TI1 DRV8860 8-channel serial interface low-side driver Datasheet

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DRV8860, DRV8860A
SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
DRV8860x 38-V 8-Channel Serial Interface Low-Side Driver
1 Features
3 Description
•
The DRV8860 provides an 8-channel low side driver
with overcurrent protection and open/shorted load
detection. It has built-in diodes to clamp turn-off
transients generated by inductive loads, and can be
used to drive unipolar stepper motors, DC motors,
relays, solenoids, or other loads.
1
•
•
•
•
•
8-Channel Protected Low-side Driver
– Eight NMOS FETs with Overcurrent Protection
– Integrated Inductive Catch Diodes
– Serial Interface
– Open/Short Load Detection (DRV8860 only)
– Configurable 100% Output Timing
– Configurable PWM Duty Cycle
Continuous Current Driving Capability
– 560 mA (Single Channel on) PW and PWP
– 200 mA (8 Channels on) PW
– 330 mA (8 Channels on) PWP
– Support Parallel Configuration
8 V to 38 V Supply Voltage Range
Input Digital Noise Filter for Noise Immunity
Internal Data Read Back Capability for Reliable
Control
Protection and Diagnostic Features
– Overcurrent Protection (OCP)
– Open Load Detection (OL)
– Overtemperature Shutdown (OTS)
– Undervoltage Lockout (UVLO)
– Individual Channel Status Report
– Fault Condition Alarm
The PWP package can supply up to 330 mA × 8
channel and The PW package can supply up to 200
mA × 8 channel continuous output current. A single
channel can deliver up to 560 mA continuous output
current.
A serial interface is provided to control the DRV8860
output drivers, configure internal setting register and
read the fault status of each channel. DRV8860
devices can be daisy-chained together to use a single
serial interface. Energizing-time and holding-PWMDuty cycles are configurable through serial interface
as well. These functions allow for cooler running than
always-on solutions.
Internal shutdown functions are provided for
overcurrent protection, short-circuit protection,
undervoltage
lockout,
and
overtemperature.
DRV8860A does not include open load detection.
Fault information for each channel can be read out
through serial interface and indicated by an external
fault pin.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
•
DRV8860
Relays, Unipolar Stepper Motors
Solenoids, Electromagnetic Drivers
General Low-side Switch Applications
LED driver with dimmer functionality (DRV8860A)
DRV8860A
PACKAGE
BODY SIZE (NOM)
TSSOP (16)
5.00 mm × 6.40 mm
HTSSOP (16)
5.00 mm × 4.40 mm
TSSOP (16)
5.00 mm × 6.40 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
8 to 38 V
600
ENABLE
LATCH
CLK
DIN
DOUT
8 Channel Serial
Interface
Low-Side Driver
VM
N=1
500
Peak Current (mA/output)
DRV8860
400
N=2
300
N=4
200
N=8
100
N: Number of outputs active
0
0
12.5
25.0
37.5
50.0
62.5
75.0
87.5
100.0
nFAULT
Duty Cycle (%)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8860, DRV8860A
SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
4
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
5
5
5
5
6
6
8
Absolute Maximum Ratings ......................................
Handling Ratings ......................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 14
8.5 Programming........................................................... 16
8.6 Register Maps ......................................................... 27
9
Application and Implementation ........................ 28
9.1 Application Information............................................ 28
9.2 Typical Application ................................................. 28
10 Power Supply Recommendations ..................... 30
10.1 Power Supply and Logic Sequencing ................... 30
11 Layout................................................................... 31
11.1 Layout Guidelines ................................................. 31
11.2 Layout Example .................................................... 31
11.3 Thermal Consideration.......................................... 32
12 Device and Documentation Support ................. 33
12.1
12.2
12.3
12.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
33
33
33
33
13 Mechanical, Packaging, and Orderable
Information ........................................................... 33
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2015) to Revision E
•
Page
Added timing diagrams Figure 1, Figure 2 and Table 2, Table 3........................................................................................... 7
Changes from Revision C (October 2014) to Revision D
Page
•
Added I(VM) MAX = 4.5 V......................................................................................................................................................... 6
•
Added IOFF for DRV8860A ..................................................................................................................................................... 6
•
Changed tOCP From: MIN = 2.7 To: 2.0 μs ............................................................................................................................. 6
•
Updated Functional Block Diagram ........................................................................................................................................ 9
Changes from Revision B (July 2014) to Revision C
Page
•
Added DRV8860A part to datasheet. .................................................................................................................................... 1
•
Added caption to Figure 9 ................................................................................................................................................... 14
•
Added caption to Figure 10 ................................................................................................................................................. 14
•
Moved the Serial Control Interface information into the Programming section of the datasheet ........................................ 16
•
Moved the Register Maps information into the Detailed Description section of the datasheet ........................................... 27
•
Changed Figure 37 from a black background to a white background ................................................................................. 29
•
Added caption to Figure 39 ................................................................................................................................................. 31
•
Changed title From: Thermal Information To: Thermal Consideration ................................................................................ 32
2
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Changes from Revision A (November 2013) to Revision B
Page
•
Added Feature: Serial Interface.............................................................................................................................................. 1
•
Changed the Features list for: Continuous Current Driving Capability................................................................................... 1
•
Deleted Features: Programmable Current Profile .................................................................................................................. 1
•
Updated the Application List .................................................................................................................................................. 1
•
Changed Description sentence From: These functions allow for lower temperature operation rather than traditional
always-on solutions. To: These functions allow for cooler running than traditional always-on solutions............................... 1
•
Added the Handling Ratings table .......................................................................................................................................... 5
•
Changed the MIN value for VM in the Recommended Operating Conditions table From: 8.2 V To: 8 V .............................. 5
•
Added HTTSSOP (PWP) to the Thermal Information table ................................................................................................... 5
•
Changed VIL From: MIN = - To: 0 V, TYP = 0.6 V To: - ........................................................................................................ 6
•
Changed VIH From: MIN = 2 V To: 1.5 V, MAX = - To: 5.3 V ............................................................................................... 6
•
Changed VHYS From: MIN = - To: 100 mV, TYP = 0.45 V To: - ............................................................................................ 6
•
Added the Timing Requirements table ................................................................................................................................... 6
•
Added the Overview section .................................................................................................................................................. 8
•
Changed the description of the Recommended Output Current section.............................................................................. 10
•
Deleted the Example Output Configuration section. ............................................................................................................ 12
•
Changed the Serial Control Interface description text ......................................................................................................... 16
Changes from Original (September 2013) to Revision A
Page
•
Added Features: Programmable Current Profile .................................................................................................................... 1
•
Changed the MIN value for VM in the Recommended Operating Conditions table From: 8 V To: 8.2 V .............................. 5
•
Added the Example Output Configuration section. .............................................................................................................. 12
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Product Folder Links: DRV8860 DRV8860A
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6 Pin Configuration and Functions
PWP (HTSSOP) PACKAGE
(TOP VIEW)
PW (TSSOP) PACKAGE
(TOP VIEW)
VM
DIN
CLK
LATCH
GND
DOUT
nFAULT
ENABLE
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VM
DIN
CLK
LATCH
GND
DOUT
nFAULT
ENABLE
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
Pin Functions
NAME
PIN
I/O
(1)
DESCRIPTION
EXTERNAL COMPONENTS OR CONNECTIONS
GND
5
—
Device ground
All pins must be connected to ground
VM
1
—
Motor power supply
Connect to motor supply voltage. Bypass to GND with a 0.1 μF ceramic capacitor
plus a 10 μF electrolytic capacitor.
ENABLE
8
I
Output stage enable
control input
Logic high to enable outputs, logic low to disable outputs. Internal logic and
registers can be read and written to when ENABLE is logic low. Internal pulldown.
LATCH
4
I
Serial latch signal
Refer to serial communication waveforms. Internal pulldown.
CLK
3
I
Serial clock input
Rising edge clocks data into part for write operations. Falling edge clocks data out
of part for read operations. Internal pulldown.
DIN
2
I
Serial data input
Serial data input from controller. Internal pulldown.
DOUT
6
O
Serial data output
Serial data output to controller. Open-drain output with internal pullup.
nFAULT
7
OD
Fault
Logic low when in fault condition. Open-drain output requires external pullup.
Faults: OCP, OTS, UVLO, OL (DRV8860 only)
OUT1
16
O
Low-side output 1
NFET output driver. Connect external load between this pin and VM
OUT2
15
O
Low-side output 2
NFET output driver. Connect external load between this pin and VM
OUT3
14
O
Low-side output 3
NFET output driver. Connect external load between this pin and VM
OUT4
13
O
Low-side output 4
NFET output driver. Connect external load between this pin and VM
OUT5
12
O
Low-side output 5
NFET output driver. Connect external load between this pin and VM
OUT6
11
O
Low-side output 6
NFET output driver. Connect external load between this pin and VM
OUT7
10
O
Low-side output 7
NFET output driver. Connect external load between this pin and VM
OUT8
9
O
Low-side output 8
NFET output driver. Connect external load between this pin and VM
(1)
Directions: I = input, O = output, OD = open-drain output
Table 1. External Components
COMPONENT
C(VM1)
R(nFAULT)
(1)
4
PIN 1
VM
V3P3
PIN 2
GND
(1)
RECOMMENDED
0.1 µF ceramic capacitor rated for VM
10 µF electrolytic capacitor rated for VM
nFAULT
> 4.7 kΩ
V3P3 is not a pin on the DRV8860, but a V3P3 supply voltage pullup is required for open-drain output nFAULT.
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SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
Power supply voltage range
VM
Digital input pin current range
ENABLE, LATCH, CLK, DIN
Digital output pin voltage range
DOUT, nFAULT
Digital output pin current
DOUT, nFAULT
Output voltage range
OUTx
Output current range
OUTx
(2)
(3)
UNIT
40
V
0
20
mA
–0.5
7
V
–0.5
7
V
–0.3
40
V
150
°C
Internally limited
Operating virtual junction temperature range, TJ
(1)
MAX
–0.3
–40
A
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
Power dissipation and thermal limits must be observed
7.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
Electrostatic discharge
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
MIN
MAX
UNIT
–60
150
°C
–2
2
kV
–500
500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VM
Motor power supply voltage range
IOUT
Low-side driver current capability
TA
Operating ambient temperature range
7.4 Thermal Information
NOM
MAX
8
–40
UNIT
38
V
560
mA
85
°C
(1)
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
TSSOP
HTSSOP
PW (16 PINS)
PWP (16 PINS)
UNIT
ΘJA
Junction-to-ambient thermal resistance
103
40.9
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
37.9
28.5
°C/W
RθJB
Junction-to-board thermal resistance
48
23.2
°C/W
ΨJT
Junction-to-top characterization parameter
3
0.9
°C/W
ΨJB
Junction-to-board characterization parameter
47.4
23.0
°C/W
RθJC(BOTTOM)
Junction-to-case (bottom) thermal resistance
N/A
3.0
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013–2015, Texas Instruments Incorporated
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7.5 Electrical Characteristics
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
3
4.5
mA
8.2
V
V
POWER SUPPLIES
I(VM)
VM operating supply current
VM = 24 V
V(UVLO)
VM undervoltage lockout voltage
VM rising
LOGIC-LEVEL INPUTS (DIN, CLK, LATCH, ENABLE)
VIL
Input low voltage
0
0.7
VIH
Input high voltage
1.5
5.3
VHYS
Input hysteresis
100
IIL
Input low current
VIN = 0
IIH
Input high current
VIN = 3.3 V
RPD
Input pulldown resistance
V
mV
–20
20
µA
100
µA
100
kΩ
nFAULT, DOUT OUTPUTS (OPEN-DRAIN OUTPUTS)
VOL
Output low voltage
IO = 5 mA
IOH
Output high leakage current
VO = 3.3 V, nFAULT
RPU
Input pullup resistance
DOUT only (Pull up to internal 5.7 V)
1.4
VM = 24 V, IO = 150 mA, TJ = 25°C
1.5
VM = 24 V, IO = 150 mA, TJ = 85°C
1.8
0.5
V
1
µA
–1
kΩ
LOW-SIDE FET DRIVERS
Rds(on)
FET on resistance
IOFF
Off-state leakage current
VM = 24 V, TJ = 25°C, DRV8860
0
VM = 24 V, TJ = 25°C, DRV8860A
Ω
30
-0.5
0.5
µA
HIGH-SIDE FREE-WHEELING DIODES
VF
Diode forward voltage
VM = 2 4V, IO = 150 mA, TJ = 25°C
0.9
V
620
mA
30
µA
PROTECTION CIRCUITS
IOCP
Overcurrent protection trip level
Each channel separately monitored
IOL
Open load detect pull-down current
Per channel, DRV8860 only
VOL
Open load detect threshold voltage
Per channel, DRV8860 only
TTSD
Thermal shutdown temperature
Die temperature
THYS
Thermal shutdown hysteresis
Die temperature
1.2
150
160
V
180
35
°C
°C
PWM CHOPPING FREQUENCY
fPWM
PWM chopping frequency
Duty cycle is > 25%
45
50
55
Duty cycle is 25%
22
25
28
Duty cycle is 12.5%
11
12.5
14
kHz
7.6 Timing Requirements
MIN
tF
Fall time
IO = 150 mA, VM = 24 V, resistive load
50
tOCP
Overcurrent protection deglitch
time
VM = 24 V
2.0
tOL
Open load detect deglitch time
Each channel separately monitored
14
6
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TYP
MAX
UNIT
300
ns
3.0
3.85
µs
17
20
µs
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SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
tSU(LATCH)
tHD(LATCH)
LATCH
tCLK
CLK
X
X
tCLKH
DIN
X
tCLKL
MSB
LSB
X
tSU(DIN) tHD(DIN)
DOUT
Z
MSB
LSB
Z
tD(DOUT)
Figure 1. Serial Interface
Table 2. Serial Timing
NO.
REF DES
DESCRIPTION
MIN
TYP
MAX
UNIT
1
tCLK
CLK cycle time
5
µs
2
tCLKH
CLK high time
2.5
µs
3
tCLKL
CLK low time
2.5
µs
4
tSU(DIN)
Setup time, DIN to CLK
1
µs
5
tH(DIN)
Hold time, DIN to CLK
1
µs
6
tSU(LATCH)
Setup time, LATCH to CLK
1
µs
7
tH(LATCH)
Hold time, LATCH to CLK
1
µs
8
tOFF(LATCH)
Inactive time between writes and read
2
9
tD(DOUT)
Delay time, CLK to DOUT
tf(LATCH)
tr(LATCH)
µs
1.5
µs
tH(LATCH)
LATCH
CLK
X
X
Part 1
Part 2
Part 3
Part 4
Figure 2. Special Commands
Table 3. Special Commands
NO.
REF DES
DESCRIPTION
MIN
TYP
MAX
UNIT
10
tf(LATCH)
LATCH fall to CLK rise
1
µs
11
tr(LATCH)
CLK fall to LATCH rise
1
µs
12
tH(LATCH)
LATCH high time
2
µs
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7.7 Typical Characteristics
3.40
1.90
1.85
3.35
I(VM) Current (mA)
RDS(on) (:)
1.80
1.75
1.70
1.65
1.60
3.30
3.25
1.55
1.50
3.20
0
10
20
30
40
VM Voltage (V)
50
0
10
Figure 3. Output ON Resistance
20
30
40
VM Voltage (V)
C004
50
C004
Figure 4. VM Operating Supply Current
8 Detailed Description
8.1 Overview
The DRV8860 is an integrated 8-channel low side driver with overcurrent protection and open/short detection. It
has built-in diodes to clamp turn-off transients generated by inductive loads, and can be used to drive unipolar
stepper motors, DC motors, relays, solenoids, or other loads.
DRV8860 can supply up to 200 mA x 8 channel continuous output current. The current driving capability
increases with lower PWM duty cycle. A single channel can deliver up to 560 mA continuous output current.
Refer to the current capability table for details.
A serial interface is provided to control the DRV8860 output drivers, configure internal register settings, and read
the fault status of each channel. Multiple DRV8860 devices can be daisy-chained together to use a single serial
interface. Energizing-time and holding-PWM-duty cycle are configurable through the serial interface as well.
These functions allow for cooler running than traditional always-on solutions.
Internal shutdown functions are provided for overcurrent protection, short-circuit protection, under voltage lockout
and over temperature. DRV8860 can diagnosis an open load condition. DRV8860A does not include open load
detection. Fault information for each channel can be read out through serial interface and is indicated by an
external fault pin.
8
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8.2 Functional Block Diagram
VM
10 µF
VM
Gate Drive
Gate Drive,
OCP,
Open Load
0.1 µF
Logic LDO
DRV8860
only OL
Power
VM
VM
OUT1
VM
ENABLE
OUT1
Gate Drive,
OCP,
Open Load
VM
LATCH
CLK
OUT1
Gate Drive,
OCP,
Open Load
Serial
Interface
VM
DIN
OUT1
Gate Drive,
OCP,
Open Load
DOUT
Core Logic
VM
OUT1
Gate Drive,
OCP,
Open Load
Protection
VM
Overcurrent
OUT1
Gate Drive,
OCP,
Open Load
Undervoltage
Thermal
VM
Open Load
OUT1
Gate Drive,
OCP,
Open Load
VM
Output
nFAULT
Gate Drive,
OCP,
Open Load
GND
PPAD
OUT1
(PWP package only)
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8.3 Feature Description
8.3.1 Recommended Output Current
DRV8860 current capability will depend on several system application parameters such as system ambient
temperature, maximum case temperature, and overall output duty cycle. The PWP package provides a better
heatsinking capability through the PowerPAD™; and therefore, is cable of driving higher output current or
operating at a slightly lower temperature than the device in PW package.
OUTPUT CURRENT RECOMMENDATION (PW PACKAGE) TA = 25°C
CONFIGURATION
OUTPUT CURRENT CAPACITY
1x output on (100% duty cycle)
566 mA
2x outputs on (100% duty cycle)
400 mA per output
4x outputs on (100% duty cycle)
283 mA per output
8x outputs on (100% duty cycle)
200 mA per output
600
N=1
Peak Current (mA/output)
500
400
N=2
300
N=4
200
N=8
100
N: Number of outputs active
0
0
12.5
25.0
37.5
50.0
62.5
75.0
87.5
100.0
Duty Cycle (%)
Figure 5. Output Current Capacity vs Duty Cycle for PW Package
10
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Figure 6. Maximum Current Capacity vs Duty Cycle when Paralleling Outputs for DRV8860PW
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8.3.2 Daisy Chain Connection
Two or more DRV8860 devices may be connected together to use a single serial interface. The SDATOUT pin of
the first device in the chain is connected to the SDATIN pin of the next device. The SCLK, LATCH, RESET, and
nFAULT pins are connected together.
Timing diagrams are shown in Figure 7 and Figure 8 for the configuration of single devices, as well as two
devices in daisy-chain connection.
8 ~38 V
Host Processor
GPIO
LATCH
GPIO
CLK
GPIO
DIN
GPIO
DOUT
GPIO
nFAULT
OUT1
DRV8860
OUT8
Figure 7. Single Device Connection
8 ~38 V
Host Processor
GPIO
LATCH
GPIO
CLK
GPIO
DIN 1
GPIO
DOUT 1
OUT1
DRV8860
Device #1
OUT8
LATCH
OUT1
CLK
DIN 2
DOUT 2
DRV8860
Device #2
OUT8
Figure 8. Daisy-Chain Connection
12
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8.3.3 Protection Circuits
The DRV8860 is fully protected against undervoltage, overcurrent and overtemperature events.
8.3.3.1 Overcurrent Protection (OCP)
When output current exceeds OCP trigger level, corresponding channel will be automatically turned off. nFault
pin will be set low and corresponding OCP flag in fault register will be set to 1.
Over current faults are automatically cleared whenever the corresponding output is turned off by setting the Data
register bit to ‘0’. Alternatively, a Fault Reset special command will also clear this value. In either case, once all
bits in the Fault register are clear, nFAULT is released.
8.3.3.2 Open Load Detection (OL) - DRV8860 only
When any output is in off status (the corresponding Data Register bit is set to ‘0’), a current sink pulls the node
down with approximately 30 µA. If the voltage on the pin is sensed to be less than 1.2 V, then an open load
condition is reported. nFAULT is driven low and the OL bit of the fault register (F8:F1) corresponding to the
specific channel is set.
Open load faults are automatically cleared whenever the corresponding output is turned on by setting the Data
register bit to ‘1’. Alternatively, a Fault Reset special command will also clear this value. In either case, once all
bits in the Fault register are clear, nFAULT is released.
8.3.3.3 Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all outputs will be disabled, and the nFAULT pin will be driven low.
Once the die temperature has fallen to a safe level, operation will automatically resume. The nFAULT pin will be
released after operation has resumed.
8.3.3.4 Undervoltage Lockout (UVLO)
If at any time the voltage on the VM pin falls below the undervoltage lockout threshold voltage, all circuitry in the
device will be disabled and internal logic will be reset. Operation will resume when VM rises above the UVLO
threshold. nFAULT will not be asserted in this condition.
8.3.3.5 Digital Noise Filter
The DRV8860 features an internal noise filter on all digital inputs. In a noisy system, noise may disturb the serial
daisy-chain interface. Without an input filter, this noise may result in an unexpected behavior or output state. The
digital input filter is capable of removing unwanted noise frequencies while allowing fast communication over the
serial interface.
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8.4 Device Functional Modes
8.4.1 Internal Registers
The DRV8860 is controlled with a simple serial interface. There are three register banks that are used during
operation: the Data register, the Control register, and the Fault register.
Register data movement flow and direction will be affected by special command.
Figure 9. Register Data Movement
In default condition, 8 Bit shift register data moves into output control register DATA-REG.
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Device Functional Modes (continued)
Figure 10. 8 Bit Shift Register Data Movement
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8.5 Programming
8.5.1 Serial Control Interface
DRV8860 is using a daisy chain serial interface. Data is latched into the register on the rising edge of the LATCH
pin. Data is clocked in on the rising edge of CLK when writing, and data is clocked out on the falling edge of CLK
when reading.
8.5.1.1 Data Writing Waveform
LATCH
xxxx
xxxxxxxxxx
1
2
3
4
5
6
7
8
xxxx
xxxxxxxxxx
xxxx
xxxxxxxxxx
DINxxxxxA_D8 A_D7 A_D6 A_D5 A_D4 A_D3 A_D2 A_D1 xxxxxxxxxxxx
xxxxx
xxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Old Data Register Contents
Data A
Data Registerxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
CLK
Figure 11. Writing Data Register – Single Device
xx
xxxx
xx
xxxx
xxx
xxxx
xxxxxxxxxxxx
xxxx
xxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxx
LATCH
CLK
DIN 1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A_D8
A_D7
A_D6
A_D5
A_D4
A_D3
A_D2
A_D1
B_D8
B_D7
B_D6
B_D5
B_D4
B_D3
B_D2
B_D1
A_D8
A_D7
A_D6
A_D5
A_D4
A_D3
A_D2
A_D1
DOUT 1 / DIN 2
Data Register 1
Old Data Register Contents ± Device #1
Data B
Data Register 2
Old Data Register Contents ± Device #2
Data A
Figure 12. Writing Data Register – Daisy Chan
Figure 13. Writing Data Register – Data Flow
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Programming (continued)
8.5.1.2 Fault Register Reading Waveform
xx
xx
xxxx
LATCH
CLK
1
DOUT
2
F16
3
F15
4
5
F14
F13
6
F12
7
F11
Fault Register
8
F10
9
10
F9
F8
11
F7
12
13
F6
F5
14
F4
15
F3
16
F2
F1
Fault Register Contents A
xx
Figure 14. Reading Fault Register – Single Device
LATCH
xxxx
xxxx
xxxx
x
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DOUT 1 / DIN 2
F16
F15
F14
F13
F12
F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1
DOUT 2
F16
F15
F14
F13
F12
F11
F10
F9
F8
F7
F6
F5
F4
F3
F2
F1
Fault Register #1
Control Register Contents A
Fault Register #2
Control Register Contents B
xxxxxxxxx
xxxxxxxxx
17
16
x
18
F16
19
F15
20
F14
21
F13
22
F12
F11
Figure 15. Reading Fault Register – Daisy Chain
Figure 16. Reading Fault Register – Data Flow
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Programming (continued)
8.5.1.3 Special Command
Besides output ON/OFF control and fault status reading back, DRV8860 has special functions to make system
more robust or power efficient. These functions will need special command to initiate the device or configure the
internal registers.
There are 5 Special Commands:
1. Write Control Register command
2. Read Control Register command
3. Read Data Register command
4. Fault Register Reset command
5. PWM Start command
Special wave form pattern on CLK and LATCH pin will issue the special command, as below
LATCH
xxx
xxx
xxx
xxx
CLK
1
1
Part 1
2
3
4
5
1
6
Part 2
2
3
4
5
6
1
Part 3
2
3
Part 4
Figure 17. Special Command
SPECIAL COMMAND
18
CLK CYCLES IN EACH PART
Part 1
Part 2
Part 3
Part 4
Write Control Register
1
2
2
3
Read Control Register
1
4
2
3
Read Data Register
1
4
4
3
Fault Register Reset
1
2
4
3
PWM Start
1
6
6
3
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8.5.1.3.1 Special command: Write Control Register
When Write-Control-Register command is issued, the following serial data will be latched into timing and duty
control register.
xxxx
xxxx
xxxxxxxxx
xxxx
xxxxxxxxxxxxxxxxxx
LATCH
x
CLK
1
1
1
2
2
1
2
3
1
2
3
4
5
6
7
8
x
DIN
Control Register
A_C8
A_C7
A_C6
A_C5
A_C4
A_C3
A_C2
A_C1
Control A
Figure 18. Writing Control Register – Single Device
xx
xxx
xx
xxx
xxxxxxxxx
xxxx
xxxxxxxxxxxxxxxxxx
xxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxx
LATCH
CLK
DIN 1
1
1
2
1
2
1
2
3
1
A_C8
2
A_C7
3
A_C6
4
A_C5
5
A_C4
6
A_C3
7
A_C2
8
A_C1
DOUT 1 / DIN 2
9
10
11
12
13
14
15
16
B_C8
B_C7
B_C6
B_C5
B_C4
B_C3
B_C2
B_C1
A_C8
A_C7
A_C6
A_C5
A_C4
A_C3
A_C2
A_C1
Control Register 1
Old Control Register Contents ± Device #1
Control B
Control Register 2
Old Control Register Contents ± Device #2
Control A
Figure 19. Writing Control Register – Daisy Chain
Figure 20. Writing Control Register – Data Flow
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8.5.1.3.2 Special command: Read Control Register
When Read-Control-Register command is issued, control register content will be copied to internal shift register
and following CLK will shift this content out from DOUT pin. This provides a mechanism for system to verify the
control register is correctly programmed.
xxxx
xxxx
xxxxx
LATCH
x
xxxxxxxxx
CLK
1
1
2
3
1
4
2
1
2
3
1
2
3
4
5
6
7
8
x
DOUT
A_C8
Control Register
A_C7
A_C6
A_C5
A_C4
A_C3
A_C2
A_C1
Control Register Contents A
Figure 21. Read Control Register – Single Device
xx
xx
xxxxxxxxxx
xxxxxxxxxx
LATCH
CLK
1
1
2
3
4
1
2
1
2
3
1
2
3
4
5
6
7
xxxxxxxxxxxx
xxx
8
DOUT 1 / DIN 2
A_C8
A_C7
A_C6
A_C5
A_C4
A_C3
A_C2
A_C1
DOUT 2
B_D8
B_D7
B_D6
B_D5
B_D4
B_D3
B_D2
B_D1
Control Register #1
Control Register Contents A
Control Register #2
Control Register Contents B
9
A_D8
10
A_D7
11
A_D6
12
A_D5
13
A_D4
14
A_D3
15
A_D2
16
A_D1
Figure 22. Read Control Register – Daisy Chain
Figure 23. Read Control Register – Data Flow
20
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8.5.1.3.3 Special command: Read Data Register
When Read-Data-Register command is issued, internal output data register content will be copied to internal shift
register and following CLK will shift this content out from DOUT pin. This provides a mechanism for system to
verify the output data is correctly programmed. It makes system more robust in noisy system.
xx
xxxxxxxxxxx
xxxx
xxxxx
LATCH
CLK
1
1
2
3
1
4
2
3
1
4
2
3
1
A_D8
DOUT
2
A_D7
3
A_D6
4
A_D5
5
A_D4
6
A_D3
7
8
A_D2
A_D1
Data Register Contents A
Data Register
Figure 24. Reading Data Register – Single Device
LATCH
x
xxxxxxxxxx
xxxxxxxxxx
CLK
1
1
2
3
4
1
2
3
4
1
2
3
1
2
3
4
5
6
7
x
DOUT 1 / DIN 2
DOUT 2
xxxxxxxxxxxx
xxx
8
A_D8
A_D7
A_D6
A_D5
A_D4
A_D3
A_D2
A_D1
B_D8
B_D7
B_D6
B_D5
B_D4
B_D3
B_D2
B_D1
Data Register 1
Data Register Contents A
Data Register 2
Data Register Contents B
9
A_D8
10
A_D7
11
A_D6
12
A_D5
13
A_D4
14
A_D3
15
A_D2
16
A_D1
Figure 25. Reading Data Register – Daisy Chain
Figure 26. Reading Data Register – Data Flow
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8.5.1.3.4 Special command: Fault Register Reset
When Fault-Register-Reset command is issued, internal 16bit fault register will be cleared. System can use this
method to clear out all fault condition in every chained device at once.
LATCH
xxx
xxx
xxx
CLK
1
1
2
1
2
3
1
4
2
3
xxxxxxxxxxx
xxxxxxxxxxx
xxxxxxxxxxx
Fault Register Contents
Fault Register
nFAULT
No Fault Condition
Fault Condition
Figure 27. Fault Register Reset
8.5.1.3.5 Special command: PWM Start
When Fault-Register-Reset command is issued, output channel will ignore energizing time and directly enter into
PWM mode following the setting in control register.
LATCH
xxx
xxx
CLK
1
1
2
3
OUTx
4
5
6
1
2
3
4
5
6
1
2
3
Max-On Time
xxxxxxxxxxxxx
xxxxxxxxxxxxx
PWM Chopping
Figure 28. PWM Start Command
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8.5.1.4 Output Energizing and PWM Control
The device output is defined by two stages: Energizing Phase and PWM Phase.
During the Energizing phase, the channel is turned on with 100% duty cycle for a duration set by Control register
bits C4:C1.
In PWM chopping phase, with the PWM Duty Cycle defined by Control register bits C7:C5.
The behavior of each bit in the Control Register is described in Table 4.
Table 4. Control Register Settings
C8
C7
C6
C5
C4
C3
C2
C1
Value
DESCRIPTION
0
X
X
X
X
X
X
X
N/A
Outputs always in Energizing mode
1
X
X
X
0
0
0
0
0 ms
No Energizing, starts in PWM chopping
1
X
X
X
0
0
0
1
3 ms
1
X
X
X
0
0
1
0
5 ms
1
X
X
X
0
0
1
1
10 ms
1
X
X
X
0
1
0
0
15 ms
1
X
X
X
0
1
0
1
20 ms
1
X
X
X
0
1
1
0
30 ms
1
X
X
X
0
1
1
1
50 ms
1
X
X
X
1
0
0
0
80 ms
1
X
X
X
1
0
0
1
110 ms
1
X
X
X
1
0
1
0
140 ms
1
X
X
X
1
0
1
1
170 ms
1
X
X
X
1
1
0
0
200 ms
1
X
X
X
1
1
0
1
230 ms
1
X
X
X
1
1
1
0
260 ms
1
X
X
X
1
1
1
1
300 ms
1
0
0
0
X
X
X
X
0%
1
0
0
1
X
X
X
X
12.50%
12.5 kHz
1
0
1
0
X
X
X
X
25.00%
25 kHz
1
0
1
1
X
X
X
X
37.50%
1
1
0
0
X
X
X
X
50.00%
1
1
0
1
X
X
X
X
62.50%
1
1
1
0
X
X
X
X
75.00%
1
1
1
1
X
X
X
X
87.50%
Sets the Energizing Time (100% duty cycle) before
switching to PWM Phase
Output is off after Energizing Phase
Sets PWM chopping duty cycle. DC is the
duty cycle that the low-side FET is on.
50 kHz
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There are five operation cases as described in Figure 29 through Figure 33.
The output is turned on with 100% duty cycle.
OUTx Voltage (V)
VM
Time (ms)
OUTx Current (mA)
VM/RL
Time (ms)
Max-On time
Figure 29. Case 1: Timer Enable Bit (C8) is 0 (Default Value)
The output is turned on in PWM chopping mode with duty cycle defined by Control register bits C7:C5.
OUTx Voltage (V)
VM
Time (ms)
OUTx Current (mA)
DC*VM/RL
Time (ms)
PWM Chopping
Figure 30. Case 2: Timer Enable Bit (C8) is 1 and Energizing Timing Bits (C4:C1) are 0000
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The output is turned on in Energizing mode with 100% duty cycle for a duration set by Control register bits
C4:C1. After the timer expires, the output switches to PWM chopping mode with PWM Duty Cycle defined by
Control register bits C7:C5.
OUTx Voltage (V)
VM
Time (ms)
OUTx Current (mA)
VM/RL
DC*VM/RL
Time (ms)
Max-On time
PWM Chopping
Figure 31. Case 3: Timer Enable Bit (C8) is 1, Energizing Timing Bits (C4:C1) are NOT 0000, and PWM
Duty Bits (C7:C5) are NOT 000
The output is turned on in Energizing mode with 100% duty cycle for a duration set by Control register bits
C4:C1. After the timer expires, the output is turned off.
OUTx Voltage (V)
VM
Time (ms)
OUTx Current (mA)
VM/RL
Time (ms)
Max-On time
Figure 32. Case 4: Timer Enable Bit (C8) is 1, Energizing Timing Bits (C4:C1) are NOT 0000, and PWM
Duty Bits (C7:C5) are 00
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8.5.1.4.1 PWM Start Special Command Used
The output is turned on in Energizing mode with 100% duty cycle, and a timer is enabled with duration set by
Control register bits C4:C1. If the PWM Start special command is received before the timer expires, then the
output switches to PWM chopping mode with PWM Duty Cycle defined by Control register bits C7:C5. If the timer
expires and no PWM Start is received, then the device will stay in Energizing mode regardless of other PWM
Start commands.
OUTx Voltage (V)
VM
Time (ms)
OUTx Current (mA)
VM/RL
DC*VM/RL
Time (ms)
Max-On time
PWM Chopping
PWM Start
Figure 33. Case 5: Timer Enable Bit (C8) is 0, Energizing Timing Bits (C4:C1) are NOT 0000, and PWM
Duty Bits (C7:C5) are NOT 000
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8.6 Register Maps
8.6.1 Data Register
The Data register is used to control the status of each of the eight outputs:
Figure 34. Data Register
D8
OUT8
R/W
D7
OUT7
R/W
D6
OUT6
R/W
D5
OUT5
R/W
D4
OUT4
R/W
D3
OUT3
R/W
D2
OUT2
R/W
D1
OUT1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
When any bit is ‘1’, the corresponding output will be active. When any bit is ‘0’, the output will be inactive.
The data register is the default write location for the serial interface. In order to read back data from this register,
the Data Register Readout special command is used.
8.6.2 Fault Register
The Fault register can be read to determine if any channel exist fault condition. OCP is an overcurrent fault and
OLD is an open load fault. OLD is not included on the DRV8860A
Figure 35. Fault Register
F16
OUT8 OCP
R/W
F8
OUT8 OL
R/W
F15
OUT7 OCP
R/W
F7
OUT7 OL
R/W
F14
OUT6 OCP
R/W
F6
OUT6 OL
R/W
F13
OUT5 OCP
R/W
F5
OUT5 OL
R/W
F12
OUT4 OCP
R/W
F4
OUT4 OL
R/W
F11
OUT3 OCP
R/W
F3
OUT3 OL
R/W
F10
OUT2 OCP
R/W
F2
OUT2 OL
R/W
F9
OUT1 OCP
R/W
F1
OUT1 OL
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
When any fault occurs, nFAULT pin will be driven low and corresponding Fault register bit will be set up as ‘1’.
OCP is a flag indicating overcurrent fault. ODP is a flag indicating open load fault.
Fault bits can be reset by two approaches:
1. Special command ‘FAULT RESET’ clear all fault bits.
2. Setting Data register to ON will clear corresponding OLD bits (DRV8860 only)
Setting Data register to OFF will clear corresponding OCP bits.
8.6.3 Control Register
The Control register is used to adjust the Energizing Time and PWM Duty Cycle of outputs:
Figure 36. Control Register
C8
Over All Enable
R/W
C7
C6
PWM Duty Cycle control
R/W
C5
C4
C3
C2
Energizing Time control
R/W
C1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Special command ‘WRITE CONTROL REGISTER’ is used to program control register.
Special command ‘READ CONTROL REGISTER’ is used to read back control register content.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DRV8860 is an eight channel low side driver with protection features. The following design is a common
application of the DRV8860.
9.2 Typical Application
10uF
VM
DRV8860PWP
VM
VM
OUT1
DIN
OUT2
CLK
OUT3
LATCH
OUT4
GND
OUT5
DOUT
OUT6
nFAULT
OUT7
0.1uF
V3P3
ENABLE
PPAD
4.7kŸ
OUT8
9.2.1 Design Requirements
Table 5. Design Parameters
28
Parameter
Value
Input voltage range
8 V – 38 V
Current
330 mA per channel
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9.2.2 Detailed Design Procedure
9.2.2.1 Drive Current
The current path is from VM, through the load, into the low-side sinking driver. Power dissipation I2R losses in
one sink are calculated using Equation 1.
PD = I2 x RDS(on)
(1)
9.2.3 Application Curves
Figure 37. PWM Operation
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10 Power Supply Recommendations
The DRV8860 is designed to operate from an input voltage supply (VM) range between 8 and 38 V. A 0.1-µF
ceramic capacitor rated for VM must be placed as close as possible to the VM pin. In addition to the local
decoupling cap, additional bulk capacitance is required and must be sized accordingly to the application
requirements.
Bulk capacitance sizing is an important factor in motor drive system design. It is dependent on a variety of factors
including:
• Type of power supply
• Acceptable supply voltage ripple
• Parasitic inductance in the power supply wiring
• Type of load
• Load startup current
The inductance between the power supply and motor drive system will limit the rate current can change from the
power supply. If the local bulk capacitance is too small, the system will respond to excessive current demands or
dumps from the motor with a change in voltage. The user should size the bulk capacitance to meet acceptable
voltage ripple levels.
The datasheet generally provides a recommended value but system level testing is required to determine the
appropriate sized bulk capacitor.
Parasitic Wire
Inductance
Motor Drive System
Power Supply
VM
+
±
+
Motor
Driver
GND
Local
Bulk Capacitor
IC Bypass
Capacitor
Figure 38. Example Setup of Motor Drive System with External Power Supply
10.1 Power Supply and Logic Sequencing
There is no specific sequence for powering-up the DRV8860. It is okay for digital input signals to be present
before VM is applied. After VM is applied to the DRV8860, it begins operation based on the status of the control
pins.
30
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SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
11 Layout
11.1 Layout Guidelines
•
•
•
The VM pin should be bypassed to GND using a low-ESR ceramic bypass capacitor with a recommended
value of 0.1-μF rated for VM.
This capacitor should be placed as close as possible to the VM pin on the device with a thick trace or ground
plane connection to the device GND pin.
The VM pin must be bypassed to ground using and appropriate bulk capacitor. This component must be
located close to the DRV8860.
11.2 Layout Example
Where the pull-up voltage (V3P3) is an external supply in the range of the recommended operating conditions for
the digital open-drain outputs.
10 µF
0.1 µF
VM
OUT1
DIN
OUT2
CLK
OUT3
LATCH
OUT4
GND
OUT5
V3P3
DOUT
OUT6
nFAULT
OUT7
ENABLE
OUT8
Figure 39. DRV8860 Layout
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11.3 Thermal Consideration
The DRV8860 device has thermal shutdown (TSD) as described in the Thermal Shutdown (TSD) section. If the
die temperature exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high of an ambient temperature.
11.3.1 Power Dissipation
Power dissipation in the DRV8860 device is dominated by the power dissipated in the output FET resistance,
RDS(on). Use the following equation to calculate the estimated average power dissipation of each output when
running a driving a load.
PD = RDS(on) x IO 2
where:
•
•
•
PD is the power dissipation of one channel
RDS(on) is the resistance of each FET
IO is the RMS output current being applied to each channel
(2)
IO is equal to the average current into the channel. Note that at startup, this current is much higher than normal
running current; these peak currents and their duration must be also be considered.
The total device dissipation is the power dissipated in each channel added together.
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and
heatsinking.
NOTE
RDS(on) increases with temperature, so as the device heats, the power dissipation
increases. This fact must be taken into consideration when sizing the heatsink.
11.3.2 Heatsinking
The PowerPAD package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane,
this connection can be accomplished by adding a number of vias to connect the thermal pad to the ground plane.
On PCBs without internal planes, a copper area can be added on either side of the PCB to dissipate heat. If the
copper area is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat
between top and bottom layers.
For details about how to design the PCB, refer to the TI application report, PowerPAD™ Thermally Enhanced
Package (SLMA002), and the TI application brief, PowerPAD Made Easy™ (SLMA004), available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated.
32
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SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV8860APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
8860A
DRV8860APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
8860A
DRV8860PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
8860
DRV8860PWPR
ACTIVE
HTSSOP
PWP
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
8860PWP
DRV8860PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
8860
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DRV8860APWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
DRV8860PWPR
HTSSOP
PWP
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
DRV8860PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8860APWR
TSSOP
PW
16
2000
367.0
367.0
35.0
DRV8860PWPR
HTSSOP
PWP
16
2000
367.0
367.0
35.0
DRV8860PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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