Lineage Power ESTW015A0F Estw015a0f series (eighth-brick) dc-dc converter power module Datasheet

Data Sheet
May 6, 2011
ESTW015A0F Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output Current
STINGRAY™ SERIES
Features

Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)

Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)

Delivers up to 15A Output current

High efficiency 91% at full load (Vin=48Vdc)

Full load at TA=85 C for airflow of 1 m/s(200 LFM)
or greater

o

Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Wide input voltage range: 36-75 Vdc
Applications

Tightly regulated output

Distributed power architectures

Constant switching frequency

Wireless networks

Positive remote On/Off logic

Access and optical network Equipment

Input under voltage protection

Enterprise Networks including Power over Ethernet
(PoE)

Output overcurrent and overvoltage protection

Over-temperature protection

Remote sense

Output Voltage adjust: 80% to 110% of Vo,nom

Wide operating temperature range (-40°C to 85°C)

UL* 60950-1, 2 Ed. Recognized, CSA C22.2 No.
‡
nd
60950-1-07 Certified, and VDE (EN60950-1, 2
Ed.) Licensed
RoHS Compliant

Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
†
nd

Negative Remote On/Off logic (-1 option,
preferred/standard)

Surface Mount version (-S option)

CE mark meets 2006/95/EC directive

Auto-restart (-4 option, preferred/standard)


Trimmed leads (-6 or -8 options)
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1

2250 Vdc Isolation tested in compliance with IEEE
¤
802.3 PoE standards

ISO 9001 and ISO 14001 certified manufacturing
facilities
§
**
Description
The Lineage Power® Stingray™ Series, ESTW015A0F, Eighth-brick power modules are cost optimized isolated dc-dc
converters that can deliver up to 15A of output current and provide a precisely regulated output voltage over a wide range of
input voltages (Vin = 36 -75Vdc). The module achieves full load efficiency of 91% at 3.3Vdc output voltage. The open frame
modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost- and
space-efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage,
overcurrent and overtemperature protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
‡
Document No: DS09-004 ver.1.03
PDF name: ESTW015A0F.pdf
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
Continuous
All
VIN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
All
TA
-40
85
°C
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All
2250
Vdc
Operating Ambient Temperature
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Operating Input Voltage
Maximum Input Current
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current
Device
Symbol
Min
Typ
Max
Unit
All
VIN
36
48
75
Vdc
All
IIN,max
2.0
Adc
All
IIN,No load
30
IIN,stand-by
6
All
(VIN = VIN, nom, module disabled)
I2t
mA
8
mA
1
A2s
Inrush Transient
All
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All
30
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
VO, set
3.25
3.3
3.35
Vdc
All
VO
3.2
3.4
Vdc
±0.1
10
% VO, set
mV
% VO, set
Nominal Output Voltage Set-point
VIN=VIN, nom, IO=IO, max, TA=25°C)
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
Load (IO=IO, min to IO, max)
Temperature (Tref=TA, min to TA, max)
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
All
All
±0.2
All
8
20
mVrms
All
40
75
mVpk-pk
External Capacitance
All
CO, max
0
5,000
μF
Output Current
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of VO, set)
Output Short-Circuit Current (VO≤250mV)
( Hiccup Mode)
Efficiency
All
Io
0
15.0
Adc
All
IO, lim
19
Adc
All
IO, s/c
60
2.5
Apk
AAVG
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set
All
η
90.0
91.0
%
VIN= VIN, nom, TA=25°C, IO=10A , VO= VO,set
All
η
90.0
91.0
%
VIN= VIN, nom, TA=25°C, IO=4A , VO= VO,set
All
η
85.5
87.0
%
All
fsw
355
kHz
All
Vpk
210
mV
All
ts
200
s
Device
Symbol
Isolation Capacitance
All
Ciso
Isolation Resistance
All
Riso
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All
Device
Symbol
Switching Frequency
Dynamic Load Response
(dIo/dt=0.1A/ s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
Settling Time (Vo<10% peak deviation)
Isolation Specifications
Parameter
Min
Typ
Max
Unit
1000
pF
MΩ
10
2250
Vdc
General Specifications
Parameter
Min
Typ
Max
Unit
9
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All
FIT
212.2
10 /Hours
All
MTBF
4,713,305
Hours
Weight
All
LINEAGE POWER
15.2
(0.6)
g
(oz.)
3
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (Von/off = -0.7 Vdc)
All
Ion/off
0.15
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7
0.6
Vdc
Logic High Voltage (Ion/off = 0Adc)
All
Von/off
2.4
15.0
Vdc
Logic High maximum leakage current
All
Ion/off
25
μA
Case 1: Input power is applied for >1 second and then
the On/Off input is set to ON (Tdelay = time from instant
On/Off signal is ON until VO = 10% of VO, set)
All
Tdelay
―
12
―
msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay = time
at which VIN = VIN, min until Vo=10% of VO,set)
All
Tdelay
―
20
―
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
4
―
msec
―
5
% VO, set
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Output voltage overshoot – Startup
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
All
Remote Sense Range
All
Output Voltage Adjustment Range
All
Output Overvoltage Protection (CO=220μF)
All
VO, limit
Overtemperature Protection – Hiccup Auto Restart
All
Tref
Input Undervoltage Lockout
All
VUVLO
VSENSE
10
% VO, set
-20
+10
% VO, set
3.9
5.0
Vdc
Turn-on Threshold
Turn-off Threshold
Hysteresis
O
138
32
34.5
C
Vdc
27.5
30
Vdc
1
2
Vdc
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts following
either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back
to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay,
will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second.
LINEAGE POWER
4
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Characteristic Curves
o
VO (V) (200mV/div)
Io(A) (5A/div)
EFFICIENCY,
(%)
OUTPUT CURRENT OUTPUT VOLTAGE
The following figures provide typical characteristics for the ESTW015A0F (3.3V, 15A) at 25 C. The figures are
identical for either positive or negative remote On/Off logic.
OUTPUT CURRENT, IO (A)
OUTPUT VOLTAGE
VOn/Off (V) (1V/div)
VO (V) (2V/div)
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
On/Off VOLTAGE
VO (V) (20mV/div)
OUTPUT VOLTAGE
Figure 1. Converter Efficiency versus Output Current.
TIME, t (200µs/div)
TIME, t (10ms/div)
TIME, t (2 s/div)
TIME, t (200µs/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load.
LINEAGE POWER
OUTPUT VOLTAGE
VIN (V) (1V/div)
VO (V) (20V/div
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
INPUT VOLTAGE
VO (V) (200mV/div)
Io(A) (5A/div)
OUTPUT CURRENT OUTPUT VOLTAGE
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max).
TIME, t (5ms/div)
Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
5
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Test Configurations
Design Considerations
Input Filtering
CURRENT PROBE
TO OSCILLOSCOPE
LTEST
Vin+
BATTERY
12μH
CS
220μF
33μF
E.S.R.<0.1
@ 20°C 100kHz
Safety Considerations
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
COPPER STRIP
VO (+)
RESISTIVE
LOAD
SCOPE
V O (–)
0.01uF 0.1uF 10uF
GROUND PLANE
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 8. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact
Rcontact
Vin+
Rdistribution
RLOAD
VO
Rcontact
Rcontact
Vin-
Rdistribution
Vout+
VIN
Rdistribution
Vout-
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
VO. IO
Efficiency
=
LINEAGE POWER
VIN. IIN
x
100 %
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:

The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.

One VIN pin and one VOUT pin are to be grounded,
or both the input and output pins are to be kept
floating.

The input pins of the module are not operator
accessible.

Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
6
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
SENSE(+)
SENSE(–)
SUPPLY
Vin+
Vout+
VI(+)
VO(+)
VI(-)
VO(–)
II
CONTACT
RESISTANCE
IO
LOAD
CONTACT AND
DISTRIBUTION LOSSES
Ion/off
ON/OFF
TRIM
Von/off
Input Undervoltage Lockout
Vin-
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is -0.7V ≤ Von/off ≤ 0.6V. The maximum Ion/off during
a logic low is 0.15mA, the switch should maintain a
logic low level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 2.4V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
LINEAGE POWER
Figure 11. Circuit Configuration for remote
sense .
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under overtemperature fault
conditions, the unit is equipped with a thermal
shutdown circuit. The unit will shutdown if the thermal
o
reference points Trefx (Figure 13), exceed 138 C
(typical). However, the thermal shutdown is not
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module restarts
automatically after the unit cools down below the
overtemperature protection thresholds.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current limiting circuitry and can endure current
limiting continuously. At the point of current limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
7
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Feature Descriptions (continued)
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (Figure 12).
Rtrim
5.11 Vo, set (100
up
Where
1.225
%
Vdesired Vo, set
Vo, set
VO(+)
Rtrim-up
ON/OFF
LOAD
VOTRIM
Rtrim-down
VIN(-)
VO(-)
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
Rtrim
Where
%
511
10.22
%
100
For example, to trim-up the output voltage of the
module by 5% to 3.465V, Rtrim-up is calculated is as
follows:
%
Rtrim
up
5.11 3.3 (100
1.225 5
Rtrim
VIN(+)
%)
%
up
5
5)
511
10.22
5
176.7
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output voltage
of the module can be increased. Therefore, for the
same output current, this would increase the output
power of the module. Care should be taken to ensure
that the maximum output power of the module
remains at or below the maximum rated power
(Maximum rated power = VO,set x IO,max).
511
10.22
%
down
Vo, set Vdesired
Vo, set
100
For example, to trim-down the output voltage of the
module by 8% to 3.036V, Rtrim-down is calculated as
follows:
% 8
Rtrim
down
Rtrim
511
10.22
8
down
53.655
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
LINEAGE POWER
8
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Thermal Considerations
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
the thermal aspects including maximum device
temperatures.
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Trefx used in the
specifications for open frame modules are shown in
Figure 13. For reliable operation Tref1 and Tref2
o
temperatures should not exceed 125 C and Tref3
o
temperature should not exceed 110 C.
Figure 13. Tref Temperature Measurement
Location for Open Frame Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves, showing the
maximum output current that can be delivered by
the module versus local ambient temperature (TA)
for natural convection and up to 1m/s (200 ft./min)
forced airflow, are shown in Figure 14. Full power up
o
to TA=85 C, is achieved for airflow of 1 m/s(200 LFM)
or greater.
OUTPUT CURRENT, IO (A)
16
15
NC
14
0.5m/s
(100LFM)
13
1.0m/s
(200LFM)
12
11
10
20
30
40
50
60
70
80
90
o
AMBIENT TEMEPERATURE, TA ( C)
Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
LINEAGE POWER
9
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Surface Mount Information
The ESTW015A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
o
temperatures of up to 300 C. The label also carries
product information such as product code, serial
number and the location of manufacture.
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP ( C)
Pick and Place
Figure 15. Pick and Place Location.
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Figure 16. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX TEMP SOLDER ( C)
Nozzle Recommendations
REFLOW TIME (S)
Tin Lead Soldering
o
The ESTW015A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
o
o
235 C. Typically, the eutectic solder melts at 183 C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
LINEAGE POWER
Figure 17. Time Limit Curve Above 205 C for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the ESTW015A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Reflow Soldering Information
The surface mountable modules in the
ESTW015A0F-S family use our newest SMT
technology called “Column Pin” (CP) connectors.
10
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Surface Mount Information (continued)
Figure 18 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
ESTW Board
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Solder Ball
End assembly PCB
Figure 18. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
o
o
at 183 C (Sn/Pb solder) or 217-218 C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 19.
MSL Rating
The ESTW015A0F modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
LINEAGE POWER
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
Reflow Temp (°C)
Insulator
200
* Min. Time Above 235°C
15 Seconds
150
Heating Zone
1°C/Second
Cooling
Zone
*Time Above 217°C
60 Seconds
100
50
0
Reflow Time (Seconds)
Figure 19. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
11
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
EMC Considerations
The filter circuit schematic and plots in Figure 20 shows a suggested configuration as tested to meet the conducted
emission limits of EN55022 Class A.
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested
parts based on the end application.
VCC
RTN
L1
+
C1
C2 C3
-48V
+
DC/DC
C6
LOAD
GND
C4
C5
GND
LISN connected to L Line
LISN connected to N Line
Figure 20. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
LINEAGE POWER
12
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
0.5 mm [x.xx in.
0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
*For optional pin lengths, see Table 2, Device Options
Bottom
View
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
13
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
0.5 mm [x.xx in.
0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
Top
View*
Side
View
Bottom
View
Pin
1
2
3
4
5
6
7
8
LINEAGE POWER
Function
Vi(+)
ON/OFF
Vi(-)
Vo(-)
SENSE(-)
TRIM
SENSE(+)
Vo(+)
14
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm
x.xx mm
0.5 mm [x.xx in.
0.02 in.] (Unless otherwise indicated)
0.25 mm [x.xxx in
0.010 in.]
SMT Recommended Pad Layout (Component Side View)
TH Recommended Pad Layout (Component Side View)
LINEAGE POWER
15
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Packaging Details
The surface mount versions of the ESTW015A0F
modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 21. The tray has
external dimensions of 135.1mm(W) x 321.8mm(L) x
12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).
Tray Specification
Material
Antistatic coated PVC
Max surface resistivity
Color
Capacity
Min order quantity
10
/sq
Clear
12 power modules
48 pcs (1 box of 4 full trays)
12
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 21. Surface Mount Packaging Tray.
LINEAGE POWER
16
Data Sheet
May 6, 2011
ESTW015A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 15A Output
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes
Input Voltage
Output
Voltage
Output
Current
On/Off
Logic
Connector
Type
ESTW015A0F61
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158093
ESTW015A0F641
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158102
ESTW015A0F41Z
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109158085
ESTW015A0F641-Z
48V (36-75Vdc)
3.3V
15A
Negative
Through hole
CC109159942
ESTW015A0F41-SZ
48V (36-75Vdc)
3.3V
15A
Negative
Surface Mount
CC109159422
Comcodes
Table 2. Device Options
Document No: DS09-004 ver.1.03
PDF name: ESTW015A0F.pdf