MOTOROLA MC145152P2 Parallel-input pll frequency synthesizer Datasheet

Order this document
by MC145151–2/D
SEMICONDUCTOR TECHNICAL DATA
! !"
!
CMOS
The devices described in this document are typically used as low–power,
phase–locked loop frequency synthesizers. When combined with an external
low–pass filter and voltage–controlled oscillator, these devices can provide all
the remaining functions for a PLL frequency synthesizer operating up to the
device’s frequency limit. For higher VCO frequency operation, a down mixer or
a prescaler can be used between the VCO and the synthesizer IC.
These frequency synthesizer chips can be found in the following and other
applications:
CATV
TV Tuning
AM/FM Radios
Scanning Receivers
Two–Way Radios
Amateur Radio
÷R
OSC
φ
CONTROL LOGIC
÷A
÷N
÷ P/P + 1
VCO
OUTPUT
FREQUENCY
CONTENTS
Page
DEVICE DETAIL SHEETS
MC145151–2 Parallel–Input, Single–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
MC145152–2 Parallel–Input, Dual–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
MC145155–2 Serial–Input, Single–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
MC145156–2 Serial–Input, Dual–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
MC145157–2 Serial–Input, Single–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MC145158–2 Serial–Input, Dual–Modulus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
FAMILY CHARACTERISTICS
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Detector/Lock Detector Output Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
25
26
27
27
DESIGN CONSIDERATIONS
Phase–Locked Loop — Low–Pass Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Crystal Oscillator Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Dual–Modulus Prescaling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
REV 1
8/95

Motorola, Inc. 1995
MOTOROLA
MC145151–2 through MC145158–2
1
SEMICONDUCTOR TECHNICAL DATA
P SUFFIX
PLASTIC DIP
CASE 710
Interfaces with Single–Modulus Prescalers
28
The MC145151–2 is programmed by 14 parallel–input data lines for the
N counter and three input lines for the R counter. The device features consist of
a reference oscillator, selectable–reference divider, digital–phase detector, and
14–bit programmable divide–by–N counter.
The MC145151–2 is an improved–performance drop–in replacement for the
MC145151–1. The power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
On– or Off–Chip Reference Oscillator Operation
Lock Detect Signal
÷ N Counter Output Available
Single Modulus/Parallel Programming
8 User–Selectable ÷ R Values: 8, 128, 256, 512, 1024, 2048, 2410, 8192
÷ N Range = 3 to 16383
“Linearized” Digital Phase Detector Enhances Transfer Function Linearity
Two Error Signal Options: Single–Ended (Three–State) or Double–Ended
Chip Complexity: 8000 FETs or 2000 Equivalent Gates
1
DW SUFFIX
SOG PACKAGE
CASE 751F
28
1
ORDERING INFORMATION
MC145151P2
MC145151DW2
Plastic DIP
SOG Package
PIN ASSIGNMENT
fin
1
28
LD
VSS
2
27
OSCin
VDD
3
26
OSCout
PDout
4
25
N11
RA0
5
24
N10
RA1
6
23
N13
RA2
7
22
N12
φR
8
21
T/R
φV
9
20
N9
fV
10
19
N8
N0
11
18
N7
N1
12
17
N6
N2
13
16
N5
N3
14
15
N4
REV 1
8/95

Motorola, Inc. 1995
MC145151–2
through MC145158–2
2
MOTOROLA
MC145151–2 BLOCK DIAGRAM
RA2
RA1
RA0
OSCout
14 x 8 ROM REFERENCE DECODER
LOCK
DETECT
14
LD
14–BIT ÷ R COUNTER
OSCin
PHASE
DETECTOR
A
PDout
14–BIT ÷ N COUNTER
fin
VDD
PHASE
DETECTOR
B
14
TRANSMIT OFFSET ADDER
T/R
φV
φR
fV
N13
N11
N9
N7 N6
N4
N2
N0
NOTE: N0 – N13 inputs and inputs RA0, RA1, and RA2 have pull–up resistors that are not shown.
sure that inputs left open remain at a logic 1 and require only
an SPST switch to alter data to the zero state.
PIN DESCRIPTIONS
INPUT PINS
fin
Frequency Input (Pin 1)
T/R
Transmit/Receive Offset Adder Input (Pin 21)
Input to the ÷ N portion of the synthesizer. fin is typically
derived from loop VCO and is ac coupled into the device. For
larger amplitude signals (standard CMOS logic levels) dc
coupling may be used.
This input controls the offset added to the data provided at
the N inputs. This is normally used for offsetting the VCO
frequency by an amount equal to the IF frequency of the
transceiver. This offset is fixed at 856 when T/R is low and
gives no offset when T/R is high. A pull–up resistor ensures
that no connection will appear as a logic 1 causing no offset
addition.
RA0 – RA2
Reference Address Inputs (Pins 5, 6, 7)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as
defined by the table below.
Pull–up resistors ensure that inputs left open remain at a
logic 1 and require only a SPST switch to alter data to the
zero state.
RA2
RA1
RA0
Total
Divide
Value
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
128
256
512
1024
2048
2410
8192
Reference Address Code
N0 – N11
N Counter Programming Inputs (Pins 11 – 20, 22 – 25)
These inputs provide the data that is preset into the ÷ N
counter when it reaches the count of zero. N0 is the least significant and N13 is the most significant. Pull–up resistors en-
MOTOROLA
OSCin, OSCout
Reference Oscillator Input/Output (Pins 27, 26)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSC in to ground and OSC out to ground.
OSC in may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSC in, but for larger amplitude signals (standard CMOS
logic levels) dc coupling may also be used. In the external
reference mode, no connection is required to OSC out.
OUTPUT PINS
PDout
Phase Detector A Output (Pin 4)
Three–state output of phase detector for use as loop–error
signal. Double–ended outputs are also available for this purpose (see φV and φR).
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency f V = fR and Phase Coincidence: High–Impedance State
MC145151–2 through MC145158–2
3
φR , φV
Phase Detector B Outputs (Pins 8, 9)
nally connected to the phase detector input. With this output
available, the ÷ N counter can be used independently.
These phase detector outputs can be combined externally
for a loop–error signal. A single–ended output is also available for this purpose (see PDout ).
If frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
LD
Lock Detector Output (Pin 28)
Essentially a high level when loop is locked (fR, fV of same
phase and frequency). Pulses low when loop is out of lock.
POWER SUPPLY
VDD
Positive Power Supply (Pin 3)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
VSS
Negative Power Supply (Pin 2)
fV
N Counter Output (Pin 10)
The most negative supply potential. This pin is usually
ground.
This is the buffered output of the ÷ N counter that is inter-
TYPICAL APPLICATIONS
2.048 MHz
OSCin
OSCout
fin
NC
NC
RA2 RA1
RA0
MC145151–2
VOLTAGE
CONTROLLED
OSCILLATOR
PDout
N13 N12 N11 N10 N9 N8 N7 N6 N5 N4 N3 N2 N1 N0
5 – 5.5 MHz
0 1 1 1 0 0 0 1 0 0 0 = 5 MHz
1 0 1 0 1 1 1 1 1 0 0 = 5.5 MHz
Figure 1. 5 MHz to 5.5 MHz Local Oscillator Channel Spacing = 1 kHz
LOCK DETECT SIGNAL
“1”
OSCout RA2
+V
REF. OSC.
10.0417 MHz
(ON–CHIP OSC.
OPTIONAL)
OSCin
VDD
VSS
“1”
“0”
RA1
RA0
LD
fV
PDout
φR
fV
fin
MC145151–2
T/R
CHOICE OF
DETECTOR
ERROR
SIGNALS
LOOP
FILTER
T: 13.0833 – 18.0833 MHz
R: 9.5167 – 14.5167 MHz
TRANSMIT
(ADDS 856 TO
÷ N VALUE)
VCO
X6
T: 73.3333 – 78.3333 MHz
R: 69.7667 – 74.7667 MHz
DOWN
MIXER
“0” “0” “1”
RECEIVE
TRANSMIT: 440.0 – 470.0 MHz
RECEIVE: 418.6 – 448.6 MHz
(25 kHz STEPS)
CHANNEL PROGRAMMING
÷ N = 2284 TO 3484
X6
60.2500 MHz
NOTES:
1. fR = 4.1667 kHz; ÷ R = 2410; 21.4 MHz low side injection during receive.
2. Frequency values shown are for the 440 – 470 MHz band. Similar implementation applies to the 406 – 440 MHz band.
For 470 – 512 MHz, consider reference oscillator frequency X9 for mixer injection signal (90.3750 MHz).
Figure 2. Synthesizer for Land Mobile Radio UHF Bands
MC145151–2 Data Sheet Continued on Page 23
MC145151–2 through MC145158–2
4
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
P SUFFIX
PLASTIC DIP
CASE 710
Interfaces with Dual–Modulus Prescalers
28
The MC145152–2 is programmed by sixteen parallel inputs for the N and A
counters and three input lines for the R counter. The device features consist of
a reference oscillator, selectable–reference divider, two–output phase detector,
10–bit programmable divide–by–N counter, and 6–bit programmable ÷ A
counter.
The MC145152–2 is an improved–performance drop–in replacement for the
MC145152–1. Power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
On– or Off–Chip Reference Oscillator Operation
Lock Detect Signal
Dual Modulus/Parallel Programming
8 User–Selectable ÷ R Values: 8, 64, 128, 256, 512, 1024, 1160, 2048
÷ N Range = 3 to 1023, ÷ A Range = 0 to 63
Chip Complexity: 8000 FETs or 2000 Equivalent Gates
See Application Note AN980
1
DW SUFFIX
SOG PACKAGE
CASE 751F
28
1
ORDERING INFORMATION
MC145152P2
MC145152DW2
Plastic DIP
SOG Package
PIN ASSIGNMENT
fin
1
28
LD
VSS
2
27
OSCin
VDD
3
26
OSCout
RA0
4
25
A4
RA1
5
24
A3
RA2
6
23
A0
φR
7
22
A2
φV
8
21
A1
MC
9
20
N9
A5
10
19
N8
N0
11
18
N7
N1
12
17
N6
N2
13
16
N5
N3
14
15
N4
REV 1
8/95

Motorola, Inc. 1995
MOTOROLA
MC145151–2 through MC145158–2
5
MC145152–2 BLOCK DIAGRAM
RA2
RA1
RA0
OSCout
12 x 8 ROM REFERENCE DECODER
12
LOCK
DETECT
12–BIT ÷ R COUNTER
OSCin
LD
MC
CONTROL
LOGIC
PHASE
DETECTOR
φV
φR
fin
6–BIT ÷ A COUNTER
A5
A3 A2
A0
10–BIT ÷ N COUNTER
N0
N2
N4 N5
N7
N9
NOTE: N0 – N9, A0 – A5, and RA0 – RA2 have pull–up resistors that are not shown.
Prescaling section). The A inputs all have internal pull–up
resistors that ensure that inputs left open will remain at a
logic 1.
PIN DESCRIPTIONS
INPUT PINS
fin
Frequency Input (Pin 1)
Input to the positive edge triggered ÷ N and ÷ A counters.
fin is typically derived from a dual–modulus prescaler and is
ac coupled into the device. For larger amplitude signals
(standard CMOS logic levels) dc coupling may be used.
RA0, RA1, RA2
Reference Address Inputs (Pins 4, 5, 6)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider. The
total reference divide values are as follows:
OSCin, OSCout
Reference Oscillator Input/Output (Pins 27, 26)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSC in to ground and OSC out to ground.
OSC in may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSC in, but for larger amplitude signals (standard CMOS
logic levels) dc coupling may also be used. In the external
reference mode, no connection is required to OSCout.
OUTPUT PINS
RA2
RA1
RA0
Total
Divide
Value
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
64
128
256
512
1024
1160
2048
Reference Address Code
N0 – N9
N Counter Programming Inputs (Pins 11 – 20)
The N inputs provide the data that is preset into the ÷ N
counter when it reaches the count of 0. N0 is the least significant digit and N9 is the most significant. Pull–up resistors ensure that inputs left open remain at a logic 1 and require only
a SPST switch to alter data to the zero state.
A0 – A5
A Counter Programming Inputs
(Pins 23, 21, 22, 24, 25, 10)
The A inputs define the number of clock cycles of fin that
require a logic 0 on the MC output (see Dual–Modulus
MC145151–2 through MC145158–2
6
φR , φV
Phase Detector B Outputs (Pins 7, 8)
These phase detector outputs can be combined externally
for a loop–error signal.
If the frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
MC
Dual–Modulus Prescale Control Output (Pin 9)
Signal generated by the on–chip control logic circuitry for
controlling an external dual–modulus prescaler. The MC
level will be low at the beginning of a count cycle and will
remain low until the ÷ A counter has counted down from its
programmed value. At this time, MC goes high and remains
high until the ÷ N counter has counted the rest of the way
down from its programmed value (N – A additional counts
since both ÷ N and ÷ A are counting down during the first
MOTOROLA
portion of the cycle). MC is then set back low, the counters
preset to their respective programmed values, and the above
sequence repeated. This provides for a total programmable
divide value (NT) = N • P + A where P and P + 1 represent the
dual–modulus prescaler divide values respectively for high
and low MC levels, N the number programmed into the ÷ N
counter, and A the number programmed into the ÷ A counter.
POWER SUPPLY
LD
Lock Detector Output (Pin 28)
VSS
Negative Power Supply (Pin 2)
Essentially a high level when loop is locked (fR, fV of same
phase and frequency). Pulses low when loop is out of lock.
The most negative supply potential. This pin is usually
ground.
VDD
Positive Power Supply (Pin 3)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
TYPICAL APPLICATIONS
NO CONNECTS
“1”
“1”
“1”
LOCK DETECT SIGNAL
10.24 MHz
NOTE 1
R2
OSCout
RA2
RA1
RA0
LD
φR
OSCin
φV
MC145152–2
+V
VDD
MC
VSS
fin
N9
N0 A5
C
150 – 175 MHz
5 kHz STEPS
R1
–
R1
VCO
+
R2
MC33171
NOTE 2
C
A0
MC12017
÷ 64/65 PRESCALER
CHANNEL PROGRAMMING
NOTES:
1. Off–chip oscillator optional.
2. The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter
Design page for additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful
not to exceed the common mode input range of the op amp used in the combiner/loop filter.
Figure 1. Synthesizer for Land Mobile Radio VHF Bands
MOTOROLA
MC145151–2 through MC145158–2
7
REF. OSC.
15.360 MHz
(ON–CHIP OSC.
OPTIONAL)
RECEIVER 2ND L.O.
30.720 MHz
NO CONNECTS
X2
“1”
“1”
“1”
R2
OSCout
RA2
RA1
RA0
+V
VDD
VSS
LD
φR
OSCin
MC145152–2
NOTE 5
φV
MC
fin
N9
N0 A5
CHANNEL PROGRAMMING
RECEIVER FIRST L.O.
825.030 → 844.980 MHz
(30 kHz STEPS)
LOCK DETECT SIGNAL
A0
C
R1
–
X4
NOTE 6
VCO
R1
+
NOTE 7
R2
C
TRANSMITTER
MODULATION
MC12017
÷ 64/65 PRESCALER
NOTE 6
X4
NOTE 6
TRANSMITTER SIGNAL
825.030 → 844.980 MHz
(30 kHz STEPS)
NOTES:
1. Receiver 1st I.F. = 45 MHz, low side injection; Receiver 2nd I.F. = 11.7 MHz, low side injection.
2. Duplex operation with 45 MHz receiver/transmit separation.
3. fR = 7.5 kHz; ÷ R = 2048.
4. Ntotal = N 64 + A = 27501 to 28166; N = 429 to 440; A = 0 to 63.
5. MC145158–2 may be used where serial data entry is desired.
6. High frequency prescalers (e.g., MC12018 [520 MHz] and MC12022 [1 GHz]) may be used for higher frequency VCO and fref
implementations.
7. The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design page for
additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the common mode
input range of the op amp used in the combiner/loop filter.
Figure 2. 666–Channel, Computer–Controlled, Mobile Radiotelephone Synthesizer
for 800 MHz Cellular Radio Systems
MC145152–2 Data Sheet Continued on Page 23
MC145151–2 through MC145158–2
8
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
P SUFFIX
PLASTIC DIP
CASE 707
Interfaces with Single–Modulus Prescalers
The MC145155–2 is programmed by a clocked, serial input, 16–bit data
stream. The device features consist of a reference oscillator, selectable–reference divider, digital–phase detector, 14–bit programmable divide–by–N
counter, and the necessary shift register and latch circuitry for accepting serial
input data.
The MC145155–2 is an improved–performance drop–in replacement for the
MC145155–1. Power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
On– or Off–Chip Reference Oscillator Operation with Buffered Output
Compatible with the Serial Peripheral Interface (SPI) on CMOS MCUs
Lock Detect Signal
Two Open–Drain Switch Outputs
8 User–Selectable ÷ R Values: 16, 512, 1024, 2048, 3668, 4096, 6144,
8192
Single Modulus/Serial Programming
÷ N Range = 3 to 16383
“Linearized” Digital Phase Detector Enhances Transfer Function Linearity
Two Error Signal Options: Single–Ended (Three–State) or Double–Ended
Chip Complexity: 6504 FETs or 1626 Equivalent Gates
18
1
DW SUFFIX
SOG PACKAGE
CASE 751D
20
1
ORDERING INFORMATION
MC145155P2
MC145155DW2
Plastic DIP
SOG Package
PIN ASSIGNMENTS
PLASTIC DIP
RA1
1
18
RA0
RA2
2
17
OSCin
φV
3
16
OSCout
φR
4
15
REFout
VDD
5
14
SW2
PDout
6
13
SW1
VSS
7
12
ENB
LD
8
11
DATA
fin
9
10
CLK
SOG PACKAGE
RA1
1
20
RA0
RA2
2
19
OSCin
φV
3
18
OSCout
φR
4
17
REFout
VDD
5
16
NC
PDout
6
15
SW2
VSS
7
14
SW1
NC
8
13
ENB
LD
9
12
DATA
fin
10
11
CLK
NC = NO CONNECTION
REV 1
8/95

Motorola, Inc. 1995
MOTOROLA
MC145151–2 through MC145158–2
9
MC145155–2 BLOCK DIAGRAM
RA2
RA1
RA0
14 x 8 ROM REFERENCE DECODER
LOCK
DETECT
14
OSCout
LD
14–BIT ÷ R COUNTER
OSCin
fR
fV
REFout
PHASE
DETECTOR
A
PDout
14–BIT ÷ N COUNTER
fin
PHASE
DETECTOR
B
14
VDD
φV
φR
SW2
ENB
LATCH
LATCH
SW1
14
DATA
2–BIT SHIFT
REGISTER
14–BIT SHIFT REGISTER
CLK
information for the 14–bit ÷ N counter and the two switch signals SW1 and SW2. The entry format is as follows:
INPUT PINS
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as
defined by the table below:
RA2
RA1
RA0
Total
Divide
Value
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
16
512
1024
2048
3668
4096
6144
8192
Reference Address Code
CLK, DATA
Shift Register Clock, Serial Data Inputs
(PDIP – Pins 10, 11; SOG – Pins 11, 12)
Each low–to–high transition clocks one bit into the on–chip
16–bit shift register. The Data input provides programming
MC145151–2 through MC145158–2
10
SW1
SW2
÷
RA0, RA1, RA2
Reference Address Inputs (PDIP – Pins 18, 1, 2;
SOG – Pins 20, 1, 2)
÷
Input to the ÷ N portion of the synthesizer. fin is typically
derived from loop VCO and is ac coupled into the device. For
larger amplitude signals (standard CMOS logic levels) dc
coupling may be used.
÷ N COUNTER BITS
N LSB
fin
Frequency Input (PDIP – Pin 9, SOG – Pin 10)
N MSB
PIN DESCRIPTIONS
LAST DATA BIT IN (BIT NO. 16)
FIRST DATA BIT IN (BIT NO. 1)
ENB
Latch Enable Input (PDIP – Pin 12, SOG – Pin 13)
When high (1), ENB transfers the contents of the shift register into the latches, and to the programmable counter inputs, and the switch outputs SW1 and SW2. When low (0),
ENB inhibits the above action and thus allows changes to be
made in the shift register data without affecting the counter
programming and switch outputs. An on–chip pull–up establishes a continuously high level for ENB when no external
signal is applied. ENB is normally low and is pulsed high to
transfer data to the latches.
OSCin, OSCout
Reference Oscillator Input/Output (PDIP – Pins 17, 16;
SOG – Pins 19, 18)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSCin to ground and OSCout to ground.
OSCin may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSCin, but for larger amplitude signals (standard CMOS
logic levels) dc coupling may also be used. In the external
reference mode, no connection is required to OSCout.
MOTOROLA
SW1, SW2
Band Switch Outputs (PDIP – Pins 13, 14;
SOG – Pins 14, 15)
OUTPUT PINS
PDout
Phase Detector A Output (PDIP, SOG – Pin 6)
Three–state output of phase detector for use as loop error
signal. Double–ended outputs are also available for this purpose (see φV and φR).
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency f V = fR and Phase Coincidence: High–Impedance State
φR , φV
Phase Detector B Outputs (PDIP, SOG – Pins 4, 3)
These phase detector outputs can be combined externally
for a loop–error signal. A single–ended output is also available for this purpose (see PDout).
If frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
LD
Lock Detector Output (PDIP – Pin 8, SOG – Pin 9)
Essentially a high level when loop is locked (fR, fV of same
phase and frequency). LD pulses low when loop is out of
lock.
SW1 and SW2 provide latched open–drain outputs corresponding to data bits numbers one and two. These outputs
can be tied through external resistors to voltages as high as
15 V, independent of the VDD supply voltage. These are
typically used for band switch functions. A logic 1 causes the
output to assume a high–impedance state, while a logic 0
causes the output to be low.
REFout
Buffered Reference Oscillator Output (PDIP, SOG –
Pin 15)
Buffered output of on–chip reference oscillator or externally provided reference–input signal.
POWER SUPPLY
VDD
Positive Power Supply (PDIP, SOG – Pin 5)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
VSS
Negative Power Supply (PDIP, SOG – Pin 7)
The most negative supply potential. This pin is usually
ground.
TYPICAL APPLICATIONS
4.0 MHz
UHF/VHF
TUNER OR
CATV
FRONT END
MC12073/74
PRESCALER
fin
DATA
KEYBOARD
MC145155–2
CLK
φR
φV
–
+
1/2 MC1458*
ENB
CMOS
MPU/MCU
3
MC14489
LED DISPLAY
* The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design page
for additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the common
mode input range of the op amp used in the combiner/loop filter.
Figure 1. Microprocessor–Controlled TV/CATV Tuning System with Serial Interface
MOTOROLA
MC145151–2 through MC145158–2
11
2.56 MHz
FM
OSC
MC12019
÷ 20 PRESCALER
AM
OSC
fin
MC145155–2
DATA
KEYBOARD
CLK
φR
φV
–
+
1/2 MC1458*
TO
AM/FM
OSCILLATORS
ENB
CMOS
MPU/MCU
TO DISPLAY
* The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design page
for additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the common
mode input range of the op amp used in the combiner/loop filter.
Figure 2. AM/FM Radio Synthesizer
MC145155–2 Data Sheet Continued on Page 23
MC145151–2 through MC145158–2
12
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
!
Interfaces with Dual–Modulus Prescalers
The MC145156–2 is programmed by a clocked, serial input, 19–bit data
stream. The device features consist of a reference oscillator, selectable–reference divider, digital–phase detector, 10–bit programmable divide–by–N
counter, 7–bit programmable divide–by–A counter, and the necessary shift
register and latch circuitry for accepting serial input data.
The MC145156–2 is an improved–performance drop–in replacement for the
MC145156–1. Power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
On– or Off–Chip Reference Oscillator Operation with Buffered Output
Compatible with the Serial Peripheral Interface (SPI) on CMOS MCUs
Lock Detect Signal
Two Open–Drain Switch Outputs
Dual Modulus/Serial Programming
8 User–Selectable ÷ R Values: 8, 64, 128, 256, 640, 1000, 1024, 2048
÷ N Range = 3 to 1023, ÷ A Range = 0 to 127
“Linearized” Digital Phase Detector Enhances Transfer Function Linearity
Two Error Signal Options: Single–Ended (Three–State) or Double–Ended
Chip Complexity: 6504 FETs or 1626 Equivalent Gates
P SUFFIX
PLASTIC DIP
CASE 738
20
1
DW SUFFIX
SOG PACKAGE
CASE 751D
20
1
ORDERING INFORMATION
MC145156P2
MC145156DW2
Plastic DIP
SOG Package
PIN ASSIGNMENT
RA1
1
20
RA0
RA2
2
19
OSCin
φV
3
18
OSCout
φR
4
17
REFout
VDD
5
16
TEST
PDout
6
15
SW2
VSS
7
14
SW1
MC
8
13
ENB
LD
9
12
DATA
fin
10
11
CLK
REV 1
8/95

Motorola, Inc. 1995
MOTOROLA
MC145151–2 through MC145158–2
13
MC145156–2 BLOCK DIAGRAM
RA2
RA1
RA0
12 x 8 ROM REFERENCE DECODER
12
12–BIT ÷ R COUNTER
OSCin
LOCK
DETECT
LD
OSCout
fR
CONTROL LOGIC
REFout
fV
MC
7–BIT ÷ A COUNTER
fin
10–BIT ÷ N COUNTER
÷ A COUNTER LATCH
ENB
φV
PHASE
DETECTOR
B
φR
SW2
÷ N COUNTER LATCH
7
LATCH
SW1
10
DATA
7–BIT SHIFT REGISTER
PDout
10
7
VDD
PHASE
DETECTOR
A
10–BIT SHIFT REGISTER
2–BIT SHIFT
REGISTER
CLK
RA0, RA1, RA2
Reference Address Inputs (Pins 20, 1, 2)
These three inputs establish a code defining one of eight
possible divide values for the total reference divider, as
defined by the table below:
RA2
RA1
RA0
Total
Divide
Value
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
8
64
128
256
640
1000
1024
2048
Reference Address Code
CLK, DATA
Shift Register Clock, Serial Data Inputs (Pins 11, 12)
Each low–to–high transition clocks one bit into the on–chip
19–bit shift register. The data input provides programming information for the 10–bit ÷ N counter, the 7–bit ÷ A counter,
and the two switch signals SW1 and SW2. The entry format
is as follows:
MC145151–2 through MC145158–2
14
SW1
÷
Input to the positive edge triggered ÷ N and ÷ A counters.
fin is typically derived from a dual–modulus prescaler and is
ac coupled into the device. For larger amplitude signals
(standard CMOS logic levels), dc coupling may be used.
÷
÷
÷
fin
Frequency Input (Pin 10)
N MSB
SW2
A LSB
INPUT PINS
÷ N COUNTER BITS
A MSB
N LSB
÷ A COUNTER BITS
PIN DESCRIPTIONS
LAST DATA BIT IN (BIT NO. 19)
FIRST DATA BIT IN (BIT NO. 1)
ENB
Latch Enable Input (Pin 13)
When high (1), ENB transfers the contents of the shift register into the latches, and to the programmable counter inputs, and the switch outputs SW1 and SW2. When low (0),
ENB inhibits the above action and thus allows changes to be
made in the shift register data without affecting the counter
programming and switch outputs. An on–chip pull–up establishes a continuously high level for ENB when no external
signal is applied. ENB is normally low and is pulsed high to
transfer data to the latches.
OSCin, OSCout
Reference Oscillator Input/Output (Pins 19, 18)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSCin to ground and OSCout to ground.
OSCin may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSC in, but for larger amplitude signals (standard CMOS
logic levels) dc coupling may also be used. In the external
reference mode, no connection is required to OSCout.
TEST
Factory Test Input (Pin 16)
Used in manufacturing. Must be left open or tied to VSS.
MOTOROLA
OUTPUT PINS
PDout
Phase Detector A Output (Pin 6)
Three–state output of phase detector for use as loop–error
signal. Double–ended outputs are also available for this purpose (see φV and φR).
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency f V = fR and Phase Coincidence: High–Impedance State
φR , φV
Phase Detector B Outputs (Pins 4, 3)
These phase detector outputs can be combined externally
for a loop–error signal. A single–ended output is also available for this purpose (see PDout ).
If frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
MC
Dual–Modulus Prescale Control Output (Pin 8)
Signal generated by the on–chip control logic circuitry for
controlling an external dual–modulus prescaler. The MC
level will be low at the beginning of a count cycle and will
remain low until the ÷ A counter has counted down from its
programmed value. At this time, MC goes high and remains
high until the ÷ N counter has counted the rest of the way
down from its programmed value (N – A additional counts
since both ÷ N and ÷ A are counting down during the first portion of the cycle). MC is then set back low, the counters
MOTOROLA
preset to their respective programmed values, and the above
sequence repeated. This provides for a total programmable
divide value (NT) = N P + A where P and P + 1 represent the
dual–modulus prescaler divide values respectively for high
and low MC levels, N the number programmed into the ÷ N
counter, and A the number programmed into the ÷ A counter.
LD
Lock Detector Output (Pin 9)
Essentially a high level when loop is locked (fR, fV of same
phase and frequency). LD pulses low when loop is out of
lock.
SW1, SW2
Band Switch Outputs (Pins 14, 15)
SW1 and SW2 provide latched open–drain outputs corresponding to data bits numbers one and two. These outputs
can be tied through external resistors to voltages as high as
15 V, independent of the VDD supply voltage. These are
typically used for band switch functions. A logic 1 causes the
output to assume a high–impedance state, while a logic 0
causes the output to be low.
REFout
Buffered Reference Oscillator Output (Pin 17)
Buffered output of on–chip reference oscillator or externally provided reference–input signal.
POWER SUPPLY
VDD
Positive Power Supply (Pin 5)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
VSS
Negative Power Supply (Pin 7)
The most negative supply potential. This pin is usually
ground.
MC145151–2 through MC145158–2
15
TYPICAL APPLICATIONS
+ 12 V
LOCK DETECT SIGNAL
3.2 MHz
NOTES 1
AND 2
+V
OSCin
OSCout
RA2 RA1 RA0
LD SW1 SW2
PDout
VDD
REFout
CLK
KEY–
BOARD
φR
MC145156–2
VSS
DATA
fin
ENB
FM B +
+ 12 V
AM B +
OPTIONAL
LOOP
ERROR SIGNAL
–
VCO
φV
+
MC
1/2 MC1458
NOTE 3
CMOS MPU/MCU
MC12019
÷ 20/21 DUAL MODULUS PRESCALER
TO DISPLAY DRIVER (e.g., MC14489)
NOTES:
1. For AM: channel spacing = 5 kHz, ÷ R = ÷ 640 (code 100).
2. For FM: channel spacing = 25 kHz, ÷ R = ÷ 128 (code 010).
3. The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design page
for additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the
common mode input range of the op amp used in the combiner/loop filter.
Figure 1. AM/FM Radio Broadcast Synthesizer
3.2 MHz (NOTE 3)
NAV = 01
COM = 10
+V
OSCin OSCout
RA2 RA1 RA0
VDD
REFout
CLK
R/T
LD SW1 SW2
PDout
MC145156–2
VSS
DATA
ENB
fin
VCO RANGE
NAV: 97.300 – 107.250 MHz
COM–T: 118.000 – 135.975 MHz
COM–R: 139.400 – 157.375 MHz
LOCK DETECT SIGNAL
φR
–
φV
+
VCO
MC
MC33171
NOTE 5
CMOS MPU/MCU
MC12016 (NOTES 2 AND 4)
÷ 40/41 DUAL MODULUS PRESCALER
CHANNEL
SELECTION
TO DISPLAY DRIVER
(e.g., MC14489)
NOTES:
1. For NAV: fR = 50 kHz, ÷ R = 64 using 10.7 MHz lowside injection, Ntotal = 1946 – 2145.
For COM–T: fR = 25 kHz, ÷ R = 128, Ntotal = 4720 – 5439.
For COM–R: fR = 25 kHz, ÷ R = 128, using 21.4 MHz highside injection, Ntotal = 5576 – 6295.
2. A ÷ 32/33 dual modulus approach is provided by substituting an MC12015 for the MC12016. The devices are pin equivalent.
3. A 6.4 MHz oscillator crystal can be used by selecting ÷ R = 128 (code 010) for NAV and ÷ R = 256 (code 011) for COM.
4. MC12013 + MC10131 combination may also be used to form the ÷ 40/41 prescaler.
5. The φR and φV outputs are fed to an external combiner/loop filter. See the Phase–Locked Loop — Low–Pass Filter Design
page for additional information. The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed
the common mode input range of the op amp used in the combiner/loop filter.
Figure 2. Avionics Navigation or Communication Synthesizer
MC145156–2 Data Sheet Continued on Page 23
MC145151–2 through MC145158–2
16
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
!
P SUFFIX
PLASTIC DIP
CASE 648
Interfaces with Single–Modulus Prescalers
16
The MC145157–2 has a fully programmable 14–bit reference counter, as well
as a fully programmable ÷ N counter. The counters are programmed serially
through a common data input and latched into the appropriate counter latch,
according to the last data bit (control bit) entered.
The MC145157–2 is an improved–performance drop–in replacement for the
MC145157–1. Power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
Fully Programmable Reference and ÷ N Counters
÷ R Range = 3 to 16383
÷ N Range = 3 to 16383
fV and fR Outputs
Lock Detect Signal
Compatible with the Serial Peripheral Interface (SPI) on CMOS MCUs
“Linearized” Digital Phase Detector
Single–Ended (Three–State) or Double–Ended Phase Detector Outputs
Chip Complexity: 6504 FETs or 1626 Equivalent Gates
1
DW SUFFIX
SOG PACKAGE
CASE 751G
16
1
ORDERING INFORMATION
MC145157P2
MC145157DW2
Plastic DIP
SOG Package
PIN ASSIGNMENT
OSCin
1
16
φR
OSCout
2
15
φV
fV
3
14
REFout
VDD
4
13
fR
PDout
5
12
S/Rout
VSS
6
11
ENB
LD
7
10
DATA
fin
8
9
CLK
REV 1
8/95

Motorola, Inc. 1995
MOTOROLA
MC145151–2 through MC145158–2
17
MC145157–2 BLOCK DIAGRAM
14–BIT SHIFT REGISTER
14
ENB
fR
REFERENCE COUNTER LATCH
14
LOCK
DETECT
LD
14–BIT ÷ R COUNTER
OSCin
PHASE
DETECTOR
A
OSCout
REFout
14–BIT ÷ N COUNTER
fin
14
PHASE
DETECTOR
B
÷ N COUNTER LATCH
DATA
PDout
φV
φR
fV
14
1–BIT
CONTROL
S/R
S/Rout
14–BIT SHIFT REGISTER
CLK
if the control bit is at a logic low. A logic low on this pin allows
the user to change the data in the shift registers without
affecting the counters. ENB is normally low and is pulsed
high to transfer data to the latches.
PIN DESCRIPTIONS
INPUT PINS
fin
Frequency Input (Pin 8)
Input frequency from VCO output. A rising edge signal on
this input decrements the ÷ N counter. This input has an
inverter biased in the linear region to allow use with ac
coupled signals as low as 500 mV p–p. For larger amplitude
signals (standard CMOS logic levels), dc coupling may be
used.
CLK, DATA
Shift Clock, Serial Data Inputs (Pins 9, 10)
MSB
LSB
CONTROL
Each low–to–high transition of the clock shifts one bit of
data into the on–chip shift registers. The last data bit entered
determines which counter storage latch is activated; a logic 1
selects the reference counter latch and a logic 0 selects the
÷ N counter latch. The entry format is as follows:
FIRST DATA BIT INTO SHIFT REGISTER
ENB
Latch Enable Input (Pin 11)
A logic high on this pin latches the data from the shift register into the reference divider or ÷ N latches depending on the
control bit. The reference divider latches are activated if the
control bit is at a logic high and the ÷ N latches are activated
MC145151–2 through MC145158–2
18
OSCin, OSCout
Reference Oscillator Input/Output (Pins 1, 2)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSC in to ground and OSC out to ground.
OSC in may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSC in, but for larger amplitude signals (standard CMOS
logic levels) dc coupling may also be used. In the external
reference mode, no connection is required to OSC out.
OUTPUT PINS
PDout
Single–Ended Phase Detector A Output (Pin 5)
This single–ended (three–state) phase detector output
produces a loop–error signal that is used with a loop filter to
control a VCO.
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency f V = fR and Phase Coincidence: High–Impedance State
φR , φV
Double–Ended Phase Detector B Outputs (Pins 16, 15)
These outputs can be combined externally for a loop–error
signal. A single–ended output is also available for this purpose (see PDout ).
MOTOROLA
If frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
fR, fV
R Counter Output, N Counter Output (Pins 13, 3)
Buffered, divided reference and fin frequency outputs. The
fR and fV outputs are connected internally to the ÷ R and ÷ N
counter outputs respectively, allowing the counters to be
used independently, as well as monitoring the phase detector
inputs.
LD
Lock Detector Output (Pin 7)
This output is essentially at a high level when the loop is
locked (fR, fV of same phase and frequency), and pulses low
when loop is out of lock.
REFout
Buffered Reference Oscillator Output (Pin 14)
This output can be used as a second local oscillator, reference oscillator to another frequency synthesizer, or as the
system clock to a microprocessor controller.
S/Rout
Shift Register Output (Pin 12)
This output can be connected to an external shift register
to provide band switching, control information, and counter
programming code checking.
POWER SUPPLY
VDD
Positive Power Supply (Pin 4)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
VSS
Negative Power Supply (Pin 6)
The most negative supply potential. This pin is usually
ground.
MC145157–2 Data Sheet Continued on Page 23
MOTOROLA
MC145151–2 through MC145158–2
19
SEMICONDUCTOR TECHNICAL DATA
!
P SUFFIX
PLASTIC DIP
CASE 648
Interfaces with Dual–Modulus Prescalers
16
The MC145158–2 has a fully programmable 14–bit reference counter, as well
as fully programmable ÷ N and ÷ A counters. The counters are programmed
serially through a common data input and latched into the appropriate counter
latch, according to the last data bit (control bit) entered.
The MC145158–2 is an improved–performance drop–in replacement for the
MC145158–1. Power consumption has decreased and ESD and latch–up
performance have improved.
•
•
•
•
•
•
•
•
•
•
•
•
•
Operating Temperature Range: – 40 to 85°C
Low Power Consumption Through Use of CMOS Technology
3.0 to 9.0 V Supply Range
Fully Programmable Reference and ÷ N Counters
÷ R Range = 3 to 16383
÷ N Range = 3 to 1023
Dual Modulus Capability; ÷ A Range = 0 to 127
fV and fR Outputs
Lock Detect Signal
Compatible with the Serial Peripheral Interface (SPI) on CMOS MCUs
“Linearized” Digital Phase Detector
Single–Ended (Three–State) or Double–Ended Phase Detector Outputs
Chip Complexity: 6504 FETs or 1626 Equivalent Gates
1
DW SUFFIX
SOG PACKAGE
CASE 751G
16
1
ORDERING INFORMATION
MC145158P2
MC145158DW2
Plastic DIP
SOG Package
PIN ASSIGNMENT
OSCin
1
16
φR
OSCout
2
15
φV
fV
3
14
REFout
VDD
4
13
fR
PDout
5
12
MC
VSS
6
11
ENB
LD
7
10
DATA
fin
8
9
CLK
REV 1
8/95

Motorola, Inc. 1995
MC145151–2
through MC145158–2
20
MOTOROLA
MC145158–2 BLOCK DIAGRAM
14–BIT SHIFT REGISTER
14
ENB
fR
REFERENCE COUNTER LATCH
LOCK
DETECT
14
14–BIT ÷ R COUNTER
OSCin
PHASE
DETECTOR
A
OSCout
CONTROL LOGIC
REFout
7–BIT ÷ A
COUNTER
fin
10–BIT ÷ N
COUNTER
÷ A COUNTER
÷ N COUNTER
LATCH
LATCH
7
1–BIT
CONTROL
S/R
PHASE
DETECTOR
B
10
7
DATA
LD
PDout
φV
φR
fV
10
7–BIT S/R
MC
10–BIT S/R
CLK
Input frequency from VCO output. A rising edge signal on
this input decrements the ÷ A and ÷ N counters. This input
has an inverter biased in the linear region to allow use with
ac coupled signals as low as 500 mV p–p. For larger amplitude signals (standard CMOS logic levels), dc coupling may
be used.
CLK, DATA
Shift Clock, Serial Data Inputs (Pins 9, 10)
Each low–to–high transition of the CLK shifts one bit of
data into the on–chip shift registers. The last data bit entered
determines which counter storage latch is activated; a logic 1
selects the reference counter latch and a logic 0 selects the
÷ A, ÷ N counter latch. The data entry format is as follows:
MSB
LSB
CONTROL
÷R
FIRST DATA BIT INTO SHIFT REGISTER
MOTOROLA
MSB
fin
Frequency Input (Pin 8)
LSB
CONTROL
INPUT PINS
÷N
MSB
LSB
÷A
PIN DESCRIPTIONS
FIRST DATA BIT INTO SHIFT REGISTER
ENB
Latch Enable Input (Pin 11)
A logic high on this pin latches the data from the shift register into the reference divider or ÷ N, ÷ A latches depending on
the control bit. The reference divider latches are activated if
the control bit is at a logic high and the ÷ N, ÷ A latches are
activated if the control bit is at a logic low. A logic low on this
pin allows the user to change the data in the shift registers
without affecting the counters. ENB is normally low and is
pulsed high to transfer data to the latches.
OSCin, OSCout
Reference Oscillator Input/Output (Pins 1, 2)
These pins form an on–chip reference oscillator when connected to terminals of an external parallel resonant crystal.
Frequency setting capacitors of appropriate value must be
connected from OSC in to ground and OSC out to ground.
OSC in may also serve as the input for an externally–generated reference signal. This signal is typically ac coupled to
OSCin, but for larger amplitude signals (standard CMOS logic levels) dc coupling may also be used. In the external reference mode, no connection is required to OSC out.
MC145151–2 through MC145158–2
21
OUTPUT PINS
PDout
Phase Detector A Output (Pin 5)
This single–ended (three–state) phase detector output
produces a loop–error signal that is used with a loop filter to
control a VCO.
Frequency fV > fR or fV Leading: Negative Pulses
Frequency fV < fR or fV Lagging: Positive Pulses
Frequency f V = fR and Phase Coincidence: High–Impedance State
φR , φV
Phase Detector B Outputs (Pins 16, 15)
Double–ended phase detector outputs. These outputs can
be combined externally for a loop–error signal. A single–
ended output is also available for this purpose (see PDout ).
If frequency fV is greater than fR or if the phase of fV is
leading, then error information is provided by φV pulsing low.
φR remains essentially high.
If the frequency fV is less than fR or if the phase of fV is
lagging, then error information is provided by φR pulsing low.
φV remains essentially high.
If the frequency of fV = fR and both are in phase, then both
φV and φR remain high except for a small minimum time
period when both pulse low in phase.
MC
Dual–Modulus Prescale Control Output (Pin 12)
This output generates a signal by the on–chip control logic
circuitry for controlling an external dual–modulus prescaler.
The MC level is low at the beginning of a count cycle and
remains low until the ÷ A counter has counted down from its
programmed value. At this time, MC goes high and remains
high until the ÷ N counter has counted the rest of the way
down from its programmed value (N – A additional counts
since both ÷ N and ÷ A are counting down during the first portion of the cycle). MC is then set back low, the counters preset to their respective programmed values, and the above
sequence repeated. This provides for a total programmable
divide value (NT) = N P + A where P and P + 1 represent the
MC145151–2 through MC145158–2
22
dual–modulus prescaler divide values respectively for high
and low modulus control levels, N the number programmed
into the ÷ N counter, and A the number programmed into the
÷ A counter. Note that when a prescaler is needed, the dual–
modulus version offers a distinct advantage. The dual–
modulus prescaler allows a higher reference frequency at
the phase detector input, increasing system performance capability, and simplifying the loop filter design.
fR, fV
R Counter Output, N Counter Output (Pins 13, 3)
Buffered, divided reference and fin frequency outputs. The
fR and fV outputs are connected internally to the ÷ R and
÷ N counter outputs respectively, allowing the counters to be
used independently, as well as monitoring the phase detector
inputs.
LD
Lock Detector Output (Pin 7)
This output is essentially at a high level when the loop is
locked (fR, fV of same phase and frequency), and pulses low
when loop is out of lock.
REFout
Buffered Reference Oscillator Output (Pin 14)
This output can be used as a second local oscillator, reference oscillator to another frequency synthesizer, or as the
system clock to a microprocessor controller.
POWER SUPPLY
VDD
Positive Power Supply (Pin 4)
The positive power supply potential. This pin may range
from + 3 to + 9 V with respect to VSS.
VSS
Negative Power Supply (Pin 6)
The most negative supply potential. This pin is usually
ground.
MOTOROLA
MC14515X–2 FAMILY CHARACTERISTICS AND DESCRIPTIONS
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
Value
Unit
– 0.5 to + 10.0
V
– 0.5 to VDD + 0.5
V
– 0.5 to + 15
V
Input or Output Current (DC or Transient),
per Pin
± 10
mA
IDD, ISS
Supply Current, VDD or VSS Pins
± 30
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
°C
260
°C
VDD
Vin, Vout
Vout
Iin, Iout
TL
Parameter
DC Supply Voltage
Input or Output Voltage (DC or Transient)
except SW1, SW2
Output Voltage (DC or Transient),
SW1, SW2 (Rpull–up = 4.7 kΩ)
Lead Temperature, 1 mm from Case for
10 seconds
These devices contain protection circuitry to
protect against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any
voltage higher than maximum rated voltages
to these high–impedance circuits. For proper
operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD
except for SW1 and SW2.
SW1 and SW2 can be tied through external
resistors to voltages as high as 15 V, independent of the supply voltage.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either VSS
or VDD), except for inputs with pull–up devices.
Unused outputs must be left open.
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
tables or Pin Descriptions section.
†Power Dissipation Temperature Derating:
Plastic DIP: – 12 mW/°C from 65 to 85°C
SOG Package: – 7 mW/°C from 65 to 85°C
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Symbol
VDD
Parameter
Test Condition
Power Supply Voltage
Range
– 40°C
25°C
85°C
VDD
V
Min
Max
Min
Max
Min
Max
Unit
—
3
9
3
9
3
9
V
Iss
Dynamic Supply Current
fin = OSCin = 10 MHz,
1 V p–p ac coupled sine
wave
R = 128, A = 32, N = 128
3
5
9
—
—
—
3.5
10
30
—
—
—
3
7.5
24
—
—
—
3
7.5
24
mA
ISS
Quiescent Supply Current
(not including pull–up
current component)
Vin = VDD or VSS
Iout = 0 µA
3
5
9
—
—
—
800
1200
1600
—
—
—
800
1200
1600
—
—
—
1600
2400
3200
µA
Vin
Input Voltage — fin, OSCin
Input ac coupled sine wave
—
500
—
500
—
500
—
mV p–p
VIL
Low–Level Input Voltage
— fin, OSCin
Vout ≥ 2.1 V
Vout ≥ 3.5 V
Vout ≥ 6.3 V
Input dc
coupled
square wave
3
5
9
—
—
—
0
0
0
—
—
—
0
0
0
—
—
—
0
0
0
V
VIH
High–Level Input Voltage
— fin, OSCin
Vout ≤ 0.9 V
Vout ≤ 1.5 V
Vout ≤ 2.7 V
Input dc
coupled
square wave
3
5
9
3.0
5.0
9.0
—
—
—
3.0
5.0
9.0
—
—
—
3.0
5.0
9.0
—
—
—
V
VIL
Low–Level Input Voltage
— except fin, OSCin
3
5
9
—
—
—
0.9
1.5
2.7
—
—
—
0.9
1.5
2.7
—
—
—
0.9
1.5
2.7
V
VIH
High–Level Input Voltage
— except fin, OSCin
3
5
9
2.1
3.5
6.3
—
—
—
2.1
3.5
6.3
—
—
—
2.1
3.5
6.3
—
—
—
V
Iin
Input Current (fin, OSCin)
Vin = VDD or VSS
9
±2
± 50
±2
± 25
±2
± 22
µA
IIL
Input Leakage Current
(Data, CLK, ENB —
without pull–ups)
Vin = VSS
9
—
– 0.3
—
– 0.1
—
– 1.0
µA
IIH
Input Leakage Current (all
inputs except fin, OSCin)
Vin = VDD
9
—
0.3
—
0.1
—
1.0
µA
(continued)
MOTOROLA
MC145151–2 through MC145158–2
23
DC ELECTRICAL CHARACTERISTICS (continued)
– 40°C
25°C
85°C
VDD
V
Min
Max
Min
Max
Min
Max
Unit
9
– 20
– 400
– 20
– 200
– 20
– 170
µA
—
—
10
—
10
—
10
pF
Iout ≈ 0 µA
Vin = VDD
3
5
9
—
—
—
0.9
1.5
2.7
—
—
—
0.9
1.5
2.7
—
—
—
0.9
1.5
2.7
V
High–Level Output
Voltage — OSCout
Iout ≈ 0 µA
Vin = VSS
3
5
9
2.1
3.5
6.3
—
—
—
2.1
3.5
6.3
—
—
—
2.1
3.5
6.3
—
—
—
V
VOL
Low–Level Output
Voltage — Other Outputs
Iout ≈ 0 µA
3
5
9
—
—
—
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
V
VOH
High–Level Output
Voltage — Other Outputs
Iout ≈ 0 µA
3
5
9
2.95
4.95
8.95
—
—
—
2.95
4.95
8.95
—
—
—
2.95
4.95
8.95
—
—
—
V
Drain–to–Source
Breakdown Voltage —
SW1, SW2
Rpull–up = 4.7 kΩ
—
15
—
15
—
15
—
V
IOL
Low–Level Sinking
Current — MC
Vout = 0.3 V
Vout = 0.4 V
Vout = 0.5 V
3
5
9
1.30
1.90
3.80
—
—
—
1.10
1.70
3.30
—
—
—
0.66
1.08
2.10
—
—
—
mA
IOH
High–Level Sourcing
Current — MC
Vout = 2.7 V
Vout = 4.6 V
Vout = 8.5 V
3
5
9
– 0.60
– 0.90
– 1.50
—
—
—
– 0.50
– 0.75
– 1.25
—
—
—
– 0.30
– 0.50
– 0.80
—
—
—
mA
IOL
Low–Level Sinking
Current — LD
Vout = 0.3 V
Vout = 0.4 V
Vout = 0.5 V
3
5
9
0.25
0.64
1.30
—
—
—
0.20
0.51
1.00
—
—
—
0.15
0.36
0.70
—
—
—
mA
IOH
High–Level Sourcing
Current — LD
Vout = 2.7 V
Vout = 4.6 V
Vout = 8.5 V
3
5
9
– 0.25
– 0.64
– 1.30
—
—
—
– 0.20
– 0.51
– 1.00
—
—
—
– 0.15
– 0.36
– 0.70
—
—
—
mA
IOL
Low–Level Sinking
Current — SW1, SW2
Vout = 0.3 V
Vout = 0.4 V
Vout = 0.5 V
3
5
9
0.80
1.50
3.50
—
—
—
0.48
0.90
2.10
—
—
—
0.24
0.45
1.05
—
—
—
mA
IOL
Low–Level Sinking
Current — Other Outputs
Vout = 0.3 V
Vout = 0.4 V
Vout = 0.5 V
3
5
9
0.44
0.64
1.30
—
—
—
0.35
0.51
1.00
—
—
—
0.22
0.36
0.70
—
—
—
mA
IOH
High–Level Sourcing
Current — Other Outputs
Vout = 2.7 V
Vout = 4.6 V
Vout = 8.5 V
3
5
9
– 0.44
– 0.64
– 1.30
—
—
—
– 0.35
– 0.51
– 1.00
—
—
—
– 0.22
– 0.36
– 0.70
—
—
—
mA
IOZ
Output Leakage Current —
PDout
Vout = VDD or VSS
Output in Off State
9
—
± 0.3
—
± 0.1
—
± 1.0
µA
IOZ
Output Leakage Current —
SW1, SW2
Vout = VDD or VSS
Output in Off State
9
—
± 0.3
—
± 0.1
—
± 3.0
µA
Cout
Output Capacitance —
PDout
PDout — Three–State
—
—
10
—
10
—
10
pF
Symbol
Parameter
IIL
Pull–up Current (all inputs
with pull–ups)
Cin
Input Capacitance
VOL
Low–Level Output
Voltage — OSCout
VOH
V(BR)DSS
Test Condition
Vin = VSS
MC145151–2 through MC145158–2
24
MOTOROLA
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 10 ns)
VDD
V
Guaranteed Limit
25°C
Guaranteed Limit
– 40 to 85°C
Maximum Propagation Delay, fin to MC
(Figures 1 and 4)
3
5
9
110
60
35
120
70
40
ns
Maximum Propagation Delay, ENB to SW1, SW2
(Figures 1 and 5)
3
5
9
160
80
50
180
95
60
ns
Output Pulse Width, φR, φV, and LD with fR in Phase with fV
(Figures 2 and 4)
3
5
9
25 to 200
20 to 100
10 to 70
25 to 260
20 to 125
10 to 80
ns
tTLH
Maximum Output Transition Time, MC
(Figures 3 and 4)
3
5
9
115
60
40
115
75
60
ns
tTHL
Maximum Output Transition Time, MC
(Figures 3 and 4)
3
5
9
60
34
30
70
45
38
ns
tTLH, tTHL
Maximum Output Transition Time, LD
(Figures 3 and 4)
3
5
9
180
90
70
200
120
90
ns
tTLH, tTHL
Maximum Output Transition Time, Other Outputs
(Figures 3 and 4)
3
5
9
160
80
60
175
100
65
ns
Parameter
Symbol
tPLH, tPHL
tPHL
tw
Unit
SWITCHING WAVEFORMS
VDD
INPUT 50%
— VSS
OUTPUT
tw
tPHL
tPLH
φR, φV, LD*
50%
50%
* fR in phase with fV.
Figure 1.
Figure 2.
tTLH
ANY
OUTPUT
tTHL
90%
10%
Figure 3.
VDD
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
CL*
* Includes all probe and fixture capacitance.
Figure 4. Test Circuit
MOTOROLA
DEVICE
UNDER
TEST
15 kΩ
CL*
* Includes all probe and fixture capacitance.
Figure 5. Test Circuit
MC145151–2 through MC145158–2
25
TIMING REQUIREMENTS (Input tr = tf = 10 ns unless otherwise indicated)
Parameter
Symbol
VDD
V
Guaranteed Limit
25°C
Guaranteed Limit
– 40 to 85°C
Unit
fclk
Serial Data Clock Frequency, Assuming 25% Duty Cycle
NOTE: Refer to CLK tw(H) below
(Figure 6)
3
5
9
dc to 5.0
dc to 7.1
dc to 10
dc to 3.5
dc to 7.1
dc to 10
MHz
tsu
Minimum Setup Time, Data to CLK
(Figure 7)
3
5
9
30
20
18
30
20
18
ns
th
Minimum Hold Time, CLK to Data
(Figure 7)
3
5
9
40
20
15
40
20
15
ns
tsu
Minimum Setup Time, CLK to ENB
(Figure 7)
3
5
9
70
32
25
70
32
25
ns
trec
Minimum Recovery Time, ENB to CLK
(Figure 7)
3
5
9
5
10
20
5
10
20
ns
tw(H)
Minimum Pulse Width, CLK and ENB
(Figure 6)
3
5
9
50
35
25
70
35
25
ns
Maximum Input Rise and Fall Times — Any Input
(Figure 8)
3
5
9
5
4
2
5
4
2
µs
tr, tf
SWITCHING WAVEFORMS
— VDD
tw(H)
DATA
— VDD
CLK,
ENB
50%
50%
VSS
tsu
th
VSS
1 *
4 fclk
— VDD
CLK
*Assumes 25% Duty Cycle.
50%
LAST
CLK
tsu
FIRST
CLK
VSS
trec
— VDD
Figure 6.
ENB
50%
VSS
tt
ANY
OUTPUT
PREVIOUS
DATA
LATCHED
tf
— VDD
90%
10%
VSS
Figure 7.
Figure 8.
MC145151–2 through MC145158–2
26
MOTOROLA
FREQUENCY CHARACTERISTICS (Voltages References to VSS, CL = 50 pF, Input tr = tf =10 ns unless otherwise indicated)
Symbol
fi
Parameter
Input Frequency
(fin, OSCin)
– 40°C
25°C
85°C
VDD
V
Min
Max
Min
Max
Min
Max
Unit
R ≥ 8, A ≥ 0, N ≥ 8
Vin = 500 mV p–p
ac coupled sine wave
3
5
9
—
—
—
6
15
15
—
—
—
6
15
15
—
—
—
6
15
15
MHz
R ≥ 8, A ≥ 0, N ≥ 8
Vin = 1 V p–p ac coupled
sine wave
3
5
9
—
—
—
12
22
25
—
—
—
12
20
22
—
—
—
7
20
22
MHz
R ≥ 8, A ≥ 0, N ≥ 8
Vin = VDD to VSS
dc coupled square wave
3
5
9
—
—
—
13
25
25
—
—
—
12
22
25
—
—
—
8
22
25
MHz
Test Condition
NOTE: Usually, the PLL’s propagation delay from fin to MC plus the setup time of the prescaler determines the upper frequency limit of the system.
The upper frequency limit is found with the following formula: f = P / (tP + tset) where f is the upper frequency in Hz, P is the lower of the dual
modulus prescaler ratios, tP is the fin to MC propagation delay in seconds, and tset is the prescaler setup time in seconds.
For example, with a 5 V supply, the fin to MC delay is 70 ns. If the MC12028A prescaler is used, the setup time is 16 ns. Thus, if the 64/65
ratio is utilized, the upper frequency limit is f = P / (tP + tset) = 64/(70 + 16) = 744 MHz.
fR
REFERENCE
OSC ÷ R
VH
VL
VH
fV
FEEDBACK
(fin ÷ N)
*
VL
VH
HIGH IMPEDANCE
PDout
VL
VH
φR
VL
VH
φV
VL
VH
LD
VL
VH = High Voltage Level.
VL = Low Voltage Level.
* At this point, when both fR and fV are in phase, the output is forced to near mid–supply.
NOTE: The PDout generates error pulses during out–of–lock conditions. When locked in phase and frequency the output is high
and the voltage at this pin is determined by the low–pass filter capacitor.
Figure 9. Phase Detector/Lock Detector Output Waveforms
MOTOROLA
MC145151–2 through MC145158–2
27
DESIGN CONSIDERATIONS
PHASE–LOCKED LOOP — LOW–PASS FILTER DESIGN
A)
PDout
φR —
ωn =
VCO
R1
C
ζ =
φV —
F(s) =
B)
PDout
φR —
VCO
ωn =
R1
R2
φV —
R2
PDout —
φR
φV
Nωn
2KφKVCO
1
R1sC + 1
KφKVCO
NC(R1 + R2)
ζ = 0.5 ωn ǒ R2C +
C
F(s) =
C)
KφKVCO
NR1C
R1
_
ωn =
C
+A
VCO
ζ =
N
KφKVCO
Ǔ
R2sC + 1
(R1 + R2)sC + 1
KφKVCO
NCR1
ωnR2C
2
R1
R2
C
ASSUMING GAIN A IS VERY LARGE, THEN:
F(s) =
R2sC + 1
R1sC
NOTE: Sometimes R1 is split into two series resistors, each R1 ÷ 2. A capacitor CC is then placed from the midpoint to ground to further
filter φV and φR. The value of CC should be such that the corner frequency of this network does not significantly affect ωn.
The φR and φV outputs swing rail–to–rail. Therefore, the user should be careful not to exceed the common mode input range of the
op amp used in the combiner/loop filter.
DEFINITIONS:
N = Total Division Ratio in feedback loop
Kφ (Phase Detector Gain) = VDD/4π for PDout
Kφ (Phase Detector Gain) = VDD/2π for φV and φR
2π∆fVCO
KVCO (VCO Gain) =
∆VVCO
for a typical design wn (Natural Frequency) ≈ 2πfr (at phase detector input).
10
Damping Factor: ζ ≅ 1
RECOMMENDED READING:
Gardner, Floyd M., Phaselock Techniques (second edition). New York, Wiley–Interscience, 1979.
Manassewitsch, Vadim, Frequency Synthesizers: Theory and Design (second edition). New York, Wiley–Interscience, 1980.
Blanchard, Alain, Phase–Locked Loops: Application to Coherent Receiver Design. New York, Wiley–Interscience, 1976.
Egan, William F., Frequency Synthesis by Phase Lock. New York, Wiley–Interscience, 1981.
Rohde, Ulrich L., Digital PLL Frequency Synthesizers Theory and Design. Englewood Cliffs, NJ, Prentice–Hall, 1983.
Berlin, Howard M., Design of Phase–Locked Loop Circuits, with Experiments. Indianapolis, Howard W. Sams and Co., 1978.
Kinley, Harold, The PLL Synthesizer Cookbook. Blue Ridge Summit, PA, Tab Books, 1980.
AN535, Phase–Locked Loop Design Fundamentals, Motorola Semiconductor Products, Inc., 1970.
AR254, Phase–Locked Loop Design Articles, Motorola Semiconductor Products, Inc., Reprinted with permission from Electronic Design,
1987.
MC145151–2 through MC145158–2
28
MOTOROLA
CRYSTAL OSCILLATOR CONSIDERATIONS
The following options may be considered to provide a reference frequency to Motorola’s CMOS frequency synthesizers.
Use of a Hybrid Crystal Oscillator
Commercially available temperature–compensated crystal
oscillators (TCXOs) or crystal–controlled data clock oscillators provide very stable reference frequencies. An oscillator
capable of sinking and sourcing 50 µA at CMOS logic levels
may be direct or dc coupled to OSCin. In general, the highest
frequency capability is obtained utilizing a direct–coupled
square wave having a rail–to–rail (VDD to VSS) voltage
swing. If the oscillator does not have CMOS logic levels on
the outputs, capacitive or ac coupling to OSCin may be used.
OSCout, an unbuffered output, should be left floating.
For additional information about TCXOs and data clock
oscillators, please consult the latest version of the eem Electronic Engineers Master Catalog, the Gold Book, or similar
publications.
C L values. The shunt load capacitance, C L , presented
across the crystal can be estimated to be:
CL =
CinCout
+ Ca + Co + C1 • C2
C1 + C2
Cin + Cout
where
Cin =
Cout =
Ca =
CO =
5 pF (see Figure 11)
6 pF (see Figure 11)
1 pF (see Figure 11)
the crystal’s holder capacitance
(see Figure 12)
C1 and C2 = external capacitors (see Figure 10)
Ca
Cin
Cout
Figure 11. Parasitic Capacitances of the Amplifier
RS
Design an Off–Chip Reference
1
The user may design an off–chip crystal oscillator using
ICs specifically developed for crystal oscillator applications,
such as the MC12061 MECL device. The reference signal
from the MECL device is ac coupled to OSCin. For large amplitude signals (standard CMOS logic levels), dc coupling is
used. OSC out, an unbuffered output, should be left floating.
In general, the highest frequency capability is obtained with a
direct–coupled square wave having rail–to–rail voltage
swing.
Use of the On–Chip Oscillator Circuitry
The on–chip amplifier (a digital inverter) along with an appropriate crystal may be used to provide a reference source
frequency. A fundamental mode crystal, parallel resonant at
the desired operating frequency, should be connected as
shown in Figure 10.
FREQUENCY
SYNTHESIZER
Rf
OSCin
C1
R1*
OSCout
C2
* May be deleted in certain cases. See text.
Figure 10. Pierce Crystal Oscillator Circuit
For VDD = 5.0 V, the crystal should be specified for a loading capacitance, CL, which does not exceed 32 pF for frequencies to approximately 8.0 MHz, 20 pF for frequencies in
the area of 8.0 to 15 MHz, and 10 pF for higher frequencies.
These are guidelines that provide a reasonable compromise
between IC capacitance, drive capability, swamping variations in stray and IC input/output capacitance, and realistic
MOTOROLA
2
LS
CS
1
2
CO
1
Re
Xe
2
NOTE: Values are supplied by crystal manufacturer
(parallel resonant crystal).
Figure 12. Equivalent Crystal Networks
The oscillator can be “trimmed” on–frequency by making a
portion or all of C1 variable. The crystal and associated components must be located as close as possible to the OSCin
and OSCout pins to minimize distortion, stray capacitance,
stray inductance, and startup stabilization time. In some
cases, stray capacitance should be added to the value for Cin
and Cout.
Power is dissipated in the effective series resistance of the
crystal, Re, in Figure 12. The drive level specified by the crystal manufacturer is the maximum stress that a crystal can
withstand without damage or excessive shift in frequency. R1
in Figure 10 limits the drive level. The use of R1 may not be
necessary in some cases (i.e., R1 = 0 Ω).
To verify that the maximum dc supply voltage does not
overdrive the crystal, monitor the output frequency as a function of voltage at OSCout. (Care should be taken to minimize
loading.) The frequency should increase very slightly as the
dc supply voltage is increased. An overdriven crystal will decrease in frequency or become unstable with an increase in
supply voltage. The operating supply voltage must be reduced or R1 must be increased in value if the overdriven
condition exists. The user should note that the oscillator
start–up time is proportional to the value of R1.
Through the process of supplying crystals for use with
CMOS inverters, many crystal manufacturers have developed expertise in CMOS oscillator design with crystals. Discussions with such manufacturers can prove very helpful
(see Table 1).
MC145151–2 through MC145158–2
29
Table 1. Partial List of Crystal Manufacturers
Name
United States Crystal Corp.
Crystek Crystal
Statek Corp.
Address
3605 McCart Ave., Ft. Worth, TX 76110
2351 Crystal Dr., Ft. Myers, FL 33907
512 N. Main St., Orange, CA 92668
Phone
(817) 921–3013
(813) 936–2109
(714) 639–7810
NOTE: Motorola cannot recommend one supplier over another and in no way suggests that this is a complete
listing of crystal manufacturers.
RECOMMENDED READING
Technical Note TN–24, Statek Corp.
Technical Note TN–7, Statek Corp.
E. Hafner, “The Piezoelectric Crystal Unit – Definitions and
Method of Measurement”, Proc. IEEE, Vol. 57, No. 2 Feb.,
1969.
D. Kemper, L. Rosine, “Quartz Crystals for Frequency
Control”, Electro–Technology, June, 1969.
P. J. Ottowitz, “A Guide to Crystal Selection”, Electronic
Design, May, 1966.
DUAL–MODULUS PRESCALING
OVERVIEW
NTmax = Nmax P + Amax
The technique of dual–modulus prescaling is well established as a method of achieving high performance frequency
synthesizer operation at high frequencies. Basically, the
approach allows relatively low–frequency programmable
counters to be used as high–frequency programmable
counters with speed capability of several hundred MHz. This
is possible without the sacrifice in system resolution and performance that results if a fixed (single–modulus) divider is
used for the prescaler.
In dual–modulus prescaling, the lower speed counters
must be uniquely configured. Special control logic is necessary to select the divide value P or P + 1 in the prescaler for
the required amount of time (see modulus control definition).
Motorola’s dual–modulus frequency synthesizers contain
this feature and can be used with a variety of dual–modulus
prescalers to allow speed, complexity and cost to be tailored
to the system requirements. Prescalers having P, P + 1 divide values in the range of ÷ 3/÷ 4 to ÷ 128/÷ 129 can be controlled by most Motorola frequency synthesizers.
Several dual–modulus prescaler approaches suitable for
use with the MC145152–2, MC145156–2, or MC145158–2
are:
MC12009
MC12011
MC12013
MC12015
MC12016
MC12017
MC12018
MC12022A
MC12032A
÷ 5/÷ 6
÷ 8/÷ 9
÷ 10/÷ 11
÷ 32/÷ 33
÷ 40/÷ 41
÷ 64/÷ 65
÷ 128/÷ 129
÷ 64/65 or ÷ 128/129
÷ 64/65 or ÷ 128/129
440 MHz
500 MHz
500 MHz
225 MHz
225 MHz
225 MHz
520 MHz
1.1 GHz
2.0 GHz
DESIGN GUIDELINES
The system total divide value, Ntotal (NT) will be dictated by
the application:
NT =
N is the number programmed into the ÷ N counter, A is the
number programmed into the ÷ A counter, P and P + 1 are
the two selectable divide ratios available in the dual–modulus prescalers. To have a range of NT values in sequence,
the ÷ A counter is programmed from zero through P – 1 for a
particular value N in the ÷ N counter. N is then incremented to
N + 1 and the ÷ A is sequenced from 0 through P – 1 again.
There are minimum and maximum values that can be
achieved for NT. These values are a function of P and the
size of the ÷ N and ÷ A counters.
The constraint N ≥ A always applies. If Amax = P – 1, then
Nmin ≥ P – 1. Then NTmin = (P – 1) P + A or (P – 1) P since A
is free to assume the value of 0.
frequency into the prescaler
=NP+A
frequency into the phase detector
MC145151–2 through MC145158–2
30
To maximize system frequency capability, the dual–modulus prescaler output must go from low to high after each
group of P or P + 1 input cycles. The prescaler should divide
by P when its modulus control line is high and by P + 1 when
its MC is low.
For the maximum frequency into the prescaler (fVCOmax),
the value used for P must be large enough such that:
1. fVCOmax divided by P may not exceed the frequency
capability of fin (input to the ÷ N and ÷ A counters).
2. The period of fVCO divided by P must be greater than
the sum of the times:
a. Propagation delay through the dual–modulus prescaler.
b. Prescaler setup or release time relative to its MC
signal.
c. Propagation time from fin to the MC output for the
frequency synthesizer device.
A sometimes useful simplification in the programming
code can be achieved by choosing the values for P of 8, 16,
32, or 64. For these cases, the desired value of NT results
when NT in binary is used as the program code to the ÷ N and
÷ A counters treated in the following manner:
1. Assume the ÷ A counter contains “a” bits where 2a ≥ P.
2. Always program all higher order ÷ A counter bits above
“a” to 0.
3. Assume the ÷ N counter and the ÷ A counter (with all the
higher order bits above “a” ignored) combined into a
single binary counter of n + a bits in length (n = number
of divider stages in the ÷ N counter). The MSB of this “hypothetical” counter is to correspond to the MSB of ÷ N and
the LSB is to correspond to the LSB of ÷ A. The system
divide value, NT, now results when the value of NT in
binary is used to program the “new” n + a bit counter.
By using the two devices, several dual–modulus values
are achievable (shown in Figure 13).
MOTOROLA
MC
DEVICE A
DEVICE B
DEVICE
B
DEVICE A
MC12009
MC10131
÷ 20/÷ 21
MC12011
MC12013
÷ 32/÷ 33
÷ 40/÷ 41
MC10138
÷ 50/÷ 51
÷ 80/÷ 81
÷ 100/÷ 101
÷ 40/÷ 41
OR
÷ 80/÷ 81
÷ 64/÷ 65
OR
÷ 128/÷ 129
÷ 80/÷ 81
MC10154
NOTE: MC12009, MC12011, and MC12013 are pin equivalent.
MC12015, MC12016, and MC12017 are pin equivalent.
Figure 13. Dual–Modulus Values
MOTOROLA
MC145151–2 through MC145158–2
31
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP
CASE 648–08
(MC145157–2, MC145158–D)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
P SUFFIX
PLASTIC DIP
CASE 707–02
(MC145155–2)
18
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
10
B
1
9
A
L
C
N
F
H
D
G
SEATING
PLANE
MC145151–2 through MC145158–2
32
K
M
J
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
22.22 23.24
6.10
6.60
3.56
4.57
0.56
0.36
1.78
1.27
2.54 BSC
1.02
1.52
0.20
0.30
2.92
3.43
7.62 BSC
15°
0°
0.51
1.02
INCHES
MIN
MAX
0.875 0.915
0.240 0.260
0.140 0.180
0.014 0.022
0.050 0.070
0.100 BSC
0.040 0.060
0.008 0.012
0.115 0.135
0.300 BSC
15°
0°
0.020 0.040
MOTOROLA
P SUFFIX
PLASTIC DIP
CASE 710–02
(MC145151–2, MC145152–2)
28
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
15
B
1
14
A
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
N
H
G
F
M
K
D
J
SEATING
PLANE
MILLIMETERS
MIN
MAX
36.45 37.21
13.72 14.22
5.08
3.94
0.56
0.36
1.52
1.02
2.54 BSC
2.16
1.65
0.38
0.20
3.43
2.92
15.24 BSC
15°
0°
0.51
1.02
INCHES
MIN
MAX
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
15°
0.020 0.040
P SUFFIX
PLASTIC DIP
CASE 738–03
(MC145156–2)
-A20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
C
-T-
L
K
SEATING
PLANE
M
E
G
N
F
J 20 PL
0.25 (0.010)
D 20 PL
0.25 (0.010)
MOTOROLA
M
T A
M
M
T
B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010 1.070
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
0.050 0.070
0.100 BSC
0.008 0.015
0.110 0.140
0.300 BSC
15°
0°
0.020 0.040
MILLIMETERS
MIN
MAX
25.66 27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0°
15°
1.01
0.51
MC145151–2 through MC145158–2
33
DW SUFFIX
SOG PACKAGE
CASE 751D–04
(MC145155–2, MC145156–2)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
20
11
–B–
10X
P
0.010 (0.25)
1
M
B
M
10
20X
D
0.010 (0.25)
M
T A
B
S
DIM
A
B
C
D
F
G
J
K
M
P
R
J
S
F
R
X 45 _
C
–T–
18X
G
SEATING
PLANE
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
K
DW SUFFIX
SOG PACKAGE
CASE 751F–04
(MC145151–2, MC145152–2)
-A28
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
15
14X
-B1
P
0.010 (0.25)
M
B
M
14
28X D
0.010 (0.25)
M
T A
S
B
M
S
R X 45°
C
-T26X
-T-
G
K
SEATING
PLANE
F
J
MC145151–2 through MC145158–2
34
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
17.80 18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0°
8°
10.05 10.55
0.25
0.75
INCHES
MIN
MAX
0.701 0.711
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
0.009 0.013
0.005 0.011
0°
8°
0.395 0.415
0.010 0.029
MOTOROLA
DW SUFFIX
SOG PACKAGE
CASE 751G–02
(MC145157–2, MC145158–2)
–A–
16
9
–B–
8X
P
0.010 (0.25)
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
M
B
M
8
16X
J
D
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
14X
MOTOROLA
G
K
SEATING
PLANE
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
MC145151–2 through MC145158–2
35
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE: Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki,
6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315
MFAX: [email protected] – TOUCHTONE (602) 244–6609
INTERNET: http://Design–NET.com
HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
◊
MC145151–2 through MC145158–2
36
*MC145151-2/D*
MC145151–2/D
MOTOROLA