LRC HFM307 Surface mount glass passivated high efficiency rectifiers reverse voltage 50 to 1000v forward current 3.0a Datasheet

HFM301 thru HFM308
Surface Mount Glass Passivated High Efficiency Rectifiers
Reverse Voltage 50 to 1000V Forward Current 3.0A
FEATURES
* Plastic package has Underwriters Laboratories
*
*
*
*
*
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Flammability Classification 94V-0
Ideally suited for use in very high frequency switching
power supplies, inverters and as free wheeling diodes
Ultrafast recovery time for high efficiency
Excellent high temperature switching
Soft recovery characteristics
Cavity-free glass passivated junction
High temperature soldering guaranteed:
260°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-214AB/SMC, molded plastic over glass die
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:
0.21g
Handling precautin:None
We declare that the material of product compliance
with ROHS requirements
1.Electrical Characteristic
Maximum& Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Maximum repetitive peak reverse voltage
VRRM
HFM
301
HFM
301
50
Maximum RSM voltage
VRSM
35
70
140
210
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
300
400
600
800
1000
V
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA = 75°C
IF(AV)
3.0
A
Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC Method)
IFSM
150
A
Maximum full load reverse current, full cycle
average,0.375"(9.5mm) lead lengths at TA = 55°C
IR(AV)
100
µA
RθJA
TJ,
TSTG
50
°C/W
–50 to +150
°C
Parameter Symbol
symbol
Device marking code
Typical thermal resistance (Note 2)
Operating junction and storage temperature range
HFM
302
HFM
302
100
HFM
303
HFM
303
200
HFM
304
HFM
304
300
HFM
305
HFM
305
400
HFM
306
HFM
306
600
HFM
307
HFM
307
800
HFM
308
HFM
308
1000
Unit
V
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol
symbol
Maximum instantaneous forward voltage at 3.0A
Maximum DC reverse current TA = 25°C
at rated DC blocking voltage TA = 100°C
Typical reverse recovery time (Note 1)
VF
trr
Typical junction capacitance at 4.0V, 1MHz
CJ
HFM
301
HFM
302
1.00
HFM
303
IR
HFM HFM
304
305
1.30
5.0
50
50
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2
2. Mounted on Copper Leaf area of 1.57in2(40mm ).
HFM HFM
307
308
1.85
Unit
V
µA
75
17
NOTES:
HFM
306
ns
PF
HFM301 thru HFM308
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
250
60 Hz
Resistive or
Inductive Load
3.0
1.5
0.375" (9.5mm) Lead Length
0
0
1.0
0.1
0.01
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
Transient thermal impedance(°C/W)
0.001
0.8
100
100
50
0
1
1.0
1.2
1.4
1.6
1.8
Instantaneous Forward Voltage (V)
10
Tj=75℃
1.0
0.1
0.01
Tj=25℃
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig 6. – Typical Junction Capacitance
10
1.0
0.1
0.1
1.0
10
t,Pulse duration,sec
100
Tj=125℃
Fig 5. –typical transient thermal
impedance
0.01
10
Number of Cycles at 60Hz
Fig 4. – Typical Reverse Characteristics
100
Instantaneous Reverse Current (µA)
10
150
25
50 75 100 125 150 175
Ambient Temperature, °C
Fig 3. – Typical Instantaneous Forward
Characteristics
TJ = TJ max
8.3ms Single Half Sine-wave
(JEDEC Method)
200
Junction Capacitance (pF)
Instantaneous Forward Current (A)
Average Forward Rectified Current (A)
Average Forward Rectified Current (A)
Fig. 1 – Forward Current Derating Curve
100
20
10
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
1.0
0.1
1
10
Reverse Voltage (V)
100
HFM301 thru HFM308
3. dimension:
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
2 页
SMD产品通用包装材料规格以及包装产品数量
General packaging materials spec. and quantity
1.1 卷装 reel
A.卷盘规格reel spec
单位:mm
规格
SMA 7"卷盘
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
A
177.0±2.0
330.0±2.0
330.0±2.0
330.0±2.0
B
54.0±0.5
75.0±0.5
75.0±0.5
75.0±0.5
C
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
每卷数量
2K
5K
3K
3K
W
13.2±0.2
13.2±0.2
13.5±0.5
17.0±0.5
B. 13"卷盘内盒 inner box
单位:mm
尺寸
A
335±5.0
B
335±2.0
C
40±1.0
按以上包装方式,产品包装数量:quantity
规格
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
每盒数量
10K
6K
6K
标题Titile:
塑封生产线SMD产品包装规范
文件编号:
WI-258
文件编号:
WI-258
Packaging specification of SMD
第
3
页
C. 7"卷盘盒 box
单位:mm
尺寸
A
B
C
188±2.0
188±2.0
138±2.0
按以上包装方式,产品包装数量:quantity
每盒数量
16K
7"卷盘
D. 卷盘外箱 reel carton
单位:mm
尺寸
A
B
C
350±2.0
340±2.0
350±2.0
按以上包装方式,产品包装数量:
规格
SMA 7"卷盘
SMA13"卷盘
SMB13"卷盘
SMC13"卷盘
1.2 编带规格 tape spec
A. 盖带 Cover tape
单位:mm
A
SMA
SMB
9.30±0.10
SMC
13.30±0.10
B
0.068±0.005
每箱数量
80K
80K
48K
36K
文件编号:
标题Titile:
第 3 版
Packaging specification of SMD
B. 载带
t
Do
Po
P2
B'
第
P1
A
D1
A'
Bo
W
F
E
塑封生产线SMD产品包装规范
B
SEC.:B-B'
Ao
Ko
产品负极端(编
带有孔一边)
SEC.:A-A'
WI-258
第 0 次修改
4
页
类型
SMA
SMB
SMC
W
12±0.3
12±0.3
16±0.3
P1
4±0.1
8±0.1
8±0.1
E
1.75±0.1
F
5.5±.05
1.75±0.1 1.75±0.1
5.5±0.05 7.5±.05
D0
D1
1.55±0.05 1.55±0.05 1.55±0.05
1.5±0.1
1.55±0.05 1.55±0.05
P0
4±0.1
4±0.1
4±0.1
P2
2±0.05
2±0.05
2±0.05
10P0
40±0.2
40±0.2
40±0.2
A0
2.79±0.1
3.8±0.1
6.05±0.1
B0
5.33±0.1
5.4±0.1
8.31±0.1
K0
2.36±0.1
T
2.45±0.1 2.54±0.1
0.25±0.05 0.25±0.05 0.25±0.05
2、SMD产品通用包装规范 General spec of SMD
5.2.1国内客户domestic
A. 7"卷盘reel
所有标签贴在卷盘负极 all the label on cathode side
B
A
C
C
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签 HF label
B. 13"卷盘 所有标签贴在卷盘负极 all the label on
(无卤产品才贴HF
cathode side only)
A
B
C
B
C
A
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签(无卤产品才贴HF only)
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
5
页
C. 标签要求label spec:
LRC标签label
******
LRC产品型号 type
******
产品数量 quantity
******
产品批号 LOT
******
产品生产日期
ROHS标签
date
无卤标签 HF label
Green
2.2 国外客户
overseas
所有标签贴在卷盘负极 all the label on cathode side
A
B
C
7"卷盘盒 inner box
13"卷盘内盒inner box
B
C
C
A
A处:贴LRC标签;
B处:贴ROHS标签
C处:贴无卤标签HF label
(无卤产品才贴HF only)
文件编号:
标题Titile:
塑封生产线SMD产品包装规范
第 3 版
Packaging specification of SMD
第
WI-258
第 0 次修改
6
页
LRC标签label
TYPE:******
MARK:******
Q'TY:******
DATE:******
LRC产品型号
印字型号
产品数量
产品生产日期
ROHS标签
无卤标签 HF label
Green
注意事项NOTE:
1. 13"卷盘内盒装好产品,需用热缩膜包装;13"reel’inner box must be packed by shrink film
2. 所有编带产品卷装完成后,用白色胶带将编带粘牢;
every tape after packing,must be fixed by white adhesive tape
3.1产品出厂检验报告 testing report of the OQC
每批出货时,需要附上出厂检验报告 every lot must with test report
3.2尾箱
同一编码每批次只允许出现一个尾数箱,对于尾数物料,须用缓冲材料对空余部分填充好,
保证物料在受到一定的外作用力下不发生明显移动,且物料间无碰撞。
The same coding is only one ending for each batch box materials for the mantissa to
be good filled with cushioning material.
HFM301 thru HFM308
4. Update Record
版次
更新记录
更新作者
更新日期
1
第一版
周杰
2011-3-12
2
增加包装规范
周杰
2011-6-18
3
更新版面。
周杰
2012-8-2
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