Vishay CRCW1218562RZNEB Standard thick film chip resistor Datasheet

D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
FEATURES
 Stability R/R = 1 % for 1000 h at 70 ° C
 2 mm pitch packaging option for 0603 size
 Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and lead
containing soldering processes
 Metal glaze on high quality ceramic
 AEC-Q200 qualified
 Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
D10/CRCW0402
INCH
METRIC
0402
RR 1005M
RATED
DISSIPATION
P70 °C
W
0.063
LIMITING
ELEMENT TEMPERATURE TOLERANCE RESISTANCE
RANGE
COEFFICIENT
%
VOLTAGE

ppm/K
Umax. AC/DC
50
± 100
± 200
SERIES
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 2M2
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
±1
±5
1R0 to 10M
E24; E96
E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A
D11/CRCW0603
0603
RR 1608M
0.10
75
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A
D12/CRCW0805
0805
RR 2012M
0.125
150
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A
D25/CRCW1206
1206
RR 3216M
0.25
200
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A
CRCW1210
1210
RR 3225M
0.5
200
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A
CRCW1218
1218
RR 3246M
1.0
200
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
CRCW2010
2010
RR 5025M
0.75
400
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 6.0 A
CRCW2512
2512
RR 6332M
1.0
500
± 100
± 200
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
Notes
 These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
 Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).
 Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TECHNICAL SPECIFICATIONS
D10/
D11/
D12/
D25/
UNIT CRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512
PARAMETER
Rated dissipation P70 (1)
W
0.063
0.1
0.125
0.25
0.5
1.0
0.75
1.0
Limiting element voltage
Umax. AC/DC
V
50
75
150
200
200
200
400
500
Insulation voltage
Uins (1 min)
V
> 75
> 100
> 200
> 300
> 300
> 300
> 300
> 300
Insulation resistance

> 109
Category temperature
range
°C
- 55 to + 155
Failure rate
h-1
< 0.1 x 10- 9
Weight
mg
29.5
25.5
40.5
0.65
2
5.5
10
16
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW0603562RFKEC
C
R
C
W
0
6
0
3
5
6
2
R
F
K
E
C
MODEL
VALUE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = Decimal
K = Thousand
M = Million
0000 = Jumper
F = ± 1.0 %
J = ± 5.0 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
0 = Jumper
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EI, EL,
EK
Up to 2 digits
Product Description: D11/CRCW0603 100 562R 1 % ET6 e3
D11/CRCW0603
100
562R
1%
ET6
e3
MODEL
TCR
RESISTANCE VALUE
TOLERANCE
PACKAGING
LEAD (Pb)-FREE
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
± 200 ppm/K
± 100 ppm/K
10R = 10 
562R = 562 
10K = 10 k
1M0 = 1 M
0R0 = Jumper
±5%
±1%
ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
ET9, EF4,
E02, E67,
E82
e3 = Pure tin
termination finish
Document Number: 20035
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
PACKAGING
MODEL
CODE
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
QUANTITY
ED = ET7
10 000
EE = EF4
50 000
WIDTH
PITCH
8 mm
2 mm
REEL DIAMETER
180 mm/7"
330 mm/13"
EI = ET2
5000
ED = ET3
10 000
EL = ET4
20 000
EE = ET8
50 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
330 mm/13"
EA = ET1
5000
180 mm/7"
EB = ET5
10 000
EC = ET6
20 000
CRCW1218
EK = ET9
4000
CRCW2010
EF = E02
4000
EG = E67
2000
EH = E82
4000
CRCW2512
CARRIER TAPE
180 mm/7"
8 mm
180 mm/7"
2 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
8 mm
4 mm
285 mm/11.25"
Paper tape acc.
to IEC 60068-3
Type I
330 mm/13"
180 mm/7"
8 mm
4 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
8 mm
4 mm
285 mm/11.25"
8 mm
4 mm
285 mm/11.25"
12 mm
4 mm
180 mm/7"
12 mm
4 mm
180 mm/7"
330 mm/13"
Blister tape acc.
to IEC 60068-3
Type II
8 mm
12 mm
180 mm/7"
4 mm
DIMENSIONS
SIZE
INCH METRIC
SOLDER PAD DIMENSIONS in millimeters
DIMENSIONS in millimeters
L
W
T2
a
b
l
0402
1005
1.0 ± 0.05
0.5 ± 0.05
0.35 ± 0.05 0.25 ± 0.05
0.2 ± 0.1
0.4
0.6
0.5
0603
1608
1.55
+ 0.10
- 0.05
0.85 ± 0.1
0.45 ± 0.05
0.3 ± 0.2
0.5
0.9
0805
2012
2.0
+ 0.20
- 0.10
1.25 ± 0.15
0.45 ± 0.05
+ 0.20
- 0.10
0.3 ± 0.2
0.7
1206
3216
3.2
+ 0.10
- 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.2
0.4 ± 0.2
1210
3225
3.2 ± 0.2
3.2
H
T1
REFLOW SOLDERING
0.3 ± 0.2
0.3
WAVE SOLDERING
a
b
l
1.0
0.9
0.9
1.0
1.3
1.2
0.9
1.3
1.3
0.9
1.7
2.0
1.1
1.7
2.3
2.5 ± 0.2
0.55 ± 0.05
0.45 ± 0.2
0.4 ± 0.2
0.9
2.5
2.0
1.1
2.5
2.2
+ 0.10
- 0.20
4.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.2
0.4 ± 0.2
1.05
4.9
1.9
1.25
4.8
1.9
1218
3246
2010
5025
5.0 ± 0.15
2.5 ± 0.15
0.6 ± 0.1
0.6 ± 0.2
0.6 ± 0.2
1.0
2.5
3.9
1.2
2.5
3.9
2512
6332
6.3 ± 0.2
3.15 ± 0.15
0.6 ± 0.1
0.6 ± 0.2
0.6 ± 0.2
1.0
3.2
5.2
1.2
3.2
5.2
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Document Number: 20035
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Revision: 04-Jun-12
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
Pulse Load Pmax. (W)
FUNCTIONAL PERFORMANCE
Single Pulse
1000
2512
1218
2010
1210
1206
0805
0603
0402
100
10
1
0.1
0.01
10-6
10-5
10-4
10-3
10-2
10-1
1
10
100
Pulse Duration t i (s)
Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û ≤ Ûmax.;
for permissible resistance change equivalent to 8000 h operation
Continuous Pulse Load Pmax. (W)
Continuous Pulse
1000
2512
1218
2010
1210
1206
0805
0603
0402
100
10
1
0.1
0.01
10-6
10-5
10-4
10-3
10-2
10-1
1
10
100
Pulse Duration t i (s)
Pulse Voltage Û
max.
(V)
Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Û ≤ Ûmax.;
for permissible resistance change equivalent to 8000 h operation
2000
1800
2512
1600
1400
2010
1200
1000
800
1206/1210/1218
600
400
0805
0603
200
0402
0 -6
10- 5
10
10- 4
10- 3
10- 2
10- 1
1
10
Pulse Duration t i (s)
Maximum pulse voltage, single and continuous pulses; applicable if
P ≤ Pmax.; for permissible resistance change equivalent to 8000 h operation
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
Fraction of Rated Dissipation P70
Derating
100
%
50
0
Attenuation of 3rd Harmonic A3 in dB
- 50
0
50
100
°C
150
70
Ambient Temperature ϑamb
120
100
80
1206, 2010
0805
60
0603
0402
40
20
0
10
100
1K
10K
100K
1M
10M
Current Noise A1 in µV/V
Resistance Value R in Ω
100
2
040
3
0
6
0
5
080 6
120 0
201
10
1
0.1
0.01
100
1K
10K
100K
1M
10M
Resistance Value R in Ω
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Document Number: 20035
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
REQUIREMENTS
PERMISSIBLE CHANGE (R)
TEST
SIZE 0402 to 2512
PROCEDURE
STABILITY
CLASS 2
OR BETTER
STABILITY
CLASS 1
OR BETTER
Stability for product types:
1  to 10 M
D/CRCW e3
4.5
-
Resistance
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
Short time overload
U = 2.5 x P 70 x R
 2 x Umax.;
duration: Acc. to style
4.13
4.17.2
-
58 (Td)
Solderability
-
21 (Uu3)
Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
4.33
21 (Uu1)
Substrate bending
Depth 2 mm;
3 times
14 (Na)
Rapid change of
temperature
No visible damage
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
5 cycles
± (0.25 % R + 0.05 )
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
Climatic sequence:
2 (Ba)
Dry heat
125 °C; 16 h
-
4.23.3
30 (Db)
Damp heat, cyclic
4.23.4
1 (Aa)
Cold
- 55 °C; 2 h
4.23.5
13 (M)
Low air pressure
1 kPa; (25 ± 10) °C; 1 h
4.23.6
30 (Db)
Damp heat, cyclic
55 °C;  90 % RH;
24 h; 5 cycles
4.23.7
-
DC load
Endurance
at 70 °C
± 200 ppm/K
1000 cycles
-
-
± 100 ppm/K
30 min. at - 55 °C;
30 min. at 125 °C
55 °C;  90 % RH;
24 h; 1 cycle
4.25.1
±0.5 % R + 0.05)
Good tinning ( 95 % covered)
no visible damage
4.32
4.23.2
±0.25 % R + 0.05)
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) C
(3 ± 0.3) s
(20/- 55/20) C and
(20/125/20) C
4.23
No flashover or breakdown
Good tinning ( 95 % covered)
no visible damage
Temperature
coefficient
4.19
±5%
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
-
4.8.4.2
±1%
U = P 70 x R
U = P 70 x R  Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (1 % R + 0.05 )
± (2 % R + 0.1 )
70 °C; 8000 h
± (2 % R + 0.1 )
± (4 % R + 0.1 )
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D/CRCW e3
Standard Thick Film Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC
EN
60068-2
60115-1
TEST
CLAUSE
METHOD
REQUIREMENTS
PERMISSIBLE CHANGE (R)
TEST
SIZE 0402 to 2512
PROCEDURE
STABILITY
CLASS 2
OR BETTER
STABILITY
CLASS 1
OR BETTER
Stability for product types:
1  to 10 M
D/CRCW e3
58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) C;
(10 ± 1) s
4.35
-
Flamability,
needle flame test
IEC 60695-11-5;
10 s
No burning after 30 s
4.24
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )
4.25.3
-
Endurance at
upper category
temperature
155 °C, 1000 h
4.40
-
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
± (1 % R + 0.05 )
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30
45 (XA)
Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22
6 (Fc)
Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z  1.5 mm;
A  200 m/s2;
10 sweeps per axis
4.37
-
Periodic electric
overload
4.27
-
Single pulse high
voltage overload,
10 µs/700 µs
4.18.2
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (0.25 % R + 0.05 )
± (0.5 % R + 0.05 )
± (2 % R + 0.1 )
± (0.5 % R + 0.05 )
U=
15 x P 70 x R
 2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
Û = 10 x P 70 x R
 2 x Umax.;
10 pulses
± (1 % R + 0.05 )
± (1 % R + 0.05 )
All tests are carried out in accordance with the following specifications:
 EN 60115-1, generic specification
 EN 140400, sectional specification
 EN 140401-802, detail specification
 IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
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