NXP IP4283CZ10-TT Esd protection for ultra high-speed interface Datasheet

IP4283CZ10
ESD protection for ultra high-speed interfaces
Rev. 01 — 7 May 2009
Product data sheet
1. Product profile
1.1 General description
The IP4283CZ10 is designed to protect high-speed interfaces such as HDMI, DisplayPort,
eSATA and LVDS against ElectroStatic Discharge (ESD). The device includes high-level
ESD protection diodes for ultra high-speed signal lines and is available in two package
variants: UTLP10 and TSSOP10.
All signal lines are protected by a special diode configuration offering ultra-low line
capacitance of only 0.6 pF. These diodes provide protection to downstream components
from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features
n Pb-free, RoHS compliant and free of Halogen and Antimony (Dark Green compliant)
n System ESD protection for HDMI, DisplayPort, eSATA and LVDS
n All signal lines with integrated rail-to-rail clamping diodes for downstream ESD
protection of ±8 kV according to IEC 61000-4-2, level 4
n Matched 0.5 mm trace spacing
n Signal lines with ≤ 0.05 pF matching capacitance between signal pairs
n Line capacitance of only 0.6 pF for each channel
n 4-channel, UTLP10 or TSSOP10 Pb-free package
n HDMI 1.3a compliant
n DisplayPort compliant
n Design-friendly ‘pass-thru’ signal routing
1.3 Applications
The IP4283CZ10 is designed for high-speed receiver and transmitter port protection:
n TVs, monitors
n DVD recorders and players
n Notebooks, main board graphics cards and ports
n Set-top boxes and game consoles
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
Simplified outline
1
TMDS_CH1−
negative channel 1
ESD protection
2
TMDS_CH1+
positive channel 1 ESD
protection
3
GND
ground
4
TMDS_CH2−
negative channel 2
ESD protection
5
TMDS_CH2+
10
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
1
10
2
9
3
8
2
1
6
4
3, 8
positive channel 2 ESD
protection
6
Graphic symbol
4
001aai619
7
1
5
5
6
5
TSSOP10
Transparent top view
XSON10U
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4283CZ10-TB
XSON10U
plastic extremely thin small outline package; no leads; 10 terminals;
UTLP based; body 1 × 2.5 × 0.5 mm
SOT1059-1
IP4283CZ10-TT
TSSOP10
plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
Vesd
electrostatic discharge voltage
Tstg
Tamb
Conditions
Min
Max
Unit
GND − 0.5
+5.5
V
−8
+8
kV
storage temperature
−55
+125
°C
ambient temperature
−40
+85
°C
all pins to ground;
IEC 61000-4-2, level 4;
contact discharge
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
2 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
5. Characteristics
Table 4.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
VBRzd
Zener diode breakdown voltage
I = 1 mA
6
-
9
V
ILRzd
Zener diode reverse leakage current
per TMDS channel; V = 3.0 V
VF
forward voltage
-
-
1
µA
-
0.7
-
V
f = 1 MHz; Vbias = 2.5 V
[1]
-
0.6
-
pF
TMDS channel capacitance difference f = 1 MHz; Vbias = 2.5 V
[1]
-
0.05 -
pF
Cch(mutual)
mutual channel capacitance
between signal pin and pin n.c.;
f = 1 MHz; Vbias = 2.5 V
[1]
-
0.07 -
pF
Rdyn
dynamic resistance
I = 1 A; Tamb = 25 °C
[3]
-
2.4
-
Ω
-
1.3
-
Ω
-
8
-
V
Cch(TMDS)
∆Cch(TMDS)
TMDS channel capacitance
positive transient
negative transient
VCL(ch)trt(pos) positive transient channel clamping
voltage
[1]
This parameter is guaranteed by design.
[2]
Human Body Model according to JESD22-A-J114D.
[3]
According to IEC 61000-4-5/9.
Vesd = 8 kV HBM; Tamb = 25 °C
IP4283CZ10_1
Product data sheet
[2]
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
3 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
6. Application information
The IP4283CZ10 is designed mainly to provide high-level ESD protection for high-speed
serial data buses such as HDMI, DisplayPort, eSATA and LVDS data lines.
It is recommended that when designing the printed-circuit board, careful consideration is
given to impedance matching, and signal coupling.
A basic application diagram for the ESD protection of an HDMI interface is shown in
Figure 1 and Figure 2 for package versions TB and TT respectively.
IP4283CZ10-TB
TMDS_D2+
5
4
8
3
2
1
TMDS_CH2+
TMDS_GND
TMDS_CH2−
TMDS_D2−
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1−
TMDS_D1−
IP4283CZ10-TB
TMDS_D0+
5
TMDS_CH2+
TMDS_GND
4
8
3
2
1
TMDS_CH2−
TMDS_D0−
GND
TMDS_CLK+
TMDS_CH1+
HDMI
CONNECTOR
TMDS_GND
TMDS_CH1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
IP4221CZ6
1
2
100 nF
3
001aaj793
Fig 1.
Application diagram of HDMI ESD protection using IP4283CZ10-TB
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
4 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
IP4283CZ10-TT
TMDS_D2+
TMDS_D2+
TMDS_GND
TMDS_D2−
TMDS_D2−
TMDS_D1+
TMDS_D1+
TMDS_GND
TMDS_D1−
TMDS_D1−
IP4283CZ10-TT
TMDS_D0+
TMDS_D0+
TMDS_GND
TMDS_D0−
TMDS_D0−
TMDS_CLK+
TMDS_CLK+
HDMI
CONNECTOR
TMDS_GND
TMDS_CLK1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
IP4220CZ10
100 nF
001aaj794
Fig 2.
Application diagram of HDMI ESD protection using IP4283CZ10-TT
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
5 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
7. Package outline
XSON10U: plastic extremely thin small outline package; no leads;
10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm
SOT1059-1
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
e
L1
v
w
b
1
5
M
M
C
C A B
C
y
y1 C
L2
e2
L
10
6
X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
E
e
e1
e2
L
L1
L2
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
2.6
2.4
1.1
0.9
0.5
2
0.6
0.4
0.2
0.15
0.00
0.45
0.25
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT1059-1
---
Fig 3.
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-12-20
08-01-18
Package outline SOT1059-1 (XSON10U)
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
6 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
D
E
SOT552-1
A
X
c
y
HE
v M A
Z
6
10
A2
(A3)
A1
A
pin 1 index
θ
Lp
L
1
5
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.15
0.23
0.15
3.1
2.9
3.1
2.9
0.5
5.0
4.8
0.95
0.7
0.4
0.1
0.1
0.1
0.67
0.34
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
99-07-29
03-02-18
SOT552-1
Fig 4.
EUROPEAN
PROJECTION
Package outline SOT552-1 (TSSOP10)
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
7 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
8. Abbreviations
Table 5.
Abbreviations
Acronym
Description
DVD
Digital Versatile Disc
eSATA
external Serial Advanced Technology Attachment
ESD
ElectroStatic Discharge
HBM
Human Body Model
HDMI
High-Definition Multimedia Interface
LVDS
Low-Voltage Differential Signaling
RoHS
Restriction of Hazardous Substances
TMDS
Transition Minimized Differential Signaling
UTLP
Ultra-Thin Leadless Package
9. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4283CZ10_1
20090507
Product data sheet
-
-
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
8 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
10.4 Licenses
Purchase of NXP ICs with HDMI technology
Use of an NXP IC with HDMI technology in equipment that complies with
the HDMI standard requires a license from HDMI Licensing LLC, 1060 E.
Arques Avenue Suite 100, Sunnyvale CA 94085, USA, e-mail:
[email protected].
10.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4283CZ10_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 7 May 2009
9 of 10
IP4283CZ10
NXP Semiconductors
ESD protection for ultra high-speed interfaces
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
10.5
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 May 2009
Document identifier: IP4283CZ10_1
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