HLMP-N305, HLMP-NG0x, HLMP-NL06 T-1 (3 mm) Auto Insertable LED Lamps Data Sheet Description Features This family of 3 mm LED Lamps is capable of withstanding automatic insertion and wave soldering processes. • T-1 (3 mm) auto-insertable package Designed with a thick epoxy flange and soft leadframe material, it is ideal for clinch and cut operations. • Tinted non-diffused lens Applications • Available colors: Red, Amber and Yellow • General purpose • Available with straight or formed lead tape and reel options • High volume manufacturing • High brightness light output • Wide viewing angle Device Selection Guide High Brightness Lamps Part Number Color Package lens Luminous Intensity, Min. Iv @ 20 mA Viewing Angle, 2θ1/2 Package Drawing HLMP-NG05 AlInGaP Red Micro-tinted 90.2 45° A HLMP-NG07 AlInGaP Red Micro-tinted 90.2 60° B HLMP-NL06 AlInGaP Amber Micro-tinted 96.2 60° B Part Number Color Package lens Luminous Intensity, Min. Iv @ 10 mA Viewing Angle, 2θ1/2 Package Drawing HLMP-N305 GaP Yellow Tinted 14.7 45° A High Efficiency Lamps Note: 1. 2θ1/2 is the off axis angle where the luminous intensity is 1/2 the on axis intensity. Package Dimensions Package Drawing “A” SEATING PLANE 23.0 (0.91) 5.9 ± 0.5 (0.23 ± 0.02) 1.0 ± 0.5 (0.04 ± 0.02) 3.5 ± 0.3 (0.14 ± 0.01) CATHODE MARKS 0.65 (0.03) MAX. 0.4 ± 0.2 (0.02 ± 0.01) 4.4 ± 0.3 3.1 ± 0.2 (0.17 ± 0.01) (0.12 ± 0.01) 2.5 ± 0.3 (0.10 ± 0.01) 0.4 ± 0.2 (0.01 ± 0.01) + 0.1 0.4 0 + 0.00 (0.2 - 0.00 ) 0.45 ± 0.10 (0.02 ± 0.007) 2.0 (0.08) REF. 3.4 0.2 (0.13 0.01) Package Drawing “B” 1.0 MIN. 23.0 MIN. 5.70 ± 0.5 3.50 ± 0.30 CATHODE FLAT 0.65 MAX. CATHODE LEAD 3.80 ± 0.30 3.10 ± 0.20 0.44 ± 0.2 2.54 ± 0.3 0.8 MAX. EPOXY MENISCUS + 0.1 0.4 – 0 2.0 3.60 NOTES: Notes: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 1. All dimensions are in millimeters (inches). 2. LEADS ARE MILD STEEL. SOLDER COATED. 2. Leads are mild steel withMENISCUS tin plating. 3. EPOXY OF 0.8 mm (0.03 in.) MAXIMUM MAY EXTEND TO THE LEADS. 3. Epoxy meniscus of 0.8 mm (0.03 in.) Maximum may extend to the leads. 4. For PCB hole recommendations, see the Precautions section. Part Numbering System HLMP - N x xx # xxx Mechanical Option 002: Tape & Reel, Straight Leads Viewing Angle Options 05: 45 Degree 06, 07: 60 Degree Color Options 3: GaP Yellow G: AlInGaP Red L: AlInGaP Amber 2 Absolute Maximum Ratings at TA = 25 ºC AlInGaP Parameter Yellow Amber & Red Units DC Forward Current[1] 20 mA Reverse Voltage (Ir = 100 µA) 5 V Junction Temperature, Tjmax 110 °C Storage Temperature Range -40 to +85 °C Operating Temperature Range -20 to +85 °C 30[2,3] -40 to +85 Notes: 1. See Figure 4 for maximum current derating vs. ambient temperature. 2. Suggested minimum DC current: 10 mA. 3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average. Electrical Characteristics at TA = 25ºC Forward Voltage Vf (Volts) Capacitance C (pF) , Vf = 0, f = 1 MHz Thermal Resistance RθJ-PIN Speed of Response τs (ns) Time Constant e-t/τs Part Number Typ. Max. If (mA) Typ. (°C/W) Typ. HLMP-N305 2.00 2.6 10 15 290 90 HLMP-NL06[1] 2.02 2.4 20 40 240 20 HLMP-NG0x[1] 1.90 2.4 20 40 240 20 Note: 1. Please contact your Avago Sales Representative about operating currents below 10 mA. Optical Characteristics at TA = 25 ºC Typ. Dominant Typ. Spectral Luminous Intensity [1] Typ. Peak Wavelength [2] Half Width Part Number Min. (mcd) If (mA) Wavelength (nm) (nm) (nm) Luminous Efficacy [3] (lm/W) HLMP-NG05 90.2 20 635 626 17 150 HLMP-NG07 90.2 20 635 626 17 150 HLMP-NL06 96.2 20 592 590 17 480 HLMP-N305 14.7 10 583 585 36 500 Notes: 1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device. 3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/hv, where lv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3 HIGH BRIGHTNESS LAMPS 1 AlInGaP AMBER 0.9 AlInGaP RED RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 WAVELENGTH – nm 650 700 HIGH EFFICIENCY LAMPS RELATIVE INTENSITY 1.0 0.5 YELLOW 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative intensity vs. peak wavelength. HIGH BRIGHTNESS LAMPS 50 HIGH EFFICIENCY LAMPS 90 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 80 40 30 AlInGaP RED 20 AlInGaP AMBER 10 70 60 50 YELLOW 40 30 20 10 0 0 0.5 1.0 1.5 2.0 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 4 2.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 VF – FORWARD VOLTAGE – V 3.5 4.0 HIGH BRIGHTNESS LAMPS 2.0 YELLOW 4.0 1.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 10 mA) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 3.5 AlInGaP 1.0 0.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 40 30 IF – DC FORWARD CURRENT – mA AlInGaP IF – FORWARD CURRENT – mA 35 30 25 RqJA = 500° C/W 20 RqJA = 650° C/W RqJA = 750° C/W 15 10 5 0 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward DC current vs. ambient temperature. 5 0 5 10 15 20 IDC – DC CURRENT PER LED – mA Figure 3. Relative luminous intensity vs. forward current. 40 0 25 30 1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES Figure 5. Representative spatial radiation pattern for 45° viewing angle. 1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 ANGULAR DISPLACEMENT – DEGREES Figure 6. Representative spatial radiation pattern for 60° viewing angle. 6 Intensity Bin Limits Amber Color Bin Limits Bin Intensity Range (mcd) Min. Max. (nm at 20 mA) H 13.8 27.6 Bin Name Min. Max. 1 584.5 587.0 I 22.0 44.0 2 587.0 589.5 J 35.2 70.4 4 589.5 592.0 K 56.4 112.8 6 592.0 594.5 L 90.2 180.4 M 138.0 276.0 N 200.0 400.0 O 290.0 580.0 Red/Orange P 500.0 1000.0 /Red-Orange Q 700.0 1400.0 R 1000.0 2000.0 S 1400.0 2800.0 T 2000.0 4000.0 U 2900.0 5800.0 V 4200.0 8400.0 W 6000.0 12000.0 X 8700.0 17400.0 Y 12600.0 25200.0 Z 18200.0 36400.0 G 14.7 29.4 H 23.5 47.0 I 37.6 75.2 J 60.1 120.2 K 96.2 192.4 L 147.0 294.0 M 212.0 424.0 N 300.0 600.0 O 450.0 900.0 P 700.0 1400.0 Q 1000.0 2000.0 R 1600.0 3200.0 S 2600.0 5200.0 T 4000.0 8000.0 U 6500.0 13000.0 V 10000.0 20000.0 W 16000.0 30000.0 Color Yellow/Amber Maximum tolerance for each bin limit is ±18%. 7 Tolerance for each bin limit is ±0.5 nm. Color Categories Color Yellow Category # Lambda (nm) Min. Max. 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Tolerance for each bin limit is ±0.5 nm. Taping Options Straight Lead Option #002 #2CA #2CD Dimension “B” – – – Dimension “H” 20.5 ± 1.0 (0.81 ± 0.04) 18.0 ± 1.0 (0.71 ± 0.04) 20.5 ± 1.0 (0.81 ± 0.04) Formed Lead Option #2UK #2UL #2UM #2UN #2UP #2UQ #2UR Dimension “B” 12.0 ± 1.0 (0.47 ± 0.04) 9.0 ± 1.0 (0.35 ± 0.04) 10.0 ± 1.0 (0.39 ± 0.04) 11.0 ± 1.0 (0.43 ± 0.04) 13.0 ± 1.0 (0.51 ± 0.04) 14.0 ± 1.0 (0.55 ± 0.04) 15.0 ± 1.0 (0.59 ± 0.04) Dimension “H” Units: mm (inches) 8 16.0 ± 1.0 (0.63 ± 0.04) Tape Outline Drawing 6.4 ± 1.3 (0.25 ± 0.05) 0.0 ± 1.0 (0.00 ± 0.04) 12.7 ± 1.0 (0.50 ± 0.04) CATHODE LEAD 5.1 ± 0.7 (0.20 ± 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 ± 1.0 (0.71 ± 0.04) 14.0 ± 1.7 (0.55 ± 0.07) 11.0 MAX. (0.43) 9.1 ± 0.6 (0.36 ± 0.03) 2.5 ± 0.3 (0.10 ± 0.01) 12.7 ± 0.3 (0.50 ± 0.01) A A ∅ 4.0 ± 0.2 TYP. (0.16 ± 0.01) VIEW A–A 0.7 ± 0.2 (0.03 ± 0.01) Straight Lead 6.4 ± 1.3 (0.25 ± 0.05) 0.0 ± 1.0 (0.00 ± 0.04) 12.7 ± 1.0 (0.50 ± 0.04) CATHODE LEAD DIMENSION "B" (SEE TABLE) 3.9 ± 0.7 (0.15 ± 0.03) DIMENSION "H" (SEE TABLE) 2.5 (0.10) MAX. 18.0 ± 1.0 (0.71 ± 0.04) 14.0 ± 1.7 (0.55 ± 0.07) 11.0 MAX. (0.43) 9.1 ± 0.6 (0.36 ± 0.03) 2.5 ± 0.3 (0.10 ± 0.01) 12.7 ± 0.3 (0.50 ± 0.01) 0.7 ± 0.2 (0.03 ± 0.01) Formed Lead Note: Dimension in mm (inches). 9 A A VIEW A–A ∅ 4.0 ± 0.2 TYP. (0.16 ± 0.01) Recommended Assembly Condition Package Options Lead Option Ammo Pack (1000 pcs.) Tape & Reel (2000 pcs.) Straight Lead #2C — #002 Formed Lead #2U — – AMMO PACK (for All options except #002) • A single-sided phenolic printed circuit board (PCB) is preferred. Double-sided PCB and other materials may cause greater lead stress. Recommended throughhole diameter is 0.98 to 1.08 mm. Leadlength below the PCB should be 1.5 to 2.0 mm, and the clinching angle (angle between the lead and PCB) should be 30 ±10 degrees. • If SMT devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are auto-inserted. If curing must be done after lamp insertion, the cure temperature and time should not exceed 140°C, 100 seconds. This is the temperature of the surface normal to the IR source. TAPE & REEL (for option #002 only) REELING ORIENTATION CLOCKWISE ADHESIVE TAPE MUST BE FACING TOWARDS THE OUTSIDE OF THE REEL. ANODE LEAD LEAVES THE REEL FIRST. 110 (4.33) DIA. 336 (13.23) DIA. DIMENSIONS IN MILLIMETERS (INCHES). PROTECTIVE CARDBOARD Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: LED Component Lead Size Diagonal Plated Through -Hole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Wave Soldering Dipping Manual Solder Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dambar shearoff area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Dwell Time 3 sec Max. 5 sec Max. Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shearoff area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Note: Refer to application note AN1027 for more information on soldering LED components. TURBULENT WAVE TEMPERATURE – °C 250 LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 PREHEAT 0 10 20 30 40 50 60 TIME – SECONDS 70 80 90 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. Figure 7. Recommended wave soldering profile. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4257EN AV02-1014EN - July 14, 2014