OPA334 OPA2334 OPA335 OPA2335 OPA3 35 OPA2 OPA2 334 335 OPA23 35 SBOS245D – JUNE 2002 – REVISED JULY 2003 0.05µV/°C max, SINGLE-SUPPLY CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series FEATURES DESCRIPTION ● ● ● ● ● ● ● The OPA334 and OPA335 series of CMOS operational amplifiers use auto-zeroing techniques to simultaneously provide very low offset voltage (5µV max), and near-zero drift over time and temperature. These miniature, high-precision, low quiescent current amplifiers offer high input impedance and rail-to-rail output swing. Single or dual supplies as low as +2.7V (±1.35V) and up to +5.5V (±2.75V) may be used. These op amps are optimized for low-voltage, single-supply operation. The OPA334 (single version with shutdown) comes in MicroSIZE SOT23-6. The OPA335 (single version without shutdown) is available in SOT23-5, and SO-8. The OPA2334 (dual version with shutdown) comes in MicroSIZE MSOP-10. The OPA2335 (dual version without shutdown) is offered in the MSOP-8 and SO-8 packages. All versions are specified for operation from –40°C to +125°C. OFFSET VOLTAGE PRODUCTION DISTRIBUTION 0.050 0.045 0.025 0.020 0.015 0.010 Absolute Value; Centered Around Zero 0 –3.0 –2.7 –2.4 –2.1 –1.8 –1.5 –1.2 –0.9 –0.6 –0.3 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 Population Population OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 0.040 TRANSDUCER APPLICATIONS TEMPERATURE MEASUREMENT ELECTRONIC SCALES MEDICAL INSTRUMENTATION BATTERY-POWERED INSTRUMENTS HANDHELD TEST EQUIPMENT 0.005 ● ● ● ● ● ● 0.035 APPLICATIONS The OPA334 family includes a shutdown mode. Under logic control, the amplifiers can be switched from normal operation to a standby current of 2µA. When the Enable pin is connected high, the amplifier is active. Connecting Enable low disables the amplifier, and places the output in a highimpedance state. 0.030 LOW OFFSET VOLTAGE: 5µV (max) ZERO DRIFT: 0.05µV/°C (max) QUIESCENT CURRENT: 285µA SINGLE-SUPPLY OPERATION SINGLE AND DUAL VERSIONS SHUTDOWN MicroSIZE PACKAGES Offset Voltage (µV) Offset Voltage Drift (µV/°C) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002-2003, Texas Instruments Incorporated www.ti.com ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Supply Voltage .................................................................................... +7V Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V Current(2) .................................................. ±10mA Output Short Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –40°C to +150°C Storage Temperature ..................................................... –65°C to +150°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ............................................... +300°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these, or any other conditions beyond those specified, is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY SOT23-6 DBV –40°C to +125°C OAOI " " " " OPA334AIDBVT OPA334AIDBVR Tape and Reel, 250 Tape and Reel, 3000 MSOP-10 DGS –40°C to +125°C BHE " " " " OPA2334AIDGST OPA2334AIDGSR Tape and Reel, 250 Tape and Reel, 2500 SOT23-5 DBV –40°C to +125°C OAPI " " " " SO-8 D –40°C to +125°C OPA335 " " " " OPA335AIDBVT OPA335AIDBVR OPA335AID OPA335AIDR Tape and Reel, 250 Tape and Reel, 3000 Rails, 100 Tape and Reel, 2500 SO-8 D –40°C to +125°C OPA2335 " " " " MSOP-8 DGK –40°C to +125°C BHF " " " " OPA2335AID OPA2335AIDR OPA2335AIDGKT OPA2335AIDGKR Rails, 100 Tape and Reel, 2500 Tape and Reel, 250 Tape and Reel, 2500 Shutdown Version OPA334 " OPA2334 " Non-Shutdown Version OPA335 " OPA335 " OPA2335 " OPA2335 " NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. PIN CONFIGURATIONS OPA335 Out 1 V– 2 +In 3 OPA2334 OPA335 5 4 V+ –In NC(1) 1 8 NC(1) Out A 1 –In 2 7 V+ –In A 2 +In 3 6 Out 5 NC(1) V– 4 10 V+ 9 Out B 8 –In B A +In A 3 B SOT23-5 V– 4 7 +In B Enable A 5 6 Enable B SO-8 MSOP-10 OPA2335 OPA334(2) OAOI 6 V+ Out A 1 V– 2 5 Enable –In A 2 +In 3 4 –In +In A 3 V– 4 Out 1 A B 8 V+ 7 Out B 6 –In B 5 +In B SOT23-6 SO-8, MSOP-8 NOTES: (1) NC indicates no internal connection. (2) Pin 1 of the SOT23-6 is determined by orienting the package marking as indicated in the diagram. 2 OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D ELECTRICAL CHARACTERISTICS Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. OPA334AI, OPA335AI OPA2334AI, OPA2335AI PARAMETER OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply Long-Term Stability(1) Channel Separation, dc CONDITION VOS dVOS /dT PSRR VCM = VS /2 TYP 1 ±0.02 ±1 VS = +2.7V to +5.5V, VCM = 0, Over Temperature MAX UNITS 5 µV µV/°C µV/V ±0.05 ±2 See Note (1) 0.1 INPUT BIAS CURRENT Input Bias Current Over Temperature Input Offset Current IOS ±70 1 ±120 en in 1.4 20 IB NOISE Input Voltage Noise, f = 0.01Hz to 10Hz Input Current Noise Density, f = 10Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio MIN VCM CMRR VCM = VS /2 (V–) – 0.1V < VCM < (V+) – 1.5V, Over Temperature (V–) – 0.1 110 INPUT CAPACITANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain, Over Temperature AOL Over Temperature 50mV < VO < (V+) – 50mV, RL = 100kΩ, VCM = VS /2 100mV < VO < (V+) – 100mV, RL = 10kΩ, VCM = VS /2 110 110 µV/V ±200 ±400 pA nA pA µVPP fA/ √Hz 130 (V+) – 1.5 V dB 1 5 pF pF 130 130 dB dB 2 1.6 MHz V/µs FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate OUTPUT Voltage Output Swing from Rail Voltage Output Swing from Rail Short-Circuit Current Capacitive Load Drive GBW SR G = +1 RL = 10kΩ, Over Temperature RL = 100kΩ, Over Temperature ISC CLOAD SHUTDOWN tOFF tON(2) VL (shutdown) VH (amplifier is active) Input Bias Current of Enable Pin IQSD POWER SUPPLY Operating Voltage Range Quiescent Current: OPA334, OPA335 IQ Over Temperature OPA2334, OPA2335 (total—two amplifiers) Over Temperature 15 100 1 50 ±50 See Typical Characteristics 2 µs µs V V pA µA 5.5 350 450 700 900 V µA µA µA µA +125 +150 +150 °C °C °C °C/W °C/W °C/W 1 150 0 0.75 (V+) +0.8 5.5 50 2.7 IO = 0 285 IO = 0 570 TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance θJA SOT23-5, SOT23-6 Surface-Mount MSOP-8, MSOP-10, SO-8 Surface-Mount –40 –40 –65 200 150 mV mV mA NOTES: (1) 500-hour life test at 150°C demonstrated randomly distributed variation approximately equal to measurement repeatability of 1µV. (2) Device requires one complete cycle to return to VOS accuracy. OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.005 0.010 Absolute Value; Centered Around Zero 0 –3.0 –2.7 –2.4 –2.1 –1.8 –1.5 –1.2 –0.9 –0.6 –0.3 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 Population Population OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION Offset Voltage (µV) Offset Voltage Drift (µV/°C) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 1200 +125°C 5.5V 2.7V +125°C Input Bias Current (pA) Output Voltage Swing (V) (V+) +25°C (V+) – 1 –40°C +25°C (V–) + 1 –40°C +125°C (V–) 1000 800 600 400 –40°C +25°C 200 0 0 2 4 6 8 0 10 0.5 1.0 1.5 2.0 2.5 3.0 Output Current (mA) Common-Mode Voltage (V) INPUT BIAS CURRENT vs TEMPERATURE QUIESCENT CURRENT (per channel) vs TEMPERATURE 3.5 400 1000 Quiescent Current (µA) Input Bias Current (pA) 350 100 VS = +5.5V 300 250 200 VS = +2.7V 150 100 50 0 10 –40 –20 0 20 40 60 80 100 –40 120 0 20 40 60 80 100 120 Temperature (°C) Temperature (°C) 4 –20 OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. LARGE-SIGNAL RESPONSE OPEN-LOOP GAIN/PHASE vs FREQUENCY 140 –80 –100 80 –110 –120 Gain 40 –130 20 –140 0 –150 –20 0.1 1 10 100 1k 10k 100k 1M Output Voltage (1V/div) 100 60 G = –1 CL = 300pF –90 Phase Phase (°) AOL (dB) 120 –160 10M Time (5µs/div) Frequency (Hz) POSITIVE OVER-VOLTAGE RECOVERY 200mV/div G = +1 CL = 50pF 0 Input 10kΩ 1V/div Output Voltage (50mV/div) SMALL-SIGNAL RESPONSE +2.5V Output 100Ω 0 OPA335 –2.5V Time (25µs/div) Time (5µs/div) NEGATIVE OVER-VOLTAGE RECOVERY COMMON-MODE REJECTION vs FREQUENCY Input 0 0 10kΩ 1V/div +2.5V 100Ω Output OPA335 Common-Mode Rejection (dB) 200mV/div 140 –2.5V 120 100 80 60 40 20 0 Time (25µs/div) 1 10 100 1k 10k 100k 1M 10M Frequency (Hz) OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. POWER-SUPPLY REJECTION RATIO vs FREQUENCY SAMPLING FREQUENCY vs SUPPLY VOLTAGE 11.0 10.9 120 +PSRR 10.8 100 Frequency (kHz) Power-Supply Rejection Ratio (dB) 140 80 60 40 –PSRR 10.7 10.6 10.5 10.4 10.3 10.2 20 10.1 0 10.0 10 100 10k 100k 1M 2.7 3.2 3.7 4.2 4.7 Frequency (Hz) Supply Voltage (V) NOISE vs FREQUENCY 0.01Hz TO 10Hz NOISE 5.2 5.5 400nV/div Noise (nV/√Hz) 1000 1k 100 10 1 10 100 1k 10k 100k 10s/div Frequency (Hz) SAMPLING FREQUENCY vs TEMPERATURE 13 50 SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE (VS = 2.7V to 5V) RL = 10kΩ 12 40 Overshoot (%) Sampling Frequency (kHz) 45 11 10 9 35 30 25 20 15 10 5 8 0 –40 –10 20 50 80 110 125 10 Temperature (°C) 6 100 1000 Load Capacitance (pF) OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted. SETTLING TIME vs CLOSED-LOOP GAIN COMMON-MODE RANGE vs SUPPLY VOLTAGE 4.5 Unity-gain requires one complete Auto-Zero Cycle—see text. 4.0 Common-Mode Range (V) Settling Time (µs) 100 0.01% 10 0.1% 3.5 Maximum Common-Mode 3.0 2.5 2.0 1.5 1.0 0.5 Minimum Common-Mode 0 –0.5 1 1 10 100 2.7 3.2 Gain (V/V) 4.2 4.7 5.2 5.5 Supply Voltage (V) APPLICATIONS INFORMATION The OPA334 and OPA335 series op amps are unity-gain stable and free from unexpected output phase reversal. They use auto-zeroing techniques to provide low offset voltage and very low drift over time and temperature. Good layout practice mandates use of a 0.1µF capacitor placed closely across the supply pins. For lowest offset voltage and precision performance, circuit layout and mechanical conditions should be optimized. Avoid temperature gradients that create thermoelectric (Seebeck) effects in thermocouple junctions formed from connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by assuring that they are equal on both input terminals. • Use low thermoelectric-coefficient connections (avoid dissimilar metals). • Thermally isolate components from power supplies or other heat-sources. • Shield op amp and input circuitry from air currents, such as cooling fans. Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can cause thermoelectric voltages of 0.1µV/°C or higher, depending on materials used. OPERATING VOLTAGE The OPA334 and OPA335 series op amps operate over a power-supply range of +2.7V to +5.5V (±1.35V to ±2.75V). Supply voltages higher than 7V (absolute maximum) can permanently damage the amplifier. Parameters that vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet. OPA334 ENABLE FUNCTION The enable/shutdown digital input is referenced to the V– supply voltage of the amp. A logic high enables the op amp. A valid logic high is defined as > 75% of the total supply voltage. The valid logic high signal can be up to 5.5V above the negative supply, independent of the positive supply voltage. A valid logic low is defined as < 0.8V above the V– supply pin. If dual or split power supplies are used, be sure that logic input signals are properly referred to the negative supply voltage. The Enable pin must be connected to a valid high or low voltage, or driven, not left open circuit. The logic input is a high-impedance CMOS input, with separate logic inputs provided on the dual version. For batteryoperated applications, this feature can be used to greatly reduce the average current and extend battery life. The enable time is 150µs, which includes one full auto-zero cycle required by the amplifier to return to VOS accuracy. Prior to this time, the amplifier functions properly, but with unspecified offset voltage. Disable time is 1µs. When disabled, the output assumes a high-impedance state. This allows the OPA334 to be operated as a gated amplifier, or to have the output multiplexed onto a common analog output bus. INPUT VOLTAGE The input common-mode range extends from (V–) – 0.1V to (V+) – 1.5V. For normal operation, the inputs must be limited to this range. The common-mode rejection ratio is only valid within the valid input common-mode range. A lower supply voltage results in lower input common-mode range; therefore, attention to these values must be given when selecting the input bias voltage. For example, when operating on a single 3V power supply, common-mode range is from 0.1V below ground to half the power-supply voltage. OPA334, OPA2334, OPA335, OPA2335 SBOS245D 3.7 www.ti.com 7 Normally, input bias current is approximately 70pA; however, input voltages exceeding the power supplies can cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply can be tolerated if the input current is limited to 10mA. This is easily accomplished with an input resistor, as shown in Figure 1. Current-limiting resistor required if input voltage exceeds supply rails by ≥ 0.5V. swing limit of a single-supply op amp. A good single-supply op amp may swing close to single-supply ground, but will not reach ground. The output of the OPA334 or OPA335 can be made to swing to ground, or slightly below, on a singlesupply power source. To do so requires use of another resistor and an additional, more negative, power supply than the op amp’s negative supply. A pull-down resistor may be connected between the output and the additional negative supply to pull the output down below the value that the output would otherwise achieve, as shown in Figure 2. +5V V+ = +5V IOVERLOAD 10mA max OPA335 VOUT VOUT OPA335 VIN 5kΩ VIN RP = 40kΩ Op Amp’s V– = Gnd FIGURE 1. Input Current Protection. –5V Additional Negative Supply INTERNAL OFFSET CORRECTION The OPA334 and OPA335 series op amps use an auto-zero topology with a time-continuous 2MHz op amp in the signal path. This amplifier is zero-corrected every 100µs using a proprietary technique. Upon power-up, the amplifier requires one full auto-zero cycle of approximately 100µs to achieve specified VOS accuracy. Prior to this time, the amplifier functions properly but with unspecified offset voltage. This design has remarkably little aliasing and noise. Zero correction occurs at a 10kHz rate, but there is virtually no fundamental noise energy present at that frequency. For all practical purposes, any glitches have energy at 20MHz or higher and are easily filtered, if required. Most applications are not sensitive to such high-frequency noise, and no filtering is required. Unity-gain operation demands that the auto-zero circuitry correct for common-mode rejection errors of the main amplifier. Because these errors can be larger than 0.01% of a fullscale input step change, one calibration cycle (100µs) can be required to achieve full accuracy. This behavior is shown in the typical characteristic section, see Settling Time vs ClosedLoop Gain. ACHIEVING OUTPUT SWING TO THE OP AMP’S NEGATIVE RAIL Some applications require output voltage swing from 0V to a positive full-scale voltage (such as +2.5V) with excellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0V, near the lower output 8 FIGURE 2. Op Amp with Pull-Down Resistor to Achieve VOUT = Ground. The OPA334 and OPA335 have an output stage that allows the output voltage to be pulled to its negative supply rail, or slightly below using the above technique. This technique only works with some types of output stages. The OPA334 and OPA335 have been characterized to perform well with this technique. Accuracy is excellent down to 0V and as low as –2mV. Limiting and non-linearity occurs below –2mV, but excellent accuracy returns as the output is again driven above –2mV. Lowering the resistance of the pull-down resistor will allow the op amp to swing even further below the negative rail. Resistances as low as 10kΩ can be used to achieve excellent accuracy down to –10mV. LAYOUT GUIDELINES Attention to good layout practices is always recommended. Keep traces short. When possible, use a PCB ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1µF capacitor closely across the supply pins. These guidelines should be applied throughout the analog circuit to improve performance and provide benefits such as reducing the EMI (electromagnetic-interference) susceptibility. OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D 4.096V REF3040 +5V + 0.1µF R9 150kΩ R1 6.04kΩ R5 31.6kΩ D1 +5V 0.1µF + – R2 2.94kΩ – + + R2 549Ω R4 6.04kΩ VO OPA335 R6 200Ω K-Type Thermocouple 40.7µV/°C Zero Adj. R3 60.4Ω FIGURE 3. Temperature Measurement Circuit. IIN R1 IIN R1 +5V +2.5V Photodiode Photodiode OPA343 OPA343 –2.5V C1 1MΩ 1MΩ C1 +5V +2.5V R2 R2 NOTE: (1) Optional pull-down resistor to allow below ground output swing. OPA335 C2 OPA335 C2 40kΩ(1) –2.5V –5V a. Split Supply. b. Single Supply. FIGURE 4. Auto-Zeroed Transimpedance Amplifier. VEX = +2.5V VEX R1 = 105Ω R1 Select R1 so bridge output ≤ VCMmax. +5V R R R R 300Ω Bridge VOUT OPA335 @ VS = 2.7V, VCMmax = 1.2V R2 +2.7V OPA335 R1 VOUT R2 VREF VREF a. 5V Supply Bridge Amplifier. b. 2.7V Supply Bridge Amplifier. FIGURE 5. Single Op Amp Bridge Amplifier Circuits. OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 9 R2 R1 R1 R2 +5V VREF G=1+ +5V 1/2 OPA2335 R R R R 1/2 OPA2335 R2 R1 VOUT R3(1) 40kΩ –5V NOTE: (1) Optional pull-down resistor to allow accurate swing to 0V. FIGURE 6. Dual Op Amp IA Bridge Amplifier. 11.5kΩ +5V V 5V FS = 0.63V Load 50mV Shunt OPA335 R3(1) 40kΩ RS ADS1100 I2C 1kΩ G = 12.5 –5V (PGA Gain = 8) 5V FS NOTE: (1) Pull-down resistor to allow accurate swing to 0V. FIGURE 7. Low-Side Current Measurement. 10 OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D R1 4.12kΩ C1 56pF +5V C2 0.1µF R3 100Ω Photodiode ≈ 2pF VOUT OPA353 R2(1) 2kΩ C3 1nF ≈ 1MHz Bandwidth VOS ≈ 10µV –5V C4 10nF Photodiode Bias +5V R7 1kΩ C6 0.1µF C7 1µF R4 100kΩ R6 49.9kΩ OPA335 R5(1) 40kΩ C5 10nF –5V NOTE: (1) Pull-down resistors to allow accurate swing to 0V. FIGURE 8. High Dynamic Range Transimpedance Amplifier. OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 11 PACKAGE DRAWINGS DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE 0,95 6X 6 0,50 0,25 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0 –8 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-5/G 01/02 NOTES: A. B. C. D. 12 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D PACKAGE DRAWINGS (Cont.) DGS (S-PDSO-G10) PLASTIC SMALL-OUTLINE PACKAGE 0,27 0,17 0,50 10 0,08 M 6 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 5 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073272/B 08/01 NOTES: A. B. C. A. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-187 OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 13 PACKAGE DRAWINGS (Cont.) DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,50 0,30 0,95 5 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0° – 8° 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-4/G 01/02 NOTES: A. B. C. D. 14 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-178 OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D PACKAGE DRAWINGS (Cont.) D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 8 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 0.050 (1,27) 8 0.010 (0,25) 5 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 1 4 0.010 (0,25) 0°– 8° A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.010 (0,25) 0.004 (0,10) 0.069 (1,75) MAX PINS ** 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047/E 09/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 OPA334, OPA2334, OPA335, OPA2335 SBOS245D www.ti.com 15 PACKAGE DRAWINGS (Cont.) DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,08 M 5 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073329/C 08/01 NOTES: A. B. C. D. 16 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-187 OPA334, OPA2334, OPA335, OPA2335 www.ti.com SBOS245D PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA2334AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2334AIDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2334AIDGST ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2334AIDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2335AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2335AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2335AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2335AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2335AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2335AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR OPA2335AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2335AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA334AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA334AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA334AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA334AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA335AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 16-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA335AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA335AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA335AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA335AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA335AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA335AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA335AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA2335 : • Military: OPA2335M NOTE: Qualified Version Definitions: • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA2334AIDGSR Package Package Pins Type Drawing MSOP DGS 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2334AIDGST MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2335AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2335AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2335AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA334AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 OPA334AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3 OPA335AIDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA335AIDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA335AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2334AIDGSR MSOP DGS 10 2500 367.0 367.0 35.0 OPA2334AIDGST MSOP DGS 10 250 210.0 185.0 35.0 OPA2335AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0 OPA2335AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0 OPA2335AIDR SOIC D 8 2500 367.0 367.0 35.0 OPA334AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 OPA334AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0 OPA335AIDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA335AIDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 OPA335AIDR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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