LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * High luminous intensity output. * Low power consumption. * High efficiency. * Versatile mounting on PCB or panel. * I.C. Compatible / low current requirements. * Popular T-1 3/4 diameter. Package Dimensions Part No. Lens Source Color LTL2T3TGK6-002 Water Clear InGaN Green Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 1 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Absolute Maximum Ratings at TA=25℃ Parameter Maximum Rating Unit 120 mW 100 mA DC Forward Current 30 mA Derating Linear From 30℃ 0.5 mA/℃ 5 V Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Reverse Voltage Operating Temperature Range -40℃ to + 85℃ Storage Temperature Range -55℃ to + 100℃ Lead Soldering Temperature [1.6mm(.063") From Body] Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 260℃ for 5 Seconds Page : 2 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Electrical / Optical Characteristics at TA=25℃ Parameter Symbol Min. Typ. IV 880 2500 mcd IF = 20mA Note 1,5 2θ1/2 30 deg Note 2 (Fig.5) Dominant Wavelength λd 525 nm Note 4 Spectral Line Half-Width ∆λ 35 nm Forward Voltage VF 3.5 Reverse Current IR Luminous Intensity Viewing Angle Max. Unit Test Condition 4.0 V IF = 20mA 100 µA VR = 5V NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Iv classification code is marked on each packing bag. 5. The Iv guarantee should be added ±15% tolerance. 6. Precautions in handling: ‧ When soldering, leave 2mm of minimum clearance from the resin to the soldering point. ‧ Dipping the resin to solder must be avoided. ‧ Correcting the soldered position after soldering must be avoided. ‧ In soldering, do not apply any stress to the lead frame particularly when heated. ‧ When forming a lead, make sure not to apply any stress inside the resin. ‧ Lead forming must be done before soldering. ‧ It is necessary to cut the lead frame at normal temperature. 7. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 3 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Typical Electrical / Optical Characteristics Curves (25℃ Ambient Temperature Unless Otherwise Noted) Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 4 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Features * Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and reel. * 2.54mm (0.1") straight lead spacing available. * Reel packaging simplifies handling and testing. Folding packaging is available by adding suffix “A” on option. Package Dimensions Specification Item Symbol Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165 Component Lead Pitch F 2.3 0.091 3.0 0.118 Front to Rear Deflection △H -- -- 2.0 0.078 Feed Hole to Bottom of Component H1 17.5 0.689 18.5 0.728 Feed Hole to Overall Component Height H2 25.9 1.020 27.5 1.083 Lead Length After Component Height L 11.0 0.433 Feed Hole Pitch P 12.4 0.488 13.0 0.511 Lead Location P1 4.4 0.173 5.8 0.228 Center of Component Location P2 5.05 0.198 7.6`5 0.301 Total Tape Thickness T -- -- 0.90 0.035 Feed Hole Location W0 8.5 0.334 9.75 0.384 Adhesive Tape Width W1 14.5 0.571 15.5 0.610 Adhesive Tape Position W2 0 0 3.0 0.118 Tape Width W3 17.5 0.689 19.0 0.748 Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 W0 Page : 5 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Packing Spec 2 reel per inner carton total 2000pcs per inner carton 6 Inner cartons per outer carton total 12000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 6 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Bin Code List For Reference Luminous Intensity Iv(mcd) IF@20mA Bin Code Min. Max. P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 Note: Tolerance of each bin limit is ±15% Dominant Wavelength λd(nm) IF@20mA Bin Code Min. Max. G07 514.0 516.0 G08 516.0 518.0 G09 518.0 520.0 G10 520.0 523.0 G11 523.0 527.0 G12 527.0 531.0 G13 531.0 535.0 Note: Tolerance of each bin limit is ±1nm Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 7 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100°C Max. 60 sec. Max. 260°C Max. 10 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 8 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A LED Circuit model B LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs 7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 9 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Suggested checking list : Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 10 of 11 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only 8. Reliability Test Classification Test Item Operation Life High Temperature High Humidity Storage Endurance Test Environmental Test High Temperature High Humidity Reverse BIAS Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) Ta= 65±5℃ RH= 90 ～ 95% MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982) Test Time= 240HRS±2HRS Ta= 65±5℃ RH= 90 ～ 95% VR=5V Test Time = 500HRS (-24HRS, +48HRS) JIS C 7021 : B-11(1982) High Temperature Storage Ta= 105±5℃ *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Low Temperature Storage Ta= -55±5℃ *Test Time=1000HRS (-24HRS,+72HRS) JIS C 7021:B-12 (1982) Temperature Cycling 105℃ ～ 25℃ ～ -55℃ ～ 25℃ 30mins 5mins 30mins 5mins 10 Cycles MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021: A-4(1982) Thermal Shock 105 ± 5℃ ～ -55℃ ± 5℃ 10mins 10mins 10 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Solder Resistance T.sol = 260 ± 5℃ Dwell Time= 10 ± 1secs MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) T. sol = 230 ± 5℃ Dwell Time= 5 ± 1secs MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982) Solderability 9. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL2T3TGK6-002 BNS-OD-C131/A4 Page : 11 of 11