NCP706 1 A, 1% Precision Very Low Dropout Voltage Regulator with Enable The NCP706 is a Very Low Dropout Regulator which provides up to 1 A of load current and maintains excellent output voltage accuracy of 1% including line, load and temperature variations. The operating input voltage range from 2.4 V up to 5.5 V makes this device suitable for Li−ion battery powered products as well as post−regulation applications. The product is available in 2.1 V, 2.2 V, 2.95 V, 3.0 V and 3.3 V fixed output voltage options. NCP706 is fully protected against overheating and output short circuit. Very small 8−pin XDFN8 1.6 x 1.2, 04P package makes the device especially suitable for space constrained portable applications such as tablets and smartphones. Features • Operating Input Voltage Range: 2.4 V to 5.5 V • Fixed Output Voltage Options: 2.1 V, 2.2 V, 2.95 V, 3.0 V and 3.3 V • • • • • • • • • Other Output Voltage Options Available on Request. Low Quiescent Current of Typ. 200 mA Very Low Dropout: 155 mV Max. at IOUT = 1 A ±1% Accuracy Over Load/Line/Temperature High PSRR: 60 dB at 1 kHz Internal Soft−Start to Limit the Inrush Current Thermal Shutdown and Current Limit Protections Stable with a 4.7 mF Ceramic Output Capacitor Available in XDFN8 1.6 x 1.2, 04P 8−pin Package These are Pb−Free Devices SNS EN ON GND OFF (Note: Microdot may be in either location) PIN CONNECTION OUT 1 8 IN OUT 2 7 IN N/C 3 6 EN 5 GND IN 8 1 OUT IN 7 2 OUT EN 6 3 N/C 4 SNS (Bottom View) OUT NCP706 CIN XX = Specific Device Code M = Date Code G = Pb−Free Package GND 5 VOUT = 2.1 (2.2) V @ 1 A IN XXMG G XDFN8 CASE 711AS (Top View) Tablets, Smartphones, Wireless Handsets, Portable Media Players Portable Medical Equipment Other Battery Powered Applications VIN = 2.4 (2.5) − 5.5 V MARKING DIAGRAM SNS 4 Typical Applications • • • • www.onsemi.com ORDERING INFORMATION See detailed ordering, marking and shipping information on page 15 of this data sheet. COUT 4.7 mF Ceramic Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 7 1 Publication Order Number: NCP706/D NCP706 Figure 2. Simplified Internal Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN8 Pin Name 1 OUT 2 OUT 3 N/C Not connected. This pin can be tied to ground to improve thermal dissipation. 4 SNS Remote sense connection. This pin should be connected to the output voltage rail. 5 GND Power supply ground. 6 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 7 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. 8 IN − Exposed Pad Description Regulated output voltage. A minimum 4.7 mF ceramic capacitor is needed from this pin to ground to assure stability. This pad enhances thermal performance and is electrically connected to GND. It is recommended that the exposed pad is connected to the ground plane on the board or otherwise left open. www.onsemi.com 2 NCP706 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s TJ(MAX) 150 °C TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Input Voltage (Note 1) Maximum Junction Temperature Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 Latch−up Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Rating Thermal Characteristics, XDFN8 1.6x1.2, 04P Thermal Resistance, Junction−to−Air www.onsemi.com 3 Symbol Value Unit RqJA 160 °C/W NCP706 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.1 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.4 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 3) Test Conditions Parameter Operating Input Voltage Symbol Min VIN 2.4 Typ Max Unit 5.5 V Undervoltage lock−out VIN rising UVLO 1.2 1.6 1.9 V Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A VOUT 2.079 2.10 2.121 V Line Regulation VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA RegLINE 2 mV Load Regulation IOUT = 0 mA to 1 A RegLOAD 2 mV Load Transient IOUT = 10 mA to 1A or 10 mA to 1 A in 10 ms, COUT = 10 mF TranLOAD ±120 mV Dropout voltage (Note 4) IOUT = 1 A, VOUT(nom) = 2.1 V VDO Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA IQ 180 Ground current IOUT = 1 A IGND 200 Shutdown current VEN ≤ 0 V, VIN = 2.0 to 5.5 V Reverse Leakage Current in Shutdown VIN = 5.5 V, VOUT = VOUT(NOM), VEN < 0.4 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V IEN Turn−on Time COUT = 4.7 mF, from assertion EN pin to 98% Vout(nom) tON IREV VEN_HI VEN_LO Power Supply Rejection Ratio VIN = 2.6 V, VOUT = 2.1 V IOUT = 0.5 A f = 100 Hz f = 1 kHz f = 10 kHz Output Noise Voltage VOUT = 2.1 V, VIN = 2.6 V, IOUT = 0.5 A f = 100 Hz to 100 kHz Thermal Shutdown Temperature Thermal Shutdown Hysteresis 300 1.1 mV A 230 mA mA 0.1 1 mA 1.5 5 mA 0.4 V V 500 nA 0.9 100 ms 200 PSRR 60 60 40 dB VNOISE 280 mVrms Temperature increasing from TJ = +25°C TSD 160 °C Temperature falling from TSD TSDH − 20 − °C 3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V. www.onsemi.com 4 NCP706 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.2 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.5 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 5) Test Conditions Parameter Operating Input Voltage Symbol Min VIN 2.5 Typ Max Unit 5.5 V Undervoltage lock−out VIN rising UVLO 1.2 1.6 1.9 V Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A VOUT 2.178 2.2 2.222 V Line Regulation VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA RegLINE 2 mV Load Regulation IOUT = 0 mA to 1 A RegLOAD 2 mV Load Transient IOUT = 10 mA to 1A or 10 mA to 1 A in 10 ms, COUT = 10 mF TranLOAD ±120 mV Dropout voltage (Note 6) IOUT = 1 A, VOUT(nom) = 2.2 V VDO Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA IQ 180 Ground current IOUT = 1 A IGND 200 Shutdown current VEN ≤ 0 V, VIN = 2.0 to 5.5 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V IEN 100 Turn−on Time COUT = 4.7 mF, from assertion EN pin to 98% Vout(nom) tON 200 ms Power Supply Rejection Ratio VIN = 3.2 V, VOUT = 2.2 V IOUT = 0.5 A f = 100 Hz f = 1 kHz f = 10 kHz PSRR 55 70 60 dB Output Noise Voltage VOUT = 2.2 V, VIN = 2.7 V, IOUT = 0.5 A f = 100 Hz to 100 kHz VNOISE 300 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 300 1.1 A 0.1 VEN_HI VEN_LO mV 230 mA mA 1 0.9 mA V 0.4 − 20 500 − nA °C 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V. www.onsemi.com 5 NCP706 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.95 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 3.3 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 7) Test Conditions Parameter Operating Input Voltage Symbol Min VIN 2.4 Typ Max Unit 5.5 V Undervoltage lock−out VIN rising, IOUT = 0 UVLO 1.2 1.6 1.9 V Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A VOUT 2.9205 2.95 2.9795 V Line Regulation VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA RegLINE 2 mV Load Regulation IOUT = 0 mA to 1 A, VIN = 3.3 V RegLOAD 2 mV Load Transient IOUT = 10 mA to 1 A in 10 ms, VIN = 3.5 V COUT = 10 mF TranLOAD ±120 mV Dropout voltage (Note 8) IOUT = 1 A, VOUT(nom) = 3.0 V VDO Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA IQ 170 Ground current IOUT = 1 A IGND 200 Shutdown current VEN ≤ 0 V, VIN = 2.4 to 5.5 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V IEN 100 Turn−on Time COUT = 4.7 mF, from assertion EN pin to 98% Vout(nom) tON 150 ms Power Supply Rejection Ratio VIN = 3.5 V + 200 mVpp modulation, VOUT = 2.95 V IOUT = 0.5 A, COUT = 4.7 mF PSRR 65 58 52 dB Output Noise Voltage VOUT = 2.95 V, VIN = 4.0 V, IOUT = 0.5 A f = 100 Hz to 100 kHz VNOISE 300 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 155 f = 100 Hz f = 1 kHz f = 10 kHz mV A 0.1 VEN_HI VEN_LO 230 1.1 230 mA mA 1 0.9 mA V 0.4 − 20 500 − nA °C 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Characterized when VOUT falls 90 mV below the regulated voltage at VIN = 3.3 V, IOUT = 10 mA. www.onsemi.com 6 NCP706 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 3.3 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 9) Test Conditions Parameter Operating Input Voltage Symbol Min VIN 2.4 Typ Max Unit 5.5 V Undervoltage lock−out VIN rising, IOUT = 0 UVLO 1.2 1.6 1.9 V Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A VOUT 2.97 3.0 3.03 V Line Regulation VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA RegLINE 2 mV Load Regulation IOUT = 0 mA to 1 A, VIN = 3.3 V RegLOAD 2 mV Load Transient IOUT = 10 mA to 1 A in 10 ms, VIN = 3.5 V COUT = 10 mF TranLOAD ±120 mV Dropout voltage (Note 10) IOUT = 1 A, VOUT(nom) = 3.0 V VDO Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA IQ 170 Ground current IOUT = 1 A IGND 200 Shutdown current VEN ≤ 0 V, VIN = 2.0 to 5.5 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V IEN 100 Turn−on Time COUT = 4.7 mF, from assertion EN pin to 98% Vout(nom) tON 150 ms Power Supply Rejection Ratio VIN = 3.5 V + 200 mVpp modulation, VOUT = 3.0 V IOUT = 0.5 A, COUT = 4.7 mF PSRR 65 58 52 dB Output Noise Voltage VOUT = 3.0 V, VIN = 4.0 V, IOUT = 0.5 A f = 100 Hz to 100 kHz VNOISE 300 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 155 f = 100 Hz f = 1 kHz f = 10 kHz mV A 0.1 VEN_HI VEN_LO 230 1.1 230 mA mA 1 0.9 mA V 0.4 − 20 500 − nA °C 9. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 10. Characterized when VOUT falls 90 mV below the regulated voltage at VIN = 3.3 V, IOUT = 10 mA. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 7 NCP706 TYPICAL CHARACTERISTICS 2.102 2.098 2.096 2.094 2.200 2.196 2.192 2.188 2.092 2.090 −40 VIN = 2.5 V IOUT = 10 mA COUT = 4.7 mF VOUT(NOM) = 2.2 V 2.204 OUTPUT VOLTAGE (V) 2.100 OUTPUT VOLTAGE (V) 2.208 VIN = 2.4 V IOUT = 10 mA COUT = 4.7 mF VOUT(NOM) = 2.1 V −20 0 20 40 60 80 100 2.184 −40 120 −20 0 TEMPERATURE (°C) 3.004 2.4 3.002 2.0 3.000 2.998 2.996 2.992 −40 −20 VIN = 3.3 V IOUT = 10 mA COUT = 1 mF VOUT(NOM) = 3.0 V 0 20 40 1.2 0.8 80 100 0.0 1.0 1.6 VIN = VEN TA = 25°C COUT = 4.7 mF VOUT(NOM) = 2.2 V IOUT = 10 mA IOUT = 50 mA IOUT = 250 mA IOUT = 500 mA 3.0 4.0 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.0 2.0 3.0 4.0 5.0 Figure 6. Output Voltage vs. Input Voltage 2.0 1.0 2.0 INPUT VOLTAGE (V) 3.5 0.0 120 IOUT = 10 mA IOUT = 50 mA IOUT = 250 mA IOUT = 500 mA 0.0 120 2.4 0.4 100 VIN = VEN TA = 25°C COUT = 4.7 mF VOUT(NOM) = 2.1 V Figure 5. Output Voltage vs. Temperature 0.0 80 1.6 TEMPERATURE (°C) 0.8 60 0.4 60 1.2 40 Figure 4. Output Voltage vs. Temperature OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) Figure 3. Output Voltage vs. Temperature 2.994 20 TEMPERATURE (°C) 2.5 VIN = VEN TA = 25°C COUT = 1 mF VOUT(NOM) = 3.0 V 2.0 1.5 1.0 IOUT = 10 mA IOUT = 50 mA IOUT = 250 mA IOUT = 500 mA 0.5 0.0 0.0 5.0 1.0 2.0 3.0 4.0 5.0 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 7. Output Voltage vs. Input Voltage Figure 8. Output Voltage vs. Input Voltage www.onsemi.com 8 NCP706 TYPICAL CHARACTERISTICS 240 IOUT = 0 COUT = 4.7 mF VOUT(NOM) = 2.1 V 240 QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) 260 TA = 125°C 220 TA = 25°C 200 TA = −40°C 180 160 140 2.0 2.5 3.0 3.5 4.0 4.5 5.0 TA = 25°C 160 TA = −40°C 140 2.0 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) Figure 10. Quiescent Current vs. Input Voltage 260 IOUT = 0 COUT = 1 mF VOUT(NOM) = 3.0 V 220 200 TA = 125°C 180 TA = 25°C 160 TA = −40°C 140 3.0 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 VIN = 2.4 V VIN = 4.0 V VIN = 5.5 V 240 200 180 COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.1 V 160 140 0.0 5.5 VIN = 3.0 V VIN = 5.0 V 220 Figure 11. Quiescent Current vs. Input Voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 OUTPUT CURRENT (A) 0.8 0.9 1.0 Figure 12. Ground Current vs. Output Current 260 260 VIN = 2.5 V VIN = 4.0 V VIN = 5.5 V 240 VIN = 3.0 V VIN = 5.0 V GROUND CURRENT (mA) GROUND CURRENT (mA) 2.5 INPUT VOLTAGE (V) GROUND CURRENT (mA) QUIESCENT CURRENT (mA) TA = 125°C 180 Figure 9. Quiescent Current vs. Input Voltage 240 120 200 120 5.5 IOUT = 0 COUT = 4.7 mF VOUT(NOM) = 2.2 V 220 220 200 180 COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.2 V 160 140 0.0 0.1 0.2 0.3 0.4 VIN = 3.3 V VIN = 4.0 V VIN = 5.0 V 240 220 200 180 COUT = 1 mF TA = 25°C VOUT(NOM) = 3.0 V 160 140 0.5 0.6 0.7 0.8 0.0 0.9 1.0 OUTPUT CURRENT (A) Figure 13. Ground Current vs. Output Current VIN = 3.5 V VIN = 4.5 V VIN = 5.5 V 0.1 0.2 0.3 0.4 0.5 0.6 0.7 OUTPUT CURRENT (A) 0.8 0.9 1.0 Figure 14. Ground Current vs. Output Current www.onsemi.com 9 NCP706 TYPICAL CHARACTERISTICS 1.8 VOUT = 0 VEN = VIN COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.1 V 1.8 1.6 1.4 SHORT CURRENT LIMIT (A) SHORT CURRENT LIMIT (A) 2 1.2 1 0.8 0.6 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.2 1.0 0.8 0.6 5.5 2.0 2.5 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) Figure 15. Short Current Limitation vs. Input Voltage Figure 16. Short Current Limitation vs. Input Voltage 5.5 0.35 VOUT = 0 VEN = VIN COUT = 1 mF TA = 25°C VOUT(NOM) = 3.0 V 1.6 DROPOUT VOLTAGE (V) 1.7 VEN = VIN COUT = 4.7 mF VOUT(NOM) = 2.1 V 0.30 1.5 1.4 1.3 125°C 0.25 25°C 0.20 0.15 −40°C 0.10 0.05 3.0 3.5 4.0 4.5 5.0 0.00 5.5 0 0.2 INPUT VOLTAGE (V) 0.35 0.6 0.8 1 Figure 18. Dropout Voltage vs. Output Current 200 VEN = VIN COUT = 4.7 mF VOUT(NOM) = 2.2 V VEN = VIN COUT = 1 mF VOUT(NOM) = 3.0 V 180 DROPOUT VOLTAGE (mV) 0.30 0.4 OUTPUT CURRENT (A) Figure 17. Short Current Limitation vs. Input Voltage DROPOUT VOLTAGE (V) 3.0 INPUT VOLTAGE (V) 1.8 SHORT CURRENT LIMIT (A) 1.4 0.4 0.4 1.2 VOUT = 0 VEN = VIN COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.2 V 1.6 125°C 0.25 0.20 25°C 0.15 −40°C 0.10 0.05 160 125°C 140 25°C 120 −40°C 100 80 60 40 20 0.00 0 0 0.2 0.4 0.6 0.8 0 1 0.2 OUTPUT CURRENT (A) 0.4 0.6 0.8 OUTPUT CURRENT (A) Figure 19. Dropout Voltage vs. Output Current Figure 20. Dropout Voltage vs. Output Current www.onsemi.com 10 1 NCP706 TYPICAL CHARACTERISTICS 100 VIN = 5.5 V VEN = 0 CIN = COUT = 4.7 mF TA = 25°C 3.0 2.5 2.0 60 1.5 40 1.0 VOUT(NOM) = 2.1 V VOUT(NOM) = 2.2 V VOUT(NOM) = 3.0 V 0.5 0.0 1.0 3.0 4.0 0 0.1 5.0 FORCED OUTPUT VOLTAGE (V) 10 FREQUENCY (kHz) Figure 21. Reverse Leakage Current in Shutdown Figure 22. PSRR vs. Frequency & Output Capacitor 100 PSRR (dB) 40 0.1 1 10 100 0 1000 COUT = 1 mF COUT = 2.2 mF COUT = 4.7 mF 0.1 1 10 FREQUENCY (kHz) 60 PSRR (dB) PSRR (dB) 80 VIN = 3.7 V + 200 mVPP Modulation COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.1 V 70 60 50 40 VIN = 3.2 V + 200 mVPP Modulation COUT = 4.7 mF TA = 25°C VOUT(NOM) = 2.2 V 40 30 20 20 IOUT = 10 mA IOUT = 100 mA IOUT = 500 mA 10 0 1000 Figure 24. PSRR vs. Frequency & Output Capacitor 100 80 100 FREQUENCY (kHz) Figure 23. PSRR vs. Frequency & Output Capacitor 90 1000 40 20 COUT = 22 mF COUT = 10 mF COUT = 4.7 mF 100 VIN = 3.5 V + 200 mVPP Modulation IOUT = 500 mA TA = 25°C VOUT(NOM) = 3.0 V 60 60 20 1 80 VIN = 2.7 V + 200 mVPP Modulation IOUT = 500 mA TA = 25°C VOUT(NOM) = 2.2 V 80 PSRR (dB) 2.0 COUT = 22 mF COUT = 10 mF COUT = 4.7 mF 20 0.0 0 VIN = 2.6 V + 200 mVPP Modulation IOUT = 500 mA TA = 25°C VOUT(NOM) = 2.1 V 80 PSRR (dB) REVERSE LEAKAGE CURRENT IN SHUTDOWN (mA) 3.5 0.1 1.0 10 100 0 1000 IOUT = 10 mA IOUT = 100 mA IOUT = 500 mA FREQUENCY (kHz) 0.1 10 FREQUENCY (kHz) Figure 25. PSRR vs. Frequency & Output Current Figure 26. PSRR vs. Frequency & Output Current www.onsemi.com 11 1 100 1000 NCP706 TYPICAL CHARACTERISTICS 80 OUTPUT NOISE DENSITY (mV/√Hz) 60 PSRR (dB) 2.5 VIN = 3.5 V + 200 mVPP Modulation COUT = 1 mF TA = 25°C VOUT(NOM) = 3.0 V 40 20 IOUT = 10 mA IOUT = 100 mA IOUT = 500 mA 0 0.1 1 10 FREQUENCY (kHz) 100 2.0 1.5 1.0 0.5 0.0 0.01 1000 Figure 27. PSRR vs. Frequency & Output Current 1.5 1.0 0.5 0.0 0.01 COUT = 4.7 mF COUT = 10 mF 0.1 0.1 1 10 FREQUENCY (kHz) 3.5 IOUT = 500 mA VIN = 2.6 V TA = 25°C VOUT(NOM) = 2.2 V 2.0 COUT = 4.7 mF COUT = 10 mF 100 1000 Figure 28. Output Noise Density vs. Frequency OUTPUT NOISE DENSITY (mV/√Hz) OUTPUT NOISE DENSITY (mV/√Hz) 2.5 IOUT = 500 mA VIN = 2.7 V TA = 25°C VOUT(NOM) = 2.1 V IOUT = 500 mA VIN = 4.0 V TA = 25°C VOUT(NOM) = 3.0 V 3.0 2.5 2.0 1.5 1.0 COUT = 1 mF COUT = 2.2 mF 0.5 0.0 1 10 100 1000 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 29. Output Noise Density vs. Frequency Figure 30. Output Noise Density vs. Frequency www.onsemi.com 12 NCP706 TYPICAL CHARACTERISTICS Figure 31. Turn−on by Coupled Input and Enable Pins Figure 32. Turn−on by Coupled Input and Enable Pins Figure 33. Turn−on by Coupled Input and Enable Pins Figure 34. Turn−on by Enable Signal Figure 35. Turn−on by Enable Signal Figure 36. Turn−on by Enable Signal www.onsemi.com 13 NCP706 TYPICAL CHARACTERISTICS Figure 37. Line Transient Response Figure 38. Line Transient Response Figure 39. Line Transient Response Figure 40. Load Transient Response Figure 41. Load Transient Response Figure 42. Load Transient Response www.onsemi.com 14 NCP706 APPLICATIONS INFORMATION Input Decoupling (Cin) Thermal A 4.7 mF capacitor either ceramic or tantalum is recommended and should be connected as close as possible to the pins of NCP706 device. Higher values and lower ESR will improve the overall line transient response. As power across the NCP706 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. This is stating that when the NCP706 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation. The power dissipation across the device can be roughly represented by the equation: Output Decoupling (Cout) The minimum decoupling value for NCP706MX21TAG and NCP706MX22TAG devices is 4.7 mF and can be augmented to fulfill stringent load transient requirements. The minimum decoupling value for NCP706MX295TAG and NCP706MX706300TAG devices is 1 mF. The regulator accepts ceramic chip capacitors MLCC. If a tantalum capacitor is used, and its ESR is large, the loop oscillation may result. Larger values improve noise rejection and PSRR. P D + ǒV IN * V OUTǓ * I OUT [W] (eq. 1) The maximum power dissipation depends on the thermal resistance of the case and circuit board, the temperature differential between the junction and ambient, PCB orientation and the rate of air flow. The maximum allowable power dissipation can be calculated using the following equation: Enable Operation The enable pin EN will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to VIN. P MAX + ǒT J * T AǓńq JA [W] (eq. 2) Where (TJ − TA) is the temperature differential between the junction and the surrounding environment and qJA is the thermal resistance from the junction to the ambient. Connecting the exposed pad and non connected pin 3 to a large ground pad or plane helps to conduct away heat and improves thermal relief. Hints Please be sure the Vin and GND lines are sufficiently wide. If their impedance is high, noise pickup or unstable operation may result. Set external components, especially the output capacitor, as close as possible to the circuit. The sense pin SNS trace is recommended to be kept as far from noisy power traces as possible and as close to load as possible. ORDERING INFORMATION Nominal Ooutput Voltage Marking Package Shipping† NCP706MX21TAG 2.1 V QM XDFN8 (Pb−Free) 3000 / Tape & Reel NCP706MX22TAG 2.2 V QR XDFN8 (Pb−Free) 3000 / Tape & Reel NCP706MX295TAG 2.95 V A2 XDFN8 (Pb−Free) 3000 / Tape & Reel NCP706MX300TAG 3.0 V A3 XDFN8 (Pb−Free) 3000 / Tape & Reel NCP706MX33TAG (In Development) 3.3 V Q3 XDFN8 (Pb−Free) 3000 / Tape & Reel (Available Soon) Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 15 NCP706 PACKAGE DIMENSIONS XDFN8 1.6x1.2, 0.4P CASE 711AS ISSUE O D L L A B L1 DETAIL A ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÇÇ ÇÇ EXPOSED Cu 0.10 C 0.10 C 2X 0.10 C DIM A A1 A3 b D D2 E E2 e L L1 E PIN ONE IDENTIFIER 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION A DETAIL B MILLIMETERS MIN MAX 0.35 0.45 0.00 0.05 0.125 REF 0.13 0.23 1.60 BSC 1.20 1.40 1.20 BSC 0.20 0.40 0.40 BSC 0.15 0.25 0.05 REF A3 A1 8X RECOMMENDED MOUNTING FOOTPRINT* 0.08 C NOTE 3 C SIDE VIEW SEATING PLANE 1.44 PACKAGE OUTLINE 8X 0.35 D2 DETAIL A 1 1.40 4 E2 0.44 8X 1 0.26 0.40 PITCH DIMENSIONS: MILLIMETERS 8 8X L 5 8X e e/2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. b 0.10 C A B 0.05 C BOTTOM VIEW ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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