CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 D D D D D D D D D D Function and Pinout Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels 3-State Outputs CY54FCT573T – 32-mA Output Sink Current – 12-mA Output Source Current CY74FCT573T – 64-mA Output Sink Current – 32-mA Output Source Current CY54FCT573T . . . D PACKAGE CY74FCT573T . . . P, Q, OR SO PACKAGE (TOP VIEW) OE D0 D1 D2 D3 D4 D5 D6 D7 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O0 O1 O2 O3 O4 O5 O6 O7 LE description The ’FCT573T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE) input is low. When OE is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches. The ’FCT573T devices are identical to the ’FCT373T devices, except for the flow-through pinout of the ’FCT573T, which simplifies board design. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 ORDERING INFORMATION QSOP – Q ORDERABLE PART NUMBER TOP-SIDE MARKING Tape and reel 4.7 CY74FCT573CTQCT Tube 4.7 CY74FCT573CTSOC Tape and reel 4.7 CY74FCT573CTSOCT DIP – P Tube 5.2 CY74FCT573ATPC CY74FCT573ATPC QSOP – Q Tape and reel 5.2 CY74FCT573ATQCT FCT573A Tube 5.2 CY74FCT573ATSOC Tape and reel 5.2 CY74FCT573ATSOCT Tape and reel 8 CY74FCT573TQCT Tube 8 CY74FCT573TSOC Tape and reel 8 CY74FCT573TSOCT SOIC – SO –40°C 40°C to 85°C SPEED (ns) PACKAGE† TA SOIC – SO QSOP – Q SOIC – SO FCT573C FCT573C FCT573A FCT573 FCT573 –55°C to 125°C CDIP – D Tube 8.5 CY54FCT573ATLMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OE LE D OUTPUT O L H H H L H L L L L X Q0 H X X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state, Qn = Previous state of flip flops (Qn–1) logic diagram (positive logic) OE LE 1 11 CP D0 2 D Q To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 19 O0 CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) CY54FCT573T CY74FCT573T MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current –12 –32 mA IOL TA Low-level output current 32 64 mA 85 °C High-level input voltage 2 Operating free-air temperature –55 2 125 –40 V V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT573T TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC = 4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 IOZH VCC = 5.5 V, VCC = 5.25 V, VOUT = 2.7 V VOUT = 2.7 V 10 IOZL VCC = 5.5 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0.5 V –10 IOS‡ VCC = 5.5 V, VCC = 5.25 V, VOUT = 0 V VOUT = 0 V VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VIN ≤ 0.2 V, ∆ICC ICCD¶ 0.3 3.3 0.55 IOL = 64 mA 0.3 0.2 0.55 0.2 ±1 ±1 10 –10 –120 –225 –60 –120 ±1 VIN ≥ VCC – 0.2 V VIN ≥ VCC – 0.2 V 0.1 VCC = 5.25 V, VIN ≤ 0.2 V, VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.5 VCC = 5.5 V, Outputs open, One input switching at 50% duty cycle, OE = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.06 V V 5 –60 V V 2 IOH = –15 mA IOL = 32 mA VCC = 4.5 V, VCC = 4.75 V, ICC –1.2 UNIT 3.3 VOL Ioff CY74FCT573T TYP† MAX MIN –225 ±1 0.2 0.1 0.2 0.5 2 2 µA µA µA µA µA mA µA mA mA 0.12 mA/ MHz VCC = 5.25 V, Outputs open, One input switching at 50% duty cycle, OE = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.06 0.12 † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER CY54FCT573T TYP† MAX TEST CONDITIONS 5V VCC = 5 5.5 V, Outputs open,, OE = GND, LE = VCC IC# VCC = 5 5.25 25 V V, Outputs open,, OE = GND, LE = VCC One bit switching at f1 = 10 MHz at 50% duty cycle Eight bits switching at f1 = 2.5 MHz at 50% duty cycle One bit switching at f1 = 10 MHz at 50% duty cycle Eight bits switching at f1 = 2.5 MHz at 50% duty cycle MIN VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| CY74FCT573T TYP† MAX MIN UNIT mA VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| Ci 6 10 6 10 pF Co 8 12 8 12 pF † Typical values are at VCC = 5 V, TA = 25°C. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) CY54FCT573T MIN MAX CY54FCT573AT MIN MAX UNIT tw tsu Pulse duration, LE high 6 6 ns Setup time, data before LE↑ 2 2 ns th Hold time, data after LE↑ 1.5 1.5 ns timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) CY74FCT573T MIN MAX CY74FCT573AT MIN MAX CY74FCT573CT MIN MAX UNIT tw tsu Pulse duration, LE high 6 5 5 ns Setup time, data before LE↑ 2 2 2 ns th Hold time, data after LE↑ 1.5 1.5 1.5 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPLH tPHL LE O tPZH tPZL OE O tPHZ tPLZ OE O CY54FCT573AT MIN MAX 1.5 5.6 1.5 5.6 2 9.8 2 9.8 1.5 7.5 1.5 7.5 1.5 6.5 1.5 6.5 UNIT ns ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) 6 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPLH tPHL LE O tPZH tPZL OE O tPHZ tPLZ OE O POST OFFICE BOX 655303 CY74FCT573T CY74FCT573AT CY74FCT573CT MIN MAX MIN MAX MIN MAX 1.5 8 1.5 5.2 1.5 4.7 1.5 8 1.5 5.2 1.5 4.7 2 13 2 8.5 2 5.5 2 13 2 8.5 2 5.5 1.5 12 1.5 6.5 1.5 5.5 1.5 12 1.5 6.5 1.5 5.5 1.5 7.5 1.5 5.5 1.5 5 1.5 7.5 1.5 5.5 1.5 5 • DALLAS, TEXAS 75265 UNIT ns ns ns ns CY54FCT573T, CY74FCT573T 8-BIT LATCHES WITH 3-STATE OUTPUTS SCCS068 – OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-9223801MRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9223801MR A 5962-9223802M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629223802M2A CY54FCT 573ATLMB CY54FCT573ATLMB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629223802M2A CY54FCT 573ATLMB CY74FCT573ATPC ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 CY74FCT573ATPC CY74FCT573ATQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT573A CY74FCT573ATQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT573A CY74FCT573ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT573A CY74FCT573ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT573A CY74FCT573CTQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT573C CY74FCT573CTQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT573C CY74FCT573CTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT573C CY74FCT573CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT573C CY74FCT573TQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT573 CY74FCT573TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 FCT573 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT573ATQCT Package Package Pins Type Drawing SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT573ATSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 CY74FCT573CTQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT573TQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT573ATQCT SSOP DBQ 20 2500 367.0 367.0 38.0 CY74FCT573ATSOCT SOIC DW 20 2000 367.0 367.0 45.0 CY74FCT573CTQCT SSOP DBQ 20 2500 367.0 367.0 38.0 CY74FCT573TQCT SSOP DBQ 20 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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