ON NCP716MT50TBG 80 ma ultra-low iq, wide input voltage low dropout regulator Datasheet

NCP716
80 mA Ultra-Low Iq, Wide
Input Voltage Low Dropout
Regulator
The NCP716 is 80 mA LDO Linear Voltage Regulator. It is a very
stable and accurate device with ultra−low ground current consumption
(4.7 mA over the full output load range) and a wide input voltage range
(up to 24 V). The regulator incorporates several protection features
such as Thermal Shutdown and Current Limiting.
Features
MARKING
DIAGRAMS
1
WDFN6
CASE 511BR
• Operating Input Voltage Range: 2.5 V to 24 V
• Fixed Voltage Options Available:
•
•
•
•
•
•
•
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1.2 V to 5.0 V
Ultra Low Quiescent Current: Max. 4.7 mA over Temperature
±2% Accuracy over Full Load, Line and Temperature Variations
PSRR: 60 dB at 100 kHz
Noise: 200 mVRMS from 200 Hz to 100 kHz
Thermal Shutdown and Current Limit Protection
Available in WDFN6, 2x2x0.8 mm Package
This is a Pb−Free Device
Typical Applicaitons
XX M
XX = Specific Device Code
M = Date Code
PIN CONNECTIONS
1
2
3
6
EXP
5
4
WDFN6 2x2 mm
(Top View)
• Portable Equipment
• Communication Systems
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 16 of this data sheet.
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. 1
1
Publication Order Number:
NCP716/D
NCP716
IN
UVLO
BANDGAP
REFERENCE
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
EEPROM
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
wDFN6, 2 x 2
Pin
Name
6
OUT
Regulated output voltage pin. A small 0.47 mF ceramic capacitor is needed from this pin to ground to
assure stability.
Description
2
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
3, EXP
GND
Power supply ground. Exposed pad EXP must be tied with GND pin 3.
4
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
5
N/C
No connection. This pin can be tied to ground to improve thermal dissipation or left disconnected.
1
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Input Voltage (Note 1)
Symbol
Value
Unit
VIN
−0.3 to 24
V
VOUT
−0.3 to 5
V
tSC
Indefinite
s
TJ(MAX)
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Output Voltage
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch up Current Maximum Rating tested per JEDEC standard: JESD78
Table 3. THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, wDFN6, 2 mm x 2 mm
Thermal Resistance, Junction−to−Air
Symbol
Value
Unit
RqJA
120
°C/W
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2
NCP716
Table 4. ELECTRICAL CHARACTERISTICS Voltage version 1.2 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 5)
Parameter
Operating Input Voltage
Test Conditions
Symbol
Min
Max
Unit
IOUT ≤ 10 mA
VIN
2.5
24
V
3.0
24
10 mA < IOUT < 80 mA
Output Voltage Accuracy
3.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
Line Regulation
3.0 V ≤ VIN ≤ 24 V, IOUT = 1 mA
RegLINE
30
mV
Load Regulation
IOUT = 0 mA to 80 mA
RegLOAD
20
mV
(Note 6)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Dropout voltage (Note 3)
Maximum Output Current
Ground current
1.164
Typ
1.2
VDO
−
110
Output Noise Voltage
Thermal Shutdown Temperature (Note 4)
Thermal Shutdown Hysteresis (Note 4)
VIN = 3.0 V, VOUT = 1.2 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
VOUT = 1.2 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
V
mV
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
1.236
4.2
mA
5.8
mA
PSRR
63
dB
VN
105
mVrms
Temperature increasing from TJ = +25°C
TSD
Temperature falling from TSD
TSDH
155
−
25
°C
−
°C
3. Not Characterized at VIN = 3.0 V, VOUT = 1.2 V, IOUT = 80 mA
4. Guaranteed by design and characterization.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Respect SOA
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NCP716
Table 5. ELECTRICAL CHARACTERISTICS Voltage version 1.5 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 9)
Parameter
Operating Input Voltage
Test Conditions
Symbol
Min
Max
Unit
IOUT ≤ 10 mA
VIN
2.5
24
V
3.0
24
10 mA < IOUT < 80 mA
Output Voltage Accuracy
1.455
Typ
3.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
1.5
1.545
V
Line Regulation
3.0 V ≤ VIN ≤ 24 V, IOUT = 1 mA
RegLINE
20
mV
Load Regulation
IOUT = 0 mA to 80 mA
RegLOAD
20
mV
(Note 10)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Dropout voltage (Note 7)
Maximum Output Current
Ground current
110
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 8)
Thermal Shutdown Hysteresis (Note 8)
VIN = 3.0 V, VOUT = 1.5 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
VOUT = 1.5 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
4.2
mA
5.8
mA
PSRR
60
dB
VN
120
mVrms
Temperature increasing from TJ = +25°C
TSD
Temperature falling from TSD
TSDH
155
−
25
°C
−
°C
7. Not Characterized at VIN = 3.0 V, VOUT = 1.5 V, IOUT = 80 mA
8. Guaranteed by design and characterization.
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
10. Respect SOA
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NCP716
Table 6. ELECTRICAL CHARACTERISTICS Voltage version 1.8 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 13)
Parameter
Operating Input Voltage
Test Conditions
Symbol
Min
Max
Unit
IOUT ≤ 10 mA
VIN
2.8
24
V
3.0
24
10 mA < IOUT < 80 mA
Output Voltage Accuracy
1.746
Typ
3.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
1.8
1.854
V
Line Regulation
3.0 V ≤ VIN ≤ 24 V, IOUT = 1 mA
RegLINE
15
mV
Load Regulation
IOUT = 0 mA to 80 mA
RegLOAD
15
mV
(Note 14)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Dropout voltage (Note 11)
Maximum Output Current
Ground current
110
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 12)
Thermal Shutdown Hysteresis (Note 12)
VIN = 3.0 V, VOUT = 1.8 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
VOUT = 1.8 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
4.2
mA
5.8
mA
PSRR
60
dB
VN
140
mVrms
Temperature increasing from TJ = +25°C
TSD
Temperature falling from TSD
TSDH
155
−
25
°C
−
°C
11. Not Characterized at VIN = 3.0 V, VOUT = 1.8 V, IOUT = 80 mA
12. Guaranteed by design and characterization.
13. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
14. Respect SOA
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NCP716
Table 7. ELECTRICAL CHARACTERISTICS Voltage version 2.5 V
−40°C ≤ TJ ≤ 125°C; VIN = 3.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 17)
Parameter
Test Conditions
Symbol
Min
0 < IOUT < 80 mA
VIN
3.5
Output Voltage Accuracy
3.5 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
2.45
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1mA
RegLINE
15
mV
Load Regulation
IOUT = 0 mA to 80 mA
RegLOAD
15
mV
Dropout voltage (Note 15)
VDO = VIN – (VOUT(NOM) – 75 mV)
IOUT = 80 mA
VDO
Maximum Output Current
(Note 18)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Operating Input Voltage
Ground current
Typ
2.5
400
Output Noise Voltage
Thermal Shutdown Temperature (Note 16)
Thermal Shutdown Hysteresis (Note 16)
VIN = 3.5 V, VOUT = 2.5 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
Unit
24
V
2.55
V
640
110
mV
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Max
4.2
mA
5.8
mA
PSRR
60
dB
VOUT = 2.5 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
160
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
−
25
−
°C
15. Characterized when VOUT falls 75 mV below the regulated voltage and only for devices with VOUT = 2.5 V
16. Guaranteed by design and characterization.
17. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
18. Respect SOA
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6
NCP716
Table 8. ELECTRICAL CHARACTERISTICS Voltage version 3.0 V
−40°C ≤ TJ ≤ 125°C; VIN = 4.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 21)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
0 < IOUT < 80 mA
VIN
4.0
Output Voltage Accuracy
4.3 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
2.94
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Max
Unit
24
V
3.0
3.06
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
Dropout voltage (Note 19)
VDO = VIN – (VOUT(NOM) – 90 mV)
IOUT = 80 mA
VDO
580
mV
Maximum Output Current
(Note 22)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Ground current
Typ
370
110
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 20)
Thermal Shutdown Hysteresis (Note 20)
VIN = 4.3 V, VOUT = 3.3 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
4.2
mA
5.8
mA
PSRR
58
dB
VOUT = 4.3 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
190
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
−
25
−
°C
19. Characterized when VOUT falls 90 mV below the regulated voltage and only for devices with VOUT = 3.0 V
20. Guaranteed by design and characterization.
21. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
22. Respect SOA
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NCP716
Table 9. ELECTRICAL CHARACTERISTICS Voltage version 3.3 V
−40°C ≤ TJ ≤ 125°C; VIN = 4.3 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 25)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
0 < IOUT < 80 mA
VIN
4.3
Output Voltage Accuracy
4.3 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
3.234
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Max
Unit
24
V
3.3
3.366
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
Dropout voltage (Note 23)
VDO = VIN – (VOUT(NOM) – 99 mV)
IOUT = 80 mA
VDO
560
mV
Maximum Output Current
(Note 26)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Ground current
Typ
350
110
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 24)
Thermal Shutdown Hysteresis (Note 24)
VIN = 4.3 V, VOUT = 3.3 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT = 10 mF
f = 100 kHz
4.2
mA
5.8
mA
PSRR
60
dB
VOUT = 4.3 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
200
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
−
25
−
°C
23. Characterized when VOUT falls 99 mV below the regulated voltage and only for devices with VOUT = 3.3 V
24. Guaranteed by design and characterization.
25. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
26. Respect SOA
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NCP716
Table 10. ELECTRICAL CHARACTERISTICS Voltage version 5.0 V
−40°C ≤ TJ ≤ 125°C; VIN = 6.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TJ = +25°C. (Note 29)
Parameter
Test Conditions
Symbol
Min
Operating Input Voltage
0 < IOUT < 80 mA
VIN
6.0
Output Voltage Accuracy
6.0 V < VIN < 24 V, 0 < IOUT < 80 mA
VOUT
4.9
Line Regulation
VOUT + 1 V ≤ VIN ≤ 24 V, IOUT = 1 mA
Load Regulation
Max
Unit
24
V
5.0
5.1
V
RegLINE
4
10
mV
IOUT = 0 mA to 80 mA
RegLOAD
10
30
mV
Dropout voltage (Note 27)
VDO = VIN – (VOUT(NOM) – 150 mV)
IOUT = 80 mA
VDO
500
mV
Maximum Output Current
(Note 30)
IOUT
0 < IOUT < 80 mA, −40 < TA < 85°C
IGND
Ground current
Typ
310
110
mA
3.2
0 < IOUT < 80 mA, VIN = 24 V
Power Supply Rejection Ratio
Output Noise Voltage
Thermal Shutdown Temperature (Note 28)
Thermal Shutdown Hysteresis (Note 28)
VIN = 6.0 V, VOUT = 5.0 V
VPP = 200 mV modulation
IOUT = 1 mA, COUT =10 mF
f = 100 kHz
4.2
mA
5.8
mA
PSRR
54
dB
VOUT = 5.0 V, IOUT = 80 mA
f = 200 Hz to 100 kHz
VN
220
mVrms
Temperature increasing from TJ = +25°C
TSD
155
°C
Temperature falling from TSD
TSDH
−
25
−
°C
27. Characterized when VOUT falls 150 mV below the regulated voltage and only for devices with VOUT = 5.0 V
28. Guaranteed by design and characterization.
29. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
30. Respect SOA
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NCP716
TYPICAL CHARACTERISTICS
1.220
2.514
IOUT = 1 mA
CIN = COUT = 1 mF
2.510
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.215
1.210
VIN = 2.5 V
1.205
VIN = (5 V − 24 V)
1.200
1.195
0
20
40
60
80
VIN = (5 V − 24 V)
2.502
2.498
2.490
−40 −20
120
100
0
20
4.995
VIN = (4.3 V − 24 V)
3.300
3.296
3.292
IOUT = 1 mA
CIN = COUT = 1 mF
3.288
3.284
−40 −20
120
0
20
40
IOUT = 1 mA
CIN = COUT = 1 mF
VIN = (8 V − 24 V)
4.985
VIN = 6.0 V
4.975
4.965
4.955
60
80
100
4.945
−40 −20
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. NCP716x33xxx Output Voltage vs.
Temperature
Figure 6. NCP716x50xxx Output Voltage vs.
Temperature
1.214
2.52
1.210
VIN = 3.0 V
24 V
10 V
15 V
4.0 V
5.0 V
1.202
1.198
TA = 25°C
CIN = COUT = 1 mF
10
20
20 V
2.51
OUTPUT VOLTAGE (V)
20 V
OUTPUT VOLTAGE (V)
100
Figure 4. NCP716x25xxx Output Voltage vs.
Temperature
3.304
0
80
Figure 3. NCP716x12xxx Output Voltage vs.
Temperature
5.005
1.194
60
TEMPERATURE (°C)
3.308
1.206
40
TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.506
2.494
1.190
−40 −20
1.190
IOUT = 1 mA
CIN = COUT = 1 mF
VIN = 3.5 V
VIN = 3.5 V
40
50
60
70
5.0 V
2.49
2.48
2.46
80
15 V
2.50
TA = 25°C
CIN = COUT = 1 mF
2.47
30
24 V
10 V
0
10
20
30
40
50
60
70
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 7. NCP716x12xxx Output Voltage vs.
Output Current
Figure 8. NCP716x25xxx Output Voltage vs.
Output Current
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10
80
NCP716
5.000
3.300
4.995
3.296
VIN = 4.3 V
5.0 V
3.292
3.288
10 V
0
10
20
15 V
20 V
TA = 25°C
CIN = COUT = 1 mF
3.284
3.280
30
40
50
60
70
4.985
8.0 V
15 V
0
10
20
30
40
50
60
Figure 9. NCP7163V3 Output Voltage vs.
Output Current
Figure 10. NCP716x50xxx Output Voltage vs.
Output Current
0.6
TA = 25°C
TA = −40°C
0.2
0.1
10
20
30
40
50
60
70
80
70
OUTPUT CURRENT (mA)
0.5
TA = 125°C
CIN = COUT = 1 mF
0.4
TA = 25°C
0.3
0.2
TA = −40°C
0.1
0
80
0
10
20
30
40
50
60
80
70
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 11. NCP716x25xxx Dropout Voltage vs.
Output Current
Figure 12. NCP716x33xxx Dropout Voltage vs.
Output Current
0.6
30
CIN = COUT = 1 mF
0.5
QUIESCENT CURRENT (mA)
DROPOUT VOLTAGE (V)
20 V
24 V
OUTPUT CURRENT (mA)
0.3
TA = 125°C
0.4
TA = 25°C
0.3
0.2
TA = −40°C
0.1
0
10 V
4.980
4.970
80
CIN = COUT = 1 mF
0
VIN = 6.0 V
24 V
0.4
0
4.990
TA = 125°C
0.5
TA = 25°C
CIN = COUT = 1 mF
4.975
0.6
DROPOUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.304
DROPOUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
70
20
15
10
IOUT = 80 mA
5
0
80
TA = 25°C
CIN = COUT = 1 mF
25
IOUT = 0
0
5
10
15
20
25
OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
Figure 13. NCP716x50xxx Dropout Voltage vs.
Output Current
Figure 14. NCP716x12xxx Ground Current vs.
Input Voltage
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NCP716
TYPICAL CHARACTERISTICS
40
TA = 25°C
CIN = COUT = 1 mF
25
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
30
20
15
10
IOUT = 80 mA
5
0
IOUT = 0
0
5
10
15
20
15
10
IOUT = 80 mA
5
IOUT = 0
0
5
10
15
20
25
Figure 15. NCP716x25xxx Ground Current vs.
Input Voltage
Figure 16. NCP716x50xxx Ground Current vs.
Input Voltage
5.5
TA = 25°C
CIN = COUT = 1 mF
25
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
20
INPUT VOLTAGE (V)
20
15
10
IOUT = 80 mA
5
IOUT = 0
0
5
10
15
20
5.0
IOUT = 0
CIN = COUT = 1 mF
4.5
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 3.0 V
3.0
2.5
−40 −20
25
0
20
40
60
80
100
120
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 17. NCP716x33xxx Ground Current vs.
Input Voltage
Figure 18. NCP716x12xxx Quiescent Current
vs. Temperature
5.5
5.5
IOUT = 0
CIN = COUT = 1 mF
5.0
4.5
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
25
INPUT VOLTAGE (V)
30
0
30
0
25
TA = 25°C
CIN = COUT = 1 mF
35
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 3.5 V
3.0
2.5
−40
−20
0
20
40
60
80
100
5.0
IOUT = 0
CIN = COUT = 1 mF
4.5
VIN = 24 V
4.0
VIN = 10 V
3.5
VIN = 4.3 V
3.0
2.5
−40 −20
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 19. NCP716x25xxx Quiescent Current
vs. Temperature
Figure 20. NCP716x33xxx Quiescent Current
vs. Temperature
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12
NCP716
TYPICAL CHARACTERISTICS
100
IOUT = 0
CIN = COUT = 1 mF
5.0
VIN = 24 V
4.5
4.0
VIN = 10 V
3.5
VIN = 6.0 V
IOUT = 10 mA
60
40
IOUT = 80 mA
20
3.0
2.5
−40
−20
0
20
40
60
80
100
0
120
0.1
1
10
100
1000
TEMPERATURE (°C)
FREQUENCY (kHz)
Figure 21. NVP716x50xxx Quiescent Current
vs. Temperature
Figure 22. NCP716x12xxx PSRR vs. Frequency
100
100
VIN = 3.5 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
IOUT = 1 mA
60
40
60
IOUT = 1 mA
40
IOUT = 10 mA
IOUT = 80 mA
IOUT = 80 mA
20
VIN = 4.3 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
80
PSRR (dB)
80
PSRR (dB)
VIN = 3.0 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
IOUT = 1 mA
80
PSRR (dB)
QUIESCENT CURRENT (mA)
5.5
20
IOUT = 10 mA
0
0.1
1
10
100
0
1000
1
10
1000
FREQUENCY (kHz)
Figure 23. NCP716x25xxx PSRR vs. Frequency
Figure 24. NCP716x33xxx PSRR vs. Frequency
1.6
VIN = 6.0 V + 200 mVpp modulation
COUT = 10 mF
TA = 25°C
60
1.2
IOUT = 1 mA
IOUT = 10 mA
40
1.0
0.8
0.6
0.4
IOUT = 80 mA
20
IOUT = 80 mA
TA = 25°C
VIN = 3.0 V
1.4
mV/sqrt (Hz)
80
COUT = 4.7 mF
0.2
0
100
FREQUENCY (kHz)
100
PSRR (dB)
0.1
0.1
1
10
100
1000
0
0.01
COUT = 10 mF
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 25. NCP716x50xxx PSRR vs. Frequency
Figure 26. NCP716x12xxx Output Spectral
Noise Density vs. Frequency
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13
NCP716
TYPICAL CHARACTERISTICS
4.0
5.0
4.0
3.5
2.5
mV/sqrt (Hz)
mV/sqrt (Hz)
3.0
2.0
1.5
3.0
2.5
2.0
1.5
1.0
COUT = 4.7 mF
0.5
0
IOUT = 80 mA
TA = 25°C
VIN = 4.3 V
4.5
IOUT = 80 mA
TA = 25°C
VIN = 3.5 V
3.5
1.0
COUT = 10 mF
0.01
0.1
1
10
100
1000
0.5
0
COUT = 4.7 mF
COUT = 10 mF
0.01
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 27. NCP716x25xxx Output Spectral
Noise Density vs. Frequency
Figure 28. NCP716x33xxx Output Spectral
Noise Density vs. Frequency
8
IOUT = 80 mA
TA = 25°C
VIN = 6.0 V
7
mV/sqrt (Hz)
6
5
4
3
2
COUT = 4.7 mF
1
0
1000
COUT = 10 mF
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 29. NCP716x50xxx Output Spectral
Noise Density vs. Frequency
Figure 30. Load Transient Response
Figure 31. Load Transient Response
Figure 32. Load Transient Response
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14
NCP716
TYPICAL CHARACTERISTICS
Figure 33. Load Transient Response
Figure 34. Line Transient Response
Figure 35. Line Transient Response
Figure 36. Line Transient Response
Figure 37. Line Transient Response
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15
NCP716
APPLICATIONS INFORMATION
Power Dissipation and Heat sinking
The NCP716 is the member of new family of Wide Input
Voltage Range Low Dropout Regulators which delivers
Ultra Low Ground Current consumption, Good Noise and
Power Supply Rejection Ratio Performance.
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP716 can handle is given by:
Input Decoupling (CIN)
It is recommended to connect at least 0.1 mF Ceramic X5R
or X7R capacitor between IN and GND pin of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or Noise superimposed onto constant
Input Voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes.
Higher capacitance and lower ESR Capacitors will
improve the overall line transient response.
P D(MAX) +
ƪTJ(MAX) * TAƫ
(eq. 1)
R qJA
The power dissipated by the NCP716 for given
application conditions can be calculated from the following
equations:
P D [ V INǒI GND(I OUT)Ǔ ) I OUTǒV IN * V OUTǓ
(eq. 2)
or
Output Decoupling (COUT)
The NCP716 does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 0.47 mF or greater up to 10 mF. The X5R and
X7R types have the lowest capacitance variations over
temperature thus they are recommended.
V IN(MAX) [
P D(MAX) ) ǒV OUT
I OUTǓ
I OUT ) I GND
(eq. 3)
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP716, and
make traces as short as possible.
ORDERING INFORMATION
Device
Voltage Option
Marking
NCP716MT12TBG
1.2 V
6A
NCP716MT15TG
1.5 V
6C
NCP716MT18TBG
1.8 V
6D
NCP716MT25TBG
2.5 V
6E
NCP716MT30TBG
3.0 V
6F
NCP716MT33TBG
3.3 V
6G
NCP716MT50TBG
5.0 V
6H
Package
Shipping†
WDFN6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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16
NCP716
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE O
D
ÍÍÍ
ÍÍÍ
ÍÍÍ
PIN ONE
REFERENCE
0.10 C
0.10 C
EXPOSED Cu
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
E
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L
L
L1
TOP VIEW
DETAIL A
ALTERNATE
CONSTRUCTIONS
A3
DETAIL B
0.05 C
ÇÇ
ÇÇ
ÉÉ
A
B
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.90
1.10
0.65 BSC
0.40
0.20
--0.15
A
6X
0.05 C
A1
NOTE 4
C
SIDE VIEW
D2
DETAIL A
1
3
RECOMMENDED
MOUNTING FOOTPRINT*
SEATING
PLANE
1.72
L
1.12
E2
6
4
6X
0.45
6X
PACKAGE
OUTLINE
b
e
BOTTOM VIEW
0.10
M
C A
0.05
M
C
B
6X
2.30
1
0.40
NOTE 3
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP716/D
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