Through Hole Lamp Product Data Sheet LTL81HKFK-051A Spec No.: DS20-2016-0029 Effective Date: 03/25/2016 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto ` Through Hole Lamp LTL81HKFK-051A Through Hole Lamp LTL81HKFK-051A Rev Description By Date Above data for PD and Customer tracking only - Upload in OPNC Lance 1/10 03/11/2016 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 1. Description Through hole LEDs are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indication. Several intensity and viewing angle choices are available in each color for design flexibility. 1. 1. Features Low power consumption & High efficiency Lead free & RoHS Compliant Popular T-1 diameter Yellow Orange AlInGaP 605nm Lamp & Water clear lens 1.2. Applications Communication Computer Consumer Home appliance Industrial 2. Outline Dimensions Notes : 1. 2. 3. 4. All dimensions are in millimeters (inches). Tolerance is ±0.25mm (.010") unless otherwise noted. Protruded resin under flange is 1.0mm (.04") max. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. 2/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 3. Absolute Maximum Ratings at TA=25°C Parameter Maximum Rating Unit 75 mW (Duty Cycle≦1/10, Pulse Width≦10ms) 60 mA DC Forward Current 30 mA 0.45 mA/°C Power Dissipation Peak Forward Current Derating Linear From 30℃ Operating Temperature Range -40°C to + 85°C Storage Temperature Range -55°C to + 100°C Lead Soldering Temperature [2.0mm (.079") From Body] 260°C for 5 Seconds Max. 4. Electrical / Optical Characteristics at TA=25°C Parameter Symbol Min. IV 30 Typ. Max. Unit 140 mcd Test Condition IF = 20mA Luminous Intensity 2θ1/2 130 deg Peak Emission Wavelength λP 611 nm Dominant Wavelength λd 605 nm Spectral Line Half-Width Δλ 17 nm Forward Voltage VF 2.1 Reverse Current IR Viewing Angle Note 1 Note 2 (Fig.6) Measurement @Peak (Fig.1) Note 4 2.6 V IF = 20mA 100 μA VR = 5V , Note 5 NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 5. Iv guarantee must be included with ±15% testing tolerance. 6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation. 3/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 5. Typical Electrical / Optical Characteristics Curves (25°C Ambient Temperature Unless Otherwise Noted) 4/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 6. Taping Features * Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and folding. * 2.54mm (0.1") straight lead spacing available. * Folding packaging simplifies handling and testing. * Reel packaging is available by removing suffix “A” on option. Package Dimensions Specification Item Symbol Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165 Component Lead Pitch F 4.8 0.188 5.8 0.228 Front to Rear Deflection △H -- -- 2.0 0.078 Height of Seating Plane H 15.5 0.610 16.5 0.649 Feed Hole to Bottom of Component H1 20.8 0.818 22.8 0.898 Feed Hole to Overall Component Height H2 25.1 0.988 27.7 1.090 Lead Length After Component Height L 11.0 0.433 Feed Hole Pitch P 12.4 0.488 13.0 0.511 Lead Location P1 3.15 0.124 4.55 0.179 Center of Component Location P2 5.05 0.198 7.65 0.301 T -- -- 0.90 0.035 Feed Hole Location W0 8.5 0.334 9.75 0.384 Adhesive Tape Position W2 0 0 3.0 0.118 Tape Width W3 17.5 0.689 19.0 0.748 Total Taped Thickness W0 5/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 7. Packing Spec. Total 3,000pcs per inner carton 10 Inner cartons per outer carton Total 30,000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing 6/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 8. Bin Table Specification Luminous Intensity Iv (mcd) IF@20mA Bin Code Min. Max. AB 30 50 CD 50 85 EF 85 140 Note: Tolerance of each bin limit is ±15% 7/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 9. CAUTIONS 9.1. Application This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 9.2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 9.3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 9.4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 9.5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions: Soldering iron Temperature Soldering time Position 350°C Max. 3 seconds Max. (one time only) No closer than 2mm from the base of the epoxy bulb Wave soldering Pre-heat Pre-heat time Solder wave Soldering time Dipping Position 100°C Max. 60 seconds Max. 260°C Max. 5 seconds Max. No lower than 2mm from the base of the epoxy bulb Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. 9.6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model (A) LED Circuit model (B) LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 8/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 9.7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Suggested checking list: Training and Certification 9.7.1.1. Everyone working in a static-safe area is ESD-certified? 9.7.1.2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 9.7.2.1. Static-safe workstation or work-areas have ESD signs? 9.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 9.7.2.3. All ionizer activated, positioned towards the units? 9.7.2.4. Each work surface mats grounding is good? Personnel Grounding 9.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk? 9.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 9.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 9.7.3.4. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 9.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging? 9.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 9.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 9.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 9.7.5.1. Audit result reported to entity ESD control coordinator? 9.7.5.2. Corrective action from previous audits completed? 9.7.5.3. Are audit records complete and on file? 9/10 Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 ` Through Hole Lamp LTL81HKFK-051A 10. Reliability Test Classification Endurance Test Item Test Condition Sample Size Reference Standard Operation Life Ta = Under room temperature IF = per datasheet maximum drive current Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) High Temperature High Humidity storage Ta = 60°C RH = 90% Test Time= 240hrs 22 PCS (CL=90%; LTPD=10%) High Temperature Storage Ta= 105 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1031 (1995) MIL-STD-883G:1008 (2006) JEITA ED-4701:200 201 (2001) Low Temperature Storage Ta= -55 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) JEITA ED-4701:200 202 (2001) Temperature Cycling 100°C ～ 25°C ～ -40°C ～ 25°C 30mins 5mins 30mins 5mins 30 Cycles 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1051 (1995) MIL-STD-883G:1010 (2006) JEITA ED-4701:100 105 (2001) JESD22-A104C (2005) Thermal Shock 100 ± 5°C ～ -30°C ± 5°C 15mins 15mins 30 Cycles (<20 secs transfer) 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1056 (1995) MIL-STD-883G:1011 (2006) MIL-STD-202G:107G (2002) JESD22-A106B (2004) Solder Resistance T.sol = 260 ± 5°C Dwell Time= 10±1 seconds 3mm from the base of the epoxy bulb 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2031(1995) JEITA ED-4701: 300 302 (2001) Solderability T. sol = 245 ± 5°C Dwell Time= 5 ± 0.5 seconds (Lead Free Solder, Coverage ≧95% of the dipped surface) 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2026 (1995) MIL-STD-883G:2003 (2006) MIL-STD-202G:208H (2002) IPC/EIA J-STD-002 (2004) Soldering Iron T. sol = 350 ± 5°C Dwell Time= 3.5 ± 0.5 seconds 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-202G:208H (2002) JEITA ED-4701:300 302 (2001) MIL-STD-750D:1026 (1995) MIL-STD-883G:1005 (2006) MIL-STD-202G:103B (2002) JEITA ED-4701:100 103 (2001) Test Environmental Test 11. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL81HKFK-051A BNS-OD-FC002/A4 10/10