LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Voltage Mode Active Clamp Controller Check for Samples: LM5027A FEATURES DESCRIPTION • • • • The LM5027A is a functional variant of the LM5027 active clamp PWM controller. The functional difference of the LM5027A is that the maximum duty cycle of the LM5027A is decreased from 91% to 71%. In addition, the oscillator timing equation has been modified. 1 2 • • • • • • • • • Voltage-Mode Control Line Feed-Forward PWM Ramp Internal 105V Rated Start-Up Bias Regulator Programmable Line Under-Voltage Lockout (UVLO) with Adjustable Hysteresis Versatile Dual Mode Over-Current Protection Programmable Volt-Second Limiter and SoftStart Programmable Synchronous Rectifier SoftStart and Stop Precise 500mV Over-Current Comparator Current Sense Leading Edge Blanking Programmable Oscillator With 1 MHz Maximum Frequency and Synchronization Capability Precision 5V Reference Programmable Time Delays Between Outputs A 70% Maximum Duty Cycle The LM5027A pulse-width modulation (PWM) controller contains all of the features necessary to implement power converters utilizing the Active Clamp / Reset technique. With the active clamp technique, higher efficiencies and greater power densities can be realized compared to conventional catch winding or RDC clamp / reset techniques. Three control outputs are provided: the main power switch control (OUTA), the active clamp switch control (OUTB), and secondary side synchronous rectifier control (OUTSR). The timing between the control outputs is adjustable with external resistors that program internal precision timers. This controller is designed for high-speed operation including an oscillator frequency range up to 1 MHz and total PWM propagation delays less than 50 ns. The LM5027A includes a high-voltage startup regulator with a maximum input voltage rating of 105V. Additional features include Line Under Voltage Lockout (UVLO), separate soft-start of main and synchronous rectifier outputs, a timer for hiccup mode current limiting, a precision reference, and thermal shutdown. Packages • • HTSSOP-20 WQFN-24 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2013, Texas Instruments Incorporated LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Typical Application Circuit VIN VOUT CS LM5027A VCC Vin OUTA RAMP OUTB UVLO OUTSR TIME3 COMP REF OTP RT TIME1 AGND SSSR ERROR AMP and ISOLATION TIME2 RES SS PGND Figure 1. Simplified Active Clamp Converter 2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 4 17 RES TIME1 5 16 SS AGND 6 15 CS RT 7 14 VCC EP COMP 8 13 PGND REF 9 12 OUTSR OUTB 10 11 OUTA OTP SSSR TIME2 24 23 22 21 20 RAMP 1 19 SSSR TIME 3 2 18 RES TIME 2 3 17 SS TIME 1 4 16 CS AGND 5 15 VCC RT 6 14 VCC COMP 7 13 PGND Figure 2. 20-Lead HTSSOP EP 8 9 10 11 12 PGND OTP 18 UVLO 19 OUTSR 2 3 NC RAMP TIME3 OUTA UVLO VIN 20 OUTB 1 REF VIN NC Connection Diagram Figure 3. 24-Lead WQFN Table 1. Pin Descriptions Pin (1) (1) Name Description Application Information Input voltage source Input to the Start-up Regulator. Operating input range is 13V to 90V. The Absolute Maximum Rating is 105V. For power sources outside of this range, the LM5027A can be biased directly at VCC by an external regulator. RAMP Feed-forward modulation ramp An external RC circuit from VIN sets the PWM ramp slope. This pin is discharged at the conclusion of every cycle by an internal FET. An internal comparator terminates the PWM pulse if the RAMP pin exceeds 2.5V thus limiting the maximum volt-second product to the transformer primary. 3 TIME3 Overlap delay 3 An external resistor sets the overlap delay for the active clamp output. The RTIME3 resistor connected between TIME3 and AGND sets the OUTA turn-off (falling edge) to OUTB turn-on (falling edge) pulse delay. See Figure 26. 4 TIME2 Overlap delay 2 An external resistor sets the overlap delay for the OUTSR output. The RTIME2 resistor connected between TIME2 and AGND sets the OUTA turn-off (falling edge) to OUTSR turn-on (rising edge) pulse delay. See Figure 26. 5 TIME1 Overlap delay 1 An external resistor sets the overlap delay for the active clamp output. The RTIME1 resistor connected between TIME1 and AGND sets the OUTB and OUTSR turnoff to OUTA turn-on pulse delay. See Figure 26. 6 AGND Analog ground Connect directly to Power Ground. 7 RT Oscillator frequency control and sync clock input Normally biased at 2V by an internal amplifier. An external resistor connected between RT and AGND sets the internal oscillator frequency. The internal oscillator can be synchronized to an external clock with a frequency higher than the free running frequency set by the RT resistor. 8 COMP Input to the pulse width modulator An external opto-coupler connected to the COMP pin sources current into an internal NPN current mirror. The PWM duty cycle is at its maximum value with zero input current, while 1mA reduces the duty cycle to zero. The current mirror improves the frequency response by reducing the ac voltage across the optocoupler detector transistor. 9 REF Reference Output Output of a 5V reference. Maximum output current is 10 mA. Locally decouple with a 0.1 µF capacitor. 1 VIN 2 Note: The pin numbers shown are only for the HTSSOP package. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 3 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Table 1. Pin Descriptions (continued) Pin 4 (1) Name Description Application Information 10 OUTB Output driver Control output of the active clamp PFET gate. Capable of 1A peak source and sink current. 11 OUTA Output driver Control output of the main PWM NFET gate. Capable of 2A peak source and sink current. 12 OUTSR Output driver Control output of the secondary side synchronous rectifier FET gates. Capable of 3A peak source and sink current. 13 PGND Power ground Connect directly to Analog Ground 14 VCC Start-up regulator output Output of the internal high voltage start-up regulator. Regulated at 9.5V during start-up and 7.5V during run mode. If the auxiliary winding raises the voltage on this pin above the regulation set point, the internal start-up regulator will shutdown, thus reducing the IC power dissipation. 15 CS Current sense input Current sense input for cycle-by-cycle current limiting. If the CS pin exceeds 500mV the output pulse will be terminated, entering cycle-by-cycle current limit. An internal switch holds CS low for 100 ns after OUTA switches high to blank leading edge transients. 16 SS Soft-start Input An internal 22 µA current source charges an external capacitor to set the soft-start rate. 17 RES Restart timer If cycle-by-cycle current limit is reached during any cycle, a 22 µA current is sourced into the RES capacitor. If the RES capacitor voltage charges to 1.0V, a hiccup sequence is initiated. The SS and SSSR capacitors are discharged and the control outputs are disabled. The voltage on the RES capacitor is ramped between 4V and 2V eight times. After the eighth cycle, the SS capacitor is released and the normal start-up sequence begins. 18 SSSR Soft-start for synchronous rectifier output. An external capacitor and an internal 25 µA current source sets the soft-start and soft-stop ramps for the synchronous rectifier output (OUTSR). 19 OTP Over-Temperature Protection The OTP comparator can be used for over-temperature shutdown protection with an external NTC thermistor voltage divider setting the shutdown temperature. The OTP comparator threshold is 1.25V. Hysteresis is set by an internal current source that sources 20 µA into the external resistor divider when the OTP pin voltage is above the threshold. 20 UVLO Line under-voltage lockout An external voltage divider from the power source sets the shutdown and standby comparator levels. When UVLO reaches the 0.4V threshold, the VCC and REF regulators are enabled. When UVLO reaches the 2.0V threshold, the SS pin is released and the device enters the active mode. Hysteresis is set by an internal current source that pulls 20 µA from the external resistor divider when the UVLO pin is below the 2.0V threshold. EP Exposed pad, underside of package No electrical contact to the LM5027A integrated circuit. Connect to system ground plane for reduced thermal resistance. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN to GND -0.3V to 105V VCC to GND -0.3V to 16V UVLO to GND -0.3 to 8V All other inputs to GND -0.3 to 7V COMP Input Current COMP, REF 10 mA (3) ESD Rating, Human Body Model (4) 2kV Storage Temperature Range -55°C to 150°C Junction Temperature (1) (2) (3) (4) 150°C If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. It is not recommended that external power sources be connected to these pins. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Operating Ratings (1) VIN 13 to 90V VCC 8 to 15V Operating Junction Temperature (1) -40°C to +125°C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature range of –40°C to +125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, VCC = 10V, RT= 38.4K , No Load on OUTA, OUTB and OUTSR unless otherwise stated. Symbol Parameter Conditions Min Typ Max Units 6.8 mA 310 650 µA 9.9 VIN SUPPLY Ibias VIN Operating Current COMP and VCC Open, UVLO and OTP = 3V VIN Shutdown Current UVLO = 0V, Vin = 100 V VCC REGULATOR VccReg VCC Regulation No Load (SS<4V) 9.1 9.5 VCC Current Limit VCC=9.5V 55 65 mA V VCC Regulator load regulation IVCCREG 0 to 15 mA 75 mV VCC Under-voltage Lockout Voltage Positive going VCC VccReg –180mV VccReg – 100mV V VCC Regulation No Load 7.3 7.5 7.7 V VCC Under-voltage Lockout Voltage Negative going Vcc 5.7 6.0 6.3 V VCC Supply Current (Icc) Supply current into VCC form an external source, CGATE = OPEN, VCC 10V 6 mA REFERENCE SUPPLY Reference Voltage IREF = 0mA Reference Voltage Regulation IREF= 0 to 10mA Reference Current Limit REF Under-voltage Threshold UVLO >0.4V, VCC >9.5V 4.85 5.0 5.15 V 10 20 mV 10 17.5 3.8 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A mA V 5 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature range of –40°C to +125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, VCC = 10V, RT= 38.4K , No Load on OUTA, OUTB and OUTSR unless otherwise stated. Symbol Parameter Conditions Min Typ Max Units 1.9 2 2.1 V 20 25 µA UVLO/OTP THRESHOLDS UVLO Threshold UVLO Hysteresis Current UVLO UVLO Shutdown Threshold ULVLO voltage falling 16 0.3 V UVLO Standby Enable Threshold UVLO voltage rising 0.4 V OTP Shutdown Threshold OTP rising 1.21 1.25 1.29 V OTP Hysteresis Current OTP 15 20 24 µA SS Charging Current Source SS = 0V 17 22 26 µA 3.85 4.05 4.25 V 18 25 30 µA SSSR Discharge Current Source in Soft Stop 14 20 26 µA SSSR Falling Threshold for SS Soft Stop 1.5 2.2 3.0 V SOFT-START SS Rising Threshold for SSSR charge current enable SSSR Charging Current Source SS output low voltage SSSR = 0V, SS>4V Sinking 100 µA UVLO = 0 SSSR output low voltage 120 mV 100 mV OSCILLATOR Frequency1 RT = 38.4 kΩ 275 Sync Threshold 310 345 kHz 150 ns 2.85 Sync Pulse Width 15 V PWM COMPARATORS Delay to Output 50 COMP to PWM Offset 1.0 Duty Cycle Maximum OUTA, OUT_A = Tdelay_min 70 72.5 ns V 75 % 22 26 µA CURRENT LIMIT RESTART (RES Pin) RES Threshold 1.1 V Charge Source Current Level 1 VRES < 1.0V Charge Source Current Level 2 4.0V < VRES > 1.0V 4 5.0 6.5 µA Discharge Current Source VRES ramping down 4 5 7 µA Ratio of RES Threshold to SS Low VRES > 1V, Hiccup counter 550 mV 125 CURRENT LIMIT CS prop Cycle by cycle sense voltage threshold RAMP = 0 450 500 Current limit propagation delay CS step from 0 to 0.6V time to onset of OUTA transition (90%) Cgate = 0pen 30 ns RDS(ON) 5 Ω VOLTAGE FEED-FORWARD (RAMP Pin) RAMP Discharge Device VOLT-SECOND CLAMP Ramp Clamp Level 6 Delta RAMP measured from onset of OUTA to Ramp peak. Comp = 5V Submit Documentation Feedback 2.3 2.5 2.6 V Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature range of –40°C to +125°C. Unless otherwise specified, the following conditions apply: VIN = 48V, VCC = 10V, RT= 38.4K , No Load on OUTA, OUTB and OUTSR unless otherwise stated. Symbol Parameter Conditions Min Typ Max Units 0.15 0.5 V OUTA GATE DRIVER VOL OUTA Low-state Output Voltage IOUTA = 100 mA VOH OUTA High-state Output Voltage IOUTA = -100 mA, VOHL = VCC -VLO 0.21 V OUTA Rise Time C-load = 1000 pF 10 ns OUTA Fall Time C-load = 1000 pF 13 ns IOHL Peak OUTA Source Current VOUTA = 0V (VCC = 10V) 2 A IOLL Peak OUTA Sink Current VOUTA = VCC= 10V 2 A 0.35 OUTB GATE DRIVER VOL OUTB Low-state Output Voltage IOUTB = 100 mA 0.2 VOH OUTB High-state Output Voltage IOUTB = -100 mA, VOHL = VCC -VLO 0.31 V OUTB Rise Time C-load = 1000 pF 15 ns OUTB High Side Fall Time C-load = 1000 pF 13 ns IOHL Peak OUTB Source Current VOUTB = 0V (VCC = 10V) 1 A IOLL Peak OUTB Sink Current VOUTB = VCC= 10V 1 A 0.5 0.4 V OUTSR GATE DRIVER VOL OUTSR Low-state Output Voltage IOUTSR = 100 mA VOH OUTSR High-state Output Voltage IOUTSR = -100 mA, VOHL = VCC -VLO OUTSR Rise Time 0.1 0.25 0.2 V 0.11 V C-load = 1000 pF 12 ns OUTSR High Side Fall Time C-load = 1000 pF 10 ns IOHH Peak OUTSR Source Current VOUTSR = 0V (VCC = 10V) 3 A IOLH Peak OUTSR Sink Current VOUTSR = VCC= 10V 3 A OUTPUT TIMING CONTROL T1 Delay Leading Range RTIME1=10 kΩ – 100 kΩ 30 T1 Delay Leading Accuracy RTIME1 = 33.2 kΩ 75 T2 Delay Trailing Range RTIME2 = 10 kΩ – 100 kΩ 30 T2 Delay Trailing Accuracy RTIME2 = 28.7 kΩ 75 T3 Delay Leading Range RTIME3 = 10 kΩ – 100 kΩ 30 T3 Delay Leading Accuracy RTIME3 = 29.4 kΩ 75 100 150 100 100 300 ns 125 ns 300 ns 125 ns 300 ns 125 ns THERMAL tsd Thermal Shutdown Temp. 165 °C Thermal Shutdown Hysteresis 25 °C RJA Junction to Ambient 40 °C/W RJC Junction to Exposed Pad 4 °C/W Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 7 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Efficiency VCC and VREF vs. VIN Figure 4. Figure . VCC vs. ICC VREF vs. IREF 6 5 VREF (V) 4 3 2 1 0 0 5 10 15 20 IREF (mA) 8 Figure 5. Figure 6. Oscillator Frequency vs RT Resistor Oscillator Frequency vs Temperature Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Time1 Delay vs RTIME1 (kΩ) Time2 Delay vs RTIME2 (kΩ) Figure 9. Figure 10. Time3 Delay vs RTIME3 (kΩ) Time1 Delay vs Temperature RTIME1 = 33.2 kΩ Figure 11. Figure 12. Time2 Delay vs Temperature RTIME2 = 28.7 kΩ Time3 Delay vs Temperature RTIME3 = 29.4 kΩ Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 9 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) SS Pin Current vs Temperature SSSR Pin Charging Current vs Temperature Figure 15. Figure 16. RES Pin Charging Current Level 1 vs Temperature Figure 17. 10 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 BLOCK DIAGRAM 9.5V-7.7 V REGULATOR VIN VCC + 1.25V OTP VCC UVLO 5.0V + 0.4V UVLO REF OTP HYSTERESIS (20 uA) SHUTDOWN - LOGIC TIME1 THERMAL LIMIT + 2.0V 5V REFERENCE TIME 2 STANDBY - TIME 3 UVLO HYSTERESIS (20 uA) S Q CLK DRIVER RT OUTA R OSCILLATOR OVERLAP AND DRIVE DELAY DRIVER OUTB RAMP FF RAMP REF DRIVER 25 uA 2.5V Max V*S Clamp 2.5V SSSR + - LOGIC 20 uA Soft-Stop REF 5V 5k OUTSR 1V COMP SS PWM 22 uA + - SS SS REF 1:1 CS 0.50V CS - 5 uA REF RESTART TIMER LOGIC AND DIVIDE-BY- 8 COUNTER + CLK + LEB 22 uA RES PGND 5 uA + AGND - 1.0V Figure 18. Simplified Block Diagram Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 11 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com DETAILED OPERATING DESCRIPTION The LM5027A PWM controller contains all the features necessary to implement power converters utilizing the Active Clamp Reset technique with synchronous rectification. The device is configured to control a P-Channel clamp switch. With the active clamp technique higher efficiencies and greater power densities can be realized compared to conventional catch winding or RDC clamp / reset techniques. The LM5027A provides three gate driver outputs: one to drive the primary side MOSFET (OUTA), one for the active clamp P-Channel MOSFET (OUTB), and one output to drive the synchronous rectifier through an isolation interface (OUTSR). This controller is designed for high-speed operation including an oscillator frequency range up to 1 MHz and total PWM and current sense propagation delay less than 50 ns. The LM5027A includes a high-voltage start-up regulator that operates over a wide input range of 13V to 90V. Additional features include: Line Under-Voltage lockout (UVLO), soft-start/soft-stop, oscillator with synchronization capability, cycle-by-cycle current limit, hiccup mode fault protection with adjustable delay, precision reference, and thermal shutdown. High Voltage Start-Up Regulator The LM5027A contains an internal high voltage start-up regulator that allows the input pin (VIN) to be connected directly to the line voltage. The regulator output is internally current limited to 55mA. When the UVLO pin potential is greater than 0.4V, the VCC regulator is enabled to charge an external capacitor connected to the VCC pin. The VCC regulator provides power to the voltage reference (REF) and the gate drivers (OUTA, OUTB, and OUTSR). The controller outputs are enabled when the voltage on the VCC pin reaches the regulation point of 9.5V, the internal voltage reference (REF) reaches its regulation point of 5V, the UVLO pin voltage is greater than 2V, and the OTP pin voltage is greater than 1.25V. The outputs will remain enabled unless one of the following conditions occurs, VCC falls below 6.0V, UVLO is below 2.0 V, or the OTP pin falls below 1.25V. The value selected for the VCC capacitor depends on the total system design and the start-up characteristics. The recommended capacitance range for the VCC regulator is 0.1 µF to 100 µF. In a typical application, an auxiliary transformer winding is connected through a diode to the VCC pin. This winding must raise the VCC voltage above the VCC regulation set point to shut off the internal start-up regulator. The LM5027A lowers the VCC regulation set point from 9.5V to 7.5V after the output of the first OUTSR drive pulse. Powering VCC from an auxiliary winding improves efficiency while reducing the controller power dissipation. When the converter auxiliary winding is inactive, external current draw on the VCC line should be limited so the power dissipation in the startup regulator does not exceed the maximum power dissipation of the LM5027A package. An external start-up regulator or other bias rail can be used instead of the internal start-up regulator by connecting the VCC and the VIN pins together and feeding the external bias into the two pins. Line Under-Voltage Detector The LM5027A contains a dual level line Under Voltage Lock Out (UVLO) circuit. When the UVLO pin voltage is greater than 0.4V but less than 2.0V, the controller is in a standby mode. In the standby mode the VCC and REF bias regulators are active while the controller outputs are disabled. This feature allows the UVLO pin to be used as a remote enable/disable function. Pulling the UVLO pin below the 2.0V threshold initiates a soft-stop sequence described later in this document. There is 100mV of hysteresis provided in the 0.4V shutdown comparator. When the VCC and REF outputs exceed their respective under-voltage thresholds and the UVLO pin voltage is greater than 2.0V and the OTP pin voltage is greater than 1.25V, the outputs are enabled and normal operation begins. An external set-point voltage divider from the VIN to GND can be used to set the minimum operating voltage of the converter. The divider must be designed such that the voltage at the UVLO pin will be greater than 2.0V when Vin is in the desired operating range. If the under-voltage threshold is not met, all three outputs are disabled. UVLO hysteresis is accomplished with an internal 20 µA current sink that is switched on or off into the impedance of the set-point divider. When the UVLO pin voltage exceeds 2.0V threshold, the current sink is deactivated to quickly raise the voltage at the UVLO pin. When the UVLO pin voltage falls below the 2.0V threshold, the current sink is turned on causing the voltage at the UVLO pin to quickly fall . Reference The REF pin is the output of a 5V linear regulator that can be used to bias an opto-coupler transistor and external house-keeping circuits. The regulator output is internally current limited to 10 mA. 12 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Cycle-by-Cycle Current Limit The CS pin is to be driven by a signal representative of the transformer primary current. If the voltage on the CS pin exceeds 0.5V, the current sense comparator terminates the output driver pulse, with the duty cycle determined by the current sense comparator instead of the PWM comparator. A small R-C filter connected to the CS pin and located near the controller is recommended to suppress noise. An internal 5Ω MOSFET discharges the external current sense filter capacitor at the conclusion of every cycle. The discharge MOSFET remains on for an additional 30 ns after either OUTA driver switches high to blank leading edge transients in the current sensing circuit. Discharging the CS pin filter each cycle and blanking leading edge spikes reduces the filtering requirements and improves the current sense response time. The current sense comparator is very fast and may respond to short duration noise pulses. Layout considerations are critical for the current sense filter and sense resistor. The capacitor associated with the CS filter must be placed very close to the device and connected directly to the CS and AGND pins. If a current sense transformer is used, both leads of the transformer secondary should be routed to the filter network, which should be located close to the IC. When designing with a current sense resistor, all of the noise sensitive low power ground connections should be connected together near the AGND pin, and a single connection should be made to the power ground (sense resistor ground point). Restart Time Delay (Hiccup Mode) The LM5027A provides a current limit restart timer to disable the outputs and force a delayed restart (hiccup mode) if a current limit condition is repeatedly sensed. The number of cycle-by-cycle current limit events required to trigger the restart is programmable by the external capacitor at the RES pin. During each PWM cycle, the LM5027A either sources or sinks current from the RES pin capacitor. If no current limit is detected during a cycle, a 5 µA current sink is enabled to pull the RES pin to ground. If a current limit is detected, the 5 µA current sink is disabled and a 22 µA current source causes the voltage at the RES pin to gradually increase. If the RES voltage reaches the 1.0V threshold, the following restart sequence occurs (also see Figure 19). • The SS and SSSR capacitors are fully discharged. • The RES 20 µA current source is turned-off and the 5 µA current source is turned-on. • The voltage on the RES pin is allowed to charge up to 4.0V. • When voltage on the RES pin reaches 4.0V the 5 µA current source is turned-off and a 5 µA current sink is turned-on, ramping the voltage on the RES capacitor down to 2.0V. • The RES capacitor voltage is ramped between 4.0V and 2.0V eight times. • When the counter reaches eight, the RES pin voltage is pulled low and the Soft-Start capacitor is released to begin a soft-start sequence. The SS capacitor voltage slowly increases. When the SS voltage reaches 1.0V, the PWM comparator will produce the first narrow output pulse at OUTA. • When the SS voltage reaches 4.0V the capacitor on the SSSR pin is released and is charged with a 25 µA current source, soft-starting the free-wheeling synchronous rectifier. • If the overload condition persists after restart, cycle-by-cycle current limiting will begin to increase the voltage on the RES capacitor again, repeating the hiccup mode sequence. • If the overload condition no longer exists after restart, the RES pin will be held at ground by the 5 µA current sink and normal operation resumes. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 13 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com CS Limit Threshold 4.0 V 2.0V 1.0 V RES Divide - by - eight counter Restart delay 4.0 V Soft - Start 1.0 V Hiccup Mode off - time SSSR SSSR Figure 19. Restart and Soft-Start Delay Timing Soft-Start The soft-start circuit allows the regulator to gradually increase its output voltage until the steady state operating point is reached; thereby reducing start-up stresses and surge currents. When bias power is supplied to the LM5027A, the SS pin capacitor is discharged by an internal MOSFET. When the voltages on the UVLO, OTP, VCC, and REF pins reach the operating thresholds, the soft-start capacitor is released and is charged with a 22 µA current source. When the SS pin voltage reaches 1V, output pulses commence with a slowly increasing duty cycle (refer to Figure 20, Figure 21 and Figure 22). The voltage on the SS pin eventually increases to 5V, while the voltage at the PWM comparator is limited to the level required for regulation as determined by the voltage feedback loop via the COMP pin. When the soft-start voltage reaches 4.0V, the capacitor on the SSSR pin is released and charged with a 25 µA current source (refer to Figure 20, Figure 21 and Figure 22) . When the SSSR pin voltage reaches approximately 2.5V (refer to Figure 23), the internal synchronous rectifier PWM circuit gradually increases the synchronous rectifier drive duty cycle (OUTSR) in proportion the rising SSSR pin voltage. Delaying the start of the SSSR gate drive pulses until after the main soft-start is completed allows the output voltage to reach regulation before the synchronous rectifiers begins operation. This delay prevents the synchronous rectifier from sinking current from the output in applications where the output voltage may be prebiased. 14 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Soft-Stop If the UVLO pin voltage falls below the 2.0V standby threshold, but above the 0.4V shutdown threshold, the synchronous rectification soft-start capacitor is discharged with a 20 µA current source which gradually disables the synchronous rectifiers (refer to Figure 21). After the SSSR capacitor has been discharged to 2.0V the softstart and synchronous rectification soft-start capacitors are quickly discharged to ground to terminate PWM pulses at OUTA ,OUTB, and OUTSR. The PWM pulses may cease before the SSSR voltage reduces the synchronous rectifier duty cycle if the VCC or REF voltage drops below the respective under-voltage thresholds during the soft-stop process. This soft-stop method of turning off the converter prevents oscillations in the synchronous rectifiers during a shutdown sequence. increasing PWM SS pulse width PWM increasing OUTA SS pulse width OUTA OUTB increasing SR SS pulse width SR Figure 20. Soft-Start Timing Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 15 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 UVLO < 2V www.ti.com UVLO > 2V 0.4V < UVLO < 2V UVLO 5V SS ~3V 1V OUTA, OUTB Soft-Start 4.5V 5V 4.5V 2.5V 2V 2.5V SSSR OUTSR Soft-Stop OUTSR Soft-Start Figure 21. Soft-Start/Soft-Stop Timing UVLO > 2.0V UVLO SS ~1V Expanded view Soft -Start SSSR OUTA OUTB OUTSR Figure 22. Soft-Start and Drive Enable 16 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 UVLO > 2.0V UVLO ~ 4V SS Expanded view SR Soft -Start ~1V SSSR ~2.5V OUTA OUTB OUTSR Figure 23. Soft-Start Synchronous Rectifier Timing External Over-Temperature Protection An external set-point voltage divider between the REF, OTP, and AGND pins, as shown in Figure 24, is one method to implement over-temperature protection shutdown. Typically a NTC thermistor is installed as the lower device of the voltage divider. The divider must be designed such that the voltage at the OTP pin will be greater than 1.25V when there is not an over-temperature condition, and the OTP pin must drop below 1.25V during an over-temperature event. OTP hysteresis is accomplished with an internal 20 µA current source that is switched on or off into the impedance of the external set-point divider. When the OTP pin voltage exceeds 1.25V threshold, the current source is activated to quickly raise the voltage at the OTP pin. When the OTP pin voltage falls below the 1.25V threshold, the current source is turned off causing the voltage at the OTP pin to quickly fall. When OTP falls below 1.25V the LM5027A will go through a soft-stop turn-off sequence. REF RTOP 1.25V OTP + Logic 5.0V NTC OTP HYSTERESIS (20 uA) LM5027A Figure 24. External OTP Protection Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 17 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Fault/Events Summary Table 2 is a Truth Table which describes the faults and events that control the LM5027A drive outputs. For example the first event is with UVLO being pulled below 0.4V, a possible remote shutdown condition. When this occurs the SS, and SSSR capacitors are discharged, and the three drive outputs will stop switching (outputs low). The last fault is if the OTP pin is pulled low <1.25V, this would occur if an OTP protection circuit is used, see Figure 24. In an OTP event, the LM5027A goes into a soft-stop shutdown. Table 2. Fault/Event Summary Fault/Event Vcc UVLO OTP SS SSSR OUTA OUTB OUTSR UVLO<0.4V >6.2V - >1.25V Fast discharge Fast discharge Low Low Low 2.0V<UVLO>0.4V >6.2V - >1.25V Fast discharge after SSSR<2V Slow discharge Low Low Low SS<1V >6.2V >2.0V >1.25V - Fast discharge Low Low Low SSSR<2.0V >6.2V >2.0V >1.25V >4.0V - Switching Switching Low OTP<1.25V >6.2V >2.0V - Fast discharge after SSSR<2V Slow discharge Low Low Low PWM Comparators The pulse width modulator (PWM) comparator compares the voltage ramp signal at the RAMP pin to the loop error signal. The loop error signal is received from the external feedback and isolation circuit in the form of a control current into the matched pair of NPN transistors which sink current through a 5 kΩ resistor connected to the 5V reference. The resulting control voltage is compared at the PWM input to a 1V level shifted ramp signal. An opto-coupler detector can be connected directly between the REF pin and the COMP pin. Since the COMP pin is a current mirror input, the potential difference across the opto-coupler detector is nearly constant. The bandwidth limiting phase delay which is normally introduced by the significant capacitance of the opto-coupler is thereby greatly reduced. Higher loop bandwidths can be realized since the bandwidth-limiting pole associated with the opto-coupler is now at a much higher frequency. The PWM comparator polarity is configured such that with no current into the COMP pin, the controller produces maximum duty cycle at the main gate drive output (OUTA). Feed-Forward Ramp An external resistor (RFF) and capacitor (CFF) connected to VIN, AGND, and the RAMP pins is required to create the PWM ramp signal as shown in Figure 25. The slope of the signal at the RAMP pin will vary in proportion to the input line voltage. This varying slope provides line feed-forward information necessary to improve line transient response with voltage mode control. The RAMP signal is compared to the error signal by the pulse width modulator comparator to control the duty cycle of the outputs. With a constant error signal, the on-time (tON) varies inversely with the input voltage (VIN) to stabilize the volt-second product of the transformer primary. The power path gain of the conventional voltage-mode pulse with modulator (oscillator generated ramp) varies directly with input voltage. The use of a line generated ramp (input voltage feed-forward) nearly eliminates the gain variation. As a result, the feedback loop is only required to make very small corrections for large changes in input voltage. At the end of each clock period, an internal MOSFET with an RDS(ON) of 10Ω (typical) is enabled to reset the CFF capacitor voltage to ground. 18 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 5V 5k COMP LM5027A Vin SLOPE PROPORTIONAL TO Vin RFF + Gate Drive VIN 1V RAMP - CLK CFF Figure 25. Feed-Forward Voltage Mode Configuration Volt-Second Clamp An external resistor (RFF) and a capacitor (CFF) connected between the VIN, RAMP and AGND pins is required to create a saw-tooth modulation ramp signal as shown in Figure 25. The slope of the RAMP will vary in proportion to the input line voltage. Varying the PWM ramp slope inversely with the input voltage provides line feed-forward information necessary to improve line transient response with voltage mode control. With a constant error signal, the on time (tON) varies inversely with the input voltage (VIN) to stabilize the volt-second product of the transformer primary. The volt-second clamp compares the ramp signal (RAMP) to a fixed 2.5V reference. By proper selection of RFF and CFF, the maximum on-time of the main switch can be set to the desired duration. An example will illustrate the use of the volt-second clamp comparator to achieve a 70% duty cycle limit at 200 kHz and 18V line input: A 70% duty cycle at 200 kHz requires a 3.5 µs on-time. At 18V input the volt-second product is 63µs (18V x 3.5 µs). To achieve this clamp level: RFF x CFF = VIN x tON / 2.5V 18V x 3.5 µs/ 2.5V = 25.2µ (1) (2) Select CFF = 470 pF RFF = 53.6 kΩ The recommended capacitor value range for CFF is 100 pF to 1000 pF. The CFF ramp capacitor is discharged at the conclusion of every cycle by an internal discharge switch controlled by either the PWM comparator, the CS comparator or by the volt-second clamp comparator, which ever occurs first. Oscillator and Sync Capability The LM5027A oscillator frequency is set by the external resistor connected between the RT pin and the ground (AGND). To set a desired oscillator frequency, the necessary RT resistor is calculated from: 1 RT = Freq x 8.3567 x 10-11 (3) Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 19 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com For example, if the desired oscillator frequency is 200 kHz, a 59.7K resistor would be the nearest standard one percent value. The RT resistor should be located as close as possible to the IC and connected directly to the pins (RT and AGND). The tolerance of the external resistor and the frequency tolerance indicated in the Electrical Characteristics must be taken into account when determining the worst case operating frequency. The LM5027A can be synchronized to an external clock by applying a narrow pulse to the RT pin. The external clock must be at least 10% higher than the free-running oscillator frequency set by the RT resistor. If the external clock frequency is less than the RT resistor programming frequency, the LM5027A will ignore the synchronizing pulses. The synchronization pulse should be coupled to the RT pin through a 100 pF capacitor with a pulse width of 15 ns to 150 ns. When a synchronizing pulse transitions from low-to-high (rising edge), the voltage at the RT pin must be driven to exceed 3.2V from its nominal 2.85V level. During the clock signal low time, the voltage at the RT pin will be clamped at 2V by an internal regulator. The output impedance of the RT regulator is approximately 100Ω. The RT resistor is always required, whether the oscillator is free running or externally synchronized. Gate Drive Outputs The LM5027A contains three unique gate drivers. OUTA, the primary switch driver, is designed to drive the gate of an N-Channel MOSFET and is capable of sourcing and sinking a peak current of 2A. The active clamp drive, OUTB, is designed to drive a P-Channel MOSFET and is capable of sourcing and sinking peak currents of 1A. The third driver, OUTSR, is designed to drive the gate of a synchronous rectification MOSFET through a gate drive transformer. OUTSR gate driver has a source and sink capability of 3A. Driver Delay Timing The three independent time delay adjustments allow a great deal of flexibility for the user to optimize the efficiency of the system. The active clamp output (OUTB) is in phase with the main output (OUTA), with the active clamp output overlapping the main output. The overlap time provides dead-time between the operation of the main switch and the P-Channel active clamp switch at both the rising and falling edges. The rising edge control is set by a resistor from the TIME1 pin to the AGND pin. The falling edge control is set with a resistor from the TIME3 pin to the AGND pin. The rising edge of the PWM comparator output coincides with the rising edge of OUTB and the falling edge of the OUTSR output without delay, as shown in Figure 26. The rising edge control for turning on the OUTSR output after the main output (OUTA) has turned off is set with a resistor from the TIME2 pin to the AGND pin. The PWM output goes high (see Figure 26) at the beginning of the oscillator cycle. The rising edge of OUTA is delayed by time delay T1. The T1 delay directly affects the maximum PWM duty cycle. The maximum duty cycle is calculated using the following equation: Maximum Duty Cycle = 20 (72% (1/Freq) ± T1) 1/Freq (4) Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 PWM OUTA OUTB SR T2 T1 T3 Delay_Leading Edge Delay_ trailing Edge Figure 26. LM5027A Driver Output Timing Thermal Protection Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event the maximum rated junction temperature is exceeded. When activated, typically at 165°C, the controller is forced into a low power standby state with the output drivers (OUTA, OUTB, and OUTSR), the bias regulators (VCC and REF) disabled. The thermal protection feature is provided to prevent catastrophic failures from accidental device overheating. During a restart, after thermal shutdown, the soft-start capacitors (SS and SSSR) are fully discharged and the controller follows a normal start-up sequence after the junction temperature falls below the Thermal Shutdown hysteresis threshold (typically 145°C). VIN The voltage applied to the VIN pin, normally the same as the system voltage applied to the power transformer’s primary (VPWR), can vary in the range of the 13 to 90V with transient capability of 105V. The current into VIN depends primarily on the output driver capacitive loads, the switching frequency, and any external loads on the VCC pin. If the power dissipation associated with the VIN current exceeds the package capability, an external voltage should be applied to the VCC pin (see Figure 27) to disable the internal start-up regulator. The VCC regulation set point voltage is initially internally regulated to 9.5V. After the first OUTSR pulse, the VCC set point voltage is reduced to 7.5V. If an external voltage is applied to the VCC pin the required range is 8V to 15V . The VIN to VCC series pass regulator includes a parasitic diode between VIN and VCC. This diode should not be forward biased in normal operation. The VCC voltage should never exceed the VIN voltage. It is recommended the circuit of Figure 27 be used to suppress transients which may occur at the input supply, in particular where VIN is operated close to the maximum operating rating of the LM5027A. VPWR 50: VIN 0.1 PF VCC LM 5027A 9V-15V (from power stage ) Figure 27. Start-up Regulator Power Reduction Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 21 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com For Applications > 100V For applications where the system input voltage (VPWR) exceeds 100V, VIN can be powered from an external start-up regulator as shown in Figure 28. Connecting the VIN and VCC pins together allows the LM5027A to be operated with VIN below 13V. To turn-off the internal start-up regulator the VCC voltage must be raised above 9.9V. The voltage at the VCC pin must not exceed 15V. The voltage source at the right side of Figure 28 is typically derived from the power stage, and becomes active when the LM5027A outputs are active. VPWR VIN VCC LM5027A 10V-15V (from power stage) 10V Figure 28. Start-up Regulator for VPWR > 100V UVLO The under-voltage lockout threshold (UVLO) is internally set to 2.0V at the UVLO pin. With two external resistors as shown in Figure 29, the LM5027A is enabled when VPWR causes the UVLO pin to exceed threshold voltage of 2V. When VPWR is below the threshold, the internal 20 µA current sink is enabled to reduce the voltage at the UVLO pin. When the UVLO pin voltage exceeds the 2V threshold, the 20 µA current sink is turned off causing the UVLO voltage to increase and providing hysteresis. The values of R1 and R2 can be determined from the following equation: R1 = VHYS/20 µA (5) 2.0 x R1 R2 = VPWR - 2.0 - 20 PA x R1 (6) Where VHYS is the desired UVLO hysteresis at VPWR, and VPWR in the second equation is the turn-on voltage. For example, if the LM5027A is to be enabled when VPWR reaches 34V, and the hysteresis is 1.8V, then R1 is 90 kΩ and 5.6 kΩ. For this application R1 was selected to be 90.0 kΩ, R2 was selected to be 6.19 kΩ. The LM5027A can be remotely shutdown by taking the UVLO pin below 0.4V with an external open collector or open drain device, as shown in Figure 29. The outputs and the VCC regulator are disabled in shutdown mode. 22 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 VPWR LM5027A R1 20 PA UVLO + 2V ON/OFF control R2 Figure 29. UVLO Circuit with Shutdown Control Oscillator The oscillator frequency is generally selected in conjunction with the system magnetic components and any other aspects of the system which may be affected by the frequency. The RT resistor selection equation is specified in the Oscillator and Sync Capability section. If the required frequency tolerance is critical in particular application, the tolerance of the external resistor and the frequency tolerance specified in the Electrical Characteristics table must be considered when selecting the RT resistor. Voltage Feedback The COMP pin is designed to accept a current input typically from an opto-coupler. A typical configuration is shown in Figure 30, where the emitter of the opto-coupler transistor is connected to the COMP pin and the collector is connected to the REF pin of the LM5027A. When the output voltage is below regulation, no current flows into the COMP pin and the LM5027A operates at maximum duty cycle. At the secondary side, VOUT is compared to a reference by the error amplifier which has an appropriate frequency compensation network. The amplifier output drives the opto-coupler, which in turn drives the LM5027A COMP pin current mirror. +VOUT +SB LM5027A REF 5V 5k +SB COMP Feedback Optocoupler PWM Comparator Error Amplifier VREF 1:1 Figure 30. Typical COMP Configuration Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 23 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com Current Sense The CS pin receives an input signal representative of the transformer primary current, either from a current sense transformer or from a resistor in series with the source of the primary switch, as shown in Figure 31 and Figure 32. In both cases the sensed current creates a ramping voltage across RSENSE, and the RF/CF filter suppresses noise and leading edge transients. The filtering components RSENSE, RF and CF should be physically as close to the LM5027A as possible. The current sense components must be scaled for 0.5V at the CS pin when an over-current condition exists. If the voltage on the CS pin reaches 0.5V, the present cycle will be immediately terminated. If the over-load event continues and the RES pin reaches 1V, the soft-start capacitor is discharged and the LM5027A will go through an auto re-start (Hiccup Mode). The Hiccup Mode time is set by the capacitor on the RES pin. V PWR Current Sense RF CF CS Rsense LM5027A OUTA OUTB OUTSR Figure 31. Transformer Current Sense 24 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 VOUT VPWR OUTA CS RF Rsense CF LM5027A OUTB OUTSR Figure 32. Resistor Current Sense Soft-Start The capacitor on the SS pin determines the time required for the output duty cycle to increase from zero to its final value for regulation. The minimum acceptable time is dependent on the output capacitance and the response of the feedback loop that controls the COMP pin. If the soft-start time is too quick, the output could significantly overshoot its intended voltage before the feedback loop has a chance to regulate the PWM controller. After power is applied and VCC has passed its upper UV threshold (9.5V), the voltage at the SS pin ramps up as the external capacitor is charged with an internal 20 μA current source. The voltage at the internal PWM comparator input node follows the voltage at the SS pin. When the voltage on the SS pin has reached 1.0V, PWM pulses appear at the drive output with a very low duty cycle. The voltage at the SS pin eventually increases to approximately 5.0V. The voltage at the input to the PWM comparator and the PWM duty cycle increase to the value required for regulation as determined by the voltage regulation loop. Hiccup Mode Current Limit Restart Hiccup mode operation is described in the Restart Time Delay (Hiccup Mode) section. In the case of continuous current limit detection at the CS pin, the time required to reach the 1.0V RES pin threshold is: CRES x 1.0V tCS = 22 PA (7) For example, if CRES = 0.047 µF the time tCS in Figure 33 is approximately 2.14 ms. After the voltage on the RES pin reaches 1.0V, the 22 µA current source is turned-off and a 5 µA current source is turned-on. The Hiccup Mode time is: thiccup = (4.0 - 1.0)CRES 'V x CRES x8 + 5 PA 5 PA (8) where ΔV is 2.0V. With a CRES = 0.047 µF, the Hiccup Mode time is 179 ms. After the Hiccup Mode off time is complete, the RES pin voltage is pulled low and soft-start capacitor is released allowing a soft-start sequence to commence. Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 25 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com The soft-start time trestart is set by the internal 22 µA current source, and is equal to: CSS x 3.0V trestart = 22 PA (9) If CSS = 0.1 µF, trestart is = 6.41 ms The hiccup mode provides the periodic cool-down time for the power converter in the event of a sustained overload or short circuit. This off time results in lower average input current and lower power dissipation within the power components. CS Limit Threshold 4.0 V 2.0V 1.0 V Divide - by - eight counter RES tcs 3.0 V Soft - Start 1.0 V thiccup trestart Figure 33. Hiccup Mode Timing Printed Circuit Board Layout The LM5027A Current Sense and PWM comparators are very fast and respond to short duration noise pulses. The components at the CS, COMP, SS, UVLO, TIME1, TIME2, and TIME3 pins should be physically close as possible to the IC, thereby minimizing noise pickup on the PC board trace inductance. Layout consideration is critical for the current sense filter. If a current sense transformer is used, both leads of the transformer secondary should be routed to the sense filter components and to the IC pins. The ground side of the transformer should be connected via a dedicated PC board trace to the AGND pin, rather than through the ground plane. If the current sense circuit employs a sense resistor in the drive transistor source, low inductance resistors should be used. In this case, all the noise sensitive, low-current ground trace should be connected in common near the IC, and then a single connection made to the power ground (sense resistor ground point). The gate drive outputs of the LM5027A should have short, direct paths to the power MOSFETs in order to minimize inductance in the PC board. The two ground pins (AGND, PGND) must be connected together with a short, direct connection, to avoid jitter due to relative ground bounce. 26 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A LM5027A www.ti.com SNVS642B – APRIL 2010 – REVISED MARCH 2013 Application Circuit Example The following schematic shows an example of the LM5027A controlling a 100W active clamp forward power converter. The input voltage range (VPWR) is 36V to 76V, and the output voltage is 3.3V. The output current capability is 30 Amps. Current sense transformer T3 provides information to the CS pin for current limit protection. The error amplifier and reference U3 and U5 provide voltage feedback via opto-coupler U2. Synchronous rectifiers Q3-Q6 minimize rectification losses in the secondary. An auxiliary winding on the power transformer T1 provides power to the LM5027A VCC pin when the output is in regulation. The input UVLO levels are 34V for increasing VPWR, and approximately 32V for decreasing VPWR. The circuit can be shutdown by forcing the ON/OFF input J2 below 0.4V. An external synchronizing frequency can be applied to the Oscillator input. The converter output current limit is limited at 32A. Special care was taken in this design such that the converter will turn on with the output pre-biased without sinking current from the output. More information is available in TBD. Figure 34. Application Circuit Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A 27 LM5027A SNVS642B – APRIL 2010 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision A (March 2013) to Revision B • 28 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 27 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5027A PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM5027AMH/NOPB ACTIVE HTSSOP PWP 20 73 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM5027A MH LM5027AMHX/NOPB ACTIVE HTSSOP PWP 20 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM5027A MH LM5027ASQ/NOPB ACTIVE WQFN NHZ 24 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5027A LM5027ASQX/NOPB ACTIVE WQFN NHZ 24 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L5027A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM5027AMHX/NOPB HTSSOP PWP 20 2500 330.0 16.4 LM5027ASQ/NOPB WQFN NHZ 24 1000 178.0 LM5027ASQX/NOPB WQFN NHZ 24 4500 330.0 6.95 7.1 1.6 8.0 16.0 Q1 12.4 4.3 5.3 1.3 8.0 12.0 Q1 12.4 4.3 5.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM5027AMHX/NOPB HTSSOP PWP 20 2500 367.0 367.0 35.0 LM5027ASQ/NOPB WQFN NHZ 24 1000 210.0 185.0 35.0 LM5027ASQX/NOPB WQFN NHZ 24 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA PWP0020A MXA20A (Rev C) www.ti.com MECHANICAL DATA NHZ0024B SQA24B (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated