Power Supply IC Series for TFT-LCD Panels 5V Input Multi-channel System Power Supply IC BD8179MUV No.09035EBT04 ●Description The BD8179MUV is a system power supply IC for TFT panels. A 1-chip IC providing a total of three voltages required for TFT panels, i.e., source voltage, gate high-level, and gate low-level voltage, thus constructing a TFT panel power supply with minimal components required. ●Features 1) Step Up DC/DC Converter. 2) Incorporates 18V, 3.0A N-channel FET 3) Linear-Regulator Controllers for VGON and VGOFF 4) 5 channel Operational Amplifiers/±150mA Output Short-Circuit Current 40V / µs Slew Rate 5) Switching Frequency: 1200 kHz. 6) Gate Shading Function Included. 7) Protection Circuits 8) Over Current Protection 9) Timer Latch Mode Short Current Protection. 10) Thermal Shut Down. 11) Under Voltage Protection. 12) Over Voltage Protection 13) VQFN032V5050 Package ●Applications Liquid crystal TV, PC monitor, and TFT-LCD panel ●Absolute maximum ratings (Ta = 25℃) Parameter Power Supply Voltage VMAIN Voltage SUP Voltage DRVP Voltage DRVN Voltage SRC Voltage CTL Voltage Junction Temperature Power Dissipation Operating Temperature Range Storage Temperature Range Symbol Limit Unit VIN VMAIN VSUP VDRVP VDRVN VSRC VCTL Tjmax Pd Topr Tstg 7 20 20 40 -30 40 7 150 4560 -40～85 -55～150 V V V V V V V ℃ mW ℃ ℃ * Reduced by 19.52 mW/℃ over 25℃, when mounted on a glass epoxy board. (4-layer 74.2 mm 74.2 mm 1.6 mm). ●Operating Condition Parameter Power Supply Voltage VMAIN Voltage SUP Voltage DRVP Voltage DRVN Voltage SRC Voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Limit Symbol Min. 2.6 8 - VIN VMAIN VSUP VDRVP VDRVN VSRC 1/12 Max. 5.5 18 18 38 -20 38 Unit V V V V V V 2009.07 - Rev.B Technical Note BD8179MUV ●Electrical Characteristics (Unless otherwise specified, VIN = 3.3V; VSUP = 12 V; VGON = 25 V; VGOFF = -6V; Ta = 25℃) 1 DC/DC CONVERTER CONTROLLER BLOCK Limit Parameter Symbol Unit Conditions Min. Typ. Max. [ ERROR AMPLIFIER BLOCK ] FB Input Bias Current IFB - 0.1 - µA Feed Back Voltage VFB 1.221 1.233 1.245 V Buffer, No load Comp Sink Current Ioi 1 5 10 µA VFB=1.5V VCOMP=0.5V Comp Source Current Ioo -10 -5 -1 µA VFB=1.0V VCOMP=0.5V [ LX BLOCK ] LX ON-Resistance Ron - 200 - mΩ LX Leak Current Ileak - 0 10 µA MAX Duty Cycle DMAX - 90 - % LX Current Limit ILX 2.5 - - A 3.25 - ms VLX=18V [ INTERNAL SOFT START BLOCK ] Soft Start Delay Time tss 2. GATE-ON LINEAR REGULATOR CONTROLLER Parameter Symbol Limit Unit Min. Typ. Max. 1.275 V FBP Voltage VFBP 1.225 1.25 FBP Input Bias Current IFBP - 0.1 - µA 5 10 mA DRVP Current Limit IDRVP 1 3. GATE-OFF LINEAR REGULATOR CONTROLLER Parameter FBN Voltage FBN Input Bias Current Symbol VFBN Limit Min. Typ. Max. 0.235 0.25 0.265 Unit IFBN - 0.1 - µA IDRVN 1 5 10 mA Parameter Symbol Input Offset Voltage Input Range DRIVE Current Voff Typ. Max. - 0 - Unit mV VRANGE 0 VSUP V Idrv 50 - - mA - 40 - V/us Slew Rate SR 5. GATE SHADING CONTROLLER BLOCK Parameter Limit Symbol Limit Min. Typ. Max. Unit DEL Start Period tdd - 15 - ms DEL Source Current Idls -8 -5 -2 µA DEL Threshold Voltage Vdls 1.2 1.25 1.3 V CTL Input Low Voltage Vctll - - VIN x 0.3 V CTL Input High Voltage Vchlh VIN x 0.7 - - V Ictl 8 16.5 25 µA SRC ON Resistance RonSRC - 5 - Ω DRN ON Resistance RonDRV - 30 - Ω CTL Input Current Conditions V DRVN Current Limit 4. OPERATIONAL AMPLIFIERS Min. Conditions Conditions VPOS1～5 = 6V Conditions VCTL=3.3V This product is not designed for protection against radioactive rays. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/12 2009.07 - Rev.B Technical Note BD8179MUV ●Electrical Characteristics (Unless otherwise specified, VIN = 3.3V; VSUP = 12 V; VGON = 25 V; VGOFF = -6V; Ta = 25℃) 6. WHOLE DEVICE Limit Parameter Symbol Unit Conditions Min. Typ. Max. [ REFERENCE BLOCK ] Reference Voltage VREF 1.231 1.25 1.269 V FOSC 1020 1200 1380 kHz 2.25 2.4 2.55 V 18 19 20 V Tscp - 150 - ms VFB OFF Threshold Voltage Vthfb 0.9 1.0 1.1 V VFBP OFF Threshold Voltage Vthfbp 0.9 1.0 1.1 V VFBN OFF Threshold Voltage Vthfpn 0.4 0.5 0.6 V [ OSCILLATION BLOCK ] Oscillation Frequency [ VIN UNDER VOLTAGE LOCK OUT BLOCK ] Detect Voltage Vuvlo [ SUP OVER VOLTAGE LOCK OUT BLOCK ] Detect Voltage Vovp [ SHORT CURRENT PROTECTION BLOCK ] Fault Delay Time [ DETECTOR BLOCK ] This product is not designed for protection against radio active rays. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/12 2009.07 - Rev.B Technical Note BD8179MUV ●Reference Data (Unless otherwise specified, Ta = 25℃, VIN=5V) 1000 2 3 2.5 100 Frequency[MHz] IIN (mA) 2 1.5 1 DELAY TIME [ms] 1.5 1 1 0.5 0.5 0 0 1 2 3 4 5 6 0.1 0 7 -40 VIN (V) 10 0.001 60 0.01 Ta[℃] 94 1 92 0.8 90 0.6 ⊿VMAIN[%] 86 84 82 1 Fig.3 Delay Time vs Capacitor VIMAIN 0.4 88 0.1 DEL CAPACITOR [uF] Fig.2 Switching Frequency vs Temperature Fig.1 Supply Current (No switching) efficency[%] 10 LX 0.2 0 -0.2 0 100 200 300 400 500 -0.4 80 -0.6 78 -0.8 -1 76 0 100 200 300 400 500 Io[mA] Io[mA] 1 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 0 20 40 60 80 100 ⊿VGL[%] ⊿VGH[%] 1 0.8 -0.2 Fig.6 Over Voltage Protect waveform Fig.5 VMAIN Voltage Load Regulation Fig.4 Efficiency vs Output Current (VMAIN) COM 0 -0.2 -0.4 -0.4 -0.6 -0.6 -0.8 -0.8 0 20 40 60 80 100 CTL -1 -1 Io[mA] Io[mA] Fig.7 Gate-ON Voltage Load Regulation IN Fig.8 Gate-OFF Voltage Load Regulation IN OUT IN OUT OUT IN OUT 300Ω 300Ω 100pF 100pF Fig.10 AMP Slew Rate (Rise) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Fig.9 Gate Shading Output waveform Fig.11 AMP Slew Rate (Fall) 4/12 Fig.12 Start Up Sequence waveform 2009.07 - Rev.B Technical Note BD8179MUV ●Pin Assignments Diagram ●Block Diagram VCP POS5 VMAIN OUT4 NEG5 OUT5 LX IN VIN FB COMP VCN LX IN 24 23 22 21 20 19 18 17 FBP 25 16 NEG4 DRVP 26 15 POS4 FBN 27 14 SUP DRVN 28 13 OUT3 DEL 29 12 POS3 GATE-ON CTL 30 11 BGND CONTROLLER DRN 31 10 POS2 COM 32 9 NEG2 1 2 3 4 5 6 7 8 SRC REF AGND PGND OUT1 NEG1 POS1 OUT2 BD8179MUV FB STEP-UP CONTROLLER COMP PGND AGND VCP DRVP VGON FBP SRC DEL GATE SHADING COM CONTROLLER CTL VCN DRN DRVN GATE-OFF VGOFF CONTROLLER SUP FBN NEG1 OUT1 － OP1 REF REF ＋ POS1 NEG2 OUT2 NEG4 － OP2 POS4 ＋ － OP3 OUT2 OUT4 － OP4 ＋ POS2 ＋ NEG5 OP5 ＋ － POS3 BGND OUT5 POS5 ●Pin Assignments PIN NO. Pin Name PIN NO. Pin Name 1 SRC Highside Input for Gate Shading switch 17 OUT4 Operational Amplifier 4 Output 2 REF Reference for VGOFF 18 POS5 Operational Amplifier 5 Noninverting Input 3 AGND Ground 19 NEG5 Operational Amplifier 5 Inverting Input 4 PGND Power Ground 20 OUT5 Operational Amplifier 5 Output 5 OUT1 Operational Amplifier 1 Output 21 LX Nch Power MOS FET Drain and Switching Node 6 NEG1 Operational Amplifier 1 Inverting Input 22 IN Power Supply voltage Input 7 POS1 Operational Amplifier 1 Noninverting Input 23 FB Feedback Input for step up DC/DC 8 OUT2 Operational Amplifier 2 Output 24 9 NEG2 Operational Amplifier 2 Inverting Input 25 FBP 10 POS2 Operational Amplifier 2 Noninverting Input 26 DRVP 11 BGND Ground 27 FBN 12 POS3 Operational Amplifier 3 Noninverting Input 28 DRVN 13 OUT3 Operational Amplifier 3 Output 29 DEL Delay Input for Gate Shading 14 SUP Power Supply voltage Input for operational Amplifier 30 CTL Switch Control Input for Gate Shading 15 POS4 Operational Amplifier 4 Noninverting Input 31 DRN Lowside Input for Gate Shading switch 16 NEG4 Operational Amplifier 4 Inverting Input 32 COM Gate Shading Output Function www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/12 Function COMP Error Amplifier Compensation Point for step up DC/DC Feedback Input for Gate-ON Linear-Regulator Gate-ON Linear-Regulator Base Drive Feedback Input for Gate-OFF Linear-Regulator Gate-OFF Linear-Regulator Base Drive 2009.07 - Rev.B Technical Note BD8179MUV ●Block Function Step-up Controller A controller circuit for DC/DC boosting. The switching duty is controlled so that the feedback voltage FB is set to 1.233 V (typ.). A soft start operates at the time of starting. Gate-on Controller A controller circuit for the positive-side charge pump. The liner regulator controls so that the feedback voltage FBP will be set to 1.25 V (typ.). Gate-off Controller A controller circuit for the negative-side charge pump. The liner regulator controls so that the feedback voltage FBN will be set to 0.25 V (Typ.). Gate Shading Controller A controller circuit for MOS FET Switch The COM switching synchronize with CTL input. Start-up Controller A control circuit for the starting sequence. Controls to start in order of VCC VMAIN VGOFF/VGONVCOM REF A block that generates internal reference voltage. 1.25V (Typ.) is output. TSD/UVLO/OVP Thermal shutdown/Under-voltage lockout protection/circuit blocks. The thermal shutdown circuit is shut down at an IC internal temperature of 175°C and reactivate at 160°C. The under-voltage lockout protection circuit shuts down the IC when the VIN is 2.4 V (typ.) or below. The over-voltage lockout protection circuit shuts down the IC when the SUP is 19.0 V (typ.) or over. OP1～OP5 Operational amplifier block ●Starting sequence ① VIN ② ③ ④ 2.4 VMAIN VGON 3.25ms VGON/VGOFF VGOFF 15ms 1.25V VDEL VCOM ①UVLO released when VIN voltage reaches 2.4V ②Step up DCDC converter starts switching, and VGON and VGOFF starts. ③VDEL starts. ④VCOM ON when VDEL reaches 1.25V www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/12 2009.07 - Rev.B Technical Note BD8179MUV ●Under Voltage Lock Out (UVLO) The UVLO circuit compares the input voltage at IN with the UVLO threshold (2.4V rising, 2.2V falling, typ) to ensure the input voltage is high enough for reliable operation. The 200mV (typ) hysteresis prevents supply transients from causing a restart. Once the input voltage exceeds the UVLO rising threshold, startup begins. When the input voltage falls below the UVLO falling threshold, the controller turns off the main step-up regulator, turns off the linear-regulator outputs, and disables the Gate Shading controller. ●Thermal Shut Down (TSD) The TSD prevents excessive power dissipation from overheating the BD8179MUV. When the junction temperature exceeds Tj=175℃(Typ), a thermal sensor immediately activates. The fault protection, which shuts down all outputs except the reference, allowing the device to cool down. Once the device cools down by approximately 15℃ reactivate the device. ●Over Voltage Protection (OVP) The Step up DC/DC converter has OVP circuit. The OVP circuit compares the input Voltage at SUP with the OVP threshold (19V rising, 18.5V falling, Typ) to protect the step up DC/DC output exceed the absolute maximum voltage. Once the SUP Voltage exceeds the OVP rising threshold, turn off the main Step-up regulator. Then, the SUP Voltage falls bellow the OVP falling threshold,reactivate the main Step-Up regulator. ●Over Current Protection (OCP) The Step-Up DC/DC converter, linear-regulator and Operational Amplifier have OCP circuit respectively. The OCP circuit restricts to load current, when an OCP activated, one’s own output only restricted. However, if the output continue to overload, the device is possible to activate thermal shutdown or short current protection. ●Timer Latch Mode Short Current Protection (SCP) BD8179MUV has SCP circuit feature to prevent the large current flowing when the output is shorted to GND. This function is monitoring VMAIN, VGON, and VGOFF Voltage and starts the timer when at least one of the outputs operating properly (when the output voltage was lower than expected). After 150ms (Typ.) of this abnormal state, the device will shutdown the all outputs and latch the state. VMAIN FB ＋ － VGON FBP ＋ － 150ms typ Counter all outputs shut down. reset VGOFF FBN － ＋ Fig.13 SCP Block Diagram www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/12 2009.07 - Rev.B Technical Note BD8179MUV ●Selecting Application Components (1) Setting the Output L Constant The coil to use for output is decided by the rating current ILR and input current maximum value IINMAX of the coil. IINMAX + ∆IL should not reach the rating value level IL VCC ILR IINMAX average current L IL Vo Co Fig.14 Coil Current Waveform Fig. 15 Output Application Circuit Diagram Adjust so that IINMAX +∆IL does not reach the rating current value ILR. At this time, ∆IL can be obtained by the following equation. 1 Vcc Vo-Vcc 1 ΔIL = [A] Here, f is the switching frequency. L Vcc f Set with sufficient margin because the coil value may have the dispersion of 30%. If the coil current exceeds the rating current ILR of the coil, it may damage the IC internal element. BD8179MUV uses the current mode DC/DC converter control and has the optimized design at the coil value. A coil inductance (L) of 4.7 µH to 15 µH is recommended from viewpoints of electric power efficiency, response, and stability. (2) Output Capacity Settings For the capacitor to use for the output, select the capacitor which has the larger value in the ripple voltage VPP allowance value and the drop voltage allowance value at the time of sudden load change. Output ripple voltage is decided by the following equation. 1 Vcc ⊿IL = ILMAX RESR + (ILMAX ) [V] Here, f is the switching frequency. ⊿VPP fCo Vo 2 Perform setting so that the voltage is within the allowable ripple voltage range. For the drop voltage during sudden load change; VDR, please perform the rough calculation by the following equation. ⊿I VDR = 10 us [V] Co However, 10 µs is the rough calculation value of the DC/DC response speed. Please set the capacitance considering the sufficient margin so that these two values are within the standard value range. (3) Selecting the Input Capacitor Since the peak current flows between the input and output at the DC/DC converter, a capacitor is required to install at the input side. For the reason, the low ESR capacitor is recommended as an input capacitor which has the value more than 10 µF and less than 100 mΩ. If a capacitor out of this range is selected, the excessive ripple voltage is superposed on the input voltage, accordingly it may cause the malfunction of IC. However these conditions may vary according to the load current, input voltage, output voltage, inductance and switching frequency. Be sure to perform the margin check using the actual product. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/12 2009.07 - Rev.B Technical Note BD8179MUV (4) Setting RC, CC of the Phase Compensation Circuit In the current mode control, since the coil current is controlled, a pole (phase lag) made by the CR filter composed of the output capacitor and load resistor will be created in the low frequency range, and a zero (phase lead) by the output capacitor and ESR of capacitor will be created in the high frequency range. In this case, to cancel the pole of the power amplifier, it is easy to compensate by adding the zero point with CC and RC to the output from the error amp as shown in the illustration. Open loop gain characteristics Fp = fp(Min) A fp(Max) Gain fz(ESR) = 0 [dB] fz(ESR) 0 Phase [deg] [Hz] 1 [Hz] 2π ESR CO Pole at the power amplification stage When the output current reduces, the load resistance Ro increases and the pole frequency lowers. lOUTMin lOUTMax 1 2 π RO CO fp(Min) = -90 1 [Hz]←at light load 2 R OMax C O 1 fz(Max) = Error amp phase compensation characteristics [Hz]←at heavy load 2 R OMin C O A Zero at the power amplification stage When the output capacitor is set larger, the pole frequency lowers but the zero frequency will not change. (This is because the capacitor ESR becomes 1/2 when the capacitor becomes 2 times.) Gain [dB] 0 Phase [deg] 0 -90 fp(Amp.) = Fig. 16 Gain vs Phase L VCC Rc ESR SW COMP 2 Rc Cc [Hz] Vo Vcc,PVcc Cin 1 Ro Co GND,PGND Cc Fig. 17 Application Circuit Diagram It is possible to realize the stable feedback loop by canceling the pole fp(Min.), which is created by the output capacitor and load resistor, with CR zero compensation of the error amp as shown below. fz(Amp.) = fp(Min.) 1 2 π Rc Cc www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. - 1 2π Romax C 9/12 [Hz] 2009.07 - Rev.B Technical Note BD8179MUV (5) Design of the Feedback Resistor Constant Refer to the following equation to set the feedback resistor. As the setting range, 10 kΩ to 330 kΩ is recommended. If the resistor is set lower than a 10 kΩ, it causes the reduction of power efficiency. If it is set more than 330 kΩ, the offset voltage becomes larger by the input bias current 0.4 µA(Typ.) in the internal error amplifier. VMAIN = R1 + R2 R2 Reference voltage 1.233 V 1.233 Vo [V] R1 ＋ ERR 23 － FB R2 (6) Positive-side Charge Pump Settings BD8179MUV incorporates a charge pump controller, thus making it possible to generate stable gate voltage. The output voltage is determined by the following formula. As the setting range, 10 kΩ to 330 kΩ is recommended. If the resistor is set lower than a 10kΩ, it causes the reduction of power efficiency. If it is set more than 330 kΩ, the offset voltage becomes larger by the input bias current 0.4 µA (Typ.) in the internal error amp. VGON = R3 + R4 R4 VGON 1.25 Reference voltage 1.25 V [V] C3 R3 ＋ 25 1000 pF to 4700 pF R4 FBP ERR － In order to prevent output voltage overshooting, add capacitor C3 in parallel with R3. The recommended capacitance is 1000 pF to 4700 pF. If a capacitor outside this range is inserted, the output voltage may oscillate. By connecting capacitance to the DEL, a rising delay time can be set for the positive-side charge pump. The delay time is determined by the following formula. Delay time of charge pump block t DELAY t DELAY = ( CDEL 1.25 )/5 µA [s] Where, CDEL is the external capacitance. (7) Negative-side Charge Pump Settings BD8179MUV incorporates a charge pump controller for negative voltage, thus making it possible to generate stable gate voltage. The output voltage is determined by the following formula. As the setting range, 10 kΩ to 330 kΩ is recommended. If the resistor is set lower than a 10 kΩ, it causes the reduction of power efficiency. If it is set more than 330 kΩ, the offset voltage becomes larger by the input bias current 0.4 µA (Typ.) in the internal error amp. VGOFF C5 VGOFF = - R5 R6 1.0 + 0.25 V 0.25 V R5 1000 pF to 4700 pF [V] R6 － 27 FBN ERR ＋ 2 REF 1.25 V The delay time is internally fixed at 200 us. In order to prevent output voltage overshooting, insert capacitor C5 in parallel with R5. The recommended capacitance is 1000 pF to 4700 pF. If a capacitor outside this range is inserted, the output voltage may oscillate. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10/12 2009.07 - Rev.B Technical Note BD8179MUV ●Notes for use 1) Absolute maximum ratings Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) GND potential Ensure a minimum GND pin potential in all operating conditions. 3) Setting of heat Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin short and mistake fitting Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the presence of a foreign object may result in damage to the IC. 5) Actions in strong magnetic field Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction. 6) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. 7) Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns of any external components. ～ ～ (Pin B) C E B ～ ～ (Pin A) ～ ～ 8) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements.For example, when the resistors and transistors are connected to the pins as shown in Fig. 18, a parasitic diode or a transistor operates by inversing the pin voltage and GND voltage. The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements, such as the application of voltages lower than the GND (P board) voltage to Resistor Transistor (NPN) (Pin B) input and output pins. B GND N N N Parasitic elements P＋ N N (Pin A) P substrate Parasitic element GND P P＋ ～ ～ P+ N P GND N P P+ Parasitic elements C E Parasitic element GND Fig.18 Example of a Simple Monolithic IC Architecture GND 9) Overcurrent protection circuits An overcurrent protection circuit designed according to the output current is incorporated for the prevention of IC destruction that may result in the event of load shorting. This protection circuit is effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. 10) Thermal shutdown circuit This IC incorporates a built-in thermal shutdown circuit for the protection from thermal destruction. The IC should be used within the specified power dissipation range. However, in the event that the IC continues to be operated in excess of its power dissipation limits, the attendant rise in the chip's temperature Tj will trigger the thermal shutdown circuit to turn off all output power elements. The circuit automatically resets once the chip's temperature Tj drops. Operation of the thermal shutdown circuit presumes that the IC's absolute maximum ratings have been exceeded. Application designs should never make use of the thermal shutdown circuit. 11) Testing on application boards At the time of inspection of the installation boards, when the capacitor is connected to the pin with low impedance, be sure to discharge electricity per process because it may load stresses to the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting or storing the IC. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/12 2009.07 - Rev.B Technical Note BD8179MUV ●Ordering part number B D 8 Part No. 1 7 9 Part No. M U V - Package MUV:VQFN032V5050 E 2 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 <Tape and Reel information> 5.0 ± 0.1 5.0±0.1 1.0MAX 3.4±0.1 0.4 ± 0.1 1 8 9 32 16 25 24 0.75 0.5 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold ) (0.22) ( reel on the left hand and you pull out the tape on the right hand 3.4 ± 0.1 +0.03 0.02 -0.02 S C0.2 Embossed carrier tape Quantity Direction of feed 1PIN MARK 0.08 S Tape 17 +0.05 0.25 -0.04 1pin (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 12/12 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.07 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A