ON MC10H131FN Dual d type master−slave flip−flop Datasheet

MC10H131
Dual D Type Master−Slave
Flip−Flop
Description
The MC10H131 is a MECL 10H™ part which is a functional/pinout
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock speed and propagation delay and no increase in
power−supply current.
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MARKING DIAGRAMS*
Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation, 235 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
16
MC10H131L
AWLYYWW
Temperature Range)
• Voltage Compensated
• MECL 10K Compatible
• Pb−Free Packages are Available*
1
CDIP−16
L SUFFIX
CASE 620A
16
MC10H131P
AWLYYWWG
16
1
PDIP−16
P SUFFIX
CASE 648
1
10H131
ALYWG
SOEIAJ−16
CASE 966
1 20
10H131G
AWLYYWW
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
Publication Order Number:
MC10H131/D
MC10H131
S1 5
Table 1. RS TRUTH TABLE
2
Q1
D1 7
CE1 6
3
Q1
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
R1 4
CC 9
R2 13
CE2 11
D2 10
Q2
14
Q2
15
16
VCC2
Q1
2
15
Q2
Q1
3
14
Q2
R1
4
13
R2
S1
5
12
S2
CE1
6
11
CE2
D1
7
10
D2
VEE
8
9
CC
Qn+1
L
Qn
L
H
H
H
L
L
H
H
ND
Table 2. CLOCKED TRUTH TABLE
Figure 1. Logic Diagram
1
S
L
ND = Not Defined
S2 12
VCC1
R
C
D
Qn+1
L
X
Qn
H
L
L
H
H
H
C = CE + CC
A clock H is a clock transition from a low to a high state.
Pin assignment is for Dual−in−Line Package.
Figure 2. Pin Assignment
Table 3. MAXIMUM RATINGS
Symbol
Rating
Unit
VEE
Power Supply (VCC = 0)
Characteristic
−8.0 to 0
Vdc
VI
Input Voltage (VCC = 0)
0 to VEE
Vdc
Iout
Output Current
50
100
mA
TA
Operating Temperature Range
0 to +75
°C
Tstg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
− Continuous
− Surge
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC10H131
Table 4. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
Symbol
IE
IinH
Characteristic
25°
75°
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
−
62
−
56
−
62
mA
Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
−
−
−
−
530
660
485
790
−
−
−
−
310
390
285
465
−
−
−
−
310
390
285
465
0.5
−
0.5
−
0.3
−
mA
mA
IinL
Input Current Low
VOH
High Output Voltage
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
VOL
Low Output Voltage
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
VIH
High Input Voltage
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
VIL
Low Input Voltage
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50 W resistor to −2.0 V.
Table 5. AC CHARACTERISTICS
0°
Symbol
75°
Min
Max
Min
Max
Min
Max
Propagation Delay
Clock, CE
Set, Reset
0.8
0.6
1.6
1.6
0.8
0.7
1.7
1.7
0.8
0.7
1.8
1.8
tr
Rise Time
0.6
2.0
0.6
2.0
0.6
2.2
ns
tf
Fall Time
0.6
2.0
0.6
2.0
0.6
2.2
ns
tset
Set−up Time
0.7
−
0.7
−
0.7
−
ns
thold
Hold Time
0.8
−
0.8
−
0.8
−
ns
ftog
Toggle Frequency
250
−
250
−
250
−
MHz
tpd
Characteristic
25°
Unit
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
APPLICATION INFORMATION
The MC10H131 is a dual master−slave type D flip−flop.
Asynchronous Set (S) and Reset (R) override Clock (CC)
and Clock Enable (CE) inputs. Each flip−flop may be
clocked separately by holding the common clock in the new
low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flip−flop, the Clock Enable inputs must be in the low state.
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flip−flop change on the positive
transition of the clock. A change in the information present
at the data (D) input will not affect the output information at
any other time due to master slave construction.
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3
MC10H131
ORDERING INFORMATION
Package
Shipping †
MC10H131FN
PLLC−20
46 Units / Rail
MC10H131FNG
PLLC−20
(Pb−Free)
46 Units / Rail
MC10H131FNR2
PLLC−20
500 / Tape & Reel
MC10H131FNR2G
PLLC−20
(Pb−Free)
500 / Tape & Reel
MC10H131L
CDIP−16
25 Unit / Rail
MC10H131M
SOEIAJ−16
50 Unit / Rail
MC10H131MG
SOEIAJ−16
(Pb−Free)
50 Unit / Rail
MC10H131MEL
SOEIAJ−16
2000 / Tape & Reel
MC10H131MELG
SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
MC10H131P
PDIP−16
25 Unit / Rail
MC10H131PG
PDIP−16
(Pb−Free)
25 Unit / Rail
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC10H131
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
0.007 (0.180) M T L−M
B
Y BRK
−N−
U
N
S
0.007 (0.180) M T L−M
S
S
N
S
D
−L−
−M−
Z
W
20
D
1
V
0.007 (0.180) M T L−M
S
N
S
R
0.007 (0.180) M T L−M
S
N
S
Z
T L−M
S
N
H
J
0.007 (0.180) M T L−M
S
−T−
VIEW S
SEATING
PLANE
F
0.007 (0.180) M T L−M
S
VIEW S
N
S
N
S
K
0.004 (0.100)
G
S
S
K1
E
G1
0.010 (0.250) S T L−M
S
VIEW D−D
A
C
0.010 (0.250)
G1
X
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
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5
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−− 0.020
2_
10 _
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2_
10 _
7.88
8.38
1.02
−−−
N
S
MC10H131
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
0.10 (0.004)
M
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
B
A
A
16
9
1
8
B
M
L
16X
0.25 (0.010)
E
F
C
K
T
N
SEATING
PLANE
G
16X
0.25 (0.010)
M
D
T A
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6
M
J
T B
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
−−− 0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
−−−
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
MC10H131
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
B
F
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your
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MC10H131/D