Material Content Data Sheet Sales Product Name TLE4274D V50 MA# MA000737682 Package PG-TO252-3-11 Issued 28. August 2013 Weight* 401.22 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 2.945 0.73 0.140 0.03 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.73 7341 7341 349 0.042 0.01 139.706 34.82 34.86 348198 105 348652 0.132 0.03 0.03 329 329 0.310 0.08 774 14.281 3.56 140.641 35.07 38.71 350530 386899 3.740 0.93 0.93 9322 9322 0.091 0.02 0.000 0.00 0.115 0.03 0.092 0.02 4.377 1.09 0.028 0.01 0.095 0.02 94.488 23.55 35595 226 0.02 1 228 1.14 10909 2. 3. 236 23.58 235500 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 11423 71 Important Remarks: 1. 227 286 235807 1000000