LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 LMV761/LMV762/LMV762Q Low Voltage, Precision Comparator with Push-Pull Output Check for Samples: LMV761, LMV762 FEATURES APPLICATIONS • • • • • • • • • 1 2 • • • • • • • • • • • • (VS = 5V, TA = 25°C, typical values unless specified) Input Offset Voltage 0.2mV Input Offset Voltage (Max Over Temp) 1mV Input Bias Current 0.2pA Propagation Delay (OD = 50mV) 120 nsec Low Supply Current 300μA CMRR 100dB PSRR 110dB Extended Temperature Range −40°C to 125°C Push-Pull Output Ideal for 2.7V and 5V Single Supply Applications Available in Space-Saving Packages: – 6-Pin SOT-23 (Single w/Shutdown) – 8-Pin SOIC (single w/Shutdown) – 8-Pin SOIC/VSSOP (Dual without Shutdown) LMV762Q is an Automotive Grade Product that is AEC-Q100 Grade 1 Qualified and is Manufactured on an Automotive Grade Flow Portable and Battery-Powered Systems Scanners Set Top Boxes High Speed Differential Line Receiver Window Comparators Zero-Crossing Detectors High Speed Sampling Circuits Automotive DESCRIPTION The LMV761/LMV762/LMV762Q are precision comparators intended for applications requiring low noise and low input offset voltage. The LMV761 single has a shutdown pin that can be used to disable the device and reduce the supply current. The LMV761 is available in a space saving 6-Pin SOT-23 or 8-Pin SOIC package. The LMV762 dual is available in 8-Pin SOIC or VSSOP package and LMV762Q in VSSOP and SOIC package. They feature a CMOS input and Push-Pull output stage. The Push-Pull output stage eliminates the need for an external pull-up resistor. The LMV761/LMV762/LMV762Q are designed to meet the demands of small size, low power and high performance required by portable and battery operated electronics. The input offset voltage has a typical value of 200μV at room temp and a 1mV limit over temp. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2013, Texas Instruments Incorporated LMV761, LMV762 SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com Typical Circuit VIN 0.2 VCC 125° C 0.18 0.16 R1 C1 = 0.1µF SD VOS (mV) VOUT R2 25°C 0.14 + 85°C 0.12 0.1 0.08 -40°C 0.06 0.04 0.02 VREF 0 2.5 3 3.5 4 4.5 5 VCC (V) Figure 1. Threshold Detector 2 Submit Documentation Feedback Figure 2. VOS vs. VCC Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Human Body Model ESD Tolerance (3) 2000V Machine Model 200V Supply Voltage (V+ – V−) 5.5V Differential Input Voltage Supply Voltage Voltage between any two pins Output Short Circuit Duration (4) Supply Voltage Current at Input Pin ±5 mA Infrared or Convection (20 sec.) Soldering Information Wave Soldering (10 sec.) 235°C 260°C (Lead Temp) Junction Temperature 150°C −65°C to 150°C Storage Temperature Range (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test condition, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Unless otherwise specified human body model is 1.5kΩ in series with 100pF. Machine model 200pF. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output current in excess of ±25 mA over long term may adversely affect reliability. Operating Ratings Supply Voltage (V+ – V−) 2.7V to 5.25V −40°C to +125°C Temperature Range Package Thermal Resistance (1) (1) 6-Pin SOT-23 265°C/W 8-Pin SOIC 190°C/W 8-Pin VSSOP 235°C/W The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)-TA)θJA. All numbers apply for packages soldered directly into a PC board. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 3 LMV761, LMV762 SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com 2.7V Electrical Characteristics Unless otherwise specified, all limited ensured for TJ = 25°C, VCM = V+/2, V+ = 2.7V, V− = 0V−. Boldface limits apply at the temperature extremes. (1) Symbol VOS Parameter Condition Min (2) Input Offset Voltage (4) Typ (3) Max (2) Units 0.2 1.0 mV 0.2 50 pA .001 5 pA IB Input Bias Current IOS Input Offset Current (4) CMRR Common Mode Rejection Ratio 0V < VCM < VCC - 1.3V 80 100 dB PSRR Power Supply Rejection Ratio V+ = 2.7V to 5V 80 110 dB CMVR Input Common Mode Voltage Range CMRR > 50dB Output Swing High IL = 2mA, VID = 200mV Output Swing Low IL = −2mA, VID = −200mV VO Output Short Circuit Current (5) ISC IS IOUT tPD 90 Sourcing, VO = 1.35V, VID = 200mV 6.0 20 Sinking, VO = 1.35V, VID = −200mV 6.0 15 V 250 mV mA 700 μA LMV762/LMV762Q (Both Comparators) 550 1400 μA Output Leakage I @ Shutdown SD = GND, VO = 2.7V 0.20 Supply Leakage I @ Shutdown SD = GND, VCC = 2.7V 0.20 Propagation Delay RL = 5.1kΩ CL = 50pF Overdrive = 5mV 270 Overdrive = 10mV 205 Overdrive = 50mV 120 Propagation Delay Skew tr Output Rise Time tf Output Fall Time ton Turn On Time from Shutdown 4 V+ – 0.1 275 tSKEW (1) (2) (3) (4) (5) V+ – 0.35 V Supply Current LMV761 (Single Comparator) LEAKAGE IS LEAKAGE −0.3 1.5 μA 2 μA ns 5 ns 10% to 90% 1.7 ns 90% to 10% 1.8 ns 6 μs Maximum temperature ensured range is −40°C to 125°C. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm. Specified by design. Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Application Information for information on temperature de-rating of this device. Absolute Maximum Rating indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 5.0V Electrical Characteristics Unless otherwise specified, all limited ensured for TJ = 25°C, VCM = V+/2, V+ = 5.0V, V− = 0V−. Boldface limits apply at the temperature extremes. Symbol Parameter VOS Min (1) Condition Input Offset Voltage (3) Typ (2) Max (1) Units 0.2 1.0 mV 0.2 50 pA 0.01 5 pA IB Input Bias Current IOS Input Offset Current (3) CMRR Common Mode Rejection Ratio 0V < VCM < VCC - 1.3V 80 100 dB PSRR Power Supply Rejection Ratio V+ = 2.7V to 5V 80 110 dB CMVR Input Common Mode Voltage Range CMRR > 50dB Output Swing High IL = 4mA, VID = 200mV Output Swing Low IL = −4mA, VID = −200mV VO Output Short Circuit Current (4) ISC IS IOUT tPD V+ – 0.1 120 Sourcing, VO = 2.5V, VID = 200mV 6.0 60 Sinking, VO = 2.5V, VID = −200mV 6.0 40 V 250 mV mA 225 700 μA LMV762/LMV762Q (Both Comparators) 450 1400 μA Output Leakage I @ Shutdown SD = GND, VO = 5.0V 0.20 Supply Leakage I @ Shutdown SD = GND, VCC = 5.0V 0.20 Propagation Delay RL = 5.1kΩ CL = 50pF Overdrive = 5mV 225 Overdrive = 10mV 190 Overdrive = 50mV 120 tSKEW Propagation Delay Skew tr Output Rise Time tf Output Fall Time ton Turn On Time from Shutdown (1) (2) (3) (4) V+ – 0.35 V Supply Current LMV761 (Single Comparator) LEAKAGE IS LEAKAGE −0.3 3.8 μA μA 2 ns 5 ns 10% to 90% 1.7 ns 90% to 10% 1.5 ns 4 μs All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm. Specified by design. Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Application Information for information on temperature de-rating of this device. Absolute Maximum Rating indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. Connection Diagrams 1 6 V +IN - V 2 + N/C -IN 5 SD +IN 3 -IN 1 8 2 7 3 6 N/C + 1 8 2 7 3 6 OUT A V -IN A OUT +IN A + V OUT B -IN B 4 OUT V Figure 3. LMV761 (Single) 6-Pin SOT-23 Top View - 4 5 SD Figure 4. LMV761 (Single) 8-Pin SOIC Top View V - 4 5 Figure 5. LMV762/LMV762Q (Dual) 8-Pin SOIC and VSSOP Top View Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 +IN B 5 LMV761, LMV762 SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com PSI vs. VCC (VO = High) 0.5 0.4 5 0.4 125°C 85°C 0.35 0.3 0.25 25°C 0.2 0.15 -40°C 0.1 0.05 0 1.5 2 2.5 3 3.5 4.5 4 PSI vs. VCC (VO = Low) 0.5 SUPPLY CURRENT PER CH (mA) SUPPLY CURRENT PER CH (mA) Typical Performance Characteristics 5 5.5 6 125°C 0.45 0.4 85°C 0.35 0.3 0.2 5 0.2 0.1 5 0.1 0.0 5 0 1.5 25°C -40°C 2 2.5 VOS vs. VCC VS = +2.7V 80 INPUT BIAS CURRENT (fA) VOS (mV) 6 Input Bias vs. Common Mode @ 25°C 25°C 0.14 85°C 0.12 0.1 0.08 -40°C 0.06 0.04 60 40 20 0 -20 -40 -60 -80 0.02 0 -100 2.5 3 3.5 4 4.5 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 0 5 COMMON MODE VOLTAGE (V) VCC (V) Figure 8. Figure 9. Input Bias vs. Common Mode @ 25°C Output Voltage vs. Supply Voltage 0.4 100 IL = 4mA 0.35 + OUTPUT VOLTAGE, REF TO V (V) VS = +5V 80 INPUT BIAS CURRENT (fA) 5.5 100 0.16 60 40 2 0 0 -20 -40 -60 -80 0.3 125°C 0.25 85°C 0.2 25°C 0.15 0.1 -40°C 0.5 0 -100 0 4 3 1 2 COMMON MODE VOLTAGE (V) 5 2 Figure 10. 6 5 Figure 7. 125° C 0.18 4.5 4 VCC (V) Figure 6. 0.2 3.5 3 VCC (V) 2.5 3 3.5 4 4.5 5 5.5 6 VCC (V) Figure 11. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Output Voltage vs. Supply Voltage Output Voltage vs. Supply Voltage 0.4 OUTPUT VOLTAGE REF TO V (V) IL = 2mA 0.14 + 125°C IL = 4mA 0.35 125°C - OUTPUT VOLTAGE, REF TO V (V) 0.16 0.12 85°C 0.1 25°C 0.08 0.06 0.04 -40°C 0.02 0.3 85°C 0.25 25°C 0.2 0.15 0.1 -40°C 0.05 0 0 2 2.5 3 3.5 4 4.5 5.5 5 2 6 2.5 3 3.5 VCC (V) Figure 12. Output Voltage vs. Supply Voltage ISOURCE vs. VOUT VCC = 5V -40°C 70 125°C - 0.16 25°C 60 0.14 85°C 85°C ISINK (mA) OUTPUT VOLTAGE, TO REF V (V) 6 80 IL = 2mA 0.12 25°C 0.1 0.08 50 40 125°C 30 0.06 20 0.04 -40°C 10 0.02 0 0 2 2.5 3 3.5 4 4.5 5.5 5 6 0 VCC (V) 1.5 VOUT (V) Figure 14. Figure 15. ISINK vs. VOUT 60 -40°C 50 1 40°C ISOURCE (mA) 30 125°C 2.5 VCC = 2.7V 25° C 20 85°C 2 ISOURCE vs. VOUT 25 25°C 20 0.5 VCC = 5V 40 ISINK (mA) 5.5 Figure 13. 0.2 0.18 5 4.5 4 VCC (V) 85°C 15 125° C 1 0 5 10 0 0 0 0.5 1 1.5 2 2.5 0 0.2 0.4 0.6 0.8 VOUT (V) VOUT (V) Figure 16. Figure 17. 1 1.2 1.4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 7 LMV761, LMV762 SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) ISINK vs. VOUT 20 18 1 6 14 500 12 85°C 8 125° C 6 CL = 50pF 400 25°C 10 RL = 5.1k: 450 PROP DELAY (ns) ISINK (mA) Prop Delay vs. Overdrive 40°C 350 300 2.7V 250 200 5V 150 4 100 VCC = 2.7V 2 50 0 0 0 0.2 0.6 0.4 1 0.8 1.2 1 1.4 10 Figure 18. Figure 19. 2 10mV 5mV 1 OVERDRIVE = 50mV 0 | | OVERDRIVE 0 -150 OUTPUT VOLTAGE (V) VCC = 2.7V TEMP = 25°C LOAD = 5.1k: 50pF Response Time vs. Input Overdrives Positive Transition INPUT VOLTAGE (mV) INPUT VOLTAGE (mV) OUTPUT VOLTAGE (V) Response Time vs. Input Overdrives Positive Transition 3 6 VCC = 5V TEMP = 25°C LOAD = 5.1k: 50pF 5 4 3 50 100 150 200 250 OVERDRIVE = 50mV 1 0 | | OVERDRIVE 0 300 0 50 100 150 200 250 TIME (ns) Figure 20. Figure 21. Response Time vs. Input Overdrives Negative Transition Response Time vs. Input Overdrives Negative Transition 2 1 0 VCC = 2.7V TEMP = 25°C LOAD = 5.1k: 50pF 10mV OUTPUT VOLTAGE (V) 3 5mV OVERDRIVE = 50mV | | 150 0 OVERDRIVE 0 50 100 150 200 TIME (ns) 250 INPUT VOLTAGE (mV) OUTPUT VOLTAGE (V) 5mV 2 TIME (ns) INPUT VOLTAGE (mV) 10mV -150 0 6 5 10mV VCC = 5V TEMP = 25°C LOAD = 5.1k: 50pF 4 3 2 1 5mV OVERDRIVE = 50mV 0 | | 150 0 300 OVERDRIVE 0 50 100 150 200 250 TIME (ns) Figure 22. 8 100 OVERDRIVE (mV) VOUT (V) Figure 23. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 APPLICATION INFORMATION BASIC COMPARATOR A basic comparator circuit is used to convert analog input signals to digital output signals. The comparator compares an input voltage (VIN) at the non-inverting input to the reference voltage (VREF) at the inverting pin. If VIN is less than VREF the output (VO) is low (VOL). However, if VIN is greater than VREF, the output voltage (VO) is high (VOH). V VREF - VIN + + VO V - Figure 24. Basic Comparator HYSTERESIS The basic comparator configuration may oscillate or produce a noisy output if the applied differential input is near the comparator's input offset voltage. This tends to occur when the voltage on one input is equal or very close to the other input voltage. Adding hysteresis can prevent this problem. Hysteresis creates two switching thresholds (one for the rising input voltage and the other for the falling input voltage). Hysteresis is the voltage difference between the two switching thresholds. When both inputs are nearly equal, hysteresis causes one input to effectively move quickly past the other. Thus, moving the input out of the region in which oscillation may occur. Hysteresis can easily be added to a comparator in a non-inverting configuration with two resistors and positive feedback Figure 25. The output will switch from low to high when VIN rises up to VIN1, where VIN1 is calculated by VIN1 = [VREF(R1+R2)] / R2 (1) The output will switch from high to low when VIN falls to VIN2, where VIN2 is calculated by VIN2 = [VREF(R1+R2) – (VCC R1)] / R2 (2) The Hysteresis is the difference between VIN1 and VIN2. ΔVIN = VIN1 - VIN2 = [VREF(R1+R2) / R2] - [VREF(R1+R2)] - [(VCC R1) / R2] = VCC R1 / R2 (3) VCC VREF VO VIN + R1 R2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 9 LMV761, LMV762 SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com VO VIN2 0 VIN1 VIN Figure 25. Non-Inverting Comparator Configuration INPUT The LMV761/LMV762 have near zero input bias current. This allows very high resistance circuits to be used without any concern for matching input resistances. This also allows the use of very small capacitors in R-C type timing circuits. This reduces the cost of the capacitors and amount of board space used. SHUTDOWN MODE The LMV761 features a low-power shutdown pin that is activated by driving SD low. In shutdown mode, the output is in a high impedance state, supply current is reduced to 20nA and the comparator is disabled. Driving SD high will turn the comparator on. The SD pin should not be left unconnected due to the fact that it is a high impedance input. When left unconnected, the output will be at an unknown voltage. Also do not three-state the SD pin. The maximum input voltage for SD is 5.5V, referred to ground and is not limited by VCC. This allows the use of 5V logic to drive SD while VCC operates at a lower voltage, such as 3V. The logic threshold limits for SD are proportional to VCC. BOARD LAYOUT AND BYPASSING The LMV761/LMV762 is designed to be stable and oscillation free, but it is still important to include the proper bypass capacitors and ground pickups. Ceramic 0.1μF capacitors should be placed at both supplies to provide clean switching. Minimize the length of signal traces to reduce stray capacitance. 10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 LMV761, LMV762 www.ti.com SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision G (March 2013) to Revision H • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LMV761 LMV762 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMV761MA ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 125 LMV76 1MA LMV761MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV76 1MA LMV761MAX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LMV76 1MA LMV761MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV76 1MA LMV761MF ACTIVE SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 125 C22A LMV761MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C22A LMV761MFX ACTIVE SOT-23 DBV 6 3000 TBD Call TI Call TI -40 to 125 C22A LMV761MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C22A LMV762MA ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 125 LMV7 62MA LMV762MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV7 62MA LMV762MAX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LMV7 62MA LMV762MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV7 62MA LMV762MM ACTIVE VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 C23A LMV762MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C23A LMV762MMX ACTIVE VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 C23A LMV762MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C23A LMV762QMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV76 2QMA LMV762QMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV76 2QMA Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Apr-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMV762QMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C32A LMV762QMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 C32A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMV761MAX Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV761MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV761MF SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMV761MF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMV761MFX SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMV761MFX/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LMV762MAX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV762MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV762MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV762MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV762MMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV762MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV762QMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMV762QMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV762QMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV761MAX SOIC D 8 2500 367.0 367.0 35.0 LMV761MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMV761MF SOT-23 DBV 6 1000 210.0 185.0 35.0 LMV761MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0 LMV761MFX SOT-23 DBV 6 3000 210.0 185.0 35.0 LMV761MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0 LMV762MAX SOIC D 8 2500 367.0 367.0 35.0 LMV762MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMV762MM VSSOP DGK 8 1000 210.0 185.0 35.0 LMV762MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMV762MMX VSSOP DGK 8 3500 367.0 367.0 35.0 LMV762MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LMV762QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMV762QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMV762QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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