Material Content Data Sheet Sales Product Name IPD090N03L G MA# MA000687270 Package PG-TO252-3-311 Issued 29. August 2013 Weight* 316.18 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon phosphorus iron copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7723-14-0 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 0.720 0.23 0.049 0.02 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.23 2279 2279 154 0.162 0.05 162.275 51.32 51.39 513233 514 513901 0.937 0.30 0.30 2965 2965 0.324 0.10 1026 19.586 6.19 127.573 40.35 46.64 403478 466448 3.740 1.18 1.18 11829 11829 0.086 0.03 0.000 0.00 0.015 0.00 0.018 0.01 0.696 0.22 61944 273 0.03 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 274 58 0.23 Important Remarks: 1. 1 46 2200 2304 1000000