MBRA210LT3G, NRVBA210LT3G Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package http://onsemi.com This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. SCHOTTKY BARRIER RECTIFIER 2 AMPERES 10 VOLTS Features Ultra Low VF 1st in the Market Place with a 10 VR Schottky Rectifier Compact Package with J−Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over−Voltage Protection Optimized for Low Forward Voltage AEC−Q101 Qualified and PPAP Capable NRVBA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb−Free* Mechanical Characteristics: Case: Molded Epoxy Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 70 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Ratings: Machine Model = C Human Body Model = 3A SMA CASE 403D PLASTIC MARKING DIAGRAM B2L1 AYWW G B2L1 A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Package Shipping† MBRA210LT3G SMA (Pb−Free) 5,000/Tape & Reel NRVBA210LT3G SMA (Pb−Free) 5,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 5 1 Publication Order Number: MBRA210LT3/D MBRA210LT3G, NRVBA210LT3G MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 10 V Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 110C) IO Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Storage/Operating Case Temperature Operating Junction Temperature A 160 Tstg, TC TJ Voltage Rate of Change (Rated VR, TJ = 25C) A 2.0 −55 to +125 dv/dt C V/ms 10,000 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead Thermal Resistance, Junction−to−Ambient Symbol Min Pad 1 Inch Pad Unit RqJL RqJA 22 150 15 81 C/W VF TJ = 25C TJ = 100C V 0.260 0.325 0.350 0.15 0.23 0.26 TJ = 25C TJ = 100C 0.25 0.70 40 60 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (IF = 0.1 A) (IF = 1.0 A) (IF = 2.0 A) Maximum Instantaneous Reverse Current IR (VR = 5.0 V) (VR = 10 V) mA 1. Pulse Test: Pulse Width 250 ms, Duty Cycle 2%. 100 VF @ 125C 10 25C 100C 75C 1 0.1 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 IF, MAXIMUM INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 VF @ 125C 10 100C 75C 1 0.1 0.45 25C 0.05 0.15 0.25 0.35 0.45 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage http://onsemi.com 2 0.55 MBRA210LT3G, NRVBA210LT3G IR, REVERSE CURRENT (AMPS) 1.0E−01 IR @ 125C 100C 1.0E−02 75C 1.0E−03 1.0E−04 1.0E−05 25C 0 2 4 6 8 10 VR, REVERSE VOLTAGE (VOLTS) 3.5 RATED VOLTAGE APPLIED RqJL = 22 C/W TJ = 125C 3 2.5 SQUARE WAVE 2 1.5 1 0.5 0 90 95 100 105 110 115 120 125 130 TL, LEAD TEMPERATURE (C) 0.9 TJ = 125C 0.8 dc 0.7 0.6 SQUARE WAVE 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1 1.5 25C f = 1 MHz 1000 0 1 2 3 4 2.5 3 Figure 5. Forward Power Dissipation 10,000 100 2 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating − Junction to Lead C, CAPACITANCE (pF) IF, AVERAGE FORWARD CURRENT (AMPS) dc PFO, AVERAGE POWER DISSIPATION (WATTS) Figure 3. Typical Reverse Current 5 6 7 8 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Capacitance http://onsemi.com 3 9 10 3.5 R(t), TRANSIENT THERMAL RESISTANCE (C/W) MBRA210LT3G, NRVBA210LT3G 100 D = 0.5 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 100 1000 t, TIME (S) R(t), TRANSIENT THERMAL RESISTANCE (C/W) Figure 7. Thermal Response, Junction to Ambient (min pad) 100 D = 0.5 0.2 10 0.1 0.05 0.02 1 0.1 0.01 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 1 10 t, TIME (S) Figure 8. Thermal Response, Junction to Ambient (1 inch pad) http://onsemi.com 4 MBRA210LT3G, NRVBA210LT3G PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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