LINER LTC3548-2 Dual synchronous, fixed /adjustable output, 2.25mhz step-down dc/dc regulator Datasheet

LTC3548-2
Dual Synchronous,
Fixed /Adjustable Output, 2.25MHz
Step-Down DC/DC Regulator
DESCRIPTION
FEATURES
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High Efficiency: Up to 95%
1.8V/800mA Fixed Output and 400mA Adjustable
Output Voltage
Only 40μA Quiescent Current (Both Channels)
2.25MHz Constant-Frequency Operation
High Switch Current Limits: 1.2A and 0.7A
No Schottky Diodes Required
Low RDS(ON) Internal Switches: 0.35Ω
Current Mode Operation for Excellent Line
and Load Transient Response
Short-Circuit Protected
Low Dropout Operation: 100% Duty Cycle
Ultralow Shutdown Current: IQ < 1μA
Power-On Reset Output
Externally Synchronizable Oscillator
Small, Thermally Enhanced 3mm × 3mm DFN Package
APPLICATIONS
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PDAs/Palmtop PCs
Digital Cameras
Cellular Phones
Portable Media Players
PC Cards
Wireless and DSL Modems
The LTC®3548-2 is a dual, constant-frequency, synchronous step-down DC/DC converter. Intended for low power
applications, it operates from 2.5V to 5.5V input voltage
range and has a constant 2.25MHz switching frequency,
allowing the use of tiny, low cost capacitors and inductors
with a profile ≤1.2mm. For channel 1, the output voltage is
fixed at 1.8V/800mA; for channel 2, the output voltage is
adjustable from 0.6V to VIN Internal synchronous 0.35Ω,
1.2A/0.7A power switches provide high efficiency without
the need for external Schottky diodes.
A user selectable mode input is provided to allow the
user to trade-off noise ripple for low power efficiency.
Burst Mode® operation provides high efficiency at light
loads, while pulse-skipping mode provides low noise
ripple at light loads.
To further maximize battery run time, the P-channel
MOSFETs are turned on continuously in dropout (100%
duty cycle), and both channels draw a total quiescent current of only 40μA. In shutdown, the device draws <1μA.
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners. Protected by U.S. Patents, including 5481178, 6127815, 6304066, 6498466, 6580258
6611131..
TYPICAL APPLICATION
Efficiency and Power Loss
vs Load Current
VIN
2.8V TO 5.5V
10μF
1000
100
RUN2
VIN
MODE/SYNC
RUN1
100k
95
POR
RESET
EFFICIENCY
68pF
887k
4.7μF
2.2μH
SW2
SW1
VOUT1
VFB2
280k
VOUT1
1.8V
800mA
GND
85
POWER LOSS
10
80
75
70
10μF
35482 F01
Figure 1. 2.5V/1.8V at 400mA/800mA Step-Down Regulators
100
65
60
1
VIN = 3.6V
1
VOUT = 1.8V
Burst Mode OPERATION
CHANNEL 1
NO LOAD ON CHANNEL 2
0.1
10
100
1000
LOAD CURRENT (mA)
35482 F01b
POWER LOSS (mW)
4.7μH
VOUT2
2.5V
400mA
EFFICIENCY (%)
90
LTC3548-2
35482fb
1
LTC3548-2
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
TOP VIEW
VIN Voltages .................................................– 0.3V to 6V
VOUT1, VFB2 Voltages ........................ –0.3V to VIN + 0.3V
RUN1, RUN2 Voltages .................................–0.3V to VIN
MODE/SYNC Voltage........................ –0.3V to VIN + 0.3V
SW1, SW2 Voltages ......................... –0.3V to VIN + 0.3V
POR Voltage ................................................. –0.3V to 6V
Ambient Operating Temperature Range
(Note 2)....................................................– 40°C to 85°C
Junction Temperature (Note 5) ............................. 125°C
Storage Temperature Range...................– 65°C to 125°C
VOUT1
1
RUN1
2
10 VFB2
9 RUN2
11
VIN
3
SW1
4
7 SW2
GND
5
6 MODE/
SYNC
8 POR
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 125°C, θJA = 40°C/W, θJC = 3°C/W (4-LAYER BOARD)
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3548EDD-2#PBF
LTC3548EDD-2#TRPBF
LCDK
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, unless otherwise specified. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN
VIN
Operating Voltage Range
l
IFB2
Feedback Pin Input Current
l
VFB2
Feedback Voltage of Channel 2 (Note 3)
VOUT1
Output Voltage of Channel 1 (Note 3)
ΔVLINEREG
Reference Voltage Line Regulation
ΔVLOADREG
Output Voltage Load Regulation
IS
TYP
2.5
MAX
UNITS
5.5
V
30
nA
l
0.588
0.585
0.6
0.6
0.612
0.612
V
V
l
1.764
1.755
1.8
1.8
1.836
1.836
V
V
VIN = 2.5V to 5.5V (Note 3)
0.3
0.5
(Note 3)
0.5
Input DC Supply Current (Note 4)
Active Mode
Sleep Mode
Shutdown
VOUT1 = 1.5V, VFB2 = 0.5V
VOUT1 = 1.9V, VFB2 = 0.63V, MODE/SYNC = 3.6V
RUN = 0V, VIN = 5.5V, MODE/SYNC = 0V
700
40
0.1
950
60
1
μA
μA
μA
fOSC
Oscillator Frequency
VOUT1 = 1.8V, VFB2 = 0.6V
2.25
2.7
MHz
fSYNC
Synchronization Frequency
ILIM
Peak Switch Current Limit Channel 1
Peak Switch Current Limit Channel 2
VIN = 3V, Duty Cycle <35%
VIN = 3V, VFB2 = 0.5V, Duty Cycle <35%
RDS(ON)
Top Switch On-Resistance
Bottom Switch On-Resistance
ISW(LKG)
Switch Leakage Current
0°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
0°C ≤ TA ≤ 85°C
–40°C ≤ TA ≤ 85°C
l
1.8
%
2.25
0.95
0.6
%/V
MHz
1.2
0.7
1.6
0.9
A
A
(Note 6)
(Note 6)
0.35
0.30
0.45
0.45
Ω
Ω
VIN = 5V, VRUN = 0V, VFB2 = 0V, VOUT1 = 0V
0.01
1
μA
35482fb
2
LTC3548-2
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, unless otherwise specified. (Note 2)
SYMBOL
PARAMETER
VMODE
Mode Threshold Low
Mode Threshold High
POR
Power-On Reset Threshold
CONDITIONS
MIN
TYP
0
VIN – 0.5
VOUT1, VFB2 Ramping Down, MODE/SYNC = 0V
UNITS
0 .5
VIN
V
V
–8.5
Power-On Reset On-Resistance
100
Power-On Reset Delay
%
200
262,144
VRUN
RUN Threshold
l
IRUN
RUN Leakage Current
l
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3548-2 is guaranteed to meet specified performance from
0°C to 85°C. Specifications over the – 40°C to 85°C operating temperature
range are assured by design, characterization and correlation with
statistical process controls.
SW
5V/DIV
VOUT
20mV/DIV
35482 G01
1
1.5
V
0.01
1
μA
Load Step
SW
5V/DIV
IL
200mA/
DIV
Cycles
TA = 25°C unless otherwise specified.
Pulse-Skipping Mode
Burst Mode Operation
0.3
Ω
Note 3: The LTC3548-2 is tested in a proprietary test mode that connects
the output of the error amplifier to an outside servo loop.
Note 4: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 5: TJ is calculated from the ambient TA and power dissipation PD
according to the following formula: TJ = TA + (PD • θJA).
Note 6: The DFN switch on-resistance is guaranteed by correlation to
wafer level measurements.
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V
2μs/DIV
VOUT = 1.8V
ILOAD = 60mA
CHANNEL 1; CIRCUIT OF FIGURE 3
MAX
VOUT
200mV/DIV
IL
200mA/DIV
IL
500mA/DIV
VOUT
10mV/DIV
ILOAD
500mA/DIV
VIN = 3.6V
1μs/DIV
VOUT = 1.8V
ILOAD = 30mA
CHANNEL 1; CIRCUIT OF FIGURE 3
35482 G02
VIN = 3.6V
20μs/DIV
VOUT = 1.8V
ILOAD = 80mA TO 800mA
CHANNEL 1; CIRCUIT OF FIGURE 3
35482 G03
35482fb
3
LTC3548-2
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C unless otherwise specified.
Oscillator Frequency
vs Temperature
Efficiency vs Input Voltage
2.5
100
Oscillator Frequency
vs Input Voltage
10
VIN = 3.6V
8
95
FREQUENCY DEVIATION (%)
2.4
100mA
FREQUENCY (MHz)
90
1mA
80
800mA
75
70
60
2
3
4
2.2
2.1
VOUT = 1.8V, CHANNEL 1
Burst Mode OPERATION
CIRCUIT OF FIGURE 3
65
2.3
5
6
INPUT VOLTAGE (V)
50
25
75
0
TEMPERATURE (°C)
Reference Voltage
vs Temperature
–2
–4
–6
100
125
2
450
0.605
400
VIN = 2.7V
VIN = 4.2V
450
0.595
RDS(ON) (mΩ)
300
250
0.585
–50 –25
200
100
MAIN
SWITCH
350
0.590
SYNCHRONOUS
SWITCH
2
3
Efficiency vs Load Current
95
1.5
1.0
85
80
PULSE-SKIPPING MODE
70
VOUT ERROR (%)
Burst Mode OPERATION
4
VIN (V)
5
6
VIN = 3.6V, VOUT = 1.8V
NO LOAD ON OTHER CHANNEL
CHANNEL 1; CIRCUIT OF FIGURE 3
1
10
100
LOAD CURRENT (mA)
100
–50 –25
7
1000
35482 G10
MAIN SWITCH
SYNCHRONOUS SWITCH
25 50 75 100 125 150
0
JUNCTION TEMPERATURE (°C)
3548 G09
Line Regulation
0.5
VOUT = 1.8V
IOUT = 200mA
0.4
0.3
Burst Mode OPERATION
0.5
0
PULSE-SKIPPING MODE
–0.5
–1.0
60
250
Load Regulation
2.0
65
300
35482 G08
100
75
350
200
35482 G07
90
VIN = 3.6V
400
150
1
125
6
RDS(ON) vs Junction Temperature
550
500
50
25
75
0
TEMPERATURE (°C)
5
35482 G06
VIN = 3.6V
0.600
4
3
VIN (V)
RDS(ON) vs Input Voltage
RDS(ON) (mΩ)
REFERENCE VOLTAGE (V)
0
–10
500
0.610
EFFICIENCY (%)
2
35482 G05
35482 G04
0.615
4
–8
2.0
–50 –25
VOUT ERROR (%)
EFFICIENCY (%)
10mA
85
6
VIN = 3.6V, VOUT = 1.8V
NO LOAD ON OTHER CHANNEL
CHANNEL 1; CIRCUIT OF FIGURE 3
–1.5
–2.0
1
10
100
LOAD CURRENT (mA)
1000
35482 G11
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
2
3
4
VIN (V)
5
6
35482 G12
35482fb
4
LTC3548-2
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Load Current
Efficiency vs Load Current
Efficiency vs Load Current
100
100
95
95
95
90
90
VIN = 2.7V
85
VIN = 4.2V
80
75
70
VOUT2 = 1.5V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
CIRCUIT OF FIGURE 3
65
60
1
10
100
LOAD CURRENT (mA)
1000
VIN = 4.2V
85
EFFICIENCY (%)
90
EFFICIENCY (%)
VIN = 3.6V
100
VIN = 2.7V
VIN = 3.6V
EFFICIENCY (%)
TA = 25°C unless otherwise specified.
80
75
70
VOUT2 = 2.5V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
CIRCUIT OF FIGURE 3
65
60
1
10
100
LOAD CURRENT (mA)
35482 G13
1000
35482 G14
VIN = 5V
85
80
75
70
VOUT2 = 3.3 V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
CIRCUIT OF FIGURE 3
65
60
1
10
100
LOAD CURRENT (mA)
1000
35482 G15
PIN FUNCTIONS
VOUT1 (Pin 1): Output Voltage Feedback for Channel 1. An
internal resistive divider divides the output voltage down
for comparison to the internal reference voltage.
RUN1 (Pin 2): Regulator 1 Enable. Forcing this pin to
VIN enables regulator 1, while forcing it to GND causes
regulator 1 to shut down. This pin must be driven; do
not float.
VIN (Pin 3): Input Power Supply. Must be closely decoupled
to GND.
SW1 (Pin 4): Regulator 1 Switch Node Connection to the
Inductor. This pin swings from VIN to GND.
GND (Pin 5): Ground. This pin is not connected internally.
Connect to PCB ground for optimum shielding.
MODE/SYNC (Pin 6): Combination Mode Selection and
Oscillator Synchronization. This pin controls the operation of the device. When tied to VIN or GND, Burst Mode
operation or pulse-skipping mode is selected, respectively.
Do not float this pin. The oscillation frequency can be
synchronized to an external oscillator applied to this pin
and pulse-skipping mode is automatically selected.
SW2 (Pin 7): Regulator 2 Switch Node Connection to the
Inductor. This pin swings from VIN to GND.
POR (Pin 8): Power-On Reset. This common-drain logic
output is pulled to GND when the output voltage falls below
–8.5% of regulation and goes high after 117ms when both
channels are within regulation.
RUN2 (Pin 9): Regulator 2 Enable. Forcing this pin to
VIN enables regulator 2, while forcing it to GND causes
regulator 2 to shut down. This pin must be driven; do
not float.
VFB2 (Pin 10): Output Feedback. Receives the feedback
voltage from the external resistive divider across the output.
Normal voltage for this pin is 0.6V.
Exposed Pad (GND) (Pin 11): Ground. Connect to the
(–) terminal of COUT, and (–) terminal of CIN. Must be
connected to PCB ground for electrical contact and rated
thermal performance.
35482fb
5
LTC3548-2
BLOCK DIAGRAM
REGULATOR 1
MODE/SYNC
6
BURST
CLAMP
VIN
SLOPE
COMP
0.6V
EA
VOUT1
ITH1
BURST
SLEEP
–
+
5Ω
ICOMP
+
0.35V
–
1
EN
–
+
R1
VFB1
S
Q
RS
LATCH
R
Q
R2
0.55V
–
UVDET
SWITCHING
LOGIC
AND
BLANKING
CIRCUIT
UV
+
ANTI
SHOOTTHRU
4 SW1
+
OVDET
–
+
0.65V
OV
IRCMP
SHUTDOWN
–
11 GND
VIN
3 VIN
PGOOD1
RUN1
2
RUN2
9
0.6V REF
8 POR
OSC
OSC
POR
COUNTER
5 GND
PGOOD2
REGULATOR 2 (IDENTICAL TO REGULATOR 1)
0.6V
7 SW2
+
EA
ITH2
–
VFB2 10
0.55V
–
UVDET
UV
+
+
OVDET
0.65V
OV
–
35482 BD
6
35482fb
LTC3548-2
OPERATION
The LTC3548-2 uses a constant-frequency, current mode
architecture. The operating frequency is set at 2.25MHz
and can be synchronized to an external oscillator. Both
channels share the same clock and run in-phase. To suit a
variety of applications, the selectable MODE pin allows the
user to choose between low noise and high efficiency.
The output voltage for channel 1 is set by an internal divider
returned to the VOUT1 pin. The output voltage for channel 2
is set by an external divider returned to the VFB2 pin. An
error amplifier compares the feedback output voltage with
a reference voltage of 0.6V and adjusts the peak inductor
current accordingly. An undervoltage comparator will
pull the POR output low if the output voltage is not above
–8.5% of the reference voltage. The POR output will go
high after 262,144 clock cycles (about 117ms in pulseskipping mode) of achieving regulation.
Main Control Loop
During normal operation, the top power switch (P-channel
MOSFET) is turned on at the beginning of a clock cycle
when the VFB voltage (see the Block Diagram) is below the
the reference voltage. The current into the inductor and
the load increases until the current limit is reached. The
switch turns off and energy stored in the inductor flows
through the bottom switch (N-channel MOSFET) into the
load until the next clock cycle.
The peak inductor current is controlled by the internally
compensated ITH voltage, which is the output of the error amplifier. This amplifier compares the VFB to the 0.6V
reference. When the load current increases, the VFB voltage decreases slightly below the reference. This decrease
causes the error amplifier to increase the ITH voltage until
the average inductor current matches the new load current. The main control loop is shut down by pulling the
RUN pin to ground.
To optimize efficiency, the Burst Mode operation can be
selected. When the load is relatively light, the LTC3548-2
automatically switches into Burst Mode operation in which
the PMOS switch operates intermittently based on load
demand with a fixed peak inductor current. By running
cycles periodically, the switching losses which are dominated by the gate charge losses of the power MOSFETs
are minimized. The main control loop is interrupted when
the output voltage reaches the desired regulated value. A
voltage comparator trips when ITH is below 0.35V, shutting
off the switch and reducing the power. The output capacitor and the inductor supply the power to the load until ITH
exceeds 0.65V, turning on the switch and the main control
loop which starts another cycle.
For lower ripple noise at low currents, the pulse-skipping
mode can be used. In this mode, the LTC3548-2 continues
to switch at a constant frequency down to very low currents, where it will begin skipping pulses. The efficiency in
pulse-skipping mode can be improved slightly by connecting the SW node to the MODE/SYNC input which reduces
the clock frequency by approximately 30%.
Dropout Operation
When the input supply voltage decreases toward the
output voltage, the duty cycle increases to 100% which
is the dropout condition. In dropout, the PMOS switch is
turned on continuously with the output voltage being equal
to the input voltage minus the voltage drops across the
internal P-channel MOSFET and the inductor.
An important design consideration is that the RDS(ON)
of the P-channel switch increases with decreasing input
supply voltage (see Typical Performance Characteristics).
Therefore, the user should calculate the power dissipation
when the LTC3548-2 is used at 100% duty cycle with low
input voltage (see Thermal Considerations in the Applications Information section).
Low Current Operation
By selecting MODE/SYNC (Pin 6), two modes are available
to control the operation of the LTC3548-2 at low currents.
Both modes automatically switch from continuous operation to the selected mode when the load current is low.
Low Supply Operation
To prevent unstable operation, the LTC3548-2 incorporates
an undervoltage lockout circuit that shuts down the part
when the input voltage drops below about 1.65V.
35482fb
7
LTC3548-2
APPLICATIONS INFORMATION
A general LTC3548-2 application circuit is shown in
Figure 2. External component selection is driven by the
load requirement, and begins with the selection of the
inductor L. Once the inductor is chosen, CIN and COUT
can be selected.
VIN
2.5V TO 5.5V
CIN
RUN2
BM*
PS*
VIN
MODE/SYNC
RUN1
R5
POWER-ON
RESET
POR
Inductor Core Selection
LTC3548-2
L1
L2
VOUT2
SW2
SW1
C5
COUT2
R1
VOUT1
VOUT1
VFB2
R2
GND
COUT1
35482 F02
*MODE/SYNC = 0V: PULSE SKIPPING
MODE/SYNC = VIN: Burst Mode OPERATION
Figure 2. LTC3548-2 General Schematic
Inductor Selection
Although the inductor does not influence the operating frequency, the inductor value has a direct effect on ripple current. The inductor ripple current ΔIL decreases with higher
inductance and increases with higher VIN or VOUT:
ΔIL =
The inductor value will also have an effect on Burst Mode
operation. The transition from low current operation
begins when the peak inductor current falls below a level
set by the burst clamp. Lower inductor values result in
higher ripple current which causes this to occur at lower
load currents. This causes a dip in efficiency in the upper
range of low current operation. In Burst Mode operation,
lower inductance values will cause the burst frequency
to increase.
VOUT ⎛ VOUT ⎞
• ⎜ 1–
⎟
fO • L ⎝
VIN ⎠
Accepting larger values of ΔIL allows the use of low
inductances, but results in higher output voltage ripple,
greater core losses, and lower output current capability.
A reasonable starting point for setting ripple current is
ΔIL = 0.3 • IOUT(MAX), where IOUT(MAX) is 800mA for channel 1
and 400mA for channel 2. The largest ripple current ΔIL
occurs at the maximum input voltage. To guarantee that
the ripple current stays below a specified maximum, the
inductor value should be chosen according to the following equation:
⎛
⎞
V
V
L ≥ OUT • ⎜ 1 – OUT ⎟
fO • Δ IL ⎝
VIN(MAX ) ⎠
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroid or shielded pot cores in ferrite or permalloy
materials are small and do not radiate much energy,
but generally cost more than powdered iron core inductors with similar electrical characteristics. The choice of
which style inductor to use often depends more on the
price vs size requirements and any radiated field/EMI
requirements than on what the LTC3548-2 requires to
operate. Table 1 shows some typical surface mount
inductors that work well in LTC3548-2 applications.
Table 1. Representative Surface Mount Inductors
PART
NUMBER
VALUE
(μH)
DCR
(Ω MAX)
MAX DC
CURRENT (A)
SIZE
W × L × H (mm3)
Sumida
CDRH3D16
2.2
3.3
4.7
0.075
0.110
0.162
1.20
1.10
0.90
3.8 × 3.8 × 1.8
Sumida
CDRH2D11
1.5
2.2
0.068
0.170
0.900
0.780
3.2 × 3.2 × 1.2
Sumida
CMD4D11
2.2
3.3
0.116
0.174
0.950
0.770
4.4 × 5.8 × 1.2
Murata
LQH32CN
1.0
2.2
0.060
0.097
1.00
0.79
2.5 × 3.2 × 2.0
Toko
D312F
2.2
3.3
0.060
0.260
1.08
0.92
2.5 × 3.2 × 2.0
Panasonic
ELT5KT
3.3
4.7
0.17
0.20
1.00
0.95
4.5 × 5.4 × 1.2
Input Capacitor (CIN) Selection
In continuous mode, the input current of the converter is a
square wave with a duty cycle of approximately VOUT/VIN.
To prevent large voltage transients, a low equivalent series
resistance (ESR) input capacitor sized for the maximum
35482fb
8
LTC3548-2
APPLICATIONS INFORMATION
RMS current must be used. The maximum RMS capacitor
current is given by:
IRMS ≈ IMAX
VOUT ( VIN – VOUT )
VIN
where the maximum average output current IMAX equals
the peak current minus half the peak-to-peak ripple current, IMAX = ILIM – ΔIL/2.
This formula has a maximum at VIN = 2VOUT, where IRMS
= IOUT/2. This simple worst-case is commonly used to
design because even significant deviations do not offer
much relief. Note that capacitor manufacturer’s ripple current ratings are often based on only 2000 hours lifetime.
This makes it advisable to further derate the capacitor,
or choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to meet
the size or height requirements of the design. An additional
0.1μF to 1μF ceramic capacitor is also recommended on
VIN for high frequency decoupling, when not using an all
ceramic capacitor solution.
Output Capacitor (COUT) Selection
The selection of COUT is driven by the required ESR to
minimize voltage ripple and load step transients. Typically,
once the ESR requirement is satisfied, the capacitance
is adequate for filtering. The output ripple (ΔVOUT) is
determined by:
⎛
⎞
1
ΔVOUT ≈ ΔIL ⎜ ESR +
8 • fO • COUT ⎟⎠
⎝
where fO = operating frequency, COUT = output capacitance
and ΔIL = ripple current in the inductor. The output ripple
is highest at maximum input voltage since ΔIL increases
with input voltage. With ΔIL = 0.3 • IOUT(MAX) the output
ripple will be less than 100mV at maximum VIN and
fO = 2.25MHz with:
ESRCOUT < 150mΩ
Once the ESR requirements for COUT have been met, the
RMS current rating generally far exceeds the IRIPPLE(P-P)
requirement, except for an all ceramic solution.
In surface mount applications, multiple capacitors may
have to be paralleled to meet the capacitance, ESR or
RMS current handling requirement of the application.
Aluminum electrolytic, special polymer, ceramic and dry
tantalum capacitors are all available in surface mount
packages. The OS-CON semiconductor dielectric capacitor
available from Sanyo has the lowest ESR (size) product
of any aluminum electrolytic at a somewhat higher price.
Special polymer capacitors, such as Sanyo POSCAP,
Panasonic Special Polymer (SP) and Kemet A700, offer very low ESR, but have a lower capacitance density
than other types. Tantalum capacitors have the highest
capacitance density, but they have a larger ESR and it
is critical that the capacitors are surge tested for use in
switching power supplies. An excellent choice is the AVX
TPS series of surface mount tantalums, available in case
heights ranging from 2mm to 4mm. Aluminum electrolytic
capacitors have a significantly larger ESR, and are often
used in extremely cost-sensitive applications provided that
consideration is given to ripple current ratings and long
term reliability. Ceramic capacitors have the lowest ESR
and cost, but also have the lowest capacitance density,
a high voltage and temperature coefficient, and exhibit
audible piezoelectric effects. In addition, the high Q of
ceramic capacitors along with trace inductance can lead
to significant ringing.
In most cases, 0.1μF to 1μF of ceramic capacitors should
also be placed close to the LTC3548-2 in parallel with the
main capacitors for high frequency decoupling.
Ceramic Input and Output Capacitors
Higher value, lower cost ceramic capacitors are now becoming available in smaller case sizes. These are tempting
for switching regulator use because of their very low ESR.
Unfortunately, the ESR is so low that it can cause loop
stability problems. Solid tantalum capacitor ESR generates
a loop zero at 5kHz to 50kHz that is instrumental in giving
acceptable loop phase margin. Ceramic capacitors remain
capacitive to beyond 300kHz and usually resonate with their
ESL before ESR becomes effective. Also, ceramic caps are
prone to temperature effects which requires the designer
to check loop stability over the operating temperature
range. To minimize their large temperature and voltage
coefficients, only X5R or X7R ceramic capacitors should
be used. A good selection of ceramic capacitors is available
from Taiyo Yuden, AVX, Kemet, TDK and Murata.
35482fb
9
LTC3548-2
APPLICATIONS INFORMATION
Great care must be taken when using only ceramic input
and output capacitors. When a ceramic capacitor is used
at the input and the power is being supplied through long
wires, such as from a wall adapter, a load step at the output
can induce ringing at the VIN pin. At best, this ringing can
couple to the output and be mistaken as loop instability.
At worst, the ringing at the input can be large enough to
damage the part.
Since the ESR of a ceramic capacitor is so low, the input
and output capacitor must instead fulfill a charge storage
requirement. During a load step, the output capacitor must
instantaneously supply the current to support the load
until the feedback loop raises the switch current enough
to support the load. The time required for the feedback
loop to respond is dependent on the compensation and the
output capacitor size. Typically, 3 to 4 cycles are required to
respond to a load step, but only in the first cycle does the
output drop linearly. The output droop, VDROOP, is usually
about 2 to 3 times the linear drop of the first cycle. Thus,
a good place to start is with the output capacitor size of
approximately:
ΔIOUT
COUT ≈ 2.5
fO • VDROOP
More capacitance may be required depending on the duty
cycle and load step requirements.
In most applications, the input capacitor is merely required
to supply high frequency bypassing, since the impedance
to the supply is very low. A 10μF ceramic capacitor is
usually enough for these conditions.
Setting the Output Voltage for Channel 2
The LTC3548-2 develops a 0.6V reference voltage between the feedback pin, VFB2, and the ground as shown
in Figure 2. The output voltage, VOUT2, is set by a resistive
divider according to the following formula:
⎛ R2 ⎞
VOUT2 = 0.6 V ⎜ 1+ ⎟
⎝ R1⎠
Keeping the current small (<5μA) in these resistors maximizes efficiency, but making them too small may allow
stray capacitance to cause noise problems and reduce the
phase margin of the error amp loop.
To improve the frequency response, a feed forward capacitor CF may also be used. Great care should be taken to
route the VOUT1, VFB2 line away from noise sources, such
as the inductor or the SW line.
Power-On Reset
The POR pin is an open-drain output which pulls low when
either regulator is out of regulation. When both output
voltages are above –8.5% of regulation, a timer is started
which releases POR after 218 clock cycles (about 117ms
in pulse-skipping mode). This delay can be significantly
longer in Burst Mode operation with low load currents,
since the clock cycles only occur during a burst and there
could be milliseconds of time between bursts. This can
be bypassed by tying the POR output to the MODE/SYNC
input, to force pulse-skipping mode during a reset. In addition, if the output voltage faults during Burst Mode sleep,
POR could have a slight delay for an undervoltage output
condition. This can be avoided by using pulse-skipping
mode instead. When either channel is shut down, the POR
output is pulled low, since one or both of the channels are
not in regulation.
Mode Selection and Frequency Synchronization
The MODE/SYNC pin is a multipurpose pin which provides
mode selection and frequency synchronization. Connecting this pin to VIN enables Burst Mode operation, which
provides the best low current efficiency at the cost of a
higher output voltage ripple. Connecting this pin to ground
selects pulse-skipping mode, which provides the lowest
output ripple, at the cost of low current efficiency.
The LTC3548-2 can also be synchronized to an external
2.25MHz clock signal by the MODE/SYNC pin. During
synchronization, the mode is set to pulse-skipping and
the top switch turn-on is synchronized to the rising edge
of the external clock.
35482fb
10
LTC3548-2
APPLICATIONS INFORMATION
Checking Transient Response
Efficiency Considerations
The regulator loop response can be checked by looking at the load transient response. Switching regulators
take several cycles to respond to a step in load current.
When a load step occurs, VOUT immediately shifts by an
amount equal to ΔILOAD • ESR, where ESR is the effective
series resistance of COUT. ΔILOAD also begins to charge
or discharge COUT, generating a feedback error signal
used by the regulator to return VOUT to its steady-state
value. During this recovery time, VOUT can be monitored
for overshoot or ringing that would indicate a stability
problem.
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
The initial output voltage step may not be within the
bandwidth of the feedback loop, so the standard secondorder overshoot/DC ratio cannot be used to determine
phase margin. In addition, a feed forward capacitor, CF,
can be added to improve the high frequency response, as
shown in Figure 2. Capacitor CF provides phase lead by
creating a high frequency zero with R2, which improves
the phase margin.
The output voltage settling behavior is related to the stability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a review of control loop theory, refer to Application Note 76.
In some applications, a more severe transient can be
caused by switching loads with large (>1μF) load input
capacitors. The discharged load input capacitors are effectively put in parallel with COUT, causing a rapid drop in
VOUT. No regulator can deliver enough current to prevent
this problem, if the switch connecting the load has low
resistance and is driven quickly. The solution is to limit
the turn-on speed of the load switch driver. A Hot Swap™
controller is designed specifically for this purpose and
usually incorporates current limiting, short-circuit protection, and soft-starting.
Hot Swap is a trademark of Linear Technology Corporation.
% Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percentage of input power.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of
the losses in LTC3548-2 circuits: 1) VIN quiescent current,
2) switching losses, 3) I2R losses, 4) other losses.
1. The VIN current is the DC supply current given in the
Electrical Characteristics which excludes MOSFET
driver and control currents. VIN current results in a
small (<0.1%) loss that increases with VIN, even at
no load.
2. The switching current is the sum of the MOSFET driver
and control currents. The MOSFET driver current results from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
from VIN to ground. The resulting dQ/dt is a current
out of VIN that is typically much larger than the DC bias
current. In continuous mode, IGATECHG = fO(QT + QB),
where QT and QB are the gate charges of the internal
top and bottom MOSFET switches. The gate charge
losses are proportional to VIN and thus their effects
will be more pronounced at higher supply voltages.
3. I2R losses are calculated from the DC resistances of
the internal switches, RSW, and external inductor, RL.
In continuous mode, the average output current flows
through inductor L, but is chopped between the internal
top and bottom switches. Thus, the series resistance
looking into the SW pin is a function of both top and
bottom MOSFET RDS(ON) and the duty cycle (D) as
follows:
RSW = (RDS(ON)TOP)(D) + (RDS(ON)BOT)(1 – D)
35482fb
11
LTC3548-2
APPLICATIONS INFORMATION
The RDS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I2R losses:
I2R losses = IOUT 2(RSW + RL)
4. Other hidden losses such as copper trace and internal
battery resistances can account for additional efficiency
degradations in portable systems. It is very important
to include these system level losses in the design of a
system. The internal battery and fuse resistance losses
can be minimized by making sure that CIN has adequate
charge storage and very low ESR at the switching frequency. Other losses including diode conduction losses
during dead-time and inductor core losses generally
account for less than 2% total additional loss.
Thermal Considerations
In a majority of applications, the LTC3548-2 does not
dissipate much heat due to its high efficiency. However,
in applications where the LTC3548-2 is running at high
ambient temperature with low supply voltage and high
duty cycles, such as in dropout, the heat dissipated may
exceed the maximum junction temperature of the part. If
the junction temperature reaches approximately 150°C,
both power switches will turn off and the SW node will
become high impedance.
To prevent the LTC3548-2 from exceeding the maximum
junction temperature, the user will need to do some thermal
analysis. The goal of the thermal analysis is to determine
whether the power dissipated exceeds the maximum
junction temperature of the part. The temperature rise is
given by:
TRISE = PD • θJA
where PD is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to
the ambient temperature.
The junction temperature, TJ, is given by:
TJ = TRISE + TAMBIENT
As an example, consider the case when the LTC3548-2 is
at an input voltage of 2.7V with a load current of 400mA
and 800mA and an ambient temperature of 70°C. From
the Typical Performance Characteristics graph of Switch
Resistance, the RDS(ON) resistance of the main switch is
0.425Ω. Therefore, power dissipated by each channel is:
PD = I2 • RDS(ON) = 272mW and 68mW
The DFN package junction-to-ambient thermal resistance,
θJA, is 40°C/W. Therefore, the junction temperature of
the regulator operating in a 70°C ambient temperature is
approximately:
TJ = (0.272 + 0.068) • 40 + 70 = 83.6°C
which is below the absolute maximum junction temperature of 125°C.
Design Example
As a design example, consider using the LTC3548-2 in
an portable application with a Li-Ion battery. The battery
provides a VIN = 2.8V to 4.2V. The load requires a maximum
of 800mA in active mode and 2mA in standby mode. The
output voltage is VOUT = 1.8V. Since the load still needs
power in standby, Burst Mode operation is selected for
good low load efficiency.
First, calculate the inductor value for about 30% ripple
current at maximum VIN:
L≥
⎛ 1.8 V ⎞
1.8 V
• ⎜ 1–
= 1.9μH
2.25MHz • 240mA ⎝ 4.2V ⎟⎠
Choosing a vendor’s closest inductor value of 2.2μH,
results in a maximum ripple current of:
ΔIL =
1.8 V
⎛ 1.8 V ⎞
• ⎜ 1−
= 208mA
2.25MHz • 2.2μ ⎝ 4.2V ⎟⎠
For cost reasons, a ceramic capacitor will be used. COUT
selection is then based on load step droop instead of ESR
requirements. For a 5% output droop:
COUT ≈ 2.5
800mA
= 9.9μF
2.25MHz •(5% • 1.8 V)
A good standard value is 10μF. Since the output impedance
of a Li-Ion battery is very low, CIN is typically 10μF. Following the same procedure for VOUT2 = 2.5V, the inductor
value is derived as 4.7μH and the output capacitor value
is 4.7μF.
35482fb
12
LTC3548-2
APPLICATIONS INFORMATION
The output voltage, VOUT2, can now be programmed by
choosing the values of R1 and R2. To maintain high efficiency, the current in these resistors should be kept small.
Choosing 2μA with the 0.6V feedback voltage makes R1
approximately 280k. A close standard 1% resistor is 280k,
and R2 is then 887k.
The POR pin is a common drain output and requires a pullup resistor. A 100k resistor is used for adequate speed.
Figure 3 shows the complete schematic for this design
example.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3548-2. These items are also illustrated graphically
in the layout diagram of Figure 4. Check the following in
your layout:
1. Does the capacitor CIN connect to the power VIN (Pin 3)
and GND (Exposed Pad) as close as possible? This
capacitor provides the AC current to the internal power
MOSFETs and their drivers.
VIN
2.5V* TO 5.5V
RUN2 VIN
L2
4.7μH
RUN1
4. Keep sensitive components away from the SW pins. The
input capacitor CIN and the resistors R1 to R2 should be
routed away from the SW traces and the inductors.
5. A ground plane is preferred, but if not available, keep the
signal and power grounds segregated with small signal
components returning to the GND pin at one point and
should not share the high current path of CIN or COUT.
6. Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
components. These copper areas should be connected
to VIN or GND.
R5
100k
RUN2
POWER-ON
RESET
POR
L1
2.2μH
LTC3548-2
SW1
SW2
C5 68pF
C3
4.7μF
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of COUT and a ground sense line
terminated near GND (Exposed Pad). The feedback
signals VOUT1, VFB2 should be routed away from noisy
components and traces, such as the SW line (Pins 4
and 7), and its trace should be minimized.
VIN
C1
10μF
MODE/SYNC
VOUT2
2.5V*
400mA
2. Are the COUT and L1 closely connected? The (–) plate of
COUT returns current to GND and the (–) plate of CIN.
R2
887k
R1
280k
CIN
GND
RUN1
POR
LTC3548-2
VOUT1
1.8V
800mA
VOUT2
L1
L2
SW2
C2
10μF
VOUT1
SW1
C5
VOUT1
VFB2
VIN
MODE/SYNC
COUT2
VOUT1
VFB2
R2
GND
R1
COUT1
35482 F03
C1, C2, C3: TAIYO YUDEN JMK212BJ106MG
C3: TAIYO YUDEN JMK212BJ475MG
L1: MURATA LQH32CN2R2M11
L2: MURATA LQH32CN4R7M23
*VOUT CONNECTED TO VIN FOR VIN b 2.8V (DROPOUT)
Figure 3. LTC3548-2 Typical Application
35482 F04
BOLD LINES INDICATE
HIGH CURRENT PATHS
Figure 4. LTC3548-2 Layout Diagram
(See Board Layout Checklist)
35482fb
13
LTC3548-2
PACKAGE DESCRIPTION
Low Ripple Buck Regulators Using Ceramic Capacitors
100
C1
10μF
RUN2
VIN
RUN1
R5
100k
POR
LTC3548-2
L2
10μH
SW2
L1
4.7μH
SW1
C5 68pF
C3
10μF
R2
887k
R1
280k
VOUT1
1.8V
800mA
90
VOUT1
VFB2
MODE/SYNC
85
VOUT1 = 1.8V
80
75
70
C2
10μF
GND
VOUT2 = 2.5V
95
POWER-ON
RESET
EFFICIENCY (%)
VIN
2.5V TO 5.5V
VOUT2
2.5V
400mA
Efficiency vs Load Current
65
VIN = 3.3V
PULSE-SKIPPING MODE
35482 TA01
60
C1, C2, C3: TDK C2012X5R0J106M
L1: SUMIDA CDRH2D18/HP-4R7NC
L2: SUMIDA CDRH2D18/HP-100NC
10
1mm Profile Core and I/O Supplies
100
C1*
10μF
RUN2
VIN
MODE/SYNC
RUN1
SW2
R5
100k
L1
2.2μH
SW1
C5 68pF
95
POWER-ON
RESET
POR
LTC3548-2
L2
4.7μH
VOUT2
3.3V
400mA
1000
35482 TA01b
Efficiency vs Load Current
VOUT1
1.8V
800mA
VOUT2 = 3.3V
90
EFFICIENCY (%)
VIN
3.6V TO 5.5V
100
LOAD CURRENT (mA)
VOUT1 = 1.8V
85
80
75
70
C3
4.7μF
R2
887k
VOUT1
VFB2
R1
196k
GND
C2
10μF
35482 TA02a
C1, C2: MURATA GRM219R60J106KE19
C3: MURATA GRM219R60J475KE19
L1: COILTRONICS LPO3310-222MX
L2: COILTRONICS LPO3310-472MX
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,
ADDITIONAL CAPACITANCE MAY BE REQUIRED.
65
VIN = 5V
Burst Mode OPERATION
60
1
10
100
LOAD CURRENT (mA)
1000
35482 TA02b
35482fb
14
LTC3548-2
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
0.70 p0.05
3.55 p0.05
1.65 p0.05
2.15 p0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 p 0.05
0.50
BSC
2.38 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 p0.10
(4 SIDES)
R = 0.125
TYP
6
0.40 p 0.10
10
1.65 p 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
(DD) DFN REV B 0309
5
0.200 REF
1
0.25 p 0.05
0.50 BSC
0.75 p0.05
0.00 – 0.05
2.38 p0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
35482fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC3548-2
TYPICAL APPLICATION
2mm Height Lithium-Ion Single Inductor Buck-Boost Regulator and a Buck Regulator
VIN
2.8V TO 4.2V
C1
10μF
RUN2
VIN
MODE/SYNC
L2
15μH
D1
VOUT2
3.3V
100mA
POWER-ON
RESET
POR
L1
2.2μH
LTC3548-2
SW2
VOUT1
1.8V
800mA
SW1
C5 22pF
M1
+
R5
100k
RUN1
C6
22μF
R4
887k
C3
4.7μF
VOUT1
VFB2
R3
196k
GND
C1, C2: TAIYO YUDEN JMK316BJ106ML
C3: MURATA GRM21BR60J475KA11B
C6: KEMET C1206C226K9PAC
D1: PHILIPS PMEG2010
L1: MURATA LQH32CN2R2M33
L2: TOKO A914BYW-150M (D52LC SERIES)
M1: SILICONIX Si2302DS
C2
10μF
35482 TA03a
Efficiency vs Load Current
Efficiency vs Load Current
90
100
95
80
2.8V
4.2V
3.6V
2.8V
70
60
50
EFFICIENCY (%)
EFFICIENCY (%)
90
85
4.2V
3.6V
80
75
70
40 VOUT = 3.3V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
30
1
10
100
LOAD CURRENT (mA)
VOUT = 1.8V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
65
1000
60
35482 TA03b
1
10
100
LOAD CURRENT (mA)
1000
3548 TA03c
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
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LTC3405/LTC3405A
300mA (IOUT), 1.5MHz, Synchronous Step-Down
DC/DC Converters
96% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 20μA,
ISD < 1μA, ThinSOT Package
LTC3406/LTC3406B
600mA (IOUT), 1.5MHz, Synchronous Step-Down
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96% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 20μA,
ISD < 1μA, ThinSOT Package
LT3407/LT3407-2
600mA/1.5MHz, 800mA/2.25MHz Dual Synchronous
Step-Down DC/DC Converter
96% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 40μA,
ISD < 1μA, MSE, DFN Package
LTC3410/LTC3410B
300mA, 2.25MHz Synchronous Step-Down
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95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 26μA,
ISD < 1μA, SC70 Package
LTC3411
1.25A (IOUT), 4MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60μA,
ISD < 1μA, MSOP-10 Package
LTC3412/LTC3412A
2.5A (IOUT), 4MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.8V, IQ = 60μA,
ISD < 1μA, TSSOP-16E Package
LTC3414
4A (IOUT), 4MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, VIN: 2.25V to 5.5V, VOUT(MIN) = 0.8V, IQ = 64μA,
ISD < 1μA, TSSOP-28E Package
LTC3548/LTC3548-1
800mA/400mA (IOUT), 2.25MHz, Dual Synchronous
Step-Down DC/DC Converter
95% Efficiency, VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6V, IQ = 40μA,
ISD < 1μA, MSE, DFN-10 Packages
35482fb
16 Linear Technology Corporation
LT 0709 REV B • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
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© LINEAR TECHNOLOGY CORPORATION 2006
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