ON NL17SZ14 Single inverter with schmitt trigger Datasheet

NL17SZ14
Single Inverter with
Schmitt Trigger
The NL17SZ14 is a single inverter with Schmitt trigger in two tiny
footprint packages. The device performs much as LCX multi−gate
products in speed and drive.
http://onsemi.com
Features
Tiny SOT−353 and SOT−553 Packages
Source/Sink 24 mA at 3.0 V
Over−Voltage Tolerant Inputs and Outputs
Pin For Pin with NC7SZ14
Designed for 1.65 V to 5.5 V VCC Operation
Chip Complexity: FET = 20
Pb−Free Packages are Available
NC
IN A
GND
MARKING
DIAGRAMS
SOT−353/SC70−5/SC−88A
DF SUFFIX
CASE 419A
5
1
LA M G
G
M
•
•
•
•
•
•
•
LA MG
G
VCC
SOT−553
XV5 SUFFIX
CASE 463B
2
3
4
LA
= Device Code
M
= Date Code*
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
OUT Y
Figure 1. Pinout
*Date Code orientation and/or position may
vary depending upon manufacturing location.
IN A
1
OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
NC
2
IN A
3
GND
4
OUT Y
5
VCC
A Input
Y Output
L
H
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
December, 2005 − Rev. 7
1
Publication Order Number:
NL17SZ14/D
NL17SZ14
MAXIMUM RATINGS
Symbol
VCC
Characteristics
Value
Unit
*0.5 to )7.0
V
*0.5 ≤ VI ≤ )7.0
V
*0.5 ≤ VO ≤ 7.0
V
VI < GND
*50
mA
VO < GND
*50
mA
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Output in High or LOW State (Note 1)
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
PD
Power Dissipation in Still Air
SOT−353
SOT−553
186
135
mW
qJA
Thermal Resistance
SOT−353
SOT−553
350
496
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
)150
°C
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
ESD
ESD Classification
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class 2
Class C
N/A
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(High or LOW State)
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
http://onsemi.com
2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
*40
)85
°C
0
0
0
No Limit
No Limit
No Limit
ns/V
NL17SZ14
DC ELECTRICAL CHARACTERISTICS
Symbol
VT)
VT*
VH
VOH
VOL
IIN
Parameter
Min
Typ
Max
Min
Max
Unit
1.65
0.6
1.0
1.4
0.6
1.4
V
2.3
1.0
1.5
1.8
1.0
1.8
2.7
1.2
1.7
2.0
1.2
2.0
3.0
1.3
1.9
2.2
1.3
2.2
4.5
1.9
2.7
3.1
1.9
3.1
5.5
2.2
3.3
3.6
2.2
3.6
1.65
0.2
0.5
0.8
0.2
0.8
2.3
0.4
0.75
1.15
0.4
1.15
2.7
0.5
0.87
1.4
0.5
1.4
3.0
0.6
1.0
1.5
0.6
1.5
4.5
1.0
1.5
2.0
1.0
2.0
5.5
1.2
1.9
2.3
1.2
2.3
1.65
0.1
0.48
0.9
0.1
0.9
2.3
0.25
0.75
1.1
0.25
1.1
2.7
0.3
0.83
1.15
0.3
1.15
3.0
0.4
0.93
1.2
0.4
1.2
4.5
0.6
1.2
1.5
0.6
1.5
5.5
0.7
1.4
1.7
0.7
1.7
1.65 to 5.5
VCC − 0.1
VCC
VCC − 0.1
IOH = −3 mA
1.65
1.29
1.52
1.29
IOH = *8 mA
2.3
1.9
2.1
1.9
IOH = *12 mA
2.7
2.2
2.4
2.2
IOH = *16 mA
3.0
2.4
2.7
2.4
IOH = *24 mA
3.0
2.3
2.5
2.3
IOH = *32 mA
4.5
3.8
4.0
3.8
Condition
Positive Input
Threshold Voltage
Negative Input
Threshold Voltage
Input Hysteresis Voltage
High−Level Output
Voltage
VIN = VIH or VIL
Low−Level Output
Voltage
VIN = VIH or VIL
*40°C ≤ TA ≤ 85°C
TA = 25°C
VCC
(V)
IOH = −100 mA
IOL = 100 mA
V
V
V
V
1.65 to 5.5
0.0
0.1
0.1
IOL = 4 mA
1.65
0.08
0.24
0.24
IOL = 8 mA
2.3
0.2
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
0 to 5.5
$0.1
$1.0
mA
0
1
10
mA
5.5
1
10
mA
Input Leakage Current
VIN = VCC or GND
IOFF
Power Off−Output
Leakage Current
VOUT = 5.5 V
ICC
Quiescent Supply
Current
VIN = VCC or GND
http://onsemi.com
3
NL17SZ14
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
Symbol
tPLH
tPHL
Min
Typ
Max
Min
Max
Unit
RL = 1 MW, CL = 15 pF
1.65
1.8
2.5 $ 0.2
3.3 $ 0.3
5.0 $ 0.5
2.0
2.0
1.0
1.0
0.5
9.1
7.6
5.0
3.7
3.1
15
12.5
9.0
6.3
5.2
2.0
2.0
1.0
1.0
0.5
15.6
13
9.5
6.5
5.5
ns
RL = 500 W, CL = 50 pF
3.3 $ 0.3
5.0 $ 0.5
1.5
0.8
4.4
3.7
7.2
5.9
1.5
0.8
7.5
6.2
Parameter
Condition
Propagation Delay
(Figure 3 and 4)
*405C v TA v 855C
TA = 255C
VCC
(V)
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CPD
Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
Typical
Unit
u4.0
pF
25
30
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
VCC
A or B
OUTPUT
50%
GND
tPLH
Y
RL
tPHL
CL
INPUT
50% VCC
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order
Number
Package
Type
Tape and
Reel Size†
NL17SZ14DFT2
SOT−353/SC70−5/SC−88A
3000 / Tape & Reel
NL17SZ14DFT2G
SOT−353/SC70−5/SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SZ14XV5T2
SOT−553*
3000 / Tape & Reel
NL17SZ14XV5T2G
SOT−553*
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb−Free.
http://onsemi.com
4
NL17SZ14
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−− 0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
mm Ǔ
ǒinches
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ14
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B−01
ISSUE B
D
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
A
L
4
1
e
2
3
E
−Y−
HE
b 5 PL
0.08 (0.003)
c
M
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
DIM
A
b
c
D
E
e
L
HE
X Y
MIN
0.50
0.17
0.08
1.50
1.10
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
http://onsemi.com
6
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NL17SZ14/D
Similar pages