Material Content Data Sheet Sales Product Name BFR 35AP E6327 MA# MA000933852 Package PG-SOT23-3-11 Issued Weight* Construction Element Material Group Substances chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material plastics inorganic material non noble metal noble metal < 10% silicon chromium silicon titanium copper gold carbon black brominated resin antimonytrioxide epoxy resin silicondioxide tin silver wire encapsulation leadfinish plating *deviation 29. August 2013 CAS# if applicable Weight [mg] 7440-21-3 7440-47-3 7440-21-3 7440-32-6 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 8.79 mg Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 0.17 1746 1746 0.015 0.17 0.008 0.09 0.001 0.01 62 0.003 0.03 309 2.704 30.77 30.90 307688 308986 0.008 0.10 0.10 962 962 0.058 0.66 0.087 0.99 9902 0.116 1.32 13202 1.247 14.19 4.293 48.85 66.01 488490 660121 0.150 1.70 1.70 17026 17026 0.098 1.12 1.12 11159 927 6601 141926 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 11159 1000000