Material Content Data Sheet Sales Product Name BCR 48PN H6327 MA# MA000846196 Package PG-SOT363-6-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-38-2 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 6.28 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.00 16 0.010 0.16 1595 0.086 1.36 0.001 0.01 0.003 0.05 459 0.009 0.14 1376 2.869 45.67 45.87 456634 458561 0.010 0.16 0.16 1631 1631 0.030 0.48 0.651 10.36 2.346 37.33 48.17 373311 481692 0.213 3.39 3.39 33936 33936 0.056 0.89 0.89 8946 1.52 13623 2. 3. 4817 103564 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 15234 92 Important Remarks: 1. Sum [ppm] 8946 1000000