Material Content Data Sheet Sales Product Name IPD050N03L G MA# MA000638988 Package PG-TO252-3-311 Issued 29. August 2013 Weight* 317.04 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 1.415 0.45 0.143 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.45 4464 4464 452 0.043 0.01 143.098 45.12 45.18 451351 136 451939 1.903 0.60 0.60 6003 6003 0.321 0.10 1012 19.371 6.11 126.171 39.80 46.01 397960 460069 3.740 1.18 1.18 11797 11797 0.086 0.03 0.000 0.00 0.039 0.01 0.031 0.01 1.480 0.47 0.006 0.00 0.019 0.01 19.177 6.05 61097 273 0.03 1 98 0.49 4667 2. 3. 61 6.06 60488 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4887 18 Important Remarks: 1. 274 122 60567 1000000