4 POLE (2 FORM C+ 2 FORM A) SIGNAL RELAY FOR CENTRAL SWITCHING/ DATA TRANSMISSION RoHS Compliant FTR-B2 Series N ■ FEATURES O 4 POLE MINIATURE RELAY Mounting space of 175mm2 with 4 pole relay, suitable for high density mounting. ● SAFETY STANDARD - UL/CSA recognized - Conforms to Bellcore specification & FCC part 68 - Conforms to IEC 60950 / UL1950 / EN60950 spacing and high breakdown voltage Clearance: 1.0mm Creepage: 1.6mm ● HIGH RELIABILITY Bifurcated gold overlay silver alloy ● HIGH HEAT RESISTANCE, FLAMMABILITY Flammability grade of 94V-0 materials employed ● AIR TIGHT CONSTRUCTION Air tight construction allows high resistance to various environments and to clean the relay ● SMT VERSION Surface mount type available on request ● RoHS compliant since date code: 0430B8 Please see page 7 for more information ● T FO R N EW D ■ ORDERING INFORMATION [Example] FTR-B2 (a) ES M A 012 Z – ** (b) (c) (d) (e) (f ) (a) Series Name FTR-B2 (b) Contact Arrangement M : 2 Form C + 2 Form A - through hole N: 2 Form C + 2 Form A - SMT (c) Coil Type A : Standard (400mW) (d) Coil Nominal Voltage 4.5: 4.5VDC 012: 12VDC (e) Contact Material Z : Gold overlay silver alloy (f) Special Number for Customized Products Custom Designation Remarks: Actual marking on relay would not carry code FTR and be as below: Ordering code Actual marking FTR-B2MA012Z → B2MA012Z IG N 1 FTR-B2 Series ■ SAFETY STANDARD AND FILE NUMBERS UL508, 1950 (File No. E63615) C22.2 No. 14, No. 950 (File No. LR40304) Please request when the approval markings are required on the cover. Nominal voltage Contact rating 0.2 A 1A 0.3 A 4.5 to 12 VDC N 125 VAC 30 VDC 110 VDC Clearance Creepage 1.0mm coil a- contacts 1.6mm coil - contacts O T ■ COIL DATA CHART Remarks - working voltage: 150V - relay inside and outside - pollution degree "2" FO MODEL Nominal Voltage FTR-B2 ( ) A4.5Z 4.5VDC FTR-B2 ( ) A012Z 12VDC resistive R Coil Resistance Operate Voltage 50Ω 3.38VDC 0.45VDC 400mw 355Ω 9.0VDC 1.2VDC 400mw N EW Release Voltage Nominal Power D ES IG N 2 FTR-B2 Series ■ SPECIFICATIONS Item FTR-B2 Series Contact N Arrangement 2 Form C + 2 Form A Material Gold overlay Silver alloy Resistance (initial) Maximum 75mΩ (at 1A 6VDC) Rating (resistive) 30VDC 1A / 125VAC 0.2A Maximum Switching Power 30W / 25VA Maximum Switching Voltage 110VDC / 125VAC Maximum Switching Current 1A O T FO Maximum Carrying Current Time Value 1.25A Operate Time (at nominal voltage) Maximum 10ms R Release Time (at nominal voltage) Maximum 5ms Coil Operating Temperature Insulation Resistance (at 500VDC) Dielectric Strength Life Vibration Mechanical -40° C to +85° C (no frost) N Minimum 1,000 MΩ EW 750 VAC 1 Min. (open contacts) 500 VAC 1 Min. (adjacent contacts) 1,500 VAC 1 Min. (coil-contacts) 10 x 106 operations minimum D Electrical 50 x 103 operations minimum at 30VDC 1A 100 x 103 operations minimum at 125VDC 0.2A Misoperation 10-55 Hz (double amplitude of 1.5mm) Endurance 10-55 Hz (double amplitude of 1.5mm) Misoperation 100m/s2 (11±1ms) Endurance 500m/s2 (6±1ms) Shock Weight ES Approximately 3.9g IG N 3 , FTR-B2 Series 10 Time (ms) 8 6 N 4 2 0 Operation time O Release 0 0.2 T 0.4 0.6 80 60 40 c ct Co n Co 0.2 AC Resistive 5 10 30 50 0.6 0.8 2.4 2.2 Co 2.0 nta 1.8 Co ct ca rry nta 1.6 ct c arr 1.4 ing yin gc cu rre urr nt: 0A ent : 1A 1.2 Operating Voltage (hot coil) 1.0 0.8 Operating Voltage (cool coil) 0.6 0 20 40 60 80 R 50 30 20 10 N 0 100 200 EW 30 VDC Resistive 125 VAC Resistive 0.2 0.4 0.6 0.8 1.0 Contact Current (A) D 1.2 {~ {~ ~ { Contact Voltage (V) ES ■ REFERENCE DATA Distribution of Operate and Release Voltage 80 60 40 20 100 60 40 0 10 20 30 40 50 60 70 80 90 100 80 FBR-B2MA4.5Z n=100 Break Make 60 40 20 20 Nominal Voltage Multiplying Factor (%) N 100 FTR-B2MA4.5Z n=100 Operate Release 80 IG Distribution of Contact Resistance Distribution (%) FTR-B2MA4.5Z n=100 Operate Release Distribution of Operate and Release Time Distribution (%) Distribution (%) 100 100 Ambient Temperature (˚C) Life Curve 5 1 0.4 (maximum applied voltage, operating voltage characteristics) 100 0.2 0.1 e urr gc yin arr 0A Coil Power (W) Operation (x104) Contact Current (A) 0.5 0.4 0.3 nt: tc tac 20 0 FO 1 n ryi nta 0.8 DC Resistive ren ar Maximum Switching Power 2 A t: 1 ur gc Coil Power (W) 3 Ambient Temperature Coil Temperature Rise Nominal Voltage Multiplying Factor (%) Operation (return time characteristics) Coil Temperature Rise (˚C) ■ CHARACTERISTIC DATA 0 1 2 3 4 Time (ms) 5 6 0 10 20 30 40 50 60 70 Contact Resistance (mΩ) 4 FTR-B2 Series Operating Voltage 3.0 2.0 Release Voltage 1.0 0 500 200 100 50 20 10 5 2 FBR-B2MA4.5Z n=10 1200 operations/min. N Initial1 O 5 10 Make Break T 50 100 500 1000 4.0 Operating Voltage 3.0 2.0 ● Dimensions Through hole type Release Voltage 1.0 FBR-B2MA4.5Z n=10 30 operations/min. 125 VAC 0.2A (resistive load) 0 500 200 100 50 20 10 5 2 Operation (x104) ■ DIMENSIONS Make Break Electrical Life Test 4.0 Operating Voltage 3.0 2.0 Release Voltage 1.0 FBR-B2MA4.5Z n=10 30 operations/min. 30 VDC 1A (resistive load) 0 500 200 100 50 20 10 5 2 Make Break Operation 5 Initial 10 Initial Operation (x104) (x104) FO R ● Schematics (BOTTOM VIEW) ● PC board mounting hole layout (BOTTOM VIEW) N EW Orientation mark ● Dimensions Nominal Voltage Multiplying Factor (%) 4.0 Electrical Life Test Contact Resistance (m‰) Nominal Voltage Multiplying Factor (%) Mechanical Life Test Contact Resistance (m‰) Contact Nominal Voltage Resistance (m‰) Multiplying Factor (%) ■ REFERENCE DATA ● Schematics (TOP VIEW) Surface mount type D ES ● PC board mounting hole layout (TOP VIEW) IG N Orientation mark 5 FTR-B2 Series ■ RECOMMENDED CONDITION (Temperature Profile) soldering T3 T 3 = 245°C max. T 2 = 200°C max. cooling T 1 = 165°C max. T2 preheating N O 0 T T3 cooling T2 T 3 = 200°C maximum T 2 = 165°C maximum T 1 = 100°C maximum preheating T1 30 sec Max. 120 sec maximum Note: 215°C maximum soldering 0 60 sec Max. 60 sec Max. 90 sec Max. 1.Temperature profiles show the temperature of PC board surface. 2.Please perform soldering test with your actual PC board before mass production, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mounting and heating method. FO R ■ PACKAGING Tape dimensions ø 1.55 ø 2.2 2 4 EW 0.4 32 28.4 14.2 16 N 17.9 T1 Temperature (°C) VPS (Vapor Phase Soldering) 1.75 Temperature (°C) IRS (Infrared Reflow Soldering) ES 10.7 11.7 D IG Tape feeding N ø 380 Reel Dimensions Top cover tape Embossed carrying tape Perforation Parts box ø 13 Dimensions: mm General tolerance: ±0.2 Quantity of one reel: 250 pieces 6 FTR-B2 Series RoHS Compliance and Lead Free Relay Information 1. General Information Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf) ● Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays. ● Most signal and some power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE). ● It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). ● “LF” is marked on each outer and inner carton. (No marking on individual relays). ● To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists. ● N O T FO 2. Recommended Lead Free Solder Profile ● Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005) Reflow Solder condtion R Flow Solder condtion: N Pre-heating: Soldering: Peak Temp.: max. 250˚C Soldering EW temperature (˚C) 250 220 130 90~120 sec. max. 120 sec. Solder by Soldering Iron: Cooling Pre-heating 170 20~30 sec. maximum 120˚C dip within 5 sec. at 260˚C soler bath D Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. ES (duration) IG N We highly recommend that you confirm your actual solder conditions 3. Moisture Sensitivity ● Moisture Sensitivity Level standard is not applicable to electromechanical realys. 4. Tin Whisker ● SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house test. 5. Solid State Relays Each lead terminal will be changed from solder plating to Sn plating and Nickel plating. A layer of Nickel plating is between the terminal and the Sn plating to avoid whisker. ● 7 FTR-B2 Series Fujitsu Components International Headquarter Offices N O T Japan Fujitsu Component Limited Gotanda-Chuo Building 3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 141, Japan Tel: (81-3) 5449-7010 Fax: (81-3) 5449-2626 Email: [email protected] Web: www.fcl.fujitsu.com Europe Fujitsu Components Europe B.V. Diamantlaan 25 2132 WV Hoofddorp Netherlands Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: [email protected] Web: www.fceu.fujitsu.com North and South America Fujitsu Components America, Inc. 250 E. Caribbean Drive Sunnyvale, CA 94089 U.S.A. Tel: (1-408) 745-4900 Fax: (1-408) 745-4970 Email: [email protected] Web: www.fcai.fujitsu.com Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #04-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: [email protected] www.fcal.fujitsu.com © 2005 Fujitsu Components America, Inc. All company and product names are trademarks or registered trademarks of their respective owners. Rev. 06/07/2005. FO R N EW D ES IG N 8