HLMP-CBxx, HLMP-CMxx Precision Optical Performance Blue and Green Data Sheet Description Features This high intensity blue and green LEDs are based on the most efficient and cost effective InGaN material technology. This LED lamps is untinted and non-diffused, T1 ¾ packages incorporating second-generation optics producing well defined spatial radiation patterns at specific viewing cone angles. • Well defined spatial radiation pattern These lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. • Superior resistance to moisture Package Dimensions • Front panel indicator 1.14 ± 0.20 (0.045 ± 0.008) 0.70 (0.028) MAX. 31.60 (1.244) MIN. 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) PACKAGE DIMENSION A • Standoff or non-standoff leads Applications • Traffic signals • Commercial outdoor advertising • Front panel backlighting 1.14 ± 0.20 (0.045 ± 0.008) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 (1.244) MIN. CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) • Viewing angle: 15º, 23º and 30º 8.71 ± 0.20 (0.343 ± 0.008) d 2.35 (0.093) MAX. CATHODE LEAD • Untinted, Non-diffused 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) • High luminous output 1.00 MIN. (0.039) CATHODE FLAT 0.70 (0.028) MAX. 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) PACKAGE DIMENSION B HLMP-Cx14 HLMP-Cx25 HLMP-Cx35 d = 12.6 ± 0.25 d = 12.52 ± 0.25 d = 11.96 ± 0.25 Notes: (0.496 ± 0.010) (0.493 ± 0.010) (0.471 ± 0.010) 1. Measured just above flange. 2. All dimensions are in millimeters (inches). 3. Epoxy meniscus may extend about 1mm (0.040”) down the leads. Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN 1142 for details. Device Selection Guide Part Number Color Typical Viewing Angle, 2���� θ��� ½ (Degree) �������� HLMP-CB13-UX0xx Blue HLMP-CB14-UX0xx Intensity (mcd) at 20 mA Min. Max. Leads with Stand-Offs 15º 3200 9300 No Blue 15º 3200 9300 Yes HLMP-CB22-SV0xx Blue 23º 1900 5500 No HLMP-CB25-SV0xx Blue 23º 1900 5500 Yes HLMP-CB34-RU0xx Blue 30º 1500 4200 No HLMP-CB35-RU0xx Blue 30º 1500 4200 Yes HLMP-CM13-Z30xx Green 15º 12000 35000 No HLMP-CM14-Z30xx Green 15º 12000 35000 Yes HLMP-CM22-X10xx Green 23º 7200 21000 No HLMP-CM25-X10xx Green 23º 7200 21000 Yes HLMP-CM34-X10xx Green 30º 7200 21000 No HLMP-CM35-X10xx Green 30º 7200 21000 Yes Notes: 1. Tolerance for luminous intensity measurement is ±15% 2. The optical axis is closely aligned with the package mechanical axis. 3. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. 4. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity. Part Numbering System HLMP - x x xx - x x x xx Packaging Option DD: Ammopacks Color Bin Selection 0 : Full Distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 13: 15º without standoff 14: 15º with standoff 22: 23º without standoff 25: 23º with standoff 34: 30º without standoff 35: 30º with standoff Color B: Blue 470nm M: Green 525nm Package C: 5mm round Lamps Note: Please refer to AB 5337 for complete information on part numbering system. Absolute Maximum Rating (TA = 25��� °�� C) Parameters Value Unit DC forward current [1] 30 mA Peak pulsed forward current [2] 100 mA Power dissipation 116 mW LED junction temperature 110 °C Operating temperature range -40 to +85 °C Storage temperature range -40 to +100 °C Notes: 1. Derate linearly as shown in figure 2. 2. Duty factor 10%, frequency 1KHz. Electrical/Optical Characteristics (TA = 25°C) Blue and Green Parameters Symbol Min Typ Max Units Test Condition Forward Voltage VF 2.8 3.2 3.8 V IF = 20 mA Reverse Voltage[1] VR 5.0 V IR = 10 µA Thermal resistance RθJ-PIN °C/W LED Junction to cathode lead Dominant wavelength [2] Blue Green λd nm IF = 20 mA Peak wavelength Blue Green λPEAK nm Peak of wavelength of spectral distribution at IF = 20 mA Spectral half width Blue Green Dλ1/2 Luminous Efficacy [3] Blue Green ηv Luminous Flux Blue ���� Green ����� φV Luminous Efficiency[4] Blue ���� Green ����� ηe 240 460 520 470 525 480 540 464 516 Wavelength width at spectral distribution 1/2 power point at IF = 20 mA 22 35 lm/W Emitted luminous power/Emitted radiant power mlm If = 20mA lm/W Luminous Flux/Electrical Power at IF = 20mA 78 545 830 3500 13 56 Notes: 1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA 2. The dominant wavelength λd is derived from the Chromaticy Diagram and represents the color pf the lamp. 3. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 4. ηe = φV / IF x VF where φV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. Blue RELATIVE INTENSITY 0.9 Green 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 1. Relative Intensity vs. Wavelength IF max. - MAXIMUM FORWARD CURRENT - mA 1.0 25 20 15 10 5 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 16 DOMINANT WAVELENGTH - nm 30 FORWARD CURRENT - m 30 Figure 2. Forward Current vs. Ambient Temperature 35 25 20 15 10 5 14 12 10 8 Green 6 Blue 4 2 0 -2 0 -4 0 1 2 3 4 Figure 3. Forward Current vs. Forward Voltage RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 5 10 15 20 25 DC FORWARD CURRENT - mA Figure 5. Relative Intensity vs. DC Forward Current 5 10 15 20 25 Figure 4. Relative Dominant Wavelength vs. DC Forward Current 1.6 0 0 FORWARD CURRENT - mA FORWARD VOLTAGE - V 35 30 35 30 35 1 0.9 0.8 0.8 0.7 0.7 RELATIVE INTENSITY RELATIVE INTENSITY 1 0.9 0.6 0.5 0.4 0.3 0.4 0.3 0.2 0.1 0.1 0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 30 60 90 -90 -60 -30 0 120 150 180 ANGULAR DISPLACEMENT - DEGREES Figure 8. Spatial Radiation Pattern for 30° lamps Note: All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information 30 ANGULAR DISPLACEMENT - DEGREES Figure 7. Spatial Radiation Pattern for 23° lamps Figure 6. Spatial Radiation Pattern for 15° lamps RELATIVE INTENSITY 0.5 0.2 0 0.6 60 90 Intensity Bin Limit Table Green Color Bin Table Intensity (mcd) at 20 mA Bin Min Dom Max Dom Xmin Ymin Bin Min Max 1 520.0 0.0743 0.8338 0.1856 0.6556 R 1500 1900 0.1650 0.6586 0.1060 0.8292 S 1900 2500 0.1060 0.8292 0.2068 0.6463 T 2500 3200 0.1856 0.6556 0.1387 0.8148 U 3200 4200 0.1387 0.8148 0.2273 0.6344 V 4200 5500 0.2068 0.6463 0.1702 0.7965 W 5500 7200 0.1702 0.7965 0.2469 0.6213 X 7200 9300 0.2273 0.6344 0.2003 0.7764 Y 9300 12000 0.2003 0.7764 0.2659 0.6070 Z 12000 16000 0.2469 0.6213 0.2296 0.7543 1 16000 21000 2 21000 27000 3 27000 35000 2 3 4 5 524.0 528.0 532.0 536.0 524.0 528.0 532.0 536.0 540.0 Blue Color Bin Table Bin Min Dom Max Dom 1 460.0 2 464.0 3 468.0 4 472.0 5 476.0 464.0 468.0 472.0 476.0 480.0 Xmin Ymin Xmax 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is ± 0.5nm Relative Light Output vs. Junction Temperature RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 10 Green Blue 1 -40 -20 0 20 40 60 T J - JUNCTION TEMPERATURE- °C Ymax Tolerance for each bin limit is ± 0.5nm Tolerance for each bin limit is +/- 15% 0.1 Xmax 80 100 120 Ymax Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED configuration CATHODE ANDOE Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. AlInGaP Device InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to Application Note 5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.807±0.039 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 A 0.70±0.20 0.0276±0.0079 A ∅4.00±0.20TYP. 0.1575±0.008 VIEW A-A Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff. Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE� FACING UPWARDS. LABEL ON THIS SIDE OF BOX ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-0678EN - November 21, 2008