HD74LV1GW17A Dual Buffer with Schmitt Trigger Inputs REJ03D0079-0200 Rev.2.00 May 19, 2006 Description The HD74LV1GW17A has dual buffer with schmitt–trigger input in a 6 pin package. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life. Features • The basic gate function is lined up as Renesas uni logic series. • Supplied on emboss taping for high-speed automatic mounting. • Supply voltage range : 1.65 to 5.5 V Operating temperature range : –40 to +85°C • All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) • Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V) • All the logical input has hysteresis voltage for the slow transition. • Ordering Information Part Name HD74LV1GW17ACME Package Type CMPAK-6 pin Package Code (Previous Code) PTSP0006JA-A (CMPAK-6V) Taping Abbreviation (Quantity) Package Abbreviation CM E (3,000 pcs / Reel) Outline and Article Indication • HD74LV1GW17A Index band Marking W K CMPAK–6 = Control code Function Table Input A H L H : High level L : Low level Rev.2.00, May 19, 2006 page 1 of 5 Output Y H L HD74LV1GW17A Pin Arrangement 1A 1 6 1Y GND 2 5 VCC 2A 3 4 2Y (Top view) Absolute Maximum Ratings Symbol Ratings Unit Supply voltage range Input voltage range *1 Item VCC VI V V Output voltage range *1, 2 VO Input clamp current Output clamp current Continuous output current IIK IOK IO –0.5 to 7.0 –0.5 to 7.0 –0.5 to VCC + 0.5 –0.5 to 7.0 –20 ±50 ±25 mA mA mA ICC or IGND ±50 mA PT 200 mW Tstg –65 to 150 °C Continuous current through VCC or GND Maximum power dissipation *3 at Ta = 25°C (in still air) Storage temperature Notes: V Test Conditions Output : H or L VCC : OFF VI < 0 VO < 0 or VO > VCC VO = 0 to VCC The absolute maximum ratings are values, which must not individually be exceeded, and furthermore no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150°C. Rev.2.00, May 19, 2006 page 2 of 5 HD74LV1GW17A Recommended Operating Conditions Item Supply voltage range Input voltage range Output voltage range Symbol VCC VI VO Min 1.65 0 0 — — — — — — — — –40 IOL Output current IOH Operating free-air temperature Ta Max 5.5 5.5 VCC 1 2 6 12 –1 –2 –6 –12 85 Unit V V V mA Conditions VCC = 1.65 to 1.95 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V VCC = 1.65 to 1.95 V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V °C Note: Unused or floating inputs must be held high or low. Electrical Characteristic Ta = –40 to 85°C Item Symbol VT Threshold voltage + VT– ∆VT VOH Output voltage VOL VCC (V) * Min Typ Max 1.65 to 1.95 2.5 3.3 5.0 1.65 to 1.95 2.5 3.3 5.0 1.65 to 1.95 2.5 3.3 5.0 Min to Max 1.65 2.3 3.0 — — — — VCC×0.25 0.75 0.99 1.5 0.1 0.25 0.33 0.5 VCC–0.1 1.4 2.0 2.48 — — — — — — — — — — — — — — — — VCC×0.75 1.75 2.31 3.50 — — — — VCC×0.4 1.0 1.32 2.0 — — — — 4.5 Min to Max 1.65 2.3 3.0 3.8 — — — — — — — — — — 0.1 0.3 0.4 0.44 — — — — 0.55 ±1 µA — — 10 µA Input current IIN 4.5 0 to 5.5 Quiescent supply current ICC 5.5 Unit Test condition V V IOH = –50 µA IOH = –1 mA IOH = –2 mA IOH = –6 mA IOH = –12 mA IOL = 50 µA IOL = 1 mA IOL = 2 mA IOL = 6 mA IOL = 12 mA VIN = 5.5 V or GND VIN = VCC or GND, IO = 0 Output leakage IOFF 0 — — 5 µA VIN or VO = 0 to 5.5 V current Input capacitance CIN 3.3 — 3.0 — pF VIN = VCC or GND Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions. Rev.2.00, May 19, 2006 page 3 of 5 HD74LV1GW17A Switching Characteristics VCC = 1.8 ± 0.15 V Item Symbol Propagation delay time tPLH tPHL Ta = 25°C Min Typ Max — 16.8 32.0 — 23.8 43.0 Ta = –40 to 85°C Min 1.0 1.0 Max 34.0 46.0 Test Conditions Unit CL = 15 pF CL = 50 pF ns FROM (Input) TO (Output) A Y VCC = 2.5 ± 0.2 V Item Symbol Propagation delay time tPLH tPHL Min — — Ta = 25°C Typ Max 10.5 19.7 14.0 24.0 Ta = –40 to 85°C Min 1.0 1.0 Max 22.0 27.0 Test Conditions Unit CL = 15 pF CL = 50 pF ns FROM (Input) TO (Output) A Y VCC = 3.3 ± 0.3 V Item Symbol Propagation delay time tPLH tPHL Ta = 25°C Min — — Typ 8.3 10.8 Ta = –40 to 85°C Max 12.8 16.3 Min 1.0 1.0 Max 15.0 18.5 Test Conditions Unit CL = 15 pF CL = 50 pF ns FROM (Input) TO (Output) A Y VCC = 5.0 ± 0.5 V Item Symbol Propagation delay time tPLH tPHL Min — — Ta = 25°C Typ Max 5.5 8.6 7.0 10.6 Ta = –40 to 85°C Min 1.0 1.0 Max 10.0 12.0 Test Conditions Unit CL = 15 pF CL = 50 pF ns FROM (Input) TO (Output) A Y Operating Characteristics CL = 50 pF Item Power dissipation capacitance Symbol VCC (V) CPD 3.3 5.0 Min — — Ta = 25°C Typ Max 8.5 — 10.0 — Unit Test Conditions pF f = 10 MHz Test Circuit VCC Pulse generator Output Input 50 Ω Note: CL includes probe and jig capacitance. Rev.2.00, May 19, 2006 page 4 of 5 CL HD74LV1GW17A • Waveforms tr tf 90% 50% Input VCC 90% 50% 10% 10% GND VOH 50% Output 50% VOL t PHL t PLH Notes: 1. Input waveform : PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. 2. The output are measured one at a time with one transition per measurement. Package Dimensions JEITA Package Code SC-88 Package Name CMPAK-6 RENESAS Code PTSP0006JA-A D Previous Code CMPAK-6 / CMPAK-6V MASS[Typ.] 0.006g A e Q c E HE LP L A A x M L1 S A A3 b Reference Symbol e A2 y S A A1 S e1 b l1 c b2 A-A Section Rev.2.00, May 19, 2006 page 5 of 5 Pattern of terminal position areas A A1 A2 A3 b c D E e HE L L1 LP x y b2 e1 l1 Q Dimension in Millimeters Min 0.8 0 0.8 0.15 0.1 1.8 1.15 2.0 0.3 0.1 0.2 Nom 0.9 0.25 0.2 0.15 2.0 1.25 0.65 2.1 Max 1.1 0.1 1.0 0.25 0.25 2.2 1.35 2.2 0.7 0.5 0.6 0.05 0.05 0.35 1.5 0.9 0.25 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .6.0