HSMB-Cxxx Surface Mount Chip LEDs Data Sheet HSMB-C190, HSMB-C170, HSMB-C110, HSMB-C150, HSMB-C191 Description Features These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. • • • • • • • • The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMBC170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 and HSMB-C191 have the industry standard 1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for HSMB-C190 and 0.6 mm for HSMB-C191) and wide viewing angles make these LEDs exceptional for backlighting applications. The HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of –30°C to +85°C Right Angle Package Available SiC Blue Color Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • • • • • Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Device Selection Guide Footprint (mm) 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] 3.20 x 1.60 Note: SiC Blue HSMB-C170 HSMB-C190/C191 HSMB-C110 HSMB-C150 Parts Per Reel 4000 4000 3000 3000 1. Right-angle package. CAUTION: HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED DIE CATHODE MARK LED DIE 1.25 (0.049) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 2.0 (0.079 ) 1.0 (0.039) POLARITY 1.4 (0.055) DIFFUSED EPOXY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.62 (0.024) POLARITY 0.8 (0.031) PC BOARD 0.3 (0.012) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMB-C170 HSMB-C190 HSMB-C190 Pkg Dimen - b (C170) HSMB-C190 Pkg Dimen - a (C190) CATHODE LINE LED DIE CATHODE MARK LED DIE 1.0 (0.039) 1.6 (0.063) 2.6 (0.102 ) 0.8 (0.031) 3.2 (0.126 ) POLARITY 3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) PC BOARD CATHODE LINE CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 1.0 (0.039) SOLDERING TERMINAL HSMB-C110 HSMB-C110 SOLDERING TERMINAL HSMB-C150 HSMx-C190 Pkg Dimen - a (C150) CATHODE MARK LED DIE 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.6 (0.023) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C191 HSMB-C191 NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Absolute Maximum Ratings at TA=25°C Parameter HSMB-C190/C170/C110/C150/C191 DC Forward Current[1] 20 [2] Peak Pulsing Current 100 Power Dissipation 92 Reverse Voltage (IR = 100 µA) 5 Maximum LED Junction Temperature 95 Operating Temperature Range -30 to +85 Storage Temperature Range -40 to +85 Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Units mA mA mW V °C °C °C Optical Characteristics at TA=25°C Luminous Intensity[1] Part No. Color Iv (mcd) @ 20 mA Min. Typ. HSMBSiC Blue 1.80 6.0 C190/C170/ C150/C191 HSMB-C110 SiC Blue 1.80 6.5 Notes: Peak Wavelength λpeak (nm) Typ. 428 Dominant Wavelength λd (nm) Typ. 466 Viewing Angle 2θ1/2 (degrees)[2] Typ. 170 428 466 130 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25°C Forward Voltage VF (Volts) Part No. @ IF = 20 mA Typ. Max. HSMB-C190/C170/C150/C191 3.8 4.6 HSMB-C110 3.8 4.6 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 Thermal Resistance RθJ-P (°C/W) Typ. 300 300 Capacitance C (pF) @ VF = 0 V, f = 1 MHz Typ. 67 67 VF Tolerance: ±0.1 V Light Intensity (Iv) Bin Limits[1] Blue Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Tolerance: ±1 nm Note: 1. Bin categories are established for class ification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. A 0.11 0.18 N 28.50 B 0.18 0.29 P 45.00 C 0.29 0.45 Q 71.50 D 0.45 0.72 R 112.50 E 0.72 1.10 S 180.00 F 1.10 1.80 T 285.00 G 1.80 2.80 U 450.00 H 2.80 4.50 V 715.00 J 4.50 7.20 W 1125.00 K 7.20 11.20 X 1800.00 L 11.20 18.00 Y 2850.00 M 18.00 28.50 Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Tolerance: ±15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 100 80 60 40 20 0 380 480 580 10 1 0.1 680 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA RELATIVE INTENSITY – % 100 3.0 WAVELENGTH – nm 3.2 3.4 3.6 3.8 Figure 2. Forward Current vs. Forward Voltage. 0.4 0.2 0 5 10 15 HSMB-C190 fig 3 100 90 RELATIVE INTENSITY – % 20 15 10 5 80 70 60 50 40 30 20 10 0 0 20 40 60 80 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. HSMB-C190 fig 4 100 HSMB-C190 fig 5a RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMB-C110. HSMB-C190 fig 5b 20 Figure 3. Relative Luminous Intensity vs. Forward Current. HSMB-C190 fig 2 IF MAX. – MAXIMUM FORWARD CURRENT – mA 0.6 IF – FORWARD CURRENT – mA HSMB-C190 fig 1 25 0.8 0 4.0 VF – FORWARD VOLTAGE – V Figure 1. Relative Intensity vs. Wavelength. 1.0 25 100 80 70 60 10 SEC. MAX. 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 230°C MAX. TEMPERATURE RELATIVE INTENSITY – % 90 0 4°C/SEC. MAX. 140-160°C –3°C/SEC. MAX. 4°C/SEC. MAX. 10 20 30 40 50 60 70 80 90 OVER 2 MIN. TIME ANGLE Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191. HSMB-C190 fig 6 Figure 7. Recommended reflow soldering profile. HSMB-C190 fig 7 TEMPERATURE 10 - 30 SEC. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 150 °C 1.2 (0.047) 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) (Acc. to J-STD-020C) Figure 8. Recommended Pb-free Reflow Soldering Profile. Figure 9. Recommended Soldering Pattern for HSMB-C170. HSMB-C190 fig 8 5.0 (0.200) 0.8 (0.031) 0.9 (0.035) 0.9 (0.035) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 10. Recommended Soldering Pattern for HSMB-C190 and C191. HSMB-C190 fig 9 Note: 1. All dimensions in millimeters (inches). 1.0 (0.039) 0.2 (0.008) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 11. Recommended Soldering Pattern for HSMB-C110. HSSM-C110 fig 8 USER FEED DIRECTION 1.5 (0.059) CATHODE SIDE 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) PRINTED LABEL Figure 12. Recommended Soldering Pattern for HSMB-C150. Figure 13. Reeling Orientation. HSMX-C190 fig 8 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 14. Reel Dimensions. Note: 1. All dimensions in millimeters (inches). 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) USER FEED DIRECTION 4.00 (0.157) HSMx-C110 POSITION IN CARRIER TAPE HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) 1.85 (0.073) 1.80 (0.071) 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) R 1.0 ± 0.05 (0.039 ± 0.002) DIM. B (SEE TABLE 1) Figure 15. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 16. Tape Leader and Trailer Dimensions. Notes: HSMB-C190 fig 14 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified. COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A (SEE TABLE 1) CARRIER TAPE MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 0.88 (0.035) 0.95 (0.037) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 0.85 (0.033) 0.87 (0.034) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0417EN AV02-0613EN - July 27, 2007