Data Sheet September 20, 2004 JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Features The JBW050F Power Module use advanced, surface-mount technology and deliver high-quality, efficient, and compact dc-dc conversion. Applications ■ Distributed power architectures ■ Workstations ■ Computer equipment ■ Communications equipment ■ Small size: 61.0 mm x 57.9 mm x 12.7 mm (2.40 in. x 2.28 in. x 0.50 in.) ■ High power density ■ High efficiency: 81% typical ■ Low output noise ■ Constant frequency ■ Industry-standard pinout ■ Metal case ■ 2:1 input voltage range ■ Overtemperature protection ■ Overcurrent and overvoltage protection ■ Remote sense ■ Remote on/off ■ Adjustable output voltage: 60% to 110% of VO, nom ■ Case ground pin ■ ISO9001 Certified manufacturing facilities ■ Options ■ ■ Heat sinks available for extended operation ■ Choice of remote on/off logic configuration ■ Short Pins: 3.7 mm ± 0.25 mm (0.145 in ± 0.010 in) ■ Approved for basic insulation (-B suffix) UL* 60950 Recognized, CSA † C22.2 No. 60950-00 Certified, and EN 60950 (VDE0805):2001-12 Licensed CE mark meets 73/23/EEC and 93/68/EEC directives‡ * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Assn. ‡ This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) Description The JBW050F Power Module is a dc-dc converter that operates over an input voltage range of 36 Vdc to 75 Vdc and provides a precisely regulated 3.3 Vdc output. The output is fully isolated from the input, allowing a versatile polarity configuration and grounding connections. The module has a maximum power rating of 33 W at a typical full-load efficiency of 81%. The modules are DC board-mountable and encapsulated in metal cases. Threaded-through holes are provided to allow easy mounting or addition of a heat sink for high-temperature applications. The standard feature set includes remote sensing, output trim, and remote on/off for convenient flexibility in distributed power applications. JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min Max Unit Input Voltage: Continuous: Transient (100 ms) VI VI, trans — — 75 100 Vdc V I/O Isolation Voltage — — 1500 Vdc Operating Case Temperature (See Thermal Considerations section.) TC –40 100 °C Storage Temperature Tstg –55 125 °C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Operating Input Voltage Maximum Input Current (VI = 0 V to 75 V; IO = IO, max): JBW050F (See Figure 1.) Symbol Min Typ Max Unit VI 36 48 75 Vdc II, max — — 1.2 A Inrush Transient i2 t — — 1.0 A2s Input Reflected-ripple Current, Peak-to-peak (5 Hz to 20 MHz, 12 µH source impedance; see Figure 8.) II — 5 — mAp-p Input Ripple Rejection (120 Hz) — — 60 — dB Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information. 2 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Electrical Specifications (continued) Table 2. Output Specifications Parameter Symbol Min Typ Max Unit VO, set 3.25 3.3 3.35 Vdc VO 3.20 — 3.40 Vdc Output Regulation: Line (VI = 36 V to 75 V) Load (IO = IO, min to IO, max) Temperature (TC = –40 °C to +100 °C) — — — — — — 0.01 0.05 15 0.1 0.2 50 %VO %VO mV Output Ripple and Noise Voltage (See Figure 9.): RMS Peak-to-peak (5 Hz to 20 MHz) — — — — — — 40 150 mVrms mVp-p External Load Capacitance — 0 — * µF Output Current (At IO < IO, min, the modules may exceed output ripple specifications.) IO 0.5 — 10 A IO, cli — 11.4 14† A Output Voltage Set Point (VI = 48 V; IO = IO, max; TC = 25 °C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life. See Figure 10.) Output Current-limit Inception (VO = 90% of VO, nom) Output Short-circuit Current (VO = 250 mV) — — 140 — %IO, max Efficiency (VI = 48 V; IO = IO, max; TC = 70 °C) η — 81 — % Switching Frequency — — 330 — kHz — — — — 3.8 400 — — %VO, set µs — — — — 3.8 400 — — %VO, set µs Dynamic Response (∆IO/∆t = 1 A/10 µs, VI = 48 V, TC = 25 °C; tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor across the load): (see Figure 5 and Figure 6) Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) * Consult your sales representative or the factory. † These are manufacturing test limits. In some situations, results may differ. Tyco Electronics Power Systems 3 JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Electrical Specifications (continued) Table 3. Isolation Specifications Min Typ Max Unit Isolation Capacitance Parameter — 2500 — pF Isolation Resistance 10 — — MΩ Min Typ Max Unit General Specifications Parameter Calculated MTBF (IO = 80% of IO, max; TC = 40 °C) Weight 3,210,000 — — hr. 100 (3.5) g (oz.) Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Remote On/Off Signal Interface (VI = 0 V to 75 V; open collector or equivalent compatible; signal referenced to VI(–) terminal; see Figure 11 and Feature Descriptions.): Preferred Logic: Logic Low—Module On Logic High—Module Off Optional Logic: Logic Low—Module Off Logic High—Module On Logic Low: At Ion/off = 1.0 mA At Von/off = 0.0 V Logic High: At Ion/off = 0.0 µA Leakage Current Turn-on Time (See Figure 7.) (IO = 80% of IO, max; VO within ±1% of steady state) Output Voltage Adjustment (See Feature Descriptions.): Output Voltage Remote-sense Range Output Voltage Set-point Adjustment Range (trim) Output Overvoltage Protection Overtemperature Protection (shutdown) Symbol Min Typ Max Unit Von/off Ion/off 0 — — — 1.2 1.0 V mA Von/off Ion/off — — — — — — 20 15 50 35 V µA ms — — — 60 — — 0.5 110 V %VO, nom VO, clamp 3.8* — 5.3* V TC — 105 — °C * These are manufacturing test limits. In some situations, results may differ. 4 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Characteristic Curves 1.4 84 1.2 82 1 80 EFFICIENCY, η (%) INPUT CURRENT, II (A) The following figures provide typical characteristics for the power modules. The figures are identical for both on/off configurations. 0.8 0.6 0.4 0.2 78 76 VI = 36 V VI = 48 V VI = 75 V 74 72 0 30 35 40 45 50 55 60 INPUT VOLTAGE, VI (V) 65 70 75 70 0 1 2 3 4 5 6 7 OUTPUT CURRENT, IO (A) 1-0698 Figure 1. Typical Input Characteristics at Room Temperature 8 9 10 1-0700 Figure 3. Typical Converter Efficiency vs. Output Current at Room Temperature 3 2.5 36 V 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (20 mV/div) OUTPUT VOLTAGE, VO (V) 3.5 48 V 75 V 1-0699 Figure 2. Typical Output Characteristics at Room Temperature TIME, t (1 µs/div) 1-0701 Figure 4. Typical Output Ripple Voltage at Room Temperature, IO = Full Load Tyco Electronics Power Systems 5 JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 REMOTE ON/OFF VON/OFF (V) OUTPUT VOLTAGE VO (V) (1 V/div) OUTPUT VOLTAGE, VO (V) OUTPUT CURRENT, IO (A) (50 mV/div) (2 A/div) Characteristic Curves (continuted) TIME, t (5 ms/div) 1-0704 Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor across the load. TIME, t (100 µs/div) 1-0702 Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor across the load. Figure 5. Typical Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) Figure 7. Typical Start-Up from Remote On/Off; IO = IO, max Test Configurations TO OSCILLOSCOPE OUTPUT VOLTAGE, VO (V) OUTPUT CURRENT, IO (A) (50 mV/div) (2 A/div) LTEST CURRENT PROBE VI(+) 12 µH BATTERY CS 220 µF ESR < 0.1 Ω @ 20 °C, 100 kHz 33 µF ESR < 0.7 Ω @ 100 kHz VI(–) 8-203.l Note: Measure input reflected-ripple current with a simulated source inductance (LTEST) of 12 µH. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 8. Input Reflected-Ripple Test Setup TIME, t (100 µs/div) 1-0703 Note: Tested with a 10 µF aluminum and a 1.0 µF ceramic capacitor across the load. Figure 6. Typical Transient Response to Step Increase in Load from 50% to 75% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) 6 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Test Configurations (continuted) Design Considerations Input Source Impedance COPPER STRIP VO(+) 1.0 µF 10 µF SCOPE RESISTIVE LOAD VO(–) 8-513.d Note: Use a 1.0 µF ceramic capacitor and a 10 µF aluminum or tantalum capacitor. Scope measurement should be made using a BNC socket. Position the load between 51 mm and 76 mm (2 in. and 3 in.) from the module. VI(+) CONTACT AND DISTRIBUTION LOSSES VO(+) II IO LOAD SUPPLY VI(–) Safety Considerations For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL60950, CSA C22.2 No. 60950-00, and EN 60950 (VDE0805):2001-12. Figure 9. Peak-to-Peak Output Noise Measurement Test Setup SENSE(+) The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. For the test configuration in Figure 8, a 33 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the power module helps ensure stability of the unit. For other highly inductive source impedances, consult the factory for further application guidelines. If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module’s output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true: VO(–) CONTACT RESISTANCE ■ The input source is to be provided with reinforced insulation from any hazardous voltages, including the ac mains. ■ One VI pin and one VO pin are to be grounded or both the input and output pins are to be kept floating. ■ The input pins of the module are not operator accessible. ■ Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module’s output. SENSE(–) 8-749 Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. [ V O (+) – V O (–) ]I O η = ------------------------------------------------ x 100 [ V I (+) – V I (–) ]I I % Figure 10. Output Voltage and Efficiency Measurement Test Setup Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pin and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 10 A fast-acting fuse in the ungrounded lead. Tyco Electronics Power Systems 7 JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Feature Descriptions Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output current decrease or increase). The unit operates normally once the output current is brought back into its specified range. Remote On/Off Ion/off + ON/OFF Von/off – SENSE(+) VO(+) LOAD VI(+) VI(–) VO(–) SENSE(–) 8-720c Figure 11. Remote On/Off Implementation Remote Sense Two remote on/off options are available. Positive logic remote on/off turns the module on during a logic-high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote on/off turns the module off during a logic high and on during a logic low. Negative logic (code suffix “1”) is the factory-preferred configuration. Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table, i.e.: To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(–) terminal (Von/off). The switch can be an open collector or equivalent (see Figure 11). A logic low is Von/off = 0 V to 1.2 V. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. The voltage between the VO(+) and VO(–) terminals must not exceed the minimum value of the output overvoltage protection. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). See Figure 12. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 µA. If not using the remote on/off feature, do one of the following: ■ For negative logic, short ON/OFF pin to VI(–). ■ For positive logic, leave ON/OFF pin open. [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V If not using the remote-sense feature to regulate the output at the point of load, then connect SENSE(+) to VO(+) and SENSE(–) to VO(–) at the module. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. 8 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Feature Descriptions (continued) The test results for this configuration are displayed in Figure 16. Remote Sense (continued) SENSE(+) SENSE(–) SUPPLY VI(+) VO(+) VI(–) VO(–) IO II CONTACT RESISTANCE LOAD CONTACT AND DISTRIBUTION LOSSES 8-651m Figure 12. Effective Circuit Configuration for Single-Module Remote-Sense Operation Output Voltage Set-Point Adjustment (Trim) Output voltage trim allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the SENSE(+) or SENSE(–) pins. The trim resistor should be positioned close to the module. If not using the trim feature, leave the TRIM pin open. With an external resistor between the TRIM and SENSE(–) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 13). The following equation determines the required external-resistor value to obtain a percentage output voltage change of ∆%. 100 R adj-down = ---------- – 2 kΩ ∆% The test results for this configuration are displayed in Figure 14. This figure applies to all output voltages. With an external resistor connected between the TRIM and SENSE(+) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 15). The following equation determines the required external-resistor value to obtain a percentage output voltage change of ∆%. O ( 100 + ∆% ) ( 100 + 2∆% ) ------------------------------------- – ---------------------------------- kΩ R adj-up = V 1.225∆% ∆% Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W The voltage between the VO(+) and VO(–) terminals must not exceed the minimum value of the output overvoltage protection. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim). See Figure 12. Data Sheet September 20, 2004 Feature Descriptions (continued) Output Voltage Set-Point Adjustment (Trim) (continued) Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. VI(+) ON/OFF Radj-up ON/OFF CASE VO(+) SENSE(+) TRIM RLOAD Radj-down VI(–) SENSE(–) TRIM RLOAD SENSE(–) VO(–) 8-715b Figure 15. Circuit Configuration to Increase Output Voltage 10M ADJUSTMENT RESISTOR VALUE ( ) VI(+) SENSE(+) CASE VI(–) The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. VO(+) 1M 100k 10k 0 VO(–) 2 4 6 8 10 % C H A N G E IN O U T P U T V O LT A G E ( % ) 8-2090 8-748b Figure 13. Circuit Configuration to Decrease Output Voltage Figure 16. Resistor Selection for Increased Output Voltage ADJUSTMENT RESISTOR VALUE (Ω) Output Overvoltage Protection 1M The output overvoltage clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. The control loop of the clamp has a higher voltage set point than the primary loop (see Feature Specifications table). This provides a redundant voltage control that reduces the risk of output overvoltage. 100k 10k 1k Overtemperature Protection 100 0 10 20 30 40 % CHANGE IN OUTPUT VOLTAGE (∆%) 8-879 Figure 14. Resistor Selection for Decreased Output Voltage 10 The module features an overtemperature protection circuit to safeguard against thermal damage. The circuit shuts down the module when the maximum case temperature is exceeded. The module restarts automatically after cooling. Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Thermal Considerations Thermal Considerations (continued) Introduction Heat Transfer Without Heat Sinks The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature (TC) occurs at the position indicated in Figure 17. 38.0 (1.50) VI(+) 38.0 (1.50) ON/OFF VO(+) + SEN TRIM CASE VI(–) MEASURE CASE TEMPERATURE HERE – SEN Increasing airflow over the module enhances the heat transfer via convection. Figure 19 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (TA) for natural convection through 3 m/s (600 ft./min.). Note that the natural convection condition was measured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.); however, systems in which these power modules may be used can typically generate natural convection airflow rates of 0.3 m/s (60 ft./min.) due to other heat dissipating components in the system. The use of Figure 19 is shown in the following example. Example What is the minimum airflow necessary for a JBW050F operating at VI = 54 V, an output current of 10 A, and a maximum ambient temperature of 70 °C? VO(–) Solution Note: Top view, pin locations are for reference only. Measurements shown in millimeters and (inches). Figure 17. Case Temperature Measurement Location The temperature at this location should not exceed 100 °C. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. Although the maximum case temperature of the power modules is 100 °C, you can limit this temperature to a lower value for extremely high reliability. Note that although the maximum case temperature allowed is lower than 100 °C under some conditions, this modules derating is equivalent to or better than the JW050F. At full load, the JW050F power module has a higher case temperature rise than the JBW050F. For additional information on these modules, refer to the Thermal Management JC-, JFC-, JW-, and JFWSeries 50 W to 150 W Board-Mounted Power Modules Technical Note (TN97-008EPS). Given: VI = 54 V IO = 10 A TA = 70 °C Determine PD (Use Figure 18): PD = 7.7 W Determine airflow (v) (Use Figure 19): v = 0.5 m/s (100 ft./min.) 10 POWER DISSIPATION, PD (W) 8-716.f 9 VI = 36 V VI = 48 V VI = 75 V 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 OUTPUT CURRENT, IO (A) 8 9 10 1-0706 Figure 18. Power Dissipation vs. Output Current Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Thermal Considerations (continued) Heat Transfer with Heat Sinks (continued) 10 8 6 4 2 0 8 MAX CASE TEMP 3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 0.25 m/s (50 ft./min.) NATURAL CONVECTION 0 20 40 60 80 100 LOCAL AMBIENT TEMPERATURE, TA (˚C) 120 1-0705 Figure 19. Forced Convection Power Derating with No Heat Sink; Either Orientation CASE-TO-AMBIENT THERMAL RESISTANCE, CA (°C/W) POWER DISSIPATION, PD (W) 12 7 NO HEAT SINK 1/4 in. HEAT SINK 1/2 in. HEAT SINK 1 in. HEAT SINK 1 1/2 in. HEAT SINK 6 5 4 3 2 1 0 0 0.25 (50) Heat Transfer with Heat Sinks 0.51 (100) 0.76 (150) 1.02 (200) 1.27 (250) 1.52 (300) 1.78 2.03 (350) (400) AIR VELOCITY, ms-1 (ft./min.) The power modules have through-threaded, M3 x 0.5 mounting holes, which enable heat sinks or cold plates to attach to the module. The mounting torque must not exceed 0.56 N-m (5 in.-lb.). For a screw attachment from the pin side, the recommended hole size on the customer’s PWB around the mounting holes is 0.130 ± 0.005 inches. If a larger hole is used, the mounting torque from the pin side must not exceed 0.25 N-m (2.2 in.-lb.). Thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. Total module thermal resistance (θca) is defined as the maximum case temperature rise (∆TC, max) divided by the module power dissipation (PD): ( TC – TA) C, max -------------------- = -----------------------θ ca = ∆T PD PD The location to measure case temperature (TC) is shown in Figure 17. Case-to-ambient thermal resistance vs. airflow is shown, for various heat sink configurations and heights, in Figure 20. These curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. 8-1052.a Figure 20. Case-to-Ambient Thermal Resistance Curves; Either Orientation These measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are generally lower than the resistance of the heat sink by itself. The module used to collect the data in Figure 20 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. The use of Figure 20 is shown in the following example. Example If an 85 °C case temperature is desired, what is the minimum airflow necessary? Assume the JBW050F module is operating at VI = 54 V and an output current of 10 A, maximum ambient air temperature of 70 °C, and the heat sink is 1/2 inch. Solution Given: VI = 54 V IO = 10 A TA = 70 °C TC = 85 °C Heat sink = 1/2 in. Determine PD by using Figure 18: PD = 7.7 W Then solve the following equation: TC – TA θca = -------------------PD 85 – 70 θca = -----------------7.7 θca = 1.95 °C/W 12 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Use Figure 20 to determine air velocity for the 1/2 inch heat sink. The minimum airflow necessary for the JBW050F module is 1.27 m/s (250 ft./min.). Custom Heat Sinks A more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. The total module resistance can be separated into a resistance from case-to-sink (θcs) and sink-toambient (θsa) shown below (Figure 21). PD TC TS θcs TA θsa 8-1304 Figure 21. Resistance from Case-to-Sink and Sink-to-Ambient For a managed interface using thermal grease or foils, a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The solution for heat sink resistance is: (TC – TA) θ sa = ------------------------- – θ cs PD This equation assumes that all dissipated power must be shed by the heat sink. Depending on the user-defined application environment, a more accurate model, including heat transfer from the sides and bottom of the module, can be used. This equation provides a conservative estimate for such instances. Solder, Cleaning, and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to the Board-Mounted Power Modules Soldering and Cleaning Application Note (AP01-056EPS). EMC Considerations For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS). Layout Considerations Copper paths must not be routed beneath the power module mounting inserts. For additional layout guidelines, refer to the FLTR100V10 data sheet (FDS01-043EPS). Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Outline Diagram Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.) Top View 57.9 (2.28) MAX 61.0 (2.40) MAX VI(+) VO(+) ON/ OFF + SEN TRIM CASE - SEN VO(-) VI(-) Note:Pinout marking for reference only Side View 12.7 (0.50) MAX 0.51 (0.020) 2.06 (0.081) DIA SOLDER-PLATED BRASS, 2 PLACES (-OUTPUT AND +OUTPUT) 1.02 (0.040) DIA SOLDER-PLATED BRASS, 7 PLACES 5.1 (0.20) MIN Bottom View STANDOFF, 4 PLACES 12.7 (0.50) 7.1 (0.28) MOUNTING INSERTS M3 x 0.5 THROUGH, 4 PLACES 5.1 (0.20) 7.1 (0.28) 10.16 (0.400) 50.8 (2.00) 25.40 (1.000) 35.56 (1.400) 4 5 3 6 7 2 1 4.8 (0.19) 8 48.26 (1.900) TERMINALS 10.16 (0.400) 17.78 (0.700) 25.40 (1.000) 35.56 (1.400) 9 48.3 (1.90) MOUNTING HOLES 1-0715 14 Tyco Electronics Power Systems JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). 57.9 (2.28) MAX 4.8 (0.19) 48.3 (1.90) VI (+) 35.56 (1.400) 50.8 (2.00) 48.26 (1.900) VO (+) ON/OFF 35.56 (1.400) +SEN 25.40 (1.000) TRIM 25.40 (1.000) 10.16 (0.400) CASE –SEN VI (–) Vo (–) 10.16 (0.400) 61.0 (2.40) MAX 17.78 (0.700) 5.1 (0.20) 12.7 (0.50) MOUNTING INSERTS MODULE OUTLINE 8-1945a Ordering Information Table 4. Device Codes Input Voltage Output Voltage Output Power Remote On/Off Logic Device Code Comcode 48 V 3.3 V 33 W Negative JBW050F1 TBD 48 V 3.3 V 33 W Positive JBW050F 108966052 Table 5. Device Options Option* Device Code Suffix** Short pins: 3.68 mm ± 0.25 mm (0.145 in. ± 0.010 in.) Approved for basic insulation 6 * Contact Tyco Electronics Sales Representatives for availability of these options, samples, minimum order quantity and lead times. ** When adding multiple options to the product code, add suffix numbers in the descending orders. Tyco Electronics Power Systems -B JBW050F Power Modules: dc-dc Converter; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W Data Sheet September 20, 2004 Ordering Information (continued) Table 6. Device Accessories Accessory Comcode 1/4 in. transverse kit (heat sink, thermal pad, and screws) 1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 1 in. transverse kit (heat sink, thermal pad, and screws) 1 in. longitudinal kit (heat sink, thermal pad, and screws) 1 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 407243989 407243997 407244706 407244714 407244722 407244730 407244748 407244755 Dimensions are in millimeters and (inches). 1/4 IN. 1/2 IN. 1 IN. 61 (2.4) 1 1/2 IN. 57.9 (2.28) D000-d.cvs D000c Figure 22. Longitudinal Heat Sink Figure 23. Transverse Heat Sink Europe, Middle-East and Africa Headquarters Tyco Electronics (UK) Ltd Tel: +44 1344 469 300, Fax: +44 1344 469 301 World Wide Headquarters Tyco Electronics Power Systems, Inc. 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900) www.power.tycoelectronics.com e-mail: [email protected] Caribbean-Latin America-Brazil Headquarters Tyco Electronics Power Systems Tel: +56 2 209 8211, Fax: +56 2 223 1477 India Headquarters Tyco Electronics Systems India Pte Ltd Tel: +91 80 841 1633 x3001 Asia-Pacific Headquarters Tyco Electronics Singapore Pte Ltd Tel: +65 6416 4283, Fax: 65 6416 4299 Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. © 2002 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved. Printed in U.S.A. September 20, 2004 FDS02-038EPS (Replaces ADS02-013EPS)