Product Folder Sample & Buy Technical Documents Support & Community Tools & Software Reference Design LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 LP2954, LP2954A 5-V and Adjustable Micropower LDOs 1 Features 3 Description • The LP2954 is a 5-V micropower LDO with very low quiescent current (90 μA typical at 1-mA load) and very low dropout voltage (typically 60 mV at light loads and 470 mV at 250-mA load current). 1 • • • • • • • • • • 5-V Output within 1.2% Over Temperature (A Grade) Adjustable 1.23-V to 29-V Output Voltage Available (LP2954IM and LP2954AIM) Ensured 250-mA Output Current Extremely Low Quiescent Current Low Dropout Voltage Reverse Battery Protection Extremely Tight Line and Load Regulation Very Low Temperature Coefficient Current and Thermal Limiting Pin Compatible with LM2940 and LM340 (5-V Version Only) Adjustable Version Adds ERROR Flag to Warn of Output Drop and a Logic-Controlled Shutdown The quiescent current increases only slightly at dropout (120 μA typical), which prolongs battery life. The LP2954 with a fixed 5-V output is available in three-pin TO-220 and DDPAK/TO-263 packages. The adjustable LP2954 is provided in an 8-pin, smalloutline SOIC package. The adjustable version also provides a resistor network which can be pin strapped to set the output to any voltage from to 1.23 V to 29 V. Reverse battery protection is provided for the IN pin. The tight line and load regulation (0.04% typical), as well as very low output temperature coefficient make the LP2954 well suited for use as a low-power voltage reference. 2 Applications • • Output accuracy is ensured at both room temperature and over the entire operating temperature range. High-Efficiency Linear Regulator Low Dropout Battery-Powered Regulator Device Information(1) PART NUMBER LP2954 PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.91 mm DDPAK/TO-263 (3) 10.18 mm × 8.41 mm TO-220 (3) 14.986 mm × 10.16 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic VIN IN OUT VOUT GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 10 7.1 7.2 7.3 7.4 Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 10 10 11 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application ................................................. 13 9 Power Supply Recommendations...................... 17 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 19 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Related Documentation ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 19 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 20 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E Page • Changed "voltage regulator" to "LDO".................................................................................................................................... 1 • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; added top nav icon for TI Designs ....................................................................................................... 1 • Changed RθJA value for DDPAK/TO-263 from "73°C/W" to "44.3°C/W"; TO-220 from "60°C/W" to "80.3°C/W"; SOIC from "160°C/W" to "105.0°C/W". These values were in former FN 3 to Abs Max table......................................................... 4 • Added Power Dissipation ..................................................................................................................................................... 15 • Added Estimating Junction Temperature ............................................................................................................................. 15 Changes from Revision C (March 2013) to Revision D • 2 Page Changed layout of National Semiconductor data sheet to TI format.................................................................................... 18 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 5 Pin Configuration and Functions NDE Package 3-Pin TO-220 Front View KTT Package 3-Pin DDPAK/TO-263 Front View D Package 8-Pin SOIC Top Pin Functions PIN NAME I/O DESCRIPTION NDE KTT D ERROR — — 5 O Error output FEEDBACK — — 7 I Voltage feedback input IN 1 1 8 I Unregulated input voltage GND 2 2 4 — Ground OUT 3 3 1 O Regulated output voltage. This pin requires an output capacitor to maintain stability. See Detailed Design Procedure for output capacitor details SENSE — — 2 I Output voltage sense SHUTDOWN — — 3 I Disable device 5V TAP — — 6 O Internal resistor divider Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 3 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) Input supply voltage Power dissipation (2) MAX UNIT –20 30 V (1) Internally Limited Storage temperature, Tstg (1) MIN –65 150 °C At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heat sink values (if a heat sink is used). If power dissipation causes the junction temperature to exceed specified limits, the device goes into thermal shutdown. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN Operating junction temperature NOM –40 MAX UNIT 125 °C 6.4 Thermal Information LP2954, LP2954A THERMAL METRIC (1) KTT (DDPAK/TO-263) NDE (TO-220) D (SOIC) 3 PINS 3 PINS 8 PINS UNIT RθJA (2) Junction-to-ambient thermal resistance, High-K 44.3 80.3 (3) 105.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.8 38.6 47.3 °C/W RθJB Junction-to-board thermal resistance 23.8 73.1 45.8 °C/W ψJT Junction-to-top characterization parameter 10.6 13.5 6.2 °C/W ψJB Junction-to-board characterization parameter 22.7 73.1 45.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.0 0.9 — °C/W (1) (2) (3) 4 For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. The TO-220 (NDE) package is vertically mounted in center of JEDEC High-K test board (JESD 51-7) with no additional heat sink. This is a through-hole package; this is NOT a surface mount package. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 6.5 Electrical Characteristics Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise noted: TJ = 25°C, VIN = 6 V, IL = 1 mA, CL = 2.2 μF PARAMETER TEST CONDITIONS −40°C to 125°C Output voltage (1) VO ΔVO/ΔT Output voltage temperature See (2), –40°C ≤ TJ ≤ 125°C coefficient ΔVO/VO Line regulation VIN = 6 V to 30 V Load regulation MAX MIN TYP MAX 4.975 5 5.025 4.95 5 5.05 5.06 4.9 4.94 5 4.93 20 0.03% 0.1% 0.03% 0.2% IL = 50 mA VIN – VO Dropout voltage (4) 60 240 310 470 IGND Ground pin current (5) 90 1.1 4.5 (1) (2) (3) (4) (5) Ground pin current at dropout (5) VIN = 4.5 V 310 600 150 2 6 21 28 470 120 170 210 400 mV 600 800 90 150 180 1.1 µA 2 2.5 4.5 6 8 21 33 VIN = 4.5 V –40°C ≤ TJ ≤ 125°C 300 520 8 IL = 250 mA –40°C ≤ TJ ≤ 125°C IGND 400 100 420 2.5 IL = 100 mA –40°C ≤ TJ ≤ 125°C IL = 250 mA 240 180 IL = 50 mA –40°C ≤ TJ ≤ 125°C IL = 100 mA 300 0.2% 150 800 IL = 1 mA –40°C ≤ TJ ≤ 125°C IL = 50 mA 60 520 IL = 250 mA –40°C ≤ TJ ≤ 125°C IL = 1 mA 100 0.2% 0.3% 420 IL = 100 mA –40°C ≤ TJ ≤ 125°C IL = 250 mA 0.04% 150 IL = 50 mA, –40°C ≤ TJ ≤ 125°C IL = 100 mA 0.16% 150 ppm/°C 0.3% 0.2% IL = 1 mA –40°C ≤ TJ ≤ 125°C V 5.12 100 IL = 1 to 250 mA IL = 0.1 to 1 mA –40°C ≤ TJ ≤ 125°C IL = 1 mA 4.88 20 0.04% UNIT 5.1 5 5.07 VIN = 6 V to 30 V –40°C ≤ TJ ≤ 125°C IL = 1 to 250 mA IL = 0.1 to 1 mA (3) LP2954I TYP 1 mA ≤ IL ≤ 250 mA 1 mA ≤ IL ≤ 250 mA −40°C to 125°C ΔVO/VO LP2954AI MIN mA 28 33 120 170 210 µA When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped to ground. Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested separately for load regulation in the load ranges 0.1 mA to 1 mA and 1 mAto 250 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a 1-V differential. GND pin current is the regulator quiescent current. The total current drawn from the source is the sum of the load current plus the GND pin current. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 5 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Electrical Characteristics (continued) Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise noted: TJ = 25°C, VIN = 6 V, IL = 1 mA, CL = 2.2 μF PARAMETER TEST CONDITIONS LP2954AI MIN VO = 0 V LP2954I TYP MAX 380 500 MIN TYP MAX 380 500 ILIMIT Current limit VO = 0 V –40°C ≤ TJ ≤ 125°C ΔVO/ΔPD Thermal regulation See (6) 0.05 IL = 100 mA, CL = 2.2 µF 400 400 IL = 100 mA, CL = 33 µF 260 260 80 80 Output noise 10 Hz to 100 kHz en 530 IL = 100 mA, CL = 33 µF (7) 530 0.2 0.05 0.2 UNIT mA %/W μVRMS ADDITIONAL SPECIFICATIONS FOR THE ADJUSTABLE DEVICE (LP2954AIM and LP2954IM) VREF Reference voltage ΔVREF/ VREF Reference voltage line regulation ΔVREF/ΔT Reference voltage temperature coefficient IB(FB) Feedback pin bias current IGND Ground pin current at shutdown (5) IO(SINK) Output OFF pulldown current See (8) 1.215 See (8) –40°C ≤ TJ ≤ 125°C 1.205 VIN= 2.5 V to VO(NOM) + 1 V 1.23 0.03% VIN= 2.5 V to VO(NOM) +1 V to 30 V (9) (8)–40°C ≤ TJ ≤ 125°C 1.245 1.205 1.255 1.19 0.1% 1.255 1.27 0.03% 0.2% See (2) –40°C ≤ TJ ≤ 125°C –40°C ≤ TJ ≤ 125°C 0.4% ppm/°C 40 20 60 VSHUTDOWN ≤ 1.1 V 105 V 0.2% 20 20 40 60 140 105 See (10) 30 30 (10) 20 20 See –40°C ≤ TJ ≤ 125°C 1.23 140 nA μA mA DROPOUT DETECTION COMPARATOR Output HIGH leakage current IOH VOL Output LOW voltage VOH = 30 V 0.01 VOH = 30 V, –40°C ≤ TJ ≤ 125°C 1 0.01 2 VIN = VO(NOM) − 0.5 V IO(COMP) = 400 μA –40°C ≤ TJ ≤ 125°C 150 2 250 150 400 See VTHR(MAX) Upper threshold voltage See (11) –40°C ≤ TJ ≤ 125°C See (11) VTHR(MIN) HYST (11) Lower threshold voltage See –40°C ≤ TJ ≤ 125°C Hysteresis See (11) –80 –60 –95 –110 –85 1 250 15 mV 400 –35 –80 –25 –95 –55 –110 –40 –160 –60 –35 –25 –85 –40 15 mV –55 (11) –160 µA mV mV (6) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for 200-mA load pulse at VIN = 20 V (3-W pulse) for T = 10 ms. (7) Connect a 0.1-μF capacitor from the OUT pin to the FEEDBACK pin. (8) VREF ≤ VOUT ≤ (VIN − 1 V), 2.3 V ≤ VIN ≤ 30 V, 100 μA ≤ IL≤ 250 mA. (9) Two separate tests are performed, one covering VIN = 2.5 V to VO(NOM) + 1 V and the other test for VIN = 2.5 V to VO(NOM) + 1 V to 30 V. (10) VSHUTDOWN ≤ 1.1 V, VOUT = VO(NOM). (11) Comparator thresholds are expressed in terms of a voltage differential at the FEEDBACK pin below the nominal reference voltage measured at VIN = VO(NOM) + 1 V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain, which is VOUT/VREF = (R1 + R2 ) / R2. 6 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 Electrical Characteristics (continued) Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise noted: TJ = 25°C, VIN = 6 V, IL = 1 mA, CL = 2.2 μF PARAMETER TEST CONDITIONS LP2954AI LP2954I MIN TYP MAX MIN TYP MAX (Referred to VREF) −7.5 ±3 7.5 −7.5 ±3 7.5 (Referred to VREF), –40°C ≤ TJ ≤ 125°C –10 10 –10 VIN(SHUTDOWN) = 0 V to 5 V –30 30 –30 VIN(SHUTDOWN) = 0 V to 5 V, –40°C ≤ TJ ≤ 125°C –50 50 –50 UNIT SHUTDOWN INPUT VOS Input offset voltage HYST Hysteresis IB Input bias current 6 10 10 6 10 mV mV 30 50 nA 6.6 Typical Characteristics Figure 1. Quiescent Current Figure 2. Quiescent Current Figure 3. Ground Pin Current vs Load Figure 4. Ground Pin Current Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 7 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Typical Characteristics (continued) 8 Figure 5. Ground Pin Current Figure 6. Output Noise Voltage Figure 7. Ripple Rejection Figure 8. Ripple Rejection Figure 9. Ripple Rejection Figure 10. Output Impedance Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 Typical Characteristics (continued) Figure 11. Dropout Characteristics Figure 12. Thermal Response Figure 13. Short-Circuit Output Current and Maximum Output Current Figure 14. Maximum Power Dissipation (DDPAK/TO-263) Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 9 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com 7 Detailed Description 7.1 Overview The LP2954 is a 5-V micropower LDO with very low quiescent current (90 μA typical at 1-mA load) and very low dropout voltage (typically 60 mV at light loads and 470 mV at 250-mA load current). 7.2 Functional Block Diagrams Figure 15. LP2954 TO-220 and TO-263 Functional Block Diagram Figure 16. LP2954 SOIC Functional Block Diagram 10 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 7.3 Feature Description 7.3.1 Dropout Voltage The dropout voltage of the regulator is defined as the minimum input-to-output voltage differential required for the output voltage to stay within 100 mV of the output voltage measured with a 1-V differential. The dropout voltages for various values of load current are listed under Electrical Characteristics. If the regulator is powered from a rectified AC source with a capacitive filter, the minimum AC line voltage and maximum load current must be used to calculate the minimum voltage at the input of the regulator. The minimum input voltage, including AC ripple on the filter capacitor, must not drop below the voltage required to keep the LP2954 in regulation. It is also advisable to verify operating at minimum operating ambient temperature, because the increasing ESR of the filter capacitor makes this a worst-case test for dropout voltage due to increased ripple amplitude. 7.3.2 Dropout Detection Comparator This comparator produces a logic LOW whenever the output falls out of regulation by more than about 5%. The 5% value is from the comparators built-in offset of 60 mV divided by the 1.23-V reference. The 5% low trip level remains constant regardless of the programmed output voltage. An out-of-regulation condition can result from low input voltage, current limiting, or thermal limiting. Figure 17 gives a timing diagram showing the relationship between the output voltage, the ERROR output, and input voltage as the input voltage is ramped up and down to a regulator programmed for 5-V output. The ERROR signal becomes low at about 1.3-V input. It goes high at about 5-V input, where the output equals 4.75 V. Because the dropout voltage is load dependent, the input voltage trip points vary with load current. The output voltage trip point does not vary. The comparator has an open-collector output which requires an external pullup resistor. This resistor may be connected to the regulator output or some other supply voltage. Using the regulator output prevents an invalid HIGH on the comparator output which occurs if it is pulled up to an external voltage while the regulator input voltage is reduced below 1.3 V. In selecting a value for the pullup resistor note that, while the output can sink 400 μA, this current adds to battery drain. Suggested values range from 100 kΩ to 1 MΩ. This resistor is not required if the output is unused. When VIN ≤ 1.3 V, the ERROR pin becomes a high impedance, allowing the error flag voltage to rise to its pullup voltage. Using VOUT as the pullup voltage (rather than an external 5-V source) keeps the error flag voltage below 1.2 V (typical) in this condition. The user may wish to divide down the error flag voltage using equal-value resistors (10 kΩ suggested) to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic level during normal operation. * In shutdown mode, ERROR goes high if it has been pulled up to an external supply. To avoid this invalid response, pull up to regulator output. ** Exact value depends on dropout voltage. (See Dropout Voltage) Figure 17. ERROR Output Timing 7.3.3 Output Isolation The regulator output can be left connected to an active voltage source (such as a battery) with the regulator input power turned off, as long as the regulator ground pin is connected to ground. If the ground pin is left floating, damage to the regulator can occur if the output is pulled up by an external voltage source. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 11 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Feature Description (continued) 7.3.4 Reducing Output Noise In reference applications it may be advantageous to reduce the AC noise present on the output. One method is to reduce regulator bandwidth by increasing output capacitance. This is relatively inefficient, because large increases in capacitance are required to get significant improvement. Noise can be reduced more effectively by a bypass capacitor placed across R1 (refer to Figure 19). The formula for selecting the capacitor to be used is: CB = 1 / 2πR1 × 20 Hz (1) This gives a value of about 0.1 μF. When this is used, the output capacitor must be 6.8 μF (or greater) to maintain stability. The 0.1-μF capacitor reduces the high frequency gain of the circuit to unity, lowering the output noise from 260 μV to 80 μV using a 10-Hz to 100-kHz bandwidth. Also, noise is no longer proportional to the output voltage, so improvements are more pronounced at high output voltages. 7.4 Device Functional Modes 7.4.1 Shutdown Input A logic-level signal shuts off the regulator output when a LOW (< 1.2 V) is applied to the SHUTDOWN input. To prevent possible mis-operation, the SHUTDOWN input must be actively terminated. If the input is driven from open-collector logic, a pullup resistor (TI recommends 20 kΩ to 100 kΩ) must be connected from the SHUTDOWN input to the regulator input. If the SHUTDOWN input is driven from a source that actively pulls high and low (like an operational amplifier), the pullup resistor is not required, but may be used. If the shutdown function is not to be used, the cost of the pullup resistor can be saved by simply tying the SHUTDOWN input directly to the regulator input. IMPORTANT: Because the Absolute Maximum Ratings state that the SHUTDOWN input cannot go more than 0.3 V below ground, the reverse-battery protection feature that protects the regulator input is sacrificed if the SHUTDOWN input is tied directly to the regulator input. If reverse-battery protection is required in an application, the pullup resistor between the SHUTDOWN input and the regulator input must be used. The recommended 20 kΩ to 100 kΩ provides adequate protection of the SHUTDOWN pin during negative voltage transitions at the IN pin. 12 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LP2954-N is a linear voltage regulator operating from 2.3 V to 30 V on the input and regulated output voltage of 5 V with typical 0.5% accuracy (LP2954AI) and 250 mA maximum output current. For linear voltage regulator the efficiency is defined by the ratio of output voltage to input voltage (efficiency = VOUT/VIN). To achieve high efficiency, the dropout voltage (VIN – VOUT) must be as small as possible, thus requiring a very low dropout LDO. Successfully implementing an LDO in an application depends on the application requirements. If the requirements are simply input voltage and output voltage, compliance specifications (such as internal power dissipation or stability) must be verified to ensure a solid design. If timing, start-up, noise, PSRR, or any other transient specification is required, the design becomes more challenging. 8.2 Typical Application IN VIN 1 µF OUT GND 5 V OUT 2.2 µF LOAD Figure 18. LP2954 Typical Application 8.2.1 Design Requirements For typical LDO applications, use the parameters listed in Table 1. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage 2.5 V to 30 V Output voltage 1.23 V to 29 V Output current 250 mA (maximum) RMS noise, 10 Hz to100 kHz 260 μVRMS 8.2.2 Detailed Design Procedure 8.2.2.1 External Capacitors A 2.2 μF (or greater) capacitor is required between the OUT pin and GND to assure stability (refer to Figure 20). Without this capacitor, the device may oscillate. Most types of tantalum or aluminum electrolytic capacitors work here. Film-type capacitors work, but are more expensive. Many aluminum electrolytics contain electrolytes which freeze at −30°C, which requires the use of solid tantalums below −25°C. The important parameters of the capacitor are an equivalent series resistance (ESR) of about 5 Ω or less and a resonant frequency above 500 kHz (the ESR may increase by a factor of 20 or 30 as the temperature is reduced from 25°C to −30°C). The value of this capacitor may be increased without limit. At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced to 0.68 μF for currents below 10 mA or 0.22 μF for currents below 1 mA. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 13 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Place a 1-μF capacitor from the IN pin to GND if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery input is used. Programming the output for voltages below 5 V runs the error amplifier at lower gains requiring more output capacitance for stability. At 3.3-V output, a minimum of 4.7 μF is required. For the worst case condition of 1.23-V output and 250 mA of load current, a 6.8-μF (or larger) capacitor must be used. Stray capacitance to the FEEDBACK pin can cause instability. This problem is most likely to appear when using high value external resistors to set the output voltage. Adding a 100-pF capacitor between the OUT and FEEDBACK pins and increasing the output capacitance to 6.8 μF (or greater) solves the problem. 8.2.2.2 Minimum Load When setting the output voltage using an external resistive divider, TI recommends a minimum current of 1 μA through the resistors to provide a minimum load. It should be noted that a minimum load current is specified in several of the electrical characteristic test conditions, so this value must be used to obtain correlation on these tested limits. The part is parametrically tested down to 100 μA, but is functional with no load. 8.2.2.3 Programming The Output Voltage The SOIC version of the LP2954 regulator may be pin strapped for 5-V operation using its internal resistive divider by tying the OUT and SENSE pins together and also tying the FEEDBACK and 5V TAP pins together. Alternatively, it may be programmed for any voltage between the 1.23-V reference and the 30-V maximum rating using an external pair of resistors (see Figure 19). The complete equation for the output voltage is: VOUT = VREF × (1 + R1 / R2) + (IFB × R1) (2) where VREF is the 1.23-V reference and IFB is the FEEDBACK pin bias current (−20 nA typical). The minimum recommended load current of 1 μA sets an upper limit of 1.2 MΩ on the value of R2 in cases where the regulator must work with no load (see Minimum Load). IFB produces a typical 2% error in VOUT which can be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 = 100 kΩ reduces this error to 0.17% while increasing the resistor program current to 12 μA. Because the typical quiescent current is 120 μA, this added current is negligible. *Drive with TTL-low to shutdown Figure 19. Adjustable Regulator 14 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 8.2.2.4 Power Dissipation Knowing the device power dissipation and proper sizing of the thermal plane connected to the tab or pad is critical to ensuring reliable operation. Device power dissipation depends on input voltage, output voltage, and load conditions and can be calculated with Equation 3. PD(MAX) = (VIN(MAX) – VOUT) × IOUT (3) Power dissipation can be minimized, and greater efficiency can be achieved, by using the lowest available voltage drop option that would still be greater than the dropout voltage (VDO). However, keep in mind that higher voltage drops result in better dynamic (that is, PSRR and transient) performance. Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance (RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to Equation 4 or Equation 5: TJ(MAX) = TA(MAX) + (RθJA × PD(MAX)) PD(MAX) = (TJ(MAX) – TA(MAX)) / RθJA (4) (5) Unfortunately, this RθJA is highly dependent on the heat-spreading capability of the particular PCB design, and therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and copperspreading area, and is to be used only as a relative measure of package thermal performance. For a welldesigned thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal resistance (RθJCbot) plus the thermal resistance contribution by the PCB copper area acting as a heat sink. 8.2.2.5 Estimating Junction Temperature The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction temperatures of surface mount devices on a typical PCB board application. These characteristics are not true thermal resistance values, but rather package specific thermal characteristics that offer practical and relative means of estimating junction temperatures. These psi metrics are determined to be significantly independent of copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are used in accordance with Equation 6 or Equation 7. TJ(MAX) = TTOP + (ΨJT × PD(MAX)) where • • PD(MAX) is explained in Equation 5 TTOP is the temperature measured at the center-top of the device package. TJ(MAX) = TBOARD + (ΨJB × PD(MAX)) (6) where • • PD(MAX) is explained in Equation 5. TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the package edge. (7) For more information about the thermal characteristics ΨJT and ΨJB, Semiconductor and IC Package Thermal Metrics; for more information about measuring TTOP and TBOARD, see Using New Thermal Metrics; and for more information about the EIA/JEDEC JESD51 PCB used for validating RθJA, see Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs. These application notes are available at www.ti.com. 8.2.2.6 Heatsinking the TO-220 Package A heat sink may be required with the LP2954IT depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junction temperature must be within the range specified under Recommended Operating Conditions. To determine if a heat sink is required, the maximum power dissipated by the regulator, P(MAX), must be calculated. It is important to remember that if the regulator is powered from a transformer connected to the AC line, the maximum specified AC input voltage must be used (because this produces the maximum DC input voltage to the regulator). Figure 20 shows the voltages and currents that are present in the circuit. The formula for calculating the power dissipated in the regulator is also shown in Figure 20. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 15 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com *See External Capacitors PD = (((VIN – VOUT) × IOUT) + (VIN × IG)) Figure 20. Basic 5-V Regulator Circuit The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is calculated by using the formula: TR(MAX) = TJ(MAX) − TA(MAX) where • • TJ(MAX) is the maximum allowable junction temperature TA(MAX) is the maximum ambient temperature (8) Using the calculated values for TR(MAX) and P(MAX), the required value for junction-to-ambient thermal resistance, RθJA , can now be found: RθJA = TR(MAX) / P(MAX) (9) If the calculated value is 60°C/W or higher , the regulator may be operated without an external heat sink. If the calculated value is below 60°C/W, an external heatsink is required. The required thermal resistance for this heat sink can be calculated using the formula: RθHA = RθJA − RθJC(bot) − RθCH where • • • RθJC(bot) is the junction-to-case thermal resistance, which is specified as 0.9°C/W maximum for the LP2954IT RθCH is the case-to-heat-sink thermal resistance, which is dependent on the interfacing material (if used). For details and typical values in Table 2 and Table 3. Rθ(H-A) is the heatsink-to-ambient thermal resistance. It is this specification (listed on the heat-sink manufacturers data sheet) which defines the effectiveness of the heat sink. The heat sink selected must have a thermal resistance which is equal to or lower than the value of RθHA calculated from the above listed formula. (10) Table 2. Typical Values of Case-To-Heatsink Thermal Resistance (RθCH) (Data from Aavid Engineering) UNIT (C°/W) Silicone grease 1 Dry interface 1.3 Mica with grease 1.4 Table 3. Typical Values Of Case-To-Heatsink Thermal Resistance (RθCH) (Data from Thermalloy) UNIT (C°/W) 16 Thermasil III 1.3 Thermasil II 1.5 Thermalfilm (0.002) with grease 2.2 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 8.2.3 Application Curves Figure 21. Line Transient Response Figure 22. Line Transient Response Figure 23. Load Transient Response Figure 24. Load Transient Response 9 Power Supply Recommendations The LP2954 is designed to operate from a minimum input voltage supply of either 2.5 V or VOUT(NOM) + 1 V, whichever is higher. The maximum input supply voltage is 30 V, but may be limited by thermal dissipation of the selected package. The input voltage range provides adequate headroom in order for the device to have a regulated output. This input supply must be well regulated. If the input supply is noisy, additional input capacitors with low ESR can help. improve the output noise performance. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 17 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com 10 Layout 10.1 Layout Guidelines For best overall performance, place all the circuit components on the same side of the circuit board and as near as practical to the respective LDO pin connections. Place ground return connections to the input and output capacitor, and to the LDO ground pin as close as possible to each other, connected by a wide, component-side, copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and negatively affects system performance. This grounding and layout scheme minimizes inductive parasitic, and thereby reduces load-current transients, minimizes noise, and increases circuit stability. TI also recommends a ground reference plane and is either embedded in the PCB itself or located on the bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output voltage, shield noise, and behaves similar to a thermal plane to spread heat from the LDO device. In most applications, this ground plane is necessary to meet thermal requirements. 10.2 Layout Example Ground IN GND 3 Input Capacitor VIN Output Capacitor OUT 2 1 VOUT Figure 25. LP2954 TO-263 Board Layout Input Capacitor Output Capacitor OUT VIN IN VOUT FEEDBACK SENSE Ground SHUTDOWN 5V TAP GND ERROR Error Pullup Resistor VOUT Figure 26. LP2954 SOIC Board Layout 18 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A LP2954, LP2954A www.ti.com SNVS096E – JUNE 1999 – REVISED JULY 2016 11 Device and Documentation Support 11.1 Related Documentation For additional information, see the following: • Semiconductor and IC Package Thermal Metrics • Using New Thermal Metrics • Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs 11.2 Related Links Table 4 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 4. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LP2954 Click here Click here Click here Click here Click here LP2954A Click here Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A 19 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LP2954 LP2954A PACKAGE OPTION ADDENDUM www.ti.com 29-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP2954AIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LP295 4AIM LP2954AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP295 4AIM LP2954AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP295 4AIM LP2954AIS LIFEBUY DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LP2954AIS LP2954AIS/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954AIS LP2954AISX NRND DDPAK/ TO-263 KTT 3 TBD Call TI Call TI -40 to 125 LP2954AIS LP2954AISX/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954AIS LP2954AIT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP2954AIT LP2954IM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LP29 54IM LP2954IM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP29 54IM LP2954IMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP29 54IM LP2954IS/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954IS LP2954ISX/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP2954IS LP2954IT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP2954IT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Jul-2016 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP2954AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2954AISX/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LP2954IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP2954ISX/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP2954AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LP2954AISX/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LP2954IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LP2954ISX/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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