TSC MBRS2050CT Dual common cathode schottky rectifier Datasheet

MBRS2035CT thru MBRS20150CT
Taiwan Semiconductor
CREAT BY ART
FEATURES
Dual Common Cathode Schottky Rectifier
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
TO-263AB (D2PAK)
Case: TO-263AB (D2PAK)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 1.37 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
MBRS MBRS MBRS MBRS MBRS MBRS MBRS
PARAMETER
SYMBOL
2035
2045
2050
2060
2090
20100 20150
CT
CT
CT
CT
CT
CT
CT
Unit
Maximum repetitive peak reverse voltage
VRRM
35
45
50
60
90
100
150
V
Maximum RMS voltage
VRMS
24
31
35
42
63
70
105
V
Maximum DC blocking voltage
VDC
35
45
50
60
90
100
150
V
Maximum average forward rectified current
IF(AV)
20
A
Peak repetitive forward current
(Rated VR, Square wave, 20KHz)
IFRM
20
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
150
A
Peak repetitive reverse surge current (Note 1)
IRRM
Maximum instantaneous forward voltage (Note 2)
IF=10A, TJ=25℃
IF=10A, TJ=125℃
IF=20A, TJ=25℃
IF=20A, TJ=125℃
Maximum reverse current @ rated VR
TJ=25 ℃
TJ=125 ℃
VF
IR
Voltage rate of change (Rated VR)
dV/dt
Typical thermal resistance
RθJC
Operating junction temperature range
Storage temperature range
1
0.5
A
0.65
0.80
0.85
0.99
0.57
0.70
0.75
0.87
0.84
0.95
0.95
1.23
0.72
0.85
0.85
1.10
0.1
15
10
5
10000
1.5
V
mA
V/μs
2
O
C/W
TJ
- 55 to +150
O
C
TSTG
- 55 to +150
O
C
Note 1: tp = 2.0 μs, 1.0KHz
Note 2: Pulse test with PW=300μs, 1% duty cycle
Document Number: D1307008
Version: J13
MBRS2035CT thru MBRS20150CT
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
PACKING CODE
GREEN COMPOUND
QUALIFIED
MBRS20xxCT
(Note 1)
PACKAGE
PACKING
D2PAK
800 / 13" Paper reel
CODE
RN
Prefix "H"
Suffix "G"
C0
2
50 / Tube
D PAK
Note 1: "xx" defines voltage from 35V (MBRS2035CT) to 150V (MBRS20150CT)
EXAMPLE
AEC-Q101
PREFERRED P/N
PART NO.
MBRS2060CT RN
MBRS2060CT
RN
MBRS2060CT RNG
MBRS2060CT
RN
MBRS2060CTHRN
MBRS2060CT
QUALIFIED
PACKING CODE
H
GREEN COMPOUND
DESCRIPTION
CODE
G
Green compound
RN
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD A
CURRENT (A)
20
15
10
5
RESISTIVE OR
INDUCTIVELOAD
0
50
60
70
80
90
100
110
120
CASE TEMPERATURE
130
140
150
PEAK FORWARD SURGE CURRENT (A)
25
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT PER LEG
150
100
75
50
25
0
1
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
PER LEG
100
INSTANTANEOUS REVERSE A
CURRENT (mA)
INSTANTANEOUS FORWARD A
CURRENT (A)
Pulse Width=300μs
1% Duty Cycle
TJ=125℃
TJ=25℃
1
MBRS2035CT-2045CT
MBRS2050CT-2060CT
MBRS2090CT-20150CT
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
FORWARD VOLTAGE (V)
1
MBRS2035CT-2045CT
MBRS2050CT-20150CT
10
TJ=125℃
1
0.1
TJ=75℃
0.01
0.01
0
100
NUMBER OF CYCLES AT 60 Hz
100
0.1
10
(oC)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
PER LEG
10
8.3ms Single Half Sine Wave
JEDEC Method
125
1.1 1.2
TJ=25℃
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Document Number: D1307008
Version: J13
MBRS2035CT thru MBRS20150CT
Taiwan Semiconductor
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
PER LEG
100
f=1.0MHz
Vsig=50mVp-p
TRANSIENT THERMAL
IMPEDANCE (℃/W)
JUNCTION CAPACITANCE (pF) A
10000
FIG. 5 TYPICAL JUNCTION CAPACITANCE PER
LEG
10
1000
MBRS2035CT-2045CT
MBRS2050CT-20150CT
1
0.1
100
0.1
1
10
0.01
100
0.1
1
10
100
T-PULSE DURATION(s)
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
-
10.5
-
0.413
B
14.60
15.88
0.575
0.625
C
2.41
2.67
0.095
0.105
D
0.68
0.94
0.027
0.037
E
2.29
2.79
0.090
0.110
F
4.44
4.70
0.175
0.185
G
1.14
1.40
0.045
0.055
H
1.14
1.40
0.045
0.055
I
8.25
9.25
0.325
0.364
J
0.36
0.53
0.014
0.021
K
2.03
2.79
0.080
0.110
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
10.8
0.425
B
8.3
0.327
C
1.1
0.043
D
3.5
0.138
E
16.9
0.665
F
9.5
0.374
G
2.5
0.098
MARKING DIAGRAM
P/N
= Specific Device Code
G
= Green Compound
YWW
= Date Code
F
= Factory Code
Document Number: D1307008
Version: J13
MBRS2035CT thru MBRS20150CT
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: D1307008
Version: J13
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