BZT585B5V1TQ ADVANCED INFORMATION SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data ±2.0% Tolerance on Breakdown Voltage Small, Low Profile Surface Mount Package Flat Lead Package Design for Low Profile and High Power Dissipation Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) Case: SOD523 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: Cathode Band Terminals: Finish - Matte Tin Annealed over Alloy 42 Leadframe. Solderable per MIL-STD-202, Method 208 e3 Weight: 0.001 grams (Approximate) Top View Ordering Information (Note 5) Part Number BZT585B5V1TQ-7 Notes: Qualification Automotive Case SOD523 Packaging 3,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/quality/product_compliance_definitions/. 5. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information xx = Product Type Marking Code (See Electrical Characteristics Table) BZT585B5V1TQ Document number: DS38426 Rev. 1 - 2 1 of 4 www.diodes.com December 2015 © Diodes Incorporated BZT585B5V1TQ Maximum Ratings (@TA = +25°C, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic ADVANCED INFORMATION Forward Voltage Symbol Value Unit VF 0.9 1.1 V IF 200 mA Symbol Value 350 Unit mW RθJA 357 °C/W TJ, TSTG -65 to +150 °C @ IF = 10mA @ IF = 100mA Continuous Forward Current Thermal Characteristics Characteristic Power Dissipation (Note 6) PD Thermal Resistance, Junction to Ambient Air (Note 6) Operating and Storage Temperature Range Note: 6. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can be found on our website at http://www.diodes.com. Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Zener Voltage Range (Note 7) Type Number Marking Codes VZ @ IZT Maximum Zener Impedance (Note 8) IZT ZZT @ ZZK @ IZT IZK Ω Nom (V) Min (V) Max (V) mA BZT585B5V1TQ Notes: 3N 5.1 5.00 5.20 5 60 IZK mA 480 1 Temperature Coefficient TC @ IZT Typical (mV/°C) -0.5 Total Capacitance CT @ f = 1MHz, VR = 0V Max (pF) 300 Maximum Reverse Current (Note 7) IR @ VR µA V 2 2 7. Short duration pulse test used to minimize self-heating effect. 8. f = 1kHz. BZT585B5V1TQ Document number: DS38426 Rev. 1 - 2 2 of 4 www.diodes.com December 2015 © Diodes Incorporated BZT585B5V1TQ IF, INSTANTANEOUS FORWARD CURRENT(mA) 0.4 P D, POWER DISSIPATION (W) 0.3 0.2 0.1 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Figure 1 Power Derating Curve 150 TA = 150°C 100 10 TA = 125°C TA = 85°C TA = 25°C 1 TA = -55°C 0.1 200 400 600 800 1000 1200 1400 1600 VF, INSTANTANEOUS FORWARD VOLTAGE(mV) Figure 2 Typical Forward Characteristics 50 I Z, ZENER CURRENT (mA) ADVANCED INFORMATION Note 56 Note 1000 40 30 20 10 0 0 2 4 6 8 10 12 VZ , ZENER VOLTAGE (V) Figure 3 Typical Zener Breakdown Characteristics Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. SOD523 Dim Min Max A 0.25 0.35 B 0.70 0.90 C 1.50 1.70 H 1.10 1.30 K 0.55 0.65 L 0.10 0.30 M 0.10 0.12 All Dimensions in mm L C H M A B BZT585B5V1TQ Document number: DS38426 Rev. 1 - 2 K 3 of 4 www.diodes.com December 2015 © Diodes Incorporated BZT585B5V1TQ Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. X1 ADVANCED INFORMATION Y Dimensions Value (in mm) G 0.80 X 0.60 X1 2.00 Y 0.70 X G IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com BZT585B5V1TQ Document number: DS38426 Rev. 1 - 2 4 of 4 www.diodes.com December 2015 © Diodes Incorporated