Samsung K6X4016C3F-TF70 256kx16 bit low power full cmos static ram Datasheet

CMOS SRAM
K6X4016C3F Family
Document Title
256Kx16 bit Low Power full CMOS Static RAM
Revision History
Revision No.
History
Draft Date
Remark
0.0
Initial draft
July 26, 2002
Preliminary
0.1
Revised
Added Commercial Product.
Deleted 44-TSOP2-400R Package Type.
November 29, 2002
Preliminary
1.0
Finalized
- Changed ICC from 10mA to 5mA
- Changed ICC1 from 10mA to 7mA
- Changed ICC2 from 50mA to 30mA
- Changed ISB from 3mA to 0.4mA
- Changed IDR(Commercial) from 15µA to 12µA
- Changed IDR(industrial) from 20µA to 12µA
- Changed IDR(Automotive) from 30µA to 25µA
September 16, 2003 final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
256Kx16 bit Low Power full CMOS Static RAM
FEATURES
GENERAL DESCRIPTION
• Process Technology: Full CMOS
• Organization: 256Kx16
• Power Supply Voltage: 4.5~5.5V
• Low Data Retention Voltage: 2V(Min)
• Three state output and TTL compatible
• Package Type: 44-TSOP2-400F
The K6X4016C3F families are fabricated by SAMSUNG′s
advanced full CMOS process technology. The families support various operating temperature range and small package types for user flexibility of system design. The families
also support low data retention voltage for battery back-up
operation with low data retention current.
PRODUCT FAMILY
Power Dissipation
Product Family Operating Temperature Vcc Range
K6X4016C3F-B
Commercial(0~70°C)
K6X4016C3F-F
Industrial (-40~85°C)
K6X4016C3F-Q
Automotive (-40~125°C)
Speed
Standby
(ISB1, Max)
Operating
(ICC2, Max)
PKG Type
20 µA
4.5~5.5V
551)/70ns
30 mA
44-TSOP2-400F
30 µA
1. The parameter is measured with 50pF test load.
FUNCTIONAL BLOCK DIAGRAM
PIN DESCRIPTION
A4
A3
A2
A1
A0
CS
I/O1
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A17
A16
A15
A14
A13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44-TSOP2
Forward
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
N.C
A8
A9
A10
A11
A12
Clk gen.
Precharge circuit.
Vcc
Vss
Row
Addresses
I/O1~I/O8
Row
select
Data
cont
Memory array
I/O Circuit
Column select
Data
cont
I/O9~I/O16
Data
cont
Name
Function
Name
Function
LB
Lower Byte (I/O1~8)
Output Enable Input
UB
Upper Byte(I/O9~16)
Write Enable Input
Vcc
Power
Address Inputs
Vss
Ground
NC
No Connection
CS
Chip Select Input
OE
WE
A0~A17
I/O1~I/O16 Data Inputs/Outputs
Column Addresses
WE
OE
UB
Control
logic
LB
CS
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
2
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
PRODUCT LIST
Commercial Products(0~70°°C)
Industrial Products(-40~85°°C)
Automotive Products(-40~125°°C)
Part Name
Function
Part Name
Function
Part Name
Function
K6X4016C3F-TB55
K6X4016C3F-TB70
44-TSOP2-F, 55ns, LL
44-TSOP2-F, 70ns, LL
K6X4016C3F-TF55
K6X4016C3F-TF70
44-TSOP2-F, 55ns, LL
44-TSOP2-F, 70ns, LL
K6X4016C3F-TQ55
K6X4016C3F-TQ70
44-TSOP2-F, 55ns, L
44-TSOP2-F, 70ns, L
FUNCTIONAL DESCRIPTION
CS
OE
WE
LB
UB
I/O1~8
I/O9~16
Mode
Power
H
X1)
X1)
X1)
X1)
High-Z
High-Z
Deselected
Standby
L
H
H
1)
X
1)
X
High-Z
High-Z
Output Disabled
Active
L
X1)
X1)
H
H
High-Z
High-Z
Output Disabled
Active
L
L
H
L
H
Dout
High-Z
Lower Byte Read
Active
L
L
H
H
L
High-Z
Dout
Upper Byte Read
Active
L
L
H
L
L
Dout
Dout
Word Read
Active
L
X1)
L
L
H
Din
High-Z
Lower Byte Write
Active
L
1)
X
L
H
L
High-Z
Din
Upper Byte Write
Active
L
X1)
L
L
L
Din
Din
Word Write
Active
1. X means don′t care. (Must be in low or high state)
ABSOLUTE MAXIMUM RATINGS1)
Item
Voltage on any pin relative to Vss
Voltage on Vcc supply relative to Vss
Power Dissipation
Storage temperature
Symbol
Ratings
Unit
Remark
VIN,VOUT
-0.5 to VCC+0.5V(max. 7.0V)
V
-
VCC
-0.3 to 7.0
V
-
PD
1.0
W
-
TSTG
-65 to 150
°C
-
TA
-40 to 85
0 to 70
Operating Temperature
-40 to 125
K6X4016C3F-B
°C
K6X4016C3F-F
K6X4016C3F-Q
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
3
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
RECOMMENDED DC OPERATING CONDITIONS1)
Item
Symbol
Min
Typ
Max
Unit
Supply voltage
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
V
Input high voltage
VIH
2.2
-
Vcc+0.52)
V
Input low voltage
VIL
-
0.8
V
3)
-0.5
Note:
1. Commercial Product: TA=0 to 70°C, otherwise specified
Industrial Product: TA=-40 to 85°C, otherwise specified
Automotive Product TA=-40 to 125°C, otherwise specified
2. Overshoot: VCC+3.0V in case of pulse width ≤ 30ns
3. Undershoot: -3.0V in case of pulse width ≤ 30ns
4. Overshoot and undershoot are sampled, not 100% tested
CAPACITANCE1) (f=1MHz, TA=25°C)
Symbol
Test Condition
Min
Max
Unit
Input capacitance
Item
CIN
VIN=0V
-
8
pF
Input/Output capacitance
CIO
VIO=0V
-
10
pF
1. Capacitance is sampled, not 100% tested
DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min
Typ
Max
Unit
Input leakage current
ILI
VIN=Vss to Vcc
-1
-
1
µA
Output leakage current
ILO
CS=VIH or OE=VIH or WE=VIL, VIO=Vss to Vcc
-1
-
1
µA
Operating power supply current
ICC
IIO=0mA, CS=VIL, VIN=VIL or VIH, Read
-
-
5
mA
ICC1
Cycle time=1µs, 100% duty, IIO=0mA
CS≤0.2V, VIN≥0.2V or VIN≥Vcc-0.2V
-
-
7
mA
ICC2
Cycle time=Min, 100% duty, IIO=0mA, CS=VIL,
VIN=VIH or VIL
-
-
30
mA
Average operating current
Output low voltage
VOL
IOL=2.1mA
-
-
0.4
V
Output high voltage
VOH
IOH=-1.0mA
2.4
-
-
V
Standby Current(TTL)
ISB
CS=VIH, Other inputs = VIL or VIH
0.4
mA
20
µA
30
µA
Standby Current(CMOS)
ISB1
CS≥Vcc-0.2V, Other inputs=0~Vcc
4
-
-
K6X4016C3F-B
-
-
K6X4016C3F-F
-
-
K6X4016C3F-Q
-
-
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
AC OPERATING CONDITIONS
TEST CONDITIONS (Test Load and Test Input/Output Reference)
Input pulse level: 0.8 to 2.4V
Input rising and falling time: 5ns
Input and output reference voltage: 1.5V
Output load (See right): CL=100pF+1TTL
CL=50pF+1TTL
CL1)
1. Including scope and jig capacitance
AC CHARACTERISTICS
( Vcc=4.5~5.5V, Commercial Product: TA=0 to 70°C, Industrial Product: TA=-40 to 85°C, Automotive Product : TA=-40 to 125°C, )
Speed Bins
Parameter List
Symbol
Write
Units
70ns
Min
Max
Min
Max
Read cycle time
tRC
55
-
70
-
ns
Address access time
tAA
-
55
-
70
ns
Chip select to output
tCO
-
55
-
70
ns
Output enable to valid output
tOE
-
25
-
35
ns
Chip select to low-Z output
Read
55ns
tLZ
10
-
10
-
ns
Output enable to low-Z output
tOLZ
5
-
5
-
ns
LB, UB enable to low-Z output
tBLZ
5
-
5
-
ns
Chip disable to high-Z output
tHZ
0
20
0
25
ns
OE disable to high-Z output
tOHZ
0
20
0
25
ns
Output hold from address change
tOH
10
-
10
-
ns
LB, UB valid to data output
tBA
-
25
-
35
ns
UB, LB disable to high-Z output
tBHZ
0
20
0
25
ns
Write cycle time
tWC
55
-
70
-
ns
Chip select to end of write
tCW
45
-
60
-
ns
Address set-up time
tAS
0
-
0
-
ns
Address valid to end of write
tAW
45
-
60
-
ns
Write pulse width
tWP
45
-
55
-
ns
Write recovery time
tWR
0
-
0
-
ns
Write to output high-Z
tWHZ
0
20
0
25
ns
Data to write time overlap
tDW
25
-
30
-
ns
Data hold from write time
tDH
0
-
0
-
ns
End write to output low-Z
tOW
5
-
5
-
ns
LB, UB valid to end of write
tBW
45
-
60
-
ns
DATA RETENTION CHARACTERISTICS
Item
Symbol
Test Condition
Vcc for data retention
VDR
CS≥Vcc-0.2V
Data retention current
IDR
Vcc=3.0V, CS≥Vcc-0.2V
Data retention set-up time
tSDR
Recovery time
tRDR
Min
Typ
Max
Unit
2.0
-
5.5
V
K6X4016C3F-B
12
-
K6X4016C3F-F
K6X4016C3F-Q
See data retention waveform
5
12
µA
25
0
-
-
5
-
-
ms
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL, WE=VIH, UB or/and LB=VIL)
tRC
Address
tAA
tOH
Data Out
Data Valid
Previous Data Valid
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
tRC
Address
tOH
tAA
tCO
CS
tHZ
tBA
UB, LB
tBHZ
tOE
OE
Data out
High-Z
tOLZ
tBLZ
tLZ
tOHZ
Data Valid
NOTES (READ CYCLE)
1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage
levels.
2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device
interconnection.
6
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
TIMING WAVEFORM OF WRITE CYCLE(1) (WE Controlled)
tWC
Address
tWR(4)
tCW(2)
CS
tAW
tBW
UB, LB
tWP(1)
WE
tAS(3)
tDW
Data in
High-Z
tDH
tWHZ
Data out
High-Z
Data Valid
tOW
Data Undefined
TIMING WAVEFORM OF WRITE CYCLE(2) (CS Controlled)
tWC
Address
tCW(2)
tAS(3)
tWR(4)
CS
tAW
tBW
UB, LB
tWP(1)
WE
tDW
Data Valid
Data in
Data out
tDH
High-Z
High-Z
7
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
TIMING WAVEFORM OF WRITE CYCLE(3) (UB, LB Controlled)
tWC
Address
tCW(2)
tWR(4)
CS
tAW
tBW
UB, LB
tAS(3)
tWP(1)
WE
tDW
Data Valid
Data in
Data out
tDH
High-Z
High-Z
NOTES (WRITE CYCLE)
1. A write occurs during the overlap(tWP) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB
or LB for single byte operation or simultaneously asserting UB and LB for double byte operation. A write ends at the earliest transition when CS goes high and WE goes high. The tWP is measured from the beginning of write to the end of write.
2. tCW is measured from the CS going low to the end of write.
3. tAS is measured from the address valid to the beginning of write.
4. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CS or WE going high.
DATA RETENTION WAVE FORM
CS controlled
VCC
Data Retention Mode
tSDR
tRDR
4.5V
2.2V
VDR
CS≥VCC - 0.2V
CS
GND
8
Revision 1.0
September 2003
CMOS SRAM
K6X4016C3F Family
PACKAGE DIMENSIONS
Units: millimeter(inch)
44 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400F)
0~8°
0.25
(
)
0.010
#44
#23
10.16
0.400
0.45 ~0.75
0.018 ~ 0.030
11.76±0.20
0.463±0.008
( 0.50 )
0.020
#1
#22
1.00±0.10
0.039±0.004
1.20
MAX.
0.047
( 0.805 )
0.032
0.35±0.10
0.014±0.004
0.05
MIN.
0.002
18.81
MAX.
0.741
18.41±0.10
0.725±0.004
0.80
0.0315
9
0
+ 0.1
5
- 0.0
04
+ 0.0
6 .002
0.00 - 0
0.15
0.10
0.004 MAX
Revision 1.0
September 2003
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