TI1 ADC08D502 High performance, low power, dual 8-bit, 500 msps a/d converter Datasheet

ADC08D502
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ADC08D502 High Performance, Low Power, Dual 8-Bit, 500 MSPS A/D Converter
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FEATURES
DESCRIPTION
•
•
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The ADC08D502 is a dual, low power, high
performance CMOS analog-to-digital converter that
digitizes signals to 8 bits resolution at sampling rates
up to 500 MSPS. Consuming a typical 1.4 Watts at
500 MSPS from a single 1.9 Volt supply, this device
is specified to have no missing codes over the full
operating temperature range. The unique folding and
interpolating architecture, the fully differential
comparator design, the innovative design of the
internal sample-and-hold amplifier and the selfcalibration scheme enable a very flat response of all
dynamic parameters beyond Nyquist, producing a
high 7.5 ENOB with a 250 MHz input signal and a
500 MHz sample rate while providing a 10-18 B.E.R.
Output formatting is offset binary and the LVDS
digital outputs are compatible with IEEE 1596.3-1996,
with the exception of an adjustable common mode
voltage between 0.8V and 1.2V.
1
2
•
Internal Sample-and-Hold
Single +1.9V ±0.1V Operation
Choice of SDR or DDR Output Clocking
Multiple ADC Synchronization Capability
Specified No Missing Codes
Serial Interface for Extended Control
Fine Adjustment of Input Full-Scale Range and
Offset
Duty Cycle Corrected Sample Clock
APPLICATIONS
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•
•
•
•
Direct RF Down Conversion
Digital Oscilloscopes
Satellite Set-top boxes
Communications Systems
Test Instrumentation
KEY SPECIFICATIONS
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Resolution: 8 Bits
Max Conversion Rate: 500 MSPS (min)
Bit Error Rate: 10-18 (typ)
ENOB @ 250 MHz Input: 7.5 Bits (typ)
DNL: ±0.15 LSB (typ)
Power Consumption
– Operating: 1.4 W (typ)
– Power Down Mode: 3.5 mW (typ)
Each converter has a 1:2 demultiplexer that feeds
two LVDS buses and reduces the output data rate on
each bus to half the sampling rate.
The converter typically consumes less than 3.5 mW
in the Power Down Mode and is available in a 128lead, thermally enhanced exposed pad HLQFP and
operates over the Industrial (-40°C ≤ TA ≤ +85°C)
temperature range.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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ADC08D502
SNOSC85A – AUGUST 2012 – REVISED APRIL 2013
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Block Diagram
I CHANNEL
VINI+
+
VINI-
-
S/H
1:2 DEMUX
& LATCH
8-BIT
ADC
DIOUT
DIOUTD
Data Bus Output
16 LVDS Pairs
INPUT
MUX
Q CHANNEL
VINQ+
+
VINQ-
-
S/H
8-BIT
ADC
1:2 DEMUX
& LATCH
DQOUT
Data Bus Output
16 LVDS Pairs
DQOUTD
VREF
VBG
CLK+
2
CLK-
Control
Inputs
Serial
Interface
2
CLK/2
Output
Clock
Generator
DCLK+
DCLK-
OR
Control
Logic
CalRun
3
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
NC
DR GND
DId6+
DId6DId7+
DId7DI0+
DI0DI1+
DI1VDR
NC
DR GND
ADC08D502
*
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
DI2+
DI2DI3+
DI3DI4+
DI4DI5+
DI5VDR
DR GND
DI6+
DI6DI7+
DI7DCLK+
DCLKOROR+
DQ7DQ7+
DQ6DQ6+
DR GND
VDR
DQ5DQ5+
DQ4DQ4+
DQ3DQ3+
DQ2DQ2+
GND
DR GND
DQd2+
DQd2DQd3+
DQd3DQd4+
DQd4DQd5+
DQd5VDR
NC
DR GND
DQd6+
DQd6DQd7+
DQd7DQ0+
DQ0DQ1+
DQ1VDR
NC
DR GND
VA
Tdiode_p
Tdiode_n
DQd0+
DQd0DQd1+
DQd1VDR
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
GND
VA
OUTV/SCLK
OutEdge/DDR/SDATA
VA
GND
VCMO
VA
GND
VINIVINI+
GND
VA
FSR/ECE
DCLK_RST
VA
VA
CLK+
CLKVA
GND
VINQ+
VINQGND
VA
PD
GND
VA
PDQ
CAL
VBG
REXT
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
VA
CalDly/SCS
CalRun
DId0+
DId0DId1+
DId1VDR
NC
DR GND
DId2+
DId2DId3+
DId3DId4+
DId4DId5+
DId5VDR
Pin Configuration
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
VA
Output Voltage Amplitude and Serial Interface Clock. Tie this pin
high for normal differential DCLK and data amplitude. Ground this
pin for a reduced differential output amplitude and reduced power
consumption. When the extended control mode is enabled, this pin
functions as the SCLK input which clocks in the serial data.
50k
3
OutV / SCLK
GND
VA
50k
4
OutEdge / DDR /
SDATA
50k
200k
DDR
8 pF
GND
DCLK Edge Select, Double Data Rate Enable and Serial Data
Input. This input sets the output edge of DCLK+ at which the output
data transitions. When this pin is floating or connected to 1/2 the
supply voltage, DDR clocking is enabled. When the extended
control mode is enabled, this pin functions as the SDATA input.
SDATA
VA
DCLK Reset. A positive pulse on this pin is used to reset and
synchronize the DCLK outs of multiple converters.
15
DCLK_RST
26
PD
Power Down Pins. A logic high on the PD pin puts the entire device
into the Power Down Mode.
30
CAL
Calibration Cycle Initiate. A minimum 80 input clock cycles logic low
followed by a minimum of 80 input clock cycles high on this pin
initiates the self calibration sequence.
VA
GND
VA
50 k:
29
A logic high on the PDQ pin puts only the "Q" ADC into the Power
Down mode.
PDQ
GND
VA
50k
14
FSR/ECE
200k
50k 8 pF
Full Scale Range Select and Extended Control Enable. In nonextended control mode, a logic low on this pin sets the full-scale
differential input range to 650 mVP-P. A logic high on this pin sets
the full-scale differential input range to 870 mVP-P. To enable the
extended control mode, whereby the serial interface and control
registers are employed, allow this pin to float or connect it to a
voltage equal to VA/2.
GND
4
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
VA
Calibration Delay and Serial Interface Chip Select. With a logic high
or low on pin 14, this pin functions as Calibration Delay and sets
the number of clock cycles after power up before calibration
begins. With pin 14 floating, this pin acts as the enable pin for the
serial interface input and the CalDly value becomes 0b (short delay
with no provision for a long power-up calibration delay). When this
pin is floating or connected to a voltage equal to VA/2,
50k
127
CalDly / SCS
50k
GND
VA
18
19
CLK+
CLK-
50k
AGND
100
VA
VBIAS
50k
LVDS Clock input pins for the ADC. The differential clock signal
must be a.c. coupled to these pins. The input signal is sampled on
the falling edge of CLK+.
AGND
VA
50k
11
10
.
22
23
VINI+
VINI−
.
VINQ+
VINQ−
AGND
VCMO
100
Control from VCMO
Analog signal inputs to the ADC. The differential full-scale input
range is 650 mVP-P when the FSR pin is low, or 870 mVP-P when
the FSR pin is high.
VA
50k
AGND
VA
VCM
200k
Enable AC
Coupling
8 pF
GND
7
VCMO
Common Mode Voltage. This pin is the common mode output in
d.c. coupling mode and also serves as the a.c. coupling mode
select pin. When d.c. coupling is used, the voltage output at this pin
is required to be the common mode input voltage at VIN+ and VIN−
when d.c. coupling is used. This pin should be grounded when a.c.
coupling is used at the analog inputs. This pin is capable of
sourcing or sinking 100 μA.
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)
Pin Functions
Pin No.
Symbol
31
VBG
Equivalent Circuit
Description
Bandgap output voltage capable of 100 μA source/sink.
VD
126
Calibration Running indication. This pin is at a logic high when
calibration is running.
CalRun
DGND
VA
32
V
REXT
External bias resistor connection. Nominal value is 3.3k-Ohms
(±0.1%) to ground.
GND
Tdiode_P
34
35
6
Tdiode_P
Tdiode_N
Tdiode_N
Temperature Diode Positive (Anode) and Negative (Cathode).
These pins may be used for die temperature measurements,
however no specified accuracy is implied or ensured. Noise
coupling from adjacent output data signals has been shown to
affect temperature measurements using this feature.
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PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
83 / 78
84 / 77
85 / 76
86 / 75
89 / 72
90 / 71
91 / 70
92 / 69
93 / 68
94 / 67
95 / 66
96 / 65
100 / 61
101 / 60
102 / 59
103 / 58
DI7− / DQ7−
DI7+ / DQ7+
DI6− / DQ6−
DI6+ / DQ6+
DI5− / DQ5−
DI5+ / DQ5+
DI4− / DQ4−
DI4+ / DQ4+
DI3− / DQ3−
DI3+ / DQ3+
DI2− / DQ2−
DI2+ / DQ2+
DI1− / DQ1−
DI1+ / DQ1+
DI0− / DQ0−
DI0+ / DQ0+
104 / 57
105 / 56
106 / 55
107 / 54
111 / 50
112 / 49
113 / 48
114 / 47
115 / 46
116 / 45
117 / 44
118 / 43
122 / 39
123 / 38
124 / 37
125 / 36
DId7− / DQd7−
DId7+ / DQd7+
DId6− / DQd6−
DId6+ / DQd6+
DId5− / DQd5−
DId5+ / DQd5+
DId4− / DQd4−
DId4+ / DQd4+
DId3− / DQd3−
DId3+ / DQd3+
DId2− / DQd2−
DId2+ / DQd2+
DId1− / DQd1−
DId1+ / DQd1+
DId0− / DQd0−
DId0+ / DQd0+
79
80
OR+
OR-
Out Of Range output. A differential high at these pins indicates that
the differential input is out of range (outside the range ±325 mV or
±435 mV as defined by the FSR pin).
82
81
DCLK+
DCLK-
Differential Clock outputs used to latch the output data. Delayed
and non-delayed data outputs are supplied synchronous to this
signal. This signal is at 1/2 the input clock rate in SDR mode and at
1/4 the input clock rate in the DDR mode. The DCLK outputs are
not active during a calibration cycle, therefore this is not
recommended as a system clock.
2, 5, 8, 13,
16, 17, 20,
25, 28, 33,
128
VA
40, 51 ,62,
73, 88, 99,
110, 121
VDR
Output Driver power supply pins. Bypass these pins to DR GND.
1, 6, 9, 12,
21, 24, 27,
41
GND
Ground return for VA.
42, 53, 64,
74, 87, 97,
108, 119
DR GND
Ground return for VDR.
52, 63, 98,
109, 120
NC
I and Q channel LVDS Data Outputs that are not delayed in the
output demultiplexer. Compared with the DId and DQd outputs,
these outputs represent the later time samples. These outputs
should always be terminated with a 100Ω differential resistor.
VDR
-
+
-
+
I and Q channel LVDS Data Outputs that are delayed by one CLK
cycle in the output demultiplexer. Compared with the DI/DQ
outputs, these outputs represent the earlier time sample. These
outputs should always be terminated with a 100Ω differential
resistor.
DR GND
Analog power supply pins. Bypass these pins to ground.
No Connection. Make no connection to these pins.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
Supply Voltage (VA, VDR)
2.2V
Supply Difference
VDR - VA
0V to 100 mV
Voltage on Any Input Pin
(Except VIN+, VIN- )
−0.15V to (VA +0.15V)
Voltage on VIN+, VIN(Maintaining Common Mode)
-0.15V to 2.5V
Ground Difference
|GND - DR GND|
0V to 100 mV
Input Current at Any Pin
Package Input Current
(4)
±25 mA
(4)
±50 mA
Power Dissipation at TA = 85°C
2.0 W
ESD Susceptibility (5)
Human Body Model
Machine Model
2500V
250V
Soldering Temperature, Infrared,
10 seconds (6)
235°C
−65°C to +150°C
Storage Temperature
(1)
(2)
(3)
(4)
(5)
(6)
All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the
Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific
performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin
should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the
power supplies with an input current of 25 mA to two. This limit is not placed upon the power, ground and digital output pins.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO
Ohms.
See http://www.ti.com for other methods of soldering surface mount devices.
Operating Ratings (1) (2)
−40°C ≤ TA ≤ +85°C
Ambient Temperature Range
Supply Voltage (VA)
+1.8V to +2.0V
Driver Supply Voltage (VDR)
+1.8V to VA
Analog Input Common Mode Voltage
VCMO ±50mV
VIN+, VIN- Voltage Range (Maintaining Common Mode)
Ground Difference
(|GND - DR GND|)
0V
CLK Pins Voltage Range
0V to VA
Differential CLK Amplitude
(1)
(2)
8
0V to 2.15V
(100% duty cycle)
0V to 2.5V
(10% duty cycle)
0.4VP-P to 2.0VP-P
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no specification of operation at the
Absolute Maximum Ratings. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific
performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply
only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
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Package Thermal Resistance (1)
Package
θJA
θJC (Top of Package)
θJ-PAD (Thermal Pad)
128-Lead Exposed Pad
HLQFP
25°C / W
10°C / W
2.8°C / W
(1)
Soldering process must comply with Texas Instrument's Reflow Temperature Profile specifications. Refer to SNOA549.
Converter Electrical Characteristics
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω
Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2)
Symbol
Parameter
Conditions
Typical
Limits
(3)
Units
(Limits)
(3)
STATIC CONVERTER CHARACTERISTICS
INL
Integral Non-Linearity
DC Coupled, 1MHz Sine Wave Over
ranged
±0.3
±0.9
LSB (max)
DNL
Differential Non-Linearity
DC Coupled, 1MHz Sine Wave Over
ranged
±0.15
±0.6
LSB (max)
8
Bits
-0.45
−1.5
0.5
LSB (min)
LSB (max)
−0.6
±25
mV (max)
−1.31
±25
mV (max)
±20
±15
%FS
Resolution with No Missing Codes
VOFF
Offset Error
VOFF_ADJ
Input Offset Adjustment Range
PFSE
Positive Full-Scale Error
NFSE
Negative Full-Scale Error
FS_ADJ
Full-Scale Adjustment Range
Extended Control Mode
(4)
(4)
Extended Control Mode
±45
mV
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
Full Power Bandwidth
B.E.R.
Bit Error Rate
Gain Flatness
ENOB
SINAD
(1)
Effective Number of Bits
Signal-to-Noise Plus Distortion Ratio
1.7
GHz
10-18
Error/Sample
d.c. to 500 MHz
±0.5
dBFS
fIN = 50 MHz, VIN = FSR − 0.5 dB
7.5
Bits
fIN = 100 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.5
7.1
Bits (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
47
fIN = 100 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
47
44.5
dB (min)
dB
The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this
device.
V
A
TO INTERNAL
CIRCUITRY
I/O
GND
(2)
(3)
(4)
To ensure accuracy, it is required that VA and VDR be well bypassed. Each supply pin must be decoupled with separate bypass
capacitors. Additionally, achieving rated performance requires that the backside exposed pad be well grounded.
Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average Outgoing
Quality Level).
Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for
this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Transfer Characteristic Figure 2. For
relationship between Gain Error and Full-Scale Error, see Specification Definitions for Gain Error.
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Converter Electrical Characteristics (continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω
Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2)
Symbol
SNR
Total Harmonic Distortion
2nd Harm
3rd Harm
IMD
Conditions
Signal-to-Noise Ratio
THD
SFDR
Parameter
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free dynamic Range
Intermodulation Distortion
Out of Range Output Code
(In addition to OR Output high)
Typical
(3)
Limits
(3)
Units
(Limits)
fIN = 50 MHz, VIN = FSR − 0.5 dB
48
fIN = 100 MHz, VIN = FSR − 0.5 dB
48
45.3
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
47.5
45.3
dB (min)
fIN = 50 MHz, VIN = FSR − 0.5 dB
-55
fIN = 100 MHz, VIN = FSR − 0.5 dB
-55
−47.5
dB (max)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-55
−47.5
dB (max)
fIN = 50 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 50 MHz, VIN = FSR − 0.5 dB
55
fIN = 100 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
fIN1 = 121 MHz, VIN = FSR − 7 dB
fIN2 = 126 MHz, VIN = FSR − 7 dB
-50
dB
dB
dB
dB
(VIN+) − (VIN−) > + Full Scale
255
(VIN+) − (VIN−) < − Full Scale
0
ANALOG INPUT AND REFERENCE CHARACTERISTICS
VCMI
Analog Input Common Mode Voltage
CIN
Analog Input Capacitance
(5)
(6)
10
650
FSR pin 14 High
870
Full Scale Analog Differential Input
Range
VIN
RIN
FSR pin 14 Low
(5) (6)
VCMO
Differential
0.02
Each input pin to ground
1.6
Differential Input Resistance
100
570
mVP-P (min)
730
mVP-P (max)
790
mVP-P (min)
950
mVP-P (max)
VCMO − 50
VCMO + 50
mV (min)
mV (max)
pF
pF
94
Ω (min)
106
Ω (max)
The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF
each pin to ground are isolated from the die capacitances by lead and bond wire inductances.
This parameter is specified by design and is not tested in production.
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Converter Electrical Characteristics (continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω
Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2)
Symbol
Parameter
Conditions
Typical
Limits
(3)
Units
(Limits)
1.26
0.95
1.45
V (min)
V (max)
(3)
ANALOG OUTPUT CHARACTERISTICS
VCMO
Common Mode Output Voltage
VCMO_LVL
VCMO input threshold to set DC
Coupling mode
TC VCMO
Common Mode Output Voltage
Temperature Coefficient
CLOAD
VCMO
Maximum VCMO load Capacitance
VBG
Bandgap Reference Output Voltage
IBG = ±100 µA
TC VBG
Bandgap Reference Voltage
Temperature Coefficient
TA = −40°C to +85°C, IBG = ±100 µA
CLOAD VBG
Maximum Bandgap Reference Load
Capacitance
VA = 1.8V
0.60
V
VA = 2.0V
0.66
V
TA = −40°C to +85°C
118
ppm/°C
1.26
80
pF
1.20
1.33
V (min)
V (max)
28
ppm/°C
80
pF
TEMPERATURE DIODE CHARACTERISTICS
ΔVBE
Temperature Diode Voltage
192 µA vs. 12 µA,
TJ = 25°C
71.23
mV
192 µA vs. 12 µA,
TJ = 85°C
85.54
mV
1
LSB
1
LSB
CHANNEL-TO-CHANNEL CHARACTERISTICS
Offset Error Match
Positive Full-Scale Error Match
Zero offset selected in Control Register
Negative Full-Scale Error Match
Zero offset selected in Control Register
1
LSB
Phase Matching (I, Q)
FIN = 1.0 GHz
<1
Degree
X-TALK
Crosstalk from I (Aggressor) to Q
(Victim) Channel
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
−71
dB
X-TALK
Crosstalk from Q (Aggressor) to I
(Victim) Channel
Aggressor = 867 MHz F.S.
Victim = 100 MHz F.S.
-71
dB
Sine Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
Square Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
CLOCK INPUT CHARACTERISTICS
VID
II
CIN
Differential Clock Input Level
Input Current
Input Capacitance
VIN = 0 or VIN = VA
(7) (8)
±1
µA
Differential
0.02
pF
Each input to ground
1.5
pF
DIGITAL CONTROL PIN CHARACTERISTICS
VIH
Logic High Input Voltage
(9)
0.85 x VA
V (min)
VIL
Logic Low Input Voltage
(9)
0.15 x VA
V (max)
CIN
Input Capacitance
(8) (10)
Each input to ground
1.2
pF
(7)
The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF
each pin to ground are isolated from the die capacitances by lead and bond wire inductances.
(8) This parameter is specified by design and is not tested in production.
(9) This parameter is specified by design and/or characterization and is not tested in production.
(10) The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated
from the die capacitances by lead and bond wire inductances.
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Converter Electrical Characteristics (continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω
Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2)
Symbol
Parameter
Typical
Conditions
(3)
Limits
(3)
Units
(Limits)
400
mVP-P (min)
920
mVP-P (max)
DIGITAL OUTPUT CHARACTERISTICS
Measured differentially, OutV = VA,
VBG = Floating, (11)
VOD
710
LVDS Differential Output Voltage
Measured differentially, OutV = GND,
VBG = Floating, (11)
Δ VO DIFF
Change in LVDS Output Swing
Between Logic Levels
VOS
Output Offset Voltage, see Figure 1
VOS
Output Offset Voltage, see Figure 1
Δ VOS
Output Offset Voltage Change
Between Logic Levels
IOS
Output Short Circuit Current
ZO
Differential Output Impedance
VOH
Cal_Run High level output
IOH = -400uA
VOL
Cal_Run Low level output
IOH = 400uA
510
280
mVP-P (min)
720
mVP-P (max)
±1
mV
VBG = Floating
800
mV
VBG = VA (11)
1200
mV
±1
mV
−4
mA
Output+ & Output- connected to 0.8V
100
(12)
(12)
Ohms
1.65
1.5
V
0.15
0.3
V
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
561
340
1.8
665
408
mA (max)
mA
mA
IDR
Output Driver Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
200
112
0.012
275
157
mA (max)
mA (max)
mA
PD
Power Consumption
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
1.4
0.8
3.5
1.78
1.0
W (max)
W
mW
PSRR1
D.C. Power Supply Rejection Ratio
Change in Full Scale Error with change
in VA from 1.8V to 2.0V
30
dB
PSRR2
A.C. Power Supply Rejection Ratio
248 MHz, 50mVP-P riding on VA
51
dB
AC ELECTRICAL CHARACTERISTICS
fCLK1
Maximum Input Clock Frequency
fCLK2
Minimum Input Clock Frequency
Input Clock Duty Cycle
500
MHz (min)
50
20
80
% (min)
% (max)
200
(12)
MHz
Input Clock Low Time
(12)
500
400
ps (min)
Input Clock High Time
(12)
500
400
ps (min)
DCLK Duty Cycle
(12)
50
45
55
% (min)
% (max)
tRS
Reset Setup Time
(12)
150
ps
tRH
Reset Hold Time
(12)
250
ps
tSD
Synchronizing Edge to DCLK Output
Delay
3.53
3.85
ns
tRPW
Reset Pulse Width
tLHT
Differential Low to High Transition
Time
tCL
tCH
fCLKIN = 500 MHz
fCLKIN = 200 MHz
(13)
10% to 90%, CL = 2.5 pF
4
250
Clock Cycles
(min)
ps
(11) Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above.
Tying VBG to the supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
(12) This parameter is specified by design and/or characterization and is not tested in production.
(13) This parameter is specified by design and is not tested in production.
12
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Converter Electrical Characteristics (continued)
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 500 MHz at 0.5VP-P with 50% duty cycle, VBG =
Floating, Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω
Differential. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2)
Symbol
Parameter
Conditions
Typical
(3)
Limits
(3)
Units
(Limits)
tHLT
Differential High to Low Transition
Time
10% to 90%, CL = 2.5 pF
250
ps
tOSK
DCLK to Data Output Skew
50% of DCLK transition to 50% of Data
transition, SDR Mode
and DDR Mode, 0° DCLK (12)
±50
ps (max)
tSU
Data to DCLK Set-Up Time
DDR Mode, 90° DCLK
(12)
2
ns
(12)
2
ns
tH
DCLK to Data Hold Time
DDR Mode, 90° DCLK
tAD
Sampling (Aperture) Delay
Input CLK+ Fall to Acquisition of Data
tAJ
Aperture Jitter
tOD
Input Clock to Data Output Delay (in
addition to Pipeline Delay)
50% of Input Clock transition to 50% of
Data transition
Pipeline Delay (Latency)
DI, DQ Outputs
13
DId, DQd Outputs
14
(13) (14)
Over Range Recovery Time
Differential VIN step from ±1.2V to 0V
to get accurate conversion
1.3
ns
0.4
ps rms
3.1
ns
Clock Cycles
1
Input Clock
Cycle
500
ns
tWU
PD low to Rated Accuracy Conversion
(Wake-Up Time)
fSCLK
Serial Clock Frequency
(12)
100
MHz
tSSU
Data to Serial Clock Setup Time
(12)
2.5
ns (min)
tSH
Data to Serial Clock Hold Time
(12)
1
ns (min)
Serial Clock Low Time
4
Serial Clock High Time
4
1.4 x 105
ns (min)
ns (min)
tCAL
Calibration Cycle Time
Clock Cycles
tCAL_L
CAL Pin Low Time
See Figure 9
(15)
80
Clock Cycles
(min)
tCAL_H
CAL Pin High Time
See Figure 9
(15)
80
Clock Cycles
(min)
tCalDly
Calibration delay determined by pin
127
See Figure 9,
(16)
225
Clock Cycles
(min)
tCalDly
Calibration delay determined by pin
127
See Figure 9,
(16)
231
Clock Cycles
(max)
(14) Each of the two converters of the ADC08D502 has two LVDS output buses, which each clock data out at one half the sample rate. The
data at each bus is clocked out at one half the sample rate. The second bus (D0 through D7) has a pipeline latency that is one clock
cycle less than the latency of the first bus (Dd0 through Dd7)
(15) This parameter is specified by design and is not tested in production.
(16) Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above.
Tying VBG to the supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
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Specification Definitions
APERTURE (SAMPLING) DELAY is that time required after the fall of the clock input for the sampling switch to
open. The Sample/Hold circuit effectively stops capturing the input signal and goes into the “hold” mode the
aperture delay time (tAD) after the clock goes low.
APERTURE JITTER (tAJ) is the variation in aperture delay from sample to sample. Aperture jitter shows up as
input noise.
Bit Error Rate (B.E.R.) is the probability of error and is defined as the probable number of errors per unit of time
divided by the number of bits seen in that amount of time. A B.E.R. of 10-18 corresponds to a statistical error in
one bit about every four (4) years.
CLOCK DUTY CYCLE is the ratio of the time that the clock wave form is at a logic high to the total time of one
clock period.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB. Measured at 500 MSPS with a ramp input.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion Ratio, or SINAD. ENOB is defined as (SINAD − 1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH (FPBW) is a measure of the frequency at which the reconstructed output
fundamental drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Offset and
Full-Scale Errors:
Pos. Gain Error = Offset Error − Pos. Full-Scale Error
Neg. Gain Error = −(Offset Error − Neg. Full-Scale Error)
Gain Error = Neg. Full-Scale Error − Pos. Full-Scale Error
= Pos. Gain Error + Neg. Gain Error
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line is measured
from the center of that code value. The best fit method is used.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in
the second and third order intermodulation products to the power in one of the original frequencies. IMD is
usually expressed in dBFS.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is
VFS / 2n
where VFS is the differential full-scale amplitude of 650 mV or 870 mV as set by the FSR input and "n" is the
ADC resolution in bits, which is 8 for the ADC08D502.
LVDS DIFFERENTIAL OUTPUT VOLTAGE (VOD) is the absolute value of the difference between the VD+ & VDoutputs; each measured with respect to Ground.
VD+
VD VOD
VD+
VOS
VD GND
VOD = | VD+ - VD- |
Figure 1.
14
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LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint between the D+ and D- pins output voltage; i.e.,
[(VD+) +( VD-)]/2.
MISSING CODES are those output codes that are skipped and will never appear at the ADC outputs. These
codes cannot be reached with any input value.
MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of how far the last code transition is from the ideal 1/2
LSB above a differential −870 mV with the FSR pin high, or 1/2 LSB above a differential −650 mV with the FSR
pin low. For the ADC08D502 the reference voltage is assumed to be ideal, so this error is a combination of fullscale error and reference voltage error.
OFFSET ERROR (VOFF) is a measure of how far the mid-scale point is from the ideal zero voltage differential
input.
Offset Error = Actual Input causing average of 8k samples to result in an average code of 127.5.
OUTPUT DELAY (tOD) is the time delay after the falling edge of DCLK before the data update is present at the
output pins.
OVER-RANGE RECOVERY TIME is the time required after the differential input voltages goes from ±1.2V to 0V
for the converter to recover and make a conversion with its rated accuracy.
PIPELINE DELAY (LATENCY) is the number of clock cycles between initiation of conversion and when that data
is presented to the output driver stage. New data is available at every clock cycle, but the data lags the
conversion by the Pipeline Delay plus the tOD.
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of how far the last code transition is from the ideal 1-1/2
LSB below a differential +870 mV with the FSR pin high, or 1-1/2 LSB below a differential +650 mV with the FSR
pin low. For the ADC08D502 the reference voltage is assumed to be ideal, so this error is a combination of fullscale error and reference voltage error.
POWER SUPPLY REJECTION RATIO (PSRR) can be one of two specifications. PSRR1 (DC PSRR) is the ratio
of the change in full-scale error that results from a power supply voltage change from 1.8V to 2.0V. PSRR2 (AC
PSRR) is a measure of how well an a.c. signal riding upon the power supply is rejected from the output and is
measured with a 248 MHz, 50 mVP-P signal riding upon the power supply. It is the ratio of the output amplitude of
that signal at the output to its amplitude on the power supply pin. PSRR is expressed in dB.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the output
to the rms value of the sum of all other spectral components below one-half the sampling frequency, not
including harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms value of
the input signal at the output to the rms value of all of the other spectral components below half the clock
frequency, including harmonics but excluding d.c.
SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the
input signal at the output and the peak spurious signal, where a spurious signal is any signal present in the
output spectrum that is not present at the input, excluding d.c.
TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic
levels at the output to the level of the fundamental at the output. THD is calculated as
THD = 20 x log
A 2 +... +A 2
f2
f10
A f12
where Af1 is the RMS power of the fundamental (output) frequency and Af2 through Af10 are the RMS power of
the first 9 harmonic frequencies in the output spectrum.
– Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the
input frequency seen at the output and the power in its 2nd harmonic level at the output.
– Third Harmonic Distortion (3rd Harm) is the difference expressed in dB between the RMS power in the input
frequency seen at the output and the power in its 3rd harmonic level at the output.
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Transfer Characteristic
IDEAL POSITIVE
FULL-SCALE
TRANSITION
Output
Code
ACTUAL
POSITIVE
FULL-SCALE
TRANSITION
1111 1110 (254)
1111 1111 (255)
1111 1101 (253)
POSITIVE
FULL-SCALE
ERROR
MID-SCALE
TRANSITION
1000 0000 (128)
0111 1111 (127)
OFFSET
ERROR
IDEAL NEGATIVE
FULL-SCALE TRANSITION
ACTUAL NEGATIVE
FULL-SCALE TRANSITION
NEGATIVE
FULL-SCALE
ERROR
0000 0010 (2)
0000 0001 (1)
0000 0000 (0)
-325 mV /
-435 mV
(VIN+) < (VIN-)
(VIN+) > (VIN-)
0.0V
Differential Analog Input Voltage (VIN+) - (VIN-)
+325 mV /
+435 mV
Figure 2. Input / Output Transfer Characteristic
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Timing Diagrams
Sample N
D
Sample N-1
Dd
VIN
Sample N+1
tAD
CLK, CLK
tOD
DId, DI
DQd, DQ
Sample N-18 and
Sample N-17
Sample N-16 and Sample N-15
Sample N-14 and Sample N-13
tOSK
DCLK+, DCLK(OutEdge = 0)
DCLK+, DCLK(OutEdge = 1)
Figure 3. ADC08D502 Timing — SDR Clocking
Sample N
D
Sample N-1
Dd
VIN
Sample N+1
tAD
CLK, CLK
tOD
DId, DI
DQd, DQ
Sample N-18 and
Sample N-17
Sample N-16 and Sample N-15
Sample N-14 and Sample N-13
tOSK
DCLK+, DCLK(0° Phase)
tSU
tH
DCLK+, DCLK(90° Phase)
Figure 4. ADC08D502 Timing — DDR Clocking
Single Register Access
SCS
1
12 13
16 17
32
SCLK
SDATA
Fixed Header Pattern
Register Write Data
Register Address
tSH
MSB
LSB
tSSU
Figure 5. Serial Interface Timing
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Synchronizing Edge
CLK
tRH
tRS
tAD
DCLK_RST
tRPW
DCLK+
Figure 6. Clock Reset Timing in DDR Mode
Synchronizing Edge
CLK
tRH
tRS
tSD
DCLK_RST
tRPW
DCLK+
OUTEDGE
Figure 7. Clock Reset Timing in SDR Mode with OUTEDGE Low
Synchronizing Edge
CLK
tRH
tRS
tSD
DCLK_RST
tRPW
DCLK+
OUTEDGE
Figure 8. Clock Reset Timing in SDR Mode with OUTEDGE High
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tCAL
tCAL
CalRun
tCalDly
tCAL_H
Calibration Delay
determined by
CalDly Pin (127)
CAL
tCAL_L
POWER
SUPPLY
Figure 9. Self Calibration and On-Command Calibration Timing
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Typical Performance Characteristics
VA=VDR=1.9V, FCLK=500MHz, TA=25°C unless otherwise stated.
20
INL vs. CODE
INL vs. TEMPERATURE
Figure 10.
Figure 11.
DNL vs. CODE
DNL vs. TEMPERATURE
Figure 12.
Figure 13.
ENOB vs. TEMPERATURE
ENOB vs. SUPPLY VOLTAGE
Figure 14.
Figure 15.
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Typical Performance Characteristics (continued)
VA=VDR=1.9V, FCLK=500MHz, TA=25°C unless otherwise stated.
ENOB vs. INPUT FREQUENCY
SNR vs. TEMPERATURE
Figure 16.
Figure 17.
SNR vs. SUPPLY VOLTAGE
SNR vs. INPUT FREQUENCY
Figure 18.
Figure 19.
THD vs. TEMPERATURE
THD vs. SUPPLY VOLTAGE
Figure 20.
Figure 21.
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Typical Performance Characteristics (continued)
VA=VDR=1.9V, FCLK=500MHz, TA=25°C unless otherwise stated.
22
THD vs. INPUT FREQUENCY
SFDR vs. TEMPERATURE
Figure 22.
Figure 23.
SFDR vs. SUPPLY VOLTAGE
SFDR vs. INPUT FREQUENCY
Figure 24.
Figure 25.
Spectral Response at FIN = 98 MHz
Spectral Response at FIN = 248 MHz
Figure 26.
Figure 27.
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Typical Performance Characteristics (continued)
VA=VDR=1.9V, FCLK=500MHz, TA=25°C unless otherwise stated.
CROSSTALK vs. SOURCE FREQUENCY
FULL POWER BANDWIDTH
Figure 28.
Figure 29.
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FUNCTIONAL DESCRIPTION
The ADC08D502 is a versatile A/D Converter with an innovative architecture permitting very high speed
operation. The controls available ease the application of the device to circuit solutions. Optimum performance
requires adherence to the provisions discussed here and in the Applications Information section.
While it is generally poor practice to allow an active pin to float, pins 4 and 14 of the ADC08D502 are designed to
be left floating without jeopardy. In all discussions throughout this data sheet, whenever a function is called by
allowing a pin to float, connecting that pin to a potential of one half the VA supply voltage will have the same
effect as allowing it to float.
OVERVIEW
The ADC08D502 uses a calibrated folding and interpolating architecture that achieves over 7.5 effective bits. The
use of folding amplifiers greatly reduces the number of comparators and power consumption. Interpolation
reduces the number of front-end amplifiers required, minimizing the load on the input signal and further reducing
power requirements. In addition to other things, on-chip calibration reduces the INL bow often seen with folding
architectures. The result is an extremely fast, high performance, low power converter.
The analog input signal that is within the converter's input voltage range is digitized to eight bits at speeds of 200
MSPS to 500 MSPS, typical. Differential input voltages below negative full-scale will cause the output word to
consist of all zeroes. Differential input voltages above positive full-scale will cause the output word to consist of
all ones. Either of these conditions at either the "I" or "Q" input will cause the OR (Out of Range) output to be
activated. This single OR output indicates when the output code from one or both of the channels is below
negative full scale or above positive full scale.
Each of the two converters has a 1:2 demultiplexer that feeds two LVDS output buses. The data on these buses
provide an output word rate on each bus at half the ADC sampling rate and must be interleaved by the user to
provide output words at the full conversion rate.
The output levels may be selected to be normal or reduced. Using reduced levels saves power but could result in
erroneous data capture of some or all of the bits, especially at higher sample rates and in marginally designed
systems.
Self-Calibration
A self-calibration is performed upon power-up and can also be invoked by the user upon command. Calibration
trims the 100Ω analog input differential termination resistor and minimizes full-scale error, offset error, DNL and
INL, resulting in maximizing SNR, THD, SINAD (SNDR) and ENOB. Internal bias currents are also set with the
calibration process. All of this is true whether the calibration is performed upon power up or is performed upon
command. Running the self calibration is an important part of this chip's functionality and is required in order to
obtain adequate performance. In addition to the requirement to be run at power-up, self calibration must be rerun whenever the sense of the FSR pin is changed. For best performance, we recommend that self calibration be
run 20 seconds or more after application of power and whenever the operating temperature changes
significantly, according to the particular system design requirements. Calibration can not be initiated or run while
the device is in the power-down mode.
During the calibration process, the input termination resistor is trimmed to a value that is equal to REXT / 33. This
external resistor is located between pin 32 and ground. REXT must be 3300 Ω ±0.1%. With this value, the input
termination resistor is trimmed to be 100 Ω. Because REXT is also used to set the proper current for the Track
and Hold amplifier, for the preamplifiers and for the comparators, other values of REXT should not be used. In
normal operation, calibration is performed just after application of power and whenever a valid calibration
command is given, which is holding the CAL pin low for at least 80 clock cycles, then hold it high for at least
another 80 clock cycles. The time taken by the calibration procedure is specified in the A.C. Characteristics
Table. Holding the CAL pin high upon power up will prevent the calibration process from running until the CAL
pin experiences the above-mentioned 80 clock cycles low followed by 80 clock cycles high.
CalDly (pin 127) is used to select one of two delay times after the application of power to the start of calibration.
This calibration delay is 225 clock cycles (about 67.2 ms at 500 MSPS) with CalDly low, or 231 clock cycles (about
4.3 seconds at 500 MSPS) with CalDly high. These delay values allow the power supply to come up and stabilize
before calibration takes place. If the PD pin is high upon power-up, the calibration delay counter will be disabled
until the PD pin is brought low. Therefore, holding the PD pin high during power up will further delay the start of
the power-up calibration cycle. The best setting of the CalDly pin depends upon the power-on settling time of the
power supply.
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The CalRun output is high whenever the calibration procedure is running. This is true whether the calibration is
done at power-up or on-command.
Acquiring the Input
Data is acquired at the falling edge of CLK+ (pin 18) and the digital equivalent of that data is available at the
digital outputs 13 clock cycles later for the DI and DQ output buses and 14 clock cycles later for the DId and DQd
output buses. There is an additional internal delay called tOD before the data is available at the outputs. See the
Timing Diagram. The ADC08D502 will convert as long as the clock signal is present. The fully differential
comparator design and the innovative design of the sample-and-hold amplifier, together with self calibration,
enables a very flat SINAD/ENOB response beyond 500 MHz. The ADC08D502 output data signaling is LVDS
and the output format is offset binary.
Control Modes
Much of the user control can be accomplished with several control pins that are provided. Examples include
initiation of the calibration cycle, power down mode and full scale range setting. However, the ADC08D502 also
provides an Extended Control mode whereby a serial interface is used to access register-based control of
several advanced features. The Extended Control mode is not intended to be enabled and disabled dynamically.
Rather, the user is expected to employ either the normal control mode or the Extended Control mode at all times.
When the device is in the Extended Control mode, pin-based control of several features is replaced with registerbased control and those pin-based controls are disabled. These pins are OutV (pin 3), OutEdge/DDR (pin 4),
FSR (pin 14) and CalDly (pin 127).
The Analog Inputs
The ADC08D502 must be driven with a differential input signal. Operation with a single-ended signal is not
recommended. It is important that the inputs either be a.c. coupled to the inputs with the VCMO pin grounded or
d.c. coupled with the VCMO pin not grounded and an input common mode voltage equal to the VCMO output.
Two full-scale range settings are provided with pin 14 (FSR). A high on pin 14 causes an input full-scale range
setting of 870 mVP-P, while grounding pin 14 causes an input full-scale range setting of 650 mVP-P. The full-scale
range setting operates equally on both ADCs.
In the Extended Control mode, the full-scale input range can be set to values between 560 mVP-P and 840 mVP-P
through a serial interface.
Clocking
The ADC08D502 must be driven with an a.c. coupled, differential clock signal. A differential LVDS output clock is
available for use in latching the ADC output data into whatever receives that data.
The ADC08D502 offers options for output clocking: a choice of which DCLK edge the output data transitions on
and choice of Single Data Rate (SDR) or Double Data Rate (DDR) outputs.
The ADC08D502 also has the option to use a duty cycle corrected clock receiver as part of the input clock
circuit. This feature is enabled by default and provides improved ADC clocking. This circuitry allows the ADC to
be clocked with a signal source having a duty cycle ratio of 80 / 20 % (worst case).
OutEdge Setting
To help ease data capture in the SDR mode, the output data may be caused to transition on either the positive or
the negative edge of the output data clock (DCLK). This is chosen with the OutEdge input (pin 4). A high on the
OutEdge input causes the output data to transition on the rising edge of DCLK, while grounding this input causes
the output to transition on the falling edge of DCLK.
Double Data Rate
A choice of single data rate (SDR) or double data rate (DDR) output is offered. With single data rate the clock
frequency is the same as the data rate of the two output buses. With double data rate the clock frequency is half
the data rate and data is sent to the outputs on both DCLK edges. DDR clocking is enabled in non-Extended
Control mode by allowing pin 4 to float.
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The LVDS Outputs
The data outputs, the Out Of Range (OR) and DCLK, are LVDS. Output current sources provide 3 mA of output
current to a differential 100 Ohm load when the OutV input (pin 14) is high or 2.2 mA when the OutV input is low.
For short LVDS lines and low noise systems, satisfactory performance may be realized with the OutV input low,
which results in lower power consumption. If the LVDS lines are long and/or the system in which the
ADC08D502 is used is noisy, it may be necessary to tie the OutV pin high. The LVDS data output have a typical
common mode voltage of 800mV when the VBG pin is unconnected and floating. This common mode voltage can
be increased to 1.2V by tying the VBG pin to VA if a higher common mode is required.
IMPORTANT NOTE: Tying the VBG pin to VA will also increase the differential LVDS output voltage by up to
40mV.
Power Down
The ADC08D502 is in the active state when the Power Down pin (PD) is low. When the PD pin is high, the
device is in the power down mode, where the output pins hold the last conversion before the PD pin went high
and the device power consumption is reduced to a minimal level. A high on the PDQ pin will power down the "Q"
channel and leave the "I" channel active. There is no provision to power down the "I" channel independently of
the "Q" channel. Upon return to normal operation, the pipeline will contain meaningless information.
If the PD input is brought high while a calibration is running, the device will not go into power down until the
calibration sequence is complete. However, if power is applied and PD is already high, the device will not begin
the calibration sequence until the PD input goes low. If a manual calibration is requested while the device is
powered down, the calibration will not begin at all. That is, the manual calibration input is completely ignored in
the power down state. Calibration will function with the "Q" channel powered down, but that channel will not be
calibrated if PDQ is high. If the "Q" channel is subsequently to be used, it is necessary to perform a calibration
after PDQ is brought low.
NORMAL/EXTENDED CONTROL
The ADC08D502 may be operated in one of two modes. In the simpler "normal" control mode, the user affects
available configuration and control of the device through several control pins. The "extended control mode"
provides additional configuration and control options through a serial interface and a set of 8 registers. The two
control modes are selected with pin 14 (FSR/ECE: Extended Control Enable). The choice of control modes is
required to be a fixed selection and is not intended to be switched dynamically while the device is operational.
Table 1 shows how several of the device features are affected by the control mode chosen.
Table 1. Features and Modes
Feature
Normal Control Mode
Extended Control Mode
SDR or DDR Clocking
Selected with pin 4
Selected with DE bit in the Configuration
Register (1h).
DDR Clock Phase
Not Selectable (0° Phase Only)
Selected with DCP bit in the Configuration
Register (1h).
SDR Data transitions with rising or falling
DCLK edge
Selected with pin 4
Selected with the OE bit in the Configuration
Register (1h).
LVDS output level
Selected with pin 3
Selected with the OV bit in the Configuration
Register (1h).
Power-On Calibration Delay
Delay Selected with pin 127
Short delay only.
Full-Scale Range
Options (650 mVP-P or 870 mVP-P) selected
with pin 14. Selected range applies to both
channels.
Up to 512 step adjustments over a nominal
range of 560 mV to 840 mV. Separate range
selected for I- and Q-Channels. Selected using
registers 3h and Bh.
Input Offset Adjust
Not possible
Separate ±45 mV adjustments in 512 steps for
each channel using registers 2h and Ah.
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The default state of the Extended Control Mode is set upon power-on reset (internally performed by the device)
and is shown in Table 2.
Table 2. Extended Control Mode Operation (Pin 14 Floating)
Feature
Extended Control Mode Default State
SDR or DDR Clocking
DDR Clocking
DDR Clock Phase
Data changes with DCLK edge (0° phase)
LVDS Output Amplitude
Normal amplitude
(710 mVP-P)
Calibration Delay
Short Delay
Full-Scale Range
700 mV nominal for both channels
Input Offset Adjust
No adjustment for either channel
THE SERIAL INTERFACE
IMPORTANT NOTE: During the initial write using the serial interface, all 8 user registers must be written with
desired or default values. In addition, the first write to register (Dh) must load the default value (0x3FFFh). Once
all registers have been written once, other desired settings can be loaded.
The 3-pin serial interface is enabled only when the device is in the Extended Control mode. The pins of this
interface are Serial Clock (SCLK), Serial Data (SDATA) and Serial Interface Chip Select (SCS) Eight write only
registers are accessible through this serial interface.
SCS: This signal should be asserted low while accessing a register through the serial interface. Setup and hold
times with respect to the SCLK must be observed.
SCLK: Serial data input is accepted with the rising edge of this signal. There is no minimum frequency
requirement for SCLK.
SDATA: Each register access requires a specific 32-bit pattern at this input. This pattern consists of a header,
register address and register value. The data is shifted in MSB first. Setup and hold times with respect to the
SCLK must be observed. See the Timing Diagram.
Each Register access consists of 32 bits, as shown in Figure 5 of the Timing Diagrams. The fixed header pattern
is 0000 0000 0001 (eleven zeros followed by a 1). The loading sequence is such that a 0b is loaded first. These
12 bits form the header. The next 4 bits are the address of the register that is to be written to and the last 16 bits
are the data written to the addressed register. The addresses of the various registers are indicated in Table 3.
Refer to the REGISTER DESCRIPTION for information on the data to be written to the registers.
Subsequent register accesses may be performed immediately, starting with the 33rd SCLK. This means that the
SCS input does not have to be de-asserted and asserted again between register addresses. It is possible,
although not recommended, to keep the SCS input permanently enabled (at a logic low) when using extended
control.
IMPORTANT NOTE: The Serial Interface should not be used when calibrating the ADC. Doing so will impair the
performance of the device until it is re-calibrated correctly. Programming the serial registers will also reduce
dynamic performance of the ADC for the duration of the register access time.
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Table 3. Register Addresses
4-Bit Address
Loading Sequence:
A3 loaded after Fixed Header Pattern, A0 loaded last
A3
A2
A1
A0
Hex
0
0
0
0
0h
Register Addressed
Reserved
0
0
0
1
1h
Configuration
0
0
1
0
2h
"I" Ch Offset
0
0
1
1
3h
"I" Ch Full-Scale Voltage
Adjust
0
1
0
0
4h
Reserved
0
1
0
1
5h
Reserved
0
1
1
0
6h
Reserved
0
1
1
1
7h
Reserved
1
0
0
0
8h
Reserved
1
0
0
1
9h
Reserved
1
0
1
0
Ah
"Q" Ch Offset
1
0
1
1
Bh
"Q" Ch Full-Scale
Voltage Adjust
1
1
0
0
Ch
Reserved
1
1
0
1
Dh
Reserved
1
1
1
0
Eh
Reserved
1
1
1
1
Fh
Reserved
REGISTER DESCRIPTION
Eight write-only registers provide several control and configuration options in the Extended Control Mode. These
registers have no effect when the device is in the Normal Control Mode. Each register description below also
shows the Power-On Reset (POR) state of each control bit.
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Table 4. Configuration Register
Addr: 1h (0001b)
W only (0xB2FF)
D15
D14
D13
D12
D11
D10
D9
D8
1
0
1
DCS
DCP
nDE
OV
OE
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bit 15
Must be set to 1b
Bit 14
Must be set to 0b
Bit 13
Must be set to 1b
Bit 12
DCS: Duty Cycle Stabilizer. When this bit is set to 1b, a duty cycle stabilization circuit is applied to the clock
input. When this bit is set to 0b the stabilization circuit is disabled.
Bit 11
DCP: DDR Clock Phase. This bit only has an effect in the DDR mode. When this bit is set to 0b, the DCLK
edges are time-aligned with the data bus edges ("0° Phase"). When this bit is set to 1b, the DCLK edges are
placed in the middle of the data bit-cells ("90° Phase"), using the one-half speed DCLK shown in Figure 4 as
the phase reference.
POR State: 0b
Bit 10
nDE: DDR Enable. When this bit is set to 0b, data bus clocking follows the DDR (Dual Data Rate) mode
whereby a data word is output with each rising and falling edge of DCLK. When this bit is set to a 1b, data bus
clocking follows the SDR (single data rate) mode whereby each data word is output with either the rising or
falling edge of DCLK, as determined by the OutEdge bit.
POR State: 0b
Bit 9
OV: Output Voltage. This bit determines the LVDS outputs' voltage amplitude and has the same function as the
OutV pin that is used in the normal control mode. When this bit is set to 1b, the standard output amplitude of
710 mVP-P is used. When this bit is set to 0b, the reduced output amplitude of 510 mVP-P is used.
POR State: 1b
Bit 8
OE: Output Edge. This bit selects the DCLK edge with which the data words transition in the SDR mode and
has the same effect as the OutEdge pin in the normal control mode. When this bit is 1b, the data outputs
change with the rising edge of DCLK+. When this bit is 0b, the data output change with the falling edge of
DCLK+.
POR State: 0b
Bits 7:0
Must be set to 1b.
Table 5. I-Channel Offset
Addr: 2h (0010b)
D15
W only (0x007F)
D14
D13
D12
(MSB)
D11
D10
D9
D8
Offset Value
(LSB)
D7
D6
D5
D4
D3
D2
D1
D0
Sign
1
1
1
1
1
1
1
Bits 15:8
Offset Value. The input offset of the I-Channel ADC is adjusted linearly and monotonically by the value in this
field. 00h provides a nominal zero offset, while FFh provides a nominal 45 mV of offset. Thus, each code step
provides 0.176 mV of offset.
POR State: 0000 0000b
Bit 7
Sign bit. 0b gives positive offset, 1b gives negative offset.
POR State: 0b
Bit 6:0
Must be set to 1b
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Table 6. I-Channel Full-Scale Voltage Adjust
Addr: 3h (0011b)
W only (0x807F)
D15
D14
D13
D12
(MSB)
D11
D10
D9
D8
Adjust Value
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
Bit 15:7
Full Scale Voltage Adjust Value. The input full-scale voltage of the I-Channel ADC is adjusted linearly and
monotonically from the nominal 700 mVP-P differential by the value in this field.
0000 0000 0
560mVP-P
1000 0000 0
700mVP-P
1111 1111 1
840mVP-P
For best performance, it is recommended that the value in this field be limited to the range of 0110 0000 0b to
1110 0000 0b. i.e., limit the amount of adjustment to ±15%. The remaining ±5% headroom allows for the ADC's
own full scale variation .A gain adjustment does not require ADC re-calibration.
POR State: 1000 0000 0b (no adjustment)
Bits 6:0
Must be set to 1b
Table 7. Q-Channel Offset
Addr: Ah (1010b)
D15
W only (0x007F)
D14
D13
D12
(MSB)
D11
D10
D9
D8
Offset Value
(LSB)
D7
D6
D5
D4
D3
D2
D1
D0
Sign
1
1
1
1
1
1
1
Bit 15:8
Offset Value. The input offset of the Q-Channel ADC is adjusted linearly and monotonically by the value in this
field. 00h provides a nominal zero offset, while FFh provides a nominal 45 mV of offset. Thus, each code step
provides about 0.176 mV of offset.
POR State: 0000 0000b
Bit 7
Sign bit. 0b gives positive offset, 1b gives negative offset.
POR State: 0b
Bit 6:0
30
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Table 8. Q-Channel Full-Scale Voltage Adjust
Addr: Bh (1011b)
W only (0x807F)
D15
D14
D13
D12
(MSB)
D11
D10
D9
D8
Adjust Value
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
Bit 15:7
Full Scale Voltage Adjust Value. The input full-scale voltage of the Q-Channel ADC is adjusted linearly and
monotonically from the nominal 700 mVP-P differential by the value in this field.
0000 0000 0
560mVP-P
1000 0000 0
700mVP-P
1111 1111 1
840mVP-P
For best performance, it is recommended that the value in this field be limited to the range of 0110 0000 0b to
1110 0000 0b. i.e., limit the amount of adjustment to ±15%. The remaining ±5% headroom allows for the ADC's
own full scale variation .A gain adjustment does not require ADC re-calibration.
POR State: 1000 0000 0b (no adjustment)
Bits 6:0
Must be set to 1b
Table 9. Reserved
Addr: Dh (1101b)
W only (0x3FFF)
D15
D14
D13
D12
D11
D10
D9
D8
0
0
1
1
1
1
1
1
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bit 15
Must be set to 0b
Bit 14
Must be set to 0b
Bits 13:0
Must be set to 1b
Table 10. Reserved
Addr: Eh (1110b)
W only (0x07FF)
D15
D14
D13
D12
D11
D10
D9
D8
0
0
0
0
0
1
1
1
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bits 15:11
Must be set to 0b
Bits 10:0
Must be set to 1b
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Table 11. Reserved
Addr: Fh (1111b)
W only (0x007F)
D15
D14
D13
D12
D11
D10
D9
D8
0
0
0
0
0
0
0
0
D7
D6
D5
D4
D3
D2
D1
D0
0
1
1
1
1
1
1
1
Bits 15:7
Must be set to 0b
Bit 6:0
Must be set to 1b
Note Regarding Extended Mode Offset Correction
When using the I or Q channel Offset Adjust registers, the following information should be noted.
For offset values of +0000 0000 and -0000 0000, the actual offset is not the same. By changing only the sign bit
in this case, an offset step in the digital output code of about 1/10th of an LSB is experienced. This is shown
more clearly in Figure 30 below.
Figure 30. Extended Mode Offset Behavior
MULTIPLE ADC SYNCHRONIZATION
The ADC08D502 has the capability to precisely reset its sampling clock input to DCLK output relationship as
determined by the user-supplied DCLK_RST pulse. This allows multiple ADCs in a system to have their DCLK
(and data) outputs transition at the same time with respect to the shared CLK input that they all use for sampling.
The DCLK_RST signal must observe some timing requirements that are shown in Figure 6, Figure 7, and
Figure 8 of the Timing Diagrams. The DCLK_RST pulse must be of a minimum width and its deassertion edge
must observe setup and hold times with respect to the CLK input rising edge. These times are specified in the
AC Electrical Characteristics Table.
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The DCLK_RST signal can be asserted asynchronous to the input clock If DCLK_RST is asserted, the DCLK
output is held in a designated state. The state in which DCLK is held during the reset period is determined by the
mode of operation (SDR/DDR) and the setting of the Output Edge configuration pin or bit. (Refer to Figure 6,
Figure 8, and Figure 8 for the DCLK reset conditions). Therefore depending upon when the DCLK_RST signal is
asserted, there may be a narrow pulse on the DCLK line during this reset event. When the DCLK_RST signal is
de-asserted in synchronization with the CLK rising edge, the next CLK falling edge synchronizes the DCLK
output with those of other ADC08D502s in the system. The DCLK output is enabled again after a constant delay
which is equal to the CLK input to DCLK output delay (tAD). The device always exhibits this delay characteristic in
normal operation.
The DCLK-RST pin should NOT be brought high while the calibration process is running (while CalRun is high).
Doing so could cause a digital glitch in the digital circuitry, resulting in corruption and invalidation of the
calibration.
Applications Information
THE REFERENCE VOLTAGE
The voltage reference for the ADC08D502 is derived from a 1.254V bandgap reference which is made available
at pin 31, VBG for user convenience and has an output current capability of ±100 μA and should be buffered if
more current than this is required.
The internal bandgap-derived reference voltage has a nominal value of 650 mV or 870 mV, as determined by the
FSR pin.
There is no provision for the use of an external reference voltage, but the full-scale input voltage can be adjusted
through a Configuration Register in the Extended Control mode.
Differential input signals up to the chosen full-scale level will be digitized to 8 bits. Signal excursions beyond the
full-scale range will be clipped at the output. These large signal excursions will also activate the OR output for
the time that the signal is out of range.
One extra feature of the VBG pin is that it can be used to raise the common mode voltage level of the LVDS
outputs. The output offset voltage (VOS) is typically 800mV when the VBG pin is used as an output or left
unconnected. To raise the LVDS offset voltage to a typical value of 1200mV the VBG pin can be connected
directly to the supply rails.
THE ANALOG INPUT
The analog input is a differential one to which the signal source may be a.c. coupled or d.c. coupled. The fullscale input range is selected with the FSR pin to be 650 mVP-P or 870 mVP-P, or can be adjusted to values
between 560 mVP-P and 840 mVP-P in the Extended Control mode through the Serial Interface. For best
performance, it is recommended that the full-scale range be kept between 595 mVP-P and 805 mVP-P in the
Extended Control mode.
Table 12 gives the input to output relationship with the FSR pin high and the normal (non-extended) mode is
used. With the FSR pin grounded, the millivolt values in Table 12 are reduced to 75% of the values indicated. In
the Enhanced Control Mode, these values will be determined by the full scale range and offset settings in the
Control Registers.
Table 12. Differential Input To Output Relationship
(Non-Extended Control Mode, FSR High)
VIN+
VIN−
Output Code
VCM − 217.5mV
VCM + 217.5mV
0000 0000
VCM − 109mV
VCM + 109mV
0100 0000
VCM
0111 1111 /
1000 0000
VCM + 109 mV
VCM − 109mV
1100 0000
VCM + 217.5mV
VCM − 217.5mV
1111 1111
VCM
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The buffered analog inputs simplify the task of driving these inputs and the RC pole that is generally used at
sampling ADC inputs is not required. If it is desired to use an amplifier circuit before the ADC, use care in
choosing an amplifier with adequate noise and distortion performance and adequate gain at the frequencies used
for the application.
Note that a precise d.c. common mode voltage must be present at the ADC inputs. This common mode voltage,
VCMO, is provided on-chip when a.c. input coupling is used and the input signal is a.c. coupled to the ADC.
When the inputs are a.c. coupled, the VCMO output must be grounded, as shown in Figure 31. This causes the
on-chip VCMO voltage to be connected to the inputs through on-chip 50k-Ohm resistors.
IMPORTANT NOTE: An Analog input channel that is not used should be left floating when the inputs are a.c.
coupled. Do not connect an unused analog input to ground.
Ccouple
VIN+
Ccouple
VINVCMO
ADC08D502
Figure 31. Differential Input Drive
When the d.c. coupled mode is used, a common mode voltage must be provided at the differential inputs. This
common mode voltage should track the VCMO output pin. Note that the VCMO output potential will change with
temperature. The common mode output of the driving device should track this change.
IMPORTANT NOTE: An analog input channel that is not used should be tied to the VCMO voltage when the
inputs are d.c. coupled. Do not connect unused analog inputs to ground.
Full-scale distortion performance falls off rapidly as the input common mode voltage deviates from VCMO.
This is a direct result of using a very low supply voltage to minimize power. Keep the input common
voltage within 50 mV of VCMO.
Performance is as good in the d.c. coupled mode as it is in the a.c. coupled mode, provided the input
common mode voltage at both analog inputs remain within 50 mV of VCMO.
If d.c. coupling is used, it is best to servo the input common mode voltage with VCMO to maintain optimum
performance. An example of this type of circuit is shown in Figure 32.
3.3V
LMH6555
RADJ-
RT2
RG1
+
50:
VIN100:
Signal
Input
50:
RT1
RG2
VIN+
50:
50:
50:
RF2
VCM_REF
ADC08D502
RADJ+
RF1
VCMO
+
LMV321
Figure 32. Example of Servoing the Analog Input with VCMO
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One such circuit should be used in front of the VIN+ input and another in front of the VIN− input. In that figure,
RD1, RD2 and RD3 are used to divide the VCMO potential so that, after being gained up by the amplifier, the input
common mode voltage is equal to VCMO from the ADC. RD1 and RD2 are split to allow the bypass capacitor to
isolate the input signal from VCMO. RIN, RD2 and RD3 will divide the input signal, if necessary. Capacitor "C" in
Figure 32 should be chosen to keep any component of the input signal from affecting VCMO.
Be sure that the current drawn from the VCMO output does not exceed 100 μA.
The Input impedance in the d.c. coupled mode (VCMO pin not grounded) consists of a precision 100Ω resistor
between VIN+ and VIN− and a capacitance from each of these inputs to ground. In the a.c. coupled mode the
input appears the same except there is also a resistor of 50K between each analog input pin and the VCMO
potential.
Driving the inputs beyond full scale will result in a saturation or clipping of the reconstructed output.
Handling Single-Ended Input Signals
There is no provision for the ADC08D502 to adequately process single-ended input signals. The best way to
handle single-ended signals is to convert them to differential signals before presenting them to the ADC. The
easiest way to accomplish single-ended to differential signal conversion is with an appropriate balun-connected
transformer, as shown in Figure 33.
Ccouple
50:
Source
VIN+
100:
1:2 Balun
Ccouple
VINADC08D502
Figure 33. Single-Ended to Differential signal conversion with a balun-connected transformer
The 100 Ohm external resistor placed across the output terminals of the balun in parallel with the ADC08D1000's
on-chip 100 Ohm resistor makes a 50 Ohms differential impedance at the balun output. Or, 25 Ohms to virtual
ground at each of the balun output terminals.
Looking into the balun, the source sees the impedance of the first coil in series with the impedance at the output
of that coil. Since the transformer has a 1:1 turns ratio, the impedance across the first coil is exactly the same as
that at the output of the second coil, namely 25 Ohms to virtual ground. So, the 25 Ohms across the first coil in
series with the 25 Ohms at its output gives 50 Ohms total impedance to match the source.
Out Of Range (OR) Indication
When the conversion result is clipped the Out of Range output is activated such that OR+ goes high and ORgoes low. This output is active as long as accurate data on either or both of the buses would be outside the
range of 00h to FFh.
Full-Scale Input Range
As with all A/D Converters, the input range is determined by the value of the ADC's reference voltage. The
reference voltage of the ADC08D502 is derived from an internal band-gap reference. The FSR pin controls the
effective reference voltage of the ADC08D502 such that the differential full-scale input range at the analog inputs
is 870 mVP-P with the FSR pin high, or is 650 mVP-P with FSR pin low. Best SNR is obtained with FSR high, but
better distortion and SFDR are obtained with the FSR pin low.
THE CLOCK INPUTS
The ADC08D502 has differential LVDS clock inputs, CLK+ and CLK-, which must be driven with a differential,
a.c. coupled clock signal as indicated in Figure 34. Although the ADC08D502 is tested and its performance is
specified with a differential 500 MHz clock, it typically will function well with clock frequencies indicated in the
Electrical Characteristics Table. The clock inputs are internally terminated and biased.
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Operation up to the sample rates indicated in the Electrical Characteristics Table is typically possible if the
maximum ambient temperatures indicated are not exceeded. Operating at higher sample rates than indicated for
the given ambient temperature may result in reduced device reliability and product lifetime. This is because of the
higher power consumption and die temperatures at high sample rates. Important also for reliability is proper
thermal management.
Ccouple
CLK+
Ccouple
CLK-
ADC08D502
Figure 34. Differential (LVDS) Clock Connection
The differential Clock line pair should have a characteristic impedance of 100Ω and be terminated at the clock
source in that (100Ω) characteristic impedance. The clock line should be as short and as direct as possible. The
ADC08D502 clock input is internally terminated with an untrimmed 100Ω resistor.
Insufficient clock levels will result in poor dynamic performance. Excessively high clock levels could cause a
change in the analog input offset voltage. To avoid these problems, keep the clock level within the range
specified in the Electrical Characteristics Table.
The low and high times of the input clock signal can affect the performance of any A/D Converter. The
ADC08D1000 features a duty cycle clock correction circuit which can maintain performance over temperature.
The ADC will meet its performance specification if the input clock high and low times are maintained within the
range (20/80% ratio) as specified in the Electrical Characteristics Table.
High speed, high performance ADCs such as the ADC08D502 require a very stable clock signal with minimum
phase noise or jitter. ADC jitter requirements are defined by the ADC resolution (number of bits), maximum ADC
input frequency and the input signal amplitude relative to the ADC input full scale range. The maximum jitter (the
sum of the jitter from all sources) allowed to prevent a jitter-induced reduction in SNR is found to be
tJ(MAX) = (VIN(P-P) / VINFSR) x (1/(2(N+1) x π x fIN))
(1)
where tJ(MAX) is the rms total of all jitter sources in seconds, VIN(P-P) is the peak-to-peak analog input signal, VINFSR
is the full-scale range of the ADC, "N" is the ADC resolution in bits and fIN is the maximum input frequency, in
Hertz, to the ADC analog input.
Note that the maximum jitter described above is the arithmetic sum of the jitter from all sources, including that in
the ADC clock, that added by the system to the ADC clock and input signals and that added by the ADC itself.
Since the effective jitter added by the ADC is beyond user control, the best the user can do is to keep the sum of
the externally added clock jitter and the jitter added by the analog circuitry to the analog signal to a minimum.
Clock amplitudes above those specified in the Electrical Characteristics Table may result in increased input offset
voltage. This would cause the converter to produce an output code other than the expected 127/128 when both
input pins are at the same potential.
CONTROL PINS
Six control pins (without the use of the serial interface) provide a wide range of possibilities in the operation of
the ADC08D502 and facilitate its use. These control pins provide Full-Scale Input Range setting, Self Calibration,
Calibration Delay, Output Edge Synchronization choice, LVDS Output Level choice and a Power Down feature.
Full-Scale Input Range Setting
The input full-scale range can be selected to be either 650 mVP-P or 870 mVP-P, as selected with the FSR control
input (pin 14) in the Normal Mode of operation. In the Extended Control Mode, the input full-scale range may be
set to be anywhere from 560 mVP-P to 840 mVP-P.
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Self Calibration
The ADC08D502 self-calibration must be run to achieve specified performance. The calibration procedure is run
upon power-up and can be run any time on command. The calibration procedure is exactly the same whether
there is a clock present upon power up or if the clock begins some time after application of power. The CalRun
output indicator is high while a calibration is in progress. Note that DCLK outputs are not active during a
calibration cycle, therefore it is not recommended as a system clock.
Power-On Calibration
Power-on calibration begins after a time delay following the application of power. This time delay is determined
by the setting of CalDly, as described in the Calibration Delay section, below.
The calibration process will be not be performed if the CAL pin is high at power up. In this case, the calibration
cycle will not begin until the on-command calibration conditions are met. The ADC08D502 will function with the
CAL pin held high at power up, but no calibration will be done and performance will be impaired. A manual
calibration, however, may be performed after powering up with the CAL pin high.
The internal power-on calibration circuitry comes up in an unknown logic state. If the clock is not running at
power up and the power on calibration circuitry is active, it will hold the analog circuitry in power down and the
power consumption will typically be less than 200 mW. The power consumption will be normal after the clock
starts.
On-Command Calibration
An on-command calibration may be run at any time.
To initiate an on-command calibration, bring the CAL pin high for a minimum of 80 input clock cycles after it has
been low for a minimum of 80 input clock cycles. Holding the CAL pin high upon power up will prevent execution
of power-on calibration until the CAL pin is low for a minimum of 80 input clock cycles, then brought high for a
minimum of another 80 input clock cycles. The calibration cycle will begin 80 input clock cycles after the CAL pin
is thus brought high. The CalRun signal should be monitored to determine when the calibration cycle has
completed. When an on-command calibration is executed, the CAL pin must be held low for 80 input clock cycles
and then low for 80 input clock cycles before the CalRun pin is activated to indicate that a calibration is taking
place. When the CalRun pin is activated, all outputs including the DCLK outputs are deactivated and enter a high
impedance state. After the calibration cycle is finished and the CalRun pin is low, the outputs, including DCLK,
are active again but require a short settling period, typically around 100ns. Because the DCLK outputs are not
activated during a calibration cycle, they are not recommended for use as a system clock.
The minimum 80 input clock cycle sequences are required to ensure that random noise does not cause a
calibration to begin when it is not desired. For best performance, a self calibration should be performed 20
seconds or more after power up and repeated when the operating temperature changes significantly according to
the particular system performance requirements. ENOB drops slightly as junction temperature increases and
executing a new self calibration cycle will essentially eliminate the change.
Calibration Delay
The CalDly input (pin 127) is used to select one of two delay times after the application of power to the start of
calibration. The calibration delay values allow the power supply to come up and stabilize before calibration takes
place. With no delay or insufficient delay, calibration would begin before the power supply is stabilized at its
operating value and result in non-optimal calibration coefficients. If the PD pin is high upon power-up, the
calibration delay counter will be disabled until the PD pin is brought low. Therefore, holding the PD pin high
during power up will further delay the start of the power-up calibration cycle. The best setting of the CalDly pin
depends upon the power-on settling time of the power supply.
Note that the calibration delay selection is not possible in the Extended Control mode and the short delay time is
used.
Output Edge Synchronization
DCLK signals are available to help latch the converter output data into external circuitry. The output data can be
synchronized with either edge of these clock signals. That is, the output data transition can be set to occur with
either the rising edge or the falling edge of the DCLK signal, so that either edge of that clock signal can be used
to latch the output data into the receiving circuit.
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When OutEdge (pin 4) is high, the output data is synchronized with (changes with) the rising edge of the DCLK+
(pin 82). When OutEdge is low, the output data is synchronized with the falling edge of DCLK+.
At the very high speeds of which the ADC08D502 is capable, slight differences in the lengths of the clock and
data lines can mean the difference between successful and erroneous data capture. The OutEdge pin is used to
capture data on the DCLK edge that best suits the application circuit and layout.
LVDS Output Level Control
The output level can be set to one of two levels with OutV (pin3). The strength of the output drivers is greater
with OutV high. With OutV low there is less power consumption in the output drivers, but the lower output level
means decreased noise immunity.
For short LVDS lines and low noise systems, satisfactory performance may be realized with the FSR input low. If
the LVDS lines are long and/or the system in which the ADC08D502 is used is noisy, it may be necessary to tie
the FSR pin high.
Power Down Feature
The Power Down pins (PD and PDQ) allow the ADC08D502 to be entirely powered down (PD) or the "Q"
channel to be powered down and the "I" channel to remain active.
The digital data (+/-) output pins are put into a high impedance state when the PD pin for the respective channel
is high. Upon return to normal operation, the pipeline will contain meaningless information and must be flushed.
If the PD input is brought high while a calibration is running, the device will not go into power down until the
calibration sequence is complete. However, if power is applied and PD is already high, the device will not begin
the calibration sequence until the PD input goes low. If a manual calibration is requested while the device is
powered down, the calibration will not begin at all. That is, the manual calibration input is completely ignored in
the power down state.
THE DIGITAL OUTPUTS
The ADC08D1000 demultiplexes the output data of each of the two ADCs on the die onto two LVDS output
buses (total of four buses, two for each ADC). For each of the two converters, the results of successive
conversions started on the odd falling edges of the CLK+ pin are available on one of the two LVDS buses, while
the results of conversions started on the even falling edges of the CLK+ pin are available on the other LVDS bus.
This means that, the word rate at each LVDS bus is 1/2 the ADC08D1000 input clock rate and the two buses
must be multiplexed to obtain the entire 1 GSPS conversion result.
Since the minimum recommended input clock rate for this device is 200 MSPS, the effective rate can be reduced
to as low as 100 MSPS by using the results available on just one of the the two LVDS buses and a 200 MHz
input clock, decimating the 200 MSPS data by two.
There is one LVDS output clock pair (DCLK+/-) available for use to latch the LVDS outputs on all buses. Whether
the data is sent at the rising or falling edge of DCLK is determined by the sense of the OutEdge pin.
DDR (Double Data Rate) clocking can also be used. In this mode a word of data is presented with each edge of
DCLK, reducing the DCLK frequency to 1/4 the input clock frequency. See the Timing Diagrams section for
details.
The OutV pin is used to set the LVDS differential output levels.
The output format is Offset Binary. Accordingly, a full-scale input level with VIN+ positive with respect to VIN− will
produce an output code of all ones, a full-scale input level with VIN− positive with respect to VIN+ will produce an
output code of all zeros and when VIN+ and VIN− are equal, the output code will vary between codes 127 and
128.
POWER CONSIDERATIONS
A/D converters draw sufficient transient current to corrupt their own power supplies if not adequately bypassed. A
33 µF capacitor should be placed within an inch (2.5 cm) of the A/D converter power pins. A 0.1 µF capacitor
should be placed as close as possible to each VA pin, preferably within one-half centimeter. Leadless chip
capacitors are preferred because they have low lead inductance.
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The VA and VDR supply pins should be isolated from each other to prevent any digital noise from being coupled
into the analog portions of the ADC. A ferrite choke, such as the JW Miller FB20009-3B, is recommended
between these supply lines when a common source is used for them.
As is the case with all high speed converters, the ADC08D502 should be assumed to have little power supply
noise rejection. Any power supply used for digital circuitry in a system where a lot of digital power is being
consumed should not be used to supply power to the ADC08D502. The ADC supplies should be the same
supply used for other analog circuitry, if not a dedicated supply.
Supply Voltage
The ADC08D502 is specified to operate with a supply voltage of 1.9V ±0.1V. It is very important to note that,
while this device will function with slightly higher supply voltages, these higher supply voltages may reduce
product lifetime.
No pin should ever have a voltage on it that is in excess of the supply voltage or below ground by more than 150
mV, not even on a transient basis. This can be a problem upon application of power and power shut-down. Be
sure that the supplies to circuits driving any of the input pins, analog or digital, do not come up any faster than
does the voltage at the ADC08D502 power pins.
The Absolute Maximum Ratings should be strictly observed, even during power up and power down. A power
supply that produces a voltage spike at turn-on and/or turn-off of power can destroy the ADC08D502. The circuit
of Figure 35 will provide supply overshoot protection.
Many linear regulators will produce output spiking at power-on unless there is a minimum load provided. Active
devices draw very little current until their supply voltages reach a few hundred millivolts. The result can be a turnon spike that can destroy the ADC08D502, unless a minimum load is provided for the supply. The 100Ω resistor
at the regulator output provides a minimum output current during power-up to ensure there is no turn-on spiking.
In the circuit of Figure 35, an LM317 linear regulator is satisfactory if its input supply voltage is 4V to 5V . If a
3.3V supply is used, an LM1086 linear regulator is recommended.
Linear
Regulator
VIN
1.9V
to ADC
+
10 PF
210
+
33 PF
100
+
10 PF
110
Figure 35. Non-Spiking Power Supply
The output drivers should have a supply voltage, VDR, that is within the range specified in the Operating Ratings
table. This voltage should not exceed the VA supply voltage and should never spice to a voltage greater than (VA
+ 100 mV).
If the power is applied to the device without a clock signal present, the current drawn by the device might be
below 200 mA. This is because the ADC08D502 gets reset through clocked logic and its initial state is random. If
the reset logic comes up in the "on" state, it will cause most of the analog circuitry to be powered down, resulting
in less than 100 mA of current draw. This current is greater than the power down current because not all of the
ADC is powered down. The device current will be normal after the clock is established.
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Thermal Management
The ADC08D502 is capable of impressive speeds and performance at very low power levels for its speed.
However, the power consumption is still high enough to require attention to thermal management. For reliability
reasons, the die temperature should be kept to a maximum of 130°C. That is, TA (ambient temperature) plus
ADC power consumption times θJA (junction to ambient thermal resistance) should not exceed 130°C. This is not
a problem if the ambient temperature is kept to a maximum of +85°C as specified in the Operating Ratings
section.
Please note that the following are general recommendations for mounting exposed pad devices onto a PCB. This
should be considered the starting point in PCB and assembly process development. It is recommended that the
process be developed based upon past experience in package mounting.
The package of the ADC08D502 has an exposed pad on its back that provides the primary heat removal path as
well as excellent electrical grounding to the printed circuit board. The land pattern design for lead attachment to
the PCB should be the same as for a conventional LQFP, but the exposed pad must be attached to the board to
remove the maximum amount of heat from the package, as well as to ensure best product parametric
performance.
To maximize the removal of heat from the package, a thermal land pattern must be incorporated on the PC
board within the footprint of the package. The exposed pad of the device must be soldered down to ensure
adequate heat conduction out of the package. The land pattern for this exposed pad should be at least as large
as the 5 x 5 mm of the exposed pad of the package and be located such that the exposed pad of the device is
entirely over that thermal land pattern. This thermal land pattern should be electrically connected to ground. A
clearance of at least 0.5 mm should separate this land pattern from the mounting pads for the package pins.
5.0 mm, min
0.25 mm, typ
0.33 mm, typ
1.2 mm, typ
Figure 36. Recommended Package Land Pattern
Since a large aperture opening may result in poor release, the aperture opening should be subdivided into an
array of smaller openings, similar to the land pattern of Figure 36.
To minimize junction temperature, it is recommended that a simple heat sink be built into the PCB. This is done
by including a copper area of about 2 square inches (6.5 square cm) on the opposite side of the PCB. This
copper area may be plated or solder coated to prevent corrosion, but should not have a conformal coating, which
could provide some thermal insulation. Thermal vias should be used to connect these top and bottom copper
areas. These thermal vias act as "heat pipes" to carry the thermal energy from the device side of the board to the
opposite side of the board where it can be more effectively dissipated. The use of 9 to 16 thermal vias is
recommended.
The thermal vias should be placed on a 1.2 mm grid spacing and have a diameter of 0.30 to 0.33 mm. These
vias should be barrel plated to avoid solder wicking into the vias during the soldering process as this wicking
could cause voids in the solder between the package exposed pad and the thermal land on the PCB. Such voids
could increase the thermal resistance between the device and the thermal land on the board, which would cause
the device to run hotter.
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If it is desired to monitor die temperature, a temperature sensor may be mounted on the heat sink area of the
board near the thermal vias. .Allow for a thermal gradient between the temperature sensor and the ADC08D502
die of θJ-PAD times typical power consumption = 2.8 x 1.6 = 4.5°C. Allowing for a 5.5°C (including an extra 1°C)
temperature drop from the die to the temperature sensor, then, would mean that maintaining a maximum pad
temperature reading of 124.5°C will ensure that the die temperature does not exceed 130°C, assuming that the
exposed pad of the ADC08D502 is properly soldered down and the thermal vias are adequate. (The inaccuracy
of the temperature sensor is in addition to the above calculation).
LAYOUT AND GROUNDING
Proper grounding and routing of all signals are essential to ensure accurate conversion. A single ground plane
should be used instead of splitting the ground plane into analog and digital areas.
Since digital switching transients are composed largely of high frequency components, the skin effect tells us that
total ground plane copper weight will have little effect upon the logic-generated noise. Total surface area is more
important than is total ground plane volume. Coupling between the typically noisy digital circuitry and the
sensitive analog circuitry can lead to poor performance that may seem impossible to isolate and remedy. The
solution is to keep the analog circuitry well separated from the digital circuitry.
High power digital components should not be located on or near any linear component or power supply trace or
plane that services analog or mixed signal components as the resulting common return current path could cause
fluctuation in the analog input “ground” return of the ADC, causing excessive noise in the conversion result.
Generally, we assume that analog and digital lines should cross each other at 90° to avoid getting digital noise
into the analog path. In high frequency systems, however, avoid crossing analog and digital lines altogether.
Clock lines should be isolated from ALL other lines, analog AND digital. The generally accepted 90° crossing
should be avoided as even a little coupling can cause problems at high frequencies. Best performance at high
frequencies is obtained with a straight signal path.
The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.
This is especially important with the low level drive required of the ADC08D502. Any external component (e.g., a
filter capacitor) connected between the converter's input and ground should be connected to a very clean point in
the analog ground plane. All analog circuitry (input amplifiers, filters, etc.) should be separated from any digital
components.
DYNAMIC PERFORMANCE
The ADC08D502 is a.c. tested and its dynamic performance is ensured. To meet the published specifications
and avoid jitter-induced noise, the clock source driving the CLK input must exhibit low rms jitter. The allowable
jitter is a function of the input frequency and the input signal level.
It is good practice to keep the ADC clock line as short as possible, to keep it well away from any other signals
and to treat it as a transmission line. Other signals can introduce jitter into the clock signal. The clock signal can
also introduce noise into the analog path if not isolated from that path.
Best dynamic performance is obtained when the exposed pad at the back of the package has a good connection
to ground. This is because this path from the die to ground is a lower impedance than offered by the package
pins.
USING THE SERIAL INTERFACE
The ADC08D502 may be operated in the non-extended control (non-Serial Interface) mode or in the extended
control mode. Table 13 and Table 14 describe the functions of pins 3, 4, 14 and 127 in the non-extended control
mode and the extended control mode, respectively.
Non-Extended Control Mode Operation
Non-extended control mode operation means that the Serial Interface is not active and all controllable functions
are controlled with various pin settings. That is, the full-scale range, single-ended or differential input and input
coupling (a.c. or d.c.) are all controlled with pin settings. The non-extended control mode is used by setting pin
14 high or low, as opposed to letting it float. Table 13 indicates the pin functions of the ADC08D502 in the nonextended control mode.
Table 13. Non-Extended Control Mode Operation
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Table 13. Non-Extended Control Mode Operation
(Pin 14 High or Low) (continued)
(Pin 14 High or Low)
Pin
Low
High
Floating
3
0.51 VP-P Output
0.71 VP-P Output
n/a
DDR
4
OutEdge = Neg
OutEdge = Pos
127
CalDly Low
CalDly High
n/a
14
650 mVP-P input range
870 mVP-P input range
Extended Control Mode
Pin 3 can be either high or low in the non-extended control mode. Pin 14 must not be left floating to select this
mode.
Pin 4 can be high or low or can be left floating in the non-extended control mode. In the non-extended control
mode, pin 4 high or low defines the edge at which the output data transitions. If this pin is floating, the output
clock (DCLK) is a DDR (Double Data Rate) clock and the output edge synchronization is irrelevant since data is
clocked out on both DCLK edges.
Pin 127, if it is high or low in the non-extended control mode, sets the calibration delay.
Table 14. Extended Control Mode Operation
(Pin 14 Floating)
Pin
Function
3
SCLK (Serial Clock)
4
SDATA (Serial Data)
127
SCS (Serial Interface Chip Select)
COMMON APPLICATION PITFALLS
Failure to write all register locations when using extended control mode. When using the serial interface, all
8 user registers must be written at least once with the default or desired values before calibration and
subsequent use of the ADC. In addition, the first write to register (Dh) must load the default value (0x3FFFh).
Once all registers have been written once, other desired settings can be loaded.
Driving the inputs (analog or digital) beyond the power supply rails. For device reliability, no input should
not go more than 150 mV below the ground pins or 150 mV above the supply pins. Exceeding these limits on
even a transient basis may not only cause faulty or erratic operation, but may impair device reliability. It is not
uncommon for high speed digital circuits to exhibit undershoot that goes more than a volt below ground.
Controlling the impedance of high speed lines and terminating these lines in their characteristic impedance
should control overshoot.
Care should be taken not to overdrive the inputs of the ADC08D502. Such practice may lead to conversion
inaccuracies and even to device damage.
Incorrect analog input common mode voltage in the d.c. coupled mode. The Input common mode voltage
must remain within 50 mV of the VCMO output, which has a variability with temperature that must also be tracked.
Distortion performance will be degraded if the input common mode voltage is more than 50 mV from VCMO .
Using an inadequate amplifier to drive the analog input. Use care when choosing a high frequency amplifier
to drive the ADC08D502 as many high speed amplifiers will have higher distortion than will the ADC08D502,
resulting in overall system performance degradation.
Driving the VBG pin to change the reference voltage. The reference voltage is intended to be fixed to provide
one of two different full-scale values (650 mVP-P and 870 mVP-P). Over driving this pin will not change the full
scale value, but can otherwise upset operation.
Driving the clock input with an excessively high level signal. The ADC clock level should not exceed the
level described in the Operating Ratings Table or the input offset could change.
Inadequate clock levels. Insufficient clock levels can result in poor performance. Excessive clock levels could
result in the introduction of an input offset.
42
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Product Folder Links: ADC08D502
ADC08D502
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SNOSC85A – AUGUST 2012 – REVISED APRIL 2013
Using a clock source with excessive jitter, using an excessively long clock signal trace, or having other
signals coupled to the clock signal trace. This will cause the sampling interval to vary, causing excessive
output noise and a reduction in SNR performance.
Failure to provide adequate heat removal. It is important to provide adequate heat removal to ensure device
reliability. This can either be done with adequate air flow or the use of a simple heat sink built into the board. The
backside pad should be grounded for best performance.
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Product Folder Links: ADC08D502
43
ADC08D502
SNOSC85A – AUGUST 2012 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Original (April 2013) to Revision A
•
44
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 43
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
ADC08D502CIYB/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
HLQFP
NNB
128
60
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
ADC08D502
CIYB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2015
Addendum-Page 2
MECHANICAL DATA
NNB0128A
VNX128A (Rev B)
www.ti.com
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