The revision list can be viewed directiy by
cliking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
H8/3687Group
16
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Tiny Series
HD64N3687G,
HD64F3687,
HD6433687,
HD6433686,
HD6433685,
HD64F3684,
HD6433684,
HD6433683,
HD6433682,
Rev.3.00
2003.5.29
HD6483687G,
HD64F3687G,
HD6433687G,
HD6433686G,
HD6433685G,
HD64F3684G,
HD6433684G,
HD6433683G,
HD6433682G
Rev. 3.00, 05/03, page ii of xxx
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor
products better and more reliable, but there is always the possibility that trouble may occur
with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of
nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the
Renesas Technology Corporation product best suited to the customer's application; they do not
convey any license under any intellectual property rights, or any other rights, belonging to
Renesas Technology Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement
of any third-party's rights, originating in the use of any product data, diagrams, charts,
programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts,
programs and algorithms represents information on products at the time of publication of these
materials, and are subject to change by Renesas Technology Corporation without notice due to
product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product
distributor for the latest product information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other
loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by
various means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products.
Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in
a device or system that is used under circumstances in which human life is potentially at stake.
Please contact Renesas Technology Corporation or an authorized Renesas Technology
Corporation product distributor when considering the use of a product contained herein for any
specific purposes, such as apparatus or systems for transportation, vehicular, medical,
aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or
reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they
must be exported under a license from the Japanese government and cannot be imported into a
country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or
the country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the
products contained therein.
Rev. 3.00, 05/03, page iii of xxx
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 3.00, 05/03, page iv of xxx
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
•
•
CPU and System-Control Modules
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
Rev. 3.00, 05/03, page v of xxx
Preface
The H8/3687 Group are single-chip microcomputers made up of the high-speed H8/300H CPU
employing Renesas Technology original architecture as their cores, and the peripheral functions
required to configure a system. The H8/300H CPU has an instruction set that is compatible with
the H8/300 CPU.
Target Users: This manual was written for users who will be using the H8/3687 Group in the
design of application systems. Target users are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8/3687 Group to the target users.
Refer to the H8/300H Series Programming Manual for a detailed description of the
instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8/300H Series Programming Manual.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 22,
List of Registers.
Example:
Register name:
The following notation is used for cases when the same or a
similar function, e.g. serial communication interface, is
implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order:
The MSB is on the left and the LSB is on the right.
Notes:
When using an on-chip emulator (E10T) for H8/3687 program development and debugging, the
following restrictions must be noted.
1. The NMI pin is reserved for the E10T, and cannot be used.
Rev. 3.00, 05/03, page vi of xxx
2. Pins P85, P86, and P87 cannot be used. In order to use these pins, additional hardware must be
provided on the user board.
3. Area H’D000 to H’DFFF is used by the E10T, and is not available to the user.
4. Area H’F780 to H’FB7F must on no account be accessed.
5. When the E10T is used, address breaks can be set as either available to the user or for use by
the E10T. If address breaks are set as being used by the E10T, the address break control
registers must not be accessed.
6. When the E10T is used, NMI is an input/output pin (open-drain in output mode), P85 and P87
are input pins, and P86 is an output pin.
Related Manuals:
The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/eng/
H8/3687 Group manuals:
Document Title
Document No.
H8/3687 Group Hardware Manual
This manual
H8/300H Series Programming Manual
ADE-602-053
User's manuals for development tools:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor
User's Manual
ADE-702-247
H8S, H8/300 Series Simulator/Debugger User's Manual
ADE-702-282
H8S, H8/300 Series High-Performance Embedded Workshop,
High-Performance Debugging Interface Tutorial
ADE-702-231
High-Performance Embedded Workshop User's Manual
ADE-702-201
Application notes:
Document Title
Document No.
TM
Single Power Supply F-ZTAT
On-Board Programming
ADE-502-055
Rev. 3.00, 05/03, page vii of xxx
Rev. 3.00, 05/03, page viii of xxx
Contents
Section 1 Overview........................................................................................... 1
1.1
1.2
1.3
1.4
Features .............................................................................................................................1
Internal Block Diagram.....................................................................................................3
Pin Arrangement ...............................................................................................................5
Pin Functions.....................................................................................................................7
Section 2 CPU................................................................................................... 11
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Address Space and Memory Map .....................................................................................12
Register Configuration ......................................................................................................15
2.2.1 General Registers .................................................................................................16
2.2.2 Program Counter (PC) .........................................................................................17
2.2.3 Condition-Code Register (CCR) ..........................................................................17
Data Formats .....................................................................................................................19
2.3.1 General Register Data Formats ............................................................................19
2.3.2 Memory Data Formats .........................................................................................21
Instruction Set ...................................................................................................................22
2.4.1 Table of Instructions Classified by Function .......................................................22
2.4.2 Basic Instruction Formats ....................................................................................32
Addressing Modes and Effective Address Calculation .....................................................33
2.5.1 Addressing Modes ...............................................................................................33
2.5.2 Effective Address Calculation..............................................................................36
Basic Bus Cycle ................................................................................................................38
2.6.1 Access to On-Chip Memory (RAM, ROM).........................................................38
2.6.2 On-Chip Peripheral Modules ...............................................................................39
CPU States ........................................................................................................................40
Usage Notes ......................................................................................................................41
2.8.1 Notes on Data Access to Empty Areas.................................................................41
2.8.2 EEPMOV Instruction...........................................................................................41
2.8.3 Bit-Manipulation Instruction................................................................................41
Section 3 Exception Handling .......................................................................... 47
3.1
3.2
Exception Sources and Vector Address ............................................................................48
Register Descriptions ........................................................................................................49
3.2.1 Interrupt Edge Select Register 1 (IEGR1)............................................................50
3.2.2 Interrupt Edge Select Register 2 (IEGR2)............................................................51
3.2.3 Interrupt Enable Register 1 (IENR1) ...................................................................52
3.2.4 Interrupt Enable Register 2 (IENR2) ...................................................................53
3.2.5 Interrupt Flag Register 1 (IRR1) ..........................................................................53
3.2.6 Interrupt Flag Register 2 (IRR2) ..........................................................................55
Rev. 3.00, 05/03, page ix of xxx
3.3
3.4
3.5
3.2.7 Wakeup Interrupt Flag Register (IWPR) ............................................................. 55
Reset Exception Handling................................................................................................. 57
Interrupt Exception Handling............................................................................................ 57
3.4.1 External Interrupts ............................................................................................... 57
3.4.2 Internal Interrupts................................................................................................. 58
3.4.3 Interrupt Handling Sequence ............................................................................... 59
3.4.4 Interrupt Response Time...................................................................................... 60
Usage Notes ...................................................................................................................... 62
3.5.1 Interrupts after Reset............................................................................................ 62
3.5.2 Notes on Stack Area Use ..................................................................................... 62
3.5.3 Notes on Rewriting Port Mode Registers............................................................. 62
Section 4 Address Break....................................................................................63
4.1
4.2
Register Descriptions ........................................................................................................ 63
4.1.1 Address Break Control Register (ABRKCR)....................................................... 64
4.1.2 Address Break Status Register (ABRKSR) ......................................................... 65
4.1.3 Break Address Registers (BARH, BARL)........................................................... 65
4.1.4 Break Data Registers (BDRH, BDRL) ................................................................ 65
Operation .......................................................................................................................... 66
Section 5 Clock Pulse Generators .....................................................................69
5.1
5.2
5.3
5.4
System Clock Generator ................................................................................................... 70
5.1.1 Connecting Crystal Resonator ............................................................................. 70
5.1.2 Connecting Ceramic Resonator ........................................................................... 71
5.1.3 External Clock Input Method............................................................................... 71
Subclock Generator........................................................................................................... 72
5.2.1 Connecting 32.768-kHz Crystal Resonator.......................................................... 72
5.2.2 Pin Connection when Not Using Subclock .......................................................... 73
Prescalers .......................................................................................................................... 73
5.3.1 Prescaler S ........................................................................................................... 73
5.3.2 Prescaler W .......................................................................................................... 73
Usage Notes ...................................................................................................................... 74
5.4.1 Note on Resonators .............................................................................................. 74
5.4.2 Notes on Board Design ........................................................................................ 74
Section 6 Power-Down Modes ..........................................................................75
6.1
6.2
Register Descriptions ........................................................................................................ 75
6.1.1 System Control Register 1 (SYSCR1) ................................................................. 76
6.1.2 System Control Register 2 (SYSCR2) ................................................................. 78
6.1.3 Module Standby Control Register 1 (MSTCR1) ................................................. 79
6.1.4 Module Standby Control Register 2 (MSTCR2) ................................................. 80
Mode Transitions and States of LSI.................................................................................. 80
6.2.1 Sleep Mode .......................................................................................................... 83
Rev. 3.00, 05/03, page x of xxx
6.3
6.4
6.5
6.2.2 Standby Mode ......................................................................................................84
6.2.3 Subsleep Mode.....................................................................................................84
6.2.4 Subactive Mode ...................................................................................................85
Operating Frequency in Active Mode ...............................................................................85
Direct Transition ...............................................................................................................85
6.4.1 Direct Transition from Active Mode to Subactive Mode.....................................85
6.4.2 Direct Transition from Subactive Mode to Active Mode.....................................86
Module Standby Function .................................................................................................86
Section 7 ROM ................................................................................................. 87
7.1
7.2
7.3
7.4
7.5
7.6
7.7
Block Configuration..........................................................................................................87
Register Descriptions ........................................................................................................89
7.2.1 Flash Memory Control Register 1 (FLMCR1).....................................................89
7.2.2 Flash Memory Control Register 2 (FLMCR2).....................................................90
7.2.3 Erase Block Register 1 (EBR1) ...........................................................................91
7.2.4 Flash Memory Power Control Register (FLPWCR) ............................................92
7.2.5 Flash Memory Enable Register (FENR) ..............................................................92
On-Board Programming Modes ........................................................................................93
7.3.1 Boot Mode ...........................................................................................................93
7.3.2 Programming/Erasing in User Program Mode.....................................................96
Flash Memory Programming/Erasing ...............................................................................97
7.4.1 Program/Program-Verify .....................................................................................97
7.4.2 Erase/Erase-Verify ...............................................................................................99
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory..........................100
Program/Erase Protection..................................................................................................102
7.5.1 Hardware Protection ............................................................................................102
7.5.2 Software Protection..............................................................................................102
7.5.3 Error Protection....................................................................................................102
Programmer Mode ............................................................................................................103
Power-Down States for Flash Memory .............................................................................103
Section 8 RAM ................................................................................................. 105
Section 9 I/O Ports ............................................................................................ 107
9.1
9.2
Port 1.................................................................................................................................107
9.1.1 Port Mode Register 1 (PMR1) .............................................................................108
9.1.2 Port Control Register 1 (PCR1) ...........................................................................109
9.1.3 Port Data Register 1 (PDR1)................................................................................109
9.1.4 Port Pull-Up Control Register 1 (PUCR1)...........................................................110
9.1.5 Pin Functions .......................................................................................................110
Port 2.................................................................................................................................113
9.2.1 Port Control Register 2 (PCR2) ...........................................................................113
9.2.2 Port Data Register 2 (PDR2)................................................................................114
Rev. 3.00, 05/03, page xi of xxx
9.3
9.4
9.5
9.6
9.7
9.8
9.2.3 Port Mode Register 3 (PMR3) ............................................................................. 114
9.2.4 Pin Functions ....................................................................................................... 114
Port 3................................................................................................................................. 116
9.3.1 Port Control Register 3 (PCR3) ........................................................................... 116
9.3.2 Port Data Register 3 (PDR3)................................................................................ 117
9.3.3 Pin Functions ....................................................................................................... 117
Port 5................................................................................................................................. 119
9.4.1 Port Mode Register 5 (PMR5) ............................................................................. 120
9.4.2 Port Control Register 5 (PCR5) ........................................................................... 121
9.4.3 Port Data Register 5 (PDR5)................................................................................ 121
9.4.4 Port Pull-Up Control Register 5 (PUCR5)........................................................... 122
9.4.5 Pin Functions ....................................................................................................... 122
Port 6................................................................................................................................. 125
9.5.1 Port Control Register 6 (PCR6) ........................................................................... 125
9.5.2 Port Data Register 6 (PDR6)................................................................................ 126
9.5.3 Pin Functions ....................................................................................................... 126
Port 7................................................................................................................................. 130
9.6.1 Port Control Register 7 (PCR7) ........................................................................... 130
9.6.2 Port Data Register 7 (PDR7)................................................................................ 131
9.6.3 Pin Functions ....................................................................................................... 131
Port 8................................................................................................................................. 133
9.7.1 Port Control Register 8 (PCR8) ........................................................................... 133
9.7.2 Port Data Register 8 (PDR8)................................................................................ 133
9.7.3 Pin Functions ....................................................................................................... 134
Port B ................................................................................................................................ 135
9.8.1 Port Data Register B (PDRB) .............................................................................. 135
Section 10 Realtime Clock (RTC).....................................................................137
10.1 Features ............................................................................................................................. 137
10.2 Input/Output Pin................................................................................................................ 138
10.3 Register Descriptions ........................................................................................................ 139
10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR)............. 139
10.3.2 Minute Data Register (RMINDR)........................................................................ 140
10.3.3 Hour Data Register (RHRDR) ............................................................................. 141
10.3.4 Day-of-Week Data Register (RWKDR) .............................................................. 142
10.3.5 RTC Control Register 1 (RTCCR1)..................................................................... 143
10.3.6 RTC Control Register 2 (RTCCR2)..................................................................... 144
10.3.7 Clock Source Select Register (RTCCSR) ............................................................ 145
10.4 Operation .......................................................................................................................... 146
10.4.1 Initial Settings of Registers after Power-On ........................................................ 146
10.4.2 Initial Setting Procedure ...................................................................................... 146
10.4.3 Data Reading Procedure ...................................................................................... 147
10.5 Interrupt Source ................................................................................................................ 148
Rev. 3.00, 05/03, page xii of xxx
Section 11 Timer B1 ......................................................................................... 149
11.1 Features .............................................................................................................................149
11.2 Input/Output Pin................................................................................................................150
11.3 Register Descriptions ........................................................................................................150
11.3.1 Timer Mode Register B1 (TMB1) .......................................................................151
11.3.2 Timer Counter B1 (TCB1)...................................................................................151
11.3.3 Timer Load Register B1 (TLB1) .........................................................................152
11.4 Operation...........................................................................................................................152
11.4.1 Interval Timer Operation .....................................................................................152
11.4.2 Auto-Reload Timer Operation .............................................................................152
11.4.3 Event Counter Operation .....................................................................................153
11.5 Timer B1 Operating Modes ..............................................................................................153
Section 12 Timer V........................................................................................... 155
12.1 Features .............................................................................................................................155
12.2 Input/Output Pins ..............................................................................................................156
12.3 Register Descriptions ........................................................................................................157
12.3.1 Timer Counter V (TCNTV) .................................................................................157
12.3.2 Time Constant Registers A and B (TCORA, TCORB)........................................157
12.3.3 Timer Control Register V0 (TCRV0) ..................................................................158
12.3.4 Timer Control/Status Register V (TCSRV) .........................................................160
12.3.5 Timer Control Register V1 (TCRV1) ..................................................................161
12.4 Operation...........................................................................................................................162
12.4.1 Timer V Operation ...............................................................................................162
12.5 Timer V Application Examples.........................................................................................165
12.5.1 Pulse Output with Arbitrary Duty Cycle..............................................................165
12.5.2 Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input .............166
12.6 Usage Notes ......................................................................................................................167
Section 13 Timer Z ........................................................................................... 169
13.1 Features .............................................................................................................................169
13.2 Input/Output Pins ..............................................................................................................174
13.3 Register Descriptions ........................................................................................................175
13.3.1 Timer Start Register (TSTR)................................................................................176
13.3.2 Timer Mode Register (TMDR) ............................................................................176
13.3.3 Timer PWM Mode Register (TPMR) ..................................................................177
13.3.4 Timer Function Control Register (TFCR)............................................................178
13.3.5 Timer Output Master Enable Register (TOER) ...................................................180
13.3.6 Timer Output Control Register (TOCR) ..............................................................181
13.3.7 Timer Counter (TCNT)........................................................................................182
13.3.8 General Registers A, B, C, and D (GRA, GRB, GRC, and GRD) .......................182
13.3.9 Timer Control Register (TCR) .............................................................................183
13.3.10 Timer I/O Control Register (TIORA and TIORC)...............................................184
Rev. 3.00, 05/03, page xiii of xxx
13.3.11 Timer Status Register (TSR)................................................................................ 186
13.3.12 Timer Interrupt Enable Register (TIER) .............................................................. 188
13.3.13 PWM Mode Output Level Control Register (POCR) .......................................... 189
13.3.14 Interface with CPU .............................................................................................. 189
13.4 Operation .......................................................................................................................... 191
13.4.1 Counter Operation................................................................................................ 191
13.4.2 Waveform Output by Compare Match................................................................. 194
13.4.3 Input Capture Function ........................................................................................ 197
13.4.4 Synchronous Operation........................................................................................ 199
13.4.5 PWM Mode ......................................................................................................... 200
13.4.6 Reset Synchronous PWM Mode .......................................................................... 206
13.4.7 Complementary PWM Mode............................................................................... 210
13.4.8 Buffer Operation .................................................................................................. 216
13.4.9 Timer Z Output Timing ....................................................................................... 223
13.5 Interrupts ........................................................................................................................... 226
13.5.1 Status Flag Set Timing......................................................................................... 226
13.5.2 Status Flag Clearing Timing ................................................................................ 228
13.6 Usage Notes ...................................................................................................................... 228
Section 14 Watchdog Timer ..............................................................................235
14.1 Features ............................................................................................................................. 235
14.2 Register Descriptions ........................................................................................................ 235
14.2.1 Timer Control/Status Register WD (TCSRWD).................................................. 236
14.2.2 Timer Counter WD (TCWD)............................................................................... 237
14.2.3 Timer Mode Register WD (TMWD) ................................................................... 237
14.3 Operation .......................................................................................................................... 238
Section 15 14-Bit PWM ....................................................................................239
15.1 Features ............................................................................................................................. 239
15.2 Input/Output Pin................................................................................................................ 240
15.3 Register Descriptions ........................................................................................................ 240
15.3.1 PWM Control Register (PWCR).......................................................................... 240
15.3.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................ 241
15.4 Operation .......................................................................................................................... 241
Section 16 Serial Communication Interface 3 (SCI3) .......................................243
16.1 Features ............................................................................................................................. 243
16.2 Input/Output Pins .............................................................................................................. 246
16.3 Register Descriptions ........................................................................................................ 246
16.3.1 Receive Shift Register (RSR) .............................................................................. 247
16.3.2 Receive Data Register (RDR) .............................................................................. 247
16.3.3 Transmit Shift Register TSR (SCI3) .................................................................... 247
16.3.4 Transmit Data Register (TDR)............................................................................. 247
Rev. 3.00, 05/03, page xiv of xxx
16.4
16.5
16.6
16.7
16.8
16.3.5 Serial Mode Register (SMR)................................................................................248
16.3.6 Serial Control Register 3 (SCR3).........................................................................249
16.3.7 Serial Status Register (SSR).................................................................................251
16.3.8 Bit Rate Register (BRR) ......................................................................................253
Operation in Asynchronous Mode ....................................................................................260
16.4.1 Clock....................................................................................................................260
16.4.2 SCI3 Initialization ................................................................................................261
16.4.3 Data Transmission................................................................................................262
16.4.4 Serial Data Reception...........................................................................................264
Operation in Clocked Synchronous Mode ........................................................................267
16.5.1 Clock....................................................................................................................267
16.5.2 SCI3 Initialization ................................................................................................267
16.5.3 Serial Data Transmission .....................................................................................268
16.5.4 Serial Data Reception (Clocked Synchronous Mode)..........................................270
16.5.5 Simultaneous Serial Data Transmission and Reception.......................................272
Multiprocessor Communication Function.........................................................................274
16.6.1 Multiprocessor Serial Data Transmission ............................................................276
16.6.2 Multiprocessor Serial Data Reception..................................................................277
Interrupts ...........................................................................................................................281
Usage Notes ......................................................................................................................282
16.8.1 Break Detection and Processing...........................................................................282
16.8.2 Mark State and Break Sending.............................................................................282
16.8.3 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only).....................................................................282
16.8.4 Receive Data Sampling Timing and Reception Margin in
Asynchronous Mode ............................................................................................283
Section 17 I2C Bus Interface 2 (IIC2)............................................................... 285
17.1 Features .............................................................................................................................285
17.2 Input/Output Pins ..............................................................................................................287
17.3 Register Descriptions ........................................................................................................287
17.3.1 I2C Bus Control Register 1 (ICCR1)....................................................................288
17.3.2 I2C Bus Control Register 2 (ICCR2)....................................................................290
17.3.3 I2C Bus Mode Register (ICMR)...........................................................................291
17.3.4 I2C Bus Interrupt Enable Register (ICIER)..........................................................293
17.3.5 I2C Bus Status Register (ICSR)............................................................................295
17.3.6 Slave Address Register (SAR) .............................................................................297
17.3.7 I2C Bus Transmit Data Register (ICDRT) ...........................................................298
17.3.8 I2C Bus Receive Data Register (ICDRR).............................................................298
17.3.9 I2C Bus Shift Register (ICDRS)...........................................................................298
17.4 Operation...........................................................................................................................299
17.4.1 I2C Bus Format ....................................................................................................299
17.4.2 Master Transmit Operation ..................................................................................300
Rev. 3.00, 05/03, page xv of xxx
17.4.3 Master Receive Operation.................................................................................... 302
17.4.4 Slave Transmit Operation .................................................................................... 304
17.4.5 Slave Receive Operation...................................................................................... 306
17.4.6 Clocked Synchronous Serial Format.................................................................... 308
17.4.7 Noise Canceler ..................................................................................................... 310
17.4.8 Example of Use.................................................................................................... 311
17.5 Interrupt Request............................................................................................................... 315
17.6 Bit Synchronous Circuit.................................................................................................... 316
Section 18 A/D Converter .................................................................................317
18.1 Features ............................................................................................................................. 317
18.2 Input/Output Pins .............................................................................................................. 319
18.3 Register Descriptions ........................................................................................................ 320
18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) ............................................. 320
18.3.2 A/D Control/Status Register (ADCSR) ............................................................... 321
18.3.3 A/D Control Register (ADCR) ............................................................................ 322
18.4 Operation .......................................................................................................................... 323
18.4.1 Single Mode......................................................................................................... 323
18.4.2 Scan Mode ........................................................................................................... 323
18.4.3 Input Sampling and A/D Conversion Time ......................................................... 324
18.4.4 External Trigger Input Timing............................................................................. 325
18.5 A/D Conversion Accuracy Definitions ............................................................................. 326
18.6 Usage Notes ...................................................................................................................... 327
18.6.1 Permissible Signal Source Impedance ................................................................. 327
18.6.2 Influences on Absolute Accuracy ........................................................................ 327
Section 19 EEPROM .........................................................................................329
19.1 Features ............................................................................................................................. 329
19.2 Input/Output Pins .............................................................................................................. 331
19.3 Register Description.......................................................................................................... 331
19.3.1 EEPROM Key Register (EKR)............................................................................ 331
19.4 Operation .......................................................................................................................... 332
19.4.1 EEPROM Interface .............................................................................................. 332
19.4.2 Bus Format and Timing ....................................................................................... 332
19.4.3 Start Condition..................................................................................................... 332
19.4.4 Stop Condition ..................................................................................................... 333
19.4.5 Acknowledge ....................................................................................................... 333
19.4.6 Slave Addressing ................................................................................................. 333
19.4.7 Write Operations.................................................................................................. 334
19.4.8 Acknowledge Polling........................................................................................... 336
19.4.9 Read Operation .................................................................................................... 336
19.5 Usage Notes ...................................................................................................................... 339
19.5.1 Data Protection at VCC On/Off............................................................................. 339
Rev. 3.00, 05/03, page xvi of xxx
19.5.2 Write/Erase Endurance ........................................................................................339
19.5.3 Noise Suppression Time ......................................................................................339
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional) . 341
20.1 Features .............................................................................................................................341
20.2 Register Descriptions ........................................................................................................342
20.2.1 Low-Voltage-Detection Control Register (LVDCR) ...........................................342
20.2.2 Low-Voltage-Detection Status Register (LVDSR) ..............................................344
20.3 Operation...........................................................................................................................345
20.3.1 Power-On Reset Circuit .......................................................................................345
20.3.2 Low-Voltage Detection Circuit............................................................................346
Section 21 Power Supply Circuit ...................................................................... 349
21.1 When Using Internal Power Supply Step-Down Circuit...................................................349
21.2 When Not Using Internal Power Supply Step-Down Circuit............................................350
Section 22 List of Registers .............................................................................. 351
22.1 Register Addresses (Address Order) .................................................................................352
22.2 Register Bits......................................................................................................................358
22.3 Registers States in Each Operating Mode .........................................................................363
Section 23 Electrical Characteristics ................................................................ 367
23.1 Absolute Maximum Ratings..............................................................................................367
23.2 Electrical Characteristics
(F-ZTAT™ Version, EEPROM Laminated F-ZTATTM Version).....................................367
23.2.1 Power Supply Voltage and Operating Ranges .....................................................367
23.2.2 DC Characteristics ...............................................................................................370
23.2.3 AC Characteristics ...............................................................................................376
23.2.4 A/D Converter Characteristics .............................................................................380
23.2.5 Watchdog Timer Characteristics..........................................................................381
23.2.6 Flash Memory Characteristics..............................................................................382
23.2.7 EEPROM Characteristics (Preliminary) ..............................................................384
23.2.8 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ..................385
23.2.9 Power-On Reset Circuit Characteristics (Optional) .............................................385
23.3 Electrical Characteristics
(Mask-ROM Version, EEPROM Laminated Mask-ROM Version) .................................386
23.3.1 Power Supply Voltage and Operating Ranges .....................................................386
23.3.2 DC Characteristics ...............................................................................................388
23.3.3 AC Characteristics ...............................................................................................395
23.3.4 A/D Converter Characteristics .............................................................................399
23.3.5 Watchdog Timer Characteristics..........................................................................400
23.3.6 EEPROM Characteristics (Preliminary) ..............................................................401
23.3.7 Power-Supply-Voltage Detection Circuit Characteristics (Optional) ..................402
Rev. 3.00, 05/03, page xvii of xxx
23.3.8 Power-On Reset Circuit Characteristics (Optional) ............................................. 402
23.4 Operation Timing.............................................................................................................. 403
23.5 Output Load Condition ..................................................................................................... 406
Appendix A Instruction Set ...............................................................................407
A.1
A.2
A.3
A.4
Instruction List .................................................................................................................. 407
Operation Code Map......................................................................................................... 422
Number of Execution States.............................................................................................. 425
Combinations of Instructions and Addressing Modes ...................................................... 436
Appendix B I/O Port Block Diagrams...............................................................437
B.1
B.2
I/O Port Block Diagrams................................................................................................... 437
Port States in Each Operating State................................................................................... 454
Appendix C Product Code Lineup.....................................................................455
Appendix D Package Dimensions .....................................................................457
Appendix E EEPROM Laminated-Structure Cross-Sectional View.................459
Main Revisions and Additions in this Edition.....................................................461
Index
.........................................................................................................469
Rev. 3.00, 05/03, page xviii of xxx
Figures
Section 1
Figure 1.1
Figure 1.2
Figure 1.3
Overview
Internal Block Diagram of H8/3687 Group of F-ZTAT TM and Mask-ROM Versions .3
Internal Block Diagram of H8/3687N (EEPROM Laminated Version) ........................4
Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions
(FP-64E, FP-64A) ..........................................................................................................5
Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Laminated Version) (FP-64E)...................6
Section 2 CPU
Figure 2.1 Memory Map (1) .........................................................................................................12
Figure 2.1 Memory Map (2) .........................................................................................................13
Figure 2.1 Memory Map (3) .........................................................................................................14
Figure 2.2 CPU Registers .............................................................................................................15
Figure 2.3 Usage of General Registers .........................................................................................16
Figure 2.4 Relationship between Stack Pointer and Stack Area ...................................................17
Figure 2.5 General Register Data Formats (1) ..............................................................................19
Figure 2.5 General Register Data Formats (2) ..............................................................................20
Figure 2.6 Memory Data Formats.................................................................................................21
Figure 2.7 Instruction Formats......................................................................................................32
Figure 2.8 Branch Address Specification in Memory Indirect Mode ...........................................35
Figure 2.9 On-Chip Memory Access Cycle..................................................................................38
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access).....................................39
Figure 2.11 CPU Operation States................................................................................................40
Figure 2.12 State Transitions ........................................................................................................41
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same Address ..42
Section 3
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Exception Handling
Reset Sequence............................................................................................................58
Stack Status after Exception Handling ........................................................................60
Interrupt Sequence.......................................................................................................61
Port Mode Register Setting and Interrupt Request Flag Clearing Procedure ..............62
Section 4
Figure 4.1
Figure 4.2
Figure 4.2
Address Break
Block Diagram of Address Break................................................................................63
Address Break Interrupt Operation Example (1) .........................................................66
Address Break Interrupt Operation Example (2) .........................................................67
Section 5
Figure 5.1
Figure 5.2
Figure 5.3
Figure 5.4
Figure 5.5
Clock Pulse Generators
Block Diagram of Clock Pulse Generators..................................................................69
Block Diagram of System Clock Generator ................................................................70
Typical Connection to Crystal Resonator....................................................................70
Equivalent Circuit of Crystal Resonator......................................................................70
Typical Connection to Ceramic Resonator..................................................................71
Rev. 3.00, 05/03, page xix of xxx
Figure 5.6 Example of External Clock Input ................................................................................ 71
Figure 5.7 Block Diagram of Subclock Generator ....................................................................... 72
Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator ................................................ 72
Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator .................................................. 72
Figure 5.10 Pin Connection when not Using Subclock ................................................................ 73
Figure 5.11 Example of Incorrect Board Design ........................................................................... 74
Section 6 Power-Down Modes
Figure 6.1 Mode Transition Diagram ...........................................................................................81
Section 7
Figure 7.1
Figure 7.2
Figure 7.3
Figure 7.4
ROM
Flash Memory Block Configuration............................................................................ 88
Programming/Erasing Flowchart Example in User Program Mode ............................ 96
Program/Program-Verify Flowchart............................................................................ 98
Erase/Erase-Verify Flowchart ................................................................................... 101
Section 9
Figure 9.1
Figure 9.2
Figure 9.3
Figure 9.4
Figure 9.5
Figure 9.6
Figure 9.7
Figure 9.8
I/O Ports
Port 1 Pin Configuration............................................................................................ 107
Port 2 Pin Configuration............................................................................................ 113
Port 3 Pin Configuration............................................................................................ 116
Port 5 Pin Configuration............................................................................................ 119
Port 6 Pin Configuration............................................................................................ 125
Port 7 Pin Configuration............................................................................................ 130
Port 8 Pin Configuration............................................................................................ 133
Port B Pin Configuration ........................................................................................... 135
Section 10
Figure 10.1
Figure 10.2
Figure 10.3
Figure 10.4
Realtime Clock (RTC)
Block Diagram of RTC ........................................................................................... 138
Definition of Time Expression ................................................................................ 143
Initial Setting Procedure .......................................................................................... 146
Example: Reading of Inaccurate Time Data............................................................ 147
Section 11 Timer B1
Figure 11.1 Block Diagram of Timer B1.................................................................................... 149
Section 12 Timer V
Figure 12.1 Block Diagram of Timer V...................................................................................... 156
Figure 12.2 Increment Timing with Internal Clock .................................................................... 162
Figure 12.3 Increment Timing with External Clock ................................................................... 163
Figure 12.4 OVF Set Timing ...................................................................................................... 163
Figure 12.5 CMFA and CMFB Set Timing ................................................................................ 163
Figure 12.6 TMOV Output Timing ............................................................................................ 164
Figure 12.7 Clear Timing by Compare Match............................................................................ 164
Figure 12.8 Clear Timing by TMRIV Input ............................................................................... 164
Figure 12.9 Pulse Output Example ............................................................................................. 165
Figure 12.10 Example of Pulse Output Synchronized to TRGV Input....................................... 166
Rev. 3.00, 05/03, page xx of xxx
Figure 12.11 Contention between TCNTV Write and Clear ......................................................167
Figure 12.12 Contention between TCORA Write and Compare Match .....................................168
Figure 12.13 Internal Clock Switching and TCNTV Operation .................................................168
Section 13
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Timer Z
Timer Z Block Diagram ..........................................................................................171
Timer Z (Channel 0) Block Diagram.......................................................................172
Timer Z (Channel 1) Block Diagram.......................................................................173
Example of Outputs in Reset Synchronous PWM Mode and
Complementary PWM Mode ...................................................................................179
Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits)) ........189
Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits)).............190
Figure 13.7 Example of Counter Operation Setting Procedure ..................................................191
Figure 13.8 Free-Running Counter Operation ............................................................................192
Figure 13.9 Periodic Counter Operation .....................................................................................193
Figure 13.10 Count Timing at Internal Clock Operation ............................................................193
Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected)......................194
Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match ............194
Figure 13.13 Example of 0 Output/1 Output Operation..............................................................195
Figure 13.14 Example of Toggle Output Operation ...................................................................196
Figure 13.15 Output Compare Timing........................................................................................196
Figure 13.16 Example of Input Capture Operation Setting Procedure .......................................197
Figure 13.17 Example of Input Capture Operation.....................................................................198
Figure 13.18 Input Capture Signal Timing .................................................................................198
Figure 13.19 Example of Synchronous Operation Setting Procedure.........................................199
Figure 13.20 Example of Synchronous Operation ......................................................................200
Figure 13.21 Example of PWM Mode Setting Procedure ..........................................................201
Figure 13.22 Example of PWM Mode Operation (1) .................................................................202
Figure 13.23 Example of PWM Mode Operation (2) .................................................................203
Figure 13.24 Example of PWM Mode Operation (3) .................................................................204
Figure 13.25 Example of PWM Mode Operation (4) .................................................................205
Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure...........................207
Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1) ......208
Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0) ......209
Figure 13.29 Example of Complementary PWM Mode Setting Procedure................................211
Figure 13.30 Canceling Procedure of Complementary PWM Mode ..........................................212
Figure 13.31 Example of Complementary PWM Mode Operation (1).......................................213
Figure 13.32 Example of Complementary PWM Mode Operation (2).......................................214
Figure 13.33 Timing of Overshooting ........................................................................................215
Figure 13.34 Timing of Undershooting ......................................................................................215
Figure 13.35 Compare Match Buffer Operation .........................................................................216
Figure 13.36 Input Capture Buffer Operation.............................................................................217
Figure 13.37 Example of Buffer Operation Setting Procedure ...................................................217
Rev. 3.00, 05/03, page xxi of xxx
Figure 13.38 Example of Buffer Operation (1)
(Buffer Operation for Output Compare Register) .................................................. 218
Figure 13.39 Example of Compare Match Timing for Buffer Operation ................................... 219
Figure 13.40 Example of Buffer Operation (2)
(Buffer Operation for Input Capture Register)....................................................... 220
Figure 13.41 Input Capture Timing of Buffer Operation............................................................ 221
Figure 13.42 Buffer Operation (3)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1) ............ 222
Figure 13.43 Buffer Operation (4)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1) ............ 223
Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER .................. 224
Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger .................... 224
Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR ................... 225
Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR ................... 225
Figure 13.48 IMF Flag Set Timing when Compare Match Occurs............................................. 226
Figure 13.49 IMF Flag Set Timing at Input Capture .................................................................. 227
Figure 13.50 OVF Flag Set Timing ............................................................................................ 227
Figure 13.51 Status Flag Clearing Timing.................................................................................. 228
Figure 13.52 Contention between TCNT Write and Clear Operations....................................... 228
Figure 13.53 Contention between TCNT Write and Increment Operations ............................... 229
Figure 13.54 Contention between GR Write and Compare Match ............................................. 230
Figure 13.55 Contention between TCNT Write and Overflow................................................... 231
Figure 13.56 Contention between GR Read and Input Capture.................................................. 232
Figure 13.57 Contention between Count Clearing and Increment Operations
by Input Capture ................................................................................................... 232
Figure 13.58 Contention between GR Write and Input Capture................................................. 233
Section 14 Watchdog Timer
Figure 14.1 Block Diagram of Watchdog Timer ........................................................................ 235
Figure 14.2 Watchdog Timer Operation Example...................................................................... 238
Section 15 14-Bit PWM
Figure 15.1 Block Diagram of 14-Bit PWM............................................................................... 239
Figure 15.2 Waveform Output by 14-Bit PWM ......................................................................... 242
Section 16
Figure 16.1
Figure 16.2
Figure 16.3
Serial Communication Interface 3 (SCI3)
Block Diagram of SCI3 ........................................................................................... 245
Data Format in Asynchronous Communication ...................................................... 260
Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode)(Example with 8-Bit Data, Parity, Two Stop Bits)............... 260
Figure 16.4 Sample SCI3 Initialization Flowchart ..................................................................... 261
Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)............................................................................ 262
Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode)...................... 263
Rev. 3.00, 05/03, page xxii of xxx
Figure 16.7 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)............................................................................264
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode)(1).......................265
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode)(2).......................266
Figure 16.9 Data Format in Clocked Synchronous Communication ..........................................267
Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode...........................268
Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................269
Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode ................................270
Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)......................271
Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode) ...............................................................................273
Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A) ...........................................275
Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart ........................................276
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1) ........................................278
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2) ........................................279
Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit) ..............................280
Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode.......................................283
Section 17 I2C Bus Interface 2 (IIC2)
Figure 17.1 Block Diagram of I2C Bus Interface 2.....................................................................286
Figure 17.2 External Circuit Connections of I/O Pins ................................................................287
Figure 17.3 I2C Bus Formats ......................................................................................................299
Figure 17.4 I2C Bus Timing........................................................................................................299
Figure 17.5 Master Transmit Mode Operation Timing (1) .........................................................301
Figure 17.6 Master Transmit Mode Operation Timing (2) .........................................................301
Figure 17.7 Master Receive Mode Operation Timing (1)...........................................................303
Figure 17.8 Master Receive Mode Operation Timing (2)...........................................................303
Figure 17.9 Slave Transmit Mode Operation Timing (1) ...........................................................305
Figure 17.10 Slave Transmit Mode Operation Timing (2) .........................................................306
Figure 17.11 Slave Receive Mode Operation Timing (1) ...........................................................307
Figure 17.12 Slave Receive Mode Operation Timing (2) ...........................................................307
Figure 17.13 Clocked Synchronous Serial Transfer Format.......................................................308
Figure 17.14 Transmit Mode Operation Timing.........................................................................309
Figure 17.15 Receive Mode Operation Timing ..........................................................................310
Figure 17.16 Block Diagram of Noise Conceler.........................................................................310
Figure 17.17 Sample Flowchart for Master Transmit Mode.......................................................311
Figure 17.18 Sample Flowchart for Master Receive Mode ........................................................312
Figure 17.19 Sample Flowchart for Slave Transmit Mode.........................................................313
Figure 17.20 Sample Flowchart for Slave Receive Mode ..........................................................314
Figure 17.21 The Timing of the Bit Synchronous Circuit ..........................................................316
Rev. 3.00, 05/03, page xxiii of xxx
Section 18
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
A/D Converter
Block Diagram of A/D Converter ........................................................................... 318
A/D Conversion Timing .......................................................................................... 324
External Trigger Input Timing ................................................................................ 325
A/D Conversion Accuracy Definitions (1) .............................................................. 326
A/D Conversion Accuracy Definitions (2) .............................................................. 327
Analog Input Circuit Example................................................................................. 328
Section 19
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Figure 19.5
Figure 19.6
Figure 19.7
EEPROM
Block Diagram of EEPROM ................................................................................... 330
EEPROM Bus Format and Bus Timing................................................................... 332
Byte Write Operation .............................................................................................. 335
Page Write Operation .............................................................................................. 335
Current Address Read Operation............................................................................. 337
Random Address Read Operation ........................................................................... 337
Sequential Read Operation (when current address read is used) ............................. 338
Section 20
Figure 20.1
Figure 20.2
Figure 20.3
Figure 20.4
Figure 20.5
Power-On Reset and Low-Voltage Detection Circuits (Optional)
Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit.... 342
Operational Timing of Power-On Reset Circuit ...................................................... 345
Operational Timing of LVDR Circuit ..................................................................... 346
Operational Timing of LVDI Circuit....................................................................... 347
Timing for Operation/Release of Low-Voltage Detection Circuit .......................... 348
Section 21 Power Supply Circuit
Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used .................... 349
Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used ............. 350
Section 23
Figure 23.1
Figure 23.2
Figure 23.3
Figure 23.4
Figure 23.5
Figure 23.6
Figure 23.7
Figure 23.8
Electrical Characteristics
System Clock Input Timing..................................................................................... 403
RES Low Width Timing.......................................................................................... 403
Input Timing............................................................................................................ 403
I2C Bus Interface Input/Output Timing ................................................................... 404
SCK3 Input Clock Timing....................................................................................... 404
SCI Input/Output Timing in Clocked Synchronous Mode ...................................... 405
EEPROM Bus Timing............................................................................................. 405
Output Load Circuit................................................................................................. 406
Appendix B I/O Port Block Diagrams
Figure B.1 Port 1 Block Diagram (P17) ..................................................................................... 437
Figure B.2 Port 1 Block Diagram (P14, P16) ............................................................................. 438
Figure B.3 Port 1 Block Diagram (P15) ..................................................................................... 439
Figure B.4 Port 1 Block Diagram (P12) ..................................................................................... 439
Figure B.5 Port 2 Block Diagram (P11) ..................................................................................... 440
Figure B.6 Port 1 Block Diagram (P10) ..................................................................................... 441
Figure B.7 Port 2 Block Diagram (P24, P23) ............................................................................. 441
Rev. 3.00, 05/03, page xxiv of xxx
Figure B.8 Port 2 Block Diagram (P22) .....................................................................................442
Figure B.9 Port 2 Block Diagram (P21) .....................................................................................443
Figure B.10 Port 2 Block Diagram (P20) ...................................................................................444
Figure B.11 Port 3 Block Diagram (P37 to P30) ........................................................................445
Figure B.12 Port 5 Block Diagram (P57, P56) ...........................................................................445
Figure B.13 Port 5 Block Diagram (P54 to P50) ........................................................................446
Figure B.14 Port 6 Block Diagram (P67 to P60) ........................................................................447
Figure B.15 Port 7 Block Diagram (P76) ...................................................................................448
Figure B.16 Port 7 Block Diagram (P75) ...................................................................................449
Figure B.17 Port 7 Block Diagram (P74) ...................................................................................450
Figure B.18 Port 7 Block Diagram (P72) ...................................................................................451
Figure B.19 Port 7 Block Diagram (P71) ...................................................................................451
Figure B.20 Port 7 Block Diagram (P70) ...................................................................................452
Figure B.21 Port 8 Block Diagram (P87 to P85) ........................................................................453
Figure B.22 Port B Block Diagram (PB7 to PB0) ......................................................................453
Appendix D Package Dimensions
Figure D.1 FP-64E Package Dimensions....................................................................................457
Figure D.2 FP-64A Package Dimensions ...................................................................................458
Appendix E EEPROM Laminated-Structure Cross-Sectional View
Figure E.1 EEPROM Laminated-Structure Cross-Sectional View.............................................459
Rev. 3.00, 05/03, page xxv of xxx
Rev. 3.00, 05/03, page xxvi of xxx
Tables
Section 1 Overview
Table 1.1 Pin Functions ................................................................................................................7
Section 2
Table 2.1
Table 2.2
Table 2.3
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.6
Table 2.7
Table 2.8
Table 2.9
Table 2.10
Table 2.11
Table 2.12
Table 2.12
CPU
Operation Notation......................................................................................................22
Data Transfer Instructions...........................................................................................23
Arithmetic Operations Instructions (1) .......................................................................24
Arithmetic Operations Instructions (2) .......................................................................25
Logic Operations Instructions .....................................................................................26
Shift Instructions.........................................................................................................26
Bit Manipulation Instructions (1)................................................................................27
Bit Manipulation Instructions (2)................................................................................28
Branch Instructions .....................................................................................................29
System Control Instructions........................................................................................30
Block Data Transfer Instructions ................................................................................31
Addressing Modes ..................................................................................................33
Absolute Address Access Ranges ...........................................................................34
Effective Address Calculation (1) ...........................................................................36
Effective Address Calculation (2) ...........................................................................37
Section 3 Exception Handling
Table 3.1 Exception Sources and Vector Address ......................................................................48
Table 3.2 Interrupt Wait States ...................................................................................................60
Section 4 Address Break
Table 4.1 Access and Data Bus Used..........................................................................................65
Section 5 Clock Pulse Generators
Table 5.1 Crystal Resonator Parameters .....................................................................................71
Section 6 Power-Down Modes
Table 6.1 Operating Frequency and Waiting Time.....................................................................77
Table 6.2 Transition Mode after SLEEP Instruction Execution and Transition Mode
due to Interrupt............................................................................................................82
Table 6.3 Internal State in Each Operating Mode.......................................................................83
Section 7 ROM
Table 7.1 Setting Programming Modes ......................................................................................93
Table 7.2 Boot Mode Operation .................................................................................................95
Table 7.3 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate
is Possible ...................................................................................................................96
Table 7.4 Reprogram Data Computation Table ..........................................................................99
Table 7.5 Additional-Program Data Computation Table ............................................................99
Rev. 3.00, 05/03, page xxvii of xxx
Table 7.6
Table 7.7
Programming Time ..................................................................................................... 99
Flash Memory Operating States................................................................................ 103
Section 10 Realtime Clock (RTC)
Table 10.1
Pin Configuration.................................................................................................. 138
Table 10.2
Interrupt Source .................................................................................................... 148
Section 11 Timer B1
Table 11.1
Pin Configuration.................................................................................................. 150
Table 11.2
Timer B1 Operating Modes .................................................................................. 153
Section 12 Timer V
Table 12.1
Pin Configuration.................................................................................................. 156
Table 12.2
Clock Signals to Input to TCNTV and Counting Conditions ............................... 159
Section 13 Timer Z
Table 13.1
Timer Z Functions................................................................................................. 170
Table 13.2
Pin Configuration.................................................................................................. 174
Table 13.3
Initial Output Level of FTIOB0 Pin...................................................................... 201
Table 13.4
Output Pins in Reset Synchronous PWM Mode ................................................... 206
Table 13.5
Register Settings in Reset Synchronous PWM Mode........................................... 206
Table 13.6
Output Pins in Complementary PWM Mode ........................................................ 210
Table 13.7
Register Settings in Complementary PWM Mode................................................ 210
Table 13.8
Register Combinations in Buffer Operation.......................................................... 216
Section 15 14-Bit PWM
Table 15.1
Pin Configuration.................................................................................................. 240
Section 16 Serial Communication Interface 3 (SCI3)
Table 16.1
Channel Configuration.......................................................................................... 244
Table 16.2
Pin Configuration.................................................................................................. 246
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1) ...... 254
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2) ...... 255
Table 16.3
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3) ...... 256
Table 16.4
Maximum Bit Rate for Each Frequency (Asynchronous Mode) .......................... 257
Table 16.5
Examples of BRR Settings for Various Bit Rates
(Clocked Synchronous Mode) (1)......................................................................... 258
Table 16.5
Examples of BRR Settings for Various Bit Rates
(Clocked Synchronous Mode) (2)......................................................................... 259
Table 16.6
SSR Status Flags and Receive Data Handling ...................................................... 265
Table 16.7
SCI3 Interrupt Requests........................................................................................ 281
Section 17 I2C Bus Interface 2 (IIC2)
Table 17.1
I2C Bus Interface Pins ........................................................................................... 287
Table 17.2
Transfer Rate......................................................................................................... 289
Table 17.3
Interrupt Requests ................................................................................................. 315
Table 17.4
Time for Monitoring SCL ..................................................................................... 316
Rev. 3.00, 05/03, page xxviii of xxx
Section 18 A/D Converter
Table 18.1
Pin Configuration..................................................................................................319
Table 18.2
Analog Input Channels and Corresponding ADDR Registers ..............................320
Table 18.3
A/D Conversion Time (Single Mode)...................................................................325
Section 19 EEPROM
Table 19.1
Pin Configuration..................................................................................................331
Table 19.2
Slave Addresses ....................................................................................................334
Section 20 Power-On Reset and Low-Voltage Detection Circuits (Optional)
Table 20.1
LVDCR Settings and Select Functions .................................................................344
Section 23 Electrical Characteristics
Table 23.1
Absolute Maximum Ratings .................................................................................367
Table 23.2
DC Characteristics (1)...........................................................................................370
Table 23.2
DC Characteristics (2)...........................................................................................374
Table 23.2
DC Characteristics (3)...........................................................................................375
Table 23.3
AC Characteristics ................................................................................................376
Table 23.4
I2C Bus Interface Timing ......................................................................................378
Table 23.5
Serial Communication Interface (SCI) Timing .....................................................379
Table 23.6
A/D Converter Characteristics ..............................................................................380
Table 23.7
Watchdog Timer Characteristics...........................................................................381
Table 23.8
Flash Memory Characteristics...............................................................................382
Table 23.9
EEPROM Characteristics......................................................................................384
Table 23.10 Power-Supply-Voltage Detection Circuit Characteristics.....................................385
Table 23.11 Power-On Reset Circuit Characteristics................................................................385
Table 23.12 DC Characteristics (1)...........................................................................................388
Table 23.12 DC Characteristics (2)...........................................................................................393
Table 23.12 DC Characteristics (3)...........................................................................................394
Table 23.13 AC Characteristics ................................................................................................395
Table 23.14 I2C Bus Interface Timing ......................................................................................397
Table 23.15 Serial Communication Interface (SCI) Timing .....................................................398
Table 23.16 A/D Converter Characteristics ..............................................................................399
Table 23.17 Watchdog Timer Characteristics...........................................................................400
Table 23.18 EEPROM Characteristics......................................................................................401
Table 23.19 Power-Supply-Voltage Detection Circuit Characteristics.....................................402
Table 23.20 Power-On Reset Circuit Characteristics................................................................402
Appendix A
Table A.1
Table A.2
Table A.2
Table A.2
Table A.3
Table A.4
Instruction Set
Instruction Set .......................................................................................................409
Operation Code Map (1) .......................................................................................422
Operation Code Map (2) .......................................................................................423
Operation Code Map (3) .......................................................................................424
Number of Cycles in Each Instruction ..................................................................426
Number of Cycles in Each Instruction ..................................................................427
Rev. 3.00, 05/03, page xxix of xxx
Table A.5
Combinations of Instructions and Addressing Modes .......................................... 436
Rev. 3.00, 05/03, page xxx of xxx
Section 1 Overview
1.1
Features
• High-speed H8/300H central processing unit with an internal 16-bit architecture
Upward-compatible with H8/300 CPU on an object level
Sixteen 16-bit general registers
62 basic instructions
• Various peripheral functions
RTC (can be used as a free running counter)
Timer B1 (8-bit timer)
Timer V (8-bit timer)
Timer Z (16-bit timer)
14-bit PWM
Watchdog timer
SCI (Asynchronous or clocked synchronous serial communication interface) × 2 channels
I2C Bus Interface (conforms to the I2C bus interface format that is advocated by Philips
Electronics)
10-bit A/D converter
Rev. 3.00, 05/03, page 1 of 472
• On-chip memory
Model
Standard
Version
Product Classification
On-Chip PowerOn Reset and
Low-Voltage
Detecting Circuit
Version
ROM
RAM
Remarks
Flash memory version
(F-ZTATTM version)
H8/3687F HD64F3687 HD64F3687G
56 kbytes
4 kbytes
H8/3684F HD64F3684 HD64F3684G
32 kbytes
4 kbytes
Mask-ROM version
H8/3687
HD6433687
HD6433687G
56 kbytes
3 kbytes
H8/3686
HD6433686
HD6433686G
48 kbytes
3 kbytes
H8/3685
HD6433685
HD6433685G
40 kbytes
3 kbytes
H8/3684
HD6433684
HD6433684G
32 kbytes
3 kbytes
H8/3683
HD6433683
HD6433683G
24 kbytes
3 kbytes
H8/3682
HD6433682
HD6433682G
16 kbytes
3 kbytes
H8/3687N
HD64N3687G
56 kbytes
4 kbytes
Under
development
HD6483687G
56 kbytes
3 kbytes
Under
development
EEPROM
laminated
version
(512 bytes)
Flash
memory
version
Mask-ROM
version
• General I/O ports
I/O pins: 45 I/O pins (43 I/O pins for H8/3687N), including 8 large current ports (IOL = 20
mA, @VOL = 1.5 V)
Input-only pins: 8 input pins (also used for analog input)
• EEPROM interface (only for H8/3687N)
I2C bus interface (conforms to the I2C bus interface format that is advocated by Philips
Electronics)
• Supports various power-down states
Note: F-ZTATTM is a trademark of Renesas Technology Corp.
• Compact package
Package
Code
Body Size
Pin Pitch
LQFP-64
FP-64E
10.0 × 10.0 mm
0.5 mm
QFP-64
FP-64A
Only LQFP-64 (FP-64E) for H8/3687N package
Rev. 3.00, 05/03, page 2 of 472
14.0 × 14.0 mm
0.8 mm
VSS
VCL
VCC
OSC1
OSC2
TEST
Port 6
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Port 7
P76/TMOV
P75/TMCIV
P74/TMRIV
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Port 1
RAM
ROM
IIC2
RTC
SCI3
14-bit
PWM
SCI3_2
Timer Z
Watchdog
timer
Timer V
Timer B1
P87
P86
P85
A/D converter
Data bus (upper)
Address bus
AVCC
Port B
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
P55/
P57/SCL
P56/SDA
/
P54/
P53/
P52/
P51/
P50/
CPU
H8/300H
Port 8
P30
P31
P32
P33
P34
P35
P36
P37
System
clock
generator
Port 2
P20/SCK3
P21/RXD
P22/TXD
P23
P24
Subclock
generator
Data bus (lower)
Port 3
P10/TMOW
P11/PWM
P12
P14/
P15/
/TMIB1
P16/
P17/
/TRGV
X1
X2
Internal Block Diagram
Port 5
1.2
Figure 1.1 Internal Block Diagram of H8/3687 Group of F-ZTAT TM
and Mask-ROM Versions
Rev. 3.00, 05/03, page 3 of 472
P55/
VSS
VCC
OSC1
OSC2
VCL
X1
X2
TEST
Port 6
Port 7
P76/TMOV
P75/TMCIV
P74/TMRIV
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Port 1
RAM
ROM
Port 2
IIC2
RTC
SCI3
14-bit
PWM
SCI3_2
Timer Z
Watchdog
timer
Timer V
Port 8
P57/SCL
P56/SDA
/
P54/
P53/
P52/
P51/
P50/
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Timer B1
P87
P86
P85
A/D converter
I2C bus
P30
P31
P32
P33
P34
P35
P36
P37
CPU
H8/300H
Data bus (lower)
Port 3
P20/SCK3
P21/RXD
P22/TXD
P23
P24
System
clock
generator
Port 5
P10/TMOW
P11/PWM
P12
P14/
P15/
/TMIB1
P16/
P17/
/TRGV
Subclock
generator
SDA
SCL
Data bus (upper)
Address bus
EEPROM
AVCC
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
Port B
Note: The HD64N3687G is a laminated-structure product in which an EEPROM chip is mounted on the HD64F3687G (F-ZTATTM version).
The HD6483687G is a laminated-structure product in which an EEPROM chip is mounted on the HD6433687G (mask-ROM version).
Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM Laminated Version)
Rev. 3.00, 05/03, page 4 of 472
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
P64/FTIOA1
P65/FTIOB1
P66/FTIOC1
P67/FTIOD1
P85
P86
P87
P20/SCK3
P21/RXD
P22/TXD
P23
Pin Arrangement
P70/SCK3_2
1.3
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P71/RXD_2
49
32
P63/FTIOD0
P72/TXD_2
50
31
P24
51
30
P76/TMOV
52
29
P75/TMCIV
53
28
P74/TMRIV
/TRGV
54
27
P57/SCL
P33
55
26
P56/SDA
P32
56
25
P12
P31
57
24
P11/PWM
P30
58
23
P10/TMOW
PB3/AN3
59
22
P55/
PB2/AN2
60
21
P54/
PB1/AN1
61
20
P53/
PB0/AN0
62
19
P52/
PB4/AN4
63
18
P37
PB5/AN5
64
17
P36
H8/3687 Group
9 10 11 12 13 14 15 16
P34
P35
8
/
P51/
VCL
7
P50/
6
Vcc
5
OSC1
4
OSC2
3
Vss
2
TEST
1
X1
Top View
X2
P17/
AVcc
/TMIB1
P16/
PB7/AN7
P15/
PB6/AN6
P14/
Figure 1.3 Pin Arrangement of H8/3687 Group of F-ZTATTM and Mask-ROM Versions
(FP-64E, FP-64A)
Rev. 3.00, 05/03, page 5 of 472
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
P64/FTIOA1
P65/FTIOB1
P66/FTIOC1
P67/FTIOD1
P85
P86
P87
P20/SCK3
P21/RXD
P22/TXD
P23
P70/SCK3_2
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P71/RXD_2
49
32
P63/FTIOD0
P72/TXD_2
50
31
P24
51
30
P76/TMOV
52
29
P75/TMCIV
53
28
P74/TMRIV
/TRGV
54
27
SCL
P33
55
26
SDA
P32
56
25
P12
P31
57
24
P11/PWM
P30
58
23
P10/TMOW
PB3/AN3
59
22
P55/
PB2/AN2
60
21
P54/
PB1/AN1
61
20
P53/
PB0/AN0
62
19
P52/
PB4/AN4
63
18
P37
PB5/AN5
64
17
P36
H8/3687N
9 10 11 12 13 14 15 16
P34
P35
8
/
P51/
7
P50/
6
Vcc
5
OSC1
4
OSC2
3
Vss
2
TEST
1
VCL
Top View
X1
P17/
X2
P16/
AVcc
/TMIB1
PB7/AN7
P15/
PB6/AN6
P14/
Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Laminated Version)
(FP-64E)
Rev. 3.00, 05/03, page 6 of 472
1.4
Pin Functions
Table 1.1
Pin Functions
Pin No.
Type
Symbol
FP-64E
FP-64A
I/O
Functions
Power
source pins
VCC
12
Input
Power supply pin. Connect this pin to the
system power supply.
VSS
9
Input
Ground pin. Connect this pin to the system
power supply (0V).
AVCC
3
Input
Analog power supply pin for the A/D converter.
When the A/D converter is not used, connect
this pin to the system power supply.
VCL
6
Input
Internal step-down power supply pin. Connect
a capacitor of around 0.1 µF between this pin
and the Vss pin for stabilization.
OSC1
11
Input
OSC2
10
Output
These pins connect with crystal or ceramic
resonator for the system clock, or can be used
to input an external clock.
Clock pins
See section 5, Clock Pulse Generators, for a
typical connection.
System
control
These pins connect with a 32.768 kHz crystal
resonator for the subclock. See section 5,
Clock Pulse Generators, for a typical
connection.
X1
5
Input
X2
4
Output
RES
7
Input
Reset pin. The pull-up resistor (typ. 150 kΩ) is
incorporated. When driven low, the chip is
reset.
TEST
8
Input
Test pin. Connect this pin to Vss.
NMI
35
Input
Non-maskable interrupt request input pin.
IRQ0 to
IRQ3
51 to 54
Input
External interrupt request input pins. Can
select the rising or falling edge.
WKP0 to
WKP5
13, 14,
19 to 22
Input
External interrupt request input pins. Can
select the rising or falling edge.
RTC
TMOW
23
Output
This is an output pin for divided clocks.
Timer B1
TMIB1
52
Input
External event input pin.
Timer V
TMOV
30
Output
This is an output pin for waveforms generated
by the output compare function.
TMCIV
29
Input
External event input pin.
TMRIV
28
Input
Counter reset input pin.
TRGV
54
Input
Counter start trigger input pin.
Interrupt
pins
Rev. 3.00, 05/03, page 7 of 472
Pin No.
Type
Symbol
FP-64E
FP-64A
I/O
Functions
Timer Z
FTIOA0
36
I/O
Output compare output/input capture
input/external clock input pin
FTIOB0
34
I/O
Output compare output/input capture
input/PWM output pin
FTIOC0
33
I/O
Output compare output/input capture
input/PWM sync output pin (at a reset,
complementary PWM mode)
FTIOD0
32
I/O
Output compare output/input capture
input/PWM output pin
FTIOA1
37
I/O
Output compare output/input capture
input/PWM output pin (at a reset,
complementary PWM mode)
FTIOB1 to
FTIOD1
38 to 40
I/O
Output compare output/input capture
input/PWM output pin
14-bit PWM PWM
2
I C bus
interface
(IIC)
Serial communication
interface
(SCI)
A/D
converter
24
Output
14-bit PWM square wave output pin
1
26
I/O
IIC data I/O pin. Can directly drive a bus by
NMOS open-drain output. When using this pin,
external pull-up resistance is required.
SCL*
1
27
I/O
IIC clock I/O pin. Can directly drive a bus by
(EEPROM: NMOS open-drain output. When using this pin,
Input)
external pull-up resistance is required.
TXD,
TXD_2
46, 50
Output
Transmit data output pin
RXD,
RXD_2
45, 49
Input
Receive data input pin
SCK3,
SCK3_2
44, 48
I/O
Clock I/O pin
AN7 to AN0 1, 2,
59 to 64
Input
Analog input pin
ADTRG
Input
A/D converter trigger input pin.
SDA*
22
Rev. 3.00, 05/03, page 8 of 472
Pin No.
Type
Symbol
I/O ports
FP-64E
FP-64A
I/O
Functions
PB7 to PB0 1, 2,
59 to 64
Input
8-bit input port.
P17 to P14, 51 to 54,
P12 to P10 23 to 25
I/O
7-bit I/O port.
P24 to P20
31, 44 to 47 I/O
5-bit I/O port.
P37 to P30
15 to 18,
55 to 58
I/O
8-bit I/O port
P57 to P50
13, 14,
19 to 22,
2
2
26* , 27*
I/O
8-bit I/O port
P67 to P60
32 to 34,
I/O
36, 37 to 40
8-bit I/O port
P76 to P74, 28 to 30,
P72 to P70 48 to 50
I/O
P87 to P85
I/O
41 to 43
6-bit I/O port
3-bit I/O port.
2
2
Notes: 1. These pins are only available for the I C bus interface in the H8/3687N. Since the I C
bus is disabled after canceling a reset, the ICE bit in ICCR1 must be set to 1 by using
the program.
2. The P57 and P56 pins are not available in the H8/3687N.
Rev. 3.00, 05/03, page 9 of 472
Rev. 3.00, 05/03, page 10 of 472
Section 2 CPU
This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with
the H8/300CPU, and supports only normal mode, which has a 64-kbyte address space.
• Upward-compatible with H8/300 CPUs
Can execute H8/300 CPUs object programs
Additional eight 16-bit extended registers
32-bit transfer and arithmetic and logic instructions are added
Signed multiply and divide instructions are added.
• General-register architecture
Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit
registers, or eight 32-bit registers
• Sixty-two basic instructions
8/16/32-bit data transfer and arithmetic and logic instructions
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct [Rn]
Register indirect [@ERn]
Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)]
Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
Absolute address [@aa:8, @aa:16, @aa:24]
Immediate [#xx:8, #xx:16, or #xx:32]
Program-counter relative [@(d:8,PC) or @(d:16,PC)]
Memory indirect [@@aa:8]
• 64-kbyte address space
• High-speed operation
All frequently-used instructions execute in one or two states
8/16/32-bit register-register add/subtract
: 2 state
8 × 8-bit register-register multiply
: 14 states
16 ÷ 8-bit register-register divide
: 14 states
16 × 16-bit register-register multiply : 22 states
32 ÷ 16-bit register-register divide
: 22 states
• Power-down state
Transition to power-down state by SLEEP instruction
CPU30H2C_000120030300
Rev. 3.00, 05/03, page 11 of 472
2.1
Address Space and Memory Map
The address space of this LSI is 64 kbytes, which includes the program area and the data area.
Figures 2.1 show the memory map.
HD64N3687G
HD64F3687
HD64F3687G
(Flash memory version)
H'0000
H'0041
H'0042
Interrupt vector
HD64F3684
HD64F3684G
(Flash memory version)
H'0000
H'0041
H'0042
Interrupt vector
On-chip ROM
(32 kbytes)
HD6433682
HD6433682G
(Mask-ROM version)
H'0000
H'0041
H'0042
Interrupt vector
HD6433683
HD6433683G
(Mask-ROM version)
H'0000
H'0041
H'0042
On-chip ROM
(16 kbytes)
Interrupt vector
On-chip ROM
(24 kbytes)
H'3FFF
H'5FFF
H'7FFF
On-chip ROM
(56 kbytes)
Not used
Not used
Not used
H'DFFF
Not used
H'E800
H'E800
H'EFFF
H'EFFF
H'FB7F
H'FB80
H'FF7F
H'FF80
Internal I/O register
(1 kbyte work area
for flash memory
programming)
On-chip RAM
(2 kbytes)
(1 kbyte user area)
H'F700
H'F77F
H'F780
H'FB7F
H'FB80
H'FF7F
H'FF80
Internal I/O register
H'F700
H'F77F
(1 kbyte work area
for flash memory
programming)
On-chip RAM
(2 kbytes)
(1 kbyte user area)
H'FFFF
H'EFFF
Internal I/O register
Not used
H'F700
H'F77F
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Internal I/O register
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Internal I/O register
Internal I/O register
H'FFFF
Figure 2.1 Memory Map (1)
Rev. 3.00, 05/03, page 12 of 472
On-chip RAM
(2 kbytes)
Not used
Internal I/O register
Internal I/O register
H'FFFF
H'EFFF
Not used
Not used
H'E800
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
H'F700
H'F77F
H'F780
H'E800
H'FFFF
HD6433684
HD6433684G
(Mask-ROM version)
H'0000
H'0041
H'0042
Interrupt vector
H'0000
H'0041
H'0042
On-chip ROM
(32 kbytes)
H'7FFF
Interrupt vector
HD6483687G
HD6433687
HD6433687G
(Mask-ROM version)
HD6433686
HD6433686G
(Mask-ROM version)
HD6433685
HD6433685G
(Mask-ROM version)
H'0000
H'0041
H'0042
On-chip ROM
(40 kbytes)
Interrupt vector
H'0000
H'0041
H'0042
Interrupt vector
On-chip ROM
(48 kbytes)
H'9FFF
On-chip ROM
(56 kbytes)
H'BFFF
Not used
Not used
Not used
H'DFFF
Not used
H'E800
H'E800
On-chip RAM
(2 kbytes)
H'EFFF
H'EFFF
Internal I/O register
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Interrupt vector
H'FB80
H'FF7F
H'FF80
H'F700
H'F77F
Interrupt vector
Not used
H'F700
H'F77F
H'FF7F
H'FF80
Interrupt vector
Not used
Not used
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
H'FFFF
On-chip RAM
(1 kbytes)
Interrupt vector
Interrupt vector
Interrupt vector
H'FFFF
H'EFFF
H'FB80
On-chip RAM
(1 kbytes)
On-chip RAM
(2 kbytes)
Not used
Not used
Internal I/O register
H'FFFF
H'EFFF
Not used
H'F700
H'F77F
H'E800
On-chip RAM
(2 kbytes)
On-chip RAM
(2 kbytes)
Not used
H'F700
H'F77F
H'E800
H'FFFF
Figure 2.1 Memory Map (2)
Rev. 3.00, 05/03, page 13 of 472
HD64N3687G
HD6483687G
(On-chip EEPROM module)
H'0000
H'01FF
User area
(512 bytes)
Not used
H'FF09
Slave address
register
Not used
Figure 2.1 Memory Map (3)
Rev. 3.00, 05/03, page 14 of 472
2.2
Register Configuration
The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers;
general registers and control registers. The control registers are a 24-bit program counter (PC), and
an 8-bit condition-code register (CCR).
General Registers (ERn)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7
E7
R7H
R7L
(SP)
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend
SP
PC
CCR
I
UI
:Stack pointer
:Program counter
:Condition-code register
:Interrupt mask bit
:User bit
H
U
N
Z
V
C
:Half-carry flag
:User bit
:Negative flag
:Zero flag
:Overflow flag
:Carry flag
Figure 2.2 CPU Registers
Rev. 3.00, 05/03, page 15 of 472
2.2.1
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
identical and can be used as both address registers and data registers. When a general register is
used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates
the usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L
to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit
registers.
The usage of each register can be selected independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
ER registers
(ER0 to ER7)
RH registers
(R0H to R7H)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.3 Usage of General Registers
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the
relationship between the stack pointer and the stack area.
Rev. 3.00, 05/03, page 16 of 472
Empty area
SP (ER7)
Stack area
Figure 2.4 Relationship between Stack Pointer and Stack Area
2.2.2
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the
start address is loaded by the vector address generated during reset exception-handling sequence.
2.2.3
Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1
by reset exception-handling sequence, but other bits are not initialized.
Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the
LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching
conditions for conditional branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List.
Rev. 3.00, 05/03, page 17 of 472
Bit
Bit Name
Initial
Value
R/W
Description
7
I
1
R/W
Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set
to 1 at the start of an exception-handling sequence.
6
UI
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
5
H
Undefined R/W
Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B,
or NEG.B instruction is executed, this flag is set to 1 if
there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or
NEG.W instruction is executed, the H flag is set to 1 if
there is a carry or borrow at bit 11, and cleared to 0
otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L
instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 27, and cleared to 0 otherwise.
4
U
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
3
N
Undefined R/W
Negative Flag
Stores the value of the most significant bit of data as a
sign bit.
2
Z
Undefined R/W
Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to
indicate non-zero data.
1
V
Undefined R/W
Overflow Flag
Set to 1 when an arithmetic overflow occurs, and
cleared to 0 at other times.
0
C
Undefined R/W
Carry Flag
Set to 1 when a carry occurs, and cleared to 0
otherwise. Used by:
•
Add instructions, to indicate a carry
•
Subtract instructions, to indicate a borrow
•
Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
Rev. 3.00, 05/03, page 18 of 472
2.3
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.3.1
General Register Data Formats
Figure 2.5 shows the data formats in general registers.
Data Type
General Register
Data Format
7
RnH
1-bit data
0
Don't care
7 6 5 4 3 2 1 0
7
1-bit data
RnL
4-bit BCD data
RnH
4-bit BCD data
RnL
Byte data
RnH
Don't care
7
4 3
Upper
0
7 6 5 4 3 2 1 0
0
Lower
Don't care
7
Don't care
7
4 3
Upper
0
Don't care
MSB
LSB
7
Byte data
RnL
0
Lower
0
Don't care
MSB
LSB
Figure 2.5 General Register Data Formats (1)
Rev. 3.00, 05/03, page 19 of 472
Data Type
General
Register
Word data
Rn
Data Format
15
Word data
MSB
En
15
MSB
Longword
data
0
LSB
0
LSB
ERn
31
16 15
MSB
Legend
ERn: General register ER
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2.5 General Register Data Formats (2)
Rev. 3.00, 05/03, page 20 of 472
0
LSB
2.3.2
Memory Data Formats
Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and
longword data in memory, however word or longword data must begin at an even address. If an
attempt is made to access word or longword data at an odd address, an address error does not
occur, however the least significant bit of the address is regarded as 0, so access begins the
preceding address. This also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack area, the operand size should be
word or longword.
Data Type
Address
Data Format
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
7
0
6
5
4
3
2
Address 2N
0
LSB
LSB
Address 2M+1
Longword data
1
MSB
Address 2N+1
Address 2N+2
LSB
Address 2N+3
Figure 2.6 Memory Data Formats
Rev. 3.00, 05/03, page 21 of 472
2.4
Instruction Set
2.4.1
Table of Instructions Classified by Function
The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each
functional category. The notation used in tables 2.2 to 2.9 is defined below.
Table 2.1
Operation Notation
Symbol
Description
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register or address register)
(EAd)
Destination operand
(EAs)
Source operand
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical XOR
→
Move
¬
NOT (logical complement)
:3/:8/:16/:24
3-, 8-, 16-, or 24-bit length
Note:
*
General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7).
Rev. 3.00, 05/03, page 22 of 472
Table 2.2
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE
B
(EAs) → Rd
Cannot be used in this LSI.
MOVTPE
B
Rs → (EAs)
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Rev. 3.00, 05/03, page 23 of 472
Table 2.3
Arithmetic Operations Instructions (1)
Instruction
Size*
Function
ADD
SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register (immediate byte data
cannot be subtracted from byte data in a general register. Use the SUBX
or ADD instruction.)
ADDX
SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data in two general
registers, or on immediate data and data in a general register.
INC
DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
ADDS
SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA
DAS
B
Rd (decimal adjust) → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the CCR to produce 4-bit BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Rev. 3.00, 05/03, page 24 of 472
Table 2.3
Arithmetic Operations Instructions (2)
Instruction
Size*
Function
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets CCR bits according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Rev. 3.00, 05/03, page 25 of 472
Table 2.4
Logic Operations Instructions
Instruction
Size*
Function
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement (logical complement) of general register
contents.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.5
Shift Instructions
Instruction
Size*
Function
SHAL
SHAR
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
SHLL
SHLR
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
ROTL
ROTR
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
ROTXL
ROTXR
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
Note: * Refers to the operand size.
B: Byte
W: Word
L: Longword
Rev. 3.00, 05/03, page 26 of 472
Table 2.6
Bit Manipulation Instructions (1)
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of a
general register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
Rev. 3.00, 05/03, page 27 of 472
Table 2.6
Bit Manipulation Instructions (2)
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
XORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand.
The bit number is specified by 3-bit immediate data.
Note: * Refers to the operand size.
B: Byte
Rev. 3.00, 05/03, page 28 of 472
Table 2.7
Branch Instructions
Instruction
Size
Function
Bcc*
Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP
Branches unconditionally to a specified address.
BSR
Branches to a subroutine at a specified address.
JSR
Branches to a subroutine at a specified address.
RTS
Returns from a subroutine
Note: * Bcc is the general name for conditional branch instructions.
Rev. 3.00, 05/03, page 29 of 472
Table 2.8
System Control Instructions
Instruction
Size*
Function
TRAPA
Starts trap-instruction exception handling.
RTE
Returns from an exception-handling routine.
SLEEP
Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR
Moves the source operand contents to the CCR. The CCR size is one
byte, but in transfer from memory, data is read by word access.
STC
B/W
CCR → (EAd)
Transfers the CCR contents to a destination location. The condition code
register size is one byte, but in transfer to memory, data is written by
word access.
ANDC
B
CCR ∧ #IMM → CCR
Logically ANDs the CCR with immediate data.
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the CCR with immediate data.
XORC
B
CCR ⊕ #IMM → CCR
Logically XORs the CCR with immediate data.
NOP
PC + 2 → PC
Only increments the program counter.
Note: * Refers to the operand size.
B: Byte
W: Word
Rev. 3.00, 05/03, page 30 of 472
Table 2.9
Block Data Transfer Instructions
Instruction
Size
Function
EEPMOV.B
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+,
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+,
R4–1 → R4
Until R4 = 0
else next;
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location set
in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
Rev. 3.00, 05/03, page 31 of 472
2.4.2
Basic Instruction Formats
H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op), a register field (r), an effective address extension (EA), and a condition field
(cc).
Figure 2.7 shows examples of instruction formats.
• Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried
out on the operand. The operation field always includes the first four bits of the instruction.
Some instructions have two operation fields.
• Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3
bits or 4 bits. Some instructions have two register fields. Some have no register field.
• Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit
address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00).
• Condition Field
Specifies the branching condition of Bcc instructions.
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm
EA(disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA(disp)
BRA d:8
Figure 2.7 Instruction Formats
Rev. 3.00, 05/03, page 32 of 472
2.5
Addressing Modes and Effective Address Calculation
The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the
generated 24-bit address, so the effective address is 16 bits.
2.5.1
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses
a subset of these addressing modes. Addressing modes that can be used differ depending on the
instruction. For details, refer to appendix A.4, Combinations of Instructions and Addressing
Modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer
instructions can use all addressing modes except program-counter relative and memory indirect.
Bit-manipulation instructions use register direct, register indirect, or the absolute addressing mode
(@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions)
or immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.10 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:24,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
Register Direct
Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
Register Indirect
@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of
which contain the address of the operand on memory.
Rev. 3.00, 05/03, page 33 of 472
Register Indirect with Displacement
@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the lower 24 bits of the sum the address of a
memory operand. A 16-bit displacement is sign-extended when added.
Register Indirect with Post-Increment or Pre-Decrement
@ERn+ or @-ERn
• Register indirect with post-increment@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word
or longword access, the register value should be even.
• Register indirect with pre-decrement@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result is the address of a memory operand.
The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for
word access, or 4 for longword access. For the word or longword access, the register value
should be even.
Absolute Address
@aa:8, @aa:16, @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24)
For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit
absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the
entire address space.
The access ranges of absolute addresses for the group of this LSI are those shown in table 2.11,
because the upper 8 bits are ignored.
Table 2.11 Absolute Address Access Ranges
Absolute Address
Access Range
8 bits (@aa:8)
H'FF00 to H'FFFF
16 bits (@aa:16)
H'0000 to H'FFFF
24 bits (@aa:24)
H'0000 to H'FFFF
Rev. 3.00, 05/03, page 34 of 472
Immediate
#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
Program-Counter Relative
@(d:8, PC) or @(d:16, PC)
This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the
instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The
PC value to which the displacement is added is the address of the first byte of the next instruction,
so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768
bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an
even number.
Memory Indirect
@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The memory operand is accessed by longword access. The first byte of the memory operand is
ignored, generating a 24-bit branch address. Figure 2.8 shows how to specify branch address for in
memory indirect mode. The upper bits of the absolute address are all assumed to be 0, so the
address range is 0 to 255 (H'0000 to H'00FF).
Note that the first part of the address range is also the exception vector area.
Specified
by @aa:8
Dummy
Branch address
Figure 2.8 Branch Address Specification in Memory Indirect Mode
Rev. 3.00, 05/03, page 35 of 472
2.5.2
Effective Address Calculation
Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI
the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address.
Table 2.12 Effective Address Calculation (1)
No
1
Addressing Mode and Instruction Format
op
2
Effective Address Calculation
Effective Address (EA)
Register direct(Rn)
rm
Operand is general register contents.
rn
Register indirect(@ERn)
31
0
23
0
23
0
23
0
23
0
General register contents
op
3
r
Register indirect with displacement
@(d:16,ERn) or @(d:24,ERn)
31
0
General register contents
op
r
disp
31
0
Sign extension
4
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
op
31
0
General register contents
r
•Register indirect with pre-decrement @-ERn
disp
1, 2, or 4
0
31
General register contents
op
r
1, 2, or 4
The value to be added or subtracted is 1 when the
operand is byte size, 2 for word size, and 4 for
longword size.
Rev. 3.00, 05/03, page 36 of 472
Table 2.12 Effective Address Calculation (2)
No
5
Addressing Mode and Instruction Format
Effective Address Calculation
Effective Address (EA)
Absolute address
@aa:8
8 7
23
op
abs
0
H'FFFF
@aa:16
23
op
abs
16 15
0
Sign extension
@aa:24
op
0
23
abs
6
Immediate
#xx:8/#xx:16/#xx:32
op
7
Operand is immediate data.
IMM
0
23
Program-counter relative
PC contents
@(d:8,PC) @(d:16,PC)
op
disp
0
23
Sign
extension
8
disp
0
23
Memory indirect @@aa:8
23
op
abs
0
8 7
abs
H'0000
0
15
Memory contents
Legend
r, rm,rn :
op :
disp :
IMM :
abs :
23
16 15
0
H'00
Register field
Operation field
Displacement
Immediate data
Absolute address
Rev. 3.00, 05/03, page 37 of 472
2.6
Basic Bus Cycle
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). The period from a
rising edge of φ or φSUB to the next rising edge is called one state. A bus cycle consists of two
states or three states. The cycle differs depending on whether access is to on-chip memory or to
on-chip peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
ø or ø SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.9 On-Chip Memory Access Cycle
Rev. 3.00, 05/03, page 38 of 472
2.6.2
On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 22.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
Bus cycle
T1 state
T2 state
T3 state
ø or ø SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
Rev. 3.00, 05/03, page 39 of 472
2.7
CPU States
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active mode and subactive mode.
For the program halt state, there are a sleep mode, standby mode, and sub-sleep mode. These
states are shown in figure 2.11. Figure 2.12 shows the state transitions. For details on program
execution state and program halt state, refer to section 6, Power-Down Modes. For details on
exception processing, refer to section 3, Exception Handling.
CPU state
Reset state
The CPU is initialized
Program
execution state
Active
(high speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Subactive mode
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
Program halt state
A state in which some
or all of the chip
functions are stopped
to conserve power
Sleep mode
Standby mode
Subsleep mode
Exceptionhandling state
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
Figure 2.11 CPU Operation States
Rev. 3.00, 05/03, page 40 of 472
Power-down
modes
Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
Program halt state
Interrupt
source
Exceptionhandling
complete
Program execution state
SLEEP instruction executed
Figure 2.12 State Transitions
2.8
Usage Notes
2.8.1
Notes on Data Access to Empty Areas
The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip
I/O registers areas available to the user. When data is transferred from CPU to empty areas, the
transferred data will be lost. This action may also cause the CPU to malfunction. When data is
transferred from an empty area to CPU, the contents of the data cannot be guaranteed.
2.8.2
EEPMOV Instruction
EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L,
which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so
that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the
value of R6 must not change from H'FFFF to H'0000 during execution).
2.8.3
Bit-Manipulation Instruction
The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in
byte units, manipulate the data of the target bit, and write data to the same address again in byte
units. Special care is required when using these instructions in cases where two registers are
assigned to the same address, or when a bit is directly manipulated for a port or a register
containing a write-only bit, because this may rewrite data of a bit other than the bit to be
manipulated.
Rev. 3.00, 05/03, page 41 of 472
Bit manipulation for two registers assigned to the same address
Example 1: Bit manipulation for the timer load register and timer counter
(Applicable for timer B1 in the H8/3687 Group.)
Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same
address. When a bit-manipulation instruction accesses the timer load register and timer counter of
a reloadable timer, since these two registers share the same address, the following operations takes
place.
1. Data is read in byte units.
2. The CPU sets or resets the bit to be manipulated with the bit-manipulation instruction.
3. The written data is written again in byte units to the timer load register.
The timer is counting, so the value read is not necessarily the same as the value in the timer load
register. As a result, bits other than the intended bit in the timer counter may be modified and the
modified value may be written to the timer load register.
Read
Count clock
Timer counter
Reload
Write
Timer load register
Internal data bus
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same
Address
Example 2: The BSET instruction is executed for port 5.
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level
signal at P50 with a BSET instruction is shown below.
Rev. 3.00, 05/03, page 42 of 472
• Prior to executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BSET instruction executed instruction
BSET
#0,
@PDR5
The BSET instruction is executed for port 5.
• After executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
0
1
0
0
0
0
0
1
• Description on operation
1. When the BSET instruction is executed, first the CPU reads port 5.
Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level
input).
P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a
value of H'80, but the value read by the CPU is H'40.
2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41.
3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction.
As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level
signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem,
store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the
data in the work area, then write this data to PDR5.
Rev. 3.00, 05/03, page 43 of 472
• Prior to executing BSET instruction
MOV.B
MOV.B
MOV.B
#80,
R0L,
R0L,
R0L
@RAM0
@PDR5
The PDR5 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
• BSET instruction executed
BSET
#0,
@RAM0
The BSET instruction is executed designating the PDR5
work area (RAM0).
• After executing BSET instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PDR5
The work area (RAM0) value is written to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 5 control register PCR5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as
an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be
input to this input pin.
Rev. 3.00, 05/03, page 44 of 472
• Prior to executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BCLR instruction executed
BCLR
#0,
@PCR5
The BCLR instruction is executed for PCR5.
• After executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
1
1
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
• Description on operation
1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only
register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F.
2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE.
3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends.
As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However,
bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins.
To prevent this problem, store a copy of the PDR5 data in a work area in memory and
manipulate data of the bit in the work area, then write this data to PDR5.
Rev. 3.00, 05/03, page 45 of 472
• Prior to executing BCLR instruction
MOV.B
MOV.B
MOV.B
#3F,
R0L,
R0L,
R0L
@RAM0
@PCR5
The PCR5 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
• BCLR instruction executed
BCLR
#0,
@RAM0
The BCLR instructions executed for the PCR5 work area
(RAM0).
• After executing BCLR instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PCR5
The work area (RAM0) value is written to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
Rev. 3.00, 05/03, page 46 of 472
Section 3 Exception Handling
Exception handling may be caused by a reset, a trap instruction (TRAPA), or interrupts.
• Reset
A reset has the highest exception priority. Exception handling starts as soon as the reset is cleared
by the RES pin. The chip is also reset when the watchdog timer overflows, and exception handling
starts. Exception handling is the same as exception handling by the RES pin.
• Trap Instruction
Exception handling starts when a trap instruction (TRAPA) is executed. The TRAPA instruction
generates a vector address corresponding to a vector number from 0 to 3, as specified in the
instruction code. Exception handling can be executed at all times in the program execution state,
regardless of the setting of the I bit in CCR.
• Interrupts
External interrupts other than NMI and internal interrupts other than address break are masked by
the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when the
current instruction or exception handling ends, if an interrupt request has been issued.
Rev. 3.00, 05/03, page 47 of 472
3.1
Exception Sources and Vector Address
Table 3.1 shows the vector addresses and priority of each exception handling. When more than
one interrupt is requested, handling is performed from the interrupt with the highest priority.
Table 3.1
Exception Sources and Vector Address
Relative Module
Exception Sources
Vector
Number
Vector Address
Priority
RES pin
Watchdog timer
Reset
0
H'0000 to H'0001
High
Reserved for system use
1 to 6
H'0002 to H'000D
External interrupt pin NMI
7
H'000E to H'000F
CPU
8
H'0010 to H'0011
(#1)
9
H'0012 to H'0013
(#2)
10
H'0014 to H'0015
(#3)
11
H'0016 to H'0017
Trap instruction (#0)
Address break
Break conditions satisfied
12
H'0018 to H'0019
CPU
Direct transition by executing
the SLEEP instruction
13
H'001A to H'001B
External interrupt pin IRQ0
14
Low-voltage detection interrupt*
H'001C to H'001D
IRQ1
15
H'001E to H'001F
IRQ2
16
H'0020 to H'0021
IRQ3
17
H'0022 to H'0023
WKP
18
H'0024 to H'0025
RTC
Overflow
19
H'0026 to H'0027
Reserved for system use
20
H'0028 to H'0029
Timer V
Timer V compare match A
Timer V compare match B
Timer V overflow
22
H'002C to H'002D
SCI3
SCI3 receive data full
SCI3 transmit data empty
SCI3 transmit end
SCI3 receive error
23
H'002E to H'002F
IIC2
Transmit data empty
Transmit end
Receive data full
Arbitration lost/Overrun error
NACK detection
Stop conditions detected
24
H'0030 to H'0031
Rev. 3.00, 05/03, page 48 of 472
Low
Vector
Relative Module
Exception Sources
Number
Vector Address
Priority
A/D converter
A/D conversion end
25
H'0032 to H'0033
High
Timer Z
Compare match/input capture 26
A0 to D0
Timer Z overflow
H'0034 to H'0035
Compare match/input capture 27
A1 to D1
Timer Z overflow
Timer Z underflow
H'0036 to H'0037
Timer B1
Timer B1 overflow
29
H'003A to H'003B
SCI3_2
Receive data full
Transmit data empty
Transmit end
Receive error
32
H'0040 to H'0041
Note:
3.2
*
Low
A low-voltage detection interrupt is enabled only in the product with an on-chip poweron reset and low-voltage detection circuit.
Register Descriptions
Interrupts are controlled by the following registers.
• Interrupt edge select register 1 (IEGR1)
• Interrupt edge select register 2 (IEGR2)
• Interrupt enable register 1 (IENR1)
• Interrupt enable register 2 (IENR2)
• Interrupt flag register 1 (IRR1)
• Interrupt flag register 2 (IRR2)
• Wakeup interrupt flag register (IWPR)
Rev. 3.00, 05/03, page 49 of 472
3.2.1
Interrupt Edge Select Register 1 (IEGR1)
IEGR1 selects the direction of an edge that generates interrupt requests of pins NMI and IRQ3 to
IRQ0.
Bit
Bit Name
Initial
Value
R/W
Description
7
NMIEG
0
R/W
NMI Edge Select
0: Falling edge of NMI pin input is detected
1: Rising edge of NMI pin input is detected
6 to 4
All 1
3
IEG3
0
R/W
Reserved
These bits are always read as 1.
IRQ3 Edge Select
0: Falling edge of IRQ3 pin input is detected
1: Rising edge of IRQ3 pin input is detected
2
IEG2
0
R/W
IRQ2 Edge Select
0: Falling edge of IRQ2 pin input is detected
1: Rising edge of IRQ2 pin input is detected
1
IEG1
0
R/W
IRQ1 Edge Select
0: Falling edge of IRQ1 pin input is detected
1: Rising edge of IRQ1 pin input is detected
0
IEG0
0
R/W
IRQ0 Edge Select
0: Falling edge of IRQ0 pin input is detected
1: Rising edge of IRQ0 pin input is detected
Rev. 3.00, 05/03, page 50 of 472
3.2.2
Interrupt Edge Select Register 2 (IEGR2)
IEGR2 selects the direction of an edge that generates interrupt requests of the pins ADTRG and
WKP5 to WKP0.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 1
Reserved
These bits are always read as 1.
5
WPEG5
0
R/W
WKP5 Edge Select
0: Falling edge of WKP5(ADTRG) pin input is detected
1: Rising edge of WKP5(ADTRG) pin input is detected
4
WPEG4
0
R/W
WKP4 Edge Select
0: Falling edge of WKP4 pin input is detected
1: Rising edge of WKP4 pin input is detected
3
WPEG3
0
R/W
WKP3 Edge Select
0: Falling edge of WKP3 pin input is detected
1: Rising edge of WKP3 pin input is detected
2
WPEG2
0
R/W
WKP2 Edge Select
0: Falling edge of WKP2 pin input is detected
1: Rising edge of WKP2 pin input is detected
1
WPEG1
0
R/W
WKP1Edge Select
0: Falling edge of WKP1 pin input is detected
1: Rising edge of WKP1 pin input is detected
0
WPEG0
0
R/W
WKP0 Edge Select
0: Falling edge of WKP0 pin input is detected
1: Rising edge of WKP0 pin input is detected
Rev. 3.00, 05/03, page 51 of 472
3.2.3
Interrupt Enable Register 1 (IENR1)
IENR1 enables direct transition interrupts, RTC interrupts, and external pin interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7
IENDT
0
R/W
Direct Transfer Interrupt Enable
When this bit is set to 1, direct transition interrupt
requests are enabled.
6
IENTA
0
R/W
RTC Interrupt Enable
When this bit is set to 1, RTC interrupt requests are
enabled.
5
IENWP
0
R/W
Wakeup Interrupt Enable
This bit is an enable bit, which is common to the pins
WKP5 to WKP0. When the bit is set to 1, interrupt
requests are enabled.
4
1
Reserved
This bit is always read as 1.
3
IEN3
0
R/W
IRQ3 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ3 pin
are enabled.
2
IEN2
0
R/W
IRQ2 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ2 pin
are enabled.
1
IEN1
0
R/W
IRQ1 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ1 pin
are enabled.
0
IEN0
0
R/W
IRQ0 Interrupt Enable
When this bit is set to 1, interrupt requests of the IRQ0 pin
are enabled.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in
an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear
operations are performed while I = 0, and as a result a conflict arises between the clear instruction
and an interrupt request, exception handling for the interrupt will be executed after the clear
instruction has been executed.
Rev. 3.00, 05/03, page 52 of 472
3.2.4
Interrupt Enable Register 2 (IENR2)
IENR2 enables, timer B1 overflow interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
IENTB1
0
R/W
Timer B1 Interrupt Enable
When this bit is set to 1, timer B1 overflow interrupt
requests are enabled.
4 to 0
All 1
Reserved
These bits are always read as 1.
When disabling interrupts by clearing bits in an interrupt enable register, or when clearing bits in
an interrupt flag register, always do so while interrupts are masked (I = 1). If the above clear
operations are performed while I = 0, and as a result a conflict arises between the clear instruction
and an interrupt request, exception handling for the interrupt will be executed after the clear
instruction has been executed.
3.2.5
Interrupt Flag Register 1 (IRR1)
IRR1 is a status flag register for direct transition interrupts, RTC interrupts, and IRQ3 to IRQ0
interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
IRRDT
0
R/W
Direct Transfer Interrupt Request Flag
[Setting condition]
When a direct transfer is made by executing a SLEEP
instruction while DTON in SYSCR2 is set to 1.
[Clearing condition]
When IRRDT is cleared by writing 0
6
IRRTA
0
R/W
RTC Interrupt Request Flag
[Setting condition]
When the RTC counter value overflows
[Clearing condition]
When IRRTA is cleared by writing 0
5, 4
All 1
Reserved
These bits are always read as 1.
Rev. 3.00, 05/03, page 53 of 472
Bit
Bit Name
Initial
Value
R/W
3
IRRI3
0
R/W
Description
IRQ3 Interrupt Request Flag
[Setting condition]
When IRQ3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI3 is cleared by writing 0
2
IRRI2
0
R/W
IRQ2 Interrupt Request Flag
[Setting condition]
When IRQ2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI2 is cleared by writing 0
1
IRRI1
0
R/W
IRQ1 Interrupt Request Flag
[Setting condition]
When IRQ1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI1 is cleared by writing 0
0
IRRl0
0
R/W
IRQ0 Interrupt Request Flag
[Setting condition]
When IRQ0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IRRI0 is cleared by writing 0
Rev. 3.00, 05/03, page 54 of 472
3.2.6
Interrupt Flag Register 2 (IRR2)
IRR2 is a status flag register for timer B1 overflow interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
IRRTB1
0
R/W
Timer B1 Interrupt Request flag
[Setting condition]
When the timer B1 counter value overflows
[Clearing condition]
When IRRTB1 is cleared by writing 0
4 to 0
All 1
Reserved
These bits are always read as 1.
3.2.7
Wakeup Interrupt Flag Register (IWPR)
IWPR is a status flag register for WKP5 to WKP0 interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 1
Reserved
These bits are always read as 1.
5
IWPF5
0
R/W
WKP5 Interrupt Request Flag
[Setting condition]
When WKP5 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF5 is cleared by writing 0.
4
IWPF4
0
R/W
WKP4 Interrupt Request Flag
[Setting condition]
When WKP4 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF4 is cleared by writing 0.
Rev. 3.00, 05/03, page 55 of 472
Bit
Bit Name
Initial
Value
R/W
3
IWPF3
0
R/W
Description
WKP3 Interrupt Request Flag
[Setting condition]
When WKP3 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF3 is cleared by writing 0.
2
IWPF2
0
R/W
WKP2 Interrupt Request Flag
[Setting condition]
When WKP2 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF2 is cleared by writing 0.
1
IWPF1
0
R/W
WKP1 Interrupt Request Flag
[Setting condition]
When WKP1 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF1 is cleared by writing 0.
0
IWPF0
0
R/W
WKP0 Interrupt Request Flag
[Setting condition]
When WKP0 pin is designated for interrupt input and the
designated signal edge is detected.
[Clearing condition]
When IWPF0 is cleared by writing 0.
Rev. 3.00, 05/03, page 56 of 472
3.3
Reset Exception Handling
When the RES pin goes low, all processing halts and this LSI enters the reset. The internal state of
the CPU and the registers of the on-chip peripheral modules are initialized by the reset. To ensure
that this LSI is reset at power-up, hold the RES pin low until the clock pulse generator output
stabilizes. To reset the chip during operation, hold the RES pin low for at least 10 system clock
cycles. When the RES pin goes high after being held low for the necessary time, this LSI starts
reset exception handling. The reset exception handling sequence is shown in figure 3.1. However,
for the reset exception handling sequence of the product with on-chip power-on reset circuit, refer
to section 20, Power-On Reset and Low-Voltage Detection Circuits.
The reset exception handling sequence is as follows:
1. Set the I bit in the condition code register (CCR) to 1.
2. The CPU generates a reset exception handling vector address (from H'0000 to H'0001), the
data in that address is sent to the program counter (PC) as the start address, and program
execution starts from that address.
3.4
Interrupt Exception Handling
3.4.1
External Interrupts
As the external interrupts, there are NMI, IRQ3 to IRQ0, and WKP5 to WKP0 interrupts.
NMI Interrupt
NMI interrupt is requested by input signal edge to pin NMI. This interrupt is detected by either
rising edge sensing or falling edge sensing, depending on the setting of bit NMIEG in IEGR1.
NMI is the highest-priority interrupt, and can always be accepted without depending on the I
bit value in CCR.
IRQ3 to IRQ0 Interrupts
IRQ3 to IRQ0 interrupts are requested by input signals to pins IRQ3 to IRQ0. These four
interrupts are given different vector addresses, and are detected individually by either rising
edge sensing or falling edge sensing, depending on the settings of bits IEG3 to IEG0 in
IEGR1.
When pins IRQ3 to IRQ0 are designated for interrupt input in PMR1 and the designated signal
edge is input, the corresponding bit in IRR1 is set to 1, requesting the CPU of an interrupt.
These interrupts can be masked by setting bits IEN3 to IEN0 in IENR1.
Rev. 3.00, 05/03, page 57 of 472
WKP5 to WKP0 Interrupts
WKP5 to WKP0 interrupts are requested by input signals to pins WKP5 to WKP0. These six
interrupts have the same vector addresses, and are detected individually by either rising edge
sensing or falling edge sensing, depending on the settings of bits WPEG5 to WPEG0 in
IEGR2.
When pins WKP5 to WKP0 are designated for interrupt input in PMR5 and the designated
signal edge is input, the corresponding bit in IWPR is set to 1, requesting the CPU of an
interrupt. These interrupts can be masked by setting bit IENWP in IENR1.
Reset cleared
Initial program
instruction prefetch
Vector fetch Internal
processing
ø
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16 bits)
(2)
(3)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) Initial program instruction
Figure 3.1 Reset Sequence
3.4.2
Internal Interrupts
Each on-chip peripheral module has a flag to show the interrupt request status and the enable bit to
enable or disable the interrupt. For RTC interrupt requests and direct transfer interrupt requests
generated by execution of a SLEEP instruction, this function is included in IRR1, IRR2, IENR1,
and IENR2.
When an on-chip peripheral module requests an interrupt, the corresponding interrupt request
status flag is set to 1, requesting the CPU of an interrupt. These interrupts can be masked by
writing 0 to clear the corresponding enable bit.
Rev. 3.00, 05/03, page 58 of 472
3.4.3
Interrupt Handling Sequence
Interrupts are controlled by an interrupt controller.
Interrupt operation is described as follows.
1. If an interrupt occurs while the NMI or interrupt enable bit is set to 1, an interrupt request
signal is sent to the interrupt controller.
2. When multiple interrupt requests are generated, the interrupt controller requests to the CPU for
the interrupt handling with the highest priority at that time according to table 3.1. Other
interrupt requests are held pending.
3. The CPU accepts the NMI and address break without depending on the I bit value. Other
interrupt requests are accepted, if the I bit is cleared to 0 in CCR; if the I bit is set to 1, the
interrupt request is held pending.
4. If the CPU accepts the interrupt after processing of the current instruction is completed,
interrupt exception handling will begin. First, both PC and CCR are pushed onto the stack. The
state of the stack at this time is shown in figure 3.2. The PC value pushed onto the stack is the
address of the first instruction to be executed upon return from interrupt handling.
5. Then, the I bit of CCR is set to 1, masking further interrupts excluding the NMI and address
break. Upon return from interrupt handling, the values of I bit and other bits in CCR will be
restored and returned to the values prior to the start of interrupt exception handling.
6.
Next, the CPU generates the vector address corresponding to the accepted interrupt, and
transfers the address to PC as a start address of the interrupt handling-routine. Then a program
starts executing from the address indicated in PC.
Figure 3.3 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
Rev. 3.00, 05/03, page 59 of 472
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR*3
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
Legend:
PCH : Upper 8 bits of program counter (PC)
PCL : Lower 8 bits of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt
handling routine.
2. Register contents must always be saved and restored by word length, starting from
an even-numbered address.
3. Ignored when returning from the interrupt handling routine.
Figure 3.2 Stack Status after Exception Handling
3.4.4
Interrupt Response Time
Table 3.2 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handling-routine is executed.
Table 3.2
Interrupt Wait States
Item
States
Total
Waiting time for completion of executing instruction*
1 to 23
15 to 37
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Note: * Not including EEPMOV instruction.
Rev. 3.00, 05/03, page 60 of 472
Figure 3.3 Interrupt Sequence
Rev. 3.00, 05/03, page 61 of 472
(2)
(1)
(4)
Instruction
prefetch
(3)
Internal
processing
(5)
(1)
Stack access
(6)
(7)
(9)
Vector fetch
(8)
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
Internal data bus
(16 bits)
Internal write
signal
Internal read
signal
Internal
address bus
ø
Interrupt
request signal
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
(10)
(9)
Prefetch instruction of
Internal
interrupt-handling routine
processing
3.5
3.5.1
Usage Notes
Interrupts after Reset
If an interrupt is accepted after a reset and before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.W #xx: 16, SP).
3.5.2
Notes on Stack Area Use
When word data is accessed, the least significant bit of the address is regarded as 0. Access to the
stack always takes place in word size, so the stack pointer (SP: R7) should never indicate an odd
address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W @SP+, Rn) to save or restore
register values.
3.5.3
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, IRQ3 to
IRQ0, and WKP5 to WKP0, the interrupt request flag may be set to 1.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0.
Figure 3.4 shows a port mode register setting and interrupt request flag clearing procedure.
CCR I bit ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
Set port mode register bit
Execute NOP instruction
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0.
Clear interrupt request flag to 0
CCR I bit ← 0
Interrupt mask cleared
Figure 3.4 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure
Rev. 3.00, 05/03, page 62 of 472
Section 4 Address Break
The address break simplifies on-board program debugging. It requests an address break interrupt
when the set break condition is satisfied. The interrupt request is not affected by the I bit of CCR.
Break conditions that can be set include instruction execution at a specific address and a
combination of access and data at a specific address. With the address break function, the
execution start point of a program containing a bug is detected and execution is branched to the
correcting program. Figure 4.1 shows a block diagram of the address break.
Internal address bus
Comparator
BARL
Internal data bus
BARH
ABRKCR
Interrupt
generation
control circuit
ABRKSR
BDRH
BDRL
Comparator
Interrupt
Legend:
BARH, BARL:
BDRH, BDRL:
ABRKCR:
ABRKSR:
Break address register
Break data register
Address break control register
Address break status register
Figure 4.1 Block Diagram of Address Break
4.1
Register Descriptions
Address break has the following registers.
• Address break control register (ABRKCR)
• Address break status register (ABRKSR)
• Break address register (BARH, BARL)
• Break data register (BDRH, BDRL)
ABK0001A_000020020200
Rev. 3.00, 05/03, page 63 of 472
4.1.1
Address Break Control Register (ABRKCR)
ABRKCR sets address break conditions.
Bit
Bit Name
Initial
Value
R/W
7
RTINTE
1
R/W
Description
RTE Interrupt Enable
When this bit is 0, the interrupt immediately after
executing RTE is masked and then one instruction must
be executed. When this bit is 1, the interrupt is not
masked.
6
CSEL1
0
R/W
Condition Select 1 and 0
5
CSEL0
0
R/W
These bits set address break conditions.
00: Instruction execution cycle
01: CPU data read cycle
10: CPU data write cycle
11: CPU data read/write cycle
4
ACMP2
0
R/W
Address Compare Condition Select 2 to 0
3
ACMP1
0
R/W
2
ACMP0
0
R/W
These bits set the comparison condition between the
address set in BAR and the internal address bus.
000: Compares 16-bit addresses
001: Compares upper 12-bit addresses
010: Compares upper 8-bit addresses
011: Compares upper 4-bit addresses
1XX: Reserved (setting prohibited)
1
DCMP1
0
R/W
Data Compare Condition Select 1 and 0
0
DCMP0
0
R/W
These bits set the comparison condition between the data
set in BDR and the internal data bus.
00: No data comparison
01: Compares lower 8-bit data between BDRL and data
bus
10: Compares upper 8-bit data between BDRH and data
bus
11: Compares 16-bit data between BDR and data bus
Legend: X: Don't care.
When an address break is set in the data read cycle or data write cycle, the data bus used will
depend on the combination of the byte/word access and address. Table 4.1 shows the access and
data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a
byte access is generated twice. For details on data widths of each register, see section 22.1,
Register Addresses (Address Order).
Rev. 3.00, 05/03, page 64 of 472
Table 4.1
Access and Data Bus Used
Word Access
Byte Access
Even Address Odd Address
Even Address
Odd Address
ROM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
RAM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
I/O register with 8-bit data
bus width
Upper 8 bits
Upper 8 bits
Upper 8 bits
Upper 8 bits
I/O register with 16-bit data
bus width
Upper 8 bits
Lower 8 bits
4.1.2
Address Break Status Register (ABRKSR)
ABRKSR consists of the address break interrupt flag and the address break interrupt enable bit.
Bit
Bit Name
Initial
Value
R/W
Description
7
ABIF
0
R/W
Address Break Interrupt Flag
[Setting condition]
When the condition set in ABRKCR is satisfied
[Clearing condition]
When 0 is written after ABIF=1 is read
6
ABIE
0
R/W
Address Break Interrupt Enable
When this bit is 1, an address break interrupt request is
enabled.
5 to 0
All 1
Reserved
These bits are always read as 1.
4.1.3
Break Address Registers (BARH, BARL)
BARH and BARL are 16-bit read/write registers that set the address for generating an address
break interrupt. When setting the address break condition to the instruction execution cycle, set
the first byte address of the instruction. The initial value of this register is H'FFFF.
4.1.4
Break Data Registers (BDRH, BDRL)
BDRH and BDRL are 16-bit read/write registers that set the data for generating an address break
interrupt. BDRH is compared with the upper 8-bit data bus. BDRL is compared with the lower 8bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is used for
even and odd addresses in the data transmission. Therefore, comparison data must be set in
Rev. 3.00, 05/03, page 65 of 472
BDRH for byte access. For word access, the data bus used depends on the address. See section
4.1.1, Address Break Control Register (ABRKCR), for details. The initial value of this register is
undefined.
4.2
Operation
When the ABIF and ABIE bits in ABRKSR are set to 1, the address break function generates an
interrupt request to the CPU. The ABIF bit in ABRKSR is set to 1 by the combination of the
address set in BAR, the data set in BDR, and the conditions set in ABRKCR. When the interrupt
request is accepted, interrupt exception handling starts after the instruction being executed ends.
The address break interrupt is not masked by the I bit in CCR of the CPU.
Figures 4.2 show the operation examples of the address break interrupt setting.
When the address break is specified in instruction execution cycle
Register setting
• ABRKCR = H'80
• BAR = H'025A
Program
0258
* 025A
025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
NOP
:
Underline indicates the address
to be stacked.
NOP
MOV
MOV
NOP
instruc- instruc- instruc- instruction 2
Internal
tion
tion 1
tion
prefetch prefetch prefetch prefetch processing
Stack save
φ
Address
bus
0258
025A
025C
025E
SP-2
SP-4
Interrupt
request
Interrupt acceptance
Figure 4.2 Address Break Interrupt Operation Example (1)
Rev. 3.00, 05/03, page 66 of 472
When the address break is specified in the data read cycle
Register setting
• ABRKCR = H'A0
• BAR = H'025A
Program
0258
025A
* 025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
Underline indicates the address
NOP
to be stacked.
:
MOV
NOP
MOV
NOP
Next
MOV
instruc- instruc- instruc- instruc- instruc- instrution
tion
tion
ction
Internal Stack
tion 2
tion 1
prefetch prefetch prefetch execution prefetch prefetch processing save
φ
Address
bus
025C
025E
0260
025A
0262
0264
SP-2
Interrupt
request
Interrupt acceptance
Figure 4.2 Address Break Interrupt Operation Example (2)
Rev. 3.00, 05/03, page 67 of 472
Rev. 3.00, 05/03, page 68 of 472
Section 5 Clock Pulse Generators
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator, a duty correction circuit, and system clock dividers. The
subclock pulse generator consists of a subclock oscillator circuit and a subclock divider.
Figure 5.1 shows a block diagram of the clock pulse generators.
OSC1
OSC2
System
clock
oscillator
øOSC
(fOSC)
Duty
correction
circuit
øOSC
(fOSC)
System
clock
divider
øOSC
øOSC/8
øOSC/16
øOSC/32
øOSC/64
System clock pulse generator
X1
X2
Subclock
oscillator
ø
Prescaler S
(13 bits)
ø/2
to
ø/8192
øW/2
øW
(fW)
Subclock
divider
øW/4
øSUB
øW/8
Prescaler W
(5 bits)
øW/8
to
øW/128
Subclock pulse generator
Figure 5.1 Block Diagram of Clock Pulse Generators
The basic clock signals that drive the CPU and on-chip peripheral modules are ø and øSUB. The
system clock is divided by prescaler S to become a clock signal from ø/8192 to ø/2, and the
subclock is divided by prescaler W to become a clock signal from øw/128 to øw/8. Both the
system clock and subclock signals are provided to the on-chip peripheral modules.
CPG0200A_000020020200
Rev. 3.00, 05/03, page 69 of 472
5.1
System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
resonator, or by providing external clock input. Figure 5.2 shows a block diagram of the system
clock generator.
OSC 2
LPM
OSC 1
LPM: Low-power mode (standby mode, subactive mode, subsleep mode)
Figure 5.2 Block Diagram of System Clock Generator
5.1.1
Connecting Crystal Resonator
Figure 5.3 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance
crystal resonator should be used. Figure 5.4 shows the equivalent circuit of a crystal resonator. A
resonator having the characteristics given in table 5.1 should be used.
C1
OSC 1
C2
OSC 2
C1 = C 2 = 12 pF ±20%
Figure 5.3 Typical Connection to Crystal Resonator
LS
RS
CS
OSC 1
OSC 2
C0
Figure 5.4 Equivalent Circuit of Crystal Resonator
Rev. 3.00, 05/03, page 70 of 472
Table 5.1
Crystal Resonator Parameters
Frequency (MHz)
2
4
8
10
16
20
RS (max)
500 Ω
120 Ω
80 Ω
60 Ω
50 Ω
40 Ω
C0 (max)
7 pF
7 pF
7 pF
7 pF
7 pF
7 pF
5.1.2
Connecting Ceramic Resonator
Figure 5.5 shows a typical method of connecting a ceramic resonator.
C1
OSC1
C2
OSC2
C1 = 30 pF ±10%
C2 = 30 pF ±10%
Figure 5.5 Typical Connection to Ceramic Resonator
5.1.3
External Clock Input Method
Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 5.6 shows a
typical connection. The duty cycle of the external clock signal must be 45 to 55%.
OSC1
OSC 2
External clock input
Open
Figure 5.6 Example of External Clock Input
Rev. 3.00, 05/03, page 71 of 472
5.2
Subclock Generator
Figure 5.7 shows a block diagram of the subclock generator.
X2
8M
X1
Note : Registance is a reference value.
Figure 5.7 Block Diagram of Subclock Generator
5.2.1
Connecting 32.768-kHz Crystal Resonator
Clock pulses can be supplied to the subclock divider by connecting a 32.768-kHz crystal
resonator, as shown in figure 5.8. Figure 5.9 shows the equivalent circuit of the 32.768-kHz crystal
resonator.
C1
X1
C2
X2
C1 = C 2 = 15 pF (typ.)
Figure 5.8 Typical Connection to 32.768-kHz Crystal Resonator
LS
RS
CS
X1
X2
CO
CO = 1.5 pF (typ.)
RS = 14 kΩ (typ.)
fW = 32.768 kHz
Note: Constants are reference values.
Figure 5.9 Equivalent Circuit of 32.768-kHz Crystal Resonator
Rev. 3.00, 05/03, page 72 of 472
5.2.2
Pin Connection when Not Using Subclock
When the subclock is not used, connect pin X1 to VCL or VSS and leave pin X2 open, as shown in
figure 5.10.
VCL or VSS
X1
X2
Open
Figure 5.10 Pin Connection when not Using Subclock
5.3
Prescalers
5.3.1
Prescaler S
Prescaler S is a 13-bit counter using the system clock (ø) as its input clock. It is incremented once
per clock period. Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from
the reset state. In standby mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000. The CPU cannot read or write
prescaler S. The output from prescaler S is shared by the on-chip peripheral modules. The divider
ratio can be set separately for each on-chip peripheral function. In active mode and sleep mode,
the clock input to prescaler S is determined by the division factor designated by MA2 to MA0 in
SYSCR2.
5.3.2
Prescaler W
Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (øW/4) as its input clock.
The divided output is used for clock time base operation of timer A. Prescaler W is initialized to
H'00 by a reset, and starts counting on exit from the reset state. Even in standby mode, subactive
mode, or subsleep mode, prescaler W continues functioning so long as clock signals are supplied
to pins X1 and X2.
Rev. 3.00, 05/03, page 73 of 472
5.4
Usage Notes
5.4.1
Note on Resonators
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Resonator circuit constants will differ
depending on the resonator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the resonator element
manufacturer. Design the circuit so that the resonator element never receives voltages exceeding
its maximum rating.
5.4.2
Notes on Board Design
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to the OSC1 and OSC2 pins. Other signal lines should be routed away from the
resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11).
Avoid
Signal A
Signal B
C1
OSC1
C2
OSC2
Figure 5.11 Example of Incorrect Board Design
Rev. 3.00, 05/03, page 74 of 472
Section 6 Power-Down Modes
This LSI has six modes of operation after a reset. These include a normal active mode and four
power-down modes, in which power consumption is significantly reduced. Module standby mode
reduces power consumption by selectively halting on-chip module functions.
• Active mode
The CPU and all on-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc, φosc/8, φosc/16, φosc/32, and φosc/64.
• Subactive mode
The CPU and all on-chip peripheral modules are operable on the subclock. The subclock
frequency can be selected from φw/2, φw/4, and φw/8.
• Sleep mode
The CPU halts. On-chip peripheral modules are operable on the system clock.
• Subsleep mode
The CPU halts. On-chip peripheral modules are operable on the subclock.
• Standby mode
The CPU and all on-chip peripheral modules halt. When the clock time-base function is
selected, the RTC is operable.
• Module standby mode
Independent of the above modes, power consumption can be reduced by halting on-chip
peripheral modules that are not used in module units.
6.1
Register Descriptions
The registers related to power-down modes are listed below.
• System control register 1 (SYSCR1)
• System control register 2 (SYSCR2)
• Module standby control register 1 (MSTCR1)
• Module standby control register 2 (MSTCR2)
LPW3002A_000120030300
Rev. 3.00, 05/03, page 75 of 472
6.1.1
System Control Register 1 (SYSCR1)
SYSCR1 controls the power-down modes, as well as SYSCR2.
Bit
Bit Name
Initial
Value
R/W
Description
7
SSBY
0
R/W
Software Standby
This bit selects the mode to transit after the execution of
the SLEEP instruction.
0: Enters sleep mode or subsleep mode.
1: Enters standby mode.
For details, see table 6.2.
6
STS2
0
R/W
Standby Timer Select 2 to 0
5
STS1
0
R/W
4
STS0
0
R/W
These bits designate the time the CPU and peripheral
modules wait for stable clock operation after exiting from
standby mode, subactive mode, or subsleep mode to
active mode or sleep mode due to an interrupt. The
designation should be made according to the clock
frequency so that the waiting time is at least 6.5 ms. The
relationship between the specified value and the number
of wait states is shown in table 6.1. When an external
clock is to be used, the minimum value (STS2 = STS1 =
STS0 =1) is recommended.
3
NESEL
0
R/W
Noise Elimination Sampling Frequency Select
The subclock pulse generator generates the watch clock
signal (φW ) and the system clock pulse generator
generates the oscillator clock (φOSC). This bit selects the
sampling frequency of the oscillator clock when the watch
clock signal (φW ) is sampled. When φOSC=2 to 10 MHz,
clear NESEL to 0.
0: Sampling rate is φOSC/16
1: Sampling rate is φOSC/4
2 to 0
All 0
Reserved
These bits are always read as 0.
Rev. 3.00, 05/03, page 76 of 472
Table 6.1
Operating Frequency and Waiting Time
Bit Name
Operating Frequency
STS2 STS1 STS0 Waiting Time
20 MHz 16 MHz 10 MHz 8 MHz 4 MHz 2 MHz 1 MHz 0.5 MHz
0
0
0
8,192 states
0.4
0.5
0.8
1.0
2.0
4.1
8.1
16.4
1
16,384 states
0.8
1.0
1.6
2.0
4.1
8.2
16.4
32.8
0
32,768 states
1.6
2.0
3.3
4.1
8.2
16.4
32.8
65.5
1
65,536 states
3.3
4.1
6.6
8.2
16.4
32.8
65.5
131.1
0
0
131,072 states
6.6
8.2
13.1
16.4
32.8
65.5
131.1 262.1
1
1,024 states
0.05
0.06
0.10
0.13
0.26
0.51
1.02
2.05
1
0
128 states
0.00
0.00
0.01
0.02
0.03
0.06
0.13
0.26
1
16 states
0.00
0.00
0.00
0.00
0.00
0.01
0.02
0.03
1
1
Note: Time unit is ms.
Rev. 3.00, 05/03, page 77 of 472
6.1.2
System Control Register 2 (SYSCR2)
SYSCR2 controls the power-down modes, as well as SYSCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7
SMSEL
0
R/W
Sleep Mode Selection
6
LSON
0
R/W
Low Speed on Flag
5
DTON
0
R/W
Direct Transfer on Flag
These bits select the mode to enter after the execution of
a SLEEP instruction, as well as bit SSBY of SYSCR1.
For details, see table 6.2.
4
MA2
0
R/W
Active Mode Clock Select 2 to 0
3
MA1
0
R/W
2
MA0
0
R/W
These bits select the operating clock frequency in active
and sleep modes. The operating clock frequency
changes to the set frequency after the SLEEP instruction
is executed.
0XX: φOSC
100: φOSC/8
101: φOSC/16
110: φOSC/32
111: φOSC/64
1
SA1
0
R/W
Subactive Mode Clock Select 1 and 0
0
SA0
0
R/W
These bits select the operating clock frequency in
subactive and subsleep modes. The operating clock
frequency changes to the set frequency after the SLEEP
instruction is executed.
00: φW /8
01: φW /4
1X: φW /2
Legend X: Don't care.
Rev. 3.00, 05/03, page 78 of 472
6.1.3
Module Standby Control Register 1 (MSTCR1)
MSTCR1 allows the on-chip peripheral modules to enter a standby state in module units.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
MSTIIC
0
R/W
5
MSTS3
0
R/W
IIC2 Module Standby
IIC2 enters standby mode when this bit is set to 1
SCI3 Module Standby
SCI3 enters standby mode when this bit is set to 1
4
MSTAD
0
R/W
A/D Converter Module Standby
A/D converter enters standby mode when this bit is set to
1
3
MSTWD
0
R/W
Watchdog Timer Module Standby
Watchdog timer enters standby mode when this bit is set
to 1.When the internal oscillator is selected for the
watchdog timer clock, the watchdog timer operates
regardless of the setting of this bit
2
0
Reserved
This bit is always read as 0.
1
MSTTV
0
R/W
Timer V Module Standby
Timer V enters standby mode when this bit is set to 1
0
MSTTA
0
R/W
RTC Module Standby
RTC enters standby mode when this bit is set to 1
Rev. 3.00, 05/03, page 79 of 472
6.1.4
Module Standby Control Register 2 (MSTCR2)
MSTCR2 allows the on-chip peripheral modules to enter a standby state in module units.
Bit
Bit Name
Initial
Value
R/W
Description
7
MSTS3_2
0
R/W
SCI3_2 Module Standby
SCI3_2 enters standby mode when this bit is set to1
6, 5
All 0
4
MSTTB1
0
R/W
Reserved
These bits are always read as 0.
Timer B1 Module Standby
Timer B1 enters standby mode when this bit is set to1
3, 2
All 0
Reserved
These bits are always read as 0.
1
MSTTZ
0
R/W
Timer Z Module Standby
Timer Z enters standby mode when this bit is set to1
0
MSTPWM 0
R/W
PWM Module Standby
PWM enters standby mode when this bit is set to1
6.2
Mode Transitions and States of LSI
Figure 6.1 shows the possible transitions among these operating modes. A transition is made from
the program execution state to the program halt state by executing a SLEEP instruction. Interrupts
allow for returning from the program halt state to the program execution state. A direct transition
between active mode and subactive mode, which are both program execution states, can be made
without halting the program. The operating frequency can also be changed in the same modes by
making a transition directly from active mode to active mode, and from subactive mode to
subactive mode. RES input enables transitions from a mode to the reset state. Table 6.2 shows the
transition conditions of each mode after the SLEEP instruction is executed and a mode to return by
an interrupt. Table 6.3 shows the internal states of the LSI in each mode.
Rev. 3.00, 05/03, page 80 of 472
Reset state
Program halt state
Program execution state
SLEEP
instruction
Direct transition
interrupt
SLEEP
instruction
Sleep mode
Active mode
Standby mode
Program halt state
Interrupt
Interrupt
SLEEP
instruction
Direct
transition
interrupt
Direct
transition
interrupt
Interrupt
SLEEP
instruction
SLEEP
instruction
Interrupt
SLEEP
instruction
Subactive
mode
Subsleep mode
Interrupt
Direct transition
interrupt
Notes: 1. To make a transition to another mode by an interrupt, make sure interrupt handling is after the interrupt
is accepted.
2. Details on the mode transition conditions are given in table 6.2.
Figure 6.1 Mode Transition Diagram
Rev. 3.00, 05/03, page 81 of 472
Table 6.2
Transition Mode after SLEEP Instruction Execution and Transition Mode due
to Interrupt
DTON
SSBY
SMSEL
LSON
Transition Mode after
SLEEP Instruction
Execution
0
0
0
0
Sleep mode
1
1
0
1
X
X
X
Legend:
*
Active mode
Subactive mode
Subsleep mode
Active mode
X
Standby mode
Active mode
0*
0
Active mode
(direct transition)
X
1
Subactive mode
(direct transition)
1
1
Transition Mode due to
Interrupt
Subactive mode
X: Don’t care.
When a state transition is performed while SMSEL is 1, timer V, SCI3, SCI3_2 and the
A/D converter are reset, and all registers are set to their initial values. To use these
functions after entering active mode, reset the registers.
Rev. 3.00, 05/03, page 82 of 472
Table 6.3
Internal State in Each Operating Mode
Function
Active Mode
Sleep Mode
Subactive
Mode
Subsleep
Mode
Standby Mode
System clock oscillator
Functioning
Functioning
Halted
Halted
Halted
Subclock oscillator
Functioning
Functioning
Functioning
Functioning
Functioning
CPU
operations
Instructions
Functioning
Halted
Functioning
Halted
Halted
Registers
Functioning
Retained
Functioning
Retained
Retained
RAM
Functioning
Retained
Functioning
Retained
Retained
IO ports
Functioning
Retained
Functioning
Retained
Register
contents are
retained, but
output is the
high-impedance
state.
Functioning
Functioning
Functioning
Functioning
Functioning
WKP5 to WKP0 Functioning
Functioning
Functioning
Functioning
Functioning
RTC
Functioning
Functioning
Functioning if the timekeeping time-base
function is selected, and retained if not selected
Timer V
Functioning
Functioning
Reset
Watchdog timer Functioning
Functioning
Retained (functioning if the internal oscillator is
selected as a count clock*)
SCI3, SCI3_2
Functioning
Functioning
Reset
Reset
Reset
IIC2
Functioning
Functioning
Retained*
Retained
Retained
Timer B1
Functioning
Functioning
Retained*
Retained
Retained
Timer Z
Functioning
Functioning
Retained (the counter increments according to
subclocks if the internal clock (φ) is selected as a
count clock*)
A/D converter
Functioning
Functioning
Reset
External
interrupts
Peripheral
functions
IRQ3 to IRQ0
Reset
Reset
Reset
Reset
Note: * Registers can be read or written in subactive mode.
6.2.1
Sleep Mode
In sleep mode, CPU operation is halted but the on-chip peripheral modules function at the clock
frequency set by the MA2, MA1, and MA0 bits in SYSCR2. CPU register contents are retained.
When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts.
Sleep mode is not cleared if the I bit of the condition code register (CCR) is set to 1 or the
requested interrupt is disabled in the interrupt enable register. After sleep mode is cleared, a
transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is made to
subactive mode when the bit is 1.
Rev. 3.00, 05/03, page 83 of 472
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared.
6.2.2
Standby Mode
In standby mode, the clock pulse generator stops, so the CPU and on-chip peripheral modules stop
functioning. However, as long as the rated voltage is supplied, the contents of CPU registers, onchip RAM, and some on-chip peripheral module registers are retained. On-chip RAM contents
will be retained as long as the voltage set by the RAM data retention voltage is provided. The I/O
ports go to the high-impedance state.
Standby mode is cleared by an interrupt. When an interrupt is requested, the system clock pulse
generator starts. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, and interrupt
exception handling starts. Standby mode is not cleared if the I bit of CCR is set to 1 or the
requested interrupt is disabled in the interrupt enable register.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
6.2.3
Subsleep Mode
In subsleep mode, operation of the CPU and on-chip peripheral modules other than RTC is halted.
As long as a required voltage is applied, the contents of CPU registers, the on-chip RAM, and
some registers of the on-chip peripheral modules are retained. I/O ports keep the same states as
before the transition.
Subsleep mode is cleared by an interrupt. When an interrupt is requested, subsleep mode is cleared
and interrupt exception handling starts. Subsleep mode is not cleared if the I bit of CCR is set to 1
or the requested interrupt is disabled in the interrupt enable register. After subsleep mode is
cleared, a transition is made to active mode when the LSON bit in SYSCR2 is 0, and a transition is
made to subactive mode when the bit is 1. After the time set in bits STS2 to STS0 in SYSCR1 has
elapsed, a transition is made to active mode.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
Rev. 3.00, 05/03, page 84 of 472
6.2.4
Subactive Mode
The operating frequency of subactive mode is selected from φW/2, φW/4, and φW/8 by the SA1 and
SA0 bits in SYSCR2. After the SLEEP instruction is executed, the operating frequency changes to
the frequency which is set before the execution. When the SLEEP instruction is executed in
subactive mode, a transition to sleep mode, subsleep mode, standby mode, active mode, or
subactive mode is made, depending on the combination of SYSCR1 and SYSCR2. When the RES
pin goes low, the system clock pulse generator starts. Since system clock signals are supplied to
the entire chip as soon as the system clock pulse generator starts functioning, the RES pin must be
kept low until the pulse generator output stabilizes. After the pulse generator output has stabilized,
the CPU starts reset exception handling if the RES pin is driven high.
6.3
Operating Frequency in Active Mode
Operation in active mode is clocked at the frequency designated by the MA2, MA1, and MA0 bits
in SYSCR2. The operating frequency changes to the set frequency after SLEEP instruction
execution.
6.4
Direct Transition
The CPU can execute programs in two modes: active and subactive modes. A direct transition is a
transition between these two modes without stopping program execution. A direct transition can
be made by executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. The direct
transition also enables operating frequency modification in active or subactive mode. After the
mode transition, direct transition interrupt exception handling starts.
If the direct transition interrupt is disabled in interrupt enable register 1, a transition is made
instead to sleep or subsleep mode. Note that if a direct transition is attempted while the I bit in
CCR is set to 1, sleep or subsleep mode will be entered, and the resulting mode cannot be cleared
by means of an interrupt.
6.4.1
Direct Transition from Active Mode to Subactive Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (1).
Direct transition time = {(number of SLEEP instruction execution states) + (number of internal
processing states)}× (tcyc before transition) + (number of interrupt exception handling states) ×
(tsubcyc after transition) (1)
Example
Direct transition time = (2 + 1) × tosc + 14 × 8tw = 3tosc + 112tw
(when the CPU operating clock of φosc → φw/8 is selected)
Rev. 3.00, 05/03, page 85 of 472
Legend
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
6.4.2
Direct Transition from Subactive Mode to Active Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (2).
Direct transition time = {(number of SLEEP instruction execution states) + (number of internal
processing states)} × (tsubcyc before transition) + {(waiting time set in bits STS2 to STS0) +
(number of interrupt exception handling states)} × (tcyc after transition)
(2)
Example
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × tosc = 24tw + 8206tosc
(when the CPU operating clock of φw/8 → φosc and a waiting time of 8192 states are selected)
Legend
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
6.5
Module Standby Function
The module-standby function can be set to any peripheral module. In module standby mode, the
clock supply to modules stops to enter the power-down mode. Module standby mode enables each
on-chip peripheral module to enter the standby state by setting a bit that corresponds to each
module to 1 and cancels the mode by clearing the bit to 0.
Rev. 3.00, 05/03, page 86 of 472
Section 7 ROM
The features of the 56-kbyte or 32-kbyte flash memories built into the flash memory (F-ZTAT)
version are summarized below.
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erase is performed in single-block
units. The flash memory is configured as follows: 1 kbyte × 4 blocks, 28 kbytes × 1 block,
16 kbytes × 1 block, and 8 kbytes × 1 block for H8/3687F and 1 kbyte × 4 blocks and 28
kbytes × 1 block for H8/3684F. To erase the entire flash memory, each block must be
erased in turn.
• Reprogramming capability
The flash memory can be reprogrammed up to 1,000 times.
• On-board programming
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user
program mode, individual blocks can be erased or programmed.
• Programmer mode
Flash memory can be programmed/erased in programmer mode using a PROM
programmer, as well as in on-board programming mode.
• Automatic bit rate adjustment
For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match
the transfer bit rate of the host.
• Programming/erasing protection
Sets software protection against flash memory programming/erasing.
• Power-down mode
Operation of the power supply circuit can be partly halted in subactive mode. As a result,
flash memory can be read with low power consumption.
7.1
Block Configuration
Figure 7.1 shows the block configuration of flash memory. The thick lines indicate erasing units,
the narrow lines indicate programming units, and the values are addresses. The 56-kbyte flash
memory is divided into 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes × 1 block, and 8 kbytes
× 1 block. The 32-kbyte flash memory is divided into 1 kbyte × 4 blocks and 28 kbytes × 1 blocks.
Erasing is performed in these units. Programming is performed in 128-byte units starting from an
address with lower eight bits H'00 or H'80.
ROM3560A_000120030300
Rev. 3.00, 05/03, page 87 of 472
Erase unit
H'0000
H'0001
H'0002
H'0080
H'0081
H'0082
H'00FF
H'0380
H'0381
H'0382
H'03FF
H'0400
H'0401
H'0402
H'0480
H'0481
H'0481
H'0780
H'0781
H'0782
H'0800
H'0801
H'0802
H'0880
H'0881
H'0882
H'0B80
H'0B81
H'0B82
H'0C00
H'0C01
H'0C02
H'0C80
H'0C81
H'0C82
H'0F80
H'0F81
H'0F82
H'1000
H'1001
H'1002
H'1080
H'1081
H'1082
H'7F80
H'7F81
H'7F82
H'8000
H'8001
H'8002
H'8080
H'8081
H'8082
H'BF80
H'BF81
H'BF82
H'C000
H'C001
H'C002
H'C080
H'C081
H'C082
H'C0FF
HDF80
H'DF81
H'DF82
H'DFFF
Programming unit: 128 bytes
H'007F
1 kbyte
Erase unit
Programming unit: 128 bytes
H'047F
H'04FF
1 kbyte
Erase unit
H'07FF
Programming unit: 128 bytes
H'087F
H'08FF
1 kbyte
Erase unit
H'0BFF
Programming unit: 128 bytes
H'0C7F
H'0CFF
1 kbyte
Erase unit
H'0FFF
Programming unit: 128 bytes
H'107F
H'10FF
28 kbytes
Erase unit
H'7FFF
Programming unit: 128 bytes
H'807F
H'80FF
16 kbytes
Erase unit
H'BFFF
Programming unit: 128 bytes
H'C07F
8 kbytes
Figure 7.1 Flash Memory Block Configuration
Rev. 3.00, 05/03, page 88 of 472
7.2
Register Descriptions
The flash memory has the following registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Flash memory power control register (FLPWCR)
• Flash memory enable register (FENR)
7.2.1
Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash
Memory Programming/Erasing.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
SWE
0
R/W
Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is cleared
to 0, other FLMCR1 register bits and all EBR1 bits cannot
be set.
5
ESU
0
R/W
Erase Setup
When this bit is set to 1, the flash memory changes to the
erase setup state. When it is cleared to 0, the erase
setup state is cancelled. Set this bit to 1 before setting the
E bit to 1 in FLMCR1.
4
PSU
0
R/W
Program Setup
When this bit is set to 1, the flash memory changes to the
program setup state. When it is cleared to 0, the program
setup state is cancelled. Set this bit to 1 before setting
the P bit in FLMCR1.
3
EV
0
R/W
Erase-Verify
When this bit is set to 1, the flash memory changes to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
Rev.3.00, 05/03, page 89 of 472
Bit
Bit Name
Initial
Value
R/W
Description
2
PV
0
R/W
Program-Verify
When this bit is set to 1, the flash memory changes to
program-verify mode. When it is cleared to 0, programverify mode is cancelled.
1
E
0
R/W
Erase
When this bit is set to 1 while SWE=1 and ESU=1, the
flash memory changes to erase mode. When it is cleared
to 0, erase mode is cancelled.
0
P
0
R/W
Program
When this bit is set to 1 while SWE=1 and PSU=1, the
flash memory changes to program mode. When it is
cleared to 0, program mode is cancelled.
7.2.2
Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLER
0
R
Flash Memory Error
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When FLER
is set to 1, flash memory goes to the error-protection
state.
See section 7.5.3, Error Protection, for details.
6 to 0
All 0
Reserved
These bits are always read as 0.
Rev. 3.00, 05/03, page 90 of 472
7.2.3
Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to
be automatically cleared to 0.
Bit
Bit Name
Initial
Value
R/W
Description
7
0
Reserved
This bit is always read as 0.
6
EB6
0
R/W
When this bit is set to 1, 8 bytes of H'C000 to H'DFFF will
be erased.
5
EB5
0
R/W
When this bit is set to 1, 16 bytes of H'8000 to H'BFFF
will be erased.
4
EB4
0
R/W
When this bit is set to 1, 28 kbytes of H'1000 to H'7FFF
will be erased.
3
EB3
0
R/W
When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF will
be erased.
2
EB2
0
R/W
When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF will
be erased.
1
EB1
0
R/W
When this bit is set to 1, 1 kbyte of H'0400 to H'07FF will
be erased.
0
EB0
0
R/W
When this bit is set to 1, 1 kbyte of H'0000 to H'03FF will
be erased.
Rev.3.00, 05/03, page 91 of 472
7.2.4
Flash Memory Power Control Register (FLPWCR)
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI
switches to subactive mode. There are two modes: mode in which operation of the power supply
circuit of flash memory is partly halted in power-down mode and flash memory can be read, and
mode in which even if a transition is made to subactive mode, operation of the power supply
circuit of flash memory is retained and flash memory can be read.
Bit
Bit Name
Initial
Value
R/W
Description
7
PDWND
0
R/W
Power-Down Disable
When this bit is 0 and a transition is made to subactive
mode, the flash memory enters the power-down mode.
When this bit is 1, the flash memory remains in the
normal mode even after a transition is made to subactive
mode.
6 to 0
All 0
Reserved
These bits are always read as 0.
7.2.5
Flash Memory Enable Register (FENR)
Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers,
FLMCR1, FLMCR2, EBR1, and FLPWCR.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLSHE
0
R/W
Flash Memory Control Register Enable
Flash memory control registers can be accessed when
this bit is set to 1. Flash memory control registers cannot
be accessed when this bit is set to 0.
6 to 0
All 0
Reserved
These bits are always read as 0.
Rev. 3.00, 05/03, page 92 of 472
7.3
On-Board Programming Modes
There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed
with a PROM programmer. On-board programming/erasing can also be performed in user
program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST
pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level
of each pin must be defined four states before the reset ends.
When changing to boot mode, the boot program built into this LSI is initiated. The boot program
transfers the programming control program from the externally-connected host to on-chip RAM
via SCI3. After erasing the entire flash memory, the programming control program is executed.
This can be used for programming initial values in the on-board state or for a forcible return when
programming/erasing can no longer be done in user program mode. In user program mode,
individual blocks can be erased and programmed by branching to the user program/erase control
program prepared by the user.
Table 7.1
Setting Programming Modes
TEST
NMI
P85
PB0
PB1
PB2
LSI State after Reset End
0
1
X
X
X
X
User Mode
0
0
1
X
X
X
Boot Mode
1
X
X
0
0
0
Programmer Mode
Legend: X : Don’t care.
7.3.1
Boot Mode
Table 7.2 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 7.4, Flash Memory Programming/Erasing.
2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop
bit, and no parity.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that
of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
Rev.3.00, 05/03, page 93 of 472
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit
rate and system clock frequency of this LSI within the ranges listed in table 7.3.
5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to
H'FEEF is the area to which the programming control program is transferred from the host.
The boot program area cannot be used until the execution state in boot mode switches to the
programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer
of program data or verify data with the host. The TxD pin is high (PCR22 = 1, P22 = 1). The
contents of the CPU general registers are undefined immediately after branching to the
programming control program. These registers must be initialized at the beginning of the
programming control program, as the stack pointer (SP), in particular, is used implicitly in
subroutine calls, etc.
7. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at
least 20 states, and then setting the NMI pin. Boot mode is also cleared when a WDT overflow
occurs.
8.
Do not change the TEST pin and NMI pin input levels in boot mode.
Rev. 3.00, 05/03, page 94 of 472
Boot Mode Operation
Host Operation
Communication Contents
Processing Contents
Transfer of number of bytes of
programming control program
Flash memory erase
Bit rate adjustment
Boot mode initiation
Item
Table 7.2
LSI Operation
Processing Contents
Branches to boot program at reset-start.
Boot program initiation
Continuously transmits data H'00
at specified bit rate.
Transmits data H'55 when data H'00
is received error-free.
H'00, H'00 . . . H'00
H'00
H'55
Boot program
erase error
H'AA reception
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte)
Transmits 1-byte of programming
control program (repeated for N times)
H'AA reception
H'FF
H'AA
Upper bytes, lower bytes
Echoback
H'XX
Echoback
H'AA
• Measures low-level period of receive data
H'00.
• Calculates bit rate and sets BRR in SCI3.
• Transmits data H'00 to host as adjustment
end indication.
H'55 reception.
Checks flash memory data, erases all flash
memory blocks in case of written data
existing, and transmits data H'AA to host.
(If erase could not be done, transmits data
H'FF to host and aborts operation.)
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transmits data H'AA to host.
Branches to programming control program
transferred to on-chip RAM and starts
execution.
Rev.3.00, 05/03, page 95 of 472
Table 7.3
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible
Host Bit Rate
System Clock Frequency Range of LSI
19,200 bps
16 to 20 MHz
9,600 bps
8 to 16 MHz
4,800 bps
4 to 16 MHz
2,400 bps
2 to 16 MHz
7.3.2
Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the user program/erase control program or a program that provides the user program/erase
control program from external memory. As the flash memory itself cannot be read during
programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot
mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode.
Prepare a user program/erase control program in accordance with the description in section 7.4,
Flash Memory Programming/Erasing.
Reset-start
No
Program/erase?
Yes
Transfer user program/erase control
program to RAM
Branch to flash memory application
program
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode
Rev. 3.00, 05/03, page 96 of 472
7.4
Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2,
Erase/Erase-Verify, respectively.
7.4.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 7.3 should be followed. Performing programming operations according to this flowchart
will enable data or programs to be written to the flash memory without subjecting the chip to
voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation according to table 7.4, and additional programming data
computation according to table 7.5.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately 6.6 ms is allowed.
7.
For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2
bits are B'00. Verify data can be read in words or in longwords from the address to which a
dummy write was performed.
8.
The maximum number of repetitions of the program/program-verify sequence of the same bit
is 1,000.
Rev.3.00, 05/03, page 97 of 472
Write pulse application subroutine
START
Apply Write Pulse
Set SWE bit in FLMCR1
WDT enable
Wait 1 µs
Set PSU bit in FLMCR1
Store 128-byte program data in program
data area and reprogram data area
*
Wait 50 µs
n= 1
Set P bit in FLMCR1
m= 0
Wait (Wait time=programming time)
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Clear P bit in FLMCR1
Wait 5 µs
Apply Write pulse
Clear PSU bit in FLMCR1
Set PV bit in FLMCR1
Wait 4 µs
Wait 5 µs
Disable WDT
Set block start address as
verify address
End Sub
H'FF dummy write to verify address
n←n+1
Wait 2 µs
*
Read verify data
Increment address
No
Verify data =
write data?
m=1
Yes
n≤6?
No
Yes
Additional-programming data computation
Reprogram data computation
No
128-byte
data verification completed?
Yes
Clear PV bit in FLMCR1
Wait 2 µs
n ≤ 6?
No
Yes
Successively write 128-byte data from additionalprogramming data area in RAM to flash memory
Sub-Routine-Call
Apply Write Pulse
m= 0 ?
Yes
Clear SWE bit in FLMCR1
No
n ≤ 1000 ?
Wait 100 µs
Wait 100 µs
End of programming
Programming failure
Note: *The RTS instruction must not be used during the following 1. and 2. periods.
1. A period between 128-byte data programming to flash memory and the P bit clearing
2. A period between dummy writing of H'FF to a verify address and verify data reading
Figure 7.3 Program/Program-Verify Flowchart
Rev. 3.00, 05/03, page 98 of 472
Yes
No
Clear SWE bit in FLMCR1
Table 7.4
Reprogram Data Computation Table
Program Data
Verify Data
Reprogram Data
Comments
0
0
1
Programming completed
0
1
0
Reprogram bit
1
0
1
1
1
1
Remains in erased state
Table 7.5
Additional-Program Data Computation Table
Reprogram Data
Verify Data
Additional-Program
Data
Comments
0
0
0
Additional-program bit
0
1
1
No additional programming
1
0
1
No additional programming
1
1
1
No additional programming
n
Programming
(Number of Writes) Time
In Additional
Programming
Comments
1 to 6
30
10
7 to 1,000
200
Table 7.6
Programming Time
Note: Time shown in µs.
7.4.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register (EBR1). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An
overflow cycle of approximately 19.8 ms is allowed.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two
bits are B'00. Verify data can be read in longwords from the address to which a dummy write
was performed.
Rev.3.00, 05/03, page 99 of 472
6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is 100.
7.4.3
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed
or erased, or while the boot program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
Rev. 3.00, 05/03, page 100 of 472
Erase start
SWE bit ← 1
Wait 1 µs
n←1
Set EBR1
Enable WDT
ESU bit ← 1
Wait 100 µs
E bit ← 1
Wait 10 µs
E bit ← 0
Wait 10 µs
ESU bit ← 10
10 µs
Disable WDT
EV bit ← 1
Wait 20 µs
Set block start address as verify address
H'FF dummy write to verify address
Wait 2 µs
*
n←n+1
Read verify data
No
Verify data + all 1s ?
Increment address
Yes
No
Last address of block ?
Yes
No
EV bit ← 0
EV bit ← 0
Wait 4 µs
Wait 4µs
All erase block erased ?
n ≤100 ?
Yes
Yes
No
Yes
SWE bit ← 0
SWE bit ← 0
Wait 100 µs
Wait 100 µs
End of erasing
Erase failure
Note: *The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading.
Figure 7.4 Erase/Erase-Verify Flowchart
Rev.3.00, 05/03, page 101 of 472
7.5
Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
7.5.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset, subactive mode, subsleep mode, or standby
mode. Flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2),
and erase block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of
a reset during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
7.5.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit
in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to
H'00, erase protection is set for all blocks.
7.5.3
Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase
operation prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling excluding a reset during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode
is aborted at the point at which the error occurred. Program mode or erase mode cannot be reentered by re-setting the P or E bit. However, PV and EV bit settings are retained, and a transition
can be made to verify mode. Error protection can be cleared only by a reset.
Rev. 3.00, 05/03, page 102 of 472
7.6
Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a
socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU
device type with the on-chip 64-kbyte flash memory (FZTAT64V5).
7.7
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to at high speed.
• Power-down operating mode
The power supply circuit of flash memory can be partly halted. As a result, flash memory can
be read with low power consumption.
• Standby mode
All flash memory circuits are halted.
Table 7.7 shows the correspondence between the operating modes of this LSI and the flash
memory. In subactive mode, the flash memory can be set to operate in power-down mode with the
PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from
power-down mode or standby mode, a period to stabilize operation of the power supply circuits
that were stopped is needed. When the flash memory returns to its normal operating state, bits
STS2 to STS0 in SYSCR1 must be set to provide a wait time of at least 20 µs, even when the
external clock is being used.
Table 7.7
Flash Memory Operating States
Flash Memory Operating State
LSI Operating State
PDWND = 0 (Initial Value)
PDWND = 1
Active mode
Normal operating mode
Normal operating mode
Subactive mode
Power-down mode
Normal operating mode
Sleep mode
Normal operating mode
Normal operating mode
Subsleep mode
Standby mode
Standby mode
Standby mode
Standby mode
Standby mode
Rev.3.00, 05/03, page 103 of 472
Rev. 3.00, 05/03, page 104 of 472
Section 8 RAM
This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus, enabling two-state access by the CPU to both byte data and word data.
Product Classification
Flash memory version
TM
(F-ZTAT
version)
Mask-ROM version
EEPROM
laminated
version
Flash
memory
version
Mask-ROM
version
RAM Size RAM Address
H8/3687F
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
H8/3684F
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
H8/3687
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3686
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3685
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3684
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3683
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3682
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
H8/3687N
4 kbytes
H'E800 to H'EFFF, H'F780 to H'FF7F*
3 kbytes
H'E800 to H'EFFF, H'FB80 to H'FF7F
Note: * When the E10T is used, area H'F780 to H'FB7F must not be accessed.
RAM0500A_000120030300
Rev. 3.00, 05/03, page 105 of 472
Rev. 3.00, 05/03, page 106 of 472
Section 9 I/O Ports
The group of this LSI has forty-five general I/O ports (forty-three general I/O ports in the
H8/3687N) and eight general input-only ports. Port 6 is a large current port, which can drive 20
mA (@VOL = 1.5 V) when a low level signal is output. Any of these ports can become an input
port immediately after a reset. They can also be used as I/O pins of the on-chip peripheral modules
or external interrupt input pins, and these functions can be switched depending on the register
settings. The registers for selecting these functions can be divided into two types: those included
in I/O ports and those included in each on-chip peripheral module. General I/O ports are
comprised of the port control register for controlling inputs/outputs and the port data register for
storing output data and can select inputs/outputs in bit units.
For functions in each port, see appendix B.1, I/O Port Block Diagrams. For the execution of bitmanipulation instructions to the port control register and port data register, see section 2.8.3, Bit
Manipulation Instruction.
9.1
Port 1
Port 1 is a general I/O port also functioning as IRQ interrupt input pins, an RTC output pin, a 14bit PWM output pin, a timer B1 input pin, and a timer V input pin. Figure 9.1 shows its pin
configuration.
P17/
/TRGV
P16/
P15/
Port 1
/TMIB1
P14/
P12
P11/PWM
P10/TMOW
Figure 9.1 Port 1 Pin Configuration
Port 1 has the following registers.
• Port mode register 1 (PMR1)
• Port control register 1 (PCR1)
• Port data register 1 (PDR1)
• Port pull-up control register 1 (PUCR1)
Rev. 3.00, 05/03, page 107 of 472
9.1.1
Port Mode Register 1 (PMR1)
PMR1 switches the functions of pins in port 1 and port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7
IRQ3
0
R/W
This bit selects the function of pin P17/IRQ3/TRGV.
0: General I/O port
1: IRQ3/TRGV input pin
6
IRQ2
0
R/W
This bit selects the function of pin P16/IRQ2.
0: General I/O port
1: IRQ2 input pin
5
IRQ1
0
R/W
This bit selects the function of pin P15/IRQ1/TMIB1.
0: General I/O port
1: IRQ1/TMIB1 input pin
4
IRQ0
0
R/W
This bit selects the function of pin P14/IRQ0.
0: General I/O port
1: IRQ0 input pin
3
TXD2
0
R/W
This bit selects the function of pin P72/TXD_2.
0: General I/O port
1: TXD_2 output pin
2
PWM
0
R/W
This bit selects the function of pin P11/PWM.
0: General I/O port
1: PWM output pin
1
TXD
0
R/W
This bit selects the function of pin P22/TXD.
0: General I/O port
1: TXD output pin
0
TMOW
0
R/W
This bit selects the function of pin P10/TMOW.
0: General I/O port
1: TMOW output pin
Rev. 3.00, 05/03, page 108 of 464
9.1.2
Port Control Register 1 (PCR1)
PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR17
0
W
6
PCR16
0
W
5
PCR15
0
W
When the corresponding pin is designated in PMR1 as a
general I/O pin, setting a PCR1 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR14
0
W
Bit 3 is a reserved bit.
3
2
PCR12
0
W
1
PCR11
0
W
0
PCR10
0
W
9.1.3
Port Data Register 1 (PDR1)
PDR1 is a general I/O port data register of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7
P17
0
R/W
PDR1 stores output data for port 1 pins.
6
P16
0
R/W
5
P15
0
R/W
4
P14
0
R/W
If PDR1 is read while PCR1 bits are set to 1, the value
stored in PDR1 are read. If PDR1 is read while PCR1 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR1.
3
1
Bit 3 is a reserved bit. This bit is always read as 1.
2
P12
0
R/W
1
P11
0
R/W
0
P10
0
R/W
Rev. 3.00, 05/03, page 109 of 472
9.1.4
Port Pull-Up Control Register 1 (PUCR1)
PUCR1 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit
Bit Name
Initial
Value
R/W
Description
7
PUCR17
0
R/W
6
PUCR16
0
R/W
5
PUCR15
0
R/W
Only bits for which PCR1 is cleared are valid. The pull-up
MOS of P17 to P14 and P12 to P10 pins enter the onstate when these bits are set to 1, while they enter the
off-state when these bits are cleared to 0.
4
PUCR14
0
R/W
Bit 3 is a reserved bit. This bit is always read as 1.
3
1
2
PUCR12
0
R/W
1
PUCR11
0
R/W
0
PUCR10
0
R/W
9.1.5
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P17/IRQ3
IRQ3/TRGV
pin
IRQ3
Register
PMR1
PCR1
Bit Name
IRQ3
PCR17
Pin Function
Setting value
0
0
P17 input pin
1
P17 output pin
X
IRQ3 input/TRGV input pin
1
Legend X: Don't care.
P16/IRQ2
IRQ2 pin
Register
PMR1
PCR1
Bit Name
IRQ2
PCR16
Pin Function
Setting value
0
0
P16 input pin
1
P16 output pin
X
IRQ2 input pin
1
Legend X: Don't care.
Rev. 3.00, 05/03, page 110 of 464
P15/IRQ1
IRQ1/TMIB1
pin
IRQ1
Register
PMR1
PCR1
Bit Name
IRQ1
PCR15
Pin Function
Setting value
0
0
P15 input pin
1
P15 output pin
1
X
IRQ1 input/TMIB1 input pin
Legend X: Don't care.
P14/IRQ0
IRQ0 pin
Register
PMR1
PCR1
Bit Name
IRQ0
PCR14
Pin Function
Setting value
0
0
P14 input pin
1
P14 output pin
X
IRQ0 input pin
1
Legend X: Don't care.
P12 pin
Register
PCR1
Bit Name
PCR12
Pin Function
Setting value
0
P12 input pin
1
P12 output pin
Rev. 3.00, 05/03, page 111 of 472
P11/PWM pin
Register
PMR1
PCR1
Bit Name
PWM
PCR11
Pin Function
Setting value
0
0
P11 input pin
1
P11 output pin
1
X
PWM output pin
Legend X: Don't care.
P10/TMOW pin
Register
PMR1
PCR1
Bit Name
TMOW
PCR10
Pin Function
Setting value
0
0
P10 input pin
1
P10 output pin
X
TMOW output pin
1
Legend X: Don't care.
Rev. 3.00, 05/03, page 112 of 464
9.2
Port 2
Port 2 is a general I/O port also functioning as SCI3 I/O pins. Each pin of the port 2 is shown in
figure 9.2. The register settings of PMR1and SCI3 have priority for functions of the pins for both
uses.
P24
P23
Port 2
P22/TXD
P21/RXD
P20/SCK3
Figure 9.2 Port 2 Pin Configuration
Port 2 has the following registers.
• Port control register 2 (PCR2)
• Port data register 2 (PDR2)
• Port mode register 3 (PMR3)
9.2.1
Port Control Register 2 (PCR2)
PCR2 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
Reserved
4
PCR24
0
W
3
PCR23
0
W
2
PCR22
0
W
When each of the port 2 pins P24 to P20 functions as a
general I/O port, setting a PCR2 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
1
PCR21
0
W
0
PCR20
0
W
Rev. 3.00, 05/03, page 113 of 472
9.2.2
Port Data Register 2 (PDR2)
PDR2 is a general I/O port data register of port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 1
Reserved
These bits are always read as 1.
4
P24
0
R/W
PDR2 stores output data for port 2 pins.
3
P23
0
R/W
2
P22
0
R/W
1
P21
0
R/W
If PDR2 is read while PCR2 bits are set to 1, the value
stored in PDR2 is read. If PDR2 is read while PCR2 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR2.
0
P20
0
R/W
9.2.3
Port Mode Register 3 (PMR3)
PMR3 selects the CMOS output or NMOS open-drain output for port 2.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 0
Reserved
These bits are always read as 0.
4
POF24
0
R/W
3
POF23
0
R/W
When the bit is set to 1, the corresponding pin is cut off
by PMOS and it functions as the NMOS open-drain
output. When cleared to 0, the pin functions as the CMOS
output.
2 to 0
All 1
Reserved
These bits are always read as 1.
9.2.4
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P24 pin
Register
PCR2
Bit Name
PCR24
Pin Function
Setting Value
0
P24 input pin
1
P24 output pin
Rev. 3.00, 05/03, page 114 of 464
P23 pin
Register
PCR2
Bit Name
PCR23
Pin Function
Setting Value
0
P23 input pin
1
P23 output pin
Register
PMR1
PCR2
Bit Name
TXD
PCR22
Pin Function
Setting Value
0
0
P22 input pin
1
P22 output pin
X
TXD output pin
P22/TXD pin
1
Legend X: Don't care.
P21/RXD pin
Register
SCR3
PCR2
Bit Name
RE
PCR21
Setting Value
0
1
Pin Function
0
P21 input pin
1
P21 output pin
X
RXD input pin
Legend X: Don't care.
P20/SCK3 pin
Register
SCR3
Bit Name
CKE1
Setting Value
0
SMR
PCR2
CKE0
COM
PCR20
Pin Function
0
0
0
P20 input pin
1
P20 output pin
0
0
1
X
SCK3 output pin
0
1
X
X
SCK3 output pin
1
X
X
X
SCK3 input pin
Legend X: Don't care.
Rev. 3.00, 05/03, page 115 of 472
9.3
Port 3
Port 3 is a general I/O port. Each pin of the port 3 is shown in figure 9.3.
P37
P36
P35
P34
Port 3
P33
P32
P31
P30
Figure 9.3 Port 3 Pin Configuration
Port 3 has the following registers.
• Port control register 3 (PCR3)
• Port data register 3 (PDR3)
9.3.1
Port Control Register 3 (PCR3)
PCR3 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR37
0
W
6
PCR36
0
W
5
PCR35
0
W
Setting a PCR3 bit to 1 makes the corresponding pin an
output port, while clearing the bit to 0 makes the pin an
input port.
4
PCR34
0
W
3
PCR33
0
W
2
PCR32
0
W
1
PCR31
0
W
0
PCR30
0
W
Rev. 3.00, 05/03, page 116 of 464
9.3.2
Port Data Register 3 (PDR3)
PDR3 is a general I/O port data register of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
P37
0
R/W
PDR3 stores output data for port 3 pins.
6
P36
0
R/W
5
P35
0
R/W
4
P34
0
R/W
If PDR3 is read while PCR3 bits are set to 1, the value
stored in PDR3 is read. If PDR3 is read while PCR3 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR3.
3
P33
0
R/W
2
P32
0
R/W
1
P31
0
R/W
0
P30
0
R/W
9.3.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P37 pin
Register
PCR3
Bit Name
PCR37
Pin Function
Setting Value
0
P37 input pin
1
P37 output pin
P36 pin
Register
PCR3
Bit Name
PCR36
Pin Function
Setting Value
0
P36 input pin
1
P36 output pin
Rev. 3.00, 05/03, page 117 of 472
P35 pin
Register
PCR3
Bit Name
PCR35
Pin Function
Setting Value
0
P35 input pin
1
P35 output pin
P34 pin
Register
PCR3
Bit Name
PCR34
Pin Function
Setting Value
0
P34 input pin
1
P34 output pin
P33 pin
Register
PCR3
Bit Name
PCR33
Pin Function
Setting Value
0
P33 input pin
1
P33 output pin
P32 pin
Register
PCR3
Bit Name
PCR32
Pin Function
Setting Value
0
P32 input pin
1
P32 output pin
P31 pin
Register
PCR3
Bit Name
PCR31
Pin Function
Setting Value
0
P31 input pin
1
P31 output pin
Rev. 3.00, 05/03, page 118 of 464
P30 pin
Register
PCR3
Bit Name
PCR30
Pin Function
Setting Value
0
P30 input pin
1
P30 output pin
9.4
Port 5
Port 5 is a general I/O port also functioning as an I2C bus interface I/O pin, an A/D trigger input
pin, and wakeup interrupt input pin. Each pin of the port 5 is shown in figure 9.4. The register
setting of the I2C bus interface register has priority for functions of the pins P57/SCL and
P56/SDA. Since the output buffer for pins P56 and P57 has the NMOS push-pull structure, it
differs from an output buffer with the CMOS structure in the high-level output characteristics (see
section 23, Electrical Characteristics).
H8/3687
H8/3687N
P57/SCL
SCL
P56/SDA
P55/
Port 5
SDA
P55/
/
P54/
/
P54/
Port 5
P53/
P53/
P52/
P52/
P51/
P51/
P50/
P50/
Figure 9.4 Port 5 Pin Configuration
Port 5 has the following registers.
• Port mode register 5 (PMR5)
• Port control register 5 (PCR5)
• Port data register 5 (PDR5)
• Port pull-up control register 5 (PUCR5)
Rev. 3.00, 05/03, page 119 of 472
9.4.1
Port Mode Register 5 (PMR5)
PMR5 switches the functions of pins in port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
POF57
0
R/W
6
POF56
0
R/W
When the bit is set to 1, the corresponding pin is cut off
by PMOS and it functions as the NMOS open-drain
output. When cleared to 0, the pin functions as the CMOS
output.
5
WKP5
0
R/W
This bit selects the function of pin P55/WKP5/ADTRG.
0: General I/O port
1: WKP5/ADTRG input pin
4
WKP4
0
R/W
This bit selects the function of pin P54/WKP4.
0: General I/O port
1: WKP4 input pin
3
WKP3
0
R/W
This bit selects the function of pin P53/WKP3.
0: General I/O port
1: WKP3 input pin
2
WKP2
0
R/W
This bit selects the function of pin P52/WKP2.
0: General I/O port
1: WKP2 input pin
1
WKP1
0
R/W
This bit selects the function of pin P51/WKP1.
0: General I/O port
1: WKP1 input pin
0
WKP0
0
R/W
This bit selects the function of pin P50/WKP0.
0: General I/O port
1: WKP0 input pin
Rev. 3.00, 05/03, page 120 of 464
9.4.2
Port Control Register 5 (PCR5)
PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR57
0
W
6
PCR56
0
W
5
PCR55
0
W
When each of the port 5 pins P57 to P50 functions as a
general I/O port, setting a PCR5 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR54
0
W
3
PCR53
0
W
2
PCR52
0
W
1
PCR51
0
W
0
PCR50
0
W
9.4.3
Port Data Register 5 (PDR5)
Note: The PCR57 and PCR56 bits should not be set to 1
in the H8/3687N.
PDR5 is a general I/O port data register of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
P57
0
R/W
Stores output data for port 5 pins.
6
P56
0
R/W
5
P55
0
R/W
4
P54
0
R/W
If PDR5 is read while PCR5 bits are set to 1, the value
stored in PDR5 are read. If PDR5 is read while PCR5 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR5.
3
P53
0
R/W
2
P52
0
R/W
1
P51
0
R/W
0
P50
0
R/W
Note: The P57 and P56 bits should not be set to 1 in the
H8/3687N.
Rev. 3.00, 05/03, page 121 of 472
9.4.4
Port Pull-Up Control Register 5 (PUCR5)
PUCR5 controls the pull-up MOS in bit units of the pins set as the input ports.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
All 0
Reserved
These bits are always read as 0.
5
PUCR55
0
R/W
4
PUCR54
0
R/W
3
PUCR53
0
R/W
2
PUCR52
0
R/W
1
PUCR51
0
R/W
0
PUCR50
0
R/W
9.4.5
Pin Functions
Only bits for which PCR5 is cleared are valid. The pull-up
MOS of the corresponding pins enter the on-state when
these bits are set to 1, while they enter the off-state when
these bits are cleared to 0.
The correspondence between the register specification and the port functions is shown below.
P57/SCL pin
Register
ICCR1
PCR5
Bit Name
ICE
PCR57
Setting Value
0
1
Pin Function
0
P57 input pin
1
P57 output pin
X
SCL I/O pin
Legend X: Don't care.
SCL performs the NMOS open-drain output, that enables a direct bus drive.
P56/SDA pin
Register
ICCR1
PCR5
Bit Name
ICE
PCR56
Pin Function
Setting Value
0
0
P56 input pin
1
P56 output pin
X
SDA I/O pin
1
Legend X: Don't care.
Rev. 3.00, 05/03, page 122 of 464
SDA performs the NMOS open-drain output, that enables a direct bus drive.
P55/WKP5
WKP5/ADTRG
WKP5 ADTRG pin
Register
PMR5
PCR5
Bit Name
WKP5
PCR55
Pin Function
Setting Value
0
0
P55 input pin
1
P55 output pin
X
WKP5/ADTRG input pin
1
Legend X: Don't care.
P54/WKP4
WKP4 pin
Register
PMR5
PCR5
Bit Name
WKP4
PCR54
Pin Function
Setting Value
0
0
P54 input pin
1
P54 output pin
X
WKP4 input pin
1
Legend X: Don't care.
P53/WKP3
WKP3 pin
Register
PMR5
PCR5
Bit Name
WKP3
PCR53
Pin Function
Setting Value
0
0
P53 input pin
1
P53 output pin
X
WKP3 input pin
1
Legend X: Don't care.
P52/WKP2
WKP2 pin
Register
PMR5
PCR5
Bit Name
WKP2
PCR52
Pin Function
Setting Value
0
0
P52 input pin
1
P52 output pin
X
WKP2 input pin
1
Legend X: Don't care.
Rev. 3.00, 05/03, page 123 of 472
P51/WKP1
WKP1 pin
Register
PMR5
PCR5
Bit Name
WKP1
PCR51
Pin Function
Setting Value
0
0
P51 input pin
1
P51 output pin
1
X
WKP1 input pin
Legend X: Don't care.
P50/WKP0
WKP0 pin
Register
PMR5
PCR5
Bit Name
WKP0
PCR50
Pin Function
Setting Value
0
0
P50 input pin
1
P50 output pin
X
WKP0 input pin
1
Legend X: Don't care.
Rev. 3.00, 05/03, page 124 of 464
9.5
Port 6
Port 6 is a general I/O port also functioning as a timer Z I/O pin. Each pin of the port 6 is shown in
figure 9.5. The register setting of the timer Z has priority for functions of the pins for both uses.
P67/FTIOD1
P66/FTIOC1
P65/FTIOB1
P64/FTIOA1
Port 6
P63/FTIOD0
P62/FTIOC0
P61/FTIOB0
P60/FTIOA0
Figure 9.5 Port 6 Pin Configuration
Port 6 has the following registers.
• Port control register 6 (PCR6)
• Port data register 6 (PDR6)
9.5.1
Port Control Register 6 (PCR6)
PCR6 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR67
0
W
6
PCR66
0
W
5
PCR65
0
W
When each of the port 6 pins P67 to P60 functions as a
general I/O port, setting a PCR6 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4
PCR64
0
W
3
PCR63
0
W
2
PCR62
0
W
1
PCR61
0
W
0
PCR60
0
W
Rev. 3.00, 05/03, page 125 of 472
9.5.2
Port Data Register 6 (PDR6)
PDR6 is a general I/O port data register of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
P67
0
R/W
Stores output data for port 6 pins.
6
P66
0
R/W
5
P65
0
R/W
4
P64
0
R/W
If PDR6 is read while PCR6 bits are set to 1, the value
stored in PDR6 are read. If PDR6 is read while PCR6 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR6.
3
P63
0
R/W
2
P62
0
R/W
1
P61
0
R/W
0
P60
0
R/W
9.5.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P67/FTIOD1 pin
Register
TOER
TFCR
Bit Name
ED1
CMD1 and
IOD2 to
CMD0
PWMD1 IOD0
PCR67
Pin Function
00
0
P67 input/FTIOD1 input pin
1
P67 output pin
X
FTIOD1 output pin
Setting Value 1
0
00
TPMR
0
TIORC1
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
Legend X: Don't care.
Rev. 3.00, 05/03, page 126 of 464
PCR6
P66/FTIOC1 pin
Register
TOER
TFCR
Bit Name
EC1
IOC2 to
CMD1 and
CMD0
PWMC1 IOC0
PCR66
Pin Function
00
0
P66 input/FTIOC1 input pin
1
P66 output pin
X
FTIOC1 output pin
Setting Value 1
0
00
TPMR
0
TIORC1
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
TIORA1
PCR6
Legend X: Don't care.
P65/FTIOB1 pin
Register
TOER
TFCR
TPMR
Bit Name
EB1
CMD1 to
CMD0
IOB2 to
PWMB1 IOB0
PCR65
Pin Function
00
0
0
P65 input/FTIOB1 input pin
1
P65 output pin
X
FTIOB1 output pin
Setting Value 1
0
00
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
PCR6
Legend X: Don't care.
P64/FTIOA1 pin
Register
TOER
TFCR
TIORA1 PCR6
Bit Name
EB1
CMD1 to
CMD0
IOA2 to
IOA0
PCR64
Pin Function
XX
000 or
0
P64 input/FTIOA1 input pin
1XX
1
P64 output pin
001 or
01X
X
FTIOA1 output pin
Setting Value 1
0
00
Legend X: Don't care.
Rev. 3.00, 05/03, page 127 of 472
P63/FTIOD0 pin
Register
TOER
TFCR
TPMR
Bit Name
ED0
CMD1 to
CMD0
IOD2 to
PWMD0 IOD0
PCR63
Pin Function
00
0
0
P63 input/FTIOD0 input pin
1
P63 output pin
X
FTIOD0 output pin
Setting Value 1
0
00
TIORC0
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
TIORC0
PCR6
Legend X: Don't care.
P62/FTIOC0 pin
Register
TOER
TFCR
TPMR
Bit Name
EC0
CMD1 to
CMD0
IOC2 to
PWMC0 IOC0
PCR62
Pin Function
00
0
0
P62 input/FTIOC0 input pin
1
P62 output pin
X
FTIOC0 output pin
Setting Value 1
0
00
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
Legend X: Don't care.
Rev. 3.00, 05/03, page 128 of 464
PCR6
P61/FTIOB0 pin
Register
TOER
TFCR
TPMR
Bit Name
EB0
CMD1 to
CMD0
IOB2 to
PWMB0 IOB0
PCR61
Pin Function
00
0
0
P61 input/FTIOB0 input pin
1
P61 output pin
X
FTIOB0 output pin
Setting Value 1
0
00
TIORA0
000 or
1XX
0
001 or
01X
1
XXX
Other than X
00
XXX
PCR6
Legend X: Don't care.
P60/FTIOA0 pin
Register
TOER
TFCR
TFCR
TIORA0
PCR6
Bit Name
EA0
CMD1 to
CMD0
STCLK
IOA2 to
IOA0
PCR60
Pin Function
Setting Value 1
XX
X
000 or
0
P60 input/FTIOA0 input pin
1XX
1
P60 output pin
0
00
0
001 or
01X
X
FTIOA0 output pin
Legend X: Don't care.
Rev. 3.00, 05/03, page 129 of 472
9.6
Port 7
Port 7 is a general I/O port also functioning as a timer V I/O pin and SCI3_2 I/O pin. Each pin of
the port 7 is shown in figure 9.6. The register settings of the timer V and SCI3_2 have priority for
functions of the pins for both uses.
P76/TMOV
P75/TMCIV
P74/TMRIV
Port 7
P72/TXD_2
P71/RXD_2
P70/SCK3_2
Figure 9.6 Port 7 Pin Configuration
Port 7 has the following registers.
• Port control register 7 (PCR7)
• Port data register 7 (PDR7)
9.6.1
Port Control Register 7 (PCR7)
PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
6
PCR76
0
W
5
PCR75
0
W
When each of the port 7 pins P76 to P74 and P72 to P70
functions as a general I/O port, setting a PCR7 bit to 1
makes the corresponding pin an output port, while
clearing the bit to 0 makes the pin an input port.
4
PCR74
0
W
Bits 7 and 3 are reserved bits.
3
2
PCR72
0
W
1
PCR71
0
W
0
PCR70
0
W
Rev. 3.00, 05/03, page 130 of 464
9.6.2
Port Data Register 7 (PDR7)
PDR7 is a general I/O port data register of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Stores output data for port 7 pins.
6
P76
0
R/W
5
P75
0
R/W
4
P74
0
R/W
If PDR7 is read while PCR7 bits are set to 1, the value
stored in PDR7 are read. If PDR7 is read while PCR7 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR7.
3
1
2
P72
0
R/W
1
P71
0
R/W
0
P70
0
R/W
9.6.3
Pin Functions
Bits 7 and 3 are reserved bits. These bits are always read
as 1.
The correspondence between the register specification and the port functions is shown below.
P76/TMOV pin
Register
TCSRV
PCR7
Bit Name
OS3 to OS0
PCR76
Pin Function
Setting Value
0000
0
P76 input pin
1
P76 output pin
X
TMOV output pin
Other than
the above
values
Legend X: Don't care.
P75/TMCIV pin
Register
PCR7
Bit Name
PCR75
Pin Function
Setting Value
0
P75 input/TMCIV input pin
1
P75 output/TMCIV input pin
Rev. 3.00, 05/03, page 131 of 472
P74/TMRIV pin
Register
PCR7
Bit Name
PCR74
Pin Function
Setting Value
0
P74 input/TMRIV input pin
1
P74 output/TMRIV input pin
P72/TXD_2 pin
Register
PMR1
PCR7
Bit Name
TXD2
PCR72
Pin Function
Setting Value
0
0
P72 input pin
1
P72 output pin
X
TXD_2 output pin
1
Legend X: Don't care.
P71/RXD_2 pin
Register
SCR3_2
PCR7
Bit Name
RE
PCR71
Setting Value
0
1
Pin Function
0
P71 input pin
1
P71 output pin
X
RXD_2 input pin
Legend X: Don't care.
P70/SCK3_2 pin
Register
SCR3_2
Bit Name
CKE1
Setting Value
0
SMR2
PCR7
CKE0
COM
PCR70 Pin Function
0
0
0
P70 input pin
1
P70 output pin
0
0
1
X
SCK3_2 output pin
0
1
X
X
SCK3_2 output pin
1
X
X
X
SCK3_2 input pin
Legend X: Don't care.
Rev. 3.00, 05/03, page 132 of 464
9.7
Port 8
Port 8 is a general I/O port. Each pin of the port 8 is shown in figure 9.7.
P87
Port 8
P86
P85
Figure 9.7 Port 8 Pin Configuration
Port 8 has the following registers.
• Port control register 8 (PCR8)
• Port data register 8 (PDR8)
9.7.1
Port Control Register 8 (PCR8)
PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR87
0
W
6
PCR86
0
W
5
PCR85
0
W
When each of the port 8 pins P87 to P85 functions as a
general I/O port, setting a PCR8 bit to 1 makes the
corresponding pin an output port, while clearing the bit to
0 makes the pin an input port.
4 to 0
Reserved
9.7.2
Port Data Register 8 (PDR8)
PDR8 is a general I/O port data register of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
P87
0
R/W
PDR8 stores output data for port 8 pins.
6
P86
0
R/W
5
P85
0
R/W
If PDR8 is read while PCR8 bits are set to 1, the value
stored in PDR8 is read. If PDR8 is read while PCR8 bits
are cleared to 0, the pin states are read regardless of the
value stored in PDR8.
4 to 0
All 1
Reserved
These bits are always read as 1.
Rev. 3.00, 05/03, page 133 of 472
9.7.3
Pin Functions
The correspondence between the register specification and the port functions is shown below.
P87 pin
Register
PCR8
Bit Name
PCR87
Pin Function
Setting Value
0
P87 input pin
1
P87 output pin
P86 pin
Register
PCR8
Bit Name
PCR86
Pin Function
Setting Value
0
P86 input pin
1
P86 output pin
P85 pin
Register
PCR8
Bit Name
PCR85
Pin Function
Setting Value
0
P85 input pin
1
P85 output pin
Rev. 3.00, 05/03, page 134 of 464
9.8
Port B
Port B is an input port also functioning as an A/D converter analog input pin. Each pin of the port
B is shown in figure 9.8.
PB7/AN7
PB6/AN6
PB5/AN5
Port B
PB4/AN4
PB3/AN3
PB2/AN2
PB1/AN1
PB0/AN0
Figure 9.8 Port B Pin Configuration
Port B has the following register.
• Port data register B (PDRB)
9.8.1
Port Data Register B (PDRB)
PDRB is a general input-only port data register of port B.
Bit
Bit Name
Initial
Value
R/W
Description
7
PB7
R
6
PB6
R
The input value of each pin is read by reading this
register.
5
PB5
R
4
PB4
R
3
PB3
R
2
PB2
R
1
PB1
R
0
PB0
R
However, if a port B pin is designated as an analog input
channel by ADCSR in A/D converter, 0 is read.
Rev. 3.00, 05/03, page 135 of 472
Rev. 3.00, 05/03, page 136 of 464
Section 10 Realtime Clock (RTC)
The realtime clock (RTC) is a timer used to count time ranging from a second to a week. Figure
10.1 shows the block diagram of the RTC.
10.1
Features
• Counts seconds, minutes, hours, and day-of-week
• Start/stop function
• Reset function
• Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes
• Periodic (seconds, minutes, hours, days, and weeks) interrupts
• 8-bit free running counter
• Selection of clock source
RTC3000A_000120030300
Rev. 3.00, 05/03, page 137 of 472
RTCCSR
PSS
RSECDR
1/4
RMINDR
RHRDR
TMOW
Clock count
control circuit
RWKDR
Internal data bus
32-kHz
oscillator
circuit
RTCCR1
RTCCR2
Interrupt
control circuit
Legend
RTCCSR:
RSECDR:
RMINDR:
RHRDR:
RWKDR:
RTCCR1:
RTCCR2:
PSS:
Clock source select register
Second date register/free running counter data register
Minute date register
Hour date register
Day-of-week date register
RTC control register 1
RTC control register 2
Prescaler S
Figure 10.1 Block Diagram of RTC
10.2
Input/Output Pin
Table 10.1 shows the RTC input/output pin.
Table 10.1 Pin Configuration
Name
Abbreviation I/O
Function
Clock output
TMOW
RTC divided clock output
Output
Rev. 3.00, 05/03, page 138 of 472
Interrupt
10.3
Register Descriptions
The RTC has the following registers.
• Second data register/free running counter data register (RSECDR)
• Minute data register (RMINDR)
• Hour data register (RHRDR)
• Day-of-week data register (RWKDR)
• RTC control register 1 (RTCCR1)
• RTC control register 2 (RTCCR2)
• Clock source select register (RTCCSR)
10.3.1
Second Data Register/Free Running Counter Data Register (RSECDR)
RSECDR counts the BCD-coded second value. The setting range is decimal 00 to 59. It is an 8-bit
read register used as a counter, when it operates as a free running counter. For more information
on reading seconds, minutes, hours, and day-of-week, see section 10.4.3, Data Reading Procedure.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy:
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
SC12
—
R/W
Counting ten’s position of seconds:
5
SC11
—
R/W
Counts on 0 to 5 for 60-second counting.
4
SC10
—
R/W
3
SC03
—
R/W
Counting one’s position of seconds:
2
SC02
—
R/W
1
SC01
—
R/W
Counts on 0 to 9 once per second. When a carry is
generated, 1 is added to the ten’s position.
0
SC00
—
R/W
Rev. 3.00, 05/03, page 139 of 472
10.3.2
Minute Data Register (RMINDR)
RMINDR counts the BCD-coded minute value on the carry generated once per minute by the
RSECDR counting. The setting range is decimal 00 to 59.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy:
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
MN12
—
R/W
Counting ten’s position of minutes:
5
MN11
—
R/W
Counts on 0 to 5 for 60-minute counting.
4
MN10
—
R/W
3
MN03
—
R/W
Counting one’s position of minutes:
2
MN02
—
R/W
1
MN01
—
R/W
Counts on 0 to 9 once per minute. When a carry is
generated, 1 is added to the ten’s position.
0
MN00
—
R/W
Rev. 3.00, 05/03, page 140 of 472
10.3.3
Hour Data Register (RHRDR)
RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR.
The setting range is either decimal 00 to 11 or 00 to 23 by the selection of the 12/24 bit in
RTCCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy:
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
—
0
—
Reserved
This bit is always read as 0.
5
HR11
—
R/W
Counting ten’s position of hours:
4
HR10
—
R/W
Counts on 0 to 2 for ten’s position of hours.
3
HR03
—
R/W
Counting one’s position of hours:
2
HR02
—
R/W
1
HR01
—
R/W
Counts on 0 to 9 once per hour. When a carry is
generated, 1 is added to the ten’s position.
0
HR00
—
R/W
Rev. 3.00, 05/03, page 141 of 472
10.3.4
Day-of-Week Data Register (RWKDR)
RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by
RHRDR. The setting range is decimal 0 to 6 using bits WK2 to WK0.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC busy:
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6 to 3
—
All 0
—
Reserved
These bits are always read as 0.
2
WK2
—
R/W
Day-of-week counting:
1
WK1
—
R/W
Day-of-week is indicated with a binary code
0
WK0
—
R/W
000: Sunday
001: Monday
010: Tuesday
011: Wednesday
100: Thursday
101: Friday
110: Saturday
111: Reserved (setting prohibited)
Rev. 3.00, 05/03, page 142 of 472
10.3.5
RTC Control Register 1 (RTCCR1)
RTCCR1 controls start/stop and reset of the clock timer. For the definition of time expression, see
figure 10.2.
Bit
Bit Name
Initial
Value
R/W
Description
7
RUN
—
R/W
RTC operation start:
0: Stops RTC operation
1: Starts RTC operation
6
12/24
—
R/W
Operating mode:
0: RTC operates in 12-hour mode. RHRDR counts on 0
to 11.
1: RTC operates in 24-hour mode. RHRDR counts on 0
to 23.
5
PM
—
R/W
A.m./p.m.:
0: Indicates a.m. when RTC is in the 12-hour mode.
1: Indicates p.m. when RTC is in the 12-hour mode.
4
RST
0
R/W
Reset:
0: Normal operation
1: Resets registers and control circuits except RTCCSR
and this bit. Clear this bit to 0 after having been set to 1.
3 to 0
—
All 0
—
Reserved
These bits are always read as 0.
Noon
24-hour count 0
12-hour count 0
PM
1
1
2
2
3
3
4
4
5 6 7
5 6 7
0 (Morning)
8
8
9 10 11 12 13 14 15 16 17
9 10 11 0 1 2 3 4 5
1 (Afternoon)
24-hour count 18 19 20 21 22 23 0
12-hour count 6 7 8 9 10 11 0
PM
1 (Afternoon)
0
Figure 10.2 Definition of Time Expression
Rev. 3.00, 05/03, page 143 of 472
10.3.6
RTC Control Register 2 (RTCCR2)
RTCCR2 controls RTC periodic interrupts of weeks, days, hours, minutes, and seconds. Enabling
interrupts of weeks, days, hours, minutes, and seconds sets the IRRTA flag to 1 in the interrupt
flag register 1 (IRR1) when an interrupt occurs. It also controls an overflow interrupt of a free
running counter when RTC operates as a free running counter.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6
—
All 0
—
Reserved
These bits are always read as 0.
5
FOIE
—
R/W
Free Running Counter Overflow Interrupt Enable:
0: Disables an overflow interrupt
1: Enables an overflow interrupt
4
WKIE
—
R/W
Week Periodic Interrupt Enable:
0: Disables a week periodic interrupt
1: Enables a week periodic interrupt
3
DYIE
—
R/W
Day Periodic Interrupt Enable:
0: Disables a day periodic interrupt
1: Enables a day periodic interrupt
2
HRIE
—
R/W
Hour Periodic Interrupt Enable:
0: Disables an hour periodic interrupt
1: Enables an hour periodic interrupt
1
MNIE
—
R/W
Minute Periodic Interrupt Enable:
0: Disables a minute periodic interrupt
1: Enables a minute periodic interrupt
0
SEIE
—
R/W
Second Periodic Interrupt Enable:
0: Disables a second periodic interrupt
1: Enables a second periodic interrupt
Rev. 3.00, 05/03, page 144 of 472
10.3.7
Clock Source Select Register (RTCCSR)
RTCCSR selects clock source. A free running counter controls start/stop of counter operation by
the RUN bit in RTCCR1. When a clock other than 32.768 MHz is selected, the RTC is disabled
and operates as an 8-bit free running counter. When the RTC operates as an 8-bit free running
counter, RSECDR enables counter values to be read. An interrupt can be generated by setting 1 to
the FOIE bit in RTCCR2 and enabling an overflow interrupt of the free running counter. A clock
in which the system clock is divided by 32, 16, 8, or 4 is output in active or sleep mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
—
0
—
Reserved
This bit is always read as 0.
6
RCS6
0
R/W
Clock output selection:
5
RCS5
0
R/W
Selects a clock output from the TMOW pin when setting
TMOW in PMR1 to 1.
00: φ/4
01: φ/8
10: φ/16
11: φ/32
4
—
0
—
Reserved
This bit is always read as 0.
3
RCS3
1
R/W
Clock source selection:
2
RCS2
0
R/W
0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1
RCS1
0
R/W
0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0
RCS0
0
R/W
0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1000: 32.768 kHz⋅⋅⋅⋅⋅RTC operation
Rev. 3.00, 05/03, page 145 of 472
10.4
Operation
10.4.1
Initial Settings of Registers after Power-On
The RTC registers that store second, minute, hour, and day-of week data are not reset by a RES
input. Therefore, all registers must be set to their initial values after power-on. Once the register
setting are made, the RTC provides an accurate time as long as power is supplied regardless of a
RES input.
10.4.2
Initial Setting Procedure
Figure 10.3 shows the procedure for the initial setting of the RTC. To set the RTC again, also
follow this procedure.
RUN in RTCCR1 = 0
RTC operation is stopped.
RST in RTCCR1 = 1
RST in RTCCR1 = 0
Set RTCCSR, RSECDR,
RMINDR, RHRDR,
RWKDR, 12/24 in
RTCCR1, and PM
RUN in RTCCR1 = 1
RTC registers and clock count
controller are reset.
Clock output and clock source are
selected and second, minute, hour,
day-of-week, operating mode, and
a.m/p.m are set.
RTC operation is started.
Figure 10.3 Initial Setting Procedure
Rev. 3.00, 05/03, page 146 of 472
10.4.3
Data Reading Procedure
When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read,
the data obtained may not be correct, and so the time data must be read again. Figure 10.4 shows
an example in which correct data is not obtained. In this example, since only RSECDR is read
after data update, about 1-minute inconsistency occurs.
To avoid reading in this timing, the following processing must be performed.
1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the
second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY
bit is set to 1, the registers are updated, and the BSY bit is cleared to 0.
2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after
the IRRTA flag in IRR1 is set to 1 and the BSY bit is confirmed to be 0.
3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is
no change in the read data, the read data is used.
Before update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59
Processing flow
BSY bit = 0
(1) Day-of-week data register read
H'03
(2) Hour data register read
H'13
(3) Minute data register read
H'46
BSY bit -> 1 (under data update)
After update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00
BSY bit -> 0
(4) Second data register read
H'00
Figure 10.4 Example: Reading of Inaccurate Time Data
Rev. 3.00, 05/03, page 147 of 472
10.5
Interrupt Source
There are five kinds of RTC interrupts: week interrupts, day interrupts, hour interrupts, minute
interrupts, and second interrupts.
When using an interrupt, initiate the RTC last after other registers are set. Do not set multiple
interrupt enable bits in RTCCR2 simultaneously to 1.
When an interrupt request of the RTC occurs, the IRRTA flag in IRR1 is set to 1. When clearing
the flag, write 0.
Table 10.2 Interrupt Source
Interrupt Name
Interrupt Source
Interrupt Enable Bit
Overflow interrupt
Occurs when the free running counter is
overflown.
FOIE
Week periodic interrupt
Occurs every week when the day-of-week date WKIE
register value becomes 0.
Day periodic interrupt
Occurs every day when the day-of-week date
register is counted.
Hour periodic interrupt
Occurs every hour when the hour date register HRIE
is counted.
Minute periodic interrupt
Occurs every minute when the minute date
register is counted.
MNIE
Second periodic interrupt
Occurs every second when the second date
register is counted.
SCIE
Rev. 3.00, 05/03, page 148 of 472
DYIE
Section 11 Timer B1
Timer B1 is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operating modes, interval and auto reload. Figure 11.1 shows a block diagram of timer B1.
11.1
Features
• Selection of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, and φ/4) or
an external clock (can be used to count external events).
• An interrupt is generated when the counter overflows.
PSS
TCB1
TMIB1
Internal data bus
TMB1
TLB1
Legend
TMB1 :
TCB1 :
TLB1 :
IRRTB1 :
PSS :
TMIB1 :
Timer mode register B1
Timer counter B1
Timer load register B1
Timer B1 interrupt request flag
Prescaler S
Timer B1 event input
IRRTB1
Figure 11.1 Block Diagram of Timer B1
TIM08B0A_000020020200
Rev. 3.00, 05/03, page 149 of 472
11.2
Input/Output Pin
Table 11.1 shows the timer B1 pin configuration.
Table 11.1 Pin Configuration
Name
Abbreviation
I/O
Function
Timer B1 event input
TMIB1
Input
Event input to TCB1
11.3
Register Descriptions
The timer B1 has the following registers.
• Timer mode register B1 (TMB1)
• Timer counter B1 (TCB1)
• Timer load register B1 (TLB1)
Rev. 3.00, 05/03, page 150 of 472
11.3.1
Timer Mode Register B1 (TMB1)
TMB1 selects the auto-reload function and input clock.
Bit
Bit Name
Initial
Value
R/W
Description
7
TMB17
0
R/W
Auto-reload function select
0: Interval timer function selected
1: Auto-reload function selected
6 to 3
All 1
Reserved
These bits are always read as 1.
2
TMB12
0
R/W
Clock select
1
TMB11
0
R/W
000: Internal clock: φ/8192
0
TMB10
0
R/W
001: Internal clock: φ/2048
010: Internal clock: φ/512
011: Internal clock: φ/256
100: Internal clock: φ/64
101: Internal clock: φ/16
110: Internal clock: φ/4
111: External event (TMIB1): rising or falling edge*
Note: * The edge of the external event signal is selected
by bit IEG1 in the interrupt edge select register 1
(IEGR1). See section 3.2.1, Interrupt Edge
Select Register 1 (IEGR1), for details. Before
setting TMB12 to TMB10 to 1, IRQ1 in the port
mode register 1 (PMR1) should be set to 1.
11.3.2
Timer Counter B1 (TCB1)
TCB1 is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMB12 to TMB10 in TMB1. TCB1 values can
be read by the CPU at any time. When TCB1 overflows from H'FF to H'00 or to the value set in
TLB1, the IRRTB1 flag in IRR2 is set to 1. TCB1 is allocated to the same address as TLB1. TCB1
is initialized to H'00.
Rev. 3.00, 05/03, page 151 of 472
11.3.3
Timer Load Register B1 (TLB1)
TLB1 is an 8-bit write-only register for setting the reload value of TCB1. When a reload value is
set in TLB1, the same value is loaded into TCB1 as well, and TCB1 starts counting up from that
value. When TCB1 overflows during operation in auto-reload mode, the TLB1 value is loaded
into TCB1. Accordingly, overflow periods can be set within the range of 1 to 256 input clocks.
TLB1 is allocated to the same address as TCB1. TLB1 is initialized to H'00.
11.4
Operation
11.4.1
Interval Timer Operation
When bit TMB17 in TMB1 is cleared to 0, timer B1 functions as an 8-bit interval timer. Upon
reset, TCB1 is cleared to H'00 and bit TMB17 is cleared to 0, so up-counting and interval timing
resume immediately. The operating clock of timer B1 is selected from seven internal clock signals
output by prescaler S, or an external clock input at pin TMB1. The selection is made by bits
TMB12 to TMB10 in TMB1.
After the count value in TMB1 reaches H'FF, the next clock signal input causes timer B1 to
overflow, setting flag IRRTB1 in IRR2 to 1. If IENTB1 in IENR2 is 1, an interrupt is requested to
the CPU.
At overflow, TCB1 returns to H'00 and starts counting up again. During interval timer operation
(TMB17 = 0), when a value is set in TLB1, the same value is set in TCB1.
11.4.2
Auto-Reload Timer Operation
Setting bit TMB17 in TMB1 to 1 causes timer B1 to function as an 8-bit auto-reload timer. When
a reload value is set in TLB1, the same value is loaded into TCB1, becoming the value from which
TCB1 starts its count. After the count value in TCB1 reaches H'FF, the next clock signal input
causes timer B1 to overflow. The TLB1 value is then loaded into TCB1, and the count continues
from that value. The overflow period can be set within a range from 1 to 256 input clocks,
depending on the TLB1 value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode. In autoreload mode (TMB17 = 1), when a new value is set in TLB1, the TLB1 value is also loaded into
TCB1.
Rev. 3.00, 05/03, page 152 of 472
11.4.3
Event Counter Operation
Timer B1 can operate as an event counter in which TMIB1 is set to an event input pin. External
event counting is selected by setting bits TMB12 to TMB10 in TMB1 to 1. TCB1 counts up at
rising or falling edge of an external event signal input at pin TMB1.
When timer B1 is used to count external event input, bit IRQ1 in PMR1 should be set to 1 and
IEN1 in IENR1 should be cleared to 0 to disable IRQ1 interrupt requests.
11.5
Timer B1 Operating Modes
Table 11.2 shows the timer B1 operating modes.
Table 11.2 Timer B1 Operating Modes
Operating Mode
Reset
Active
Sleep
Subactive
Subsleep
Standby
Interval
Reset
Functions
Functions
Halted
Halted
Halted
Auto-reload Reset
Functions
Functions
Halted
Halted
Halted
Reset
Functions
Retained
Retained
Retained
Retained
TCB1
TMB1
Rev. 3.00, 05/03, page 153 of 472
Rev. 3.00, 05/03, page 154 of 472
Section 12 Timer V
Timer V is an 8-bit timer based on an 8-bit counter. Timer V counts external events. Comparematch signals with two registers can also be used to reset the counter, request an interrupt, or
output a pulse signal with an arbitrary duty cycle. Counting can be initiated by a trigger input at
the TRGV pin, enabling pulse output control to be synchronized to the trigger, with an arbitrary
delay from the trigger input. Figure 12.1 shows a block diagram of timer V.
12.1
Features
• Choice of seven clock signals is available.
Choice of six internal clock sources (φ/128, φ/64, φ/32, φ/16, φ/8, φ/4) or an external clock.
• Counter can be cleared by compare match A or B, or by an external reset signal. If the count
stop function is selected, the counter can be halted when cleared.
• Timer output is controlled by two independent compare match signals, enabling pulse output
with an arbitrary duty cycle, PWM output, and other applications.
• Three interrupt sources: compare match A, compare match B, timer overflow
• Counting can be initiated by trigger input at the TRGV pin. The rising edge, falling edge, or
both edges of the TRGV input can be selected.
TIM08V0A_000120030300
Rev. 3.00, 05/03, page 155 of 472
TCRV1
TCORB
Trigger
control
TRGV
Comparator
Clock select
TCNTV
Internal data bus
TMCIV
Comparator
ø
PSS
TCORA
Clear
control
TMRIV
TCRV0
Interrupt
request
control
Output
control
TMOV
Legend:
TCORA:
TCORB:
TCNTV:
TCSRV:
TCRV0:
TCRV1:
PSS:
CMIA:
CMIB:
OVI:
TCSRV
CMIA
CMIB
OVI
Time constant register A
Time constant register B
Timer counter V
Timer control/status register V
Timer control register V0
Timer control register V1
Prescaler S
Compare-match interrupt A
Compare-match interrupt B
Overflow interupt
Figure 12.1 Block Diagram of Timer V
12.2
Input/Output Pins
Table 12.1 shows the timer V pin configuration.
Table 12.1 Pin Configuration
Name
Abbreviation I/O
Function
Timer V output
TMOV
Output
Timer V waveform output
Timer V clock input
TMCIV
Input
Clock input to TCNTV
Timer V reset input
TMRIV
Input
External input to reset TCNTV
Trigger input
TRGV
Input
Trigger input to initiate counting
Rev. 3.00, 05/03, page 156 of 472
12.3
Register Descriptions
Time V has the following registers.
• Timer counter V (TCNTV)
• Timer constant register A (TCORA)
• Timer constant register B (TCORB)
• Timer control register V0 (TCRV0)
• Timer control/status register V (TCSRV)
• Timer control register V1 (TCRV1)
12.3.1
Timer Counter V (TCNTV)
TCNTV is an 8-bit up-counter. The clock source is selected by bits CKS2 to CKS0 in timer
control register V0 (TCRV0). The TCNTV value can be read and written by the CPU at any time.
TCNTV can be cleared by an external reset input signal, or by compare match A or B. The
clearing signal is selected by bits CCLR1 and CCLR0 in TCRV0.
When TCNTV overflows, OVF is set to 1 in timer control/status register V (TCSRV).
TCNTV is initialized to H'00.
12.3.2
Time Constant Registers A and B (TCORA, TCORB)
TCORA and TCORB have the same function.
TCORA and TCORB are 8-bit read/write registers.
TCORA and TCNTV are compared at all times. When the TCORA and TCNTV contents match,
CMFA is set to 1 in TCSRV. If CMIEA is also set to 1 in TCRV0, a CPU interrupt is requested.
Note that they must not be compared during the T3 state of a TCORA write cycle.
Timer output from the TMOV pin can be controlled by the identifying signal (compare match A)
and the settings of bits OS3 to OS0 in TCSRV.
TCORA and TCORB are initialized to H'FF.
Rev. 3.00, 05/03, page 157 of 472
12.3.3
Timer Control Register V0 (TCRV0)
TCRV0 selects the input clock signals of TCNTV, specifies the clearing conditions of TCNTV,
and controls each interrupt request.
Bit
Bit Name
Initial
Value
R/W
Description
7
CMIEB
0
R/W
Compare Match Interrupt Enable B
When this bit is set to 1, interrupt request from the CMFB
bit in TCSRV is enabled.
6
CMIEA
0
R/W
Compare Match Interrupt Enable A
When this bit is set to 1, interrupt request from the CMFA
bit in TCSRV is enabled.
5
OVIE
0
R/W
Timer Overflow Interrupt Enable
When this bit is set to 1, interrupt request from the OVF
bit in TCSRV is enabled.
4
CCLR1
0
R/W
Counter Clear 1 and 0
3
CCLR0
0
R/W
These bits specify the clearing conditions of TCNTV.
00: Clearing is disabled
01: Cleared by compare match A
10: Cleared by compare match B
11: Cleared on the rising edge of the TMRIV pin. The
operation of TCNTV after clearing depends on TRGE in
TCRV1.
2
CKS2
0
R/W
Clock Select 2 to 0
1
CKS1
0
R/W
0
CKS0
0
R/W
These bits select clock signals to input to TCNTV and the
counting condition in combination with ICKS0 in TCRV1.
Refer to table 12.2.
Rev. 3.00, 05/03, page 158 of 472
Table 12.2 Clock Signals to Input to TCNTV and Counting Conditions
TCRV0
TCRV1
Bit 2
Bit 1
Bit 0
Bit 0
CKS2
CKS1
CKS0
ICKS0
Description
0
0
0
Clock input prohibited
1
0
Internal clock: counts on φ/4, falling edge
1
Internal clock: counts on φ/8, falling edge
0
Internal clock: counts on φ/16, falling edge
1
Internal clock: counts on φ/32, falling edge
0
Internal clock: counts on φ/64, falling edge
1
Internal clock: counts on φ/128, falling edge
0
Clock input prohibited
1
External clock: counts on rising edge
0
External clock: counts on falling edge
1
External clock: counts on rising and falling
edge
1
0
1
1
0
1
Rev. 3.00, 05/03, page 159 of 472
12.3.4
Timer Control/Status Register V (TCSRV)
TCSRV indicates the status flag and controls outputs by using a compare match.
Bit
Bit Name
Initial
Value
R/W
Description
7
CMFB
0
R/W
Compare Match Flag B
Setting condition:
When the TCNTV value matches the TCORB value
Clearing condition:
After reading CMFB = 1, cleared by writing 0 to CMFB
6
CMFA
0
R/W
Compare Match Flag A
Setting condition:
When the TCNTV value matches the TCORA value
Clearing condition:
After reading CMFA = 1, cleared by writing 0 to CMFA
5
OVF
0
R/W
Timer Overflow Flag
Setting condition:
When TCNTV overflows from H'FF to H'00
Clearing condition:
After reading OVF = 1, cleared by writing 0 to OVF
4
1
3
OS3
0
R/W
Output Select 3 and 2
2
OS2
0
R/W
These bits select an output method for the TMOV pin by
the compare match of TCORB and TCNTV.
Reserved
This bit is always read as 1.
00: No change
01: 0 output
10: 1 output
11: Output toggles
1
OS1
0
R/W
Output Select 1 and 0
0
OS0
0
R/W
These bits select an output method for the TMOV pin by
the compare match of TCORA and TCNTV.
00: No change
01: 0 output
10: 1 output
11: Output toggles
Rev. 3.00, 05/03, page 160 of 472
OS3 and OS2 select the output level for compare match B. OS1 and OS0 select the output level
for compare match A. The two output levels can be controlled independently. After a reset, the
timer output is 0 until the first compare match.
12.3.5
Timer Control Register V1 (TCRV1)
TCRV1 selects the edge at the TRGV pin, enables TRGV input, and selects the clock input to
TCNTV.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5
All 1
Reserved
These bits are always read as 1.
4
TVEG1
0
R/W
TRGV Input Edge Select
3
TVEG0
0
R/W
These bits select the TRGV input edge.
00: TRGV trigger input is prohibited
01: Rising edge is selected
10: Falling edge is selected
11: Rising and falling edges are both selected
2
TRGE
0
R/W
TCNT starts counting up by the input of the edge which is
selected by TVEG1 and TVEG0.
0: Disables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
1: Enables starting counting-up TCNTV by the input of
the TRGV pin and halting counting-up TCNTV when
TCNTV is cleared by a compare match.
1
1
Reserved
This bit is always read as 1.
0
ICKS0
0
R/W
Internal Clock Select 0
This bit selects clock signals to input to TCNTV in
combination with CKS2 to CKS0 in TCRV0.
Refer to table 12.2.
Rev. 3.00, 05/03, page 161 of 472
12.4
Operation
12.4.1
Timer V Operation
1. According to table 12.2, six internal/external clock signals output by prescaler S can be
selected as the timer V operating clock signals. When the operating clock signal is selected,
TCNTV starts counting-up. Figure 12.2 shows the count timing with an internal clock signal
selected, and figure 12.3 shows the count timing with both edges of an external clock signal
selected.
2. When TCNTV overflows (changes from H'FF to H'00), the overflow flag (OVF) in TCRV0
will be set. The timing at this time is shown in figure 12.4. An interrupt request is sent to the
CPU when OVIE in TCRV0 is 1.
3. TCNTV is constantly compared with TCORA and TCORB. Compare match flag A or B
(CMFA or CMFB) is set to 1 when TCNTV matches TCORA or TCORB, respectively. The
compare-match signal is generated in the last state in which the values match. Figure 12.5
shows the timing. An interrupt request is generated for the CPU when CMIEA or CMIEB in
TCRV0 is 1.
4. When a compare match A or B is generated, the TMOV responds with the output value
selected by bits OS3 to OS0 in TCSRV. Figure 12.6 shows the timing when the output is
toggled by compare match A.
5. When CCLR1 or CCLR0 in TCRV0 is 01 or 10, TCNTV can be cleared by the corresponding
compare match. Figure 12.7 shows the timing.
6. When CCLR1 or CCLR0 in TCRV0 is 11, TCNTV can be cleared by the rising edge of the
input of TMRIV pin. A TMRIV input pulse-width of at least 1.5 system clocks is necessary.
Figure 12.8 shows the timing.
7. When a counter-clearing source is generated with TRGE in TCRV1 set to 1, the counting-up is
halted as soon as TCNTV is cleared. TCNTV resumes counting-up when the edge selected by
TVEG1 or TVEG0 in TCRV1 is input from the TGRV pin.
ø
Internal clock
TCNTV input
clock
TCNTV
N–1
N
Figure 12.2 Increment Timing with Internal Clock
Rev. 3.00, 05/03, page 162 of 472
N+1
ø
TMCIV
(External clock
input pin)
TCNTV input
clock
TCNTV
N–1
N
N+1
Figure 12.3 Increment Timing with External Clock
ø
TCNTV
H'FF
H'00
Overflow signal
OVF
Figure 12.4 OVF Set Timing
ø
TCNTV
N
TCORA or
TCORB
N
N+1
Compare match
signal
CMFA or
CMFB
Figure 12.5 CMFA and CMFB Set Timing
Rev. 3.00, 05/03, page 163 of 472
ø
Compare match
A signal
Timer V output
pin
Figure 12.6 TMOV Output Timing
ø
Compare match
A signal
N
TCNTV
H'00
Figure 12.7 Clear Timing by Compare Match
ø
Compare match
A signal
Timer V output
pin
TCNTV
N–1
N
H'00
Figure 12.8 Clear Timing by TMRIV Input
Rev. 3.00, 05/03, page 164 of 472
12.5
Timer V Application Examples
12.5.1
Pulse Output with Arbitrary Duty Cycle
Figure 12.9 shows an example of output of pulses with an arbitrary duty cycle.
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORA.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
4. With these settings, a waveform is output without further software intervention, with a period
determined by TCORA and a pulse width determined by TCORB.
TCNTV value
H'FF
Counter cleared
TCORA
TCORB
H'00
Time
TMOV
Figure 12.9 Pulse Output Example
Rev. 3.00, 05/03, page 165 of 472
12.5.2
Pulse Output with Arbitrary Pulse Width and Delay from TRGV Input
The trigger function can be used to output a pulse with an arbitrary pulse width at an arbitrary
delay from the TRGV input, as shown in figure 12.10. To set up this output:
1. Set bits CCLR1 and CCLR0 in TCRV0 so that TCNTV will be cleared by compare match with
TCORB.
2. Set bits OS3 to OS0 in TCSRV so that the output will go to 1 at compare match with TCORA
and to 0 at compare match with TCORB.
3. Set bits TVEG1 and TVEG0 in TCRV1 and set TRGE to select the falling edge of the TRGV
input.
4. Set bits CKS2 to CKS0 in TCRV0 and bit ICKS0 in TCRV1 to select the desired clock source.
5. After these settings, a pulse waveform will be output without further software intervention,
with a delay determined by TCORA from the TRGV input, and a pulse width determined by
(TCORB – TCORA).
TCNTV value
H'FF
Counter cleared
TCORB
TCORA
H'00
Time
TRGV
TMOV
Compare match A
Compare match B
clears TCNTV and
halts count-up
Compare match A
Compare match B
clears TCNTV and
halts count-up
Figure 12.10 Example of Pulse Output Synchronized to TRGV Input
Rev. 3.00, 05/03, page 166 of 472
12.6
Usage Notes
The following types of contention or operation can occur in timer V operation.
1.
Writing to registers is performed in the T3 state of a TCNTV write cycle. If a TCNTV clear
signal is generated in the T3 state of a TCNTV write cycle, as shown in figure 12.11, clearing
takes precedence and the write to the counter is not carried out. If counting-up is generated in
the T3 state of a TCNTV write cycle, writing takes precedence.
2.
If a compare match is generated in the T3 state of a TCORA or TCORB write cycle, the write
to TCORA or TCORB takes precedence and the compare match signal is inhibited. Figure
12.12 shows the timing.
3.
If compare matches A and B occur simultaneously, any conflict between the output selections
for compare match A and compare match B is resolved by the following priority: toggle
output > output 1 > output 0.
4.
Depending on the timing, TCNTV may be incremented by a switch between different internal
clock sources. When TCNTV is internally clocked, an increment pulse is generated from the
falling edge of an internal clock signal, that is divided system clock (φ). Therefore, as shown
in figure 12.3 the switch is from a high clock signal to a low clock signal, the switchover is
seen as a falling edge, causing TCNTV to increment. TCNTV can also be incremented by a
switch between internal and external clocks.
TCNTV write cycle by CPU
T1
T2
T3
ø
Address
TCNTV address
Internal write signal
Counter clear signal
TCNTV
N
H'00
Figure 12.11 Contention between TCNTV Write and Clear
Rev. 3.00, 05/03, page 167 of 472
TCORA write cycle by CPU
T1
T2
T3
ø
Address
TCORA address
Internal write signal
TCNTV
N
TCORA
N
N+1
M
TCORA write data
Compare match signal
Inhibited
Figure 12.12 Contention between TCORA Write and Compare Match
Clock before
switching
Clock after
switching
Count clock
TCNTV
N
N+1
N+2
Write to CKS1 and CKS0
Figure 12.13 Internal Clock Switching and TCNTV Operation
Rev. 3.00, 05/03, page 168 of 472
Section 13 Timer Z
The timer Z has a 16-bit timer with two channels. Figures 13.1, 13.2, and 13.3 show the block
diagrams of entire timer Z, its channel 0, and its channel 1, respectively. For details on the timer Z
functions, refer to table 13.1.
13.1
Features
• Capability to process up to eight inputs/outputs
• Eight general registers (GE): four registers for each channel
Independently assignable output compare or input capture functions
• Selection of five counter clock sources: four internal clocks (φ, φ/2, φ/4, and φ/8) and an
external clock
• Seven selectable operating modes
Output compare function
Selection of 0 output, 1 output, or toggle output
Input capture function
Rising edge, falling edge, or both edges
Synchronous operation
Timer counters_0 and _1 (TCNT_0 and TCNT_1) can be written simultaneously.
Simultaneous clearing by compare match or input capture is possible.
PWM mode
Up to six-phase PWM output can be provided with desired duty ratio.
Reset synchronous PWM mode
Three-phase PWM output for normal and counter phases
Complementary PWM mode
Three-phase PWM output for non-overlapped normal and counter phases
The A/D conversion start trigger can be set for PWM cycles.
Buffer operation
The input capture register can be consisted of double buffers.
The output compare register can automatically be modified.
• High-speed access by the internal 16-bit bus
16-bit TCNT and GR registers can be accessed in high speed by a 16-bit bus interface
• Any initial timer output value can be set
• Output of the timer is disabled by external trigger
• Eleven interrupt sources
Four compare match/input capture interrupts and an overflow interrupt are available for
each channel. An underflow interrupt can be set for channel 1.
TIM08Z0A_000120030300
Rev. 3.00, 05/03, page 169 of 472
Table 13.1 Timer Z Functions
Item
Channel 0
Count clock
Internal clocks: φ, φ/2, φ/4, φ/8
External clock: FTIOA0 (TCLK)
General registers
(output compare/input
capture registers)
GRA_0, GRB_0, GRC_0, GRD_0 GRA_1, GRB_1, GRC_1, GRD_1
Buffer register
GRC_0, GRD_0
GRC_1, GRD_1
I/O pins
FTIOA0, FTIOB0, FTIOC0,
FTIOD0
FTIOA1, FTIOB1, FTIOC1,
FTIOD1
Counter clearing function
Compare match/input capture of
GRA_0, GRB_0, GRC_0, or
GRD_0
Compare match/input capture of
GRA_1, GRB_1, GRC_1, or
GRD_1
Compare
match output
0 output
Yes
Yes
1 output
Yes
Yes
output
Yes
Yes
Input capture function
Yes
Yes
Synchronous operation
Yes
Yes
PWM mode
Yes
Yes
Reset synchronous PWM
mode
Yes
Yes
Complementary PWM
mode
Yes
Yes
Buffer function
Yes
Yes
Interrupt sources
Compare match/input capture A0
to D0
Overflow
Compare match/input capture A1
to D1
Overflow
Underflow
Rev. 3.00, 05/03, page 170 of 472
Channel 1
ITMZ0
FTIOA0
ITMZ1
FTIOB0
FTIOC0
FTIOD0
Control logic
FTIOA1
FTIOB1
FTIOC1
FTIOD1
φ, φ/2,
φ/4, φ/8
ADTRG
Channel 0
timer
Channel 1
timer
TSTR
TMDR
TPMR
TFCR
TOER
TOCR
Module data bus
Legend
TSTR :
Timer start register (8 bits)
TMDR : Timer mode register (8 bits)
TPMR : Timer PWM mode register (8 bits)
TFCR :
Timer function control register (8 bits)
TOER :
Timer output master enable register (8 bits)
TOCR : Timer output control register (8 bits)
: A/D conversion start trigger output signal
ITMZ0 : Channel 0 interrupt
ITMZ1 : Channel 1 interrupt
Figure 13.1 Timer Z Block Diagram
Rev. 3.00, 05/03, page 171 of 472
FTIOA0
FTIOB0
φ, φ/2,
φ/4, φ/8
FTIOC0
Clock select
FTIOD0
Control logic
ITMZ0
Module data bus
Legend
TCNT_0 :
GRA_0, GRB_0:
GRC_0, GRD_0 :
TCR_0 :
TIORA_0 :
TIORC_0 :
TSR_0 :
TIER_0 :
POCR_0 :
ITMZ0 :
Timer counter_0 (16 bits)
General registers A_0, B_0, C_0, and D_0 (input capture/output compare registers:
16 bits 4)
Timer control register_0 (8 bits)
Timer I/O control register A_0 (8 bits)
Timer I/O control register C_0 (8 bits)
Timer status register_0 (8 bits)
Timer interrupt enable register_0 (8 bits)
PWM mode output level control register_0 (8 bits)
Channel 0 interrupt
Figure 13.2 Timer Z (Channel 0) Block Diagram
Rev. 3.00, 05/03, page 172 of 472
POCR_0
TIER_0
TSR_0
TIORC_0
TIORA_0
TCR_0
GRD_0
GRC_0
GRB_0
GRA_0
TCNT_0
Comparator
FTIOA1
FTIOB1
φ, φ/2,
φ/4, φ/8
FTIOC1
Clock select
FTIOD1
Control logic
ITMZ1
POCR_1
TIER_1
TSR_1
TIORC_1
TIORA_1
TCR_1
GRD_1
GRC_1
GRB_1
GRA_1
TCNT_1
Comparator
Module data bus
Legend
TCNT_1 :
GRA_1, GRB_1:
GRC_1, GRD_1 :
TCR_1 :
TIORA_1 :
TIORC_1 :
TSR_1 :
TIER_1 :
POCR_1 :
ITMZ1 :
Timer counter_1 (16 bits)
General registers A_1, B_1, C_1, and D_1 (input capture/output compare registers:
16 bits 4)
Timer control register_1 (8 bits)
Timer I/O control register A_1 (8 bits)
Timer I/O control register C_1 (8 bits)
Timer status register_1 (8 bits)
Timer interrupt enable register_1 (8 bits)
PWM mode output level control register_1 (8 bits)
Channel 1 interrupt
Figure 13.3 Timer Z (Channel 1) Block Diagram
Rev. 3.00, 05/03, page 173 of 472
13.2
Input/Output Pins
Table 13.2 summarizes the timer Z pins.
Table 13.2 Pin Configuration
Name
Abbreviation
Input/Output
Function
Input capture/output
compare A0
FTIOA0
Input/output
GRA_0 output compare output, GRA_0
input capture input, or external clock
input (TCLK)
Input capture/output
compare B0
FTIOB0
Input/output
GRB_0 output compare output, GRB_0
input capture input, or PWM output
Input capture/output
compare C0
FTIOC0
Input/output
GRC_0 output compare output, GRC_0
input capture input, or PWM
synchronous output (in reset
synchronous PWM and complementary
PWM modes)
Input capture/output
compare D0
FTIOD0
Input/output
GRD_0 output compare output, GRD_0
input capture input, or PWM output
Input capture/output
compare A1
FTIOA1
Input/output
GRA_1 output compare output, GRA_1
input capture input, or PWM output (in
reset synchronous PWM and
complementary PWM modes)
Input capture/output
compare B1
FTIOB1
Input/output
GRB_1 output compare output, GRB_1
input capture input, or PWM output
Input capture/output
compare C1
FTIOC1
Input/output
GRC_1 output compare output, GRC_1
input capture input, or PWM output
Input capture/output
compare D1
FTIOD1
Input/output
GRD_1 output compare output, GRD_1
input capture input, or PWM output
Rev. 3.00, 05/03, page 174 of 472
13.3
Register Descriptions
The timer Z has the following registers.
Common
• Timer start register (TSTR)
• Timer mode register (TMDR)
• Timer PWM mode register (TPMR)
• Timer function control register (TFCR)
• Timer output master enable register (TOER)
• Timer output control register (TOCR)
Channel 0
• Timer control register_0 (TCR_0)
• Timer I/O control register A_0 (TIORA_0)
• Timer I/O control register C_0 (TIORC_0)
• Timer status register_0 (TSR_0)
• Timer interrupt enable register_0 (TIER_0)
• PWM mode output level control register_0 (POCR_0)
• Timer counter_0 (TCNT_0)
• General register A_0 (GRA_0)
• General register B_0 (GRB_0)
• General register C_0 (GRC_0)
• General register D_0 (GRD_0)
Channel 1
• Timer control register_1 (TCR_1)
• Timer I/O control register A_1 (TIORA_1)
• Timer I/O control register C_1 (TIORC_1)
• Timer status register_1 (TSR_1)
• Timer interrupt enable register_1 (TIER_1)
• PWM mode output level control register_1 (POCR_1)
• Timer counter_1 (TCNT_1)
• General register A_1 (GRA_1)
• General register B_1 (GRB_1)
• General register C_1 (GRC_1)
• General register D_1 (GRD_1)
Rev. 3.00, 05/03, page 175 of 472
13.3.1
Timer Start Register (TSTR)
TSTR selects the operation/stop for the TCNT counter.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2
All 1
Reserved
These bits are always read as 1, and cannot be modified.
1
STR1
0
R/W
Channel 1 Counter Start
0: TCNT_1 halts counting
1: TCNT_1 starts counting
0
STR0
0
R/W
Channel 0 Counter Start
0: TCNT_0 halts counting
1: TCNT_0 starts counting
13.3.2
Timer Mode Register (TMDR)
TMDR selects buffer operation settings and synchronized operation.
Bit
Bit Name
Initial
Value
R/W
Description
7
BFD1
0
R/W
Buffer Operation D1
0: GRD_1 operates normally
1: GRB_1 and GRD_1 are used together for buffer
operation
6
BFC1
0
R/W
Buffer Operation C1
0: GRC_1 operates normally
1: GRA_1 and GRD_1 are used together for buffer
operation
5
BFD0
0
R/W
Buffer Operation D0
0: GRD_0 operates normally
1: GRB_0 and GRD_0 are used together for buffer
operation
4
BFC0
0
R/W
Buffer Operation C0
0: GRC_0 operates normally
1: GRA_0 and GRC_0 are used together for buffer
operation
3 to 1
All 1
Reserved
These bits are always read as 1, and cannot be modified.
Rev. 3.00, 05/03, page 176 of 472
Bit
Bit Name
Initial
Value
R/W
Description
0
SYNC
0
R/W
Timer Synchronization
0: TCNT_1 and TCNT_0 operate independently
1: TCNT_1 and TCNT_0 are synchronized
TCNT_1 and TCNT_0 can be pre-set or cleared
synchronously
13.3.3
Timer PWM Mode Register (TPMR)
TPMR sets the pin to enter PWM mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Reserved
This bit is always read as 1, and cannot be modified.
6
PWMD1
0
R/W
PWM Mode D1
0: FTIOD1 operates normally
1: FTIOD1 operates in PWM mode
5
PWMC1
0
R/W
PWM Mode C1
0: FTIOC1 operates normally
1: FTIOC1 operates in PWM mode
4
PWMB1
0
R/W
PWM Mode B1
0: FTIOB1 operates normally
1: FTIOB1 operates in PWM mode
3
1
Reserved
This bit is always read as 1, and cannot be modified.
2
PWMD0
0
R/W
PWM Mode D0
0: FTIOD0 operates normally
1: FTIOD0 operates in PWM mode
1
PWMC0
0
R/W
PWM Mode C0
0: FTIOC0 operates normally
1: FTIOC0 operates in PWM mode
0
PWMB0
0
R/W
PWM Mode B0
0: FTIOB0 operates normally
1: FTIOB0 operates in PWM mode
Rev. 3.00, 05/03, page 177 of 472
13.3.4
Timer Function Control Register (TFCR)
TFCR selects the settings and output levels for each operating mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
STCLK
0
R/W
External Clock Input Select
0: External clock input is disabled
1: External clock input is enabled
5
ADEG
0
R/W
A/D Trigger Edge Select
A/D module should be set to start an A/D conversion by
the external trigger
0: A/D trigger at the crest in complementary PWM mode
1: A/D trigger at the trough in complementary PWM mode
4
ADTRG
0
R/W
External Trigger Disable
0: A/D trigger for PWM cycles is disabled in
complementary PWM mode
1: A/D trigger for PWM cycles is enabled in
complementary PWM mode
3
OLS1
0
R/W
Output Level Select 1
Selects the counter-phase output levels in reset
synchronous PWM mode or complementary PWM mode.
0: Initial output is high and the active level is low.
1: Initial output is low and the active level is high.
2
OLS0
0
R/W
Output Level Select 0
Selects the normal-phase output levels in reset
synchronous PWM mode or complementary PWM mode.
0: Initial output is high and the active level is low.
1: Initial output is low and the active level is high.
Figure 13.4 shows an example of outputs in reset
synchronous PWM mode and complementary PWM
mode when OLS1 = 0 and OLS0 = 0.
Rev. 3.00, 05/03, page 178 of 472
Bit
Bit Name
Initial
Value
R/W
Description
1
CMD1
0
R/W
Combination Mode 1 and 0
0
CMD0
0
R/W
00: Channel 0 and channel 1 operate normally
01: Channel 0 and channel 1 are used together to
operate in reset synchronous PWM mode
10: Channel 0 and channel 1 are used together to
operate in complementary PWM mode (transferred at
the trough)
11: Channel 0 and channel 1 are used together to
operate in complementary PWM mode (transferred at
the crest)
Note: When reset synchronous PWM mode or
complementary PWM mode is selected by these
bits, this setting has the priority to the settings for
PWM mode by each bit in TPMR. Stop TCNT_0
and TCNT_1 before making settings for reset
synchronous PWM mode or complementary PWM
mode.
TCNT_0
TCNT_1
Normal phase
Normal phase
Active level
Active level
Counter phase
Counter phase
Initial
output
Active level
Reset synchronous PWM mode
Initial
output
Active level
Complementary PWM mode
Note: Write H'00 to TOCR to start initial outputs after stopping the counter.
Figure 13.4 Example of Outputs in Reset Synchronous PWM Mode
and Complementary PWM Mode
Rev. 3.00, 05/03, page 179 of 472
13.3.5
Timer Output Master Enable Register (TOER)
TOER enables/disables the outputs for channel 0 and channel 1. When WKP4 is selected for
inputs, if a low level signal is input to WKP4, the bits in TOER are set to 1 to disable the output
for timer Z.
Bit
Bit Name
Initial
Value
R/W
Description
7
ED1
1
R/W
Master Enable D1
0: FTIOD1 pin output is enabled according to the TPMR,
TFCR, and TIORC_1 settings
1: FTIOD1 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_1 settings (FTIOD1 pin is operated
as an I/O port).
6
EC1
1
R/W
Master Enable C1
0: FTIOC1 pin output is enabled according to the TPMR,
TFCR, and TIORC_1 settings
1: FTIOC1 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_1 settings (FTIOC1 pin is operated
as an I/O port).
5
EB1
1
R/W
Master Enable B1
0: FTIOB1 pin output is enabled according to the TPMR,
TFCR, and TIORA_1 settings
1: FTIOB1 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_1 settings (FTIOB1 pin is operated
as an I/O port).
4
EA1
1
R/W
Master Enable A1
0: FTIOA1 pin output is enabled according to the TPMR,
TFCR, and TIORA_1 settings
1: FTIOA1 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_1 settings (FTIOA1 pin is operated
as an I/O port).
3
ED0
1
R/W
Master Enable D0
0: FTIOD0 pin output is enabled according to the TPMR,
TFCR, and TIORC_0 settings
1: FTIOD0 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_0 settings (FTIOD0 pin is operated
as an I/O port).
Rev. 3.00, 05/03, page 180 of 472
Bit
Bit Name
Initial
Value
R/W
Description
2
EC0
1
R/W
Master Enable C0
0: FTIOC0 pin output is enabled according to the TPMR,
TFCR, and TIORC_0 settings
1: FTIOC0 pin output is disabled regardless of the TPMR,
TFCR, and TIORC_0 settings (FTIOC0 pin is operated
as an I/O port).
1
EB0
1
R/W
Master Enable B0
0: FTIOB0 pin output is enabled according to the TPMR,
TFCR, and TIORA_0 settings
1: FTIOB0 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_0 settings (FTIOB0 pin is operated
as an I/O port).
0
EA0
1
R/W
Master Enable A0
0: FTIOA0 pin output is enabled according to the TPMR,
TFCR, and TIORA_0 settings
1: FTIOA0 pin output is disabled regardless of the TPMR,
TFCR, and TIORA_0 settings (FTIOA0 pin is operated
as an I/O port).
13.3.6
Timer Output Control Register (TOCR)
TOCR selects the initial outputs before the first occurrence of a compare match. Note that bits
OLS1 and OLS0 in TFCR set these initial outputs in reset synchronous PWM mode and
complementary PWM mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
TOD1
0
R/W
Output Level Select D1
0: 0 output at the FTIOD1 pin*
1: 1 output at the FTIOD1 pin*
6
TOC1
0
R/W
Output Level Select C1
0: 0 output at the FTIOC1 pin*
1: 1 output at the FTIOC1 pin*
5
TOB1
0
R/W
Output Level Select B1
0: 0 output at the FTIOB1 pin*
1: 1 output at the FTIOB1 pin*
Rev. 3.00, 05/03, page 181 of 472
Bit
Bit Name
Initial
Value
R/W
4
TOA1
0
R/W
Description
Output Level Select A1
0: 0 output at the FTIOA1 pin*
1: 1 output at the FTIOA1 pin*
3
TOD0
0
R/W
Output Level Select D0
0: 0 output at the FTIOD0 pin*
1: 1 output at the FTIOD0 pin*
2
TOC0
0
R/W
Output Level Select C0
0: 0 output at the FTIOC0 pin*
1: 1 output at the FTIOC0 pin*
1
TOB0
0
R/W
Output Level Select B0
0: 0 output at the FTIOB0 pin*
1: 1 output at the FTIOB0 pin*
0
TOA0
0
R/W
Output Level Select A0
0: 0 output at the FTIOA0 pin*
1: 1 output at the FTIOA0 pin*
Note:
13.3.7
*
The change of the setting is immediately reflected in the output value.
Timer Counter (TCNT)
The timer Z has two TCNT counters (TCNT_0 and TCNT_1), one for each channel. The TCNT
counters are 16-bit readable/writable registers that increment/decrement according to input clocks.
Input clocks can be selected by bits TPSC2 to TPSC0 in TCR. TCNT0 and TCNT 1
increment/decrement in complementary PWM mode, while they only increment in other modes.
The TCNT counters are initialized to H'0000 by compare matches with corresponding GRA, GRB,
GRC, or GRD, or input captures to GRA, GRB, GRC, or GRD (counter clearing function). When
the TCNT counters overflow, an OVF flag in TSR for the corresponding channel is set to 1. When
TCNT_1 underflows, an UDF flag in TSR is set to 1. The TCNT counters cannot be accessed in 8bit units; they must always be accessed as a 16-bit unit.
13.3.8
General Registers A, B, C, and D (GRA, GRB, GRC, and GRD)
GR are 16-bit registers. Timer Z has eight general registers (GR), four for each channel. The GR
registers are dual function 16-bit readable/writable registers, functioning as either output compare
or input capture registers. Functions can be switched by TIORA and TIORC.
Rev. 3.00, 05/03, page 182 of 472
The values in GR and TCNT are constantly compared with each other when the GR registers are
used as output compare registers. When the both values match, the IMFA to IMFD flags in TSR
are set to 1. Compare match outputs can be selected by TIORA and TIORC.
When the GR registers are used as input capture registers, the TCNT value is stored after detecting
external signals. At this point, IMFA to IMFD flags in the corresponding TSR are set to 1.
Detection edges for input capture signals can be selected by TIORA and TIORC.
When PWM mode, complementary PWM mode, or reset synchronous PWM mode is selected, the
values in TIORA and TIORC are ignored. Upon reset, the GR registers are set as output compare
registers (no output) and initialized to H'FFFF. The GR registers cannot be accessed in 8-bit units;
they must always be accessed as a 16-bit unit.
13.3.9
Timer Control Register (TCR)
The TCR registers select a TCNT counter clock, an edge when an external clock is selected, and
counter clearing sources. Timer Z has a total of two TCR registers, one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7
CCLR2
0
R/W
Counter Clear 2 to 0
6
CCLR1
0
R/W
000: Disables TCNT clearing
5
CCLR0
0
R/W
001: Clears TCNT by GRA compare match/input
1
capture*
010: Clears TCNT by GRB compare match/input
1
capture*
011: Synchronization clear; Clears TCNT in synchronous
2
with counter clearing of the other channel’s timer*
000: Disables TCNT clearing
001: Clears TCNT by GRC compare match/input
1
capture*
010: Clears TCNT by GRD compare match/input
1
capture*
011: Synchronization clear; Clears TCNT in synchronous
2
with counter clearing of the other channel’s timer*
4
CKEG1
0
R/W
Clock Edge 1 and 0
3
CKEG0
0
R/W
00: Count at rising edge
01: Count at falling edge
1X: Count at both edges
Rev. 3.00, 05/03, page 183 of 472
Bit
Bit Name
Initial
value
R/W
Description
2
TPSC2
0
R/W
Time Prescaler 2 to 0
1
TPSC1
0
R/W
000: Internal clock: count by φ
0
TPSC0
0
R/W
001: Internal clock: count by φ/2
010: Internal clock: count by φ/4
011: Internal clock: count by φ/8
1XX: External clock: count by FTIOA0 (TCLK) pin input
Notes: 1. When GR functions as an output compare register, TCNT is cleared by compare match.
When GR functions as input capture, TCNT is cleared by input capture.
2. Synchronous operation is set by TMDR.
3. X: Don’t care
13.3.10
Timer I/O Control Register (TIORA and TIORC)
The TIOR registers control the general registers (GR). Timer Z has four TIOR registers
(TIORA_0, TIORA_1, TIORC_0, and TIORC_1), two for each channel. In PWM mode including
complementary PWM mode and reset synchronous PWM mode, the settings of TIOR are invalid.
TIORA: TIORA selects whether GRA or GRB is used as an output compare register or an input
capture register. When an output compare register is selected, the output setting is selected. When
an input capture register is selected, an input edge of an input capture signal is selected. TIORA
also selects the function of FTIOA or FTIOB pin.
Bit
Bit Name
Initial
value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
IOB2
0
R/W
I/O Control B2 to B0
5
IOB1
0
R/W
GRB is an output compare register:
4
IOB0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRB compare match
010: 1 output by GRB compare match
011: Toggle output by GRB compare match
GRB is an input capture register:
100: Input capture to GRB at the rising edge
101: Input capture to GRB at the falling edge
11X: Input capture to GRB at both rising and falling edges
Rev. 3.00, 05/03, page 184 of 472
Bit
Bit Name
Initial
value
R/W
Description
3
1
Reserved
This bit is always read as 1.
2
IOA2
0
R/W
I/O Control A2 to A0
1
IOA1
0
R/W
GRA is an output compare register:
0
IOA0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRA compare match
010: 1 output by GRA compare match
011: Toggle output by GRA compare match
GRA is an input capture register:
100: Input capture to GRA at the rising edge
101: Input capture to GRA at the falling edge
11X: Input capture to GRA at both rising and falling edges
Legend: X: Don't care
TIORC: TIORC selects whether GRC or GRD is used as an output compare register or an input
capture register. When an output compare register is selected, the output setting is selected. When
an input capture register is selected, an input edge of an input capture signal is selected. TIORC
also selects the function of FTIOC or FTIOD pin.
Bit
Bit Name
Initial
value
R/W
Description
7
1
Reserved
This bit is always read as 1.
6
IOD2
0
R/W
I/O Control D2 to D0
5
IOD1
0
R/W
GRD is an output compare register:
4
IOD0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRD compare match
010: 1 output by GRD compare match
011: Toggle output by GRD compare match
GRD is an input capture register:
100: Input capture to GRD at the rising edge
101: Input capture to GRD at the falling edge
11X: Input capture to GRD at both rising and falling
edges
Rev. 3.00, 05/03, page 185 of 472
Bit
Bit Name
Initial
value
R/W
Description
3
1
Reserved
This bit is always read as 1.
2
IOC2
0
R/W
I/O Control C2 to C0
1
IOC1
0
R/W
GRC is an output compare register:
0
IOC0
0
R/W
000: Disables pin output by compare match
001: 0 output by GRC compare match
010: 1 output by GRC compare match
011: Toggle Output by GRC compare match
GRC is an input capture register:
100: Input capture to GRC at the rising edge
101: Input capture to GRC at the falling edge
11X: Input capture to GRC at both rising and falling
edges
Legend: X: Don't care
13.3.11
Timer Status Register (TSR)
TSR indicates generation of an overflow/underflow of TCNT and a compare match/input capture
of GRA, GRB, GRC, and GRD. These flags are interrupt sources. If an interrupt is enabled by a
corresponding bit in TIER, TSR requests an interrupt for the CPU. Timer Z has two TSR registers,
one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7, 6
All 1
Reserved
5
UDF*
0
R/W
These bits are always read as 1.
Underflow Flag
[Setting condition]
•
When TCNT_1 underflows
[Clearing condition]
•
4
OVF
0
R/W
When 0 is written to UDF after reading UDF = 1
Overflow Flag
[Setting condition]
•
When the TCNT value underflows
[Clearing condition]
•
Rev. 3.00, 05/03, page 186 of 472
When 0 is written to OVF after reading OVF = 1
Bit
Bit Name
Initial
value
R/W
3
IMFD
0
R/W
Description
Input Capture/Compare Match Flag D
[Setting conditions]
•
When TCNT = GRD and GRD is functioning as output
compare register
•
When TCNT value is transferred to GRD by input
capture signal and GRD is functioning as input
capture register
[Clearing condition]
•
2
IMFC
0
R/W
When 0 is written to IMFD after reading IMFD = 1
Input Capture/Compare Match Flag C
[Setting conditions]
•
When TCNT = GRC and GRC is functioning as output
compare register
•
When TCNT value is transferred to GRC by input
capture signal and GRC is functioning as input
capture register
[Clearing condition]
•
1
IMFB
0
R/W
When 0 is written to IMFC after reading IMFC = 1
Input Capture/Compare Match Flag B
[Setting conditions]
•
When TCNT = GRB and GRB is functioning as output
compare register
•
When TCNT value is transferred to GRB by input
capture signal and GRB is functioning as input
capture register
[Clearing condition]
•
0
IMFA
0
R/W
When 0 is written to IMFB after reading IMFB = 1
Input Capture/Compare Match Flag A
[Setting conditions]
•
When TCNT = GRA and GRA is functioning as output
compare register
•
When TCNT value is transferred to GRA by input
capture signal and GRA is functioning as input
capture register
[Clearing condition]
•
When 0 is written to IMFA after reading IMFA = 1
Note: Bit 5 is not the UDF flag in TSR_0. It is a reserved bit. It is always read as 1.
Rev. 3.00, 05/03, page 187 of 472
13.3.12
Timer Interrupt Enable Register (TIER)
TIER enables or disables interrupt requests for overflow or GR compare match/input capture.
Timer Z has two TIER registers, one for each channel.
Bit
Bit Name
Initial
value
R/W
Description
7 to 5
All 1
Reserved
These bits are always read as 1.
4
OVIE
0
R/W
Overflow Interrupt Enable
0: Interrupt requests (OVI) by OVF or UDF flag are
disabled
1: Interrupt requests (OVI) by OVF or UDF flag are
enabled
3
IMIED
0
R/W
Input Capture/Compare Match Interrupt Enable D
0: Interrupt requests (IMID) by IMFD flag are disabled
1: Interrupt requests (IMID) by IMFD flag are enabled
2
IMIEC
0
R/W
Input Capture/Compare Match Interrupt Enable C
0: Interrupt requests (IMIC) by IMFC flag are disabled
1: Interrupt requests (IMIC) by IMFC flag are enabled
1
IMIEB
0
R/W
Input Capture/Compare Match Interrupt Enable B
0: Interrupt requests (IMIB) by IMFB flag are disabled
1: Interrupt requests (IMIB) by IMFB flag are enabled
0
IMIEA
0
R/W
Input Capture/Compare Match Interrupt Enable A
0: Interrupt requests (IMIA) by IMFA flag are disabled
1: Interrupt requests (IMIA) by IMFA flag are enabled
Rev. 3.00, 05/03, page 188 of 472
13.3.13
PWM Mode Output Level Control Register (POCR)
POCR control the active level in PWM mode. Timer Z has two POCR registers, one for each
channel.
Bit
Bit Name
Initial
value
R/W
Description
7 to 3
All 1
Reserved
These bits are always read as 1.
2
POLD
0
R/W
PWM Mode Output Level Control D
0: The output level of FTIOD is low-active
1: The output level of FTIOD is high-active
1
POLC
0
R/W
PWM Mode Output Level Control C
0: The output level of FTIOC is low-active
1: The output level of FTIOC is high-active
0
POLB
0
R/W
PWM Mode Output Level Control B
0: The output level of FTIOB is low-active
1: The output level of FTIOB is high-active
13.3.14 Interface with CPU
1. 16-bit register
TCNT and GR are 16-bit registers. Reading/writing in a 16-bit unit is enabled but disabled in
an 8-bit unit since the data bus with the CPU is 16-bit width. These registers must always be
accessed in a 16-bit unit. Figure 13.5 shows an example of accessing the 16-bit registers.
Internal data bus
H
C
P
L
Module data bus
Bus interface
U
TCNTH
TCNTL
Figure 13.5 Accessing Operation of 16-Bit Register (between CPU and TCNT (16 bits))
Rev. 3.00, 05/03, page 189 of 472
2. 8-bit register
Registers other than TCNT and GR are 8-bit registers that are connected internally with the
CPU in an 8-bit width. Figure 13.6 shows an example of accessing the 8-bit registers.
Internal data bus
H
C
P
L
Module data bus
Bus interface
U
TSTR
Figure 13.6 Accessing Operation of 8-Bit Register (between CPU and TSTR (8 bits))
Rev. 3.00, 05/03, page 190 of 472
13.4
Operation
13.4.1
Counter Operation
When one of bits STR0 and STR1 in TSTR is set to 1, the TCNT counter for the corresponding
channel begins counting. TCNT can operate as a free-running counter, periodic counter, for
example. Figure 13.7 shows an example of the counter operation setting procedure.
Operation selection
Select counter clock
[1]
Periodic counter
Free-running counter
Select counter clearing source
[2]
Select output compare register
[3]
Set period
Start count operation
[4]
[5]
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. When an external
clock is selected, select
the external clock edge
with bits CKEG1
and CKEG0 in TCR.
[2] For periodic counter
operation, select the
TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
[3] Designate the general
register selected in [2]
as an output compare
register by means of
TIOR.
[4] Set the periodic counter
cycle in the general
register selected
in [2].
[5] Set the STR bit in TSTR
to 1 to start the counter
operation.
Figure 13.7 Example of Counter Operation Setting Procedure
1. Free-running count operation and periodic count operation
Immediately after a reset, the TCNT counters for channels 0 and 1 are all designated as freerunning counters. When the relevant bit in TSTR is set to 1, the corresponding TCNT counter
starts an increment operation as a free-running counter. When TCNT overflows, the OVF flag
in TSR is set to 1. If the value of the OVIE bit in the corresponding TIER is 1 at this point,
timer Z requests an interrupt. After overflow, TCNT starts an increment operation again from
H'0000.
Figure 13.8 illustrates free-running counter operation.
Rev. 3.00, 05/03, page 191 of 472
TCNT value
H'FFFF
H'0000
Time
STR0,
STR1
OVF
Figure 13.8 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the relevant
channel performs periodic count operation. The GR registers for setting the period are designated
as output compare registers, and counter clearing by compare match is selected by means of bits
CCLR1 and CCLR0 in TCR. After the settings have been made, TCNT starts an increment
operation as a periodic counter when the corresponding bit in TSTR is set to 1. When the count
value matches the value in GR, the IMFA, IMFB, IMFC, or IMFD flag in TSR is set to 1 and
TCNT is cleared to H'0000.
If the value of the corresponding IMIEA, IMIEB, IMIEC, or IMIED bit in TIER is 1 at this point,
the timer Z requests an interrupt. After a compare match, TCNT starts an increment operation
again from H'0000.
Figure 13.9 illustrates periodic counter operation.
Rev. 3.00, 05/03, page 192 of 472
TCNT value
Counter cleared by GR compare match
GR value
H'0000
Time
STR
IMF
Figure 13.9 Periodic Counter Operation
2. TCNT count timing
A. Internal clock operation
A system clock (φ) or three types of clocks (φ/2, φ/4, or φ/8) that divides the system clock
can be selected by bits TPSC2 to TPSC0 in TCR.
Figure 13.10 illustrates this timing.
φ
Internal clock
TCNT input
TCNT
N-1
N
N+1
Figure 13.10 Count Timing at Internal Clock Operation
B. External clock operation
An external clock input pin (TCLK) can be selected by bits TPSC2 to TPSC0 in TCR, and
a detection edge can be selected by bits CKEG1 and CKEG0. To detect an external clock,
the rising edge, falling edge, or both edges can be selected. The pulse width of the external
clock needs two or more system clocks. Note that an external clock does not operate
correctly with the lower pulse width.
Rev. 3.00, 05/03, page 193 of 472
Figure 13.11 illustrates the detection timing of the rising and falling edges.
φ
External clock input pin
TCNT input
TCNT
N-1
N
N+1
Figure 13.11 Count Timing at External Clock Operation (Both Edges Detected)
13.4.2
Waveform Output by Compare Match
Timer Z can perform 0, 1, or toggle output from the corresponding FTIOA, FTIOB, FTIOC, or
FTIOD output pin using compare match A, B, C, or D.
Figure 13.12 shows an example of the setting procedure for waveform output by compare match.
Output selection
Select waveform output mode
[1]
Set output timing
[2]
Enable waveform output
[3]
Start count operation
[4]
[1] Select 0 output, 1 output, or toggle
output as a compare much output, by
means of TIOR. The initial values set in
TOCR are output unit the first compare
match occurs.
[2] Set the timing for compare match
generation in GRA/GRB/GRC/GRD.
[3] Enable or disable the timer output by
TOER.
[4] Set the STR bit in TSTR to 1 to start the
TCNT count operation.
<Waveform output>
Figure 13.12 Example of Setting Procedure for Waveform Output by Compare Match
Rev. 3.00, 05/03, page 194 of 472
1. Examples of waveform output operation
Figure 13.13 shows an example of 0 output/1 output.
In this example, TCNT has been designated as a free-running counter, and settings have been
made such that 0 is output by compare match A, and 1 is output by compare match B. When
the set level and the pin level coincide, the pin level does not change.
TCNT value
H'FFFF
Time
H'0000
FTIOB
No change
FTIOA
No change
No change
No change
Figure 13.13 Example of 0 Output/1 Output Operation
Figure 13.14 shows an example of toggle output.
In this example, TCNT has been designated as a periodic counter (with counter clearing on
compare match B), and settings have been made such that the output is toggled by both
compare match A and compare match B.
Rev. 3.00, 05/03, page 195 of 472
TCNT value
GRB
GRA
Time
H'0000
Toggle output
FTIOB
FTIOA
Toggle output
Figure 13.14 Example of Toggle Output Operation
2. Output compare timing
The compare match signal is generated in the last state in which TCNT and GR match (when
TCNT changes from the matching value to the next value). When the compare match signal is
generated, the output value selected in TIOR is output at the compare match output pin
(FTIOA, FTIOB, FTIOC, or FTIOD). When TCNT matches GR, the compare match signal is
generated only after the next TCNT input clock pulse is input.
Figure 13.15 shows an example of the output compare timing.
φ
TCNT input
TCNT
N
GR
N
N+1
Compare match
signal
FTIOA to FTIOD
Figure 13.15 Output Compare Timing
Rev. 3.00, 05/03, page 196 of 472
13.4.3
Input Capture Function
The TCNT value can be transferred to GR on detection of the input edge of the input
capture/output compare pin (FTIOA, FTIOB, FTIOC, or FTIOD). Rising edge, falling edge, or
both edges can be selected as the detected edge. When the input capture function is used, the pulse
width or period can be measured.
Figure 13.16 shows an example of the input capture operation setting procedure.
Input selection
Select input edge of
input capture
[1]
Start counter operation
[2]
[1] Designate GR as an input capture
register by means of TIOR, and select
rising edge, falling edge, or both edges
as the input edge of the input capture
signal.
[2] Set the STR bit in TSTR to 1 to start the
TCNT counter operation.
<Input capture operation>
Figure 13.16 Example of Input Capture Operation Setting Procedure
1. Example of input capture operation
Figure 13.17 shows an example of input capture operation.
In this example, both rising and falling edges have been selected as the FTIOA pin input
capture input edge, the falling edge has been selected as the FTIOB pin input capture input
edge, and counter clearing by GRB input capture has been designated for TCNT.
Rev. 3.00, 05/03, page 197 of 472
Counter cleared by FTIOB input (rising edge)
TCNT value
H'0180
H'0160
H'0005
H'0000
Time
FTIOB
FTIOA
GRA
H'0005
H'0160
GRB
H'0180
Figure 13.17 Example of Input Capture Operation
2. Input capture signal timing
Input capture on the rising edge, falling edge, or both edges can be selected through settings in
TIOR. Figure 13.18 shows the timing when the rising edge is selected. The pulse width of the
input capture signal must be at least two system clock (φ) cycles.
φ
Input capture input
Input capture signal
TCNT
N
GR
N
Figure 13.18 Input Capture Signal Timing
Rev. 3.00, 05/03, page 198 of 472
13.4.4
Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten
simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared
simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous
operation enables GR to be increased with respect to a single time base.
Figure 13.19 shows an example of the synchronous operation setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Select counter
clearing source
[4]
Start counter operation
[5]
Start counter operation
[5]
<Counter clearing>
<Synchronous clearing>
[1] Set the SYNC bits in TMDR to 1.
[2] When a value is written to either of the TCNT counters, the same value is simultaneously written to the
other TCNT counter.
[3] Set bits CCLR1 and CCLR0 in TCR to specify counter clearing by compare match/input capture.
[4] Set bits CCLR1 and CCLR0 in TCR to designate synchronous clearing for the counter clearing source.
[5] Set the STR bit in TSTR to 1 to start the count operation.
Figure 13.19 Example of Synchronous Operation Setting Procedure
Figure 13.20 shows an example of synchronous operation. In this example, synchronous operation
has been selected, FTIOB0 and FTIOB1 have been designated for PWM mode, GRA_0 compare
match has been set as the channel 0 counter clearing source, and synchronous clearing has been set
for the channel 1 counter clearing source. Two-phase PWM waveforms are output from pins
FTIOB0 and FTIOB1. At this time, synchronous presetting and synchronous operation by GRA_0
compare match are performed by TCNT counters.
Rev. 3.00, 05/03, page 199 of 472
For details on PWM mode, see section 13.4.5, PWM Mode.
TCNT values
Synchronous clearing by GRA_0 compare match
GRA_0
GRA_1
GRB_0
GRB_1
H'0000
Time
FTIOB0
FTIOB1
Figure 13.20 Example of Synchronous Operation
13.4.5
PWM Mode
In PWM mode, PWM waveforms are output from the FTIOB, FTIOC, and FTIOD output pins
with GRA as a cycle register and GRB, GRC, and GRD as duty registers. The initial output level
of the corresponding pin depends on the setting values of TOCR and POCR. Table 13.3 shows an
example of the initial output level of the FTIOB0 pin.
The output level is determined by the POLB to POLD bits corresponding to POCR. When POLB
is 0, the FTIOB output pin is set to 0 by compare match B and set to 1 by compare match A.
When POLB is 1, the FTIOB output pin is set to 1 by compare match B and cleared to 0 by
compare match A. In PWM mode, maximum 6-phase PWM outputs are possible.
Figure 13.21 shows an example of the PWM mode setting procedure.
Rev. 3.00, 05/03, page 200 of 472
Table 13.3 Initial Output Level of FTIOB0 Pin
TOB0
POLB
Initial Output Level
0
0
1
0
1
0
1
0
0
1
1
1
PWM mode
Select counter clock
[1]
Select counter clearing source
[2]
Set PWM mode
[3]
Set initial output level
[4]
Select output level
[5]
Set GR
[6]
Enable waveform output
[7]
Start counter operation
[8]
[1] Select the counter clock with bits TPSC2
to TOSC0 in TCR. When an external
clock is selected, select the external
clock edge with bits CKEG1 and CKEG0
in TCR.
[2] Use bits CCLR1 and CCLR0 in TCR to
select the counter clearing source.
[3] Select the PWM mode with bits PWMB0
to PWMD0 and PWMB1 to PWMD1 in
TPMR.
[4] Set the initial output value with bits
TOB0 to TOD0 and TOB1 to TOD1 in
TOCR.
[5] Set the output level with bits POLB to
POLD in POCR.
[6] Set the cycle in GRA, and set the duty in
the other GR.
[7] Enable or disable the timer output by
TOER.
[8] Set the STR bit in TSTR to 1 and start
the counter operation.
<PWM mode>
Figure 13.21 Example of PWM Mode Setting Procedure
Rev. 3.00, 05/03, page 201 of 472
Figure 13.22 shows an example of operation in PWM mode. The output signals go to 1 and TCNT
is reset at compare match A, and the output signals go to 0 at compare match B, C, and D (TOB,
TOC, and TOD = 0, POLB, POLC, and POLD = 0).
Counter cleared by GRA compare match
TCNT value
GRA
GRB
GRC
GRD
H'0000
Time
FTIOB
FTIOC
FTIOD
Figure 13.22 Example of PWM Mode Operation (1)
Figure 13.23 shows another example of operation in PWM mode. The output signals go to 0 and
TCNT is reset at compare match A, and the output signals go to 1 at compare match B, C, and D
(TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1).
Rev. 3.00, 05/03, page 202 of 472
Counter cleared by GRA compare match
TCNT value
GRA
GRB
GRC
GRD
H'0000
Time
FTIOB
FTIOC
FTIOD
Figure 13.23 Example of PWM Mode Operation (2)
Figures 13.24 (when TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 0) and 13.25 (when
TOB, TOC, and TOD = 0, POLB, POLC, and POLD = 1) show examples of the output of PWM
waveforms with duty cycles of 0% and 100% in PWM mode.
Rev. 3.00, 05/03, page 203 of 472
TCNT value
GRB rewritten
GRA
GRB
GRB rewritten
Time
H'0000
0% duty
FTIOB
TCNT value
GRB rewritten
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
GRA
GRB rewritten
GRB rewritten
GRB
H'0000
Time
FTIOB
100% duty
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
TCNT value
GRB rewritten
GRB rewritten
GRA
GRB rewritten
GRB
H'0000
Time
FTIOB
100% duty
0% duty
Figure 13.24 Example of PWM Mode Operation (3)
Rev. 3.00, 05/03, page 204 of 472
TCNT value
GRB rewritten
GRA
GRB
GRB rewritten
H'0000
Time
FTIOB
0% duty
TCNT value
GRB rewritten
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
GRA
GRB rewritten
GRB rewritten
GRB
Time
H'0000
100% duty
FTIOB
When cycle register and duty register compare matches
occur simultaneously, duty register compare match has
priority.
TCNT value
GRB rewritten
GRB rewritten
GRA
GRB rewritten
GRB
Time
H'0000
FTIOB
100% duty
0% duty
Figure 13.25 Example of PWM Mode Operation (4)
Rev. 3.00, 05/03, page 205 of 472
13.4.6
Reset Synchronous PWM Mode
Three normal- and counter-phase PWM waveforms are output by combining channels 0 and 1 that
one of changing points of waveforms will be common.
In reset synchronous PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become
PWM-output pins automatically. TCNT_0 performs an increment operation. Tables 13.4 and
13.5 show the PWM-output pins used and the register settings, respectively.
Figure 13.26 shows the example of reset synchronous PWM mode setting procedure.
Table 13.4 Output Pins in Reset Synchronous PWM Mode
Channel
Pin Name
Input/Output
Pin Function
0
FTIOC0
Output
Toggle output in synchronous with PWM cycle
0
FTIOB0
Output
PWM output 1
0
FTIOD0
Output
PWM output 1 (counter-phase waveform of PWM
output 1)
1
FTIOA1
Output
PWM output 2
1
FTIOC1
Output
PWM output 2 (counter-phase waveform of PWM
output 2)
1
FTIOB1
Output
PWM output 3
1
FTIOD1
Output
PWM output 3 (counter-phase waveform of PWM
output 3)
Table 13.5 Register Settings in Reset Synchronous PWM Mode
Register
Description
TCNT_0
Initial setting of H'0000
TCNT_1
Not used (independently operates)
GRA_0
Sets counter cycle of TCNT_0
GRB_0
Set a changing point of the PWM waveform output from pins FTIOB0 and
FTIOD0.
GRA_1
Set a changing point of the PWM waveform output from pins FTIOA1 and
FTIOC1.
GRB_1
Set a changing point of the PWM waveform output from pins FTIOB1 and
FTIOD1.
Rev. 3.00, 05/03, page 206 of 472
Reset synchronous PWM mode
Stop counter operation
[1]
Select counter clock
[2]
Select counter clearing source
[3]
Set reset synchronous PWM mode
[4]
Initialize the output pin
[5]
Set TCNT
[6]
Set GR
[7]
Enable waveform output
[8]
Start counter operation
[9]
[1] Clear bit STR0 in TSTR to 0 and stop the
counter operation of TCNT_0. Set reset
synchronous PWM mode after TCNT_0
stops.
[2] Select the counter clock with bits TPSC2
to TOSC0 in TCR. When an external
clock is selected, select the external clock
edge with bits CKEG1 and CKEG0 in
TCR.
[3] Use bits CCLR1 and CCLR0 in TCR to
select counter clearing source GRA_0.
[4] Select the reset synchronous PWM mode
with bits CMD1 and CMD0 in TFCR.
FTIOB0 to FTIOD0 and FTIOA1 to
FTIOD1 become PWM output pins
automatically.
[5] Set H'00 to TOCR.
[6] Set TCNT_0 as H'0000. TCNT1 does not
need to be set.
[7] GRA_0 is a cycle register. Set a cycle for
GRA_0. Set the changing point timing of
the PWM output waveform for GRB_0,
GRA_1, and GRB_1.
[8] Enable or disable the timer output by
TOER.
[9] Set the STR bit in TSTR to 1 and start the
counter operation.
<Reset synchronous PWM mode>
Figure 13.26 Example of Reset Synchronous PWM Mode Setting Procedure
Rev. 3.00, 05/03, page 207 of 472
Figures 13.27 and 13.28 show examples of operation in reset synchronous PWM mode.
Counter cleared by GRA compare match
TCNT value
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.27 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 1)
Rev. 3.00, 05/03, page 208 of 472
Counter cleared by GRA compare match
TCNT value
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.28 Example of Reset Synchronous PWM Mode Operation (OLS0 = OLS1 = 0)
In reset synchronous PWM mode, TCNT_0 and TCNT_1 perform increment and independent
operations, respectively. However, GRA_1 and GRB_1 are separated from TCNT_1. When a
compare match occurs between TCNT_0 and GRA_0, a counter is cleared and an increment
operation is restarted from H'0000.
The PWM pin outputs 0 or 1 whenever a compare match between GRB_0, GRA_1, GRB_1 and
TCNT_0 or counter clearing occur.
For details on operations when reset synchronous PWM mode and buffer operation are
simultaneously set, refer to section 13.4.8, Buffer Operation.
Rev. 3.00, 05/03, page 209 of 472
13.4.7
Complementary PWM Mode
Three PWM waveforms for non-overlapped normal and counter phases are output by combining
channels 0 and 1.
In complementary PWM mode, the FTIOB0 to FTIOD0 and FTIOA1 to FTIOD1 pins become
PWM-output pins automatically. TCNT_0 and TCNT_1 perform an increment or decrement
operation. Tables 13.6 and 13.7 show the output pins and register settings in complementary PWM
mode, respectively.
Figure 13.29 shows the example of complementary PWM mode setting procedure.
Table 13.6 Output Pins in Complementary PWM Mode
Channel
Pin Name
Input/Output
Pin Function
0
FTIOC0
Output
Toggle output in synchronous with PWM cycle
0
FTIOB0
Output
PWM output 1
0
FTIOD0
Output
PWM output 1 (counter-phase waveform nonoverlapped with PWM output 1)
1
FTIOA1
Output
PWM output 2
1
FTIOC1
Output
PWM output 2 (counter-phase waveform nonoverlapped with PWM output 2)
1
FTIOB1
Output
PWM output 3
1
FTIOD1
Output
PWM output 3 (counter-phase waveform nonoverlapped with PWM output 3)
Table 13.7 Register Settings in Complementary PWM Mode
Register
Description
TCNT_0
Initial setting of non-overlapped periods (non-overlapped periods are differences
with TCNT_1)
TCNT_1
Initial setting of H'0000
GRA_0
Sets (upper limit value – 1) of TCNT_0
GRB_0
Set a changing point of the PWM waveform output from pins FTIOB0 and
FTIOD0.
GRA_1
Set a changing point of the PWM waveform output from pins FTIOA1 and
FTIOC1.
GRB_1
Set a changing point of the PWM waveform output from pins FTIOB1 and
FTIOD1.
Rev. 3.00, 05/03, page 210 of 472
Complementary PWM mode
Stop counter operation
[1]
Initialize output pin
[2]
Select counter clock
[3]
Set complementary
PWM mode
[4]
Initialize output pin
[5]
Set TCNT
[6]
Set GR
[7]
Enable waveform output
[8]
Start counter operation
[9]
[1] Clear bits STR0 and STR1 in TSTR to 0,
and stop the counter operation of
TCNT_0. Stop TCNT_0 and TCNT_1 and
set complementary PWM mode.
[2] Write H'00 to TOCR.
[3] Use bits TPSC2 to TPSC0 in TCR to
select the same counter clock for channels
0 and 1. When an external clock is
selected, select the edge of the external
clock by bits CKEG1 and CKEG0 in TCR.
Do not use bits CCLR1 and CCLR0 in
TCR to clear the counter.
[4] Use bits CMD1 and CMD0 in TFCR to set
complementary PWM mode. FTIOB0 to
FTIOD0 and FTIOA1 to FTIOD1
automatically become PWM output pins.
[5] Set H'00 to TOCR.
[6] TCNT_1 must be H'0000. Set a nonoverlapped period to TCNT_0.
[7] GRA_0 is a cycle register. Set the cycle to
GRA_0. Set the timing to change the
PWM output waveform to GRB_0, GRA_1,
and GRB_1. Note that the timing must be
set within the range of compare match
carried out for TCNT_0 and TCNT_1.
T X (X: Initial value of GRB_0, GRA_1,
and GRB_1)
[8] Use TOER to enable or disable the timer
output.
[9] Set the STR0 and STR1 bits in TSTR to 1
to start the count operation.
<Complementary PWM mode>
Note: To re-enter complementary PWM mode after it has been
cancelled during operation, repeat the setting procedures from [1].
Figure 13.29 Example of Complementary PWM Mode Setting Procedure
Rev. 3.00, 05/03, page 211 of 472
1.
Canceling Procedure of Complementary PWM Mode: Figure 13.30 shows the complementary
PWM mode canceling procedure.
Complementary PWM mode
Stop counter operation
[1]
Cancel complementary
PWM mode
[2]
[1] Clear bit CMD1 in TFCR to 0, and set
channels 0 and 1 to normal operation.
[2] After setting channels 0 and 1 to normal
operation, clear bits STR0 and STR1 in
TSTR to 0 and stop TCNT0 and TCNT1.
<Normal operation>
Figure 13.30 Canceling Procedure of Complementary PWM Mode
2. Examples of Complementary PWM Mode Operation: Figure 13.31 shows an example of
complementary PWM mode operation. In complementary PWM mode, TCNT_0 and TCNT_1
perform an increment or decrement operation. When TCNT_0 and GRA_0 are compared and
their contents match, the counter is decremented, and when TCNT_1 underflows, the counter
is incremented. In GRA_0, GRA_1, and GRB_1, compare match is carried out in the order of
TCNT_0 → TCNT_1 → TCNT_1 → TCNT_0 and PWM waveform is output, during one
cycle of a up/down counter. In this mode, the initial setting will be TCNT_0 > TCNT_1.
Rev. 3.00, 05/03, page 212 of 472
TCNT_0 and GRA_0 are compared and their contents match
TCNT values
GRA_0
GRB_0
GRA_1
GRB_1
H'0000
Time
FTIOB0
FTIOD0
FTIOA1
FTIOC1
FTIOB1
FTIOD1
FTIOC0
Figure 13.31 Example of Complementary PWM Mode Operation (1)
Figure 13.32 shows examples of PWM waveform output with 0% duty and 100% duty in
complementary PWM mode (for one phase). In this example, by setting the GRB_0 to a value
equal to or more than GRA_0, and H'0000 for the value of GRB_0, the waveform with a duty of
0% and 100% can be output. When buffer operation is also used, manipulation of the above
operation and modification of the duty can be done easily during operation. For details on buffer
operation, refer to section 13.4.8, Buffer Operation.
Rev. 3.00, 05/03, page 213 of 472
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
0% duty
(a) When duty is 0%
TCNT values
GRA0
GRB0
H'0000
Time
FTIOB0
FTIOD0
100% duty
(b) When duty is 100%
Figure 13.32 Example of Complementary PWM Mode Operation (2)
In complementary PWM mode, when the counter switches from up-counter to down-counter or
vice versa, TCNT_0 and TCNT_1 overshoots or undershoots, respectively. In this case, the
conditions to set the IMFA flag in channel 0 and the UDF flag in channel 1 differ from usual
Rev. 3.00, 05/03, page 214 of 472
settings. Also, the transfer conditions in buffer operation differ from usual settings. Such timings
are shown in figures 13.33 and 13.34.
TCNT
N-1
N
GRA_0
N
N+1
N-1
N
IMFA
Set to 1
Flag is not set
Buffer transfer signal
GR
Transferred
to buffer
Not transferred
to buffer
Figure 13.33 Timing of Overshooting
TCNT
H'0001
H'0000
H'FFFF
H'0000
H'0001
Flag is not set
UDF
Set to 1
Buffer transfer signal
GR
Transferred
to buffer
Not transferred
to buffer
Figure 13.34 Timing of Undershooting
When the counter is incremented or decremented, the IMFA flag of channel 0 is set to 1, and when
the register is underflowed, the UDF flag of channel 0 is set to 1. After buffer operation has been
designated for BR, BR is transferred to GR when the counter is incremented by compare match
A0 or when TCNT_1 is underflowed.
Rev. 3.00, 05/03, page 215 of 472
3. Setting GR Value in Complementary PWM Mode: To set GR or modify GR during operation
in complementary PWM mode, refer to the following notes.
A. Initial value
a. H'0000 to T – 1 (T: Initial value of TCNT0) must not be set for the initial value.
b. GRA_0 – (T – 1) or more must not be set for the initial value.
c. When using buffer operation, the same values must be set in the buffer registers and
corresponding general registers.
B. Modifying the setting value
Use buffer operation. When GR is written to directly, a correct waveform may not be
output. Do not change settings of GRA_0 during operation.
13.4.8
Buffer Operation
Buffer operation differs depending on whether GR has been designated for an input capture
register or an output compare register, or in reset synchronous PWM mode or complementary
PWM mode.
Table 13.8 shows the register combinations used in buffer operation.
Table 13.8 Register Combinations in Buffer Operation
General Register
Buffer Register
GRA
GRC
GRB
GRD
1. When GR is an output compare register
When a compare match occurs, the value in the buffer register of the corresponding channel is
transferred to the general register.
This operation is illustrated in figure 13.35.
Compare match signal
Buffer
register
Buffer register
Comparator
Figure 13.35 Compare Match Buffer Operation
Rev. 3.00, 05/03, page 216 of 472
TCNT
2. When GR is an input capture register
When an input capture occurs, the value in TCNT is transferred to the general register and the
value previously stored in the general register is transferred to the buffer register.
This operation is illustrated in figure 13.36.
Input capture
signal
Buffer
register
Buffer register
TCNT
Figure 13.36 Input Capture Buffer Operation
3. Complementary PWM Mode
When the counter switches from counting up to counting down or vice versa, the value of the
buffer register is transferred to the general register. Here, the value of the buffer register is
transferred to the general register in the following timing:
A. When TCNT_0 and GRA_0 are compared and their contents match
B. When TCNT_1 underflows
4. Reset Synchronous PWM Mode
The value of the buffer register is transferred from compare match A0 to the general register.
5. Example of Buffer Operation Setting Procedure
Figure 13.37 shows an example of the buffer operation setting procedure.
Buffer operation
Select GR function
[1]
Set buffer operation
[2]
Start count operation
[3]
[1] Designate GR as an input capture register
or output compare register by means of
TIOR.
[2] Designate GR for buffer operation with bits
BFD1, BFC1, BFD0, or BFC0 in TMDR.
[3] Set the STR bit in TSTR to 1 to start the
count operation of TCNT.
<Buffer operation>
Figure 13.37 Example of Buffer Operation Setting Procedure
Rev. 3.00, 05/03, page 217 of 472
6. Examples of Buffer Operation
Figure 13.38 shows an operation example in which GRA has been designated as an output
compare register, and buffer operation has been designated for GRA and GRC.
This is an example of TCNT operating as a periodic counter cleared by compare match B.
Pins FTIOA and FTIOB are set for toggle output by compare match A and B.
As buffer operation has been set, when compare match A occurs, the FTIOA pin performs
toggle outputs and the value in buffer register is simultaneously transferred to the general
register. This operation is repeated each time that compare match A occurs.
The timing to transfer data is shown in figure 13.39.
Counter is cleared by GBR compare match
TCNT value
GRB
H'0250
H'0200
H'0100
Time
H'0000
GRC
H'0200
H'0100
GRA
H'0250
H'0200
H'0200
H'0100
H'0200
FTIOB
FTIOA
Compare match A
Figure 13.38 Example of Buffer Operation (1)
(Buffer Operation for Output Compare Register)
Rev. 3.00, 05/03, page 218 of 472
φ
TCNT
n
n+1
Compare match
signal
Buffer transfer
signal
GRC
GRA
N
n
N
Figure 13.39 Example of Compare Match Timing for Buffer Operation
Figure 13.40 shows an operation example in which GRA has been designated as an input capture
register, and buffer operation has been designated for GRA and GRC.
Counter clearing by input capture B has been set for TCNT, and falling edges have been selected
as the FIOCB pin input capture input edge. And both rising and falling edges have been selected
as the FIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in GRA upon the occurrence of
input capture A, the value previously stored in GRA is simultaneously transferred to GRC. The
transfer timing is shown in figure 13.41.
Rev. 3.00, 05/03, page 219 of 472
Counter is cleared by the input capture B
TCNT value
H'0180
H'0160
H'0005
H'0000
Time
FTIOB
FTIOA
GRA
H'0005
H'0160
GRC
H'0005
GRB
H'0160
H'0180
Input capture A
Figure 13.40 Example of Buffer Operation (2)
(Buffer Operation for Input Capture Register)
Rev. 3.00, 05/03, page 220 of 472
φ
FTIO pin
Input capture
signal
TCNT
n
n+1
N
N+1
GRA
M
n
n
N
GRC
m
M
M
n
Figure 13.41 Input Capture Timing of Buffer Operation
Figures 13.42 and 13.43 show the operation examples when buffer operation has been designated
for GRB_0 and GRD_0 in complementary PWM mode. These are examples when a PWM
waveform of 0% duty is created by using the buffer operation and performing GRD_0 ≥ GRA_0.
Data is transferred from GRD_0 to GRB_0 according to the settings of CMD_0 and CMD_1 when
TCNT_0 and GRA_0 are compared and their contents match or when TCNT_1 underflows.
However, when GRD_0 ≥ GRA_0, data is transferred from GRD_0 to GRB_0 when TCNT_1
underflows regardless of the setting of CMD_0 and CMD_1. When GRD_0 = H'0000, data is
transferred from GRD_0 to GRB_0 when TCNT_0 and GRA_0 are compared and their contents
match regardless of the settings of CMD_0 and CMD_1.
Rev. 3.00, 05/03, page 221 of 472
TCNT values
GRB_0 (When restored, data will be transferred
to the saved location regardless of the
CMD1 and CMD0 values)
TCNT_0
GRA_0
TCNT_1
H'0999
H'0000
Time
GRD_0
H'0999
GRB_0
H'0999
H'1FFF
H'0999
H'1FFF
H'0999
H'0999
FTIOB0
FTIOD0
Figure 13.42 Buffer Operation (3)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1)
Rev. 3.00, 05/03, page 222 of 472
GRB_0 (When restored, data will be transferred
to the saved location regardless of the
CMD1 and CMD0 values)
TCNT values
TCNT_0
GRA_0
TCNT_1
H'0999
H'0000
Time
GRB_0
GRD_0
H'0999
GRB_0
H'0999
H'0000
H'0999
H'0000
H'0999
FTIOC0
FTIOD0
Figure 13.43 Buffer Operation (4)
(Buffer Operation in Complementary PWM Mode CMD1 = CMD0 = 1)
13.4.9
Timer Z Output Timing
The outputs of channels 0 and 1 can be disabled or inverted by the settings of TOER and TOCR
and the external level.
1. Output Disable/Enable Timing of Timer Z by TOER: Setting the master enable bit in TOER to
1 disables the output of timer Z. By setting the PCR and PDR of the corresponding I/O port
beforehand, any value can be output. Figure 13.44 shows the timing to enable or disable the
output of timer Z by TOER.
Rev. 3.00, 05/03, page 223 of 472
T1
T2
φ
Address bus
TOER address
TOER
Timer Z
output pin
I/O port
Timer output
Timer Z output
I/O port
Figure 13.44 Example of Output Disable Timing of Timer Z by Writing to TOER
2.
Output Disable Timing of Timer Z by External Trigger: When P54/WKP4 is set as a WKP4
input pin, and low level is input to WKP4, the master enable bit in TOER is set to 1 and the
output of timer Z will be disabled.
φ
TOER
Timer Z
output pin
N
H'00
I/O port
Timer Z output
Timer Z output
I/O port
Figure 13.45 Example of Output Disable Timing of Timer Z by External Trigger
Rev. 3.00, 05/03, page 224 of 472
3.
Output Inverse Timing by TFCR: The output level can be inverted by inverting the OLS1 and
OLS0 bits in TFCR in reset synchronous PWM mode or complementary PWM mode. Figure
13.46 shows the timing.
T1
T2
φ
Address bus
TOER address
TFCR
Timer Z
output pin
Inverted
Figure 13.46 Example of Output Inverse Timing of Timer Z by Writing to TFCR
4.
Output Inverse Timing by POCR: The output level can be inverted by inverting the POLD,
POLC, and POLB bits in POCR in PWM mode. Figure 13.47 shows the timing.
T1
T2
φ
Address bus
POCR address
TFCR
Timer Z
output pin
Inverted
Figure 13.47 Example of Output Inverse Timing of Timer Z by Writing to POCR
Rev. 3.00, 05/03, page 225 of 472
13.5
Interrupts
There are three kinds of timer Z interrupt sources; input capture/compare match, overflow, and
underflow. An interrupt is requested when the corresponding interrupt request flag is set to 1 while
the corresponding interrupt enable bit is set to 1.
13.5.1
1.
Status Flag Set Timing
IMF Flag Set Timing: The IMF flag is set to 1 by the compare match signal that is generated
when the GR matches with the TCNT. The compare match signal is generated at the last state
of matching (timing to update the counter value when the GR and TCNT match). Therefore,
when the TCNT and GR matches, the compare match signal will not be generated until the
TCNT input clock is generated. Figure 13.48 shows the timing to set the IMF flag.
φ
TCNT input clock
TCNT
N
GR
N+1
N
Compare match
signal
IMF
ITMZ
Figure 13.48 IMF Flag Set Timing when Compare Match Occurs
Rev. 3.00, 05/03, page 226 of 472
2. IMF Flag Set Timing at Input Capture: When an input capture signal is generated, the IMF flag
is set to 1 and the value of TCNT is simultaneously transferred to corresponding GR. Figure
13.49 shows the timing.
φ
Input capture
signal
IMF
TCNT
N
GR
N
ITMZ
Figure 13.49 IMF Flag Set Timing at Input Capture
3. Overflow Flag (OVF) Set Timing: The overflow flag is set to 1 when the TCNT overflows.
Figure 13.50 shows the timing.
φ
TCNT
H'FFFF
H'0000
Overflow
signal
OVF
ITMZ
Figure 13.50 OVF Flag Set Timing
Rev. 3.00, 05/03, page 227 of 472
13.5.2
Status Flag Clearing Timing
The status flag can be cleared by writing 0 after reading 1 from the CPU. Figure 13.51 shows the
timing in this case.
Address
TSR address
WTSR
(internal write signal)
IMF, OVF
ITMZ
Figure 13.51 Status Flag Clearing Timing
13.6
Usage Notes
1. Contention between TCNT Write and Clear Operations: If a counter clear signal is generated
in the T2 state of a TCNT write cycle, TCNT clearing has priority and the TCNT write is not
performed. Figure 13.52 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
Counter clear signal
TCNT
N
H'0000
Clearing has priority.
Figure 13.52 Contention between TCNT Write and Clear Operations
Rev. 3.00, 05/03, page 228 of 472
2.
Contention between TCNT Write and Increment Operations: If a counter clear signal is
generated in T2 state of a TCNT write cycle, TCNT clearing has priority and TCNT write is
not performed. Figure 13.53 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
TCNT input clock
TCNT
N
M
TCNT write data
Figure 13.53 Contention between TCNT Write and Increment Operations
3. Contention between GR Write and Compare Match: If a compare match occurs in the T2 state
of a GR write cycle, GR write has priority and the compare match signal is disabled. Figure
13.54 shows the timing in this case.
Rev. 3.00, 05/03, page 229 of 472
GR write cycle
T1
T2
φ
GR address
WGR
(internal write signal)
TCNT
N
GR
N
N+1
M
GR write data
Compare match
signal
Disabled
Figure 13.54 Contention between GR Write and Compare Match
4. Contention between TCNT Write and Overflow/Underflow: If overflow/underflow occurs in
the T2 state of a TCNT write cycle, TCNT write has priority without an increment operation.
At this time, the OVF flag is set to 1. Figure 13.55 shows the timing in this case.
Rev. 3.00, 05/03, page 230 of 472
TCNT write cycle
T1
T2
φ
TCNT address
WTCNT
(internal write signal)
TCNT input clock
Overflow signal
TCNT
H'FFFF
M
TCNT write data
OVF
Figure 13.55 Contention between TCNT Write and Overflow
5. Contention between GR Read and Input Capture: If an input capture signal is generated in the
T1 state of a GR read cycle, the data that is read will be transferred before input capture
transfer. Figure 13.56 shows the timing in this case.
Rev. 3.00, 05/03, page 231 of 472
GR read cycle
T1
T2
φ
GR address
Internal read
signal
Input capture
signal
GR
X
Internal data
bus
M
X
Figure 13.56 Contention between GR Read and Input Capture
6. Contention between Count Clearing and Increment Operations by Input Capture: If an input
capture and increment signals are simultaneously generated, count clearing by the input
capture operation has priority without an increment operation. The TCNT contents before
clearing counter are transferred to GR. Figure 13.57 shows the timing in this case.
φ
Input capture signal
Counter clear signal
TCNT input clock
TCNT
N
GR
H'0000
N
Clearing has priority.
Figure 13.57 Contention between Count Clearing and Increment Operations
by Input Capture
Rev. 3.00, 05/03, page 232 of 472
7. Contention between GR Write and Input Capture: If an input capture signal is generated in the
T2 state of a GR write cycle, the input capture operation has priority and the write to GR is not
performed. Figure 13.58 shows the timing in this case.
GR write cycle
T1
T2
φ
Address bus
GR address
WGR
(internal write signal)
Input capture
signal
TCNT
GR
N
M
GR write data
Figure 13.58 Contention between GR Write and Input Capture
8. Notes on Setting Reset Synchronous PWM Mode/Complementary PWM Mode: When bits
CMD1 and CMD0 in TFCR are set, note the following:
A. Write bits CMD1 and CMD0 while TCNT_1 and TCNT_0 are halted.
B. Changing the settings of reset synchronous PWM mode to complementary PWM mode or
vice versa is disabled. Set reset synchronous PWM mode or complementary PWM mode
after the normal operation (bits CMD1 and CMD0 are cleared to 0) has been set.
Rev. 3.00, 05/03, page 233 of 472
9.
Note on Clearing TSR Flag: When a specific flag in TSR is cleared, a combination of the
BCLR or MOV instructions is used to read 1 from the flag and then write 0 to the flag.
However, if another bit is set during this processing, the bit may also be cleared
simultaneously. To avoid this, the following processing that does not use the BCLR
instruction must be executed. Note that this note is only applied to the F-ZTAT version. This
problem has already been solved in the mask ROM version.
Example: When clearing bit 4 (OVF) in TSR
MOV.B @TSR,R0L
MOV.B #B'11101111, R0L
MOV.B R0L,@TSR
Rev. 3.00, 05/03, page 234 of 472
Only the bit to be cleared is 0 and
the other bits are all set to 1.
Section 14 Watchdog Timer
The watchdog timer is an 8-bit timer that can generate an internal reset signal for this LSI if a
system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
Internal
oscillator
ø
CLK
TCSRWD
PSS
TCWD
Internal data bus
The block diagram of the watchdog timer is shown in figure 14.1.
TMWD
Legend:
TCSRWD:
TCWD:
PSS:
TMWD:
Internal reset
signal
Timer control/status register WD
Timer counter WD
Prescaler S
Timer mode register WD
Figure 14.1 Block Diagram of Watchdog Timer
14.1
Features
• Selectable from nine counter input clocks.
Eight clock sources (φ/64, φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, and φ/8192) or the
internal oscillator can be selected as the timer-counter clock. When the internal oscillator is
selected, it can operate as the watchdog timer in any operating mode.
• Reset signal generated on counter overflow
An overflow period of 1 to 256 times the selected clock can be set.
14.2
Register Descriptions
The watchdog timer has the following registers.
• Timer control/status register WD (TCSRWD)
• Timer counter WD (TCWD)
• Timer mode register WD (TMWD)
WDT0110A_000020020200
Rev. 3.00, 05/03, page 235 of 472
14.2.1
Timer Control/Status Register WD (TCSRWD)
TCSRWD performs the TCSRWD and TCWD write control. TCSRWD also controls the
watchdog timer operation and indicates the operating state. TCSRWD must be rewritten by using
the MOV instruction. The bit manipulation instruction cannot be used to change the setting value.
Bit
Bit Name
Initial
Value
R/W
Description
7
B6WI
1
R/W
Bit 6 Write Inhibit
The TCWE bit can be written only when the write value of
the B6WI bit is 0.
This bit is always read as 1.
6
TCWE
0
R/W
Timer Counter WD Write Enable
TCWD can be written when the TCWE bit is set to 1.
When writing data to this bit, the value for bit 7 must be 0.
5
B4WI
1
R/W
Bit 4 Write Inhibit
The TCSRWE bit can be written only when the write
value of the B4WI bit is 0. This bit is always read as 1.
4
TCSRWE
0
R/W
Timer Control/Status Register W Write Enable
The WDON and WRST bits can be written when the
TCSRWE bit is set to 1.
When writing data to this bit, the value for bit 5 must be 0.
3
B2WI
1
R/W
Bit 2 Write Inhibit
This bit can be written to the WDON bit only when the
write value of the B2WI bit is 0.
This bit is always read as 1.
2
WDON
0
R/W
Watchdog Timer On
TCWD starts counting up when WDON is set to 1 and
halts when WDON is cleared to 0.
[Setting condition]
When 1 is written to the WDON bit while writing 0 to the
B2WI bit when the TCSRWE bit=1
[Clearing condition]
1
B0WI
1
R/W
•
Reset by RES pin
•
When 0 is written to the WDON bit while writing 0 to
the B2WI when the TCSRWE bit=1
Bit 0 Write Inhibit
This bit can be written to the WRST bit only when the
write value of the B0WI bit is 0. This bit is always read as
1.
Rev. 3.00, 05/03, page 236 of 472
Bit
Bit
Name
0
WRST 0
Initial Value R/W
R/W
Description
Watchdog Timer Reset
[Setting condition]
When TCWD overflows and an internal reset signal is
generated
[Clearing condition]
14.2.2
•
Reset by RES pin
•
When 0 is written to the WRST bit while writing 0 to the
B0WI bit when the TCSRWE bit=1
Timer Counter WD (TCWD)
TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the
internal reset signal is generated and the WRST bit in TCSRWD is set to 1. TCWD is initialized to
H'00.
14.2.3
Timer Mode Register WD (TMWD)
TMWD selects the input clock.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4
All 1
Reserved
These bits are always read as 1.
3
CKS3
1
R/W
Clock Select 3 to 0
2
CKS2
1
R/W
Select the clock to be input to TCWD.
1
CKS1
1
R/W
1000: Internal clock: counts on φ/64
0
CKS0
1
R/W
1001: Internal clock: counts on φ/128
1010: Internal clock: counts on φ/256
1011: Internal clock: counts on φ/512
1100: Internal clock: counts on φ/1024
1101: Internal clock: counts on φ/2048
1110: Internal clock: counts on φ/4096
1111: Internal clock: counts on φ8192
0XXX: Internal oscillator
For the internal oscillator overflow periods, see section
23, Electrical Characteristics.
Legend X: Don't care.
Rev. 3.00, 05/03, page 237 of 472
14.3
Operation
The watchdog timer is provided with an 8-bit counter. If 1 is written to WDON while writing 0 to
B2WI when the TCSRWE bit in TCSRWD is set to 1, TCWD begins counting up. (To operate
the watchdog timer, two write accesses to TCSRWD are required.) When a clock pulse is input
after the TCWD count value has reached H'FF, the watchdog timer overflows and an internal reset
signal is generated. The internal reset signal is output for a period of 512 φosc clock cycles.
TCWD is a writable counter, and when a value is set in TCWD, the count-up starts from that
value. An overflow period in the range of 1 to 256 input clock cycles can therefore be set,
according to the TCWD set value.
Figure 14.2 shows an example of watchdog timer operation.
Example:
With 30ms overflow period when φ = 4 MHz
4 × 106
8192
× 30 × 10–3 = 14.6
Therefore, 256 – 15 = 241 (H'F1) is set in TCW.
TCWD overflow
H'FF
H'F1
TCWD
count value
H'00
Start
H'F1 written
to TCWD
H'F1 written to TCWD
Reset generated
Internal reset
signal
512 φosc clock cycles
Figure 14.2 Watchdog Timer Operation Example
Rev. 3.00, 05/03, page 238 of 472
Section 15 14-Bit PWM
The 14-bit PWM is a pulse division type PWM that can be used for electronic tuner control, etc.
Figure 15.1 shows a block diagram of the 14-bit PWM.
15.1
Features
• Choice of two conversion periods
A conversion period of 32768/φ with a minimum modulation width of 2/φ, or a conversion
period of 16384/φ with a minimum modulation width of 1/φ, can be selected.
• Pulse division method for less ripple
Internal data bus
PWCR
PWDRL
PWDRU
/4
PWM waveform
generator
/2
PWM
Legend
PWCR:
PWM control register
PWDRL:
PWM data register L
PWDRU:
PWM data register U
PWM:
PWM output pin
Figure 15.1 Block Diagram of 14-Bit PWM
PWM1400A_000120030300
Rev. 3.00, 05/03, page 239 of 472
15.2
Input/Output Pin
Table 15.1 shows the 14-bit PWM pin configuration.
Table 15.1 Pin Configuration
Name
Abbreviation I/O
Function
14-bit PWM square-wave output
PWM
14-bit PWM square-wave output pin
15.3
Output
Register Descriptions
The 14-bit PWM has the following registers.
• PWM control register (PWCR)
• PWM data register U (PWDRU)
• PWM data register L (PWDRL)
15.3.1
PWM Control Register (PWCR)
PWCR selects the conversion period.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 1
All 1
Reserved
These bits are always read as 1, and cannot be modified.
0
PWCR0
0
R/W
Clock Select
0: The input clock is φ/2 (tφ = 2/φ)
The conversion period is 16384/φ, with a minimum
modulation width of 1/φ
1: The input clock is φ/4 (tφ = 4/φ)
The conversion period is 32768/φ, with a minimum
modulation width of 2/φ
Legend tφ: Period of PWM clock input
Rev. 3.00, 05/03, page 240 of 464
15.3.2
PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU and PWDRL indicate high level width in one PWM waveform cycle. PWDRU and
PWDRL are 14-bit write-only registers, with the upper 6 bits assigned to PWDRU and the lower 8
bits to PWDRL. When read, all bits are always read as 1.
Both PWDRU and PWDRL are accessible only in bytes. Note that the operation is not guaranteed
if word access is performed. When 14-bit data is written in PWDRU and PWDRL, the contents
are latched in the PWM waveform generator and the PWM waveform generation data is updated.
When writing the 14-bit data, the order is as follows: PWDRL to PWDRU.
PWDRU and PWDRL are initialized to H'C000.
15.4
Operation
When using the 14-bit PWM, set the registers in this sequence:
1. Set the PWM bit in the port mode register 1 (PMR1) to set the P11/PWM pin to function as a
PWM output pin.
2. Set the PWCR0 bit in PWCR to select a conversion period of either.
3. Set the output waveform data in PWDRU and PWDRL. Be sure to write byte data first to
PWDRL and then to PWDRU. When the data is written in PWDRU, the contents of these
registers are latched in the PWM waveform generator, and the PWM waveform generation
data is updated in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 15.2. The total high-level width
during this period (TH) corresponds to the data in PWDRU and PWDRL. This relation can be
expressed as follows:
TH = (data value in PWDRU and PWDRL + 64) × tφ/2
where tφ is the period of PWM clock input: 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1).
If the data value in PWDRU and PWDRL is from H'FFC0 to H'FFFF, the PWM output stays high.
When the data value is H'C000, TH is calculated as follows:
TH = 64 × tφ/2 = 32 tφ
Rev. 3.00, 05/03, page 241 of 472
Conversion period
t f1
t H1
t f2
t H2
t f63
t H3
t H63
t f64
t H64
T H = t H1 + t H2 + t H3 + ... + t H64
t f1 = t f2 = t f3 = ... = t f64
Figure 15.2 Waveform Output by 14-Bit PWM
Rev. 3.00, 05/03, page 242 of 464
Section 16 Serial Communication Interface 3 (SCI3)
This LSI includes a serial communication interface 3 (SCI3), which has independent two channels.
The SCI3 can handle both asynchronous and clocked synchronous serial communication. In
asynchronous mode, serial data communication can be carried out using standard asynchronous
communication chips such as a Universal Asynchronous Receiver/Transmitter (UART) or an
Asynchronous Communication Interface Adapter (ACIA). A function is also provided for serial
communication between processors (multiprocessor communication function).
Table 16.1 shows the SCI3 channel configuration and figure 16.1 shows a block diagram of the
SCI3. Since pin functions are identical for each of the two channels (SCI3 and SCI3_2), separate
explanations are not given in this section.
16.1
Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
• External clock or on-chip baud rate generator can be selected as a transfer clock source.
• Six interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity
error.
Asynchronous mode
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RxD pin level directly in the case of a
framing error
Clocked synchronous mode
• Data length: 8 bits
• Receive error detection: Overrun errors
SCI0011A_000020020200
Rev. 3.00, 05/03, page 243 of 472
Table 16.1 Channel Configuration
Channel
Abbreviation
Pin
Register
Register Address
Channel 1
SCI3*
SCK3
RXD
TXD
SMR
H'FFA8
BRR
H'FFA9
SCR3
H'FFAA
TDR
H'FFAB
SSR
H'FFAC
Channel 2
Note:
*
SCI3_2
SCK3_2
RXD_2
TXD_2
RDR
H'FFAD
RSR
TSR
SMR_2
H'F740
BRR_2
H'F741
SCR3_2
H'F742
TDR_2
H'F743
SSR_2
H'F744
RDR_2
H'F745
RSR_2
TSR_2
The channel 1 of the SCI3 is used in on-board programming mode by boot mode.
Rev. 3.00, 05/03, page 244 of 472
SCK3
External
clock
Internal clock (ø/64, ø/16, ø/4, ø)
Baud rate generator
BRC
BRR
Clock
Internal data bus
SMR
Transmit/receive
control circuit
SCR3
SSR
TXD
TSR
TDR
RXD
RSR
RDR
Interrupt request
(TEI, TXI, RXI, ERI)
Legend:
Receive shift register
RSR:
Receive data register
RDR:
Transmit shift register
TSR:
Transmit data register
TDR:
Serial mode register
SMR:
SCR3: Serial control register 3
Serial status register
SSR:
Bit rate register
BRR:
Bit rate counter
BRC:
Figure 16.1 Block Diagram of SCI3
Rev. 3.00, 05/03, page 245 of 472
16.2
Input/Output Pins
Table 16.2 shows the SCI3 pin configuration.
Table 16.2 Pin Configuration
Pin Name
Abbreviation
I/O
Function
SCI3 clock
SCK3
I/O
SCI3 clock input/output
SCI3 receive data input
RXD
Input
SCI3 receive data input
SCI3 transmit data output
TXD
Output
SCI3 transmit data output
16.3
Register Descriptions
The SCI3 has the following registers for each channel.
• Receive Shift Register (RSR)
• Receive Data Register (RDR)
• Transmit Shift Register (TSR)
• Transmit Data Register (TDR)
• Serial Mode Register (SMR)
• Serial Control Register 3 (SCR3)
• Serial Status Register (SSR)
• Bit Rate Register (BRR)
Rev. 3.00, 05/03, page 246 of 472
16.3.1
Receive Shift Register (RSR)
RSR is a shift register that is used to receive serial data input from the RxD pin and convert it into
parallel data. When one frame of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
16.3.2
Receive Data Register (RDR)
RDR is an 8-bit register that stores received data. When the SCI3 has received one frame of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once. RDR cannot be written to by the CPU. RDR is initialized to H'00.
16.3.3
Transmit Shift Register TSR (SCI3)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI3 first
transfers transmit data from TDR to TSR automatically, then sends the data that starts from the
LSB to the TXD pin. TSR cannot be directly accessed by the CPU.
16.3.4
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for transmission. When the SCI3 detects that TSR is
empty, it transfers the transmit data written in TDR to TSR and starts transmission. The doublebuffered structure of TDR and TSR enables continuous serial transmission. If the next transmit
data has already been written to TDR during transmission of one-frame data, the SCI3 transfers
the written data to TSR to continue transmission. To achieve reliable serial transmission, write
transmit data to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is
initialized to H'FF.
Rev. 3.00, 05/03, page 247 of 472
16.3.5
Serial Mode Register (SMR)
SMR is used to set the SCI3’s serial transfer format and select the baud rate generator clock
source.
Bit
Bit Name
Initial
Value
R/W
Description
7
COM
0
R/W
Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6
CHR
0
R/W
Character Length (enabled only in asynchronous mode)
0: Selects 8 bits as the data length.
1: Selects 7 bits as the data length.
5
PE
0
R/W
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to transmit
data before transmission, and the parity bit is checked in
reception.
4
PM
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
3
STOP
0
R/W
Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
For reception, only the first stop bit is checked, regardless
of the value in the bit. If the second stop bit is 0, it is
treated as the start bit of the next transmit character.
2
MP
0
R/W
Multiprocessor Mode
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit and PM
bit settings are invalid in multiprocessor mode. In clocked
synchronous mode, clear this bit to 0.
Rev. 3.00, 05/03, page 248 of 472
Bit
Bit Name
Initial
Value
R/W
Description
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 16.3.8, Bit Rate Register
(BRR). n is the decimal representation of the value of n in
BRR (see section 16.3.8, Bit Rate Register (BRR)).
16.3.6
Serial Control Register 3 (SCR3)
SCR3 is a register that enables or disables SCI3 transfer operations and interrupt requests, and is
also used to select the transfer clock source. For details on interrupt requests, refer to section 16.7,
Interrupts.
Bit
Bit Name
Initial
Value
R/W
7
TIE
0
R/W
Description
Transmit Interrupt Enable
When this bit is set to 1, the TXI interrupt request is
enabled.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
5
TE
0
R/W
Transmit Enable
When this bit s set to 1, transmission is enabled.
4
RE
0
R/W
Receive Enable
When this bit is set to 1, reception is enabled.
3
MPIE
0
R/W
Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of the
RDRF, FER, and OER status flags in SSR is disabled.
On receiving data in which the multiprocessor bit is 1, this
bit is automatically cleared and normal reception is
resumed. For details, refer to section 16.6, Multiprocessor
Communication Function.
Rev. 3.00, 05/03, page 249 of 472
Bit
Bit Name
Initial
Value
R/W
2
TEIE
0
R/W
Description
Transmit End Interrupt Enable
When this bit is set to 1, TEI interrupt request is enabled.
1
CKE1
0
R/W
Clock Enable 0 and 1
0
CKE0
0
R/W
Selects the clock source.
•
Asynchronous mode
00: On-chip baud rate generator
01: On-chip baud rate generator
Outputs a clock of the same frequency as the bit rate
from the SCK3 pin.
10: External clock
Inputs a clock with a frequency 16 times the bit rate
from the SCK3 pin.
11:Reserved
•
Clocked synchronous mode
00: On-chip clock (SCK3 pin functions as clock output)
01:Reserved
10: External clock (SCK3 pin functions as clock input)
11:Reserved
Rev. 3.00, 05/03, page 250 of 472
16.3.7
Serial Status Register (SSR)
SSR is a register containing status flags of the SCI3 and multiprocessor bits for transfer. 1 cannot
be written to flags TDRE, RDRF, OER, PER, and FER; they can only be cleared.
Bit
Bit Name
Initial
Value
R/W
Description
7
TDRE
1
R/W
Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR3 is 0
•
When data is transferred from TDR to TSR
[Clearing conditions]
6
RDRF
0
R/W
•
When 0 is written to TDRE after reading TDRE = 1
•
When the transmit data is written to TDR
Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
•
When serial reception ends normally and receive data
is transferred from RSR to RDR
[Clearing conditions]
5
OER
0
R/W
•
When 0 is written to RDRF after reading RDRF = 1
•
When data is read from RDR
Overrun Error
[Setting condition]
•
When an overrun error occurs in reception
[Clearing condition]
•
4
FER
0
R/W
When 0 is written to OER after reading OER = 1
Framing Error
[Setting condition]
•
When a framing error occurs in reception
[Clearing condition]
•
When 0 is written to FER after reading FER = 1
Rev. 3.00, 05/03, page 251 of 472
Bit
Bit Name
Initial
Value
R/W
3
PER
0
R/W
Description
Parity Error
[Setting condition]
•
When a parity error is detected during reception
[Clearing condition]
•
2
TEND
1
R
When 0 is written to PER after reading PER = 1
Transmit End
[Setting conditions]
•
When the TE bit in SCR3 is 0
•
When TDRE = 1 at transmission of the last bit of a 1frame serial transmit character
[Clearing conditions]
1
MPBR
0
R
•
When 0 is written to TDRE after reading TDRE = 1
•
When the transmit data is written to TDR
Multiprocessor Bit Receive
MPBR stores the multiprocessor bit in the receive
character data. When the RE bit in SCR3 is cleared to 0,
its state is retained.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
MPBT stores the multiprocessor bit to be added to the
transmit character data.
Rev. 3.00, 05/03, page 252 of 472
16.3.8
Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. The initial value of BRR is H'FF. Table 16.3
shows the relationship between the N setting in BRR and the n setting in bits CKS1 and CKS0 of
SMR in asynchronous mode. Table 16.4 shows the maximum bit rate for each frequency in
asynchronous mode. The values shown in both tables 16.3 and 16.4 are values in active (highspeed) mode. Table 16.5 shows the relationship between the N setting in BRR and the n setting in
bits CKS1 and CKS0 of SMR in clocked synchronous mode. The values shown in table 16.5 are
values in active (high-speed) mode. The N setting in BRR and error for other operating
frequencies and bit rates can be obtained by the following formulas:
[Asynchronous Mode]
N=
φ
× 106 – 1
64 × 22n–1 × B
φ × 106
– 1 × 100
(N
+
1)
×
B × 64 × 22n–1
Error (%) =
[Clocked Synchronous Mode]
N=
φ
× 106 – 1
8 × 22n–1 × B
Legend B: Bit rate (bit/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ: Operating frequency (MHz)
n: CSK1 and CSK0 settings in SMR (0 ≤ n ≤ 3)
Rev. 3.00, 05/03, page 253 of 472
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)
Operating Frequency φ (MHz)
2
2.097152
2.4576
3
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
–0.04
1
174
–0.26
1
212
0.03
150
1
103
0.16
1
108
0.21
1
127
0.00
1
155
0.16
300
0
207
0.16
0
217
0.21
0
255
0.00
1
77
0.16
600
0
103
0.16
0
108
0.21
0
127
0.00
0
155
0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
0
6
–6.99
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
0
2
8.51
0
2
13.78
0
3
0.00
0
4
–2.34
31250
0
1
0.00
0
1
4.86
0
1
22.88
0
2
0.00
38400
0
1
–18.62
0
1
–14.67
0
1
0.00
—
—
—
Operating Frequency φ (MHz)
3.6864
4
4.9152
5
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
0
6
–6.99
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
0
2
8.51
0
3
0.00
0
3
1.73
Legend
: A setting is available but error occurs
Rev. 3.00, 05/03, page 254 of 472
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)
Operating Frequency φ (MHz)
6
6.144
7.3728
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
106
–0.44
2
108
0.08
2
130
–0.07
150
2
77
0.16
2
79
0.00
2
95
0.00
300
1
155
0.16
1
159
0.00
1
191
0.00
600
1
77
0.16
1
79
0.00
1
95
0.00
1200
0
155
0.16
0
159
0.00
0
191
0.00
2400
0
77
0.16
0
79
0.00
0
95
0.00
4800
0
38
0.16
0
39
0.00
0
47
0.00
9600
0
19
–2.34
0
19
0.00
0
23
0.00
19200
0
9
–2.34
0
9
0.00
0
11
0.00
31250
0
5
0.00
0
5
2.40
0
6
5.33
38400
0
4
–2.34
0
4
0.00
0
5
0.00
Operating Frequency φ (MHz)
8
9.8304
10
12
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
141
0.03
2
174
–0.26
2
177
–0.25
2
212
0.03
150
2
103
0.16
2
127
0.00
2
129
0.16
2
155
0.16
300
1
207
0.16
1
255
0.00
2
64
0.16
2
77
0.16
600
1
103
0.16
1
127
0.00
1
129
0.16
1
155
0.16
1200
0
207
0.16
0
255
0.00
1
64
0.16
1
77
0.16
2400
0
103
0.16
0
127
0.00
0
129
0.16
0
155
0.16
4800
0
51
0.16
0
63
0.00
0
64
0.16
0
77
0.16
9600
0
25
0.16
0
31
0.00
0
32
–1.36
0
38
0.16
19200
0
12
0.16
0
15
0.00
0
15
1.73
0
19
–2.34
31250
0
7
0.00
0
9
–1.70
0
9
0.00
0
11
0.00
38400
0
6
-6.99
0
7
0.00
0
7
1.73
0
9
–2.34
Legend
: A setting is available but error occurs.
Rev. 3.00, 05/03, page 255 of 472
Table 16.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3)
Operating Frequency φ (MHz)
12.888
14
14.7456
16
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
217
0.08
2
248
–0.17
3
64
0.70
3
70
0.03
150
2
159
0.00
2
181
0.16
2
191
0.00
2
207
0.16
300
2
79
0.00
2
90
0.16
2
95
0.00
2
103
0.16
600
1
159
0.00
1
181
0.16
1
191
0.00
1
207
0.16
1200
1
79
0.00
1
90
0.16
1
95
0.00
1
103
0.16
2400
0
159
0.00
0
181
0.16
0
191
0.00
0
207
0.16
4800
0
79
0.00
0
90
0.16
0
95
0.00
0
103
0.16
9600
0
39
0.00
0
45
–0.93
0
47
0.00
0
51
0.16
19200
0
19
0.00
0
22
–0.93
0
23
0.00
0
25
0.16
31250
0
11
2.40
0
13
0.00
0
14
–1.70
0
15
0.00
38400
0
9
0.00
—
—
—
0
11
0.00
0
12
0.16
Operating Frequency φ (MHz)
18
20
Bit Rate
(bit/s)
n
N
Error
(%)
n
N
Error
(%)
110
3
79
–0.12
3
88
–0.25
150
2
233
0.16
3
64
0.16
300
2
116
0.16
2
129
0.16
600
1
233
0.16
2
64
0.16
1200
1
116
0.16
1
129
0.16
2400
0
233
0.16
1
64
0.16
4800
0
116
0.16
0
129
0.16
9600
0
58
–0.96
0
64
0.16
19200
0
28
1.02
0
32
–1.36
31250
0
17
0.00
0
19
0.00
38400
0
14
–2.34
0
15
1.73
Legend
—: A setting is available but error occurs.
Rev. 3.00, 05/03, page 256 of 472
Table 16.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
φ (MHz)
Maximum Bit
Rate (bit/s)
n
N
φ (MHz)
Maximum Bit
Rate (bit/s)
n
N
2
62500
0
0
8
250000
0
0
2.097152
65536
0
0
9.8304
307200
0
0
2.4576
76800
0
0
10
312500
0
0
3
93750
0
0
12
375000
0
0
3.6864
115200
0
0
12.288
384000
0
0
4
125000
0
0
14
437500
0
0
4.9152
153600
0
0
14.7456
460800
0
0
5
156250
0
0
16
500000
0
0
6
187500
0
0
17.2032
537600
0
0
6.144
192000
0
0
18
562500
0
0
7.3728
230400
0
0
20
625000
0
0
Rev. 3.00, 05/03, page 257 of 472
Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
(1)
Operating Frequency φ (MHz)
2
4
8
10
Bit Rate
(bit/s)
n
N
n
N
n
N
n
N
110
3
70
—
—
—
—
—
—
250
2
124
2
249
3
124
—
500
1
249
2
124
2
249
1k
1
124
1
249
2
2.5k
0
199
1
99
5k
0
99
0
10k
0
49
25k
0
50k
0
100k
16
n
N
—
3
249
—
—
3
124
124
—
—
2
249
1
199
1
249
2
99
199
1
99
1
124
1
199
0
99
0
199
0
249
1
99
19
0
39
0
79
0
99
0
159
9
0
19
0
39
0
49
0
79
0
4
0
9
0
19
0
24
0
39
250k
0
1
0
3
0
7
0
9
0
15
500k
0
0*
0
1
0
3
0
4
0
7
0
0*
0
1
—
—
0
3
0
0*
—
—
0
1
0
0*
—
—
0
0*
1M
2M
2.5M
4M
Legend
Blank : No setting is available.
—
: A setting is available but error occurs.
*
: Continuous transfer is not possible.
Rev. 3.00, 05/03, page 258 of 472
Table 16.5 Examples of BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
(2)
Operating Frequency φ (MHz)
18
20
Bit Rate
(bit/s)
n
N
n
N
110
—
—
—
—
250
—
—
—
—
500
3
140
3
155
1k
3
69
3
77
2.5k
2
112
2
124
5k
1
224
1
249
10k
1
112
1
124
25k
0
179
0
199
50k
0
89
0
99
100k
0
44
0
49
250k
0
17
0
19
500k
0
8
0
9
1M
0
4
0
4
2M
—
—
—
—
2.5M
—
—
—
—
4M
—
—
—
—
Legend
Blank : No setting is available.
—
: A setting is available but error occurs.
*
: Continuous transfer is not possible.
Rev. 3.00, 05/03, page 259 of 472
16.4
Operation in Asynchronous Mode
Figure 16.2 shows the general format for asynchronous serial communication. One character (or
frame) consists of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or
low level), and finally stop bits (high level). Inside the SCI3, the transmitter and receiver are
independent units, enabling full-duplex. Both the transmitter and the receiver also have a doublebuffered structure, so data can be read or written during transmission or reception, enabling
continuous data transfer.
LSB
MSB
Serial Start
data
bit
7 or 8 bits
1 bit
1
Parity
bit
Transmit/receive data
Stop bit
Mark state
1 or
2 bits
1 bit,
or none
One unit of transfer data (character or frame)
Figure 16.2 Data Format in Asynchronous Communication
16.4.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK3 pin can be selected as the SCI3’s serial clock, according to the setting of the COM bit in
SMR and the CKE0 and CKE1 bits in SCR3. When an external clock is input at the SCK3 pin, the
clock frequency should be 16 times the bit rate used.
When the SCI3 is operated on an internal clock, the clock can be output from the SCK3 pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is in the middle of the transmit data, as shown in figure 16.3.
Clock
Serial data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (frame)
Figure 16.3 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode)(Example with 8-Bit Data, Parity, Two Stop Bits)
Rev. 3.00, 05/03, page 260 of 472
16.4.2
SCI3 Initialization
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR3 to 0,
then initialize the SCI3 as described below. When the operating mode, or transfer format, is
changed for example, the TE and RE bits must be cleared to 0 before making the change using the
following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1. Note that clearing
the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and OER flags, or the
contents of RDR. When the external clock is used in asynchronous mode, the clock must be
supplied even during initialization.
[1]
Start initialization
When the clock output is selected in
asynchronous mode, clock is output
immediately after CKE1 and CKE0
settings are made. When the clock
output is selected at reception in clocked
synchronous mode, clock is output
immediately after CKE1, CKE0, and RE
are set to 1.
Clear TE and RE bits in SCR3 to 0
[1]
Set CKE1 and CKE0 bits in SCR3
Set data transfer format in SMR
[2]
Set value in BRR
[3]
Wait
[2]
Set the data transfer format in SMR.
[3]
Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
[4]
Wait at least one bit interval, then set the
TE bit or RE bit in SCR3 to 1. RE
settings enable the RXD pin to be used.
For transmission, set the TXD bit in
PMR1 to 1 to enable the TXD output pin
to be used. Also set the RIE, TIE, TEIE,
and MPIE bits, depending on whether
interrupts are required. In asynchronous
mode, the bits are marked at
transmission and idled at reception to
wait for the start bit.
No
1-bit interval elapsed?
Yes
Set TE and RE bits in
SCR3 to 1, and set RIE, TIE, TEIE,
and MPIE bits. For transmit (TE=1),
also set the TxD bit in PMR1.
<Initialization completion>
[4]
Set the clock selection in SCR3.
Be sure to clear bits RIE, TIE, TEIE, and
MPIE, and bits TE and RE, to 0.
Figure 16.4 Sample SCI3 Initialization Flowchart
Rev. 3.00, 05/03, page 261 of 472
16.4.3
Data Transmission
Figure 16.5 shows an example of operation for transmission in asynchronous mode. In
transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI3 recognizes that
data has been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI3 sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a TXI interrupt request is generated.
Continuous transmission is possible because the TXI interrupt routine writes next transmit data
to TDR before transmission of the current transmit data has been completed.
3. The SCI3 checks the TDRE flag at the timing for sending the stop bit.
4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered, in which 1 is output. If the TEIE bit in SCR3 is set to 1 at this time, a TEI
interrupt request is generated.
6.
Figure 16.6 shows a sample flowchart for transmission in asynchronous mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
D7
1 frame
Parity Stop Start
bit
bit bit
0/1
1
0
Transmit
data
D0
D1
D7
Parity Stop
bit
bit
0/1
Mark
state
1
1
1 frame
TDRE
TEND
LSI
TXI interrupt
operation request
generated
User
processing
TDRE flag
cleared to 0
TXI interrupt request generated
TEI interrupt request
generated
Data written
to TDR
Figure 16.5 Example of SCI3 Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Rev. 3.00, 05/03, page 262 of 472
Start transmission
[1]
Read TDRE flag in SSR
No
TDRE = 1
Yes
Write transmit data to TDR
[2]
Yes
All data transmitted?
[1] Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. When data is
written to TDR, the TDRE flag is
automaticaly cleared to 0.
[2] To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR. When data
is written to TDR, the TDRE flag is
automaticaly cleared to 0.
[3] To output a break in serial
transmission, after setting PCR to 1
and PDR to 0, clear TxD in PMR1
to 0, then clear the TE bit in SCR3
to 0.
No
Read TEND flag in SSR
No
TEND = 1
Yes
[3]
No
Break output?
Yes
Clear PDR to 0 and
set PCR to 1
Clear TE bit in SCR3 to 0
<End>
Figure 16.6 Sample Serial Transmission Data Flowchart (Asynchronous Mode)
Rev. 3.00, 05/03, page 263 of 472
16.4.4
Serial Data Reception
Figure 16.7 shows an example of operation for reception in asynchronous mode. In serial
reception, the SCI3 operates as described below.
1. The SCI3 monitors the communication line. If a start bit is detected, the SCI3 performs
internal synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this time, an
ERI interrupt request is generated. Receive data is not transferred to RDR.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has been completed.
Start
bit
Serial
data
1
0
Receive
data
D0
D1
D7
Parity Stop Start
bit
bit bit
0/1
1
0
1 frame
Receive
data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
Mark state
(idle state)
1
1 frame
RDRF
FER
RXI request
LSI
operation
RDRF
cleared to 0
0 stop bit
detected
RDR data read
User
processing
ERI request in
response to
framing error
Framing error
processing
Figure 16.7 Example of SCI3 Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Table 16.6 shows the states of the SSR status flags and receive data handling when a receive error
is detected. If a receive error is detected, the RDRF flag retains its state before receiving data.
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.8 shows a sample flow chart
for serial data reception.
Rev. 3.00, 05/03, page 264 of 472
Table 16.6 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF*
OER
FER
PER
Receive Data
Receive Error Type
1
1
0
0
Lost
Overrun error
0
0
1
0
Transferred to RDR
Framing error
0
0
0
1
Transferred to RDR
Parity error
1
1
1
0
Lost
Overrun error + framing error
1
1
0
1
Lost
Overrun error + parity error
0
0
1
1
Transferred to RDR
Framing error + parity error
1
1
1
1
Lost
Overrun error + framing error +
parity error
Note: * The RDRF flag retains the state it had before data reception.
Start reception
Read OER, PER, and
FER flags in SSR
[1]
Yes
OER+PER+FER = 1
[4]
No
Error processing
(Continued on next page)
Read RDRF flag in SSR
[2]
No
RDRF = 1
Yes
Read receive data in RDR
[1] Read the OER, PER, and FER flags in
SSR to identify the error. If a receive
error occurs, performs the appropriate
error processing.
[2] Read SSR and check that RDRF = 1,
then read the receive data in RDR.
The RDRF flag is cleared automatically.
[3] To continue serial reception, before the
stop bit for the current frame is
received, read the RDRF flag and read
RDR.
The RDRF flag is cleared automatically.
[4] If a receive error occurs, read the OER,
PER, and FER flags in SSR to identify
the error. After performing the
appropriate error processing, ensure
that the OER, PER, and FER flags are
all cleared to 0. Reception cannot be
resumed if any of these flags are set to
1. In the case of a framing error, a
break can be detected by reading the
value of the input port corresponding to
the RxD pin.
Yes
All data received?
(A)
[3]
No
Clear RE bit in SCR3 to 0
<End>
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode)(1)
Rev. 3.00, 05/03, page 265 of 472
[4]
Error processing
No
OER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
No
PER = 1
Yes
Parity error processing
(A)
Clear OER, PER, and
FER flags in SSR to 0
<End>
Figure 16.8 Sample Serial Reception Data Flowchart (Asynchronous Mode)(2)
Rev. 3.00, 05/03, page 266 of 472
16.5
Operation in Clocked Synchronous Mode
Figure 16.9 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. A single
character in the transmit data consists of the 8-bit data starting from the LSB. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the synchronization clock to the next. In clocked synchronous mode, the SCI3 receives data in
synchronous with the rising edge of the synchronization clock. After 8-bit data is output, the
transmission line holds the MSB state. In clocked synchronous mode, no parity or multiprocessor
bit is added. Inside the SCI3, the transmitter and receiver are independent units, enabling fullduplex communication through the use of a common clock. Both the transmitter and the receiver
also have a double-buffered structure, so data can be read or written during transmission or
reception, enabling continuous data transfer.
8-bit
One unit of transfer data (character or frame)
*
*
Synchronization
clock
LSB
Bit 0
Serial data
MSB
Bit 1
Don’t care
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don’t care
Note: * High except in continuous transfer
Figure 16.9 Data Format in Clocked Synchronous Communication
16.5.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK3 pin can be selected, according to the setting of the COM
bit in SMR and CKE0 and CKE1 bits in SCR3. When the SCI3 is operated on an internal clock,
the synchronization clock is output from the SCK3 pin. Eight synchronization clock pulses are
output in the transfer of one character, and when no transfer is performed the clock is fixed high.
16.5.2
SCI3 Initialization
Before transmitting and receiving data, the SCI3 should be initialized as described in a sample
flowchart in figure 16.4.
Rev. 3.00, 05/03, page 267 of 472
16.5.3
Serial Data Transmission
Figure 16.10 shows an example of SCI3 operation for transmission in clocked synchronous mode.
In serial transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR, and if the flag is 0, the SCI3 recognizes that data
has been written to TDR, and transfers the data from TDR to TSR.
2. The SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR3 is set to 1 at
this time, a transmit data empty interrupt (TXI) is generated.
3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock
mode has been specified, and synchronized with the input clock when use of an external clock
has been specified. Serial data is transmitted sequentially from the LSB (bit 0), from the TxD
pin.
4. The SCI3 checks the TDRE flag at the timing for sending the MSB (bit 7).
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains
the output state of the last bit. If the TEIE bit in SCR3 is set to 1 at this time, a TEI interrupt
request is generated.
7.
The SCK3 pin is fixed high at the end of transmission.
Figure 16.11 shows a sample flow chart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission.
Serial
clock
Serial
data
Bit 0
Bit 1
1 frame
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
TDRE
TEND
TXI interrupt
LSI
operation request
generated
TDRE flag
cleared
to 0
User
processing
Data written
to TDR
TXI interrupt request generated
TEI interrupt request
generated
Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode
Rev. 3.00, 05/03, page 268 of 472
Start transmission
[1]
[1]
Read TDRE flag in SSR
No
TDRE = 1
Yes
[2]
Read SSR and check that the TDRE flag is
set to 1, then write transmit data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0 and clocks are
output to start the data transmission.
To continue serial transmission, be sure to
read 1 from the TDRE flag to confirm that
writing is possible, then write data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0.
Write transmit data to TDR
[2]
All data transmitted?
Yes
No
Read TEND flag in SSR
No
TEND = 1
Yes
Clear TE bit in SCR3 to 0
<End>
Figure 16.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode)
Rev. 3.00, 05/03, page 269 of 472
16.5.4
Serial Data Reception (Clocked Synchronous Mode)
Figure 16.12 shows an example of SCI3 operation for reception in clocked synchronous mode. In
serial reception, the SCI3 operates as described below.
1.
The SCI3 performs internal initialization synchronous with a synchronization clock input or
output, starts receiving data.
2.
The SCI3 stores the receive data in RSR.
3.
If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR3 is set to 1 at this
time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the
RDRF flag remains to be set to 1.
4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR3 is set to 1 at this time, an RXI interrupt request is
generated.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
RDRF
OER
LSI
operation
User
processing
RXI interrupt
request
generated
RDRF flag
cleared
to 0
RDR data read
RXI interrupt request generated
RDR data has
not been read
(RDRF = 1)
ERI interrupt request
generated by
overrun error
Overrun error
processing
Figure 16.12 Example of SCI3 Reception in Clocked Synchronous Mode
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 16.13 shows a sample flow
chart for serial data reception.
Rev. 3.00, 05/03, page 270 of 472
Start reception
[1]
[1]
Read OER flag in SSR
[2]
Yes
OER = 1
[4]
No
Error processing
[3]
(Continued below)
Read RDRF flag in SSR
[2]
[4]
No
RDRF = 1
Yes
Read the OER flag in SSR to determine if
there is an error. If an overrun error has
occurred, execute overrun error processing.
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR.
When data is read from RDR, the RDRF
flag is automatically cleared to 0.
To continue serial reception, before the
MSB (bit 7) of the current frame is received,
reading the RDRF flag and reading RDR
should be finished. When data is read from
RDR, the RDRF flag is automatically
cleared to 0.
If an overrun error occurs, read the OER
flag in SSR, and after performing the
appropriate error processing, clear the OER
flag to 0. Reception cannot be resumed if
the OER flag is set to 1.
Read receive data in RDR
Yes
All data received?
[3]
No
Clear RE bit in SCR3 to 0
<End>
[4]
Error processing
Overrun error processing
Clear OER flag in SSR to 0
<End>
Figure 16.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)
Rev. 3.00, 05/03, page 271 of 472
16.5.5
Simultaneous Serial Data Transmission and Reception
Figure 16.14 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that the SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear
TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished
reception, clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER,
and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
Rev. 3.00, 05/03, page 272 of 472
Start transmission/reception
Read TDRE flag in SSR
[1]
[1]
No
TDRE = 1
Yes
Write transmit data to TDR
Read OER flag in SSR
OER = 1
No
Read RDRF flag in SSR
Yes
[4]
Error processing
[2]
No
RDRF = 1
Yes
Read receive data in RDR
Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0.
[2] Read SSR and check that the RDRF
flag is set to 1, then read the receive
data in RDR.
When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[3] To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading RDR.
Also, before the MSB (bit 7) of the
current frame is transmitted, read 1
from the TDRE flag to confirm that
writing is possible. Then write data to
TDR.
When data is written to TDR, the
TDRE flag is automatically cleared to
0. When data is read from RDR, the
RDRF flag is automatically cleared to
0.
[4] If an overrun error occurs, read the
OER flag in SSR, and after
performing the appropriate error
processing, clear the OER flag to 0.
Transmission/reception cannot be
resumed if the OER flag is set to 1.
For overrun error processing, see
figure 16.13.
Yes
All data received?
[3]
No
Clear TE and RE bits in SCR to 0
<End>
Figure 16.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)
Rev. 3.00, 05/03, page 273 of 472
16.6
Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer between a number of
processors sharing communication lines by asynchronous serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data. When
multiprocessor communication is performed, each receiving station is addressed by a unique ID
code. The serial communication cycle consists of two component cycles; an ID transmission cycle
that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to
differentiate between the ID transmission cycle and the data transmission cycle. If the
multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the
cycle is a data transmission cycle. Figure 16.15 shows an example of inter-processor
communication using the multiprocessor format. The transmitting station first sends the ID code of
the receiving station with which it wants to perform serial communication as data with a 1
multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose IDs do not
match continue to skip data until data with a 1 multiprocessor bit is again received.
The SCI3 uses the MPIE bit in SCR3 to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and OER, to 1, are inhibited until data with a 1 multiprocessor bit is received. On
reception of a receive character with a 1 multiprocessor bit, the MPBR bit in SSR is set to 1 and
the MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR3 is
set to 1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit
settings are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
Rev. 3.00, 05/03, page 274 of 472
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'AA
H'01
(MPB = 1)
(MPB = 0)
ID transmission cycle = Data transmission cycle =
receiving station
Data transmission to
specification
receiving station specified by ID
Legend
MPB: Multiprocessor bit
Figure 16.15 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
Rev. 3.00, 05/03, page 275 of 472
16.6.1
Multiprocessor Serial Data Transmission
Figure 16.16 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI3 operations are the same
as those in asynchronous mode.
Start transmission
[1]
[1]
Read TDRE flag in SSR
No
TDRE = 1
[2]
Yes
Set MPBT bit in SSR
[3]
Write transmit data to TDR
Yes
[2]
Read SSR and check that the TDRE
flag is set to 1, set the MPBT bit in
SSR to 0 or 1, then write transmit
data to TDR. When data is written to
TDR, the TDRE flag is automatically
cleared to 0.
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR. When data is
written to TDR, the TDRE flag is
automatically cleared to 0.
To output a break in serial
transmission, set the port PCR to 1,
clear PDR to 0, then clear the TE bit
in SCR3 to 0.
All data transmitted?
No
Read TEND flag in SSR
No
TEND = 1
Yes
No
[3]
Break output?
Yes
Clear PDR to 0 and set PCR to 1
Clear TE bit in SCR3 to 0
<End>
Figure 16.16 Sample Multiprocessor Serial Transmission Flowchart
Rev. 3.00, 05/03, page 276 of 472
16.6.2
Multiprocessor Serial Data Reception
Figure 16.17 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR3 is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI3 operations are the same as those in asynchronous mode.
Figure 16.18 shows an example of SCI3 operation for multiprocessor format reception.
Rev. 3.00, 05/03, page 277 of 472
[1]
[2]
Start reception
Set MPIE bit in SCR3 to 1
[1]
Read OER and FER flags in SSR
[2]
[3]
Yes
FER+OER = 1
No
Read RDRF flag in SSR
[3]
No
[4]
[5]
RDRF = 1
Yes
Read receive data in RDR
No
This station’s ID?
Set the MPIE bit in SCR3 to 1.
Read OER and FER in SSR to check for
errors. Receive error processing is performed
in cases where a receive error occurs.
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR
and compare it with this station’s ID.
If the data is not this station’s ID, set the MPIE
bit to 1 again.
When data is read from RDR, the RDRF flag
is automatically cleared to 0.
Read SSR and check that the RDRF flag is
set to 1, then read the data in RDR.
If a receive error occurs, read the OER and
FER flags in SSR to identify the error. After
performing the appropriate error processing,
ensure that the OER and FER flags are all
cleared to 0.
Reception cannot be resumed if either of
these flags is set to 1.
In the case of a framing error, a break can be
detected by reading the RxD pin value.
Yes
Read OER and FER flags in SSR
Yes
FER+OER = 1
No
Read RDRF flag in SSR
[4]
No
RDRF = 1
[5]
Error processing
Yes
Read receive data in RDR
(Continued on
next page)
Yes
All data received?
No
[A]
Clear RE bit in SCR3 to 0
<End>
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (1)
Rev. 3.00, 05/03, page 278 of 472
[5]
Error processing
No
OER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
[A]
Framing error processing
Clear OER, and
FER flags in SSR to 0
<End>
Figure 16.17 Sample Multiprocessor Serial Reception Flowchart (2)
Rev. 3.00, 05/03, page 279 of 472
Start
bit
Serial
data
1
0
Receive
data (ID1)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data1)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
User
processing
RXI interrupt request
is not generated, and
RDR retains its state
RDRF flag
cleared
to 0
RXI interrupt
request
MPIE cleared
to 0
RDR data read
When data is not
this station's ID,
MPIE is set to 1
again
(a) When data does not match this receiver's ID
Start
bit
Serial
data
1
0
Receive
data (ID2)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data2)
D0
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
User
processing
ID2
RXI interrupt
request
MPIE cleared
to 0
RDRF flag
cleared
to 0
RDR data read
Data2
RXI interrupt
request
When data is
this station's
ID, reception
is continued
RDRF flag
cleared
to 0
RDR data read
MPIE set to 1
again
(b) When data matches this receiver's ID
Figure 16.18 Example of SCI3 Reception Using Multiprocessor Format
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Rev. 3.00, 05/03, page 280 of 472
16.7
Interrupts
SCI3 creates the following six interrupt requests: transmission end, transmit data empty, receive
data full, and receive errors (overrun error, framing error, and parity error). Table 16.7 shows the
interrupt sources.
Table 16.7 SCI3 Interrupt Requests
Interrupt Requests
Abbreviation
Interrupt Sources
Receive Data Full
RXI
Setting RDRF in SSR
Transmit Data Empty
TXI
Setting TDRE in SSR
Transmission End
TEI
Setting TEND in SSR
Receive Error
ERI
Setting OER, FER, and PER in SSR
The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR3 is set to 1 before
transferring the transmit data to TDR, a TXI interrupt request is generated even if the transmit data
is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit in SCR3 is
set to 1 before transferring the transmit data to TDR, a TEI interrupt request is generated even if
the transmit data has not been sent. It is possible to make use of the most of these interrupt
requests efficiently by transferring the transmit data to TDR in the interrupt routine. To prevent the
generation of these interrupt requests (TXI and TEI), set the enable bits (TIE and TEIE) that
correspond to these interrupt requests to 1, after transferring the transmit data to TDR.
Rev. 3.00, 05/03, page 281 of 472
16.8
Usage Notes
16.8.1
Break Detection and Processing
When framing error detection is performed, a break can be detected by reading the RxD pin value
directly. In a break, the input from the RxD pin becomes all 0s, setting the FER flag, and possibly
the PER flag. Note that as the SCI3 continues the receive operation after receiving a break, even if
the FER flag is cleared to 0, it will be set to 1 again.
16.8.2
Mark State and Break Sending
When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are
determined by PCR and PDR. This can be used to set the TxD pin to mark state (high level) or
send a break during serial data transmission. To maintain the communication line at mark state
until TE is set to 1, set both PCR and PDR to 1. As TE is cleared to 0 at this point, the TxD pin
becomes an I/O port, and 1 is output from the TxD pin. To send a break during serial transmission,
first set PCR to 1 and clear PDR to 0, and then clear TE to 0. When TE is cleared to 0, the
transmitter is initialized regardless of the current transmission state, the TxD pin becomes an I/O
port, and 0 is output from the TxD pin.
16.8.3
Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
Rev. 3.00, 05/03, page 282 of 472
16.8.4
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI3 operates on a basic clock with a frequency of 16 times the
transfer rate. In reception, the SCI3 samples the falling edge of the start bit using the basic clock,
and performs internal synchronization. Receive data is latched internally at the rising edge of the
8th pulse of the basic clock as shown in figure 16.19. Thus, the reception margin in asynchronous
mode is given by formula (1) below.
1
D – 0.5
M = (0.5 –
)–
– (L – 0.5) F × 100(%)
2N
N
... Formula (1)
Legend N
D
L
F
: Ratio of bit rate to clock (N = 16)
: Clock duty (D = 0.5 to 1.0)
: Frame length (L = 9 to 12)
: Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in
formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 16.19 Receive Data Sampling Timing in Asynchronous Mode
Rev. 3.00, 05/03, page 283 of 472
Rev. 3.00, 05/03, page 284 of 472
Section 17 I2C Bus Interface 2 (IIC2)
The I2C bus interface 2 conforms to and provides a subset of the Philips I2C bus (inter-IC bus)
interface functions. The register configuration that controls the I2C bus differs partly from the
Philips configuration, however.
Figure 17.1 shows a block diagram of the I2C bus interface 2.
Figure 17.2 shows an example of I/O pin connections to external circuits.
17.1
Features
• Selection of I2C format or clocked synchronous serial format
• Continuous transmission/reception
Since the shift register, transmit data register, and receive data register are independent from
each other, the continuous transmission/reception can be performed.
I2C bus format
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Bit synchronization/wait function
In master mode, the state of SCL is monitored per bit, and the timing is synchronized
automatically.
If transmission/reception is not yet possible, set the SCL to low until preparations are
completed.
• Six interrupt sources
Transmit data empty (including slave-address match), transmit end, receive data full (including
slave-address match), arbitration lost, NACK detection, and stop condition detection
• Direct bus drive
Two pins, SCL and SDA pins, function as NMOS open-drain outputs when the bus drive
function is selected.
Clocked synchronous format
• Four interrupt sources
Transmit-data-empty, transmit-end, receive-data-full, and overrun error
IFIIC10A_000020020200
Rev. 3.00, 05/03, page 285 of 472
Transfer clock
generation
circuit
SCL
Transmission/
reception
control circuit
Output
control
ICCR1
ICCR2
ICMR
Internal data bus
Noise canceler
ICDRT
SDA
Output
control
ICDRS
SAR
Address
comparator
Noise canceler
ICDRR
Bus state
decision circuit
Arbitration
decision circuit
ICSR
ICEIR
Interrupt
generator
Legend
ICCR1 : I2C bus control register 1
ICCR2 : I2C bus control register 2
ICMR : I2C bus mode register
ICSR : I2C bus status register
ICIER : I2C bus interrupt enable register
ICDRT : I2C bus transmit data register
ICDRR : I2C bus receive data register
ICDRS : I2C bus shift register
SAR : Slave address register
Figure 17.1 Block Diagram of I2C Bus Interface 2
Rev. 3.00, 05/03, page 286 of 472
Interrupt request
Vcc
SCL in
Vcc
SCL
SCL
SDA
SDA
out
SDA in
SCL in
out
SCL
SDA
(Master)
SCL
SDA
out
SCL in
out
SDA in
SDA in
out
out
(Slave 1)
(Slave 2)
Figure 17.2 External Circuit Connections of I/O Pins
17.2
Input/Output Pins
Table 17.1 summarizes the input/output pins used by the I2C bus interface 2.
Table 17.1 I2C Bus Interface Pins
Name
Abbreviation
I/O
Function
Serial clock
SCL
I/O
IIC serial clock input/output
Serial data
SDA
I/O
IIC serial data input/output
17.3
Register Descriptions
The I2C bus interface 2 has the following registers:
• I2C bus control register 1 (ICCR1)
• I2C bus control register 2 (ICCR2)
• I2C bus mode register (ICMR)
• I2C bus interrupt enable register (ICIER)
• I2C bus status register (ICSR)
• I2C bus slave address register (SAR)
• I2C bus transmit data register (ICDRT)
• I2C bus receive data register (ICDRR)
Rev. 3.00, 05/03, page 287 of 472
• I2C bus shift register (ICDRS)
17.3.1
I2C Bus Control Register 1 (ICCR1)
ICCR1 enables or disables the I2C bus interface 2, controls transmission or reception, and selects
master or slave mode, transmission or reception, and transfer clock frequency in master mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
ICE
0
R/W
I C Bus Interface Enable
2
0: This module is halted. (SCL and SDA pins are set to
port function.)
1: This bit is enabled for transfer operations. (SCL and
SDA pins are bus drive state.)
6
RCVD
0
R/W
Reception Disable
This bit enables or disables the next operation when TRS
is 0 and ICDRR is read.
0: Enables next reception
1: Disables next reception
5
MST
0
R/W
Master/Slave Select
4
TRS
0
R/W
Transmit/Receive Select
2
In master mode with the I C bus format, when arbitration
is lost, MST and TRS are both reset by hardware,
causing a transition to slave receive mode. Modification
of the TRS bit should be made between transfer frames.
After data receive has been started in slave receive
mode, when the first seven bits of the receive data agree
with the slave address that is set to SAR and the eighth
bit is 1, TRS is automatically set to 1. If an overrun error
occurs in master mode with the clock synchronous serial
format, MST is cleared to 0 and slave receive mode is
entered.
Operating modes are described below according to MST
and TRS combination. When clocked synchronous serial
format is selected and MST is 1, clock is output.
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
Rev. 3.00, 05/03, page 288 of 472
Bit
Bit Name
Initial
Value
R/W
Description
3
CKS3
0
R/W
Transfer Clock Select 3 to 0
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
These bits are valid only in master mode and should be
set according to the necessary transfer rate. For details
on transfer rate, see table 17.2, Transfer Rate.
Table 17.2 Transfer Rate
Bit 3
Bit 2
Bit 1
Bit 0
Transfer Rate
CKS3 CKS2 CKS1 CKS0 Clock
0
0
1
0
1
φ = 8 MHz
φ = 10 MHz φ = 16 MHz φ = 20 MHz
0
φ/28
179 kHz
286 kHz
357 kHz
571 kHz
714 kHz
1
φ/40
125 kHz
200 kHz
250 kHz
400 kHz
500 kHz
1
0
φ/48
104 kHz
167 kHz
208 kHz
333 kHz
417 kHz
1
φ/64
78.1 kHz
125 kHz
156 kHz
250 kHz
313 kHz
0
0
φ/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
1
φ/100
50.0 kHz
80.0 kHz
100 kHz
160 kHz
200 kHz
0
φ/112
44.6 kHz
71.4 kHz
89.3 kHz
143 kHz
179 kHz
1
φ/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
0
φ/56
89.3 kHz
143 kHz
179 kHz
286 kHz
357 kHz
1
φ/80
62.5 kHz
100 kHz
125 kHz
200 kHz
250 kHz
1
0
φ/96
52.1 kHz
83.3 kHz
104 kHz
167 kHz
208 kHz
1
φ/128
39.1 kHz
62.5 kHz
78.1 kHz
125 kHz
156 kHz
0
φ/160
31.3 kHz
50.0 kHz
62.5 kHz
100 kHz
125 kHz
1
φ/200
25.0 kHz
40.0 kHz
50.0 kHz
80.0 kHz
100 kHz
0
φ/224
22.3 kHz
35.7 kHz
44.6 kHz
71.4 kHz
89.3 kHz
1
φ/256
19.5 kHz
31.3 kHz
39.1 kHz
62.5 kHz
78.1 kHz
0
1
1
φ = 5 MHz
0
1
Rev. 3.00, 05/03, page 289 of 472
17.3.2
I2C Bus Control Register 2 (ICCR2)
ICCR1 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls
reset in the control part of the I2C bus interface 2.
Bit
Bit Name
Initial
Value
R/W
Description
7
BBSY
0
R/W
Bus Busy
2
This bit enables to confirm whether the I C bus is
occupied or released and to issue start/stop conditions in
master mode. With the clocked synchronous serial
2
format, this bit has no meaning. With the I C bus format,
this bit is set to 1 when the SDA level changes from high
to low under the condition of SCL = high, assuming that
the start condition has been issued. This bit is cleared to
0 when the SDA level changes from low to high under the
condition of SCL = high, assuming that the stop condition
has been issued. Write 1 to BBSY and 0 to SCP to issue
a start condition. Follow this procedure when also retransmitting a start condition. Write 0 in BBSY and 0 in
SCP to issue a stop condition. To issue start/stop
conditions, use the MOV instruction.
6
SCP
1
W
Start/Stop Issue Condition Disable
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in SCP.
A retransmit start condition is issued in the same way. To
issue a stop condition, write 0 in BBSY and 0 in SCP.
This bit is always read as 1. If 1 is written, the data is not
stored.
5
SDAO
1
R/W
SDA Output Value Control
This bit is used with SDAOP when modifying output level
of SDA. This bit should not be manipulated during
transfer.
0: When reading, SDA pin outputs low.
When writing, SDA pin is changed to output low.
1: When reading, SDA pin outputs high.
When writing, SDA pin is changed to output Hi-Z
(outputs high by external pull-up resistance).
Rev. 3.00, 05/03, page 290 of 472
Bit
Bit Name
Initial
Value
R/W
4
SDAOP
1
R/W
Description
SDAO Write Protect
This bit controls change of output level of the SDA pin by
modifying the SDAO bit. To change the output level, clear
SDAO and SDAOP to 0 or set SDAO to 1 and clear
SDAOP to 0 by the MOV instruction. This bit is always
read as 1.
3
SCLO
1
R
This bit monitors SCL output level. When SCLO is 1, SCL
pin outputs high. When SCLO is 0, SCL pin outputs low.
2
1
Reserved
This bit is always read as 1, and cannot be modified.
1
IICRST
0
R/W
IIC Control Part Reset
2
This bit resets the control part except for I C registers. If
this bit is set to 1 when hang-up occurs because of
2
2
communication failure during I C operation, I C control
part can be reset without setting ports and initializing
registers.
0
1
Reserved
This bit is always read as 1, and cannot be modified.
17.3.3
I2C Bus Mode Register (ICMR)
ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control,
and selects the transfer bit count.
Bit
Bit Name
Initial
Value
R/W
Description
7
MLS
0
R/W
MSB-First/LSB-First Select
0: MSB-first
1: LSB-first
2
Set this bit to 0 when the I C bus format is used.
6
WAIT
0
R/W
Wait Insertion Bit
2
In master mode with the I C bus format, this bit selects
whether to insert a wait after data transfer except the
acknowledge bit. When WAIT is set to 1, after the fall of
the clock for the final data bit, low period is extended for
two transfer clocks. If WAIT is cleared to 0, data and
acknowledge bits are transferred consecutively with no
wait inserted.
2
The setting of this bit is invalid in slave mode with the I C
bus format or with the clocked synchronous serial format.
Rev. 3.00, 05/03, page 291 of 472
Bit
Bit Name
Initial
Value
R/W
Description
5, 4
All 1
Reserved
These bits are always read as 1, and cannot be modified.
3
BCWP
1
R/W
BC Write Protect
This bit controls the BC2 to BC0 modifications. When
modifying BC2 to BC0, this bit should be cleared to 0 and
use the MOV instruction. In clock synchronous serial
mode, BC should not be modified.
0: When writing, values of BC2 to BC0 are set.
1: When reading, 1 is always read.
When writing, settings of BC2 to BC0 are invalid.
2
BC2
0
R/W
Bit Counter 2 to 0
1
BC1
0
R/W
0
BC0
0
R/W
These bits specify the number of bits to be transferred
next. When read, the remaining number of transfer bits is
2
indicated. With the I C bus format, the data is transferred
with one addition acknowledge bit. Bit BC2 to BC0
settings should be made during an interval between
transfer frames. If bits BC2 to BC0 are set to a value
other than 000, the setting should be made while the SCL
pin is low. The value returns to 000 at the end of a data
transfer, including the acknowledge bit. With the clock
synchronous serial format, these bits should not be
modified.
2
Rev. 3.00, 05/03, page 292 of 472
I C Bus Format
Clock Synchronous Serial Format
000: 9 bits
000: 8 bits
001: 2 bits
001: 1 bits
010: 3 bits
010: 2 bits
011: 4 bits
011: 3 bits
100: 5 bits
100: 4 bits
101: 6 bits
101: 5 bits
110: 7 bits
110: 6 bits
111: 8 bits
111: 7 bits
17.3.4
I2C Bus Interrupt Enable Register (ICIER)
ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be
transferred, and confirms acknowledge bits to be received.
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When the TDRE bit in ICSR is set to 1, this bit enables or
disables the transmit data empty interrupt (TXI).
0: Transmit data empty interrupt request (TXI) is disabled.
1: Transmit data empty interrupt request (TXI) is enabled.
6
TEIE
0
R/W
Transmit End Interrupt Enable
This bit enables or disables the transmit end interrupt
(TEI) at the rising of the ninth clock while the TDRE bit in
ICSR is 1. TEI can be canceled by clearing the TEND bit
or the TEIE bit to 0.
0: Transmit end interrupt request (TEI) is disabled.
1: Transmit end interrupt request (TEI) is enabled.
5
RIE
0
R/W
Receive Interrupt Enable
This bit enables or disables the receive data full interrupt
request (RXI) and the overrun error interrupt request
(ERI) with the clocked synchronous format, when a
receive data is transferred from ICDRS to ICDRR and the
RDRF bit in ICSR is set to 1. RXI can be canceled by
clearing the RDRF or RIE bit to 0.
0: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are disabled.
1: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are enabled.
4
NAKIE
0
R/W
NACK Receive Interrupt Enable
This bit enables or disables the NACK receive interrupt
request (NAKI) and the overrun error (setting of the OVE
bit in ICSR) interrupt request (ERI) with the clocked
synchronous format, when the NACKF and AL bits in
ICSR are set to 1. NAKI can be canceled by clearing the
NACKF, OVE, or NAKIE bit to 0.
0: NACK receive interrupt request (NAKI) is disabled.
1: NACK receive interrupt request (NAKI) is enabled.
Rev. 3.00, 05/03, page 293 of 472
Bit
Bit Name
Initial
Value
R/W
3
STIE
0
R/W
Description
Stop Condition Detection Interrupt Enable
0: Stop condition detection interrupt request (STPI) is
disabled.
1: Stop condition detection interrupt request (STPI) is
enabled.
2
ACKE
0
R/W
Acknowledge Bit Judgement Select
0: The value of the receive acknowledge bit is ignored,
and continuous transfer is performed.
1: If the receive acknowledge bit is 1, continuous transfer
is halted.
1
ACKBR
0
R
Receive Acknowledge
In transmit mode, this bit stores the acknowledge data
that are returned by the receive device. This bit cannot be
modified.
0: Receive acknowledge = 0
1: Receive acknowledge = 1
0
ACKBT
0
R/W
Transmit Acknowledge
In receive mode, this bit specifies the bit to be sent at the
acknowledge timing.
0: 0 is sent at the acknowledge timing.
1: 1 is sent at the acknowledge timing.
Rev. 3.00, 05/03, page 294 of 472
17.3.5
I2C Bus Status Register (ICSR)
ICSR performs confirmation of interrupt request flags and status.
Bit
Bit Name
Initial
Value
R/W
Description
7
TDRE
0
R/W
Transmit Data Register Empty
[Setting condition]
•
When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
•
When TRS is set
•
When a start condition (including re-transfer) has
been issued
•
When transmit mode is entered from receive mode in
slave mode
[Clearing conditions]
6
TEND
0
R/W
•
When 0 is written in TDRE after reading TDRE = 1
•
When data is written to ICDRT with an instruction
Transmit End
[Setting conditions]
•
When the ninth clock of SCL rises with the I C bus
format while the TDRE flag is 1
•
When the final bit of transmit frame is sent with the
clock synchronous serial format
2
[Clearing conditions]
5
RDRF
0
R/W
•
When 0 is written in TEND after reading TEND = 1
•
When data is written to ICDRT with an instruction
Receive Data Register Full
[Setting condition]
•
When a receive data is transferred from ICDRS to
ICDRR
[Clearing conditions]
•
When 0 is written in RDRF after reading RDRF = 1
•
When ICDRR is read with an instruction
Rev. 3.00, 05/03, page 295 of 472
Bit
Bit Name
Initial
Value
R/W
4
NACKF
0
R/W
Description
No Acknowledge Detection Flag
[Setting condition]
•
When no acknowledge is detected from the receive
device in transmission while the ACKE bit in ICIER is
1
[Clearing condition]
•
3
STOP
0
R/W
When 0 is written in NACKF after reading NACKF = 1
Stop Condition Detection Flag
[Setting condition]
•
When a stop condition is detected after frame transfer
[Clearing condition]
•
2
AL/OVE
0
R/W
When 0 is written in STOP after reading STOP = 1
Arbitration Lost Flag/Overrun Error Flag
This flag indicates that arbitration was lost in master
2
mode with the I C bus format and that the final bit has
been received while RDRF = 1 with the clocked
synchronous format.
When two or more master devices attempt to seize the
2
bus at nearly the same time, if the I C bus interface
detects data differing from the data it sent, it sets AL to 1
to indicate that the bus has been taken by another
master.
[Setting conditions]
•
If the internal SDA and SDA pin disagree at the rise of
SCL in master transmit mode
•
When the SDA pin outputs high in master mode while
a start condition is detected
•
When the final bit is received with the clocked
synchronous format while RDRF = 1
[Clearing condition]
•
Rev. 3.00, 05/03, page 296 of 472
When 0 is written in AL/OVE after reading AL/OVE=1
Bit
Bit Name
Initial
Value
R/W
1
AAS
0
R/W
Description
Slave Address Recognition Flag
In slave receive mode, this flag is set to 1 if the first frame
following a start condition matches bits SVA6 to SVA0 in
SAR.
[Setting conditions]
•
When the slave address is detected in slave receive
mode
•
When the general call address is detected in slave
receive mode.
[Clearing condition]
•
0
ADZ
0
R/W
When 0 is written in AAS after reading AAS=1
General Call Address Recognition Flag
2
This bit is valid in I C bus format slave receive mode.
[Setting condition]
•
When the general call address is detected in slave
receive mode
[Clearing conditions]
•
17.3.6
When 0 is written in ADZ after reading ADZ=1
Slave Address Register (SAR)
SAR selects the communication format and sets the slave address. When the chip is in slave mode
with the I2C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame
received after a start condition, the chip operates as the slave device.
Initial
Value
R/W
Description
SVA6 to
SVA0
All 0
R/W
Slave Address 6 to 0
FS
0
Bit
Bit Name
7 to 1
0
These bits set a unique address in bits SVA6 to SVA0,
differing form the addresses of other slave devices
2
connected to the I C bus.
R/W
Format Select
2
0: I C bus format is selected.
1: Clocked synchronous serial format is selected.
Rev. 3.00, 05/03, page 297 of 472
17.3.7
I2C Bus Transmit Data Register (ICDRT)
ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the
space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to
ICDRS and starts transferring data. If the next transfer data is written to ICDRT during
transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1
and when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of
ICDRT is H’FF.
17.3.8
I2C Bus Receive Data Register (ICDRR)
ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR
transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a
receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR
is H’FF.
17.3.9
I2C Bus Shift Register (ICDRS)
ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from
ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from
ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the
CPU.
Rev. 3.00, 05/03, page 298 of 472
17.4
Operation
The I2C bus interface can communicate either in I2C bus mode or clocked synchronous serial
mode by setting FS in SAR.
17.4.1
I2C Bus Format
Figure 17.3 shows the I2C bus formats. Figure 17.4 shows the I2C bus timing. The first frame
following a start condition always consists of 8 bits.
(a) I2C bus format (FS = 0)
S
SLA
1
7
R/
1
A
DATA
A
A/
P
1
n
1
1
1
1
n: Transfer bit count
(n = 1 to 8)
m: Transfer frame count
(m ≥ 1)
m
(b) I2C bus format (Start condition retransmission, FS = 0)
S
SLA
1
7
R/
1
A
DATA
1
n1
1
A/
S
SLA
1
1
7
m1
R/
1
A
DATA
1
n2
1
A/
P
1
1
m2
n1 and n2: Transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: Transfer frame count (m1 and m2 ≥ 1)
Figure 17.3 I2C Bus Formats
SDA
SCL
S
1-7
8
9
SLA
R/
A
1-7
DATA
8
9
A
1-7
DATA
8
9
A
P
Figure 17.4 I2C Bus Timing
Legend
S:
SLA:
R/W:
Start condition. The master device drives SDA from high to low while SCL is high.
Slave address
Indicates the direction of data transfer: from the slave device to the master device when
R/W is 1, or from the master device to the slave device when R/W is 0.
A:
Acknowledge. The receive device drives SDA to low.
DATA: Transfer data
Rev. 3.00, 05/03, page 299 of 472
P:
17.4.2
Stop condition. The master device drives SDA from low to high while SCL is high.
Master Transmit Operation
In master transmit mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For master transmit mode operation timing, refer to
figures 17.5 and 17.6. The transmission procedure and operations in master transmit mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting)
2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in
ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV
instruction. (Start condition issued) This generates the start condition.
3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data
show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0,
and data is transferred from ICDRT to ICDRS. TDRE is set again.
4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1
at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the
slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1,
the slave device has not been acknowledged, so issue the stop condition. To issue the stop
condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the
transmit data is prepared or the stop condition is issued.
5. The transmit data after the second byte is written to ICDRT every time TDRE is set.
6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last
byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the
receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or
NACKF.
7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode.
Rev. 3.00, 05/03, page 300 of 472
SCL
(Master output)
1
2
3
4
5
6
SDA
(Master output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
7
8
Bit 1
Slave address
9
1
Bit 0
Bit 7
2
Bit 6
R/
SDA
(Slave output)
A
TDRE
TEND
Address + R/
ICDRT
ICDRS
User
processing
Data 1
Address + R/
[2] Instruction of start
condition issuance
Data 2
Data 1
[4] Write data to ICDRT (second byte)
[5] Write data to ICDRT (third byte)
[3] Write data to ICDRT (first byte)
Figure 17.5 Master Transmit Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
SDA
(Slave output)
1
2
3
4
5
6
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
A
7
Bit 1
8
9
Bit 0
A/
TDRE
TEND
Data n
ICDRT
ICDRS
Data n
User
[5] Write data to ICDRT
processing
[6] Issue stop condition. Clear TEND.
[7] Set slave receive mode
Figure 17.6 Master Transmit Mode Operation Timing (2)
Rev. 3.00, 05/03, page 301 of 472
17.4.3
Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data from the slave
device, and returns an acknowledge signal. For master receive mode operation timing, refer to
figures 17.7 and 17.8. The reception procedure and operations in master receive mode are shown
below.
1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master
transmit mode to master receive mode. Then, clear the TDRE bit to 0.
2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock. The master device outputs the
level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse.
3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise
of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF
is cleared to 0.
4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th
receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is
fixed low until ICDRR is read.
5. If next frame is the last receive data, set the RCVD bit in ICCR1 to 1 before reading ICDRR.
This enables the issuance of the stop condition after the next reception.
6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, issue the stage condition.
7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0.
8. The operation returns to the slave receive mode.
Rev. 3.00, 05/03, page 302 of 472
Master transmit mode
SCL
(Master output)
Master receive mode
9
1
2
3
4
5
6
7
8
SDA
(Master output)
9
1
A
SDA
(Slave output)
Bit 7
A
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
RDRF
ICDRS
Data 1
ICDRR
Data 1
User
processing
[3] Read ICDRR
[1] Clear TDRE after clearing
TEND and TRS
[2] Read ICDRR (dummy read)
Figure 17.7 Master Receive Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
A
SDA
(Slave output)
1
2
3
4
5
6
7
8
9
A/
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RDRF
RCVD
ICDRS
ICDRR
User
processing
Data n
Data n-1
Data n
Data n-1
[5] Read ICDRR after setting RCVD
[7] Read ICDRR,
and clear RCVD
[6] Issue stop
condition [8] Set slave
receive mode
Figure 17.8 Master Receive Mode Operation Timing (2)
Rev. 3.00, 05/03, page 303 of 472
17.4.4
Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. For slave transmit mode operation timing,
refer to figures 17.9 and 17.10.
The transmission procedure and operations in slave transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are
set to 1, and the mode changes to slave transmit mode automatically. The continuous
transmission is performed by writing transmit data to ICDRT every time TDRE is set.
3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1,
with TDRE = 1. When TEND is set, clear TEND.
4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free.
5. Clear TDRE.
Rev. 3.00, 05/03, page 304 of 472
Slave receive mode
SCL
(Master output)
Slave transmit mode
9
1
2
3
4
5
6
7
8
9
SDA
(Master output)
1
A
SCL
(Slave output)
SDA
(Slave output)
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
ICDRT
ICDRS
Data 1
Data 2
Data 1
Data 3
Data 2
ICDRR
User
processing
[2] Write data to ICDRT (data 1)
[2] Write data to ICDRT (data 2)
[2] Write data to ICDRT (data 3)
Figure 17.9 Slave Transmit Mode Operation Timing (1)
Rev. 3.00, 05/03, page 305 of 472
Slave receive
mode
Slave transmit mode
SCL
(Master output)
9
SDA
(Master output)
A
1
2
3
4
5
6
7
8
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
SCL
(Slave output)
SDA
(Slave output)
Bit 7
Bit 6
Bit 5
TDRE
TEND
TRS
ICDRT
ICDRS
Data n
ICDRR
User
processing
[3] Clear TEND
[4] Read ICDRR (dummy read)
after clearing TRS
[5] Clear TDRE
Figure 17.10 Slave Transmit Mode Operation Timing (2)
17.4.5
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For slave receive mode operation timing, refer to
figures 17.11 and 17.12. The reception procedure and operations in slave receive mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the
read data show the slave address and R/W, it is not used.)
3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is
fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be
returned to the master device, is reflected to the next transmit frame.
Rev. 3.00, 05/03, page 306 of 472
4. The last byte data is read by reading ICDRR.
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
1
Bit 7
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 1
Data 2
ICDRR
User
processing
Data 1
[2] Read ICDRR
[2] Read ICDRR (dummy read)
Figure 17.11 Slave Receive Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 2
Data 1
ICDRR
User
processing
Data 1
[3] Set ACKBT
[3] Read ICDRR [4] Read ICDRR
Figure 17.12 Slave Receive Mode Operation Timing (2)
Rev. 3.00, 05/03, page 307 of 472
17.4.6
Clocked Synchronous Serial Format
This module can be operated with the clocked synchronous serial format, by setting the FS bit in
SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When
MST is 0, the external clock input is selected.
Data Transfer Format
Figure 17.13 shows the clocked synchronous serial transfer format.
The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge
of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the
MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the
SDAO bit in ICCR2.
SCL
SDA
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5 Bit 6
Bit 7
Figure 17.13 Clocked Synchronous Serial Transfer Format
Transmit Operation
In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer
clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For
transmit mode operation timing, refer to figure 17.14. The transmission procedure and operations
in transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set.
3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is
transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous
transmission is performed by writing data to ICDRT every time TDRE is set. When changing
from transmit mode to receive mode, clear TRS while TDRE is 1.
Rev. 3.00, 05/03, page 308 of 472
SCL
1
2
7
8
1
7
8
1
SDA
(Output)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
Bit 0
TRS
TDRE
Data 1
ICDRT
Data 1
ICDRS
User
processing
Data 2
[3] Write data [3] Write data
to ICDRT
to ICDRT
[2] Set TRS
Data 3
Data 2
Data 3
[3] Write data
to ICDRT
[3] Write data
to ICDRT
Figure 17.14 Transmit Mode Operation Timing
Receive Operation
In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when
MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to
figure 17.15. The reception procedure and operations in receive mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. When the transfer clock is output, set MST to 1 to start outputting the receive clock.
3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and
RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is
continually output. The continuous reception is performed by reading ICDRR every time
RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and
AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR.
4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is
fixed high after receiving the next byte data.
Rev. 3.00, 05/03, page 309 of 472
SCL
1
2
7
8
1
7
8
SDA
(Input)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
1
2
Bit 0
MST
TRS
RDRF
Data 2
Data 1
ICDRS
Data 3
Data 1
ICDRR
User
processing
[2] Set MST
(when outputting the clock)
[3] Read ICDRR
Data 2
[3] Read ICDRR
Figure 17.15 Receive Mode Operation Timing
17.4.7
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched
internally. Figure 17.16 shows a block diagram of the noise canceler circuit.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C
SCL or SDA
input signal
D
C
Q
Latch
D
Q
Latch
March detector
System clock
period
Sampling
clock
Figure 17.16 Block Diagram of Noise Conceler
Rev. 3.00, 05/03, page 310 of 472
Internal
SCL or SDA
signal
17.4.8
Example of Use
Flowcharts in respective modes that use the I2C bus interface are shown in figures 17.17 to 17.20.
Start
Initialize
[1]
Test the status of the SCL and SDA lines.
[2]
Set master transmit mode.
[3]
Issue the start candition.
[2]
[4]
Set the first byte (slave address + R/ ) of transmit data.
Write 1 to BBSY
and 0 to SCP.
[3]
[5]
Wait for 1 byte to be transmitted.
Write transmit data
in ICDRT
[4]
[6]
Test the acknowledge transferred from the specified slave device.
[7]
Set the second and subsequent bytes (except for the final byte) of transmit data.
[8]
Wait for ICDRT empty.
[9]
Set the last byte of transmit data.
Read BBSY in ICCR2
[1]
No
BBSY=0 ?
Yes
Set MST and TRS
in ICCR1 to 1.
Read TEND in ICSR
[5]
No
TEND=1 ?
Yes
Read ACKBR in ICIER
[6]
ACKBR=0 ?
[10] Wait for last byte to be transmitted.
No
[11] Clear the TEND flag.
Yes
Transmit
mode?
Yes
No
Write transmit data in ICDRT
Mater receive mode
[7]
[13] Issue the stop condition.
Read TDRE in ICSR
No
[8]
TDRE=1 ?
Yes
No
[12] Clear the STOP flag.
[14] Wait for the creation of stop condition.
[15] Set slave receive mode. Clear TDRE.
Last byte?
[9]
Yes
Write transmit data in ICDRT
Read TEND in ICSR
No
[10]
TEND=1 ?
Yes
Clear TEND in ICSR
[11]
Clear STOP in ICSR
[12]
Write 0 to BBSY
and SCP
[13]
Read STOP in ICSR
No
[14]
STOP=1 ?
Yes
Set MST to 1 and TRS
to 0 in ICCR1
[15]
Clear TDRE in ICSR
End
Figure 17.17 Sample Flowchart for Master Transmit Mode
Rev. 3.00, 05/03, page 311 of 472
Mater receive mode
[1]
Clear TEND, select master receive mode, and then clear TDRE.*
[2]
Set acknowledge to the transmit device.*
[3]
Dummy-read ICDDR.*
[4]
Wait for 1 byte to be received
[5]
Check whether it is the (last receive - 1).
[6]
Read the receive data last.
[7]
Set acknowledge of the final byte. Disable continuous reception (RCVD = 1).
[8]
Read the (final byte - 1) of receive data.
[9]
Wait for the last byte to be receive.
Clear TEND in ICSR
Clear TRS in ICCR1 to 0
[1]
Clear TDRE in ICSR
Clear ACKBT in ICIER to 0
[2]
Dummy-read ICDRR
[3]
Read RDRF in ICSR
No
[4]
RDRF=1 ?
Yes
Last receive
- 1?
No
Read ICDRR
Yes
[5]
[10] Clear the STOP flag.
[6]
[11] Issue the stop condition.
[12] Wait for the creation of stop condition.
Set ACKBT in ICIER to 1
[7]
Set RCVD in ICCR1 to 1
Read ICDRR
[13] Read the last byte of receive data.
[14] Clear RCVD.
[8]
[15] Set slave receive mode.
Read RDRF in ICSR
No
RDRF=1 ?
[9]
Yes
Clear STOP in ICSR.
Write 0 to BBSY
and SCP
[10]
[11]
Read STOP in ICSR
No
[12]
STOP=1 ?
Yes
Read ICDRR
[13]
Clear RCVD in ICCR1 to 0
[14]
Clear MST in ICCR1 to 0
[15]
End
Note: Do not activate an interrupt during the execution of steps [1] to [3].
Figure 17.18 Sample Flowchart for Master Receive Mode
Rev. 3.00, 05/03, page 312 of 472
[1] Clear the AAS flag.
Slave transmit mode
Clear AAS in ICSR
[1]
Write transmit data
in ICDRT
[2]
[3] Wait for ICDRT empty.
[4] Set the last byte of transmit data.
Read TDRE in ICSR
No
[5] Wait for the last byte to be transmitted.
[3]
TDRE=1 ?
Yes
No
[6] Clear the TEND flag .
[7] Set slave receive mode.
Last
byte?
Yes
[2] Set transmit data for ICDRT (except for the last data).
[8] Dummy-read ICDRR to release the SCL line.
[4]
[9] Clear the TDRE flag.
Write transmit data
in ICDRT
Read TEND in ICSR
No
[5]
TEND=1 ?
Yes
Clear TEND in ICSR
[6]
Clear TRS in ICCR1 to 0
[7]
Dummy read ICDRR
[8]
Clear TDRE in ICSR
[9]
End
Figure 17.19 Sample Flowchart for Slave Transmit Mode
Rev. 3.00, 05/03, page 313 of 472
Slave receive mode
[1] Clear the AAS flag.
Clear AAS in ICSR
[1]
Clear ACKBT in ICIER to 0
[2]
[2] Set acknowledge to the transmit device.
[3] Dummy-read ICDRR.
[3]
Dummy-read ICDRR
[5] Check whether it is the (last receive - 1).
Read RDRF in ICSR
No
[4]
RDRF=1 ?
[6] Read the receive data.
[7] Set acknowledge of the last byte.
Yes
Last receive
- 1?
[4] Wait for 1 byte to be received.
Yes
No
Read ICDRR
[5]
[8] Read the (last byte - 1) of receive data.
[9] Wait the last byte to be received.
[6]
[10] Read for the last byte of receive data.
Set ACKBT in ICIER to 1
[7]
Read ICDRR
[8]
Read RDRF in ICSR
No
[9]
RDRF=1 ?
Yes
Read ICDRR
[10]
End
Figure 17.20 Sample Flowchart for Slave Receive Mode
Rev. 3.00, 05/03, page 314 of 472
17.5
Interrupt Request
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK receive, STOP recognition, and arbitration lost/overrun error. Table 17.3 shows the
contents of each interrupt request.
Table 17.3 Interrupt Requests
Interrupt Request
Abbreviation Interrupt Condition
I C Mode
Clocked
Synchronous Mode
2
Transmit Data Empty TXI
(TDRE=1) • (TIE=1)
!
!
Transmit End
TEI
(TEND=1) • (TEIE=1)
!
!
Receive Data Full
RXI
(RDRF=1) (RIE=1)
!
!
STOP Recognition
STPI
•
(STOP=1) (STIE=1)
!
×
NACK Receive
NAKI
{(NACKF=1)+(AL=1)} •
(NAKIE=1)
!
×
!
!
Arbitration
Lost/Overrun Error
•
When interrupt conditions described in table 17.3 are 1 and the I bit in CCR is 0, the CPU
executes an interrupt exception processing. Interrupt sources should be cleared in the exception
processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to
ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the
same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive
data of one byte may be transmitted.
Rev. 3.00, 05/03, page 315 of 472
17.6
Bit Synchronous Circuit
In master mode, this module has a possibility that high level period may be short in the two states
described below.
• When SCL is driven to low by the slave device
• When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pullup resistance)
Therefore, it monitors SCL and communicates by bit with synchronization.
Figure 17.21 shows the timing of the bit synchronous circuit and table 17.4 shows the time when
SCL output changes from low to Hi-Z then SCL is monitored.
SCL monitor
timing reference
clock
VIH
SCL
Internal SCL
Figure 17.21 The Timing of the Bit Synchronous Circuit
Table 17.4 Time for Monitoring SCL
CKS3
CKS2
Time for Monitoring SCL
0
0
7.5 tcyc
1
19.5 tcyc
0
17.5 tcyc
1
41.5 tcyc
1
Rev. 3.00, 05/03, page 316 of 472
Section 18 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to eight
analog input channels to be selected. The block diagram of the A/D converter is shown in figure
18.1.
18.1
Features
• 10-bit resolution
• Eight input channels
• Conversion time: at least 3.5 µs per channel (at 20-MHz operation)
• Two operating modes
Single mode: Single-channel A/D conversion
Scan mode: Continuous A/D conversion on 1 to 4 channels
• Four data registers
Conversion results are held in a data register for each channel
• Sample-and-hold function
• Two conversion start methods
Software
External trigger signal
• Interrupt request
An A/D conversion end interrupt request (ADI) can be generated
ADCMS32A_000020020200
Rev. 3.00, 05/03, page 317 of 472
Module data bus
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Analog multiplexer
10-bit D/A
Bus interface
Successive approximations
register
AVCC
Internal data bus
A
D
D
R
A
A
D
D
R
B
A
D
D
R
C
A
D
D
R
D
A
D
C
S
R
A
D
C
R
+
ø/4
Control circuit
Comparator
Sample-andhold circuit
Legend
ADCR : A/D control register
ADCSR : A/D control/status register
ADDRA : A/D data register A
ADDRB : A/D data register B
ADDRC : A/D data register C
ADDRD : A/D data register D
Figure 18.1 Block Diagram of A/D Converter
Rev. 3.00, 05/03, page 318 of 472
ø/8
ADI
interrupt
18.2
Input/Output Pins
Table 18.1 summarizes the input pins used by the A/D converter. The 8 analog input pins are
divided into two groups; analog input pins 0 to 3 (AN0 to AN3) comprising group 0, analog input
pins 4 to 7 (AN4 to AN7) comprising group 1. The AVcc pin is the power supply pin for the
analog block in the A/D converter.
Table 18.1 Pin Configuration
Pin Name
Abbreviation
I/O
Function
Analog power supply pin
AVCC
Input
Analog block power supply
Analog input pin 0
AN0
Input
Group 0 analog input
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
A/D external trigger input pin
ADTRG
Input
Group 1 analog input
External trigger input for starting
A/D conversion
Rev. 3.00, 05/03, page 319 of 472
18.3
Register Descriptions
The A/D converter has the following registers.
• A/D data register A (ADDRA)
• A/D data register B (ADDRB)
• A/D data register C (ADDRC)
• A/D data register D (ADDRD)
• A/D control/status register (ADCSR)
• A/D control register (ADCR)
18.3.1
A/D Data Registers A to D (ADDRA to ADDRD)
There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each analog input
channel, are shown in table 18.2.
The converted 10-bit data is stored in bits 15 to 6. The lower 6 bits are always read as 0.
The data bus width between the CPU and the A/D converter is 8 bits. The upper byte can be read
directly from the CPU, however the lower byte should be read via a temporary register. The
temporary register contents are transferred from the ADDR when the upper byte data is read.
When reading ADDR, read the upper bytes only or read in word units. ADDR is initialized to
H'0000.
Table 18.2 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
Group 0
Group 1
A/D Data Register to Be Stored Results of A/D Conversion
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6
ADDRC
AN3
AN7
ADDRD
Rev. 3.00, 05/03, page 320 of 472
18.3.2
A/D Control/Status Register (ADCSR)
ADCSR consists of the control bits and conversion end status bits of the A/D converter.
Bit
Bit Name
Initial
Value
R/W
Description
7
ADF
0
R/W
A/D End Flag
[Setting conditions]
•
When A/D conversion ends in single mode
•
When A/D conversion ends once on all the channels
selected in scan mode
[Clearing condition]
•
6
ADIE
0
R/W
When 0 is written after reading ADF = 1
A/D Interrupt Enable
A/D conversion end interrupt request (ADI) is enabled by
ADF when this bit is set to 1
5
ADST
0
R/W
A/D Start
Setting this bit to 1 starts A/D conversion. In single mode,
this bit is cleared to 0 automatically when conversion on
the specified channel is complete. In scan mode,
conversion continues sequentially on the specified
channels until this bit is cleared to 0 by software, a reset, or
a transition to standby mode.
4
SCAN
0
R/W
Scan Mode
Selects single mode or scan mode as the A/D conversion
operating mode.
0: Single mode
1: Scan mode
3
CKS
0
R/W
Clock Select
Selects the A/D conversions time.
0: Conversion time = 134 states (max.)
1: Conversion time = 70 states (max.)
Clear the ADST bit to 0 before switching the conversion
time.
Rev. 3.00, 05/03, page 321 of 472
Bit
Bit Name
Initial
Value
R/W
Description
2
CH2
0
R/W
Channel Select 2 to 0
1
CH1
0
R/W
Select analog input channels.
0
CH0
0
R/W
When SCAN = 0
When SCAN = 1
000: AN0
000: AN0
18.3.3
001: AN1
001: AN0 and AN1
010: AN2
010: AN0 to AN2
011: AN3
011: AN0 to AN3
100: AN4
100: AN4
101: AN5
101: AN4 and AN5
110: AN6
110: AN4 to AN6
111: AN7
111: AN4 to AN7
A/D Control Register (ADCR)
ADCR enables A/D conversion started by an external trigger signal.
Bit
Bit Name
Initial
Value
R/W
Description
7
TRGE
0
R/W
Trigger Enable
A/D conversion is started at the falling edge and the rising
edge of the external trigger signal (ADTRG) when this bit is
set to 1.
The selection between the falling edge and rising edge of
the external trigger pin (ADTRG) conforms to the WPEG5
bit in the interrupt edge select register 2 (IEGR2)
6 to 1
—
All 1
—
Reserved
These bits are always read as 1.
0
—
0
R/W
Reserved
Do not set this bit to 1, though the bit is readable/writable.
Rev. 3.00, 05/03, page 322 of 472
18.4
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes; single mode and scan mode. When changing the operating mode or analog input
channel, in order to prevent incorrect operation, first clear the bit ADST in ADCSR to 0. The
ADST bit can be set at the same time as the operating mode or analog input channel is changed.
18.4.1
Single Mode
In single mode, A/D conversion is performed once for the analog input of the specified single
channel as follows:
1. A/D conversion is started when the ADST bit in ADCSR is set to 1, according to software or
external trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register of the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADST
bit is automatically cleared to 0 and the A/D converter enters the wait state.
18.4.2
Scan Mode
In scan mode, A/D conversion is performed sequentially for the analog input of the specified
channels (four channels maximum) as follows:
1. When the ADST bit in ADCSR is set to 1 by software or external trigger input, A/D
conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1).
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the A/D data register corresponding to each channel.
3. When conversion of all the selected channels is completed, the ADF flag in ADCSR is set to 1.
If the ADIE bit is set to 1 at this time, an ADI interrupt requested is generated. A/D conversion
starts again on the first channel in the group.
4. The ADST bit is not automatically cleared to 0. Steps [2] and [3] are repeated as long as the
ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops.
Rev. 3.00, 05/03, page 323 of 472
18.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then
starts conversion. Figure 18.2 shows the A/D conversion timing. Table 18.3 shows the A/D
conversion time.
As indicated in figure 18.2, the A/D conversion time includes tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 18.3.
In scan mode, the values given in table 18.3 apply to the first conversion time. In the second and
subsequent conversions, the conversion time is 128 states (fixed) when CKS = 0 and 66 states
(fixed) when CKS = 1.
(1)
ø
Address
(2)
Write signal
Input sampling
timing
ADF
tD
tSPL
tCONV
Legend
ADCSR write cycle
(1) :
ADCSR address
(2) :
A/D conversion start delay time
tD :
tSPL : Input sampling time
tCONV : A/D conversion time
Figure 18.2 A/D Conversion Timing
Rev. 3.00, 05/03, page 324 of 472
Table 18.3 A/D Conversion Time (Single Mode)
CKS = 0
CKS = 1
Item
Symbol
Min
Typ
Max
Min
Typ
Max
A/D conversion start delay time
tD
6
—
9
4
—
5
Input sampling time
tSPL
—
31
—
—
15
—
A/D conversion time
tCONV
131
—
134
69
—
70
Note: All values represent the number of states.
18.4.4
External Trigger Input Timing
A/D conversion can also be started by an external trigger input. When the TRGE bit in ADCR is
set to 1, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG input
pin sets the ADST bit in ADCSR to 1, starting A/D conversion. Other operations, in both single
and scan modes, are the same as when the bit ADST has been set to 1 by software. Figure 18.3
shows the timing.
ø
Internal trigger signal
ADST
A/D conversion
Figure 18.3 External Trigger Input Timing
Rev. 3.00, 05/03, page 325 of 472
18.5
A/D Conversion Accuracy Definitions
This LSI's A/D conversion accuracy definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 18.4).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value 0000000000 to 0000000001
(see figure 18.5).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from 1111111110 to 1111111111 (see figure 18.5).
• Nonlinearity error
The deviation from the ideal A/D conversion characteristic as the voltage changes from zero to
full scale. This does not include the offset error, full-scale error, or quantization error.
• Absolute accuracy
The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error.
Digital output
Ideal A/D conversion
characteristic
111
110
101
100
011
010
Quantization error
001
000
1
8
2
8
3
8
4
8
5
8
6
8
7 FS
8
Analog
input voltage
Figure 18.4 A/D Conversion Accuracy Definitions (1)
Rev. 3.00, 05/03, page 326 of 472
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
Offset error
FS
Analog
input voltage
Figure 18.5 A/D Conversion Accuracy Definitions (2)
18.6
18.6.1
Usage Notes
Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling time;
if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee A/D conversion accuracy. However, for A/D conversion in single mode with
a large capacitance provided externally, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/µs or greater) (see figure 18.6). When converting a high-speed
analog signal or converting in scan mode, a low-impedance buffer should be inserted.
18.6.2
Influences on Absolute Accuracy
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute accuracy. Be sure to make the connection to an electrically stable GND.
Care is also required to ensure that filter circuits do not interfere with digital signals or act as
antennas on the mounting board.
Rev. 3.00, 05/03, page 327 of 472
This LSI
Sensor output
impedance
up to 5 k
A/D converter
equivalent circuit
10 k
Sensor input
Low-pass
filter
C to 0.1 F
Cin =
15 pF
Figure 18.6 Analog Input Circuit Example
Rev. 3.00, 05/03, page 328 of 472
20 pF
Section 19 EEPROM
The H8/3687N has an on-chip 512-byte EEPROM. The block diagram of the EEPROM is shown
in figure 19.1.
19.1
Features
• Two writing methods:
1-byte write
Page write: Page size 8 bytes
• Three reading methods:
Current address read
Random address read
Sequential read
• Acknowledge polling possible
• Write cycle time:
10 ms (power supply voltage Vcc = 2.7 V or more)
• Write/Erase endurance:
104 cycles/byte (byte write mode), 105 cycles/page (page write mode)
• Data retention:
10 years after the write cycle of 104 cycles (page write mode)
• Interface with the CPU
I2C bus interface (complies with the standard of Philips Corporation)
Device code 1010
Sleep address code can be changed (initial value: 000)
The I2C bus is open to the outside, so the EEPROM can be directly accessed from the outside.
Rev. 3.00, 05/03, page 329 of 472
EEPROM Data bus
Y decoder
H'FF10
SDA
SCL
I2C bus interface
control circuit
Y-select/
Sense amp.
Memory
array
User area
(512 bytes)
X decoder
Key control circuit
Address bus
EEPROM Key
register (EKR)
Slave address
register
ESAR
Power-on reset
Booster circuit
EEPROM module
Legend: ESAR: Register for referring the slave address
(specifies the slave address of the memory array)
Figure 19.1 Block Diagram of EEPROM
Rev. 3.00, 05/03, page 330 of 472
H'0000
H'01FF
H'FF09
19.2
Input/Output Pins
Pins used in the EEPROM are listed in table 19.1.
Table 19.1 Pin Configuration
Pin name
Symbol
Input/Output
Function
Serial clock pin
SCL
Input
The SCL pin is used to control serial input/output data
timing. The data is input at the rising edge of the
clock and output at the falling edge of the clock. The
SCL pin needs to be pulled up by resistor as that pin
2
is open-drain driven structure of the I C pin. Use
proper resistor value for your system by considering
VOL, IOL, and the CIN pin capacitance in section 23.2.2,
DC Characteristics and in section 23.2.3, AC
Characteristics. Maximum clock frequency is 400
kHz.
Serial data pin
SDA
Input/Output
The SDA pin is bidirectional for serial data transfer.
The SDA pin needs to be pulled up by resistor as that
pin is open-drain driven structure. Use proper resistor
value for your system by considering VOL, IOL, and the
CIN pin capacitance in section 23.2.2, DC
Characteristics and in section 23.2.3, AC
Characteristics. Except for a start condition and a
stop condition which will be discussed later, the highto-low and low-to-high change of SDA input should be
done during SCL low periods.
19.3
Register Description
The EEPROM has a following register.
• EEPROM key register (EKR)
19.3.1
EEPROM Key Register (EKR)
EKR is an 8-bit readable/writable register, which changes the slave address code written in the
EEPROM. The slave address code is changed by writing H'5F in EKR and then writing either of
H'00 to H'07 as an address code to the H'FF09 address in the EEPROM by the byte write method.
EKR is initialized to H'FF.
Rev. 3.00, 05/03, page 331 of 472
19.4
Operation
19.4.1
EEPROM Interface
The HD64N3687G has a multi-chip structure with two internal chips of the HD64F3687G (FZTAT™ version) and 512-byte EEPROM. The HD6483687G has a multi-chip structure with two
internal chips of the HD6433687G (mask-ROM version) and 512-byte EEPROM.
The EEPROM interface is the I2C bus interface. This I2C bus is open to the outside, so the
communication with the external devices connected to the I2C bus can be made.
19.4.2
Bus Format and Timing
The I2C bus format and the I2C bus timing follow section 17.4.1, I2C Bus Format. The bus
formats specific for the EEPROM are the following two.
1. The EEPROM address is configured of two bytes, the write data is transferred in the order of
upper address and lower address from each MSB side.
2.
The write data is transmitted from the MSB side.
The bus format and bus timing of the EEPROM are shown in figure 19.2.
Stop
conditon
Start
condition
Slave address
SCL
1
2
3
4
5
R/
6
7
8
ACK
9
SDA
Upper memory
lower memory
ACK
ACK
address
address
1
8
A15
A8
9
1
8
A7
A0
9
Data
Data
ACK
1
8
D7
D0
9
ACK
1
8
D7
D0
9
Legend: R/ : R/ code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.2 EEPROM Bus Format and Bus Timing
19.4.3
Start Condition
A high-to-low transition of the SDA input with the SCL input high is needed to generate the start
condition for starting read, write operation.
Rev. 3.00, 05/03, page 332 of 472
19.4.4
Stop Condition
A low-to-high transition of the SDA input with the SCL input high is needed to generate the stop
condition for stopping read, write operation.
The standby operation starts after a read sequence by a stop condition. In the case of write
operation, a stop condition terminates the write data inputs and place the device in an internallytimed write cycle to the memories. After the internally-timed write cycle (tWC) which is specified
as tWC, the device enters a standby mode.
19.4.5
Acknowledge
All address data and serial data such as read data and write data are transmitted to and from in 8bit unit. The acknowledgement is the signal that indicates that this 8-bit data is normally
transmitted to and from.
In the write operation, EEPROM sends "0" to acknowledge in the ninth cycle after receiving the
data. In the read operation, EEPROM sends a read data following the acknowledgement after
receiving the data. After sending read data, the EEPROM enters the bus open state. If the
EEPROM receives "0" as an acknowledgement, it sends read data of the next address. If the
EEPROM does not receive acknowledgement "0" and receives a following stop condition, it stops
the read operation and enters a standby mode. If the EEPROM receives neither acknowledgement
"0" nor a stop condition, the EEPROM keeps bus open without sending read data.
19.4.6
Slave Addressing
The EEPROM device receives a 7-bit slave address and a 1-bit R/W code following the generation
of the start conditions. The EEPROM enables the chip for a read or a write operation with this
operation.
The slave address consists of a former 4-bit device code and latter 3-bit slave address as shown in
table 19.2. The device code is used to distinguish device type and this LSI uses "1010" fixed code
in the same manner as in a general-purpose EEPROM. The slave address code selects one device
out of all devices with device code 1010 (8 devices in maximum) which are connected to the I2C
bus. This means that the device is selected if the inputted slave address code received in the order
of A2, A1, A0 is equal to the corresponding slave address reference register (ESAR).
The slave address code is stored in the address H'FF09 in the EEPROM. It is transferred to ESAR
from the slave address register in the memory array during 10 ms after the reset is released. An
access to the EEPROM is not allowed during transfer.
The initial value of the slave address code written in the EEPROM is H'00. It can be written in the
range of H'00 to H'07. Be sure to write the data by the byte write method.
Rev. 3.00, 05/03, page 333 of 472
The next one bit of the slave address is the R/W code. 0 is for a write and 1 is for a read.
The EEPROM turns to a standby state if the device code is not "1010" or slave address code
doesn’t coincide.
Table 19.2 Slave Addresses
Bit
Bit name
Initial Value Setting Value Remarks
7
Device code D3
1
6
Device code D2
0
5
Device code D1
1
4
Device code D0
0
3
Slave address code A2
0
A2
The initial value can be changed
2
Slave address code A1
0
A1
The initial value can be changed
1
Slave address code A0
0
A0
The initial value can be changed
19.4.7
Write Operations
There are two types write operations; byte write operation and page write operation. To initiate
the write operation, input 0 to R/W code following the slave address.
1. Byte Write
A write operation requires an 8-bit data of a 7-bit slave address with R/W code = "0". Then
the EEPROM sends acknowledgement "0" at the ninth bit. This enters the write mode. Then,
two bytes of the memory address are received from the MSB side in the order of upper and
lower. Upon receipt of one-byte memory address, the EEPROM sends acknowledgement "0"
and receives a following a one-byte write data. After receipt of write data, the EEPROM sends
acknowledgement "0". If the EEPROM receives a stop condition, the EEPROM enters an
internally controlled write cycle and terminates receipt of SCL and SDA inputs until
completion of the write cycle. The EEPROM returns to a standby mode after completion of
the write cycle.
The byte write operation is shown in figure 19.3.
Rev. 3.00, 05/03, page 334 of 472
SCL
1
2
3
4
5
6
7
8
9
SDA
R/
Slave address
ACK
1
8
9
A15
A8
Upper memory
address
ACK
1
8
A7
A0
9
lower memory
address
ACK
1
8
D7
D0
Write Data
9
ACK
Stop
conditon
Start
condition
Legend: R/ : R/ code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.3 Byte Write Operation
2. Page Write
This LSI is capable of the page write operation which allows any number of bytes up to 8 bytes
to be written in a single write cycle. The write data is input in the same sequence as the byte
write in the order of a start condition, slave address + R/W code, memory address (n), and
write data (Dn) with every ninth bit acknowledgement "0" output. The EEPROM enters the
page write operation if the EEPROM receives more write data (Dn+1) is input instead of
receiving a stop condition after receiving the write data (Dn). LSB 3 bits (A2 to A0) in the
EEPROM address are automatically incremented to be the (n+1) address upon receiving write
data (Dn+1). Thus the write data can be received sequentially.
Addresses in the page are incremented at each receipt of the write data and the write data can
be input up to 8 bytes. If the LSB 3 bits (A2 to A0) in the EEPROM address reach the last
address of the page, the address will roll over to the first address of the same page. When the
address is rolled over, write data is received twice or more to the same address, however, the
last received data is valid. At the receipt of the stop condition, write data reception is
terminated and the write operation is entered.
The page write operation is shown in figure 19.4.
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/
ACK
1
8
A15
A8
9
1
8
A7
A0
9
1
8
D7
D0
Upper memory
lower memory
ACK
ACK Write Data
address
address
9
ACK
Write Data ACK
Stop
conditon
Start
condition
Legend: R/ : R/ code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.4 Page Write Operation
Rev. 3.00, 05/03, page 335 of 472
19.4.8
Acknowledge Polling
Acknowledge polling feature is used to show if the EEPROM is in an internally-timed write cycle
or not. This feature is initiated by the input of the 8-bit slave address + R/W code following the
start condition during an internally-timed write cycle. Acknowledge polling will operate R/W
code = "0". The ninth acknowledgement judges if the EEPROM is an internally-timed write cycle
or not. Acknowledgement "1" shows the EEPROM is in a internally-timed write cycle and
acknowledgement "0" shows the internally-timed write cycle has been completed. The
acknowledge polling starts to function after a write data is input, i.e., when the stop condition is
input.
19.4.9
Read Operation
There are three read operations; current address read, random address read, and sequential read.
Read operations are initiated in the same way as write operations with the exception of R/W = 1.
1. Current Address Read
The internal address counter maintains the (n+1) address that is made by the last address (n)
accessed during the last read or write operation, with incremented by one. Current address
read accesses the (n+1) address kept by the internal address counter.
After receiving in the order of a start condition and the slave address + R/W code (R/W = 1),
the EEPROM outputs the 1-byte data of the (n+1) address from the most significant bit
following acknowledgement "0". If the EEPROM receives in the order of acknowledgement
"1" (release of a bus without inputting the acknowledgement is possible) and a following stop
condition, the EEPROM stops the read operation and is turned to a standby state.
In case the EEPROM has accessed the last address H'01FF at previous read operation, the
current address will roll over and returns to zero address. In case the EEPROM has accessed
the last address of the page at previous write operation, the current address will roll over within
page addressing and returns to the first address in the same page.
The current address is valid while power is on. The current address after power on will be
undefined. After power is turned on, define the address by the random address read operation
described below is necessary.
The current address read operation is shown in figure 19.5.
Rev. 3.00, 05/03, page 336 of 472
SCL
1
2
3
4
5
6
7
8
9
SDA
R/
Slave address
ACK
1
8
9
D7
D0
ACK
Read Data
Stop
conditon
Start
condition
Legend: R/ : R/ code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.5 Current Address Read Operation
2. Random Address Read
This is a read operation with defined read address. A random address read requires a dummy
write to set read address. The EEPROM receives a start condition, slave address + R/W code
(R/W = 0), memory address (upper) and memory address (lower) sequentially. The EEPROM
outputs acknowledgement "0" after receiving memory address (lower) then enters a current
address read with receiving a start condition again. The EEPROM outputs the read data of the
address which was defined in the dummy write operation. After receiving acknowledgement
"1" (release of a bus is allowed without receiving acknowledgement) and a following stop
condition, the EEPROM stops the random read operation and returns to a standby state.
The random address read operation is shown in figure 19.6.
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/
ACK
1
8
A15
A8
9
1
8
A7
A0
9
1
Upper memory
lower memory
ACK
ACK
address
address
Start
condition
2
3
4
5
6
Slave address
Start
condition
7
8
9
R ACK
1
8
D7
D0
9
lower memory
ACK
address
Stop
conditon
Legend: R/ : R/ code (0 is for a write and 1 is for a read),
ACK: acknowledge
Figure 19.6 Random Address Read Operation
Rev. 3.00, 05/03, page 337 of 472
3. Sequential Read
This is a mode to read the data sequentially. Data is sequential read by either a current address
read or a random address read. If the EEPROM receives acknowledgement "0" after 1-byte
read data is output, the read address is incremented and the next 1-byte read data are coming
out. Data is output sequentially by incrementing addresses as long as the EEPROM receives
acknowledgement "0" after the data is output. The address will roll over and returns address
zero if it reaches the last address H'01FF. The sequential read can be continued after roll over.
The sequential read is terminated if the EEPROM receives acknowledgement "1" (release of a
bus without acknowledgement is allowed) and a following stop condition as the same manner
as in the random address read.
The condition of a sequential read when the current address read is used is shown in figure
19.7.
SCL
1
2
3
4
5
6
7
8
9
SDA
Slave address
R/
ACK
1
8
D7
D0
9
Read Data ACK
1
8
D7
D0
Read Data
9
ACK
Start
condition
Legend:R/ : R/ code (0 is for a write and 1 is for a read)
ACK: acknowledge
Figure 19.7 Sequential Read Operation (when current address read is used)
Rev. 3.00, 05/03, page 338 of 472
Stop
conditon
19.5
Usage Notes
19.5.1
Data Protection at VCC On/Off
When VCC is turned on or off, the data might be destroyed by malfunction. Be careful of the
notices described below to prevent the data to be destroyed.
1. SCL and SDA should be fixed to VCC or VSS during VCC on/off.
2. VCC should be turned off after the EEPROM is placed in a standby state.
3. When VCC is turned on from the intermediate level, malfunction is caused, so VCC should be
turned on from the ground level (VSS).
4. VCC turn on speed should be longer than 10 us.
19.5.2
Write/Erase Endurance
The endurance is 105 cycles/page (1% cumulative failure rate) in case of page programming and
104 cycles/byte in case of byte programming. The data retention time is more than 10 years when
a device is page-programmed less than 104 cycles.
19.5.3
Noise Suppression Time
This EEPROM has a noise suppression function at SCL and SDA inputs, that cuts noise of width
less than 50 ns. Be careful not to allow noise of width more than 50 ns because the noise of with
more than 50 ms is recognized as an active pulse.
Rev. 3.00, 05/03, page 339 of 472
Rev. 3.00, 05/03, page 340 of 472
Section 20 Power-On Reset and Low-Voltage Detection
Circuits (Optional)
This LSI can include a power-on reset circuit and low-voltage detection circuit as optional circuits.
The low-voltage detection circuit consists of two circuits: LVDI (interrupt by low voltage detect)
and LVDR (reset by low voltage detect) circuits.
This circuit is used to prevent abnormal operation (runaway execution) from occurring due to the
power supply voltage fall and to recreate the state before the power supply voltage fall when the
power supply voltage rises again.
Even if the power supply voltage falls, the unstable state when the power supply voltage falls
below the guaranteed operating voltage can be removed by entering standby mode when
exceeding the guaranteed operating voltage and during normal operation. Thus, system stability
can be improved. If the power supply voltage falls more, the reset state is automatically entered. If
the power supply voltage rises again, the reset state is held for a specified period, then active mode
is automatically entered.
Figure 20.1 is a block diagram of the power-on reset circuit and the low-voltage detection circuit.
20.1
Features
• Power-on reset circuit
Uses an external capacitor to generate an internal reset signal when power is first supplied.
• Low-voltage detection circuit
LVDR: Monitors the power-supply voltage, and generates an internal reset signal when the
voltage falls below a specified value.
LVDI: Monitors the power-supply voltage, and generates an interrupt when the voltage falls
below or rises above respective specified values.
Two pairs of detection levels for reset generation voltage are available: when only the LVDR
circuit is used, or when the LVDI and LVDR circuits are both used.
LVI0000A_000020030300
Rev. 3.00, 05/03, page 341 of 472
CK
R
OVF
PSS
R
Internal reset
signal
Q
Noise canceler
S
Power-on reset circuit
Noise canceler
Vcc
Ladder
resistor
Internal data bus
LVDCR
Vreset
+
−
Vint
+
−
Interrupt
control
circuit
LVDSR
Reference
voltage
generator
Interrupt
request
Low-voltage detection circuit
Legend
PSS:
LVDCR:
LVDSR:
Prescaler S
Low-voltage-detection control register
Low-voltage-detection status register
: Low-voltage-detection reset signal
: Low-voltage-detection interrupt signal
Vreset:
Reset detection voltage
Vint:
Power-supply fall/rise detection voltage
Figure 20.1 Block Diagram of Power-On Reset Circuit and Low-Voltage Detection Circuit
20.2
Register Descriptions
The low-voltage detection circuit has the following registers.
• Low-voltage-detection control register (LVDCR)
• Low-voltage-detection status register (LVDSR)
20.2.1
Low-Voltage-Detection Control Register (LVDCR)
LVDCR is used to enable or disable the low-voltage detection circuit, set the detection levels for
the LVDR function, enable or disable the LVDR function, and enable or disable generation of an
interrupt when the power-supply voltage rises above or falls below the respective levels.
Table 20.1 shows the relationship between the LVDCR settings and select functions. LVDCR
should be set according to table 20.1.
Rev. 3.00, 05/03, page 342 of 472
Bit
Bit Name
Initial
Value
R/W
7
LVDE
0*
R/W
Description
LVD Enable
0: The low-voltage detection circuit is not used (In
standby mode)
1: The low-voltage detection circuit is used
6 to 4
All 1
3
LVDSEL
0*
R/W
Reserved
These bits are always read as 1, and cannot be modified.
LVDR Detection Level Select
0: Reset detection voltage is 2.3 V (typ.)
1: Reset detection voltage is 3.6 V (typ.)
When the falling or rising voltage detection interrupt is
used, reset detection voltage of 2.3 V (typ.) should be
used. When only a reset detection interrupt is used, reset
detection voltage of 3.6 V (typ.) should be used.
2
LVDRE
0*
R/W
LVDR Enable
0: Disables the LVDR function
1: Enables the LVDR function
1
LVDDE
0
R/W
Voltage-Fall-Interrupt Enable
0: Interrupt on the power-supply voltage falling below the
selected detection level disabled
1: Interrupt on the power-supply voltage falling below the
selected detection level enabled
0
LVDUE
0
R/W
Voltage-Rise-Interrupt Enable
0: Interrupt on the power-supply voltage rising above the
selected detection level disabled
1: Interrupt on the power-supply voltage rising above the
selected detection level enabled
Note:
*
Not initialized by LVDR but initialized by a power-on reset or WDT reset.
Rev. 3.00, 05/03, page 343 of 472
Table 20.1 LVDCR Settings and Select Functions
LVDCR Settings
Select Functions
Low-VoltageDetection
Rising
Interrupt
LVDE
LVDSEL
LVDRE
LVDDE
LVDUE
Power-On
Reset
LVDR
Low-VoltageDetection
Falling
Interrupt
0
*
*
*
*
O
1
1
1
0
0
O
O
1
0
0
1
0
O
O
1
0
0
1
1
O
O
O
1
0
1
1
1
O
O
O
O
Legend
20.2.2
*
means invalid.
Low-Voltage-Detection Status Register (LVDSR)
LVDSR indicates whether the power-supply voltage falls below or rises above the respective
specified values.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2
All 1
Reserved
These bits are always read as 1, and cannot be modified.
1
LVDDF
0*
R/W
LVD Power-Supply Voltage Fall Flag
[Setting condition]
When the power-supply voltage falls below Vint (D) (typ.
= 3.7 V)
[Clearing condition]
Writing 0 to this bit after reading it as 1
0
LVDUF
0*
R/W
LVD Power-Supply Voltage Rise Flag
[Setting condition]
When the power supply voltage falls below Vint (D) while
the LVDUE bit in LVDCR is set to 1, then rises above Vint
(U) (typ. = 4.0 V) before falling below Vreset1 (typ. = 2.3
V)
[Clearing condition]
Writing 0 to this bit after reading it as 1
Note:
*
Initialized by LVDR.
Rev. 3.00, 05/03, page 344 of 472
20.3
20.3.1
Operation
Power-On Reset Circuit
Figure 20.2 shows the timing of the operation of the power-on reset circuit. As the power-supply
voltage rises, the capacitor which is externally connected to the RES pin is gradually charged via
the on-chip pull-up resistor (typ. 150 kΩ). Since the state of the RES pin is transmitted within the
chip, the prescaler S and the entire chip are in their reset states. When the level on the RES pin
reaches the specified value, the prescaler S is released from its reset state and it starts counting.
The OVF signal is generated to release the internal reset signal after the prescaler S has counted
131,072 clock (φ) cycles. The noise cancellation circuit of approximately 100 ns is incorporated to
prevent the incorrect operation of the chip by noise on the RES pin.
To achieve stable operation of this LSI, the power supply needs to rise to its full level and settles
within the specified time. The maximum time required for the power supply to rise and settle after
power has been supplied (tPWON) is determined by the oscillation frequency (fOSC) and capacitance
which is connected to RES pin (CRES). If tPWON means the time required to reach 90 % of power
supply voltage, the power supply circuit should be designed to satisfy the following formula.
tPWON (ms) ≤ 90 × CRES (µF) ± 162/fOSC (MHz)
(tPWON ≤ 3000 ms, CRES ≥ 0.22 µF, and fOSC = 10 in 2-MHz to 10-MHz operation)
Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV and rise after charge on
the RES pin is removed. To remove charge on the RES pin, it is recommended that the diode
should be placed near Vcc. If the power supply voltage (Vcc) rises from the point above Vpor, a
power-on reset may not occur.
tPWON
Vcc
Vpor
Vss
Vss
PSS-reset
signal
OVF
Internal reset
signal
131,072 cycles
PSS counter starts
Reset released
Figure 20.2 Operational Timing of Power-On Reset Circuit
Rev. 3.00, 05/03, page 345 of 472
20.3.2
Low-Voltage Detection Circuit
LVDR (Reset by Low Voltage Detect) Circuit:
Figure 20.3 shows the timing of the LVDR function. The LVDR enters the module-standby state
after a power-on reset is canceled. To operate the LVDR, set the LVDE bit in LVDCR to 1, wait
for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have
stabilized by a software timer, etc., then set the LVDRE bit in LVDCR to 1. After that, the output
settings of ports must be made. To cancel the low-voltage detection circuit, first the LVDRE bit
should be cleared to 0 and then the LVDE bit should be cleared to 0. The LVDE and LVDRE bits
must not be cleared to 0 simultaneously because incorrect operation may occur.
When the power-supply voltage falls below the Vreset voltage (typ. = 2.3 V or 3.6 V), the LVDR
clears the LVDRES signal to 0, and resets the prescaler S. The low-voltage detection reset state
remains in place until a power-on reset is generated. When the power-supply voltage rises above
the Vreset voltage again, the prescaler S starts counting. It counts 131,072 clock (φ) cycles, and
then releases the internal reset signal. In this case, the LVDE, LVDSEL, and LVDRE bits in
LVDCR are not initialized.
Note that if the power supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises from that
point, the low-voltage detection reset may not occur.
If the power supply voltage (Vcc) falls below Vpor = 100 mV, a power-on reset occurs.
VCC
Vreset
VLVDRmin
VSS
PSS-reset
signal
OVF
Internal reset
signal
131,072 cycles
PSS counter starts
Reset released
Figure 20.3 Operational Timing of LVDR Circuit
Rev. 3.00, 05/03, page 346 of 472
LVDI (Interrupt by Low Voltage Detect) Circuit:
Figure 20.4 shows the timing of LVDI functions. The LVDI enters the module-standby state after
a power-on reset is canceled. To operate the LVDI, set the LVDE bit in LVDCR to 1, wait for 50
µs (tLVDON) until the reference voltage and the low-voltage-detection power supply have stabilized
by a software timer, etc., then set the LVDDE and LVDUE bits in LVDCR to 1. After that, the
output settings of ports must be made. To cancel the low-voltage detection circuit, first the
LVDDE and LVDUE bits should all be cleared to 0 and then the LVDE bit should be cleared to 0.
The LVDE bit must not be cleared to 0 at the same timing as the LVDDE and LVDUE bits
because incorrect operation may occur.
When the power-supply voltage falls below Vint (D) (typ. = 3.7 V) voltage, the LVDI clears the
LVDINT signal to 0 and the LVDDF bit in LVDSR is set to 1. If the LVDDE bit is 1 at this time,
an IRQ0 interrupt request is simultaneously generated. In this case, the necessary data must be
saved in the external EEPROM, etc, and a transition must be made to standby mode or subsleep
mode. Until this processing is completed, the power supply voltage must be higher than the lower
limit of the guaranteed operating voltage.
When the power-supply voltage does not fall below Vreset1 (typ. = 2.3 V) voltage but rises above
Vint (U) (typ. = 4.0 V) voltage, the LVDI sets the LVDINT signal to 1. If the LVDUE bit is 1 at
this time, the LVDUF bit in LVDSR is set to 1 and an IRQ0 interrupt request is simultaneously
generated.
If the power supply voltage (Vcc) falls below Vreset1 (typ. = 2.3 V) voltage, the LVDR function
is performed.
Vint (U)
Vint (D)
Vcc
Vreset1
VSS
LVDDE
LVDDF
LVDUE
LVDUF
IRQ0 interrupt generated IRQ0 interrupt generated
Figure 20.4 Operational Timing of LVDI Circuit
Rev. 3.00, 05/03, page 347 of 472
Procedures for Clearing Settings when Using LVDR and LVDI:
To operate or release the low-voltage detection circuit normally, follow the procedure described
below. Figure 20.5 shows the timing for the operation and release of the low-voltage detection
circuit.
1. To operate the low-voltage detection circuit, set the LVDE bit in LVDCR to 1.
2. Wait for 50 µs (tLVDON) until the reference voltage and the low-voltage-detection power supply
have stabilized by a software timer, etc. Then, clear the LVDDF and LVDUF bits in LVDSR
to 0 and set the LVDRE, LVDDE, and LVDUE bits in LVDCR to 1, as required.
3. To release the low-voltage detection circuit, start by clearing all of the LVDRE, LVDDE, and
LVDUE bits to 0. Then clear the LVDE bit to 0. The LVDE bit must not be cleared to 0 at the
same timing as the LVDRE, LVDDE, and LVDUE bits because incorrect operation may occur.
LVDE
LVDRE
LVDDE
LVDUE
tLVDON
Figure 20.5 Timing for Operation/Release of Low-Voltage Detection Circuit
Rev. 3.00, 05/03, page 348 of 472
Section 21 Power Supply Circuit
This LSI incorporates an internal power supply step-down circuit. Use of this circuit enables the
internal power supply to be fixed at a constant level of approximately 3.0 V, independently of the
voltage of the power supply connected to the external VCC pin. As a result, the current consumed
when an external power supply is used at 3.0 V or above can be held down to virtually the same
low level as when used at approximately 3.0 V. If the external power supply is 3.0 V or below, the
internal voltage will be practically the same as the external voltage. It is, of course, also possible to
use the same level of external power supply voltage and internal power supply voltage without
using the internal power supply step-down circuit.
21.1
When Using Internal Power Supply Step-Down Circuit
Connect the external power supply to the VCC pin, and connect a capacitance of approximately 0.1
µF between VCL and VSS, as shown in figure 21.1. The internal step-down circuit is made effective
simply by adding this external circuit. In the external circuit interface, the external power supply
voltage connected to VCC and the GND potential connected to VSS are the reference levels. For
example, for port input/output levels, the VCC level is the reference for the high level, and the VSS
level is that for the low level. The A/D converter analog power supply is not affected by the
internal step-down circuit.
VCC
Step-down circuit
Internal
logic
VCC = 3.0 to 5.5 V
VCL
Stabilization
capacitance
(approx. 0.1 µF)
Internal
power
supply
VSS
Figure 21.1 Power Supply Connection when Internal Step-Down Circuit is Used
PSCKT00A_000020020200
Rev. 3.00, 05/03, page 349 of 472
21.2
When Not Using Internal Power Supply Step-Down Circuit
When the internal power supply step-down circuit is not used, connect the external power supply
to the VCL pin and VCC pin, as shown in figure 21.2. The external power supply is then input
directly to the internal power supply. The permissible range for the power supply voltage is 3.0 V
to 3.6 V. Operation cannot be guaranteed if a voltage outside this range (less than 3.0 V or more
than 3.6 V) is input.
VCC
Step-down circuit
Internal
logic
VCC = 3.0 to 3.6 V
VCL
Internal
power
supply
VSS
Figure 21.2 Power Supply Connection when Internal Step-Down Circuit is Not Used
Rev. 3.00, 05/03, page 350 of 472
Section 22 List of Registers
The register list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register addresses (address order)
• Registers are listed from the lower allocation addresses.
• The symbol in the register-name column represents a reserved address or range of reserved
addresses.
Do not attempt to access reserved addresses.
• When the address is 16-bit wide, the address of the upper byte is given in the list.
• Registers are classified by functional modules.
• The data bus width is indicated.
• The number of access states is indicated.
2. Register bits
• Bit configurations of the registers are described in the same order as the register addresses.
• Reserved bits are indicated by in the bit name column.
• When registers consist of 16 bits, bits are described from the MSB side.
3. Register states in each operating mode
• Register states are described in the same order as the register addresses.
• The register states described here are for the basic operating modes. If there is a specific reset
for an on-chip peripheral module, refer to the section on that on-chip peripheral module.
Rev. 3.00, 05/03, page 351 of 472
22.1
Register Addresses (Address Order)
The data-bus width column indicates the number of bits. The access-state column shows the
number of states of the selected basic clock that is required for access to the register.
Note: Access to undefined or reserved addresses should not take place. Correct operation of the
access itself or later operations is not guaranteed when such a register is accessed.
Register
Abbreviation
—
—
Bit No
Module
Address Name
Data
Bus
Width
Access
State
—
H'F000 to —
—
—
H'F6FF
Timer control register_0
TCR_0
8
H'F700
Timer Z
8
2
Timer I/O control register A_0
TIORA_0 8
H'F701
Timer Z
8
2
Timer I/O control register C_0
TIORC_0 8
H'F702
Timer Z
8
2
Timer status register_0
TSR_0
8
H'F703
Timer Z
8
2
Timer interrupt enable register_0
TIER_0
8
H'F704
Timer Z
8
2
PWM mode output level control
register_0
POCR_0 8
H'F705
Timer Z
8
2
Timer counter_0
TCNT_0 16
H'F706
Timer Z
16
2
General register A_0
GRA_0
16
H'F708
Timer Z
16
2
General register B_0
GRB_0
16
H'F70A
Timer Z
16
2
General register C_0
GRC_0
16
H'F70C
Timer Z
16
2
General register D_0
GRD_0
16
H'F70E
Timer Z
16
2
Timer control register_1
TCR_1
8
H'F710
Timer Z
8
2
Timer I/O control register A_1
TIORA_1 8
H'F711
Timer Z
8
2
Timer I/O control register C_1
TIORC_1 8
H'F712
Timer Z
8
2
Timer status register_1
TSR_1
8
H'F713
Timer Z
8
2
Timer interrupt enable register_1
TIER_1
8
H'F714
Timer Z
8
2
PWM mode output level control
register_1
POCR_1 8
H'F715
Timer Z
8
2
Timer counter_1
TCNT_1 16
H'F716
Timer Z
16
2
General register A_1
GRA_1
16
H'F718
Timer Z
16
2
General register B_1
GRB_1
16
H'F71A
Timer Z
16
2
General register C_1
GRC_1
16
H'F71C
Timer Z
16
2
General register D_1
GRD_1
16
H'F71E
Timer Z
16
2
Rev. 3.00, 05/03, page 352 of 472
Bit No
Module
Address Name
Data
Bus
Width
Access
State
TSTR
8
H'F720
Timer Z
8
2
Timer mode register
TMDR
8
H'F721
Timer Z
8
2
Timer PWM mode register
TPMR
8
H'F722
Timer Z
8
2
Timer Z, for common use
TFCR
8
H'F723
Timer Z
8
2
Timer output master enable register TOER
8
H'F724
Timer Z
8
2
Timer output control register
TOCR
8
H'F725
Timer Z
8
2
—
—
—
H'F726,
H'F727
Timer Z
—
—
Second data register/free running
counter data register
RSECDR 8
H'F728
RTC
8
2
Minute data register
RMINDR 8
H'F729
RTC
8
2
Hour data register
RHRDR
8
H'F72A
RTC
8
2
Day-of-week data register
RWKDR 8
H'F72B
RTC
8
2
RTC control register 1
RTCCR1 8
H'F72C
RTC
8
2
RTC control register 2
RTCCR2 8
H'F72D
RTC
8
2
—
—
H'F72E
RTC
—
—
Clock source select register
RTCCSR 8
H'F72F
RTC
Register
Abbreviation
Timer start register
Low-voltage-detection control
register
—
8
2
1
8
2
1
8
2
LVDCR
8
H'F730
LVDC*
Low-voltage-detection status register LVDSR
8
H'F731
LVDC*
—
—
—
H'F732 to —
H'F73F
—
—
Serial mode register_2
SMR_2
8
H'F740
SCI3_2
8
3
Bit rate register_2
BRR_2
8
H'F741
SCI3_2
8
3
Serial control register 3_2
SCR3_2 8
H'F742
SCI3_2
8
3
Transmit data register_2
TDR_2
8
H'F743
SCI3_2
8
3
Serial status register_2
SSR_2
8
H'F744
SCI3_2
8
3
Rev. 3.00, 05/03, page 353 of 472
Bit No
Module
Address Name
Data
Bus
Width
Access
State
RDR_2
8
H'F745
SCI3_2
8
3
—
—
—
H'F746,
H'F747
SCI3_2
—
—
I2C bus control register 1
ICCR1
8
H'F748
IIC2
8
2
I2C bus control register 2
ICCR2
8
H'F749
IIC2
8
2
I2C bus mode register
ICMR
8
H'F74A
IIC2
8
2
Register
Abbreviation
Receive data register_2
I2C bus interrupt enable register
ICIER
8
H'F74B
IIC2
8
2
I2C status register
ICSR
8
H'F74C
IIC2
8
2
Slave address register
SAR
8
H'F74D
IIC2
8
2
I2C bus transmit data register
ICDRT
8
H'F74E
IIC2
8
2
I2C bus receive data register
ICDRR
8
H'F74F
IIC2
8
2
—
—
—
H'F750 to —
H'F75F
—
—
Timer mode register B1
TMB1
8
H'F760
Timer B1
8
2
Timer counter B1
TCB1
8
H'F761
Timer B1
8
2
—
—
—
H'F762 to —
—
—
H'FF8F
Flash memory control register 1
FLMCR1 8
H'FF90
ROM
8
2
Flash memory control register 2
FLMCR2 8
H'FF91
ROM
8
2
Flash memory power control register FLPWCR 8
H'FF92
ROM
8
2
ROM
Erase block register 1
EBR1
8
H'FF93
8
2
—
—
—
H'FF94 to ROM
H'FF9A
—
—
Flash memory enable register
FENR
8
H'FF9B
8
2
—
—
—
H'FF9C to ROM
—
—
ROM
H'FF9F
Timer control register V0
TCRV0
8
H'FFA0
Timer V
8
3
Timer control/status register V
TCSRV
8
H'FFA1
Timer V
8
3
Time constant register A
TCORA
8
H'FFA2
Timer V
8
3
Time constant register B
TCORB
8
H'FFA3
Timer V
8
3
Timer counter V
TCNTV
8
H'FFA4
Timer V
8
3
Timer control register V1
TCRV1
8
H'FFA5
Timer V
8
3
—
—
—
H'FFA6,
H'FFA7
—
—
—
Rev. 3.00, 05/03, page 354 of 472
Bit No
Module
Address Name
Data
Bus
Width
Access
State
SMR
8
H'FFA8
SCI3
8
3
Bit rate register
BRR
8
H'FFA9
SCI3
8
3
Serial control register 3
SCR3
8
H'FFAA
SCI3
8
3
Transmit data register
TDR
8
H'FFAB
SCI3
8
3
Serial status register
SSR
8
H'FFAC
SCI3
8
3
Receive data register
RDR
8
H'FFAD
SCI3
8
3
—
—
—
H'FFAE, SCI3
H'FFAF
—
—
A/D data register
ADDRA
16
H'FFB0
A/D converter 8
3
A/D data register
ADDRB
16
H'FFB2
A/D converter 8
3
A/D data register
ADDRC
16
H'FFB4
A/D converter 8
3
A/D data register
ADDRD
16
H'FFB6
A/D converter 8
3
A/D control/status register
ADCSR
8
H'FFB8
A/D converter 8
3
A/D control register
ADCR
8
H'FFB9
A/D converter 8
3
—
—
—
H'FFBA, —
H'FFBB
—
—
PWM data register L
PWDRL
8
H'FFBC
14-bit PWM
8
2
PWM data register U
PWDRU 8
H'FFBD
14-bit PWM
8
2
PWM control register
PWCR
8
H'FFBE
14-bit PWM
8
2
—
—
—
H'FFBF
14-bit PWM
Register
Abbreviation
Serial mode register
Timer control/status register WD
TCSRWD 8
H'FFC0
—
—
2
8
2
2
8
2
2
8
2
2
—
—
—
—
WDT*
Timer counter WD
TCWD
8
H'FFC1
WDT*
Timer mode register WD
TMWD
8
H'FFC2
WDT*
—
—
—
H'FFC3
WDT*
—
—
—
H'FFC4 to —
H'FFC7
Address break control register
ABRKCR 8
H'FFC8
Address break 8
2
Address break status register
ABRKSR 8
H'FFC9
Address break 8
2
Break address register H
BARH
8
H'FFCA
Address break 8
2
Break address register L
BARL
8
H'FFCB
Address break 8
2
Break data register H
BDRH
8
H'FFCC
Address break 8
2
Break data register L
BDRL
8
H'FFCD
Address break 8
2
Port pull-up control register 1
PUCR1
8
H'FFD0
I/O port
2
8
Rev. 3.00, 05/03, page 355 of 472
Bit No
Module
Address Name
Data
Bus
Width
Access
State
PUCR5
8
H'FFD1
8
2
—
—
—
H'FFD2, I/O port
H'FFD3
—
—
Port data register 1
PDR1
8
H'FFD4
I/O port
8
2
Port data register 2
PDR2
8
H'FFD5
I/O port
8
2
Port data register 3
PDR3
8
H'FFD6
I/O port
8
2
—
—
—
H'FFD7
I/O port
—
—
Port data register 5
PDR5
8
H'FFD8
I/O port
8
2
Port data register 6
PDR6
8
H'FFD9
I/O port
8
2
Port data register 7
PDR7
8
H'FFDA
I/O port
8
2
Port data register 8
PDR8
8
H'FFDB
I/O port
8
2
—
—
—
H'FFDC
I/O port
—
—
Port data register B
PDRB
8
H'FFDD
I/O port
8
2
—
—
—
H'FFDE, I/O port
H'FFDF
—
—
Port mode register 1
PMR1
8
H'FFE0
I/O port
8
2
Port mode register 5
PMR5
8
H'FFE1
I/O port
8
2
Port mode register 3
PMR3
8
H'FFE2
I/O port
8
2
—
—
—
H'FFD3
I/O port
—
—
Port control register 1
PCR1
8
H'FFE4
I/O port
8
2
Port control register 2
PCR2
8
H'FFE5
I/O port
8
2
Port control register 3
PCR3
8
H'FFE6
I/O port
8
2
—
—
—
H'FFE7
I/O port
—
—
Port control register 5
PCR5
8
H'FFE8
I/O port
8
2
Port control register 6
PCR6
8
H'FFE9
I/O port
8
2
Port control register 7
PCR7
8
H'FFEA
I/O port
8
2
Port control register 8
PCR8
8
H'FFEB
I/O port
8
2
—
—
—
H'FFEC I/O port
to H'FFEF
—
—
System control register 1
SYSCR1 8
H'FFF0
Low power
8
2
System control register 2
SYSCR2 8
H'FFF1
Low power
8
2
Interrupt edge select register 1
IEGR1
8
H'FFF2
Interrupt
8
2
Interrupt edge select register 2
IEGR2
8
H'FFF3
Interrupt
8
2
Register
Abbreviation
Port pull-up control register 5
Rev. 3.00, 05/03, page 356 of 472
I/O port
Bit No
Module
Address Name
Data
Bus
Width
Access
State
IENR1
8
H'FFF4
Interrupt
8
2
Interrupt enable register 2
IENR2
8
H'FFF5
Interrupt
8
2
Interrupt flag register 1
IRR1
8
H'FFF6
Interrupt
8
2
Interrupt flag register 2
IRR2
8
H'FFF7
Interrupt
8
2
Wakeup interrupt flag register
IWPR
8
H'FFF8
Interrupt
8
2
Module standby control register 1
MSTCR1 8
H'FFF9
Low power
8
2
Module standby control register 2
MSTCR2 8
H'FFFA
Low power
8
2
—
—
—
H'FFEB
Low power
—
—
—
—
—
H'FFFC —
to H'FFFF
—
—
Register
Abbreviation
Interrupt enable register 1
• EEPROM
Bit No Address
Module
Name
Data
Bus
Access
Width State
—
8
H'FF09
EEPROM
—
—
EKR
8
H'FF10
EEPROM
8
2
Register Name
Abbreviation
EEPROM slave address register
EEPROM key register
Notes: 1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
Rev. 3.00, 05/03, page 357 of 472
22.2
Register Bits
The addresses and bit names of the registers in the on-chip peripheral modules are listed below.
The 16-bit register is indicated in two rows, 8 bits for each row.
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
—
—
—
—
—
—
—
—
—
—
TCR_0
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Timer Z
TIORA_0
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
TIORC_0
—
IOD2
IOD1
IOD0
—
IOC2
IOC1
IOC0
TSR_0
—
—
—
OVF
IMFD
IMFC
IMFB
IMFA
TIER_0
—
—
—
OVIE
IMIED
IMIEC
IMIEB
IMIEA
POCR_0
—
—
—
—
—
POLD
POLC
POLB
TCNT_0
TCNT0H7 TCNT0H6 TCNT0H5 TCNT0H4 TCNT0H3 TCNT0H2 TCNT0H1 TCNT0H0
GRA_0
GRB_0
GRC_0
GRD_0
TCNT0L7
TCNT0L6
TCNT0L5
TCNT0L4
TCNT0L3
TCNT0L2
TCNT0L1
TCNT0L0
GRA0H7
GRA0H6
GRA0H5
GRA0H4
GRA0H3
GRA0H2
GRA0H1
GRA0H0
GRA0L7
GRA0L6
GRA0L5
GRA0L4
GRA0L3
GRA0L2
GRA0L1
GRA0L0
GRB0H7
GRB0H6
GRB0H5
GRB0H4
GRB0H3
GRB0H2
GRB0H1
GRB0H0
GRB0L7
GRB0L6
GRB0L5
GRB0L4
GRB0L3
GRB0L2
GRB0L1
GRB0L0
GRC0H7
GRC0H6
GRC0H5
GRC0H4
GRC0H3
GRC0H2
GRC0H1
GRC0H0
GRC0L7
GRC0L6
GRC0L5
GRC0L4
GRC0L3
GRC0L2
GRC0L1
GRC0L0
GRD0H7
GRD0H6
GRD0H5
GRD0H4
GRD0H3
GRD0H2
GRD0H1
GRD0H0
GRD0L7
GRD0L6
GRD0L5
GRD0L4
GRD0L3
GRD0L2
GRD0L1
GRD0L0
TCR_1
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TIORA_1
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
TIORC_1
—
IOD2
IOD1
IOD0
—
IOC2
IOC1
IOC0
TSR_1
—
—
UDF
OVF
IMFD
IMFC
IMFB
IMFA
TIER_1
—
—
—
OVIE
IMIED
IMIEC
IMIEB
IMIEA
POCR_1
—
—
—
—
—
POLD
POLC
POLB
TCNT_1
TCNT1H7 TCNT1H6 TCNT1H5 TCNT1H4 TCNT1H3 TCNT1H2 TCNT1H1 TCNT1H0
GRA_1
GRB_1
TCNT1L7
TCNT1L6
TCNT1L5
TCNT1L4
TCNT1L3
TCNT1L2
TCNT1L1
TCNT1L0
GRA1H7
GRA1H6
GRA1H5
GRA1H4
GRA1H3
GRA1H2
GRA1H1
GRA1H0
GRA1L7
GRA1L6
GRA1L5
GRA1L4
GRA1L3
GRA1L2
GRA1L1
GRA1L0
GRB1H7
GRB1H6
GRB1H5
GRB1H4
GRB1H3
GRB1H2
GRB1H1
GRB1H0
GRB1L7
GRB1L6
GRB1L5
GRB1L4
GRB1L3
GRB1L2
GRB1L1
GRB1L0
Rev. 3.00, 05/03, page 358 of 472
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
GRC_1
GRC1H7
GRC1H6
GRC1H5
GRC1H4
GRC1H3
GRC1H2
GRC1H1
GRC1H0
Timer Z
GRC1L7
GRC1L6
GRC1L5
GRC1L4
GRC1L3
GRC1L2
GRC1L1
GRC1L0
GRD1H7
GRD1H6
GRD1H5
GRD1H4
GRD1H3
GRD1H2
GRD1H1
GRD1H0
GRD1L7
GRD1L6
GRD1L5
GRD1L4
GRD1L3
GRD1L2
GRD1L1
GRD1L0
TSTR
—
—
—
—
—
—
STR1
STR0
TMDR
BFD1
BFC1
BFD0
BFC0
—
—
—
SYNC
TPMR
—
PWMD1
PWMC1
PWMB1
—
PWMD0
PWMC0
PWMB0
TFCR
—
STCLK
ADEG
ADTRG
OLS1
OLS0
CMD1
CMD0
TOER
ED1
EC1
EB1
EA1
ED0
EC0
EB0
EA0
TOCR
TOD1
TOC1
TOB1
TOA1
TOD0
TOC0
TOB0
TOA0
RSECDR
BSY
SC12
SC11
SC10
SC03
SC02
SC01
SC00
RMINDR
BSY
MN12
MN11
MN10
MN03
MN02
MN01
MN00
RHRDR
BSY
—
HR11
HR10
HR03
HR02
HR01
HR00
RWKDR
BSY
—
—
—
—
WK2
WK1
WK0
RTCCR1
RUN
12/24
PM
RST
—
—
—
—
RTCCR2
—
—
FOIE
WKIE
DYIE
HRIE
MNIE
SEIE
RTCCSR
—
RCS6
RCS5
—
RCS3
RCS2
RCS1
RCS0
LVDCR
LVDE
—
—
—
LVDSEL
LVDRE
LVDDE
LVDUE
LVDC
LVDSR
—
—
—
—
—
—
LVDDF
LVDUF
(optional)*
—
—
—
—
—
—
—
—
—
—
SMR_2
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3_2
BRR_2
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR_2
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR_2
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR_2
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
ICCR1
ICE
RCVD
MST
TRS
CKS3
CKS2
CKS1
CKS0
ICCR2
BBSY
SCP
SDAO
SDAOP
SCLO
—
IICRST
—
ICMR
MLS
WAIT
—
—
BCWP
BC2
BC1
BC0
ICIER
TIE
TEIE
RIE
NAKIE
STIE
ACKE
ACKBR
ACKBT
ICSR
TDRE
TEND
RDRF
NACKF
STOP
AL/OVE
AAS
ADZ
SAR
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
GRD_1
RTC
1
IIC2
Rev. 3.00, 05/03, page 359 of 472
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ICDRT
ICDRT7
ICDRT6
ICDRT5
ICDRT4
ICDRT3
ICDRT2
ICDRT1
ICDRT0
ICDRR
ICDRR7
ICDRR6
ICDRR5
ICDRR4
ICDRR3
ICDRR2
ICDRR1
ICDRR0
—
—
—
—
—
—
—
—
—
—
TMB1
TMB17
—
—
—
—
TMB12
TMB11
TMB10
Timer B1
TCB1
TCB17
TCB16
TCB15
TCB14
TCB13
TCB12
TCB11
TCB10
—
—
—
—
—
—
—
—
—
—
FLMCR1
—
SWE
ESU
PSU
EV
PV
E
P
ROM
FLMCR2
FLER
—
—
—
—
—
—
—
FLPWCR
PDWND
—
—
—
—
—
—
—
EBR1
—
EB6
EB5
EB4
EB3
EB2
EB1
EB0
FENR
FLSHE
—
—
—
—
—
—
—
TCRV0
CMIEB
CMIEA
OVIE
CCLR1
CCLR0
CKS2
CKS1
CKS0
TCSRV
CMFB
CFMA
OVF
—
OS3
OS2
OS1
OS0
TCORA
TCORA7
TCORA6
TCORA5
TCORA4
TCORA3
TCORA2
TCORA1
TCORA0
TCORB
TCORB7
TCORB6
TCORB5
TCORB4
TCORB3
TCORB2
TCORB1
TCORB0
TCNTV
TCNTV7
TCNTV6
TCNTV5
TCNTV4
TCNTV3
TCNTV2
TCNTV1
TCNTV0
TCRV1
—
—
—
TVEG1
TVEG0
TRGE
—
ICKS0
Timer V
—
—
—
—
—
—
—
—
—
—
SMR
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3
BRR
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
ADDRA
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
ADDRB
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
ADDRC
ADDRD
ADCSR
Rev. 3.00, 05/03, page 360 of 472
A/D converter
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ADCR
TRGE
—
—
—
—
—
—
—
A/D converter
—
—
—
—
—
—
—
—
—
—
PWDRL
PWDRL7
PWDRL6
PWDRL5
PWDRL4
PWDRL3
PWDRL2
PWDRL1
PWDRL0
14-bit PWM
PWDRU
—
—
PWDRU5
PWDRU4
PWDRU3
PWDRU2
PWDRU1
PWDRU0
PWCR
—
—
—
—
—
—
—
PWCR0
TCSRWD
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
TCWD
TCWD7
TCWD6
TCWD5
TCWD4
TCWD3
TCWD2
TCWD1
TCWD0
TMWD
—
—
—
—
CKS3
CKS2
CKS1
CKS0
—
—
—
—
—
—
—
—
—
ABRKCR
RTINTE
CSEL1
CSEL0
ACMP2
ACMP1
ACMP0
DCMP1
DCMP0
Address
ABRKSR
ABIF
ABIE
—
—
—
—
—
—
break
BARH
BARH7
BARH6
BARH5
BARH4
BARH3
BARH2
BARH1
BARH0
BARL
BARL7
BARL6
BARL5
BARL4
BARL3
BARL2
BARL1
BARL0
BDRH
BDRH7
BDRH6
BDRH5
BDRH4
BDRH3
BDRH2
BDRH1
BDRH0
BDRL
BDRL7
BDRL6
BDRL5
BDRL4
BDRL3
BDRL2
BDRL1
BDRL0
—
—
—
—
—
—
—
—
—
—
PUCR1
PUCR17
PUCR16
PUCR15
PUCR14
—
PUCR12
PUCR11
PUCR10
I/O port
PUCR5
—
—
PUCR55
PUCR54
PUCR53
PUCR52
PUCR51
PUCR50
PDR1
P17
P16
P15
P14
—
P12
P11
P10
PDR2
—
—
—
P24
P23
P22
P21
P20
PDR3
P37
P35
P34
P33
P32
P31
P30
P36
3
3
PDR5
P57*
P56*
P55
P54
P53
P52
P51
P50
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
PDR7
—
P76
P75
P74
—
P72
P71
P70
PDR8
P87
P86
P85
—
—
—
—
—
PDRB
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PMR1
IRQ3
IRQ2
IRQ1
IRQ0
TXD2
PWM
TXD
TMOW
PMR5
POF57
POF56
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
PMR3
—
—
—
POF24
POF23
—
—
—
PCR1
PCR17
PCR16
PCR15
PCR14
—
PCR12
PCR11
PCR10
PCR2
—
—
—
PCR24
PCR23
PCR22
PCR21
PCR20
PCR3
PCR37
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
PCR5
PCR36
3
PCR57*
3
PCR56*
2
WDT*
—
Rev. 3.00, 05/03, page 361 of 472
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
I/O port
PCR7
—
PCR76
PCR75
PCR74
—
PCR72
PCR71
PCR70
PCR8
PCR87
PCR86
PCR85
—
—
—
—
—
SYSCR1
SSBY
STS2
STS1
STS0
NESEL
—
—
—
SYSCR2
SMSEL
LSON
DTON
MA2
MA1
MA0
SA1
SA0
IEGR1
NMIEG
—
—
—
IEG3
IEG2
IEG1
IEG0
IEGR2
—
—
WPEG5
WPEG4
WPEG3
WPEG2
WPEG1
WPEG0
IENR1
IENDT
IENTA
IENWP
—
IEN3
IEN2
IEN1
IEN0
IENR2
—
—
IENTB1
—
—
—
—
—
IRR1
IRRDT
IRRTA
—
—
IRRI3
IRRI2
IRRI1
IRRI0
IRR2
—
—
IRRTB1
—
—
—
—
—
IWPR
—
—
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
Interrupt
MSTCR1
—
MSTIIC
MSTS3
MSTAD
MSTWD
—
MSTTV
MSTTA
Low power
MSTCR2
MSTS3_2
—
—
MSTTB1
—
—
MSTTZ
MSTPWM
—
—
—
—
—
—
—
—
—
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Low power
Interrupt
—
• EEPROM
Register
Name
Bit 7
EKR
Module Name
EEPROM
Notes: 1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
TM
3. These bits are reserved in the EEPROM laminated F-ZTAT and mask-ROM versions.
Rev. 3.00, 05/03, page 362 of 472
22.3
Registers States in Each Operating Mode
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
TCR_0
Initialized
—
—
—
—
—
Timer Z
TIORA_0
Initialized
—
—
—
—
—
TIORC_0
Initialized
—
—
—
—
—
TSR_0
Initialized
—
—
—
—
—
TIER_0
Initialized
—
—
—
—
—
POCR_0
Initialized
—
—
—
—
—
TCNT_0
Initialized
—
—
—
—
—
GRA_0
Initialized
—
—
—
—
—
GRB_0
Initialized
—
—
—
—
—
GRC_0
Initialized
—
—
—
—
—
GRD_0
Initialized
—
—
—
—
—
TCR_1
Initialized
—
—
—
—
—
TIORA_1
Initialized
—
—
—
—
—
TIORC_1
Initialized
—
—
—
—
—
TSR_1
Initialized
—
—
—
—
—
TIER_1
Initialized
—
—
—
—
—
POCR_1
Initialized
—
—
—
—
—
TCNT_1
Initialized
—
—
—
—
—
GRA_1
Initialized
—
—
—
—
—
GRB_1
Initialized
—
—
—
—
—
GRC_1
Initialized
—
—
—
—
—
GRD_1
Initialized
—
—
—
—
—
TSTR
Initialized
—
—
—
—
—
TMDR
Initialized
—
—
—
—
—
TPMR
Initialized
—
—
—
—
—
TFCR
Initialized
—
—
—
—
—
TOER
Initialized
—
—
—
—
—
TOCR
Initialized
—
—
—
—
—
RSECDR
Initialized
—
—
—
—
—
RMINDR
Initialized
—
—
—
—
—
RHRDR
Initialized
—
—
—
—
—
RTC
Rev. 3.00, 05/03, page 363 of 472
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
RWKDR
—
—
—
—
—
—
RTC
RTCCR1
—
—
—
—
—
—
RTCCR2
—
—
—
—
—
—
RTCCSR
Initialized
—
—
—
—
—
LVDCR
Initialized
—
—
—
—
—
LVDC
LVDSR
Initialized
—
—
—
—
—
(optional)*
SMR_2
Initialized
—
—
Initialized
Initialized
Initialized
SCI3_2
BRR_2
Initialized
—
—
Initialized
Initialized
Initialized
SCR3_2
Initialized
—
—
Initialized
Initialized
Initialized
TDR_2
Initialized
—
—
Initialized
Initialized
Initialized
SSR_2
Initialized
—
—
Initialized
Initialized
Initialized
RDR_2
Initialized
—
—
Initialized
Initialized
Initialized
ICCR1
Initialized
—
—
—
—
—
ICCR2
Initialized
—
—
—
—
—
ICMR
Initialized
—
—
—
—
—
ICIER
Initialized
—
—
—
—
—
ICSR
Initialized
—
—
—
—
—
SAR
Initialized
—
—
—
—
—
ICDRT
Initialized
—
—
—
—
—
ICDRR
Initialized
—
—
—
—
—
TMB1
Initialized
—
—
—
—
—
TCB1
Initialized
—
—
—
—
—
FLMCR1
Initialized
—
—
Initialized
Initialized
Initialized
FLMCR2
Initialized
—
—
Initialized
Initialized
Initialized
FLPWCR
Initialized
—
—
Initialized
Initialized
Initialized
EBR1
Initialized
—
—
Initialized
Initialized
Initialized
FENR
Initialized
—
—
Initialized
Initialized
Initialized
TCRV0
Initialized
—
—
Initialized
Initialized
Initialized
TCSRV
Initialized
—
—
Initialized
Initialized
Initialized
TCORA
Initialized
—
—
Initialized
Initialized
Initialized
TCORB
Initialized
—
—
Initialized
Initialized
Initialized
TCNTV
Initialized
—
—
Initialized
Initialized
Initialized
TCRV1
Initialized
—
—
Initialized
Initialized
Initialized
Rev. 3.00, 05/03, page 364 of 472
1
IIC2
Timer B1
ROM
Timer V
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
SMR
Initialized
—
—
Initialized
Initialized
Initialized
SCI3
BRR
Initialized
—
—
Initialized
Initialized
Initialized
SCR3
Initialized
—
—
Initialized
Initialized
Initialized
TDR
Initialized
—
—
Initialized
Initialized
Initialized
SSR
Initialized
—
—
Initialized
Initialized
Initialized
RDR
Initialized
—
—
Initialized
Initialized
Initialized
ADDRA
Initialized
—
—
Initialized
Initialized
Initialized
ADDRB
Initialized
—
—
Initialized
Initialized
Initialized
ADDRC
Initialized
—
—
Initialized
Initialized
Initialized
ADDRD
Initialized
—
—
Initialized
Initialized
Initialized
ADCSR
Initialized
—
—
Initialized
Initialized
Initialized
ADCR
Initialized
—
—
Initialized
Initialized
Initialized
PWDRL
Initialized
—
—
—
—
—
PWDRU
Initialized
—
—
—
—
—
PWCR
Initialized
—
—
—
—
—
TCSRWD
Initialized
—
—
—
—
—
TCWD
Initialized
—
—
—
—
—
TMWD
Initialized
—
—
—
—
—
ABRKCR
Initialized
—
—
—
—
—
ABRKSR
Initialized
—
—
—
—
—
BARH
Initialized
—
—
—
—
—
BARL
Initialized
—
—
—
—
—
BDRH
Initialized
—
—
—
—
—
BDRL
Initialized
—
—
—
—
—
PUCR1
Initialized
—
—
—
—
—
PUCR5
Initialized
—
—
—
—
—
PDR1
Initialized
—
—
—
—
—
PDR2
Initialized
—
—
—
—
—
PDR3
Initialized
—
—
—
—
—
PDR5
Initialized
—
—
—
—
—
PDR6
Initialized
—
—
—
—
—
PDR7
Initialized
—
—
—
—
—
A/D converter
14bit PWM
2
WDT*
Address break
I/O port
Rev. 3.00, 05/03, page 365 of 472
Register
Name
Reset
Active
Sleep
Subactive
Subsleep Standby
Module
PDR8
Initialized
—
—
—
—
—
I/O port
PDRB
Initialized
—
—
—
—
—
PMR1
Initialized
—
—
—
—
—
PMR5
Initialized
—
—
—
—
—
PMR3
Initialized
—
—
—
—
—
PCR1
Initialized
—
—
—
—
—
PCR2
Initialized
—
—
—
—
—
PCR3
Initialized
—
—
—
—
—
PCR5
Initialized
—
—
—
—
—
PCR6
Initialized
—
—
—
—
—
PCR7
Initialized
—
—
—
—
—
PCR8
Initialized
—
—
—
—
—
SYSCR1
Initialized
—
—
—
—
—
SYSCR2
Initialized
—
—
—
—
—
IEGR1
Initialized
—
—
—
—
—
IEGR2
Initialized
—
—
—
—
—
IENR1
Initialized
—
—
—
—
—
IENR2
Initialized
—
—
—
—
—
IRR1
Initialized
—
—
—
—
—
IRR2
Initialized
—
—
—
—
—
IWPR
Initialized
—
—
—
—
—
MSTCR1
Initialized
—
—
—
—
—
MSTCR2
Initialized
—
—
—
—
—
Low power
Interrupt
Low power
• EEPROM
Register
Name
Reset
Active
Sleep
Subactive
Subsleep
Standby
Module
EKR
—
—
—
—
—
—
EEPROM
Notes: is not initialized
1. LVDC: Low-voltage detection circuits (optional)
2. WDT: Watchdog timer
Rev. 3.00, 05/03, page 366 of 472
Section 23 Electrical Characteristics
23.1
Absolute Maximum Ratings
Table 23.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Note
Power supply voltage
VCC
–0.3 to +7.0
V
*
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Input voltage
VIN
–0.3 to VCC +0.3
V
Ports other than ports B
and X1
Port B
–0.3 to AVCC +0.3 V
X1
–0.3 to 4.3
V
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note:
*
Permanent damage may result if maximum ratings are exceeded. Normal operation
should be under the conditions specified in Electrical Characteristics. Exceeding these
values can result in incorrect operation and reduced reliability.
23.2
Electrical Characteristics (F-ZTAT™ Version, EEPROM Laminated
F-ZTATTM Version)
23.2.1
Power Supply Voltage and Operating Ranges
Power Supply Voltage and Oscillation Frequency Range
φOSC (MHz)
φW (kHz)
20.0
32.768
10.0
2.0
3.0
4.0
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
5.5
VCC (V)
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• All operating modes
Rev. 3.00, 05/03, page 367 of 472
Power Supply Voltage and Operating Frequency Range
φ (MHz)
φSUB (kHz)
20.0
16.384
10.0
8.192
4.096
1.0
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 0 )
φ (kHz)
2500
1250
78.125
3.0
4.0
5.5
VCC (V)
• AVCC = 3.3 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 1 )
Rev. 3.00, 05/03, page 368 of 472
3.0
4.0
• AVCC = 3.3 to 5.5 V
• Subactive mode
• Subsleep mode
5.5
VCC (V)
Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range
φ (MHz)
20.0
10.0
2.0
3.3
4.0
5.5
AVCC (V)
• VCC = 3.0 to 5.5 V
• Active mode
• Sleep mode
Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection
Circuit is Used
φosc (MHz)
20.0
16.0
2.0
Vcc(V)
3.0
4.5
5.5
Operation guarantee range
Operation guarantee range except
A/D conversion accuracy
Rev. 3.00, 05/03, page 369 of 472
23.2.2
DC Characteristics
Table 23.2 DC Characteristics (1)
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Input high VIH
voltage
Max
Unit
VCC = 4.0 to 5.5 V VCC × 0.8 —
VCC + 0.3
V
VCC × 0.9 —
VCC + 0.3
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V VCC × 0.7 —
VCC + 0.3
VCC × 0.8 —
VCC + 0.3
PB0 to PB7
VCC = 4.0 to 5.5 V AVCC ×
0.7
—
AVCC + 0.3 V
AVCC ×
0.8
—
AVCC + 0.3
Applicable Pins
Test Condition
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1,SCK3,
SCK3_2, TRGV
OSC1
Input low
voltage
VIL
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
Note: Connect the TEST pin to Vss.
Rev. 3.00, 05/03, page 370 of 472
Min
Typ
VCC = 4.0 to 5.5 V VCC – 0.5 —
VCC + 0.3
VCC – 0.3 —
VCC + 0.3
VCC = 4.0 to 5.5 V –0.3
—
VCC × 0.2
–0.3
—
VCC × 0.1
V
V
V
Notes
Values
Min
Typ
Max
Unit
Item
Symbol
Applicable Pins
Test Condition
Input low
voltage
VIL
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V –0.3
—
VCC × 0.3
V
–0.3
—
VCC × 0.2
V
PB0 to PB7
VCC = 4.0 to 5.5 V –0.3
—
AVCC × 0.3 V
–0.3
—
AVCC × 0.2
OSC1
VCC = 4.0 to 5.5 V –0.3
—
0.5
–0.3
—
0.3
Output
high
voltage
VOH
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P55,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VOL
—
V
V
–IOH = 1.5 mA
–IOH = 0.1 mA
VCC – 0.5 —
—
VCC = 4.0 to 5.5 V VCC – 2.5 —
–IOH = 0.1 mA
—
VCC = 3.0 to 4.0 V VCC – 2.0 —
–IOH = 0.1 mA
—
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V —
IOL = 1.6 mA
—
0.6
IOL = 0.4 mA
—
—
0.4
P60 to P67
VCC = 4.0 to 5.5 V —
IOL = 20.0 mA
—
1.5
VCC = 4.0 to 5.5 V —
IOL = 10.0 mA
—
1.0
VCC = 4.0 to 5.5 V —
IOL = 1.6 mA
—
0.4
IOL = 0.4 mA
—
0.4
P56, P57
Output
low
voltage
VCC = 4.0 to 5.5 V VCC – 1.0 —
Notes
—
V
V
V
Rev. 3.00, 05/03, page 371 of 472
Values
Min
Typ
Max
Unit
V
Item
Symbol
Applicable Pins
Test Condition
Output
low
voltage
VOL
SCL, SDA
VCC = 4.0 to 5.5 V —
IOL = 6.0 mA
—
0.6
IOL = 3.0 mA
—
—
0.4
Input/
output
leakage
current
| IIL |
VIN = 0.5 V or
OSC1, TMIB1,
RES, NMI,
higher
WKP0 to WKP5, (VCC – 0.5 V)
IRQ0 to IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTIOA0 to
FTIOD0, FTIOA1
to FTIOD1 RXD,
SCK3, RXD_2,
SCK3_2, SCL,
SDA
—
—
1.0
µA
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VIN = 0.5 V or
higher
(VCC – 0.5 V)
—
—
1.0
µA
PB0 to PB7
VIN = 0.5 V or
higher
(AVCC – 0.5 V)
—
—
1.0
µA
P10 to P12,
P14 to P17,
P50 to P55
VCC = 5.0 V,
VIN = 0.0 V
50.0
—
300.0
µA
VCC = 3.0 V,
VIN = 0.0 V
—
60.0
—
All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
—
—
15.0
pF
Active
IOPE1
mode
current
consumption
VCC
Active mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
21.0
30.0
mA
Active mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
9.0
—
IOPE2
VCC
Active mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.8
3.0
Active mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.2
—
Pull-up
MOS
current
–Ip
Input
capacitance
Cin
Rev. 3.00, 05/03, page 372 of 472
Notes
Reference
value
*
*
Reference
value
mA
*
*
Reference
value
Values
Applicable Pins
Test Condition
Min
Sleep
ISLEEP1
mode
current
consumption
VCC
Sleep mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
17.5
22.5
Sleep mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
7.5
—
ISLEEP2
VCC
Sleep mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.7
2.7
Sleep mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.1
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
35.0
70.0
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/8)
—
25.0
—
Item
Symbol
Typ
Max
Unit
Notes
mA
*
*
Reference
value
mA
*
*
Reference
value
Subactive ISUB
mode
current
consumption
VCC
Subsleep ISUBSP
mode
current
consumption
VCC
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
25.0
50.0
µA
*
ISTBY
Standby
mode
current
consumption
VCC
32-kHz crystal
resonator not
used
—
—
5.0
µA
*
RAM data VRAM
retaining
voltage
VCC
2.0
—
—
V
µA
*
*
Reference
value
Rev. 3.00, 05/03, page 373 of 472
Note:
*
Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Mode
RES Pin
Internal State
Other Pins Oscillator Pins
Active mode 1
VCC
Operates
VCC
Active mode 2
Sleep mode 1
Main clock:
ceramic or crystal resonator
Operates
(φ/64)
VCC
Sleep mode 2
Subclock:
Pin X1 = VSS
Only timers operate
VCC
Only timers operate
(φ/64)
Subactive mode
VCC
Operates
VCC
Main clock:
ceramic or crystal resonator
Subsleep mode
VCC
Only timers operate
VCC
Subclock:
crystal resonator
Standby mode
VCC
CPU and timers
both stop
VCC
Main clock:
ceramic or crystal resonator
Subclock:
Pin X1 = VSS
Table 23.2 DC Characteristics (2)
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins
Test Condition
EEPROM
current
consumption
IEEW
VCC
IEER
IEESTBY
Min
Typ
Max
Unit
Notes
VCC = 5.0 V, tSCL = 2.5 —
µs (when writing)
—
2.0
mA
*
VCC
VCC = 5.0 V, tSCL = 2.5 —
µs (when reading)
—
0.3
mA
VCC
VCC = 5.0 V, tSCL = 2.5 —
µs (at standby)
—
3.0
µA
Note: * The current consumption of the EEPROM chip is shown.
For the current consumption of H8/3687N, add the above current values to the current
consumption of H8/3687F.
Rev. 3.00, 05/03, page 374 of 472
Table 23.2 DC Characteristics (3)
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
Allowable output low
current (per pin)
IOL
Applicable
Pins
Values
Test Condition
Typ
Max
Unit
VCC = 4.0 to 5.5 V —
—
2.0
mA
Port 6
—
—
20.0
Output pins
except port 6,
SCL, and SDA
—
—
0.5
Output pins
except port 6,
SCL, and SDA
Min
Port 6
—
—
10.0
SCL, SDA
—
—
6.0
Output pins
except port 6,
SCL, and SDA
VCC = 4.0 to 5.5 V —
—
40.0
Port 6,
SCL, and SDA
—
—
80.0
Output pins
except port 6,
SCL, and SDA
—
—
20.0
Port 6,
SCL, and SDA
—
—
40.0
Allowable output high –IOH
current (per pin)
All output pins
VCC = 4.0 to 5.5 V —
—
2.0
—
—
0.2
Allowable output high –∑IOH
current (total)
All output pins
VCC = 4.0 to 5.5 V —
—
30.0
—
—
8.0
Allowable output low
current (total)
∑IOL
mA
mA
mA
Rev. 3.00, 05/03, page 375 of 472
23.2.3
AC Characteristics
Table 23.3 AC Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable
Pins
System clock
oscillation
frequency
fOSC
OSC1, OSC2 VCC = 4.0 to 5.5 V
System clock (φ)
cycle time
tcyc
Test Condition
Min
Typ
Max
Unit
Reference
Figure
2.0
—
20.0
MHz
*1
2.0
—
10.0
1
—
64
tOSC
*2
12.8
—
—
Subclock oscillation fW
frequency
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
2
—
—
tcyc
tsubcyc
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
µs
trc
OSC1,
OSC2
—
—
10.0
ms
Oscillation
trc
stabilization time
(ceramic resonator)
OSC1,
OSC2
—
—
5.0
ms
Oscillation
stabilization time
trcx
X1, X2
—
—
2.0
s
External clock
high width
tCPH
OSC1
VCC = 4.0 to 5.5 V
20.0
—
—
ns
40.0
—
—
External clock
low width
tCPL
OSC1
VCC = 4.0 to 5.5 V
20.0
—
—
40.0
—
—
External clock
rise time
tCPr
—
—
10.0
—
—
15.0
External clock
fall time
tCPf
—
—
10.0
—
—
15.0
OSC1
OSC1
Rev. 3.00, 05/03, page 376 of 472
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
ns
ns
ns
*2
Figure 23.1
Item
Symbol
Applicable
Pins
RES pin low
width
tREL
RES
Values
Typ
Max
Unit
Reference
Figure
At power-on and in trc
modes other than
those below
—
—
ms
Figure 23.2
In active mode and 200
sleep mode
operation
—
—
ns
Test Condition
Min
Input pin high
width
tIH
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
Figure 23.3
tsubcyc
Input pin low
width
tIL
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is
1.0 MHz.
2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2).
Rev. 3.00, 05/03, page 377 of 472
Table 23.4 I2C Bus Interface Timing
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Max
Unit
Reference
Figure
12tcyc + 600 —
—
ns
Figure 23.4
3tcyc + 300
—
—
ns
tSCLL
5tcyc + 300
—
—
ns
SCL and SDA input
fall time
tSf
—
—
300
ns
SCL and SDA input
spike pulse removal
time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input
hold time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup
time
tSTAS
3tcyc
—
—
ns
Setup time for stop
condition input
tSTOS
3tcyc
—
—
ns
Data-input setup time tSDAS
1tcyc+20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
cb
0
—
400
pF
SCL and SDA output
fall time
tSf
VCC = 4.0 to —
5.5 V
—
250
ns
—
—
300
Item
Symbol
SCL input cycle time
tSCL
SCL input high width
tSCLH
SCL input low width
Rev. 3.00, 05/03, page 378 of 472
Test
Condition Min
Typ
Table 23.5 Serial Communication Interface (SCI) Timing
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Input
clock
cycle
Asynchronous
Symbol
Applicable
Pins
tScyc
SCK3
Values
Test Condition
Clocked
synchronous
Input clock pulse
width
tSCKW
SCK3
Transmit data delay
time (clocked
synchronous)
tTXD
TXD
Receive data setup
time (clocked
synchronous)
tRXS
Receive data hold
time (clocked
synchronous)
tRXH
RXD
RXD
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
Min
Typ Max Unit
Reference
Figure
4
—
—
Figure 23.5
6
—
—
0.4
—
0.6
tScyc
tcyc
—
—
1
—
—
1
50.0
—
—
100.0
—
—
50.0
—
—
100.0
—
—
tcyc
Figure 23.6
ns
ns
Rev. 3.00, 05/03, page 379 of 472
23.2.4
A/D Converter Characteristics
Table 23.6 A/D Converter Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Test
Condition
Values
Min
Typ Max
Unit
Reference
Figure
V
*1
Analog power supply AVCC
voltage
AVCC
3.3
VCC
5.5
Analog input voltage AVIN
AN0 to
AN7
VSS – 0.3
—
AVCC + 0.3 V
Analog power supply AIOPE
current
AVCC
—
2.0
mA
AVCC = 5.0 V —
fOSC =
20 MHz
AISTOP1
AVCC
—
50
—
µA
*2
Reference
value
AISTOP2
AVCC
—
—
5.0
µA
*3
Analog input
capacitance
CAIN
AN0 to
AN7
—
—
30.0
pF
Allowable signal
source impedance
RAIN
AN0 to
AN7
—
—
5.0
kΩ
10
10
10
bit
134
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Resolution (data
length)
Conversion time
(single mode)
AVCC = 3.3
to 5.5 V
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
70
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Conversion time
(single mode)
AVCC = 4.0
to 5.5 V
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
Rev. 3.00, 05/03, page 380 of 472
Item
Symbol
Applicable
Pins
Conversion time
(single mode)
Test
Condition
AVCC = 4.0
to 5.5 V
Nonlinearity error
Values
Min
Typ Max
Unit
134
—
—
tcyc
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Reference
Figure
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the
A/D converter is idle.
23.2.5
Watchdog Timer Characteristics
Table 23.7 Watchdog Timer Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
On-chip
oscillator
overflow
time
tOVF
Note:
*
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
0.2
0.4
—
s
*
Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Rev. 3.00, 05/03, page 381 of 472
23.2.6
Flash Memory Characteristics
Table 23.8 Flash Memory Characteristics
VCC = 3.0 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
1 2 4
Programming time (per 128 bytes)* * *
Test Condition Min
Typ
Max
Unit
tP
—
7
—
ms
Erase time (per block) * * *
tE
—
100
—
ms
Reprogramming count
NWEC
—
—
1000
Times
Programming Wait time after SWE
bit setting*1
x
1
—
—
µs
Wait time after PSU
bit setting*1
y
50
—
—
µs
Wait time after P bit setting
z1
1≤n≤6
28
30
32
µs
z2
7 ≤ n ≤ 1000
198
200
202
µs
z3
Additionalprogramming
8
10
12
µs
1 3 6
1 4
**
Wait time after P bit clear*1
α
5
—
—
µs
Wait time after PSU
bit clear*1
β
5
—
—
µs
Wait time after PV
bit setting*1
γ
4
—
—
µs
Wait time after dummy write*1 ε
2
—
—
µs
Wait time after PV bit clear*
η
2
—
—
µs
Wait time after SWE
bit clear*1
θ
100
—
—
µs
Maximum programming
count *1*4*5
N
—
—
1000
Times
1
Rev. 3.00, 05/03, page 382 of 472
Values
Item
Erasing
Symbol
Test Condition Min
Typ
Max
Unit
Wait time after SWE
bit setting*1
x
1
—
—
µs
Wait time after ESU
bit setting*1
y
100
—
—
µs
Wait time after E bit
setting*1*6
z
10
—
100
ms
Wait time after E bit clear*1
α
10
—
—
µs
Wait time after ESU
bit clear*1
β
10
—
—
µs
Wait time after EV
bit setting*1
γ
20
—
—
µs
Wait time after dummy write*1 ε
2
—
—
µs
Wait time after EV bit clear*
η
4
—
—
µs
Wait time after SWE
bit clear*1
θ
100
—
—
µs
—
—
120
Times
1
Maximum erase count *1*6*7 N
Notes: 1. Make the time settings in accordance with the program/erase algorithms.
2. The programming time for 128 bytes. (Indicates the total time for which the P bit in flash
memory control register 1 (FLMCR1) is set. The program-verify time is not included.)
3. The time required to erase one block. (Indicates the time for which the E bit in flash
memory control register 1 (FLMCR1) is set. The erase-verify time is not included.)
4. Programming time maximum value (tP(max.)) = wait time after P bit setting (z) ×
maximum programming count (N)
5. Set the maximum programming count (N) according to the actual set values of z1, z2,
and z3, so that it does not exceed the programming time maximum value (tP(max.)).
The wait time after P bit setting (z1, z2) should be changed as follows according to the
value of the programming count (n).
Programming count (n)
1≤n≤6
z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erase time maximum value (tE(max.)) = wait time after E bit setting (z) × maximum
erase count (N)
7. Set the maximum erase count (N) according to the actual set value of (z), so that it
does not exceed the erase time maximum value (tE(max.)).
Rev. 3.00, 05/03, page 383 of 472
23.2.7
EEPROM Characteristics (Preliminary)
Table 23.9 EEPROM Characteristics
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Values
Typ Max
Unit
Reference
Figure
2500
ns
Figure 23.7
tSCLH
600
µs
SCL input low pulse width
tSCLL
1200
ns
SCL, SDA input spike pulse
removal time
tSP
50
ns
SDA input bus-free time
tBUF
1200
ns
Start condition input hold time
tSTAH
600
ns
Retransmit start condition input
setup time
tSTAS
600
ns
Stop condition input setup time
tSTOS
600
ns
Data input setup time
tSDAS
160
ns
Data input hold time
tSDAH
0
ns
SCL, SDA input fall time
tSf
300
ns
SDA input rise time
tSr
300
ns
Data output hold time
tDH
50
ns
SCL, SDA capacitive load
Cb
0
400
pF
Access time
tAA
100
900
ns
Cycle time at writing*
tWC
10
ms
Reset release time
tRES
13
ms
Item
Symbol
SCL input cycle time
tSCL
SCL input high pulse width
Test
Condition Min
Note: * Cycle time at writing is a time from the stop condition to write completion (internal control).
Rev. 3.00, 05/03, page 384 of 472
23.2.8
Power-Supply-Voltage Detection Circuit Characteristics (Optional)
Table 23.10 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Test Condition Min
Typ
Max
Unit
Power-supply falling detection
voltage
Vint (D)
LVDSEL = 0
3.3
3.7
—
V
Power-supply rising detection
voltage
Vint (U)
LVDSEL = 0
—
4.0
4.5
V
Vreset1
LVDSEL = 0
—
2.3
2.7
V
Reset detection voltage 2*
Vreset2
LVDSEL = 1
3.0
3.6
4.2
V
Lower-limit voltage of LVDR
3
operation*
VLVDRmin
1.0
—
—
V
LVD stabilization time
tLVDON
50
—
—
µs
Current consumption in standby
mode
ISTBY
LVDE = 1,
Vcc = 5.0 V,
When a 32-kHz
crystal
resonator is not
used
—
350
µA
1
Reset detection voltage 1*
2
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a
reset may not occur. Therefore sufficient evaluation is required.
23.2.9
Power-On Reset Circuit Characteristics (Optional)
Table 23.11 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Pull-up resistance of RES pin
Power-on reset start voltage*
Note:
*
Test Condition Min
Typ
Max
Unit
RRES
100
150
—
kΩ
Vpor
—
—
100
mV
The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Rev. 3.00, 05/03, page 385 of 472
23.3
Electrical Characteristics (Mask-ROM Version, EEPROM
Laminated Mask-ROM Version)
23.3.1
Power Supply Voltage and Operating Ranges
Power Supply Voltage and Oscillation Frequency Range
φOSC (MHz)
φW (kHz)
20.0
32.768
10.0
2.0
2.7
4.0
VCC (V)
5.5
2.7
4.0
5.5
VCC (V)
• AVCC = 3.0 to 5.5 V
• All operating modes
• AVCC = 3.0 to 5.5 V
• Active mode
• Sleep mode
Power Supply Voltage and Operating Frequency Range
φ (MHz)
φSUB (kHz)
20.0
16.384
10.0
8.192
4.096
1.0
2.7
φ (kHz)
4.0
5.5
VCC (V)
• AVCC = 3.0 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 0)
2500
1250
78.125
2.7
4.0
5.5
VCC (V)
• AVCC = 3.0 to 5.5 V
• Active mode
• Sleep mode
(When MA2 in SYSCR2 = 1)
Rev. 3.00, 05/03, page 386 of 472
2.7
4.0
• AVCC = 3.0 to 5.5 V
• Subactive mode
• Subsleep mode
5.5
VCC (V)
Analog Power Supply Voltage and A/D Converter Accuracy Guarantee Range
φ (MHz)
20.0
10.0
2.0
3.3
4.0
5.5
AVCC (V)
• VCC = 2.7 to 5.5 V
• Active mode
• Sleep mode
Range of Power Supply Voltage and Oscillation Frequency when Low-Voltage Detection
Circuit is Used
φosc (MHz)
20.0
16.0
2.0
Vcc(V)
3.0
4.5
5.5
Operation guarantee range
Operation guarantee range except
A/D conversion accuracy
Rev. 3.00, 05/03, page 387 of 472
23.3.2
DC Characteristics
Table 23.12 DC Characteristics (1)
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Input high VIH
voltage
Applicable Pins
Test Condition
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG,TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
Max
Unit
VCC = 4.0 to 5.5 V VCC × 0.8 —
VCC + 0.3
V
VCC × 0.9 —
VCC + 0.3
RXD, RXD_2
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V VCC × 0.7 —
VCC + 0.3
VCC × 0.8 —
VCC + 0.3
PB0 to PB7
VCC = 4.0 to 5.5 V AVCC ×
0.7
—
AVCC + 0.3 V
AVCC ×
0.8
—
AVCC + 0.3
Note: Connect the TEST pin to Vss.
Rev. 3.00, 05/03, page 388 of 472
Min
Typ
V
Notes
Values
Item
Applicable Pins
Test Condition
Input high VIH
voltage
OSC1
Input low
voltage
RES, NMI,
WKP0 to WKP5,
IRQ0 to IRQ3,
ADTRG, TMIB1,
TMRIV,
TMCIV, FTIOA0
to FTIOD0,
FTIOA1 to
FTIOD1, SCK3,
SCK3_2, TRGV
VCC = 4.0 to 5.5 V –0.3
—
VCC × 0.2
–0.3
—
VCC × 0.1
RXD, RXD_2,
SCL, SDA,
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,.
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V –0.3
—
VCC × 0.3
–0.3
—
VCC × 0.2
PB0 to PB7
VCC = 4.0 to 5.5 V –0.3
—
AVCC × 0.3
–0.3
—
AVCC × 0.2
OSC1
VCC = 4.0 to 5.5 V –0.3
—
0.5
–0.3
—
0.3
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P55,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87
VCC = 4.0 to 5.5 V VCC – 1.0 —
Output
high
voltage
Symbol
VIL
VOH
P56, P57
Min
Typ
Max
Unit
VCC = 4.0 to 5.5 V VCC – 0.5 —
VCC + 0.3
V
VCC – 0.3 —
VCC + 0.3
—
Notes
V
V
V
V
–IOH = 1.5 mA
–IOH = 0.1 mA
VCC – 0.5 —
—
VCC = 4.0 to 5.5 V VCC – 2.5 —
—
V
–IOH = 0.1 mA
VCC =2.7 to 4.0 V
VCC – 2.0 —
—
–IOH = 0.1 mA
Rev. 3.00, 05/03, page 389 of 472
Values
Item
Symbol
Applicable Pins
Output
low
voltage
VOL
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P70 to P72,
P74 to P76,
P85 to P87
Typ
Max
Unit
—
0.6
V
—
—
0.4
VCC = 4.0 to 5.5 V —
—
1.5
—
1.0
—
0.4
—
—
0.4
VCC = 4.0 to 5.5 V —
—
0.6
—
—
0.4
VIN = 0.5 V or
OSC1, TMIB1,
RES, NMI,
higher
WKP0 to WKP5, (VCC – 0.5 V)
IRQ0 to IRQ3,
ADTRG, TRGV,
TMRIV, TMCIV,
FTIOA0 to
FTIOD0, FTIOA1
to FTIOD1, RXD,
SCK3, RXD_2,
SCK3_2, SCL,
SDA
—
—
1.0
µA
P10 to P12,
P14 to P17,
P20 to P24,
P30 to P37,
P50 to P57,
P60 to P67,
P70 to P72,
P74 to P76,
P85 to P87,
VIN = 0.5 V or
higher
(VCC – 0.5 V)
—
—
1.0
µA
PB0 to PB7
VIN = 0.5 V or
higher
(AVCC – 0.5 V)
—
—
1.0
µA
P60 to P67
Test Condition
Min
VCC = 4.0 to 5.5 V —
IOL = 1.6 mA
IOL = 0.4 mA
V
IOL = 20.0 mA
VCC = 4.0 to 5.5 V —
IOL = 10.0 mA
VCC = 4.0 to 5.5 V —
IOL = 1.6 mA
IOL = 0.4 mA
SCL, SDA
V
IOL = 6.0 mA
IOL = 3.0 mA
Input/
output
leakage
current
| IIL |
Rev. 3.00, 05/03, page 390 of 472
Notes
Values
Item
Symbol
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Pull-up
MOS
current
–Ip
P10 to P12,
P14 to P17,
P50 to P55
VCC = 5.0 V,
VIN = 0.0 V
50.0
—
300.0
µA
VCC = 3.0 V,
VIN = 0.0 V
—
60.0
—
Input
capacitance
Cin
Reference
value
All input pins
except power
supply pins
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
—
—
15.0
pF
Active
IOPE1
mode
current
consumption
VCC
Active mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
21.0
30.0
mA
Active mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
9.0
—
IOPE2
VCC
Active mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.8
3.0
Active mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.2
—
Sleep mode 1
VCC = 5.0 V,
fOSC = 20 MHz
—
17.5
22.5
Sleep mode 1
VCC = 3.0 V,
fOSC = 10 MHz
—
7.5
—
Sleep mode 2
VCC = 5.0 V,
fOSC = 20 MHz
—
1.7
2.7
Sleep mode 2
VCC = 3.0 V,
fOSC = 10 MHz
—
1.1
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
35.0
70.0
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/8)
—
25.0
—
VCC = 3.0 V
32-kHz crystal
resonator
(φSUB = φW/2)
—
25.0
50.0
Sleep
ISLEEP1
mode
current
consumption
VCC
ISLEEP2
VCC
Subactive ISUB
mode
current
consumption
VCC
Subsleep ISUBSP
mode
current
consumption
VCC
Notes
*
*
Reference
value
mA
*
*
Reference
value
mA
*
*
Reference
value
mA
*
*
Reference
value
µA
*
*
Reference
value
µA
*
Rev. 3.00, 05/03, page 391 of 472
Values
Item
Applicable Pins
Test Condition
Min
Typ
Max
Unit
Notes
ISTBY
Standby
mode
current
consumption
VCC
32-kHz crystal
resonator not
used
—
—
5.0
µA
*
RAM data VRAM
retaining
voltage
VCC
2.0
—
—
V
Note:
Symbol
*
Pin states during current consumption measurement are given below (excluding current
in the pull-up MOS transistors and output buffers).
Mode
RES Pin
Internal State
Other Pins
Oscillator Pins
Active mode 1
VCC
Operates
VCC
Main clock:
ceramic or crystal
resonator
Active mode 2
Sleep mode 1
Operates
(φ/64)
VCC
Sleep mode 2
Only timers operate
Subclock:
Pin X1 = VSS
VCC
Only timers operate
(φ/64)
Subactive mode
VCC
Operates
VCC
Main clock:
ceramic or crystal
resonator
Subsleep mode
VCC
Only timers operate
VCC
Subclock resonator:
crystal
Standby mode
VCC
CPU and timers
both stop
VCC
Main clock:
ceramic or crystal
resonator
Subclock:
Pin X1 = VSS
Rev. 3.00, 05/03, page 392 of 472
Table 23.12 DC Characteristics (2)
VCC = 3.0 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins
Test Condition
EEPROM
current
consumption
IEEW
VCC
IEER
IEESTBY
Min
Typ
Max
Unit
Notes
VCC = 5.0 V, tSCL = 2.5 —
µs (when writing)
—
2.0
mA
*
VCC
VCC = 5.0 V, tSCL = 2.5 —
µs (when reading)
—
0.3
mA
VCC
VCC = 5.0 V, tSCL = 2.5 —
µs (at standby)
—
3.0
µA
Note: * The current consumption of the EEPROM chip is shown.
For the current consumption of H8/3687N, add the above current values to the current
consumption of H8/3687.
Rev. 3.00, 05/03, page 393 of 472
Table 23.12 DC Characteristics (3)
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Applicable Pins Test Condition
Min
Typ
Max
Unit
Allowable output low
current (per pin)
IOL
Output pins
except port 6,
SCL, and SDA
—
—
2.0
mA
VCC = 4.0 to 5.5 V
Port 6
—
—
20.0
Output pins
except port 6,
SCL, and SDA
—
—
0.5
Port 6
—
—
10.0
SCL, SDA
Allowable output low
current (total)
∑IOL
Allowable output high –IOH
current (per pin)
—
—
6.0
—
—
40.0
Port 6,
SCL, and SDA
—
—
80.0
Output pins
except port 6,
SCL, and SDA
—
—
20.0
Port 6,
SCL, and SDA
—
—
40.0
—
2.0
Output pins
except port 6,
SCL, and SDA
VCC = 4.0 to 5.5 V
All output pins
VCC = 4.0 to 5.5 V
—
—
—
0.2
Allowable output high –∑IOH All output pins
current (total)
VCC = 4.0 to 5.5 V
—
—
30.0
—
—
8.0
Rev. 3.00, 05/03, page 394 of 472
mA
mA
mA
23.3.3
AC Characteristics
Table 23.13 AC Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
System clock
oscillation
frequency
fOSC
System clock (φ)
cycle time
tcyc
Applicable
Test Condition
Pins
OSC1,
OSC2
VCC = 4.0 to 5.5 V
Values
Min
Typ
Max
Unit
Reference
Figure
2.0
—
20.0
MHz
*1
tOSC
*2
2.0
10.0
1
—
64
12.8
—
—
Subclock oscillation fW
frequency
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
2
—
—
tcyc
tsubcyc
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
µs
trc
OSC1,
OSC2
—
—
10.0
ms
Oscillation
trc
stabilization time
(ceramic resonator)
OSC1,
OSC2
—
—
5.0
ms
Oscillation
stabilization time
trcx
X1, X2
—
—
2.0
s
External clock
high width
tCPH
OSC1
VCC = 4.0 to 5.5 V
20.0
—
—
ns
40.0
—
—
External clock
low width
tCPL
OSC1
VCC = 4.0 to 5.5 V
20.0
—
—
40.0
—
—
External clock
rise time
tCPr
—
—
10.0
—
—
15.0
External clock
fall time
tCPf
—
—
10.0
—
—
15.0
OSC1
OSC1
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
*2
Figure 23.1
ns
ns
ns
Rev. 3.00, 05/03, page 395 of 472
Item
Symbol
Applicable
Pins
RES pin low
width
tREL
RES
Values
Typ
Max
Unit
Reference
Figure
At power-on and in trc
modes other than
those below
—
—
ms
Figure 23.2
In active mode and 200
sleep mode
operation
—
—
ns
Test Condition
Min
Input pin high
width
tIH
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
Figure 23.3
tsubcyc
Input pin low
width
tIL
NMI, TMIB1,
IRQ0 to
IRQ3,
WKP0 to
WKP5,
TMCIV,
TMRIV,
TRGV,
ADTRG,
FTIOA0 to
FTIOD0,
FTIOA1 to
FTIOD1
2
—
—
tcyc
tsubcyc
Notes: 1. When an external clock is input, the minimum system clock oscillation frequency is
1.0 MHz.
2. Determined by MA2, MA1, MA0, SA1, and SA0 of system control register 2 (SYSCR2).
Rev. 3.00, 05/03, page 396 of 472
Table 23.14 I2C Bus Interface Timing
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Min
Typ
Max
Unit
Reference
Figure
tSCL
12tcyc +
600
—
—
ns
Figure 23.4
SCL input high width
tSCLH
3tcyc + 300 —
—
ns
SCL input low width
tSCLL
5tcyc + 300 —
—
ns
SCL and SDA input
fall time
tSf
—
—
300
ns
SCL and SDA input
spike pulse removal
time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input
hold time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup
time
tSTAS
3tcyc
—
—
ns
Setup time for stop
condition input
tSTOS
3tcyc
—
—
ns
Data-input setup time tSDAS
1tcyc+20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
cb
0
—
400
pF
SCL and SDA output
fall time
tSf
VCC = 4.0 —
to 5.5 V
—
250
ns
—
—
300
Item
Symbol
SCL input cycle time
Test
Condition
Rev. 3.00, 05/03, page 397 of 472
Table 23.15 Serial Communication Interface (SCI) Timing
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Input
clock
cycle
Asynchronous
Values
Symbol
Applicable
Pins
Test Condition
Min
Typ
Max Unit
Reference
Figure
tScyc
SCK3
4
—
—
Figure 23.5
6
—
—
0.4
—
0.6
tScyc
—
—
1
tcyc
—
—
1
50.0
—
—
100.0
—
—
Clocked
synchronous
Input clock pulse
width
tSCKW
SCK3
Transmit data delay
time (clocked
synchronous)
tTXD
TXD
Receive data setup
time (clocked
synchronous)
tRXS
Receive data hold
time (clocked
synchronous)
tRXH
RXD
RXD
Rev. 3.00, 05/03, page 398 of 472
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
VCC = 4.0 to 5.5 V
50.0
—
—
100.0
—
—
tcyc
ns
ns
Figure 23.6
23.3.4
A/D Converter Characteristics
Table 23.16 A/D Converter Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
V
*1
Analog power supply AVCC
voltage
AVCC
3.3
VCC
5.5
Analog input voltage AVIN
AN0 to
AN7
VSS –
0.3
—
AVCC + 0.3 V
Analog power supply AIOPE
current
AVCC
—
—
2.0
mA
AVCC = 5.0 V
fOSC =
20 MHz
AISTOP1
AVCC
—
50
—
µA
*2
Reference
value
AISTOP2
AVCC
—
—
5.0
µA
*3
Analog input
capacitance
CAIN
AN0 to
AN7
—
—
30.0
pF
Allowable signal
source impedance
RAIN
AN0 to
AN7
—
—
5.0
kΩ
10
10
10
bit
134
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Resolution (data
length)
Conversion time
(single mode)
AVCC = 3.0 to
5.5 V
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
70
—
—
tcyc
Nonlinearity error
—
—
±7.5
LSB
Offset error
—
—
±7.5
LSB
Full-scale error
—
—
±7.5
LSB
Conversion time
(single mode)
AVCC = 4.0 to
5.5 V
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±8.0
LSB
Rev. 3.00, 05/03, page 399 of 472
Item
Symbol
Applicable
Test Condition
Pins
Conversion time
(single mode)
AVCC = 4.0 to 5.5
V
Nonlinearity error
Values
Min
Typ
Max
Unit
134
—
—
tcyc
—
—
±3.5
LSB
Offset error
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
LSB
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
LSB
Reference
Figure
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, subactive, and subsleep modes while the
A/D converter is idle.
23.3.5
Watchdog Timer Characteristics
Table 23.17 Watchdog Timer Characteristics
VCC = 2.7 to 5.5 V, VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Item
Symbol
On-chip
oscillator
overflow
time
tOVF
Note:
*
Applicable
Pins
Test
Condition
Values
Min
Typ
Max
Unit
Reference
Figure
0.2
0.4
—
s
*
Shows the time to count from 0 to 255, at which point an internal reset is generated,
when the internal oscillator is selected.
Rev. 3.00, 05/03, page 400 of 472
23.3.6
EEPROM Characteristics (Preliminary)
Table 23.18 EEPROM Characteristics
VCC = 2.7 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise indicated.
Values
Typ Max
Unit
Reference
Figure
2500
ns
Figure 23.7
tSCLH
600
µs
SCL input low pulse width
tSCLL
1200
ns
SCL, SDA input spike pulse
removal time
tSP
50
ns
SDA input bus-free time
tBUF
1200
ns
Start condition input hold time
tSTAH
600
ns
Retransmit start condition input
setup time
tSTAS
600
ns
Stop condition input setup time
tSTOS
600
ns
Data input setup time
tSDAS
160
ns
Data input hold time
tSDAH
0
ns
SCL, SDA input fall time
tSf
300
ns
SDA input rise time
tSr
300
ns
Data output hold time
tDH
50
ns
SCL, SDA capacitive load
Cb
0
400
pF
Access time
tAA
100
900
ns
Cycle time at writing*
tWC
10
ms
Reset release time
tRES
13
ms
Item
Symbol
SCL input cycle time
tSCL
SCL input high pulse width
Test
Condition Min
Note: * Cycle time at writing is a time from the stop condition to write completion (internal control).
Rev. 3.00, 05/03, page 401 of 472
23.3.7
Power-Supply-Voltage Detection Circuit Characteristics (Optional)
Table 23.19 Power-Supply-Voltage Detection Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Test Condition Min
Typ
Max
Unit
Power-supply falling detection
voltage
Vint (D)
LVDSEL = 0
3.3
3.7
—
V
Power-supply rising detection
voltage
Vint (U)
LVDSEL = 0
—
4.0
4.5
V
1
Reset detection voltage 1*
Vreset1
LVDSEL = 0
—
2.3
2.7
V
Reset detection voltage 2*
Vreset2
LVDSEL = 1
3.0
3.6
4.2
V
Lower-limit voltage of LVDR
3
operation*
VLVDRmin
1.0
—
—
V
LVD stabilization time
tLVDON
50
—
—
µs
Current consumption in standby
mode
ISTBY
—
LVDE = 1,
Vcc = 5.0 V,
When a 32-kHz
crystal
resonator is not
used
—
350
µA
2
Notes: 1. This voltage should be used when the falling and rising voltage detection function is
used.
2. Select the low-voltage reset 2 when only the low-voltage detection reset is used.
3. When the power-supply voltage (Vcc) falls below VLVDRmin = 1.0 V and then rises, a
reset may not occur. Therefore sufficient evaluation is required.
23.3.8
Power-On Reset Circuit Characteristics (Optional)
Table 23.20 Power-On Reset Circuit Characteristics
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise indicated.
Values
Item
Symbol
Pull-up resistance of RES pin
Power-on reset start voltage*
Note:
*
Test Condition Min
Typ
Max
Unit
RRES
100
150
—
kΩ
Vpor
—
—
100
mV
The power-supply voltage (Vcc) must fall below Vpor = 100 mV and then rise after
charge of the RES pin is removed completely. In order to remove charge of the RES
pin, it is recommended that the diode be placed in the Vcc side. If the power-supply
voltage (Vcc) rises from the point over 100 mV, a power-on reset may not occur.
Rev. 3.00, 05/03, page 402 of 472
23.4
Operation Timing
t OSC
VIH
OSC1
VIL
t CPH
t CPL
t CPr
t CPf
Figure 23.1 System Clock Input Timing
VCC × 0.7
VCC
OSC1
tREL
VIL
VIL
tREL
Figure 23.2 RES Low Width Timing
to
to
VIH
VIL
FTIOA0 to FTIOD0,
FTIOA1 to FTIOD1,
TMCIV, TMRIV
TRGV
t IL
t IH
Figure 23.3 Input Timing
Rev. 3.00, 05/03, page 403 of 472
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOS
SCL
P*
S*
tSf
Sr*
tSCLL
tSCL
P*
tSDAS
tSr
tSDAH
Note: * S, P, and Sr represent the following:
S: Start condition
P: Stop condition
Sr: Retransmission start condition
Figure 23.4 I2C Bus Interface Input/Output Timing
t SCKW
SCK3
t Scyc
Figure 23.5 SCK3 Input Clock Timing
Rev. 3.00, 05/03, page 404 of 472
t Scyc
VIH or VOH *
VIL or VOL *
SCK3
t TXD
VOH*
TXD
(transmit data)
VOL
*
t RXS
t RXH
RXD
(receive data)
Note:
* Output timing reference levels
Output high:
V OH= 2.0 V
Output low:
V OL= 0.8 V
Load conditions are shown in figure 23.8.
Figure 23.6 SCI Input/Output Timing in Clocked Synchronous Mode
1/fSCL
tSf
tSCLH
tSCLL
tSP
SCL
tSTAS
tSDAH
tSTAH
tSTOS
tSDAS
tSr
SDA
(in)
tBUF
tAA
tDH
SDA
(out)
Figure 23.7 EEPROM Bus Timing
Rev. 3.00, 05/03, page 405 of 472
23.5
Output Load Condition
VCC
2.4 kΩ
LSI output pin
30 pF
12 k Ω
Figure 23.8 Output Load Circuit
Rev. 3.00, 05/03, page 406 of 472
Appendix A Instruction Set
A.1
Instruction List
Condition Code
Symbol
Description
Rd
General destination register
Rs
General source register
Rn
General register
ERd
General destination register (address register or 32-bit register)
ERs
General source register (address register or 32-bit register)
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
PC
Program counter
SP
Stack pointer
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
disp
Displacement
→
Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+
Addition of the operands on both sides
–
Subtraction of the operand on the right from the operand on the left
×
Multiplication of the operands on both sides
÷
Division of the operand on the left by the operand on the right
∧
Logical AND of the operands on both sides
∨
Logical OR of the operands on both sides
⊕
Logical exclusive OR of the operands on both sides
¬
NOT (logical complement)
( ), < >
Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
Rev. 3.00, 05/03, page 407 of 472
Symbol
Description
↔
Condition Code Notation (cont)
Changed according to execution result
*
Undetermined (no guaranteed value)
0
Cleared to 0
1
Set to 1
—
Not affected by execution of the instruction
∆
Varies depending on conditions, described in notes
Rev. 3.00, 05/03, page 408 of 472
Table A.1
Instruction Set
1. Data Transfer Instructions
Condition Code
MOV.B @(d:16, ERs), Rd
B
4
@(d:16, ERs) → Rd8
— —
MOV.B @(d:24, ERs), Rd
B
8
@(d:24, ERs) → Rd8
— —
MOV.B @ERs+, Rd
B
@ERs → Rd8
ERs32+1 → ERs32
— —
MOV.B @aa:8, Rd
B
2
@aa:8 → Rd8
— —
MOV.B @aa:16, Rd
B
4
@aa:16 → Rd8
— —
MOV.B @aa:24, Rd
B
6
@aa:24 → Rd8
— —
MOV.B Rs, @ERd
B
Rs8 → @ERd
— —
MOV.B Rs, @(d:16, ERd)
B
4
Rs8 → @(d:16, ERd)
— —
MOV.B Rs, @(d:24, ERd)
B
8
Rs8 → @(d:24, ERd)
— —
MOV.B Rs, @–ERd
B
ERd32–1 → ERd32
Rs8 → @ERd
— —
MOV.B Rs, @aa:8
B
2
Rs8 → @aa:8
— —
MOV.B Rs, @aa:16
B
4
Rs8 → @aa:16
— —
MOV.B Rs, @aa:24
B
6
Rs8 → @aa:24
— —
MOV.W #xx:16, Rd
W 4
#xx:16 → Rd16
— —
MOV.W Rs, Rd
W
Rs16 → Rd16
— —
MOV.W @ERs, Rd
W
@ERs → Rd16
— —
2
2
2
2
2
2
MOV.W @(d:16, ERs), Rd W
4
@(d:16, ERs) → Rd16
— —
MOV.W @(d:24, ERs), Rd W
8
@(d:24, ERs) → Rd16
— —
@ERs → Rd16
ERs32+2 → @ERd32
— —
MOV.W @ERs+, Rd
W
MOV.W @aa:16, Rd
W
4
@aa:16 → Rd16
— —
MOV.W @aa:24, Rd
W
6
@aa:24 → Rd16
— —
MOV.W Rs, @ERd
W
Rs16 → @ERd
— —
2
2
MOV.W Rs, @(d:16, ERd) W
4
Rs16 → @(d:16, ERd)
— —
MOV.W Rs, @(d:24, ERd) W
8
Rs16 → @(d:24, ERd)
— —
0 —
0 —
0 —
Advanced
— —
B
↔ ↔ ↔ ↔ ↔ ↔
@ERs → Rd8
MOV.B @ERs, Rd
2
↔ ↔ ↔ ↔ ↔ ↔
— —
B
C
0 —
↔ ↔ ↔ ↔ ↔ ↔ ↔
Rs8 → Rd8
MOV.B Rs, Rd
V
↔ ↔ ↔ ↔ ↔ ↔ ↔
Z
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
I
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
N
— —
↔ ↔ ↔ ↔ ↔
H
#xx:8 → Rd8
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
2
Rn
B
No. of
States*1
↔ ↔ ↔ ↔ ↔
MOV MOV.B #xx:8, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
6
0 —
8
0 —
4
0 —
6
0 —
10
Rev. 3.00, 05/03, page 409 of 472
No. of
States*1
Condition Code
↔
↔
0 —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
0 —
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
0 —
POP POP.W Rn
W
2 @SP → Rn16
SP+2 → SP
— —
↔ ↔ ↔
↔ ↔ ↔
0 —
POP.L ERn
L
4 @SP → ERn32
SP+4 → SP
— —
↔
0 —
PUSH PUSH.W Rn
W
2 SP–2 → SP
Rn16 → @SP
— —
0 —
PUSH.L ERn
L
4 SP–4 → SP
ERn32 → @SP
— —
0 —
MOVFPE
MOVFPE @aa:16, Rd
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
MOVTPE
MOVTPE Rs, @aa:16
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
MOV MOV.W Rs, @–ERd
W
MOV.W Rs, @aa:16
W
4
Rs16 → @aa:16
— —
MOV.W Rs, @aa:24
W
6
Rs16 → @aa:24
— —
MOV.L #xx:32, Rd
L
#xx:32 → Rd32
— —
MOV.L ERs, ERd
L
ERs32 → ERd32
— —
MOV.L @ERs, ERd
L
@ERs → ERd32
— —
MOV.L @(d:16, ERs), ERd
L
6
@(d:16, ERs) → ERd32
— —
MOV.L @(d:24, ERs), ERd
L
10
@(d:24, ERs) → ERd32
— —
MOV.L @ERs+, ERd
L
@ERs → ERd32
ERs32+4 → ERs32
— —
MOV.L @aa:16, ERd
L
6
@aa:16 → ERd32
— —
MOV.L @aa:24, ERd
L
8
@aa:24 → ERd32
— —
MOV.L ERs, @ERd
L
ERs32 → @ERd
— —
MOV.L ERs, @(d:16, ERd)
L
6
ERs32 → @(d:16, ERd)
— —
MOV.L ERs, @(d:24, ERd)
L
10
ERs32 → @(d:24, ERd)
— —
MOV.L ERs, @–ERd
L
ERd32–4 → ERd32
ERs32 → @ERd
— —
MOV.L ERs, @aa:16
L
6
ERs32 → @aa:16
— —
MOV.L ERs, @aa:24
L
8
ERs32 → @aa:24
— —
2
6
2
Rev. 3.00, 05/03, page 410 of 472
4
4
4
4
Advanced
— —
C
↔
ERd32–2 → ERd32
Rs16 → @ERd
V
↔
Z
↔
N
↔
H
↔
I
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
6
0 —
8
0 —
6
0 —
2
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
6
10
6
10
2. Arithmetic Instructions
No. of
States*1
Condition Code
Z
V
C
↔ ↔
— (2)
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
ERd32+ERs32 →
ERd32
— (2)
↔
↔
(3)
↔ ↔
Rd16+Rs16 → Rd16
— (1)
ERd32+#xx:32 →
ERd32
Rd8+#xx:8 +C → Rd8
—
2
B
2
Rd8+Rs8 +C → Rd8
—
ADDS ADDS.L #1, ERd
L
2
ERd32+1 → ERd32
— — — — — —
2
ADDS.L #2, ERd
L
2
ERd32+2 → ERd32
— — — — — —
2
ADDS.L #4, ERd
L
2
ERd32+4 → ERd32
— — — — — —
2
INC.B Rd
B
2
Rd8+1 → Rd8
— —
INC.W #1, Rd
W
2
Rd16+1 → Rd16
— —
INC.W #2, Rd
W
2
Rd16+2 → Rd16
— —
INC.L #1, ERd
L
2
ERd32+1 → ERd32
— —
INC.L #2, ERd
L
2
ERd32+2 → ERd32
— —
DAA
DAA Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
SUB
SUB.B Rs, Rd
B
2
Rd8–Rs8 → Rd8
—
SUB.W #xx:16, Rd
W 4
Rd16–#xx:16 → Rd16
— (1)
SUB.W Rs, Rd
W
Rd16–Rs16 → Rd16
— (1)
SUB.L #xx:32, ERd
L
SUB.L ERs, ERd
L
W
ADD.L #xx:32, ERd
L
ADD.L ERs, ERd
L
ADDX ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
6
2
2
(3)
2
4
2
6
2
—
2
—
2
—
2
—
2
—
2
* —
2
Rd8–Rs8–C → Rd8
—
SUBS SUBS.L #1, ERd
L
2
ERd32–1 → ERd32
— — — — — —
2
SUBS.L #2, ERd
L
2
ERd32–2 → ERd32
— — — — — —
2
SUBS.L #4, ERd
L
2
ERd32–4 → ERd32
— — — — — —
2
B
2
Rd8–1 → Rd8
— —
DEC.W #1, Rd
W
2
Rd16–1 → Rd16
— —
DEC.W #2, Rd
W
2
Rd16–2 → Rd16
— —
2
ERd32–ERs32 → ERd32 — (2)
Rd8–#xx:8–C → Rd8
—
(3)
(3)
↔ ↔ ↔
DEC DEC.B Rd
2
↔ ↔
SUBX.B Rs, Rd
B
ERd32–#xx:32 → ERd32 — (2)
6
↔ ↔ ↔
2
SUBX SUBX.B #xx:8, Rd
2
↔ ↔ ↔
2
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
INC
B
2
↔ ↔ ↔ ↔ ↔
ADD.W Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
W 4
↔ ↔ ↔ ↔ ↔
ADD.W #xx:16, Rd
2
↔ ↔ ↔ ↔ ↔ ↔ ↔
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
ADD.B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
2
ADD ADD.B #xx:8, Rd
↔
↔ ↔ ↔ ↔ ↔
— (1)
↔ ↔ ↔ ↔ ↔
Rd16+#xx:16 → Rd16
2
↔
—
↔ ↔
Rd8+Rs8 → Rd8
↔
—
Advanced
N
↔ ↔
I
Rd8+#xx:8 → Rd8
Normal
H
↔ ↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
2
@ERn
B
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
4
2
6
2
2
2
—
2
—
2
—
2
Rev. 3.00, 05/03, page 411 of 472
Advanced
— —
↔ ↔
2
Rd8 decimal adjust
→ Rd8
— *
↔ ↔ ↔
2
B
↔ ↔ ↔
—
* —
2
B
2
Rd8 × Rs8 → Rd16
(unsigned multiplication)
— — — — — —
14
W
2
Rd16 × Rs16 → ERd32
(unsigned multiplication)
— — — — — —
22
B
4
Rd8 × Rs8 → Rd16
(signed multiplication)
— —
↔
Normal
ERd32–2 → ERd32
W
4
Rd16 × Rs16 → ERd32
(signed multiplication)
— —
↔
—
@@aa
2
2
B
2
W
16
— —
24
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(unsigned division)
— — (6) (7) — —
14
2
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(unsigned division)
— — (6) (7) — —
22
B
4
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
— — (8) (7) — —
16
W
4
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(signed division)
— — (8) (7) — —
24
Rd8–#xx:8
—
2
Rd8–Rs8
—
Rd16–#xx:16
— (1)
Rd16–Rs16
— (1)
ERd32–#xx:32
— (2)
ERd32–ERs32
— (2)
B
2
CMP.B Rs, Rd
B
CMP.W #xx:16, Rd
W 4
CMP.W Rs, Rd
W
CMP.L #xx:32, ERd
L
CMP.L ERs, ERd
L
2
6
2
Rev. 3.00, 05/03, page 412 of 472
↔ ↔ ↔ ↔ ↔ ↔
— —
↔ ↔ ↔ ↔ ↔ ↔
↔
CMP CMP.B #xx:8, Rd
@(d, PC)
2
↔
DIVXS. W Rs, ERd
@aa
C
—
↔ ↔ ↔ ↔ ↔ ↔
DIVXS DIVXS. B Rs, Rd
@–ERn/@ERn+
V
↔ ↔
DIVXU. W Rs, ERd
I
↔ ↔ ↔ ↔ ↔ ↔
DIVXU DIVXU. B Rs, Rd
@(d, ERn)
Z
DAS.Rd
MULXS. W Rs, ERd
@ERn
N
L
MULXS MULXS. B Rs, Rd
Rn
H
L
MULXU. W Rs, ERd
Condition Code
Operation
— —
DEC.L #2, ERd
MULXU MULXU. B Rs, Rd
No. of
States*1
ERd32–1 → ERd32
DEC DEC.L #1, ERd
DAS
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
4
2
4
2
No. of
States*1
Condition Code
W
2
0–Rd16 → Rd16
—
NEG.L ERd
L
2
0–ERd32 → ERd32
—
EXTU EXTU.W Rd
W
2
0 → (<bits 15 to 8>
of Rd16)
— — 0
EXTU.L ERd
L
2
0 → (<bits 31 to 16>
of ERd32)
— — 0
EXTS EXTS.W Rd
W
2
(<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
— —
EXTS.L ERd
L
2
(<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
— —
Advanced
↔ ↔ ↔
NEG.W Rd
Normal
C
↔ ↔ ↔
—
↔ ↔ ↔
V
↔ ↔ ↔ ↔
0–Rd8 → Rd8
2
0 —
2
↔
2
0 —
2
↔
H
B
0 —
2
↔
Z
↔
I
NEG NEG.B Rd
↔ ↔ ↔
N
↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 —
2
2
2
Rev. 3.00, 05/03, page 413 of 472
3. Logic Instructions
AND.B Rs, Rd
B
AND.W #xx:16, Rd
W 4
AND.W Rs, Rd
W
AND.L #xx:32, ERd
L
AND.L ERs, ERd
L
OR.B #xx:8, Rd
B
OR.B Rs, Rd
B
OR.W #xx:16, Rd
W 4
OR.W Rs, Rd
W
OR.L #xx:32, ERd
L
OR.L ERs, ERd
L
XOR.B #xx:8, Rd
B
XOR.B Rs, Rd
B
XOR.W #xx:16, Rd
W 4
XOR.W Rs, Rd
W
XOR.L #xx:32, ERd
L
XOR.L ERs, ERd
L
4
ERd32⊕ERs32 → ERd32 — —
NOT.B Rd
B
2
¬ Rd8 → Rd8
— —
NOT.W Rd
W
2
¬ Rd16 → Rd16
— —
NOT.L ERd
L
2
¬ Rd32 → Rd32
— —
I
Z
Rd8∧Rs8 → Rd8
— —
Rd16∧#xx:16 → Rd16
— —
Rd16∧Rs16 → Rd16
— —
ERd32∧#xx:32 → ERd32 — —
6
4
2
2
2
6
4
2
2
2
ERd32∧ERs32 → ERd32 — —
Rd8⁄#xx:8 → Rd8
— —
Rd8⁄Rs8 → Rd8
— —
Rd16⁄#xx:16 → Rd16
— —
Rd16⁄Rs16 → Rd16
— —
ERd32⁄#xx:32 → ERd32
— —
ERd32⁄ERs32 → ERd32
— —
Rd8⊕#xx:8 → Rd8
— —
Rd8⊕Rs8 → Rd8
— —
Rd16⊕#xx:16 → Rd16
— —
Rd16⊕Rs16 → Rd16
— —
ERd32⊕#xx:32 → ERd32 — —
6
Rev. 3.00, 05/03, page 414 of 472
V
C
Advanced
N
— —
Normal
—
@@aa
@(d, PC)
@aa
H
Rd8∧#xx:8 → Rd8
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
NOT
2
@(d, ERn)
2
@ERn
B
Rn
#xx
XOR
Condition Code
Operand Size
OR
No. of
States*1
AND.B #xx:8, Rd
Mnemonic
AND
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
2
4. Shift Instructions
W
2
SHAL.L ERd
L
2
SHAR SHAR.B Rd
B
2
SHAR.W Rd
W
2
SHAR.L ERd
L
2
SHLL SHLL.B Rd
B
2
SHLL.W Rd
W
2
SHLL.L ERd
L
2
SHLR SHLR.B Rd
B
2
SHLR.W Rd
W
2
SHLR.L ERd
L
2
ROTXL ROTXL.B Rd
B
2
ROTXL.W Rd
W
2
ROTXL.L ERd
L
2
B
2
ROTXR.W Rd
W
2
ROTXR.L ERd
L
2
ROTL ROTL.B Rd
B
2
ROTL.W Rd
W
2
ROTL.L ERd
L
2
ROTR ROTR.B Rd
B
2
ROTR.W Rd
W
2
ROTR.L ERd
L
2
ROTXR ROTXR.B Rd
C
0
MSB
LSB
Z
— —
— —
— —
C
MSB
— —
LSB
— —
— —
C
0
MSB
LSB
— —
— —
— —
0
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
V
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Advanced
N
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
I
↔ ↔ ↔
SHAL.W Rd
H
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Condition Code
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
SHAL SHAL.B Rd
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Rev. 3.00, 05/03, page 415 of 472
5. Bit-Manipulation Instructions
B
BSET #xx:3, @aa:8
B
BSET Rn, Rd
B
BSET Rn, @ERd
B
BSET Rn, @aa:8
B
B
BCLR #xx:3, @ERd
B
BCLR #xx:3, @aa:8
B
BCLR Rn, Rd
B
BCLR Rn, @ERd
B
BCLR Rn, @aa:8
B
BNOT BNOT #xx:3, Rd
B
BNOT #xx:3, @ERd
B
BNOT #xx:3, @aa:8
B
BNOT Rn, Rd
B
BNOT Rn, @ERd
B
BNOT Rn, @aa:8
B
BTST BTST #xx:3, Rd
B
BTST #xx:3, @ERd
B
BTST #xx:3, @aa:8
B
BTST Rn, Rd
B
BTST Rn, @ERd
B
BTST Rn, @aa:8
B
BLD #xx:3, Rd
B
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
Rev. 3.00, 05/03, page 416 of 472
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
Condition Code
Operation
(#xx:3 of Rd8) ← 1
— — — — — —
2
(#xx:3 of @ERd) ← 1
— — — — — —
8
(#xx:3 of @aa:8) ← 1
— — — — — —
8
(Rn8 of Rd8) ← 1
— — — — — —
2
(Rn8 of @ERd) ← 1
— — — — — —
8
(Rn8 of @aa:8) ← 1
— — — — — —
8
(#xx:3 of Rd8) ← 0
— — — — — —
2
(#xx:3 of @ERd) ← 0
— — — — — —
8
(#xx:3 of @aa:8) ← 0
— — — — — —
8
(Rn8 of Rd8) ← 0
— — — — — —
2
(Rn8 of @ERd) ← 0
— — — — — —
8
(Rn8 of @aa:8) ← 0
— — — — — —
8
(#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
— — — — — —
2
(#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
— — — — — —
8
(#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
— — — — — —
8
(Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
— — — — — —
2
(Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
— — — — — —
8
(Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
— — — — — —
8
¬ (#xx:3 of Rd8) → Z
— — —
¬ (#xx:3 of @ERd) → Z
— — —
¬ (#xx:3 of @aa:8) → Z
— — —
¬ (Rn8 of @Rd8) → Z
— — —
¬ (Rn8 of @ERd) → Z
— — —
¬ (Rn8 of @aa:8) → Z
— — —
(#xx:3 of Rd8) → C
— — — — —
— —
2
— —
6
— —
6
— —
2
— —
6
— —
6
↔
BSET #xx:3, @ERd
BCLR BCLR #xx:3, Rd
BLD
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔
BSET BSET #xx:3, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
B
BLD #xx:3, @aa:8
B
BILD BILD #xx:3, Rd
BST
BILD #xx:3, @ERd
B
BILD #xx:3, @aa:8
B
BST #xx:3, Rd
B
BST #xx:3, @ERd
B
BST #xx:3, @aa:8
B
BIST BIST #xx:3, Rd
B
BIST #xx:3, @ERd
B
BIST #xx:3, @aa:8
B
BAND BAND #xx:3, Rd
B
BAND #xx:3, @ERd
B
BAND #xx:3, @aa:8
B
BIAND BIAND #xx:3, Rd
BOR
B
B
BIAND #xx:3, @ERd
B
BIAND #xx:3, @aa:8
B
BOR #xx:3, Rd
B
BOR #xx:3, @ERd
B
BOR #xx:3, @aa:8
B
BIOR BIOR #xx:3, Rd
B
BIOR #xx:3, @ERd
B
BIOR #xx:3, @aa:8
B
BXOR BXOR #xx:3, Rd
B
BXOR #xx:3, @ERd
B
BXOR #xx:3, @aa:8
B
BIXOR BIXOR #xx:3, Rd
B
BIXOR #xx:3, @ERd
B
BIXOR #xx:3, @aa:8
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
H
N
Z
V
C
(#xx:3 of @ERd) → C
— — — — —
6
(#xx:3 of @aa:8) → C
— — — — —
¬ (#xx:3 of Rd8) → C
— — — — —
¬ (#xx:3 of @ERd) → C
— — — — —
¬ (#xx:3 of @aa:8) → C
— — — — —
C → (#xx:3 of Rd8)
— — — — — —
2
C → (#xx:3 of @ERd24)
— — — — — —
8
C → (#xx:3 of @aa:8)
— — — — — —
8
¬ C → (#xx:3 of Rd8)
— — — — — —
2
¬ C → (#xx:3 of @ERd24)
— — — — — —
8
¬ C → (#xx:3 of @aa:8)
— — — — — —
8
C∧(#xx:3 of Rd8) → C
— — — — —
2
C∧(#xx:3 of @ERd24) → C
— — — — —
C∧(#xx:3 of @aa:8) → C
— — — — —
C∧ ¬ (#xx:3 of Rd8) → C
— — — — —
C∧ ¬ (#xx:3 of @ERd24) → C
— — — — —
C∧ ¬ (#xx:3 of @aa:8) → C
— — — — —
C (#xx:3 of Rd8) → C
— — — — —
C (#xx:3 of @ERd24) → C
— — — — —
C (#xx:3 of @aa:8) → C
— — — — —
C ¬ (#xx:3 of Rd8) → C
— — — — —
C ¬ (#xx:3 of @ERd24) → C
— — — — —
C ¬ (#xx:3 of @aa:8) → C
— — — — —
C⊕(#xx:3 of Rd8) → C
— — — — —
C⊕(#xx:3 of @ERd24) → C
— — — — —
C⊕(#xx:3 of @aa:8) → C
— — — — —
C⊕ ¬ (#xx:3 of Rd8) → C
— — — — —
C⊕ ¬ (#xx:3 of @ERd24) → C — — — — —
4
4
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
Condition Code
Operation
↔ ↔ ↔ ↔ ↔
BLD #xx:3, @ERd
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
BLD
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
C⊕ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
2
6
6
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
Rev. 3.00, 05/03, page 417 of 472
6. Branching Instructions
Bcc
No. of
States*1
Condition Code
BRA d:8 (BT d:8)
—
2
BRA d:16 (BT d:16)
—
4
BRN d:8 (BF d:8)
—
2
BRN d:16 (BF d:16)
—
4
BHI d:8
—
2
BHI d:16
—
4
BLS d:8
—
2
BLS d:16
—
4
BCC d:8 (BHS d:8)
—
2
BCC d:16 (BHS d:16)
—
4
BCS d:8 (BLO d:8)
—
2
BCS d:16 (BLO d:16)
—
4
BNE d:8
—
2
BNE d:16
—
4
BEQ d:8
—
2
BEQ d:16
—
4
BVC d:8
—
2
BVC d:16
—
4
BVS d:8
—
2
BVS d:16
—
4
BPL d:8
—
2
BPL d:16
—
4
BMI d:8
—
2
BMI d:16
—
4
BGE d:8
—
2
BGE d:16
—
4
BLT d:8
—
2
BLT d:16
—
BGT d:8
If condition Always
is true then
PC ← PC+d
Never
else next;
I
H
N
Z
V
C
Advanced
Branch
Condition
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
4
— — — — — —
6
—
2
Z (N⊕V) = 0 — — — — — —
4
BGT d:16
—
4
— — — — — —
6
BLE d:8
—
2
Z (N⊕V) = 1 — — — — — —
4
BLE d:16
—
4
— — — — — —
6
Rev. 3.00, 05/03, page 418 of 472
C Z=0
C Z=1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V = 0
N⊕V = 1
JMP
BSR
JSR
RTS
JMP @ERn
—
JMP @aa:24
—
JMP @@aa:8
—
BSR d:8
—
BSR d:16
—
JSR @ERn
—
JSR @aa:24
—
JSR @@aa:8
—
RTS
—
Condition Code
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@–ERn/@ERn+
No. of
States*1
Operation
@aa
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
PC ← ERn
— — — — — —
PC ← aa:24
— — — — — —
PC ← @aa:8
— — — — — —
8
10
2
PC → @–SP
PC ← PC+d:8
— — — — — —
6
8
4
PC → @–SP
PC ← PC+d:16
— — — — — —
8
10
PC → @–SP
PC ← ERn
— — — — — —
6
8
PC → @–SP
PC ← aa:24
— — — — — —
8
10
PC → @–SP
PC ← @aa:8
— — — — — —
8
12
2 PC ← @SP+
— — — — — —
8
10
2
4
2
2
4
2
4
6
Rev. 3.00, 05/03, page 419 of 472
7. System Control Instructions
No. of
States*1
Condition Code
Advanced
—
CCR ← @SP+
PC ← @SP+
—
Transition to powerdown state
@aa:16 → CCR
8
@aa:24 → CCR
↔
ERd32–2 → ERd32
CCR → @ERd
— — — — — —
8
6
CCR → @aa:16
— — — — — —
8
8
CCR → @aa:24
— — — — — —
10
W
STC CCR, @aa:24
W
ANDC ANDC #xx:8, CCR
B
2
CCR∧#xx:8 → CCR
B
2
CCR #xx:8 → CCR
B
2
CCR⊕#xx:8 → CCR
2 PC ← PC+2
↔ ↔ ↔
STC CCR, @aa:16
4
Rev. 3.00, 05/03, page 420 of 472
↔
12
W
—
↔
— — — — — —
↔ ↔ ↔
CCR → @(d:24, ERd)
STC CCR, @–ERd
NOP
↔
8
10
W
4
↔ ↔ ↔
— — — — — —
STC CCR, @(d:24, ERd)
NOP
↔
CCR → @(d:16, ERd)
W
2
↔ ↔ ↔
6
6
STC CCR, @(d:16, ERd)
XORC XORC #xx:8, CCR
2
— — — — — —
W
ORC #xx:8, CCR
— — — — — —
8
CCR → @ERd
B
STC CCR, @ERd
ORC
10
CCR → Rd8
STC CCR, Rd
STC
↔ ↔ ↔ ↔ ↔
6
W
↔
W
LDC @aa:24, CCR
8
↔ ↔
LDC @aa:16, CCR
@ERs → CCR
ERs32+2 → ERs32
4
↔ ↔ ↔ ↔ ↔
W
↔
LDC @ERs+, CCR
8
12
↔ ↔
@(d:24, ERs) → CCR
↔ ↔ ↔ ↔ ↔
10
↔
W
6
↔ ↔
LDC @(d:24, ERs), CCR
↔ ↔ ↔ ↔ ↔
@(d:16, ERs) → CCR
2
↔
6
2
↔ ↔
W
↔ ↔ ↔ ↔ ↔
LDC @(d:16, ERs), CCR
@ERs → CCR
4
↔ ↔ ↔ ↔ ↔
W
Rs8 → CCR
2
2
↔
LDC @ERs, CCR
2
C
↔
B
V
↔ ↔
B
LDC Rs, CCR
Z
↔ ↔
#xx:8 → CCR
LDC #xx:8, CCR
N
— — — — — —
↔ ↔ ↔
LDC
H
10
↔ ↔ ↔
SLEEP SLEEP
↔
RTE
RTE
@@aa
16
@(d, PC)
1 — — — — — 14
@aa
2 PC → @–SP
CCR → @–SP
<vector> → PC
@ERn
—
Rn
TRAPA TRAPA #x:2
#xx
I
Normal
Operation
—
@–ERn/@ERn+
@(d, ERn)
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
— — — — — —
2
2
2
8. Block Transfer Instructions
EEPMOV
No. of
States*1
H
N
Z
V
C
Normal
—
@@aa
@(d, PC)
I
EEPMOV. B
—
4 if R4L ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
until
R4L=0
else next
— — — — — — 8+
4n*2
EEPMOV. W
—
4 if R4 ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4–1 → R4
until
R4=0
else next
— — — — — — 8+
4n*2
Advanced
Condition Code
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Notes: 1. The number of states in cases where the instruction code and its operands are located
in on-chip memory is shown here. For other cases see section A.3, Number of
Execution States.
2. n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Rev. 3.00, 05/03, page 421 of 472
Rev. 3.00, 05/03, page 422 of 472
MULXU
5
STC
Table A.2
(2)
LDC
3
SUBX
OR
XOR
AND
MOV
C
D
E
F
BILD
BIST
BLD
BST
TRAPA
BEQ
B
BIAND
BAND
AND
RTE
BNE
CMP
BIXOR
BXOR
XOR
BSR
BCS
A
BIOR
BOR
OR
RTS
BCC
MOV.B
Table A.2
(2)
LDC
7
ADDX
BTST
DIVXU
BLS
AND.B
ANDC
6
9
BCLR
MULXU
BHI
XOR.B
XORC
5
ADD
BNOT
DIVXU
BRN
OR.B
ORC
4
MOV
BVS
9
B
JMP
BPL
BMI
MOV
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
(2)
(2)
A
Table A.2 Table A.2
EEPMOV
(2)
(2)
SUB
ADD
Table A.2
(2)
BVC
8
BSR
BGE
C
CMP
MOV
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
8
7
BSET
BRA
6
2
1
Table A.2 Table A.2 Table A.2 Table A.2
(2)
(2)
(2)
(2)
NOP
0
4
3
2
1
0
AL
1st byte 2nd byte
AH AL BH BL
E
JSR
BGT
SUBX
ADDX
Table A.2
(3)
BLT
D
BLE
Table A.2
(2)
Table A.2
(2)
F
Table A.2
AH
Instruction code:
A.2
Operation Code Map
Operation Code Map (1)
SUBS
DAS
BRA
MOV
MOV
1B
1F
58
79
7A
1
ADD
ADD
CMP
CMP
BHI
2
SUB
SUB
BLS
NOT
ROTXR
ROTXL
SHLR
SHLL
3
4
OR
OR
BCC
LDC/STC
1st byte 2nd byte
AH AL BH BL
BRN
NOT
17
DEC
ROTXR
13
1A
ROTXL
12
DAA
0F
SHLR
ADDS
0B
11
INC
0A
SHLL
MOV
01
10
0
BH
AH AL
Instruction code:
XOR
XOR
BCS
DEC
EXTU
INC
5
AND
AND
BNE
6
BEQ
DEC
EXTU
INC
7
BVC
SUB
NEG
9
BVS
ROTR
ROTL
SHAR
SHAL
ADDS
SLEEP
8
BPL
A
MOV
BMI
NEG
CMP
SUB
ROTR
ROTL
SHAR
C
D
BGE
BLT
DEC
EXTS
INC
Table A.2 Table A.2
(3)
(3)
ADD
SHAL
B
BGT
E
BLE
DEC
EXTS
INC
Table A.2
(3)
F
Table A.2
Operation Code Map (2)
Rev. 3.00, 05/03, page 423 of 472
CL
Rev. 3.00, 05/03, page 424 of 472
DIVXS
3
BSET
7Faa7 * 2
BNOT
BNOT
BCLR
BCLR
Notes: 1. r is the register designation field.
2. aa is the absolute address field.
BSET
7Faa6 * 2
BTST
BCLR
7Eaa7 * 2
BNOT
BTST
BSET
7Dr07 * 1
7Eaa6 * 2
BSET
7Dr06 * 1
BTST
BCLR
MULXS
2
7Cr07 * 1
BNOT
DIVXS
1
BTST
MULXS
0
BIOR
BOR
BIOR
BOR
OR
4
BIXOR
BXOR
BIXOR
BXOR
XOR
5
BIAND
BAND
BIAND
BAND
AND
6
7
BIST
BILD
BST
BLD
BIST
BILD
BST
BLD
1st byte 2nd byte 3rd byte 4th byte
AH AL BH BL CH CL DH DL
7Cr06 * 1
01F06
01D05
01C05
01406
AH
ALBH
BLCH
Instruction code:
8
LDC
STC
9
A
LDC
STC
B
C
LDC
STC
D
E
LDC
STC
F
Instruction when most significant bit of DH is 1.
Instruction when most significant bit of DH is 0.
Table A.2
Operation Code Map (3)
A.3
Number of Execution States
The status of execution for each instruction of the H8/300H CPU and the method of calculating
the number of states required for instruction execution are shown below. Table A.4 shows the
number of cycles of each type occurring in each instruction, such as instruction fetch and data
read/write. Table A.3 shows the number of states required for each cycle. The total number of
states required for execution of an instruction can be calculated by the following expression:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1,
L=M=N=0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Rev. 3.00, 05/03, page 425 of 472
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
2 or 3*
Internal operation
SN
1
Note: * Depends on which on-chip peripheral module is accessed. See section 22.1, Register
Addresses (Address Order).
Rev. 3.00, 05/03, page 426 of 472
Table A.4
Number of Cycles in Each Instruction
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
ADD
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W #xx:16, Rd
2
ADD.W Rs, Rd
1
ADD.L #xx:32, ERd
3
ADD.L ERs, ERd
1
ADDS
ADDS #1/2/4, ERd
1
ADDX
ADDX #xx:8, Rd
1
ADDX Rs, Rd
1
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
AND.W #xx:16, Rd
2
AND.W Rs, Rd
1
AND.L #xx:32, ERd
3
AND.L ERs, ERd
2
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
BAND #xx:3, @ERd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
AND
Bcc
Stack
K
Rev. 3.00, 05/03, page 427 of 472
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
Bcc
BLT d:8
2
BGT d:8
2
BLE d:8
2
BRA d:16(BT d:16)
2
2
BRN d:16(BF d:16)
2
2
BHI d:16
2
2
BLS d:16
2
2
BCC d:16(BHS d:16)
2
2
BCS d:16(BLO d:16)
2
2
BNE d:16
2
2
BEQ d:16
2
2
BVC d:16
2
2
BVS d:16
2
2
BPL d:16
2
2
BMI d:16
2
2
BGE d:16
2
2
BLT d:16
2
2
BGT d:16
2
2
BLE d:16
2
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @ERd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
BCLR Rn, @ERd
2
2
2
BCLR
BIAND
BILD
Stack
K
BCLR Rn, @aa:8
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @ERd
2
1
BIAND #xx:3, @aa:8
2
1
BILD #xx:3, Rd
1
BILD #xx:3, @ERd
2
1
BILD #xx:3, @aa:8
2
1
Rev. 3.00, 05/03, page 428 of 472
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BIOR
BIOR #xx:8, Rd
1
BIOR #xx:8, @ERd
2
1
BIOR #xx:8, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @ERd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @ERd
2
1
BIXOR #xx:3, @aa:8
2
1
BLD #xx:3, Rd
1
BLD #xx:3, @ERd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @ERd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @ERd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @ERd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @ERd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @ERd
2
2
BSET Rn, @aa:8
2
2
BSR d:8
2
1
BSR d:16
2
1
BST #xx:3, Rd
1
BST #xx:3, @ERd
2
2
BST #xx:3, @aa:8
2
2
BIST
BIXOR
BLD
BNOT
BOR
BSET
BSR
BST
Stack
K
2
Rev. 3.00, 05/03, page 429 of 472
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BTST
BTST #xx:3, Rd
1
BTST #xx:3, @ERd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST Rn, @ERd
2
1
BTST Rn, @aa:8
2
1
BXOR #xx:3, Rd
1
BXOR #xx:3, @ERd
2
1
1
BXOR
Stack
K
BXOR #xx:3, @aa:8
2
CMP.B #xx:8, Rd
1
CMP.B Rs, Rd
1
CMP.W #xx:16, Rd
2
CMP.W Rs, Rd
1
CMP.L #xx:32, ERd
3
CMP.L ERs, ERd
1
DAA
DAA Rd
1
DAS
DAS Rd
1
DEC
DEC.B Rd
1
DEC.W #1/2, Rd
1
DEC.L #1/2, ERd
1
DIVXS.B Rs, Rd
2
12
DIVXS.W Rs, ERd
2
20
DIVXU.B Rs, Rd
1
12
DIVXU.W Rs, ERd
1
EEPMOV.B
2
2n+2*
EEPMOV.W
2
2n+2*
EXTS.W Rd
1
EXTS.L ERd
1
EXTU.W Rd
1
EXTU.L ERd
1
CMP
DUVXS
DIVXU
EEPMOV
EXTS
EXTU
Rev. 3.00, 05/03, page 430 of 472
20
1
1
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
INC
INC.B Rd
1
INC.W #1/2, Rd
1
INC.L #1/2, ERd
1
JMP @ERn
2
JMP @aa:24
2
JMP @@aa:8
2
JSR @ERn
2
1
JSR @aa:24
2
1
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
LDC@ERs, CCR
2
1
LDC@(d:16, ERs), CCR
3
1
LDC@(d:24,ERs), CCR
5
1
LDC@ERs+, CCR
2
1
LDC@aa:16, CCR
3
1
LDC@aa:24, CCR
4
1
JMP
JSR
LDC
MOV
Stack
K
2
1
1
2
2
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
MOV.B @ERs, Rd
1
1
MOV.B @(d:16, ERs), Rd
2
1
MOV.B @(d:24, ERs), Rd
4
1
MOV.B @ERs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B @aa:24, Rd
3
1
MOV.B Rs, @Erd
1
1
MOV.B Rs, @(d:16, ERd)
2
1
MOV.B Rs, @(d:24, ERd)
4
1
MOV.B Rs, @-ERd
1
1
MOV.B Rs, @aa:8
1
1
2
2
2
Rev. 3.00, 05/03, page 431 of 472
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MOV
MOV.B Rs, @aa:16
2
1
MOV.B Rs, @aa:24
3
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @ERs, Rd
1
1
MOV.W @(d:16,ERs), Rd
2
1
MOV.W @(d:24,ERs), Rd
4
1
MOV.W @ERs+, Rd
1
1
MOV.W @aa:16, Rd
2
1
MOV.W @aa:24, Rd
3
1
MOV.W Rs, @ERd
1
1
MOV.W Rs, @(d:16,ERd)
2
1
MOV.W Rs, @(d:24,ERd)
4
1
MOV.W Rs, @-ERd
1
1
MOV.W Rs, @aa:16
2
1
MOV.W Rs, @aa:24
3
1
MOV.L #xx:32, ERd
3
MOV.L ERs, ERd
1
MOV.L @ERs, ERd
2
2
MOV.L @(d:16,ERs), ERd
3
2
MOV.L @(d:24,ERs), ERd
5
2
MOV.L @ERs+, ERd
2
2
MOV.L @aa:16, ERd
3
2
MOV.L @aa:24, ERd
4
2
MOV.L ERs,@ERd
2
2
MOV.L ERs, @(d:16,ERd)
3
2
MOV.L ERs, @(d:24,ERd)
5
2
MOV.L ERs, @-ERd
2
2
MOV.L ERs, @aa:16
3
2
MOV.L ERs, @aa:24
4
2
MOV
2
Stack
K
MOVFPE
MOVFPE @aa:16, Rd*
2
1
MOVTPE
2
2
1
MOVTPE Rs,@aa:16*
Rev. 3.00, 05/03, page 432 of 472
2
2
2
2
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MULXS
MULXS.B Rs, Rd
2
12
MULXS.W Rs, ERd
2
20
MULXU.B Rs, Rd
1
12
MULXU.W Rs, ERd
1
20
NEG.B Rd
1
NEG.W Rd
1
NEG.L ERd
1
NOP
NOP
1
NOT
NOT.B Rd
1
NOT.W Rd
1
NOT.L ERd
1
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
OR.W #xx:16, Rd
2
OR.W Rs, Rd
1
OR.L #xx:32, ERd
3
OR.L ERs, ERd
2
ORC
ORC #xx:8, CCR
1
POP
POP.W Rn
1
1
2
POP.L ERn
2
2
2
PUSH
PUSH.W Rn
1
1
2
PUSH.L ERn
2
2
2
ROTL.B Rd
1
ROTL.W Rd
1
ROTL.L ERd
1
ROTR.B Rd
1
ROTR.W Rd
1
ROTR.L ERd
1
ROTXL.B Rd
1
ROTXL.W Rd
1
ROTXL.L ERd
1
MULXU
NEG
OR
ROTL
ROTR
ROTXL
Stack
K
Rev. 3.00, 05/03, page 433 of 472
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
ROTXR
ROTXR.B Rd
1
ROTXR.W Rd
1
ROTXR.L ERd
1
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHAL
SHAL.B Rd
1
SHAL.W Rd
1
SHAL.L ERd
1
SHAR.B Rd
1
SHAR.W Rd
1
SHAR.L ERd
1
SHLL.B Rd
1
SHLL.W Rd
1
SHLL.L ERd
1
SHLR.B Rd
1
SHLR.W Rd
1
SHLR.L ERd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
STC CCR, @ERd
2
1
STC CCR, @(d:16,ERd)
3
1
STC CCR, @(d:24,ERd)
5
1
STC CCR,@-ERd
2
1
STC CCR, @aa:16
3
1
STC CCR, @aa:24
4
1
SUB.B Rs, Rd
1
SUB.W #xx:16, Rd
2
SUB.W Rs, Rd
1
SUB.L #xx:32, ERd
3
SUB.L ERs, ERd
1
SUBS #1/2/4, ERd
1
SHAR
SHLL
SHLR
SUB
SUBS
Rev. 3.00, 05/03, page 434 of 472
Stack
K
2
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
K
L
M
N
SUBX
SUBX #xx:8, Rd
1
SUBX. Rs, Rd
1
TRAPA
TRAPA #xx:2
2
1
2
XOR
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XOR.W #xx:16, Rd
2
XOR.W Rs, Rd
1
XOR.L #xx:32, ERd
3
XOR.L ERs, ERd
2
XORC #xx:8, CCR
1
XORC
Stack
4
Notes: 1. n: Specified value in R4L and R4. The source and destination operands are accessed
n+1 times respectively.
2. Cannot be used in this LSI.
Rev. 3.00, 05/03, page 435 of 472
A.4
Combinations of Instructions and Addressing Modes
Table A.5
Combinations of Instructions and Addressing Modes
@(d:16.PC)
@@aa:8
—
—
—
—
—
WL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
—
W
W
—
—
—
—
—
—
—
—
—
—
W
W
—
—
—
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BW
Data
MOV
transfer
POP, PUSH
instructions
MOVFPE,
MOVTPE
BWL BWL BWL BWL BWL BWL
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
Arithmetic
operations
BWL
WL
B
—
—
—
—
BWL
BWL
B
L
BWL
B
BW
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BWL
WL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BWL
BWL
BWL
B
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
B
—
—
—
B
B
—
—
—
—
W
W
—
—
—
—
W
W
—
—
—
—
—
—
—
—
—
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
Logical
operations
AND, OR, XOR
NOT
Shift operations
Bit manipulations
Branching
BCC, BSR
instructions JMP, JSR
RTS
System
TRAPA
control
RTE
instructions
SLEEP
LDC
STC
ANDC, ORC,
XORC
NOP
Block data transfer instructions
Rev. 3.00, 05/03, page 436 of 472
@aa:24
—
—
—
@aa:16
—
—
—
@aa:8
@(d:8.PC)
@ERn+/@ERn
@(d:24.ERn)
@ERn
Rn
Instructions
#xx
Functions
@(d:16.ERn)
Addressing Mode
BWL BWL
—
—
—
—
Appendix B I/O Port Block Diagrams
B.1
I/O Port Block Diagrams
RES goes low in a reset, and SBY goes low at reset and in standby mode.
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
TRGV
Legend
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.1 Port 1 Block Diagram (P17)
Rev. 3.00, 05/03, page 437 of 472
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
Legend
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.2 Port 1 Block Diagram (P14, P16)
Rev. 3.00, 05/03, page 438 of 472
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
TMIB1
Legend
PUCR : Port pull-up control register
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.3 Port 1 Block Diagram (P15)
Internal data bus
PUCR
Pull-up MOS
PDR
PCR
Legend
PUCR : Port pull-up control register
PDR : Port data register
PCR : Port control register
Figure B.4 Port 1 Block Diagram (P12)
Rev. 3.00, 05/03, page 439 of 472
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
14-bit PWM
PWM
Legend
PUCR : Port pull-up control register
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.5 Port 2 Block Diagram (P11)
Rev. 3.00, 05/03, page 440 of 472
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
RTC
TMOW
Legend
PUCR : Port pull-up control register
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.6 Port 1 Block Diagram (P10)
Internal data bus
PMR
PDR
PCR
Legend
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.7 Port 2 Block Diagram (P24, P23)
Rev. 3.00, 05/03, page 441 of 472
Internal data bus
PMR
PDR
PCR
SCI3
TxD
Legend
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.8 Port 2 Block Diagram (P22)
Rev. 3.00, 05/03, page 442 of 472
Internal data bus
PDR
PCR
SCI3
RE
RxD
Legend
PDR: Port data register
PCR: Port control register
Figure B.9 Port 2 Block Diagram (P21)
Rev. 3.00, 05/03, page 443 of 472
SCI3
SCKIE
SCKOE
Internal data bus
PDR
PCR
SCKO
SCKI
Legend
PDR: Port data register
PCR: Port control register
Figure B.10 Port 2 Block Diagram (P20)
Rev. 3.00, 05/03, page 444 of 472
Internal data bus
PDR
PCR
Legend
PDR : Port data register
PCR : Port control register
Figure B.11 Port 3 Block Diagram (P37 to P30)
Internal data bus
PMR
PDR
PCR
IIC2
ICE
SDAO/SCLO
SDAI/SCLI
Legend
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.12 Port 5 Block Diagram (P57, P56)*
Note: * This diagram is applied to the SCL and SDA pins in the H8/3687N.
Rev. 3.00, 05/03, page 445 of 472
Internal data bus
PUCR
Pull-up MOS
PMR
PDR
PCR
Legend
PUCR: Port pull-up control register
PMR: Port mode register
PDR: Port data register
PCR: Port control register
Figure B.13 Port 5 Block Diagram (P54 to P50)
Rev. 3.00, 05/03, page 446 of 472
Internal data bus
Timer Z
Output control
signals A to D
PDR
PCR
FTIOA to
FTIOD
Legend
PDR : Port data register
PCR : Port control register
Figure B.14 Port 6 Block Diagram (P67 to P60)
Rev. 3.00, 05/03, page 447 of 472
Internal data bus
Timer V
OS3
OS2
OS1
OS0
PDR
PCR
TMOV
Legend
PDR: Port data register
PCR: Port control register
Figure B.15 Port 7 Block Diagram (P76)
Rev. 3.00, 05/03, page 448 of 472
Internal data bus
PDR
PCR
Timer V
TMCIV
Legend
PDR: Port data register
PCR: Port control register
Figure B.16 Port 7 Block Diagram (P75)
Rev. 3.00, 05/03, page 449 of 472
Internal data bus
PDR
PCR
Timer V
TMRIV
Legend
PDR: Port data register
PCR: Port control register
Figure B.17 Port 7 Block Diagram (P74)
Rev. 3.00, 05/03, page 450 of 472
Internal data bus
PMR
PDR
PCR
SCI3_2
TxD
Legend
PMR : Port mode register
PDR : Port data register
PCR : Port control register
Figure B.18 Port 7 Block Diagram (P72)
Internal data bus
PDR
PCR
SCI3_2
RE
RxD
Legend
PDR : Port data register
PCR : Port control register
Figure B.19 Port 7 Block Diagram (P71)
Rev. 3.00, 05/03, page 451 of 472
SCI3_2
SCKIE
SCKOE
Internal data bus
PDR
PCR
SCKO
SCKI
Legend
PDR : Port data register
PCR : Port control register
Figure B.20 Port 7 Block Diagram (P70)
Rev. 3.00, 05/03, page 452 of 472
Internal data bus
PDR
PCR
Legend
PDR: Port data register
PCR: Port control register
Figure B.21 Port 8 Block Diagram (P87 to P85)
Internal data bus
A/D converter
CH3 to CH0
DEC
VIN
Figure B.22 Port B Block Diagram (PB7 to PB0)
Rev. 3.00, 05/03, page 453 of 472
B.2
Port States in Each Operating State
Port
Reset
Sleep
Subsleep
Standby
P17 to P14,
P12 to P10
High
impedance
Retained
Retained
High
Functioning
1
impedance*
Functioning
P24 to P20
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P37 to P30
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P57 to P50*
High
impedance
Retained
Retained
High
Functioning
1
impedance*
Functioning
P67 to P60
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P76 to P74,
P72 to P70
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
P87 to P85
High
impedance
Retained
Retained
High
impedance
Functioning
Functioning
PB7 to PB0
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
High
impedance
2
Notes: 1. High level output when the pull-up MOS is in on state.
2. The P55 to P50 pins are applied to the H8/3687N.
Rev. 3.00, 05/03, page 454 of 472
Subactive
Active
Appendix C Product Code Lineup
Product Classification
Product Code Model Marking
Package Code
H8/3687
HD64F3687H
HD64F3687H
QFP-64 (FP-64A)
HD64F3687FP
HD64F3687FP
LQFP-64 (FP-64E)
Product with HD64F3687GH
POR & LVDC
HD64F3687GH
QFP-64 (FP-64A)
Standard
product
Flash memory Standard
version
product
Mask ROM
version
HD64F3687GFP HD64F3687GFP
LQFP-64 (FP-64E)
HD6433687H
HD6433687(***)H
QFP-64 (FP-64A)
HD6433687FP
HD6433687(***)FP
LQFP-64 (FP-64E)
Product with HD6433687GH
POR & LVDC
HD6433687G(***)H
QFP-64 (FP-64A)
Standard
product
HD6433686H
HD6433686(***)H
QFP-64 (FP-64A)
HD6433686FP
HD6433686(***)FP
LQFP-64 (FP-64E)
HD6433687GFP HD6433687G(***)FP LQFP-64 (FP-64E)
H8/3686
Mask ROM
version
Product with HD6433686GH HD6433686G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433686GFP HD6433686G(***)FP LQFP-64 (FP-64E)
H8/3685
Mask ROM
version
Standard
product
HD6433685H
HD6433685(***)H
QFP-64 (FP-64A)
HD6433685FP
HD6433685(***)FP
LQFP-64 (FP-64E)
Product with HD6433685GH
POR & LVDC
HD6433685G(***)H
QFP-64 (FP-64A)
HD6433685GFP HD6433685G(***)FP LQFP-64 (FP-64E)
H8/3684
Flash memory Standard
version
product
Mask ROM
version
HD64F3684H
HD64F3684H
QFP-64 (FP-64A)
HD64F3684FP
HD64F3684FP
LQFP-64 (FP-64E)
Product with HD64F3684GH
POR & LVDC
HD64F3684GH
QFP-64 (FP-64A)
Standard
product
HD64F3684GFP HD64F3684GFP
LQFP-64 (FP-64E)
HD6433684H
HD6433684(***)H
QFP-64 (FP-64A)
HD6433684FP
HD6433684(***)FP
LQFP-64 (FP-64E)
Product with HD6433684GH HD6433684G(***)H QFP-64 (FP-64A)
POR & LVDC HD6433684GFP HD6433684G(***)FP LQFP-64 (FP-64E)
H8/3683
Mask ROM
version
Standard
product
HD6433683H
HD6433683(***)H
QFP-64 (FP-64A)
HD6433683FP
HD6433683(***)FP
LQFP-64 (FP-64E)
Product with HD6433683GH
POR & LVDC
HD6433683G(***)H
QFP-64 (FP-64A)
Standard
product
HD6433682H
HD6433682(***)H
QFP-64 (FP-64A)
HD6433682FP
HD6433682(***)FP
LQFP-64 (FP-64E)
Product with HD6433682GH
POR & LVDC
HD6433682G(***)H
QFP-64 (FP-64A)
HD6433683GFP HD6433683G(***)FP LQFP-64 (FP-64E)
H8/3682
Mask ROM
version
HD6433682GFP HD6433682G(***)FP LQFP-64 (FP-64E)
Rev. 3.00, 05/03, page 455 of 472
Product Classification
Product Code Model Marking
H8/3687 EEPROM Flash
Product with HD64N3687GFP HD64N3687GFP
laminated memory POR & LVDC
version
version
Mask
ROM
version
LQFP-64 (FP-64E)
HD6483687GFP HD6483687G(***)FP LQFP-64 (FP-64E)
Legend
(***): ROM code.
POR & LVDC: Power-on reset and low-voltage detection circuits.
Rev. 3.00, 05/03, page 456 of 472
Package Code
Appendix D Package Dimensions
The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have
priority.
Unit: mm
12.0 ± 0.2
10
48
33
32
64
17
0.5
12.0 ± 0.2
49
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
1.25
1.45
0.08 M
1.70 Max
16
0.10 ± 0.10
1
*0.22 ± 0.05
0.20 ± 0.04
1.0
0
8
0.5 ± 0.2
Package Code
JEDEC
EIAJ
Mass (reference value)
FP-64E
Conforms
0.4 g
Figure D.1 FP-64E Package Dimensions
Rev. 3.00, 05/03, page 457 of 472
Unit: mm
17.2 ± 0.3
14
33
48
32
0.8
17.2 ± 0.3
49
64
17
1
0.10
*Dimension including the plating thickness
Base material dimension
*0.17 ± 0.05
0.15 ± 0.04
3.05 Max
1.0
2.70
0.15 M
0.10 +0.15
- 0.10
*0.37 ± 0.08
0.35 ± 0.06
16
0
0.8 ± 0.3
Renesas Code
JEDEC
EIAJ
Mass (reference value)
Figure D.2 FP-64A Package Dimensions
Rev. 3.00, 05/03, page 458 of 472
1.6
FP-64A
Conforms
1.2 g
8
Appendix E EEPROM Laminated-Structure Cross-Sectional
View
Figure E.1 EEPROM Laminated-Structure Cross-Sectional View
Rev. 3.00, 05/03, page 459 of 472
Rev. 3.00, 05/03, page 460 of 472
Main Revisions and Additions in this Edition
Item
Page Revision (See Manual for Details)
H8/3687N (EEPROM version) added (HD64N3687G,
HD6483687G)
All
Section 1 Overview
2
•
On-chip memory
1.1 Features
Model
Standard
Product Classification
Version
EEPROM Flash
H8/3687N
laminated memory
version
version
(512 bytes)
Mask
ROM
version
2
•
On-Chip
Power-On
Reset and
Low-Voltage
Detecting
Circuit Version ROM
RAM
Remarks
HD64N3687G
56
4
kbytes kbytes
Under
development
HD6483687G
56
3
kbytes kbytes
Under
development
General I/O ports
I/O pins: 45 I/O pins (43 I/O pins for H8/3687N)
•
EEPROM interface (only for H8/3687N)
I C bus interface (conforms to the I C bus interface
format that is advocated by Philips Electronics)
2
•
2
Compact package
Only LQFP-64 (FP-64E) for H8/3687N package
1.2 Internal Block Diagram 3
Data bus (lower)
Figure 1.1 Internal Block
Diagram of H8/3687
TM
Group of F-ZTAT and
Mask-ROM Versions
ROM
RTC
14-bit
PWM
Timer Z
Timer V
4
(Added)
Figure 1.2 Internal Block Diagram of H8/3687N (EEPROM
Laminated Version)
Rev. 3.00, 05/03, page 461 of 472
Item
Page Revision (See Manual for Details)
1.3 Pin Arrangement
6
(Added)
Figure 1.4 Pin Arrangement of H8/3687N (EEPROM Laminated
Version) (FP-64E)
1.4 Pin Functions
7
Table 1.1 Pin Functions
Type
Symbol
Functions
System
control
RES
Reset pin. The pull-up resistor (typ. 150
kΩ) is incorporated. When driven low,
the chip is reset.
8, 9
Pin No.
Type
FP-64E
FP-64A
I/O
1
26
I/O
1
Symbol
2
I C bus
interface
(IIC)
SDA*
SCL*
27
I/O
(EEPROM: Input)
I/O ports
P57 to P50
13, 14,
19 to 22,
2
2
26* , 27*
I/O
2
Notes: 1. These pins are only available for the I C bus
2
interface in the H8/3687N. Since the I C bus is
disabled after canceling a reset, the ICE bit in
ICCR1 must be set to 1 by using the program.
2. The P57 and P56 pins are not available in the
H8/3687N.
Section 2 CPU
14
2.1 Address Space and
Memory Map
(Added)
Figure 2.1 Memory Map (3) (On-chip EEPROM module)
2.6.2 On-Chip Peripheral
Modules
39
Section 3 Exception
Handling
60
When a register with 8-bit data bus width is accessed by word
size, a bus cycle occurs twice.
States
Total
1 to 23
15 to 37
Function
Subactive
Mode
3.4.4 Interrupt Response
Time
Table 3.2 Interrupt Wait
States
Section 6 Power-Down
Modes
83
6.2 Mode Transitions and
States of LSI
Table 6.3 Internal State in
Each Operating Mode
Rev. 3.00, 05/03, page 462 of 472
Peripheral Timer Z
functions
Subsleep
Mode
Standby Mode
Retained (the counter increments according to
subclocks if the internal clock (φ) is selected as
a count clock*)
Item
Page Revision (See Manual for Details)
Section 7 ROM
94
Transfer of number of bytes of
programming control program
Bit rate adjustment
95
Host Operation
Item
7.3.1 Boot Mode
7. End the reset after driving the reset pin low, waiting at least
20 states, and then setting the NMI pin.
Continuously transmits data H'00
at specified bit rate.
Transmits data H'55 when data H'00
is received error-free.
102
Section 8 RAM
105
H'00, H'00 . . . H'00
H'00
H'55
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte)
Transmits 1-byte of programming
control program (repeated for N times)
H'AA reception
7.5.3 Error Protection
Communication Contents
LSI Operation
Processing Contents
Processing Contents
H'55 reception.
Upper bytes, lower bytes
Echoback
H'XX
Echoback
H'AA
• Measures low-level period of receive data
H'00.
• Calculates bit rate and sets BRR in SCI3.
• Transmits data H'00 to host as adjustment
end indication.
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transmits data H'AA to host.
Error protection can be cleared only by a reset.
Product Classification
EEPROM
laminated
version
Flash
memory
version
MaskROM
version
RAM Size
RAM Address
H8/3687N 4 kbytes
H'E800 to H'EFFF,
H'F780 to H'FF7F*
3 kbytes
H'E800 to H'EFFF,
H'FB80 to H'FF7F
Note: * When the E10T is used, area H'F780 to H'FB7F must
not be accessed.
Section 9 I/O Ports
107
The group of this LSI has forty-five general I/O ports (forty-three
general I/O ports in the H8/3687N) and eight general input-only
ports.
9.4 Port 5
119
(Added)
9.4.2 Port Control
Register 5 (PCR5)
121
(Added)
Figure 9.4 Port 5 Pin Configuration (H8/3687N)
9.4.3 Port Data Register 5
(PDR5)
Note: The PCR57 and PCR56 bits should not be set to 1 in the
H8/3687N.
(Added)
Note: The P57 and P56 bits should not be set to 1 in the
H8/3687N.
Rev. 3.00, 05/03, page 463 of 472
Item
Page Revision (See Manual for Details)
Section 10 Realtime Clock 146
(RTC)
Figure 10.3 shows the procedure for the initial setting of the
RTC. To set the RTC again, also follow this procedure.
10.4.2 Initial Setting
Procedure
RTC operation is stopped.
RUN in RTCCR1 = 0
Figure 10.3 Initial Setting
Procedure
RST in RTCCR1 = 1
RTC registers and clock count
controller are reset.
RST in RTCCR1 = 0
Set RTCCSR, RSECDR,
RMINDR, RHRDR,
RWKDR, 12/24 in
RTCCR1, and PM
Clock output and clock source are
selected and second, minute, hour,
day-of-week, operating mode, and
a.m/p.m are set.
RTC operation is started.
RUN in RTCCR1 = 1
Section 12 Timer V
160
12.3.4 Timer
Control/Status Register V
(TCSRV)
Section 13 Timer Z
182
Bit Name
Description
3
OS3
Output Select 3 and 2
2
OS2
These bits select an output method for the
TMOV pin by the compare match of
TCORB and TCNTV.
1
OS1
Output Select 1 and 0
0
OS0
These bits select an output method for the
TMOV pin by the compare match of
TCORA and TCNTV.
(Added)
Note: The change of the setting is immediately reflected in the
output value.
13.3.6 Timer Output
Control Register (TOCR)
13.4.8 Buffer Operation
Bit
219
φ
Figure 13.39 Example of
Compare Match Timing
for Buffer Operation
TCNT
n
Compare match
signal
Buffer transfer
signal
GRC
GRA
Section 15 14-Bit PWM
241
15.4 Operation
Rev. 3.00, 05/03, page 464 of 472
N
n
1. Set the PWM bit in the port mode register 1 (PMR1) to set
the P11/PWM pin to function as a PWM output pin.
Item
Page Revision (See Manual for Details)
Section 16 Serial
Communication Interface
3 (SCI3)
244
(Added) Note in table 16.1, Channel Configuration
Note: * The channel 1 of the SCI3 is used in on-board
programming mode by boot mode.
16.1 Features
Section 19 EEPROM
329 to (Added)
340
Section 20 Power-On
Reset and Low-Voltage
Detection Circuits
(Optional)
341 to (Changed)
348
Section 22 List of
Registers
357,
362,
366
23.2 Electrical
369
Characteristics (F-ZTAT™
Version, EEPROM
TM
Laminated F-ZTAT
Version)
(Added) EEPROM added.
(Added) Range of Power Supply Voltage and Oscillation
Frequency when Low-Voltage Detection Circuit is Used
23.2.1 Power Supply
Voltage and Operating
Ranges
23.2.2 DC Characteristics 374
(Added) Table 23.2 DC Characteristics (2) EEPROM current
consumption
23.2.3 AC Characteristics 376
23.2.7 EEPROM
Characteristics
384
Values
Item
Symbol
Test Condition
Min
External clock
high width
tCPH
VCC = 4.0 to 5.5 V
20.0
External clock
low width
tCPL
40.0
VCC = 4.0 to 5.5 V
20.0
40.0
(Added) Table 23.9 EEPROM Characteristics
23.2.8 Power-Supply385
Voltage Detection Circuit
Characteristics (Optional)
(Changed) Table 23.10 Power-Supply-Voltage Detection Circuit
Characteristics
23.2.9 Power-On Reset
Circuit Characteristics
(Optional)
(Added) Table 23.11 Power-On Reset Circuit Characteristics
385
Rev. 3.00, 05/03, page 465 of 472
Item
Page Revision (See Manual for Details)
23.3 Electrical
Characteristics (MaskROM Version, EEPROM
Laminated Mask-ROM
Version)
387
(Added) Range of Power Supply Voltage and Oscillation
Frequency when Low-Voltage Detection Circuit is Used
23.3.1 Power Supply
Voltage and Operating
Ranges
23.3.2 DC Characteristics 393
(Added) Table 23.12 DC Characteristics (2) EEPROM current
consumption
23.3.3 AC Characteristics 395
23.3.6 EEPROM
Characteristics
401
Values
Item
Symbol
Test Condition
Min
External clock
high width
tCPH
VCC = 4.0 to 5.5 V
20.0
External clock
low width
tCPL
40.0
VCC = 4.0 to 5.5 V
20.0
40.0
(Added) Table 23.18 EEPROM Characteristics
23.3.7 Power-Supply402
Voltage Detection Circuit
Characteristics (Optional)
(Changed) Table 23.19 Power-Supply-Voltage Detection Circuit
Characteristics
23.3.8 Power-On Reset
Circuit Characteristics
(Optional)
402
(Added) Table 23.20 Power-On Reset Circuit Characteristics
23.4 Operation Timing
405
(Added) Figure 23.7 EEPROM Bus Timing
Appendix
426
A.3 Number of Execution
States
B.1 I/O Port Block
Diagrams
Access Location
Execution Status
(Instruction Cycle)
445
Rev. 3.00, 05/03, page 466 of 472
On-Chip
Memory
On-Chip
Peripheral Module
2
—
Instruction fetch
SI
Branch address
read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
2 or 3*
Internal operation
SN
1
(Added) Note in figure B.12 Port 5 Block Diagram (P57, P56)*
Note: * This diagram is applied to the SCL and SDA pins in the
H8/3687N.
Item
Page Revision (See Manual for Details)
B.2 Port States in Each
Operating State
454
(Added) Note
Notes: 2. The P55 to P50 pins are applied to the H8/3687N.
Appendix C Product Code 456
Lineup
Product Classification
H8/3687
Product Code
EEPROM Flash
laminated memory
version
version
Mask ROM
version
Appendix E EEPROM
Laminated-Structure
Cross-Sectional View
459
Product
HD64N3687GFP
with POR
& LVDC
HD6483687GFP
Model Marking
Package Code
HD64N3687GFP
LQFP-64
(FP-64E)
HD6483687G(***)FP
LQFP-64
(FP-64E)
(Added) Figure E.1 EEPROM Laminated-Structure CrossSectional View
Rev. 3.00, 05/03, page 467 of 472
Rev. 3.00, 05/03, page 468 of 472
Index
14-bit PWM ............................................ 239
Register settings.................................. 241
Waveform output ................................ 242
A/D converter ......................................... 317
Sample-and-hold circuit...................... 324
Scan mode........................................... 323
Single mode ........................................ 323
Address break ........................................... 63
Addressing modes..................................... 33
Absolute address ................................... 34
Immediate ............................................. 35
Memory indirect ................................... 35
Program-counter relative ...................... 35
Register direct ....................................... 33
Register indirect.................................... 33
Register indirect with displacement...... 34
Register indirect with post-increment ... 34
Register indirect with pre-decrement .... 34
Clock pulse generators.............................. 69
Prescaler S ............................................ 73
Prescaler W........................................... 73
Subclock generator ............................... 72
System clock generator ......................... 70
Condition field .......................................... 32
Condition-code register (CCR) ................. 17
CPU .......................................................... 11
EEPROM ................................................ 329
Acknowledge ...................................... 333
Acknowledge polling .......................... 336
Byte write............................................ 334
Current address read ........................... 336
EEPROM interface ............................. 332
Page write ........................................... 335
Random address read .......................... 338
Sequential read.................................... 338
Slave address reference register
(ESAR) ............................................... 333
Slave addressing..................................333
Start condition .....................................332
Stop condition .....................................333
Effective address .......................................36
Effective address extension.......................32
Exception handling....................................47
Reset exception handling ......................56
Stack status............................................60
Trap instruction .....................................47
Flash memory............................................87
Boot mode .............................................93
Boot program ........................................93
Erase/erase-verify..................................99
Erasing units..........................................87
Error protection ...................................102
Hardware protection............................102
Power-down states ..............................103
Program/program-verify........................97
Programmer mode...............................103
Programming units ................................87
Programming/erasing in user program
mode......................................................96
Software protection .............................102
General registers .......................................16
I/O ports ..................................................107
I/O port block diagrams.......................437
I2C bus format .........................................298
I2C bus interface 2 (IIC2) ........................285
Acknowledge ......................................298
Bit synchronous circuit .......................315
Clock synchronous serial format.........307
Noise canceler .....................................309
Slave address.......................................298
Start condition .....................................298
Stop condition .....................................299
Transfer rate ........................................289
Rev. 3.00, 05/03, page 469 of 472
Instruction set............................................ 22
Arithmetic operations instructions........ 24
Bit manipulation instructions................ 27
Block data transfer instructions ............ 31
Branch instructions ............................... 29
Data transfer instructions ...................... 23
Logic operations instructions................ 26
Shift instructions................................... 26
System control instructions................... 30
Internal power supply step-down
circuit ...................................................... 349
Interrupt
Internal interrupts.................................. 58
Interrupt response time ......................... 60
IRQ3 to IRQ0 interrupts ....................... 57
NMI interrupt........................................ 57
WKP5 to WKP0 interrupts ................... 57
Interrupt mask bit...................................... 18
Laminated-structure cross-sectional view
of H8/3687N ........................................... 459
Large current ports...................................... 2
Low-voltage detection circuit ................. 341
LVDI....................................................... 347
LVDI (interrupt by low voltage detect)
circuit ...................................................... 347
LVDR ..................................................... 346
LVDR (reset by low voltage detect)
circuit ...................................................... 346
Memory map............................................. 12
Module standby function .......................... 86
On-board programming modes ................. 93
Operation field .......................................... 32
Package....................................................... 2
Package dimensions................................ 457
Pin arrangement .......................................... 5
Power-down modes .................................. 75
Sleep mode ........................................... 83
Standby mode ....................................... 84
Subactive mode..................................... 85
Rev. 3.00, 05/03, page 470 of 472
Subsleep mode ...................................... 84
Power-on reset ........................................ 341
Power-on reset circuit ............................. 345
Product code lineup................................. 455
Program counter (PC) ............................... 17
Realtime clock (RTC) ............................. 137
Data reading procedure ....................... 146
Initial setting procedure ...................... 146
Register
ABRKCR ...................... 64, 355, 361, 365
ABRKSR....................... 65, 355, 361, 365
ADCR ......................... 322, 355, 361, 365
ADCSR ....................... 321, 355, 360, 365
ADDRA ...................... 320, 355, 360, 365
ADDRB....................... 320, 355, 360, 365
ADDRC....................... 320, 355, 360, 365
ADDRD ...................... 320, 355, 360, 365
BARH ........................... 65, 355, 361, 365
BARL............................ 65, 355, 361, 365
BDRH ........................... 65, 355, 361, 365
BDRL............................ 65, 355, 361, 365
BRR ............................ 253, 355, 360, 365
EBR1............................. 91, 354, 360, 364
EKR ............................ 331, 357, 362, 366
FENR ............................ 92, 354, 360, 364
FLMCR1 ....................... 89, 354, 360, 364
FLMCR2 ....................... 90, 354, 360, 364
FLPWCR....................... 92, 354, 360, 364
GRA ............................ 182, 352, 358, 363
GRB ............................ 182, 352, 358, 363
GRC ............................ 182, 352, 358, 363
GRD ............................ 182, 352, 358, 363
ICCR1 ......................... 288, 354, 359, 364
ICCR2 ......................... 289, 354, 359, 364
ICDRR ........................ 297, 354, 360, 364
ICDRS................................................. 297
ICDRT ........................ 297, 354, 360, 364
ICIER .......................... 292, 354, 359, 364
ICMR .......................... 291, 354, 359, 364
ICSR............................ 294, 354, 359, 364
IEGR1 ........................... 50, 356, 362, 366
IEGR2 ........................... 51, 356, 362, 366
IENR1 ........................... 52, 357, 362, 366
IENR2 ........................... 53, 357, 362, 366
IRR1.............................. 54, 357, 362, 366
IRR2.............................. 55, 357, 362, 366
IWPR ............................ 55, 357, 362, 366
LVDCR....................... 342, 353, 359, 364
LVDSR ....................... 344, 353, 359, 364
MSTCR1....................... 79, 357, 362, 366
MSTCR2....................... 80, 357, 362, 366
PCR1........................... 109, 356, 361, 366
PCR2........................... 113, 356, 361, 366
PCR3........................... 116, 356, 361, 366
PCR5........................... 121, 356, 361, 366
PCR6........................... 125, 356, 362, 366
PCR7........................... 129, 356, 362, 366
PCR8........................... 132, 356, 362, 366
PDR1 .......................... 109, 356, 361, 365
PDR2 .......................... 113, 356, 361, 365
PDR3 .......................... 117, 356, 361, 365
PDR5 .......................... 121, 356, 361, 365
PDR6 .......................... 125, 356, 361, 365
PDR7 .......................... 130, 356, 361, 365
PDR8 .......................... 133, 356, 361, 366
PDRB.......................... 135, 356, 361, 366
PMR1.......................... 108, 356, 361, 366
PMR3.......................... 114, 356, 361, 366
PMR5.......................... 120, 356, 361, 366
POCR.......................... 189, 352, 358, 363
PUCR1........................ 110, 355, 361, 365
PUCR5........................ 122, 356, 361, 365
PWCR ......................... 240, 355, 361, 365
PWDRL ...................... 241, 355, 361, 365
PWDRU...................... 241, 355, 361, 365
RDR ............................ 247, 355, 360, 365
RHRDR....................... 141, 353, 359, 363
RMINDR .................... 140, 353, 359, 363
RSECDR..................... 140, 353, 359, 363
RSR..................................................... 247
RTCCR1 ..................... 143, 353, 359, 364
RTCCR2 ..................... 144, 353, 359, 364
RTCCSR ..................... 145, 353, 359, 364
RWKDR ..................... 142, 353, 359, 364
SAR............................. 296, 354, 359, 364
SCR3 ........................... 249, 355, 360, 365
SMR ............................ 248, 355, 360, 365
SSR ............................. 251, 355, 360, 365
SYSCR1 ........................ 76, 356, 362, 366
SYSCR2 ........................ 78, 356, 362, 366
TCB1........................... 151, 354, 360, 364
TCNT .......................... 182, 352, 358, 363
TCNTV ....................... 157, 354, 360, 364
TCORA ....................... 157, 354, 360, 364
TCORB ....................... 157, 354, 360, 364
TCR............................. 183, 352, 358, 363
TCRV0 ........................ 158, 354, 360, 364
TCRV1 ........................ 161, 354, 360, 364
TCSRV........................ 160, 354, 360, 364
TCSRWD .................... 236, 355, 361, 365
TCWD......................... 237, 355, 361, 365
TDR............................. 247, 355, 360, 365
TFCR........................... 178, 353, 359, 363
TIER............................ 188, 352, 358, 363
TIORA ........................ 184, 352, 358, 363
TIORC......................... 185, 352, 358, 363
TLB1 ...................................................152
TMB1.......................... 151, 354, 360, 364
TMDR ......................... 176, 353, 359, 363
TMWD........................ 237, 355, 361, 365
TOCR.......................... 181, 353, 359, 363
TOER .......................... 180, 353, 359, 363
TPMR.......................... 177, 353, 359, 363
TSR ............................. 186, 352, 358, 363
TSTR........................... 176, 353, 359, 363
Register field .............................................32
Serial communication interface 3 (SCI3) 243
Asynchronous mode............................260
Bit rate.................................................253
Break ...................................................283
Clocked synchronous mode ................268
Framing error ......................................264
Multiprocessor communication function
............................................................275
Overrun error.......................................264
Parity error ..........................................264
Stack pointer (SP) .....................................17
Rev. 3.00, 05/03, page 471 of 472
Timer B1................................................. 149
Auto-reload timer operation................ 152
Event counter operation ...................... 153
Interval timer operation ...................... 152
Timer V................................................... 155
Timer Z ................................................... 169
Buffer operation.................................. 216
Complementary PWM mode .............. 210
Input capture function......................... 197
Rev. 3.00, 05/03, page 472 of 472
PWM mode ......................................... 200
Reset synchronous PWM mode .......... 206
Synchronous operation........................ 199
Waveform output by compare match .. 194
Vector address........................................... 48
Watchdog timer....................................... 235
H8/3687 Group Hardware Manual
Publication Date: 1st Edition, July, 2001
Rev.3.00, May 29, 2003
Published by:
Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by:
Technical Documentation & Information Department
Renesas Kodaira Semiconductor Co., Ltd.
2001, 2003 Renesas Technology Corp. All rights reserved. Printed in Japan.
H8/3687Group
REJ09B0027-0300Z