Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) U2J Dielectric, 10 - 50 VDC (Commercial Grade) Overview KEMET’s U2J dielectric features a maximum operating temperature of 125°C and is considered stable. The Electronics Industries Alliance (EIA) characterizes U2J dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. U2J is an extremely stable dielectric material that exhibits a negligible shift in capacitance with respect to voltage and boasts a predictable and linear change in capacitance with reference to ambient temperature with no aging effect. In addition, U2J dielectric extends the available capacitance range of Class I MLCCs to achieve values previously only available using Class II dielectric materials like X7R, X5R, Y5V and Z5U. U2J is not sensitive to DC Bias as compared to Class II dielectric materials and retains over 99% of nominal capacitance at full rated voltage. Capacitance change is limited to −750 ± 120 ppm /°C from −55°C to +125°C. These devices are Lead-free, RoHS and REACH compliant without exception and are capable of withstanding multiple passes through a Lead-free solder reflow profile. Benefits • • • • • • • • • • • Operating temperature range of −55°C to +125°C Lead (Pb)-free, RoHS and REACH compliant EIA 0402, 0603, 0805, 1206, 1210 and 1812 case sizes DC voltage ratings of 10 V, 16 V, 25 V and 50 V Capacitance offerings ranging from 1.0 nF up to 470 nF Available capacitance tolerances of ±1%, ±2%, ±5%, ±10% and ±20% Low noise solution similar to C0G Low dissipation factor DF < 0.1% Low ESR & ESL High thermal stability High ripple current capability Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C Ceramic 1206 Case Size Specification/ (L" x W") Series1 0402 0603 0805 1206 1210 1812 1 2 C C = Standard 104 Capacitance Code (pF) Two significant digits + number of zeros. J 3 A J Capacitance Rated Voltage Failure Rate/ Dielectric Tolerance2 (VDC) Design F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 8 = 10 4 = 16 3 = 25 5 = 50 J = U2J A = N/A C TU Termination Finish3 Packaging/Grade (C-Spec) C = 100% Matte Sn See “Packaging C-Spec Ordering Options Table” below Flexible termination option is available. Please see FT-CAP product bulletin C1062_C0G_FT-CAP_SMD Additional capacitance tolerance offerings may be available. Contact KEMET for details. One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 1 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type1 Bulk Bag/Unmarked 7" Reel/Unmarked 13" Reel/Unmarked 7" Reel/Unmarked/2 mm pitch2 13" Reel/Unmarked/2 mm pitch2 Not required (Blank) TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) 7081 7082 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see “Capacitor Marking”. 2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. 1 1 Benefits cont'd • • • • • Preferred capacitance solution at line frequencies & into the MHz range Small predictable and linear capacitance change with respect to temperature Non-polar device, minimizing installation concerns 100% pure matte Tin-plated termination finish allowing for excellent solderability Retains 99% of nominal capacitance at full rated voltage Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression and blocking, as well as energy storage in critical and safety relevant circuits without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 2 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code B Bandwidth S Separation Minimum 0402 1005 1.00 (0.040)±0.05 (0.002) 0.50 (0.020)± 0.05 (0.002) 0.30 (0.012)±0.10 (0.004) 0.30 (0.012) 0603 1608 1.60 (0.063)±0.15 (0.006) 0.80 (0.032)±0.15 (0.006) 0.35 (0.014)±0.15 (0.006) 0.70 (0.028) 0805 2012 2.00 (0.079)±0.20 (0.008) 1.25 (0.049)±0.20 (0.008) 0.50 (0.02)±0.25 (0.010) 0.75 (0.030) 1206 3216 3.20 (0.126)±0.20 (0.008) 1.60 (0.063)±0.20 (0.008) 0.50 (0.02)±0.25 (0.010) 1210 3225 3.20 (0.126)±0.20 (0.008) 2.50 (0.098)±0.20 (0.008) 0.50 (0.02)±0.25 (0.010) 1812 4532 4.50 (0.177)±0.30 (0.012) 3.20 (0.126)±0.30 (0.012) 0.60 (0.024)±0.35 (0.014) L Length W Width T Thickness © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com N/A Mounting Technique Solder wave or Solder reflow Solder reflow only C1086_U2J • 6/7/2016 3 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Limit at 25°C −55°C to +125°C −750 ±12030 ppm/ºC 0.1% 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) 0.1% 1,000 megohm microfarads or 100 GΩ (Rated voltage applied for 120 ±5 seconds at 25°C) To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF 1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) U2J All All 0.5 Capacitance Shift Insulation Resistance 0.3% or ±0.25 pF 10% of Initial Limit © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 4 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) 3 5 8 4 3 5 8 4 3 5 8 4 3 50 10 16 25 50 10 16 25 50 10 16 25 50 3 5 8 GB GB GB GB GB GB GB GB GB 50 4 25 FB FB FB 25 FB FB FB 16 FB FB FB 16 FB FB FB 10 5 8 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 4 3 5 8 C0603C DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN DN EB EB EB 4 3 5 8 C0805C © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com EB EB EB EB EB EB EB EB EB 10 3 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 50 4 C0402C CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 25 CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF CF 16 8 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 10 Voltage Code Case Size/Series BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 50 Rated Voltage (VDC) BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 25 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 16 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 10 K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 50 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 25 G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G 16 F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F 4 3 5 Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 10 Capacitance Tolerance 5 50 4 10 8 50 5 50 3 25 4 25 8 16 5 16 3 10 4 25 C1812C 16 C1210C 8 50 Capacitance Cap Code C1206C Voltage Code 25 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 C0805C Rated Voltage (VDC) 16 100 pF 110 pF 120 pF 130 pF 150 pF 160 pF 180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF C0603C 10 Cap Code C0402C 10 Capacitance Case Size/ Series 4 3 5 8 C1206C C1210C C1812C C1086_U2J • 6/7/2016 5 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont'd 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 25 50 10 16 25 50 10 16 25 50 10 16 25 50 Capacitance Tolerance DN DN DP DP DG DG DG DN DN DP DP DG DG DG DN DN DP DP DG DG DG DN DP DP DG DG DG EB EB EB EB EB EB EB EC EC EC EF EF EH EH EB EB EB EB EB EB EB EC EC EC EF EF EH EH EB EB EB EB EB EB EB EC EC EC EF EF EH EH EB EB EB EB EB EB EC EC EE EF EH EH FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM FB FB FB FB FB FB FB FB FB FC FE FG FG FH FM GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GC GH GK Rated Voltage (VDC) 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 M M M M M M M M M M M M M M M M M M 10 K K K K K K K K K K K K K K K K K K 50 J J J J J J J J J J J J J J J J J J 25 G G G G G G G G G G G G G G G G G G 16 F F F F F F F F F F F F F F F F F F Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions 5 50 3 25 4 16 8 10 5 50 3 25 4 16 8 10 Voltage Code Rated Voltage (VDC) 16 C1812C 10 Cap Code C1210C 50 Capacitance C1206C 25 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 C0805C 16 18,000 pF 22,000 pF 27,000 pF 33,000 pF 47,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 100,000 pF 120,000 pF 150,000 pF 180,000 pF 220,000 pF 270,000 pF 330,000 pF 390,000 pF 470,000 pF C0603C 10 Cap Code C0402C 10 Capacitance Case Size/ Series Voltage Code 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 8 4 3 5 Case Size/Series C0402C C0603C C0805C © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1206C C1210C C1812C C1086_U2J • 6/7/2016 6 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Code Case Size1 Thickness ± Range (mm) BB BD CF CH DM DN DP DE DF DG EB EC ED EE EF EH FB FC FE FF FG FH FM FJ FK GB GD GH GG GK GJ GN GM 0402 0402 0603 0603 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 0.50 ± 0.05 0.55 ± 0.05 0.80 ± 0.07 0.85 ± 0.07 0.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.60 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.55 ± 0.15 1.70 ± 0.20 1.85 ± 0.20 2.10 ± 0.20 1.00 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 2.00 ± 0.20 Thickness Code Case Size1 Thickness ± Range (mm) Paper Quantity1 Plastic Quantity 7" Reel 13" Reel 7" Reel 13" Reel 7" Reel 13" Reel 7" Reel 13" Reel 10,000 10,000 4,000 4,000 4,000 4,000 4,000 0 0 0 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 50,000 15,000 10,000 15,000 15,000 15,000 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Paper Quantity1 0 0 0 0 0 0 0 2,500 2,500 2,500 4,000 4,000 2,500 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 0 0 0 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 Plastic Quantity Package quantity based on finished chip thickness specifications. 1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 7 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec N/A 2 Case Size Packaging Quantities (pieces/unit packaging) 1 EIA (in) Metric (mm) Minimum 0402 0603 0805 1206 1210 1812 1005 1608 2012 3216 3225 4532 1 Maximum 50,000 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products. 2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "Bulk Bag" packaging. 1 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 8 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0402 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 12101 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 9 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Ramp-Up Rate (TL to TP) Termination Finish SnPb 100% Matte Sn 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Time 25°C to Peak Temperature TL tP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec tL Tsmax Tsmin tS 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) Ramp-Down Rate (TP to TL) TP Temperature Profile Feature 25 25° C to Peak Time 6°C/second maximum 6°C/second maximum 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 10 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Package Size (L" x W") Force Duration 0402 0603 ≥ 0805 5 N (0.51 kg) 10 N (1.02 kg) 18 N (1.83 kg) 60 seconds Terminal Strength JIS–C–6429 Appendix 1, Note: Board Flex JIS–C–6429 Appendix 2, Note: 3.0 mm (minimum). Magnification 50 X Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Temperature Cycling JESD22 Method JA-104 1,000 cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C°/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/− 4 hours after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Measurement at 24 hrs. +/− 4 hours after test conclusion. −55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell time – 15 minutes. Air – Air. Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108/EIA -198 Storage Life MIL-STD-202 Method 108 125°C, 0 VDC for 1,000 hours. Vibration MIL-STD-202 Method 204 5 G's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent. 1,000 hours at 125°C with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 11 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Construction Detailed Cross Section Barrier Layer (Ni) Termination Finish (100% Matte Sn) Dielectric Material (CaZrO3) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) Capacitor Marking (Optional): Laser marking option is not available on: • • • • C0G, Ultra Stable X8R and Y5V dielectric devices EIA 0402 case size devices EIA 0603 case size devices with Flexible Termination option. KPS Commercial and Automotive grade stacked devices. These capacitors are supplied unmarked only. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 12 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Punched Paper 7" Reel Pitch (P1)* 13" Reel Pitch (P1)* 01005 – 0402 8 2 2 0603 8 2/4 2/4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥ 1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. New 2 mm Pitch Reel Options* Packaging Ordering Code (C-Spec) C-3190 C-3191 C-7081 C-7082 Packaging Type/Options Automotive grade 7" reel unmarked Automotive grade 13" reel unmarked Commercial grade 7" reel unmarked Commercial grade 13" reel unmarked * 2 mm pitch reel only available for 0603 EIA case size. 2 mm pitch reel for 0805 EIA case size under development. Benefits of Changing from 4 mm to 2 mm Pitching Spacing • Lower placement costs • Double the parts on each reel results in fewer reel changes and increased efficiency • Fewer reels result in lower packaging, shipping and storage costs, reducing waste © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 13 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 ±0.05 0.600 (0.079 ±0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 (0.138 ±0.002) 5.5 ±0.05 (0.217 ±0.002) 7.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 8.0 ±0.10 (0.315 ±0.004) 12.0 ±0.10 (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 14 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) G Minimum 0.10 (0.004) Maximum R Reference Note 2 0.75 (0.030) 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) T1 Maximum Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 ±0.05 (0.138 ±0.002) P1 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 15 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 5 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1086_U2J • 6/7/2016 16 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 17 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 18 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Wyboston, United Kingdom Tel: 44-1480-273082 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835 KEMET Way Simpsonville, SC 29681 Northeast Wilmington, MA Tel: 978-658-1663 Southeast Lake Mary, FL Tel: 407-855-8886 Central Novi, MI Tel: 248-994-1030 Beijing, China Tel: 86-10-5877-1075 Shanghai, China Tel: 86-21-6447-0707 Seoul, South Korea Tel: 82-2-6294-0550 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 Irving, TX Tel: 972-915-6041 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 19 Preliminary Data Sheet Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – U2J Dielectric, 10 - 50 VDC (Commercial Grade) Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1086_U2J • 6/7/2016 20