LDO is on,
USB PLL disabled
MAX
UNIT
3.75
V
5.5
V
±9%
V
V
12
mA
100
mA
250
µA
ISUSPEND
Operating supply current into VBUS terminal. (4)
CBUS
VBUS terminal recommended capacitance
4.7
µF
CUSB
VUSB terminal recommended capacitance
220
nF
C18
V18 terminal recommended capacitance
220
nF
tENABLE
Settling time VUSB and V18
RPUR
Pullup resistance of PUR terminal
(1)
(2)
(3)
(4)
Within 2%,
recommended capacitances
70
110
2
ms
150
Ω
This voltage is for internal usages only. No external DC loading should be applied.
This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
A current overload will be detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
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PRODUCT PREVIEW
PARAMETER
VOH
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
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USB-PLL (USB Phase Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IPLL
Operating supply current
fPLL
PLL frequency
fUPD
PLL reference frequency
tLOCK
PLL lock time
tJitter
PLL jitter
VCC
MIN
TYP
MAX
7
48
1.5
UNIT
mA
MHz
3
MHz
2
ms
1000
ps
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
DVCC(PGM/ERASE) Program and erase supply voltage
IPGM
Average supply current from DVCC during program
IERASE
Average supply current from DVCC during erase
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank erase
tCPT
Cumulative program time
MIN
TYP
1.8
3.6
3
See
MAX
(1)
PRODUCT PREVIEW
104
V
5
mA
2
mA
2
mA
16
Program/erase endurance
UNIT
105
ms
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
See
(2)
64
85
µs
tBlock,
0
Block program time for first byte or word
See
(2)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(2)
37
49
µs
Block program time for last byte or word
See
(2)
55
73
µs
tSeg Erase
Erase time for segment, mass erase, and bank erase when
available
See
(2)
23
32
ms
fMCLK,MGR
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4.MGR1 = 1)
0
1
MHz
tBlock,
(1)
(2)
N
100
years
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V/3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V/3 V
0.025
15
µs
tSBW,
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V/3 V
1
µs
100
µs
En
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency - 4-wire JTAG (2)
Rinternal
Internal pull-down resistance on TEST
(1)
(2)
72
15
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V/3 V
45
80
kΩ
60
Tools accessing the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
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MSP430F663x
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SLAS566A – JUNE 2010 – REVISED JULY 2010
INPUT/OUTPUT SCHEMATICS
Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
S32...S39
LCDS32...LCDS39
P1REN.x
0
0
Module X OUT
1
DVCC
1
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
Bus
Keeper
EN
Module X IN
1
Direction
0: Input
1: Output
1
P1OUT.x
0
P1.0/TA0CLK/ACLK/S39
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Copyright © 2010, Texas Instruments Incorporated
Set
Interrupt
Edge
Select
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PRODUCT PREVIEW
P1DIR.x
DVSS
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Table 50. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
x
P1.0/TA0CLK/ACLK/
S39
0
P1.1/TA0.0/S38
1
FUNCTION
P1.0 (I/O)
2
3
0
0
0
1
0
ACLK
1
1
0
S39
X
X
1
P1.1 (I/O)
I: 0; O: 1
0
0
Timer TA0.CCI0A capture input
0
1
0
Timer TA0.0 output
1
1
0
P1.2 (I/O)
PRODUCT PREVIEW
P1.5/TA0.4/S34
P1.6/TA0.1/S33
4
5
6
7
1
0
0
0
1
0
1
1
0
X
X
1
I: 0; O: 1
0
0
0
1
0
P1.3 (I/O)
Timer TA0.2 output
1
1
0
S36
X
X
1
I: 0; O: 1
0
0
Timer TA0.CCI3A capture input
0
1
0
Timer TA0.3 output
1
1
0
S35
X
X
1
P1.4 (I/O)
P1.5 (I/O)
I: 0; O: 1
0
0
Timer TA0.CCI4A capture input
0
1
0
Timer TA0.4 output
1
1
0
S34
X
X
1
P1.6 (I/O)
I: 0; O: 1
0
0
Timer TA0.CCI1B capture input
0
1
0
Timer TA0.1 output
1
1
0
P1.7 (I/O)
Timer TA0.CCI2B capture input
74
X
S37
S33
P1.7/TA0.2/S32
X
I: 0; O: 1
Timer TA0.1 output
Timer TA0.CCI2A capture input
P1.4/TA0.3/S35
LCDS32...39
I: 0; O: 1
Timer TA0.CCI1A capture input
P1.3/TA0.2/S36
P1SEL.x
Timer TA0.TA0CLK
S38
P1.2/TA0.1/S37
CONTROL BITS/SIGNALS
P1DIR.x
X
X
1
I: 0; O: 1
0
0
0
1
0
Timer TA0.2 output
1
1
0
S32
X
X
1
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MSP430F663x
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
to LCD_B
from LCD_B
P2REN.x
0
From Port Mapping
1
P2OUT.x
0
From Port Mapping
1
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
From Port Mapping
P2.0/P2MAP0
P2.1/P2MAP1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4
P2.5/P2MAP5
P2.6/P2MAP6/R03
P2.7/P2MAP7/LCDREF/R13
EN
To Port Mapping
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
Copyright © 2010, Texas Instruments Incorporated
Set
Interrupt
Edge
Select
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PRODUCT PREVIEW
P2DIR.x
DVSS
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Table 51. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/P2MAP0
x
0
FUNCTION
P2.0 (I/O)
Mapped secondary digital function
P2.1/P2MAP1
1
P2.1 (I/O)
Mapped secondary digital function
P2.2/P2MAP2
2
P2.2 (I/O)
Mapped secondary digital function
P2.3/P2MAP3
3
P2.4/P2MAP4
4
P2.3 (I/O)
Mapped secondary digital function
P2.4 (I/O)
Mapped secondary digital function
P2.5/P2MAP5
5
P2.5 (I/O
Mapped secondary digital function
P2.6/P2MAP6/R03
6
P2.6 (I/O)
Mapped secondary digital function
R03
PRODUCT PREVIEW
P2.7/P2MAP7/
LCDREF/R13
(1)
76
7
CONTROL BITS/SIGNALS (1)
P2DIR.x
P2SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
P2MAPx
≤ 19
≤ 19
≤ 19
≤ 19
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
≤ 19
= 31
≤ 19
≤ 19
X
1
I: 0; O: 1
0
Mapped secondary digital function
X
1
≤ 19
LCDREF/R13
X
1
= 31
P2.7 (I/O)
X = Don't care
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
Pad Logic
S24...S31
LCDS24...LCDS31
P3REN.x
0
0
Module X OUT
1
DVCC
1
1
Direction
0: Input
1: Output
1
P3OUT.x
0
P3.0/TA1CLK/CBOUT/S31
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.4/TA2CLK/SMCLK/S27
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
Bus
Keeper
EN
Module X IN
D
P3IE.x
EN
P3IRQ.x
Q
P3IFG.x
Set
P3SEL.x
Interrupt
Edge
Select
P3IES.x
Table 52. Port P3 (P3.0 to P3.7) Pin Functions
PIN NAME (P3.x)
x
P3.0/TA1CLK/CBOUT/
S31
0
P3.1/TA1.0/S30
1
FUNCTION
P3SEL.x
LCDS24...31
I: 0; O: 1
0
0
Timer TA1.TA1CLK
0
1
0
CBOUT
1
1
0
S31
X
X
1
P3.0 (I/O)
P3.1 (I/O)
I: 0; O: 1
0
0
Timer TA1.CCI0A capture input
0
1
0
Timer TA1.0 output
1
1
0
S30
P3.2/TA1.1/S29
2
CONTROL BITS/SIGNALS
P3DIR.x
X
X
1
I: 0; O: 1
0
0
Timer TA1.CCI1A capture input
0
1
0
Timer TA1.1 output
1
1
0
S29
X
X
1
P3.2 (I/O)
Copyright © 2010, Texas Instruments Incorporated
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PRODUCT PREVIEW
P3DIR.x
DVSS
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Table 52. Port P3 (P3.0 to P3.7) Pin Functions (continued)
PIN NAME (P3.x)
P3.3/TA1.2/S28
x
3
FUNCTION
P3.3 (I/O)
P3.5/TA2.0/S26
4
0
0
0
1
0
Timer TA1.2 output
1
1
0
P3.4 (I/O)
PRODUCT PREVIEW
P3.7/TA2.2/S24
78
6
7
X
X
1
I: 0; O: 1
0
0
0
1
0
SMCLK
1
1
0
S27
X
X
1
I: 0; O: 1
0
0
0
1
0
P3.5 (I/O)
Timer TA2.CCI0A capture input
P3.6/TA2.1/S25
LCDS24...31
I: 0; O: 1
Timer TA2.TA2CLK
5
P3SEL.x
Timer TA1.CCI2A capture input
S28
P3.4/TA2CLK/SMCLK/
S27
CONTROL BITS/SIGNALS
P3DIR.x
Timer TA2.0 output
1
1
0
S26
X
X
1
I: 0; O: 1
0
0
Timer TA2.CCI1A capture input
0
1
0
Timer TA2.1 output
1
1
1
S25
X
X
1
P3.6 (I/O)
P3.7 (I/O)
I: 0; O: 1
0
0
Timer TA2.CCI2A capture input
0
1
0
Timer TA2.2 output
1
1
0
S24
X
X
1
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
S16...S23
LCDS16...LCDS23
P4REN.x
0
0
Module X OUT
1
DVCC
1
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
Bus
Keeper
EN
Module X IN
1
Direction
0: Input
1: Output
1
P4OUT.x
0
P4.0/TB0.0/S23
P4.1/TB0.1/S22
P4.2/TB0.2/S21
P4.3/TB0.3/S20
P4.4/TB0.4/S19
P4.5/TB0.5/S18
P4.6/TB0.6/S17
P4.7/TB0OUTH/SVMOUT/S16
D
P4IE.x
EN
P4IRQ.x
Q
P4IFG.x
P4SEL.x
P4IES.x
Copyright © 2010, Texas Instruments Incorporated
Set
Interrupt
Edge
Select
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PRODUCT PREVIEW
P4DIR.x
DVSS
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Table 53. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/TB0.0/S23
P4.1/TB0.1/S22
x
0
1
FUNCTION
P4.0 (I/O)
2
0
0
0
1
0
Timer TB0.0 output (1)
1
1
0
S23
X
X
1
P4.1 (I/O)
I: 0; O: 1
0
0
Timer TB0.CCI1A capture input
0
1
0
Timer TB0.1 output (1)
1
1
0
P4.2 (I/O)
Timer TB0.2 output
(1)
S21
3
P4.3 (I/O)
Timer TB0.CCI3A capture input
Timer TB0.3 output
(1)
PRODUCT PREVIEW
P4.5/TB0.5/S18
P4.6/TB0.6/S17
4
5
6
(1)
80
7
X
1
0
0
0
1
0
1
1
0
X
X
1
I: 0; O: 1
0
0
0
1
0
1
1
0
X
1
I: 0; O: 1
0
0
Timer TB0.CCI4A capture input
0
1
0
Timer TB0.4 output (1)
1
1
0
S19
X
X
1
P4.4 (I/O)
P4.5 (I/O)
I: 0; O: 1
0
0
Timer TB0.CCI5A capture input
0
1
0
Timer TB0.5 output (1)
1
1
0
S18
X
X
1
P4.6 (I/O)
I: 0; O: 1
0
0
Timer TB0.CCI6A capture input
0
1
0
Timer TB0.6 output (1)
1
1
0
S17
P4.7/TB0OUTH/
SVMOUT/S16
X
I: 0; O: 1
X
S20
P4.4/TB0.4/S19
LCDS16...23
I: 0; O: 1
Timer TB0.CCI2A capture input
P4.3/TB0.3/S20
P4SEL.x
Timer TB0.CCI0A capture input
S22
P4.2/TB0.2/S21
CONTROL BITS/SIGNALS
P4DIR.x
P4.7 (I/O)
Timer TB0.TB0OUTH
X
X
1
I: 0; O: 1
0
0
0
1
0
SVMOUT
1
1
0
S16
X
X
1
Setting TB0OUTH causes all Timer_B configured outputs to be set to high impedance.
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
To/From
Reference
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
P5OUT.x
0
Module X OUT
1
P5.0/VREF+/VeREF+
P5.1/VREF–/VeREF–
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
Module X IN
D
Table 54. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/VREF+/VeREF+
x
0
FUNCTION
P5DIR.x
P5SEL.x
REFOUT
I: 0; O: 1
0
X
X
1
0
X
1
1
P5.1 (I/O) (2)
I: 0; O: 1
0
X
VeREF– (5)
X
1
0
VREF– (6)
X
1
1
P5.0 (I/O) (2)
VeREF+
(3)
VREF+ (4)
P5.1/VREF–/VeREF–
(1)
(2)
(3)
(4)
(5)
(6)
1
CONTROL BITS/SIGNALS (1)
X = Don't care
Default condition
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
Setting the P5SEL.0 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF+ reference is available at the pin.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. An external voltage can be applied to VeREF- and used as the reference for the ADC12_A, Comparator_B, or
DAC12_A.
Setting the P5SEL.1 bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals. The ADC12_A, VREF– reference is available at the pin.
Copyright © 2010, Texas Instruments Incorporated
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PRODUCT PREVIEW
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SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Port P5, P5.2 to P5.7, Input/Output With Schmitt Trigger
Pad Logic
S40...S42
LCDS40...LCDS42
P5REN.x
P5DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P5OUT.x
DVSS
PRODUCT PREVIEW
P5.2/R23
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P5.6/ADC12CLK/DMAE0
P5.7/RTCCLK
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
Module X IN
D
Table 55. Port P5 (P5.2 to P5.7) Pin Functions
PIN NAME (P5.x)
P5.2/R23
x
2
FUNCTION
P5.2 (I/O)
R23
P5.3/COM1/S42
3
P5.3 (I/O)
COM1
S42
P5.4/COM2/S41
4
P5.4 (I/O)
COM2
S41
P5.5/COM3/S40
5
P5.5 (I/O)
COM3
S40
P5.6/ADC12CLK/DMAE0
P5.7/RTCCLK
(1)
82
6
7
CONTROL BITS/SIGNALS (1)
P5DIR.x
P5SEL.x
LCDS40...42
I: 0; O: 1
0
na
X
1
na
I: 0; O: 1
0
0
X
1
X
1
X
0
I: 0; O: 1
0
0
X
1
X
1
X
0
I: 0; O: 1
0
0
X
1
X
X
0
1
I: 0; O: 1
0
na
ADC12CLK
1
1
na
DMAE0
0
1
na
P5.7 (I/O)
I: 0; O: 1
0
na
RTCCLK
1
1
na
P5.6 (I/O)
X = Don't care
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
To ADC12
INCHx = y
0
Dvss
1
From DAC12_A
2
0 if DAC12AMPx=0
1 if DAC12AMPx=1
2 if DAC12AMPx>1
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
DVSS
0
DVCC
1
1
P6DIR.x
P6OUT.x
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
Bus
Keeper
Copyright © 2010, Texas Instruments Incorporated
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6/DAC0
P6.7/CB7/A7/DAC1
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PRODUCT PREVIEW
P6REN.x
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
Table 56. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/CB0/A0
x
0
FUNCTION
P6.0 (I/O)
CB0
A0 (2)
P6.1/CB1/A1
1
(3)
P6.1 (I/O)
CB1
A1 (2)
P6.2/CB2/A2
2
(3)
P6.2 (I/O)
CB2
A2 (2)
P6.3/CB3/A3
3
(3)
P6.3 (I/O)
CB3
A3 (2)
P6.4/CB4/A4
4
(3)
P6.4 (I/O)
CB4
A4
PRODUCT PREVIEW
P6.5/CB5/A5
5
(2) (3)
P6.5 (I/O)
CB5
A5
P6.6/CB6/A6/DAC0
6
(1) (2) (3)
P6.6 (I/O)
CB6
A6
(2) (3)
DAC0
P6.7/CB7/A7/DAC1
7
P6.7 (I/O)
CB7
A7
(2) (3)
DAC1
(1)
(2)
(3)
84
CONTROL BITS/SIGNALS (1)
P6DIR.x
P6SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
X
X
1
n/a
n/a
X
1
X
n/a
n/a
I: 0; O: 1
0
0
X
0
X
X
1
X
0
X
1
X
X
0
X
X
X
0
2
I: 0; O: 1
0
0
X
0
X
X
1
X
0
X
1
X
X
0
X
X
X
0
2
X = Don't care
Setting the P6SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected via the respective INCHx bits.
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Port P7, P7.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P7REN.2
P7DIR.2
DVSS
0
DVCC
1
1
0
1
P7DS.2
0: Low drive
1: High drive
P7SEL.2
PRODUCT PREVIEW
P7OUT.2
P7.2/XT2IN
P7IN.2
Bus
Keeper
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Port P7, P7.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P7REN.3
P7DIR.3
DVSS
0
DVCC
1
1
0
1
PRODUCT PREVIEW
P7OUT.3
P7.3/XT2OUT
P7DS.3
0: Low drive
1: High drive
P7SEL.3
P7IN.3
Bus
Keeper
Table 57. Port P7 (P7.2 and P7.3) Pin Functions
PIN NAME (P5.x)
P7.2/XT2IN
P7.3/XT2OUT
(1)
(2)
(3)
86
x
2
3
FUNCTION
P7.2 (I/O)
CONTROL BITS/SIGNALS (1)
P7DIR.x
P7SEL.2
P7SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
XT2IN crystal mode (2)
X
1
X
0
XT2IN bypass mode (2)
X
1
X
1
I: 0; O: 1
0
X
X
XT2OUT crystal mode (3)
X
1
X
0
P7.3 (I/O) (3)
X
1
X
1
P7.3 (I/O)
X = Don't care
Setting P7SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P7.2 is configured for crystal
mode or bypass mode.
Setting P7SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P7.3 can be used as
general-purpose I/O.
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Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
0
Dvss
1
From DAC12_A
2
Pad Logic
0 if DAC12AMPx=0
1 if DAC12AMPx=1
2 if DAC12AMPx>1
To ADC12
INCHx = y
To Comparator_B
From Comparator_B
CBPD.x
DAC12AMPx>0
DAC12OPS
DVSS
0
DVCC
1
1
P7DIR.x
P7OUT.x
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
P7.7/CB11/A15/DAC1
P7DS.x
0: Low drive
1: High drive
P7SEL.x
P7IN.x
Bus
Keeper
Table 58. Port P7 (P7.4 to P7.7) Pin Functions
PIN NAME (P7.x)
P7.4/CB8/A12
P7.5/CB9/A13
P7.6/CB10/A14/DAC0
x
4
5
6
FUNCTION
P7DIR.x
P7SEL.x
CBPD.x
DAC12OPS
DAC12AMPx
I: 0; O: 1
0
0
n/a
n/a
Comparator_B input CB8
X
X
1
n/a
n/a
A12 (2)
X
1
X
n/a
n/a
I: 0; O: 1
0
0
n/a
n/a
Comparator_B input CB9
X
X
1
n/a
n/a
A13 (2)
X
1
X
n/a
n/a
I: 0; O: 1
0
0
X
0
X
X
1
X
0
X
1
X
X
0
X
X
X
1
2
P7.4 (I/O)
(3)
P7.5 (I/O)
(3)
P7.6 (I/O)
Comparator_B input CB10
A14
(2) (3)
DAC12_A output DAC0
(1)
(2)
(3)
CONTROL BITS/SIGNALS (1)
X = Don't care
Setting the P7SEL.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying
analog signals.
The ADC12_A channel Ax is connected internally to AVSS if not selected via the respective INCHx bits.
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PRODUCT PREVIEW
P7REN.x
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Table 58. Port P7 (P7.4 to P7.7) Pin Functions (continued)
PIN NAME (P7.x)
x
P7.7/CB11/A15/DAC1
7
FUNCTION
P7.7 (I/O)
A15 (2)
CONTROL BITS/SIGNALS (1)
P7DIR.x
P7SEL.x
I: 0; O: 1
X
X
(3)
DAC12_A output DAC1
CBPD.x
DAC12OPS
DAC12AMPx
0
0
X
0
1
X
X
0
X
X
1
2
Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
Pad Logic
S8...S15
LCDS8...LCDS15
P8REN.x
PRODUCT PREVIEW
P8DIR.x
0
From module
1
P8OUT.x
0
Module X OUT
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P8.0/TB0CLK/S15
P8.1/UCB1STE/UCA1CLK/S14
P8.2/UCA1TXD/UCA1SIMO/S13
P8.3/UCA1RXD/UCA1SOMI/S12
P8.4/UCB1CLK/UCA1STE/S11
P8.5/UCB1SIMO//UCB1SDA/S10
P8.6/UCB1SOMI/UCB1SCL/S9
P8.7/S8
P8DS.x
0: Low drive
1: High drive
P8SEL.x
P8IN.x
Bus
Keeper
EN
Module X IN
D
Table 59. Port P8 (P8.0 to P8.7) Pin Functions
PIN NAME (P9.x)
P8.0/TB0CLK/S15
x
0
FUNCTION
P8.0 (I/O)
Timer TB0.TB0CLK clock input
S15
P8.1/UCB1STE/UCA1CLK/S14
1
P8.1 (I/O)
UCB1STE/UCA1CLK
S14
P8.2/UCA1TXD/UCA1SIMO/S13
2
P8.2 (I/O)
UCA1TXD/UCA1SIMO
S13
P8.3/UCA1RXD/UCA1SOMI/S12
88
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CONTROL BITS/SIGNALS
P8DIR.x
P8SEL.x
LCDS8...16
I: 0; O: 1
0
0
0
1
0
X
X
1
I: 0; O: 1
0
0
X
1
0
X
X
1
I: 0; O: 1
0
0
X
1
0
X
X
1
I: 0; O: 1
0
0
UCA1RXD/UCA1SOMI
X
1
0
S12
X
X
1
P8.3 (I/O)
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Table 59. Port P8 (P8.0 to P8.7) Pin Functions (continued)
PIN NAME (P9.x)
x
P8.4/UCB1CLK/UCA1STE/S11
4
P8.5/UCB1SIMO/UCB1SDA/S10
P8.4 (I/O)
5
P8.6/UCB1SOMI/UCB1SCL/S9
P8SEL.x
LCDS8...16
I: 0; O: 1
0
0
X
1
0
S11
X
X
1
I: 0; O: 1
0
0
UCB1SIMO/UCB1SDA
X
1
0
S10
X
X
1
P8.6 (I/O)
7
P8DIR.x
UCB1CLK/UCA1STE
P8.5 (I/O)
6
P8.7/S8
CONTROL BITS/SIGNALS
FUNCTION
I: 0; O: 1
0
0
UCB1SOMI/UCB1SCL
X
1
0
S9
X
X
1
I: 0; O: 1
0
0
X
X
1
P8.7 (I/O)
S8
Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
PRODUCT PREVIEW
Pad Logic
S0...S7
LCDS0...LCDS7
P9REN.x
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P9DIR.x
P9OUT.x
P9.0/S7
P9.1/S6
P9.2/S5
P9.3/S4
P9.4/S3
P9.5/S2
P9.6/S1
P9.7/S0
P9DS.x
0: Low drive
1: High drive
P9IN.x
Bus
Keeper
Table 60. Port P9 (P9.0 to P9.7) Pin Functions
PIN NAME (P9.x)
P9.0/S7
x
0
FUNCTION
P9.0 (I/O)
S7
(1)
CONTROL BITS/SIGNALS (1)
P9DIR.x
P9SEL.x
LCDS0...7
I: 0; O: 1
0
0
X
X
1
X = Don't care
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Table 60. Port P9 (P9.0 to P9.7) Pin Functions (continued)
PIN NAME (P9.x)
P9.1/S6
x
1
FUNCTION
P9.1 (I/O)
S6
P9.2/S5
2
P9.3/S4
3
P9.2 (I/O)
S5
P9.3 (I/O)
S4
P9.4/S3
4
P9.4 (I/O)
S3
P9.5/S2
5
P9.5 (I/O)
S2
P9.6/S1
6
P9.6 (I/O)
S1
P9.7/S0
7
P9.7 (I/O)
S0
CONTROL BITS/SIGNALS (1)
P9DIR.x
P9SEL.x
LCDS0...7
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
I: 0; O: 1
0
0
X
X
1
PRODUCT PREVIEW
90
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port PU.0/DP, PU.1/DM, PUR USB Ports
PUSEL
PUDIR
0
USB output enable
1
PUOUT0
VUSB
VSSU
Pad Logic
0
PU.0/
DP
1
USB DP output
PUIN0
USB DP input
.
PUIN1
USB DM input
0
USB DM output
1
PU.1/
DM
VUSB
PRODUCT PREVIEW
PUOUT0
VSSU
Pad Logic
PUREN
PUR
“1”
PUSEL
PURIN
Table 61. Port PU.0/DP, PU.1/DM Output Functions
CONTROL BITS
PIN NAME
FUNCTION
PUSEL
PUDIR
PUOUT1
PUOUT0
PU.1/DM
PU.0/DP
0
0
X
X
Hi-Z
Hi-Z
Outputs off
0
1
0
0
0
0
Outputs enabled
0
1
0
1
0
1
Outputs enabled
0
1
1
0
1
0
Outputs enabled
0
1
1
1
1
1
Outputs enabled
1
X
X
X
DM
DP
Direction set by
USB module
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Table 62. Port PUR Input Functions
CONTROL BITS
FUNCTION
PUSEL
PUREN
0
0
Input disabled
Pull up disabled
0
1
Input disabled
Pull up enabled
1
0
Input enabled
Pull up disabled
1
1
Input enabled
Pull up enabled
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PRODUCT PREVIEW
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.0
0: Low drive
1: High drive
From JTAG
1
PJ.0/TDO
PJIN.0
EN
D
92
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SLAS566A – JUNE 2010 – REVISED JULY 2010
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
1
PJDS.x
0: Low drive
1: High drive
From JTAG
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PRODUCT PREVIEW
PJIN.x
EN
To JTAG
D
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Table 63. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS/
SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
(2)
I: 0; O: 1
PJ.1 (I/O) (2)
I: 0; O: 1
PJ.0 (I/O)
TDO (3)
PJ.1/TDI/TCLK
1
X
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
(1)
(2)
(3)
(4)
X
I: 0; O: 1
(4)
PJ.3 (I/O)
TCK (3)
(4)
(2)
X
(2)
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
PRODUCT PREVIEW
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SLAS566A – JUNE 2010 – REVISED JULY 2010
DEVICE DESCRIPTORS
Table 64 list the complete contents of the device descriptor tag-length-value (TLV) structure for each device type.
Info Block
Die Record
ADC12
Calibration
Peripheral
Descriptor
Description
Address
Size
bytes
'F6638
'F6637
'F6636
'F6635
'F6634
'F6633
'F6632
'F6631
'F6630
Value
Value
Value
Value
Value
Value
Value
Value
Value
Info length
01A00h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
1
1Ch
1Ah
18h
16h
4Eh
4Ch
4Ah
48h
46h
Device ID
01A05h
1
80h
80h
80h
80h
80h
80h
80h
80h
80h
Hardware revision
01A06h
1
10h
10h
10h
10h
10h
10h
10h
10h
10h
Firmware revision
01A07h
1
10h
10h
10h
10h
10h
10h
10h
10h
10h
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC12 Calibration Tag
01A14h
1
11h
11h
11h
11h
11h
11h
05h
05h
05h
ADC12 Calibration
length
01A15h
1
10h
10h
10h
10h
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
per unit
per unit
per unit
per unit
per unit
N/A
N/A
N/A
Peripheral Descriptor
Tag
01A26h
1
02h
02h
02h
02h
02h
02h
02h
02h
02h
Peripheral Descriptor
Length
01A27h
1
75h
76h
75h
73h
74h
73h
71h
72h
71h
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
Memory 4
2
12h
30h
12h
30h
12h
30h
12h
30h
12h
30h
12h
30h
12h
30h
12h
30h
12h
30h
Memory 5
2
38h
ACh
38h
ACh
38h
ACh
38h
ACh
38h
ACh
38h
ACh
38h
ACh
38h
ACh
38h
ACh
Memory 6
2/3
40h
98h
40h
97h
94h
40h
96h
40h
98h
40h
97h
94h
40h
96h
40h
98h
40h
97h
94h
40h
96h
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
00h
Peripheral count
1
27h
27h
27h
26h
26h
26h
25h
25h
25h
2
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
MSP430CPUXV2
(1)
NA = Not applicable
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Table 64. 'F663x Device Descriptor Table (1)
MSP430F663x
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Table 64. 'F663x Device Descriptor Table(1) (continued)
Description
PRODUCT PREVIEW
96
Address
Size
bytes
'F6638
'F6637
'F6636
'F6635
'F6634
'F6633
'F6632
'F6631
'F6630
Value
Value
Value
Value
Value
Value
Value
Value
Value
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
JTAG
2
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-L
2
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
00h
05h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
Reserved for future use
2
00h
FAh
00h
FAh
00h
FAh
00h
FAh
00h
FAh
00h
FAh
00h
FAh
00h
FAh
00h
FAh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
39h
02h
39h
02h
39h
02h
39h
02h
39h
02h
39h
02h
39h
02h
39h
02h
39h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
Reserved for future use
2
02h
43h
02h
43h
02h
43h
02h
43h
02h
43h
02h
43h
02h
43h
02h
43h
02h
43h
Shared REF
2
01h
A0h
01h
A0h
01h
A0h
01h
A0h
01h
A0h
01h
A0h
01h
A0h
01h
A0h
01h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
Port 7/8
2
02h
54h
02h
54h
02h
54h
02h
54h
02h
54h
02h
54h
02h
54h
02h
54h
02h
54h
Port 9
2
02h
55h
02h
55h
02h
55h
02h
55h
02h
55h
02h
55h
02h
55h
02h
55h
02h
55h
Port J
2
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
0Ah
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
Battery Backup Switch +
Backup Memory
2
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
08h
6Ah
RTC_B
2
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
02h
6Bh
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
MSP430F663x
www.ti.com
SLAS566A – JUNE 2010 – REVISED JULY 2010
Table 64. 'F663x Device Descriptor Table(1) (continued)
Interrupts
Address
Size
bytes
'F6638
'F6637
'F6636
'F6635
'F6634
'F6633
'F6632
'F6631
'F6630
Value
Value
Value
Value
Value
Value
Value
Value
Value
04h
4Ah
04h
4Ah
04h
4Ah
04h
4Ah
04h
4Ah
04h
4Ah
04h
4Ah
04h
4Ah
DMA with 6 channels
2
04h
4Ah
USCI_A/B
2
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
ADC12_A
2
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
10h
D1h
N/A
N/A
N/A
DAC12_A
2
08h
C0h
08h
C0h
08h
C0h
N/A
N/A
N/A
N/A
N/A
N/A
COMP_B
2
14h
A8h
14h
A8h
14h
A8h
1Ch
A8h
1Ch
A8h
1Ch
A8h
2Ch
A8h
2Ch
A8h
2Ch
A8h
USB
2
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
LCD_B
2
10h
B1h
10h
B1h
10h
B1h
10h
B1h
10h
B1h
10h
B1h
10h
B1h
10h
B1h
10h
B1h
COMP_B
1
A8h
A8h
A8h
A8h
A8h
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
64h
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
65h
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
40h
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
90h
90h
90h
90h
90h
USCI_B0
1
91h
91h
91h
91h
91h
91h
91h
91h
91h
ADC12_A
1
D0h
D0h
D0h
D0h
D0h
D0h
01h
01h
01h
TA0.CCIFG0
1
60h
60h
60h
60h
60h
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
61h
61h
61h
61h
61h
USB
1
98h
98h
98h
98h
98h
98h
98h
98h
98h
DMA
1
46h
46h
46h
46h
46h
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
62h
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
63h
63h
63h
63h
63h
Port P1
1
50h
50h
50h
50h
50h
50h
50h
50h
50h
USCI_A1
1
92h
92h
92h
92h
92h
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
93h
93h
93h
93h
93h
Port P2
1
51h
51h
51h
51h
51h
51h
51h
51h
51h
LCD_B
1
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
B0h
RTC_B
1
68h
68h
68h
68h
68h
68h
68h
68h
68h
DAC12_A
1
C0h
C0h
C0h
01h
01h
01h
01h
01h
01h
TA2.CCIFG0
1
66h
66h
66h
66h
66h
66h
66h
66h
66h
TA2.CCIFG1..2
1
67h
67h
67h
67h
67h
67h
67h
67h
67h
Port P3
1
52h
52h
52h
52h
52h
52h
52h
52h
52h
Port P4
1
53h
53h
53h
53h
53h
53h
53h
53h
53h
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
00h
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
PRODUCT PREVIEW
Description
97
MSP430F663x
SLAS566A – JUNE 2010 – REVISED JULY 2010
www.ti.com
REVISION HISTORY
REVISION
SLAS566
SLAS566A
COMMENTS
Product Preview release
Updated Product Preview including electrical specifications
PRODUCT PREVIEW
98
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
MSP430F6634IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F6634IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F6634IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F6636IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F6638IPZ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F6638IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F6638IZQWR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F6638IZQWT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQW
113
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
XMS430F6638IPZR
ACTIVE
LQFP
PZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2011
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Apr-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MSP430F6634IZQWR
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430F6636IZQWR
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
PZ
100
1000
330.0
24.4
17.4
17.4
2.0
20.0
24.0
Q2
ZQW
113
250
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q1
MSP430F6638IPZR
MSP430F6638IZQWT
LQFP
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Apr-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F6634IZQWR
BGA MICROSTAR
JUNIOR
ZQW
113
2500
333.2
345.9
28.6
MSP430F6636IZQWR
BGA MICROSTAR
JUNIOR
ZQW
113
2500
333.2
345.9
28.6
MSP430F6638IPZR
LQFP
PZ
100
1000
346.0
346.0
41.0
MSP430F6638IZQWT
BGA MICROSTAR
JUNIOR
ZQW
113
250
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
76
50
100
26
1
0,13 NOM
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,05 MIN
1,45
1,35
0,25
0°– 7°
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149 /B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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