CSPEMI200A 4 Channel Headset EMI Filter with ESD Protection Features Product Description • • The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. • • • • • • • • Four channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Includes 1 channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals—ideal for audio applications 11-bump, 2.046mm X 1.436mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Applications • • • • • • • EMI filtering and ESD protection for audio ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs In addition, the CSPEMI200A provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI200A can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI200A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI200A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Electrical Schematic 100Ω SPKR_IN2 10Ω C4 47pF 47pF C2 A3 SPKR_OUT1 A4 SPKR_OUT2 100pF GND MIC_OUT2 10Ω C3 100pF GND SPKR_IN1 100pF 68Ω A2 MIC_OUT1 100pF MIC_IN2 C1 47pF B1 47pF MIC_IN1 B3 B2 ESD Channel B4 © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CSPEMI200A PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 A 200A B C1 C2 MIC_IN1 ESD1 GND GND B1 B2 B3 B4 Orientation Marking C C3 C4 MIC_IN2 SPKR_OUT1 SPKR_OUT2 A2 A3 A4 A1 CSPEMI200A Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 N.B. A2 MIC_IN2 No Bump – used for orientation / alignment A3 SPKR_OUT1 Speaker Output 1 (to speaker) A4 SPKR_OUT2 Speaker Output 2 (to speaker) B1 MIC_IN1 B2 ESD1 ESD Protection Input. Provides a channel specifically for ESD protection purposes. B3 GND Device Ground B4 GND Device Ground C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C2 MIC_OUT2 Microphone Output 2 (to audio circuitry) C3 SPKR_IN1 Speaker Input 1 (from audio circuitry) C4 SPKR_IN2 Speaker Input 2 (from audio circuitry) Microphone Input 2 (from microphone) Microphone Input 1 (from microphone) Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 11 CSP CSPEMI200A 200A CSPEMI200AG 200A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 400 mW RATING UNITS -40 to +85 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER R1 CONDITIONS MIN TYP MAX UNITS Resistance 1 90 100 110 Ω R2 Resistance 2 61 68 75 Ω R3 Resistance 3 9 10 11 Ω C1 Capacitance 1 38 47 57 pF C2 Capacitance 2 80 100 120 pF 1.0 μA 15 -15 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 fC1 Cut-off frequency 1; Note 6 fC2 fC3 VCL 5 -5 7 -10 ±15 kV ±8 kV +15 -19 V V R = 100Ω, C = 47pF 53 MHz Cut-off frequency 2; Note 6 R = 68Ω, C = 47pF 61 MHz Cut-off frequency 3; Note 6 R = 10Ω, C = 100pF 33 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization. Note 6: ZSOURCE=50Ω, ZLOAD=50Ω. © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CSPEMI200A Performance Information Typical Filter Performance (nominal conditions unless specified otherwise) Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise) Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CSPEMI200A Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/27/05 CSPEMI200A Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI200A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 SIDE VIEW C1 PACKAGE DIMENSIONS C B Bumps 11 A Millimeters Min Nom Inches Max Min Nom 1 Max A1 2.001 2.046 2.091 0.0788 0.0806 0.0823 A2 1.391 1.436 1.481 0.0548 0.0565 0.0583 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.223 0.273 0.323 0.0088 0.0107 0.0127 C2 0.168 0.218 0.268 0.0066 0.0086 0.0106 D1 0.562 0.606 0.650 0.0221 0.0239 0.0256 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel A2 Custom CSP C2 Package Dim B2 B1 2 3 4 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI200A Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CSPEMI200A 2.04 X 1.44 X 0.606 2.29 X 1.60 X 0.81 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 8. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 09/27/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7