HCPL-4506/J456/0466, HCNW4506 Intelligent Power Module and Gate Drive Interface Optocouplers Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features The HCPL-4506 and HCPL-0466 contain a GaAsP LED while the HCPL-J456 and the HCNW4506 contain an AlGaAs LED. The LED is optically coupled to an integrated high gain photo detector. Minimized propagation delay difference between devices makes these optocouplers excellent solutions for improving inverter efficiency through reduced switching dead time. • Performance specified for bommon IPM applications over industrial temperature range: -40°C to 100°C An on chip 20 kΩ output pull-up resistor can be enabled by shorting output pins 6 and 7, thus eliminating the need for an external pull-up resistor in common IPM applications. Specifications and performance plots are given for typical IPM applications. • 15 kV/µs minimum common mode transient immunity at VCM = 1500 V Functional Diagram NC 1 8 VCC 20 kΩ ANODE 2 7 VL CATHODE 3 6 VO NC 4 5 GND Truth Table LED SHIELD • Minimized Pulse Width Distortion PWD = 450 ns • CTR > 44% at IF = 10 mA • Safety approval: UL Recognized -3750 V rms / 1 min. for HCPL-4506/0466/J456 -5000 V rms / 1 min. for HCPL-4506 Option 020 and HCNW4506 CSA Approved IEC/EN/DIN EN 60747-5-2 Approved -VIORM = 560 Vpeak for HCPL-0466 Option 060 -VIORM = 630 Vpeak for HCPL-4506 Option 060 -VIORM = 891 Vpeak for HCPL-J456 -VIORM = 1414 Vpeak for HCNW4506 Applications VO ON L HCPL-4506 Functional Diagram OFF • Fast maximum propagation delays tPHL = 480 ns tPLH = 550 ns H The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended. • IPM isolation • Isolated IGBT/MOSFET gate drive • AC and brushless DC motor drives • Industrial inverters CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Selection Guide Package Type Standard 8-Pin DIP (300 Mil) White Mold 8-Pin DIP (300 Mil) Small Outline SO8 Widebody (400 Mil) Part HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506 Number IEC/EN/DIN EN 607475-2 Approval VIORM = 630 Vpeak VIORM = 891 Vpeak (Option 060) *Technical data for these products are on separate Avago publications. VIORM = 560 Vpeak (Option 060) VIORM = 1414 Vpeak Hermetic* HCPL-5300 HCPL-5301 — Ordering Information HCPL-0466, HCPL-4506 and HCPL-J456 are UL Recognized with 3750 Vrms for 1 minute per UL1577. HCNW4506 is UL Recognized with 5000 Vrms for 1 minute per UL1577. HCPL-0466, HCPL-4506, HCPL-J456 and HCNW4506 are approved under CSA Component Acceptance Notice #5, File CA 88324. Part Number HCPL-4506 HCPL-J456 HCPL-0466 Option RoHS Compliant non RoHS Compliant Package Surface Mount Gull Wing Tape & Reel UL 5000 Vrms/ 1 Minute rating IEC/EN/DIN EN 60747-5-2 -000E no option -300E #300 X X 50 per tube -500E #500 X X 1000 per reel -020E #020 300 mil DIP-8 X X Quantity 50 per tube 50 per tube -320E #320 X X X 50 per tube -520E #520 X X X 1000 per reel -060E #060 X 50 per tube -360E #360 X X X 50 per tube -560E #560 X X X X 1000 per reel -000E no option 300 mil DIP-8 X 50 per tube -300E #300 X X X 50 per tube -500E #500 X X X 1000 per reel -000E no option X 100 per tube -500E #500 X 1500 per reel -060E #060 X X 100 per tube -560E #560 X X 1500 per reel -000E no option X 42 per tube SO-8 X X X X 400 mil X HCNW4506 -300E #300 Widebody X X X X 42 per tube -500E #500 DIP-8 X X X X 750 per reel X To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example 1: HCPL-4506-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant. Example 2: HCPL-4506 to order product of 300 mil DIP package in Tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and RoHS compliant will use ‘–XXXE.’ Package Outline Drawings HCPL-4506 Outline Drawing 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) 8 TYPE NUMBER 7 6 5 6.35 ± 0.25 (0.250 ± 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5° TYP. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 1.080 ± 0.320 (0.043 ± 0.013) DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. 0.65 (0.025) MAX. 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. HCPL-4506 Gull Wing Surface Mount Option 300 Outline Drawing LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.016 (0.040) 5 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.25 (0.025 ± 0.010) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 2.0 (0.080) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. Package Outline Drawings HCPL-J456 Outline Drawing 7.62 ± 0.25 (0.300 ± 0.010) 9.80 ± 0.25 (0.386 ± 0.010) 8 TYPE NUMBER 7 6 5 6.35 ± 0.25 (0.250 ± 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5° TYP. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 1.080 ± 0.320 (0.043 ± 0.013) DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. 0.65 (0.025) MAX. 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (20 mils) MAX. HCPL-J456 Gull Wing Surface Mount Option 300 Outline Drawing LAND PATTERN RECOMMENDATION 9.80 ± 0.25 (0.386 ± 0.010) 8 7 6 1.016 (0.040) 5 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.25 (0.025 ± 0.010) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.5 mm (20 mils) MAX. 2.0 (0.080) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. HCPL-0466 Outline Drawing (8-Pin Small Outline Package) LAND PATTERN RECOMMENDATION 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) 7.49 (0.295) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 1.9 (0.075) 4 0.406 ± 0.076 (0.016 ± 0.003) 0.64 (0.025) 1.270 BSC (0.050) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 1.524 (0.060) 0.228 ± 0.025 (0.009 ± 0.001) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. HCNW4506 Outline Drawing (8-Pin Widebody Package) 11.00 MAX. (0.433) 11.15 ± 0.15 (0.442 ± 0.006) 8 7 6 5 TYPE NUMBER A HCNWXXXX 9.00 ± 0.15 (0.354 ± 0.006) DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7° TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.78 ± 0.15 (0.070 ± 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. HCNW4506 Gull Wing Surface Mount Option 300 Outline Drawing 11.15 ± 0.15 (0.442 ± 0.006) 8 7 6 LAND PATTERN RECOMMENDATION 5 9.00 ± 0.15 (0.354 ± 0.006) 1 2 3 13.56 (0.534) 4 1.3 (0.051) 2.29 (0.09) 12.30 ± 0.30 (0.484 ± 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.78 ± 0.15 (0.070 ± 0.006) 2.54 (0.100) BSC 0.75 ± 0.25 (0.030 ± 0.010) 1.00 ± 0.15 (0.039 ± 0.006) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 7° NOM. Solder Reflow Temperature Profile 300 PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. 200 PEAK TEMP. 245 °C PEAK TEMP. 240 °C TEMPERATURE (°C) 2.5 C ± 0.5 °C/SEC. 30 SEC. 160 °C 150 °C 140 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C 30 SEC. 3 °C + 1 °C/–0.5 °C 100 PREHEATING TIME 150 °C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 TIME (SECONDS) NOTE: NON-HALIDE FLUX SHOULD BE USED. Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax * 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 15 SEC. 217 °C 150 - 200 °C RAMP-UP 3 °C/SEC. MAX. RAMP-DOWN 6 °C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL 60 to 150 SEC. t 25 °C to PEAK TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C NOTE: NON-HALIDE FLUX SHOULD BE USED. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C 200 250 Regulatory Information The devices contained in this data sheet have been approved by the following agencies: Agency/Standard Underwriters Laboratories (UL) HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506 • • • • • • • • • • • UL 1577 Recognized under UL 1577, Component Recognized Program, Category FPQU2, File E55361 Canadian Standards Association (CSA) Component Acceptance Notice #5 File CA88324 Verband Deutscher Electrotechniker (VDE) DIN VDE 0884 (June 1992) IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 • • • • EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 Insulation and Safety Related Specifications Value Parameter Symbol HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506 Units Conditions Minimum External L(101) 7.1 7.4 4.9 9.6 mm Air Gap (External Clearance) Measured from input terminals to output terminals, shortest distance through air. Minimum External L(102) 7.4 8.0 4.8 10.0 mm Tracking (External Creepage) Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal 0.08 0.5 0.08 1.0 mm Plastic Gap (Internal Clearance) Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA NA 4.0 mm Tracking (Internal Creepage) Measured from input terminals to output terminals, along internal cavity. Tracking Resistance CTI ≥175 ≥175 ≥175 ≥200 Volts (Comparative Tracing Index) Isolation Group IIIa IIIa IIIa IIIa DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) All Avago data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered. There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level. IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Description Symbol HCPL-0466 Option 060 HCPL-4506 Option 060 HCPL-J456 HCNW4506 Unit Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤150 V rms I-IV I-IV I-IV I-IV for rated mains voltage ≤300 V rms I-III I-IV I-IV I-IV for rated mains voltage ≤450 V rms I-III I-III I-IV for rated mains voltage ≤600 V rms I-III I-IV for rated mains voltage ≤1000 V rms I-III Climatic Classification 55/100/21 55/100/21 55/100/21 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 2 2 2 560 630 891 1414 Maximum Working Insulation Voltage VIORM Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = VPR 1050 1181 1670 2652 1 sec, Partial Discharge < 5pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and Sample Test, tm = 60 sec, VPR 840 945 1336 2121 Partial Discharge < 5pC Highest Allowable Overvoltage* VIOTM 4000 6000 6000 8000 (Transient Overvoltage, tini = 10 sec) Safety Limiting Values – maximum values allowed in the event of a fail- ure, also see Thermal Derating curve. Case Temperature TS 150 175 175 150 Input Current IS INPUT 150 230 400 400 Output Power PS OUTPUT 600 600 600 700 Insulation Resistance at TS , RS ≥ 109 ≥109 ≥109 ≥109 VIO = 500 V Vpeak Vpeak Vpeak Vpeak °C mA mW Ω *Refer to the optocoupler section of the Designer's Catalog, under regulatory information (IEC/EN/DIN EN 60747-5-2) for a detailed description of Method a and Method b partial discharge test profiles. Notes: These optocouplers are suitable for "safe electrical isolation" only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Insulation Characteristics are per IEC/EN/DIN EN 60747-5-2. Surface mount classification is Class A in accordance with CECC 00802. 10 Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -55 125 °C Operating Temperature TA -40 100 °C Average Input Current[1] IF(avg) 25 mA Peak Input Current[2] (50% duty cycle, ≤1 ms pulse width) IF(peak) 50 mA Peak Transient Input Current (<1 µs pulse width, 300 pps) IF(tran) 1.0 A VR 5 Volts HCPL-J456, HCNW4506 3 Reverse Input Voltage (Pin 3-2) HCPL-4506, HCPL-0466 Average Output Current (Pin 6) IO(avg) 15 mA Resistor Voltage (Pin 7) V7 -0.5 VCC Volts Output Voltage (Pin 6-5) VO -0.5 30 Volts Supply Voltage (Pin 8-5) VCC -0.5 30 Volts Output Power Dissipation[3] PO 100 mW Total Power Dissipation[4] PT 145 mW Lead Solder Temperature (HCPL-4506, HCPL-J456) 260°C for 10 s, 1.6 mm below seating plane Lead Solder Temperature (HCNW4506) Infrared and Vapor Phase Reflow Temperature (HCPL-0466 and Option 300) See Package Outline Drawings Section Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage VCC 4.5 30 Volts Output Voltage VO 0 30 Volts Input Current (ON) IF(on) 10 20 mA Input Voltage (OFF) VF(off )* -5 0.8 V TA -40 100 °C Operating Temperature *Recommended VF(OFF) = -3 V to 0.8 V for HCPL-J456, HCNW4506. 11 260°C for 10 s (up to seating plane) Electrical Specifications Over recommended operating conditions unless otherwise specified: TA = -40°C to +100°C, VCC = +4.5 V to 30 V, IF(on) = 10 mA to 20 mA, VF(off ) = -5 V to 0.8 V† Parameter Symbol Device Min. Typ.* Max. Units Test Conditions Fig. Current Transfer Ratio CTR 44 90 % IF = 10 mA, VO = 0.6 V Low Level Output Current IOL 4.4 9.0 mA IF = 10 mA, 1, 2 VO = 0.6 V Low Level Output Voltage VOL 0.3 0.6 V HCPL-4506 1.5 5 mA VO = 0.8 V, 1 HCPL-0466 IO = 0.75 mA HCNW4506 HCPL-J456 IOH 5 IO = 2.4 mA Input Threshold Current ITH High Level Output Current Note 16 0.6 5 50 µA VF = 0.8 V 3 High Level Supply Current ICCH 0.6 1.3 mA VF = 0.8 V, VO = Open 16 Low Level Supply Current ICCL 0.6 1.3 mA IF = 10 mA, VO = Open 16 Input Forward Voltage VF HCPL-4506 1.5 1.8 V IF = 10 mA 4 HCPL-0466 HCPL-J456 HCNW4506 Temperature Coefficient ∆VF/∆TA of Forward Voltage Input Reverse Breakdown BVR Voltage 1.2 1.6 1.95 5 1.6 1.85 HCPL-4506 -1.6 mV/°C IF = 10 mA HCPL-0466 HCPL-J456 HCNW4506 -1.3 HCPL-4506 5 V IR = 10 µA HCPL-0466 HCPL-J456 3 HCNW4506 IR = 100 µA Input Capacitance CIN HCPL-4506 60 pF HCPL-0466 f = 1 MHz, VF = 0 V HCPL-J456 72 HCNW4506 Internal Pull-up Resistor Internal Pull-up Resistor Temperature Coefficient RL ∆RL/∆TA *All typical values at 25°C, VCC = 15 V. †VF(off ) = -3 V to 0.8 V for HCPL-J456, HCNW4506. 12 14 20 25 0.014 kΩ TA = 25°C kΩ/°C 12, 13 Switching Specifications (RL= 20 kΩ External) Over recommended operating conditions unless otherwise specified: TA = -40°C to +100°C, VCC = +4.5 V to 30 V, IF(on) = 10 mA to 20 mA, VF(off ) = -5 V to 0.8 V† Parameter Symbol Min. Typ.* Max. Units Test Conditions Propagation Delay TPHL 30 200 400 ns CL = 100 pF Time to Logic HCPL-J456 480 Low at Output 100 CL = 10 pF IF(on) = 10 mA, VF(off ) = 0.8 V, VCC = 15.0 V, Fig. Note 6, 8, 1013 11, 14, 16 Propagation Delay TPLH 270 400 550 ns CL = 100 pF V THLH = 2.0 V, Time to High V THHL = 1.5 V Output Level 130 CL = 10 pF Pulse Width Distortion PWD 200 450 ns CL = 100 pF 20 Propagation Delay tPLH-tPHL -150 200 450 ns 17 Difference Between Any 2 Parts Output High Level |CMH| 15 30 kV/µs IF = 0 mA, Common Mode VO > 3.0 V Transient Immunity VCC = 15.0 V, 7 CL = 100 pF, VCM = 1500 Vp-p 18 Output Low Level |CML| 15 30 kV/µs IF = 10 mA TA = 25°C Common Mode VO < 1.0 V Transient Immunity 19 Switching Specifications (RL= Internal Pull-up) Over recommended operating conditions unless otherwise specified: TA = -40°C to +100°C, VCC = +4.5 V to 30 V, IF(on) = 10 mA to 20 mA, VF(off ) = -5 V to 0.8 V† Parameter Symbol Min. Typ.* Max. Units Propagation Delay tPHL 20 200 400 ns Time to Logic HCPL-J456 485 Low at Output Propagation Delay Time to High Output Level tPLH Pulse Width Distortion PWD Propagation Delay Difference Between Any 2 Parts tPLH-tPHL 220 -150 Test Conditions Fig. IF(on) = 10 mA, VF(off ) = 0.8 V, 6, 9 VCC = 15.0 V, CL = 100 pF, V THLH = 2.0 V, V THHL = 1.5 V Note 11-14, 16 450 650 ns 250 500 ns 20 250 500 ns 17 Output High Level |CMH| 30 kV/µs IF = 0 mA, Common Mode VO > 3.0 V Transient Immunity VCC = 15.0 V, CL = 100 pF, VCM = 1500 Vp-p, 7 18 Output Low Level |CML| 30 kV/µs IF = 16 mA, Common Mode VO < 1.0 V Transient Immunity TA = 25°C 19 Square Wave, tRISE, tFALL > 5 ns, no bypass capacitors 16 Power Supply PSR 1.0 Vp-p Rejection *All typical values at 25°C, VCC = 15 V. †VF(off ) = -3 V to 0.8 V for HCPL-J456, HCNW4506. 13 Package Characteristics Over recommended temperature (TA = -40°C to 100°C) unless otherwise specified. Parameter Sym. Input-Output Momentary VISO Withstand Voltage† Device Min. Typ.* Max. Units Test Conditions Fig. Note HCPL-4506 3750 V rms HCPL-0466 RH < 50% t = 1 min. 6,7,10 HCPL-J456 TA = 25°C 6,8,10 HCPL-4506 5000 Option020 HCNW4506 Resistance RI-O (Input-Output) HCPL-4506 1012 HCPL-J456 Ω HCPL-0466 HCNW4506 Capacitance CI-O (Input-Output) 3750 5000 1012 6,9, 15 6,9,10 VI-O = 500 Vdc 6 f = 1 MHz 6 1013 HCPL-4506 HCPL-0466 0.6 HCPL-J456 0.8 HCNW4506 0.5 pF *All typical values at 25°C, VCC = 15 V. †The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E. Notes: 1. Derate linearly above 90°C free-air temperature at a rate of 0.8 mA/°C. 2. Derate linearly above 90°C free-air temperature at a rate of 1.6 mA/°C. 3. Derate linearly above 90°C free-air temperature at a rate of 3.0 mW/°C. 4. Derate linearly above 90°C free-air temperature at a rate of 4.2 mW/°C. 5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current (IO) to the forward LED input current (IF) times 100. 6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 7. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥4500 V rms for 1 second (leakage detection current limit, II-O ≤5 µA). 8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage detection current limit, Ii-o ≤ 5 µA). 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). 10. This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable. 11. Pulse: f = 20 kHz, Duty Cycle = 10%. 12. The internal 20 kΩ resistor can be used by shorting pins 6 and 7 together. 13. Due to tolerance of the internal resistor, and since propagation delay is dependent on the load resistor value, performance can be improved by using an external 20 kΩ 1% load resistor. For more information on how propagation delay varies with load resistance, see Figure 8. 14. The RL = 20 kΩ, CL = 100 pF load represents a typical IPM (Intelligent Power Module) load. 15. See Option 020 data sheet for more information. 16. Use of a 0.1 µF bypass capacitor connected between pins 5 and 8 can improve performance by filtering power supply line noise. 17. The difference between tPLH and tPHL between any two devices under the same test condition. (See IPM Dead Time and Propagation Delay Specifications section.) 18. Common mode transient immunity in a Logic High level is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 3.0 V). 19. Common mode transient immunity in a Logic Low level is the maximum tolerable dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 1.0 V). 20. Pulse Width Distortion (PWD) is defined as |tPHL - tPLH| for any given device. 14 NORMALIZED OUTPUT CURRENT IO – OUTPUT CURRENT – mA 8 6 4 VO = 0.6 V 2 0 100 °C 25 °C -40 °C 0 5 10 15 1.00 0.95 0.90 IF = 10 mA VO = 0.6 V 0.85 0.80 -40 20 -20 20 0 40 60 80 100 TA – TEMPERATURE – °C IF – FORWARD LED CURRENT – mA IOH – HIGH LEVEL OUTPUT CURRENT – µA 1.05 10 20.0 VF = 0.8 V VCC = VO = 4.5 V OR 30 V 15.0 4.5 V 30 V 10.0 5.0 0 -40 -20 0 20 40 60 80 TA – TEMPERATURE – °C Figure 2. Normalized output current vs. temperature. Figure 1. Typical transfer characteristics. Figure 3. High level output current vs. temperature. HCPL-4506 fig 6 HCPL-4506 fig 5 HCPL-4506 fig 7 IF – FORWARD CURRENT – mA IF – INPUT FORWARD CURRENT – mA HCPL-4506/0466 1000 TA = 25°C 100 IF + 10 VF – 1.0 0.1 0.01 0.001 1.10 1.20 1.30 1.40 1.50 1.60 TA = 25 °C 10 IF 0.1 0.01 0.001 0.8 – 1.0 1.2 1.4 1.6 1.8 2.0 Figure 5. HCPL-J456 and HCNW4506 input current vs. forward voltage. HCPL-4506 fig 9 HCPL-4506 fig 8 + VF – VF – INPUT FORWARD VOLTAGE – V Figure 4. HCPL-4506 and HCPL-0466 input current vs. forward voltage. IF(ON) =10 mA + 1 VF – FORWARD VOLTAGE – VOLTS 1 HCPL-J456/HCNW4506 100 8 2 20 kΩ 0.1 µF 20 kΩ + – 7 If VCC = 15 V 5V 3 6 tf VO VOUT C L* 4 SHIELD 15 90% 90% 10% 10% VTHHL 5 *TOTAL LOAD CAPACITANCE Figure 6. Propagation delay test circuit. tr HCPL-4506 fig 10 tPHL tPLH VTHLH 100 1 IF VCM 8 0.1 µF 20 kΩ 2 δV = VCM δt ∆t 20 kΩ 7 + – A B 3 6 OV VCC = 15 V ∆t VOUT 100 pF* 4 + VFF VO 5 SHIELD *100 pF TOTAL CAPACITANCE – VCC SWITCH AT A: IF = 0 mA VO VOL SWITCH AT B: IF = 10 mA – + VCM = 1500 V Figure 7. CMR test circuit. Typical CMR waveform. 400 IF = 10 mA VCC = 15 V CL = 100 pF RL = 20 kΩ (EXTERNAL) 200 100 -40 -20 0 20 40 60 80 IF = 10 mA VCC = 15 V CL = 100 pF RL = 20 kΩ 500 (INTERNAL) tPLH tPHL 400 300 200 100 -40 100 TA – TEMPERATURE – °C HCPL-4506 fig 12 800 200 100 200 300 400 500 CL – LOAD CAPACITANCE – pF Figure 11. Propagation delay vs. load capacitance. HCPL-4506 fig 15 16 80 400 tPLH tPHL 200 0 100 20 10 800 400 200 5 10 15 20 25 30 VCC – SUPPLY VOLTAGE – V Figure 12. Propagation delay vs. supply voltage. HCPL-4506 fig 16 40 50 Figure 10. Propagation delay vs. load resistance. HCPL-4506 fig 14 500 600 0 30 RL – LOAD RESISTANCE – kΩ IF = 10 mA CL = 100 pF RL = 20 kΩ TA = 25°C tPLH tPHL 1000 400 0 60 600 HCPL-4506 fig 13 1200 600 0 40 Figure 9. Propagation delay with internal 20 kΩ RL vs. temperature. tP – PROPAGATION DELAY – ns tP – PROPAGATION DELAY – ns 1000 20 1400 IF = 10 mA VCC = 15 V RL = 20 kΩ TA = 25°C tPLH tPHL 1200 0 IF = 10 mA VCC = 15 V CL = 100 pF TA = 25 °C TA – TEMPERATURE – °C Figure 8. Propagation delay with external 20 kΩ RL vs. temperature. 1400 -20 tP – PROPAGATION DELAY – ns 300 800 tP – PROPAGATION DELAY – ns tPLH tPHL 600 tP – PROPAGATION DELAY – ns tP – PROPAGATION DELAY – ns HCPL-4506 fig 11b HCPL-4506 fig 11a 500 tPLH tPHL 400 VCC = 15 V CL = 100 pF RL = 20 kΩ TA = 25°C 300 200 100 0 5 10 15 20 IF – FORWARD LED CURRENT – mA Figure 13. Propagation delay vs. input current. HCPL-4506 fig 17 PS (mW) IS (mA) FOR HCPL-4506 OPTION 060 IS (mA) FOR HCPL-J456 700 600 500 400 300 (230) 200 100 0 0 25 50 75 100 125 150 175 200 OUTPUT POWER – PS, INPUT CURRENT – IS OUTPUT POWER – PS, INPUT CURRENT – IS HCPL-4506 OPTION 060/HCPL-J456 800 HCPL-0466 OPTION 060/HCNW4506 1000 PS (mW) FOR HCNW4506 IS (mA) FOR HCNW4506 PS (mW) FOR HCPL-0466 OPTION 060 IS (mA) FOR HCPL-0466 OPTION 060 900 800 700 600 500 400 300 200 (150) 100 0 0 25 50 75 100 125 150 175 TS – CASE TEMPERATURE – °C TS – CASE TEMPERATURE – °C Figure 14. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2. HCPL-4504 fig 18b HCPL-4506 fig 18a 1 8 0.1 µF 20 kΩ +5 V 310 Ω 2 + – VCC = 15 V 7 3 1 20 kΩ 6 2 VOUT CMOS 3 100 pF 4 SHIELD 4 *100 pF TOTAL CAPACITANCE 2 CLEDP 7 CLED01 3 4 CLEDN SHIELD 310 Ω 6 1 5 7 6 CLEDN 5 SHIELD 8 0.1 µF 20 kΩ 2 7 3 6 4 5 CMOS Figure 17. Optocoupler input to output capaciHCPL-4506 fig 21-new tance model for shielded optocouplers. 17 +5 V 20 kΩ CLED02 20 kΩ Figure 16. Optocoupler input to output capacitance 20-new model forHCPL-4506 unshieldedfig optocouplers. HCPL-4506 fig 19-new 8 CLEDP 5 Figure 15. Recommended LED drive circuit. 1 8 20 kΩ + – VCC = 15 V VOUT 100 pF SHIELD *100 pF TOTAL CAPACITANCE HCPL-4506 fig 22-new Figure 18. LED drive circuit with resistor connected to LED anode (not recommended). 1 1 ITOTAL* 310 Ω 8 ICLEDP 2 3 IF 20 kΩ CLED02 CLEDP 7 CLEDN 4 + VR** – 100 pF 5 SHIELD CLED02 * THE ARROWS INDICATE THE DIRECTION OF CURRENT FLOW FOR +dVCM/dt TRANSIENTS. 3 CLEDN 4 6 5 * THE ARROWS INDICATE THE DIRECTION OF CURRENT FLOW FOR +dVCM/dt TRANSIENTS. ** OPTIONAL CLAMPING DIODE FOR IMPROVED CMH PERFORMANCE. VR < VF (OFF) DURING +dVCM/dt. + – – VCM VCM Figure 19. AC equivalent circuit for Figure 18 during common mode transients. HCPL-4506 fig 23-new HCPL-4506 fig 24-new Figure 20. AC equivalent circuit for Figure 15 during common mode transients. 1 2 1 8 +5 V 20 kΩ 2 3 6 5 CLED02 20 kΩ 7 CLEDN 6 VOUT 100 pF SHIELD 5 * THE ARROWS INDICATE THE DIRECTION OF CURRENT FLOW FOR +dVCM/dt TRANSIENTS. + – SHIELD CLEDP ICLEDN* 7 3 8 20 kΩ CLED01 Q1 4 4 VOUT 100 pF SHIELD + Q1 20 kΩ 7 ICLEDN* VOUT 6 CLEDP CLED01 310 Ω CLED01 ICLED01 2 20 kΩ 8 20 kΩ VCM Figure 21. Not recommended open collector LED drive circuit. HCPL-4506 fig 25-new 1 8 +5 V 20 kΩ 2 7 3 6 4 SHIELD Figure 23. Recommended LED drive circuit for ultra high CMR. HCPL-4506 fig 27 18 5 Figure 22. AC Equivalent circuit for Figure 21 during common mode transients. HCPL-4506 fig 26-new HCPL-4506 1 I +5 V LED1 310 Ω 8 20 kΩ 2 VCC1 0.1 µF 3 6 4 5 IPM 20 kΩ 7 +HV VOUT1 CMOS Q1 SHIELD Q2 HCPL-4506 1 I +5 V LED2 310 Ω M 8 20 kΩ 2 VCC2 0.1 µF 3 6 4 5 -HV HCPL-4506 20 kΩ 7 HCPL-4506 VOUT2 CMOS HCPL-4506 HCPL-4506 HCPL-4506 SHIELD Figure 24. Typical application circuit. HCPL-4506 fig 28 ILED1 VOUT1 VOUT2 ILED1 VOUT1 VOUT2 ILED2 Q1 ON Q2 OFF Q2 ON tPLH MIN. Q2 ON PDD* MAX. tPLH MAX. tPHL MIN. tPHL MAX. MAX. DEAD TIME tPLH MAX. tPHL MIN. PDD* MAX. = (tPLH-tPHL) MAX. = tPLH MAX. - tPHL MIN. *PDD = PROPAGATION DELAY DIFFERENCE NOTE: THE PROPAGATION DELAYS USED TO CALCULATE PDD ARE TAKEN AT EQUAL TEMPERATURES. HCPL-4506 fig 29 Figure 25. Minimum LED skew for zero dead time. 19 Q2 OFF Q1 OFF ILED2 Q1 OFF Q1 ON MAXIMUM DEAD TIME (DUE TO OPTOCOUPLER) = (tPLH MAX. - tPLH MIN.) + (tPHL MAX. - tPHL MIN.) = (tPLH MAX. - tPHL MIN.) - (tPLH MIN. - tPHL MAX.) = PDD* MAX. - PDD* MIN. *PDD = PROPAGATION DELAY DIFFERENCE NOTE: THE PROPAGATION DELAYS USED TO CALCULATE THE MAXIMUM DEAD TIME ARE TAKEN AT EQUAL TEMPERATURES. HCPL-4506 fig 30 Figure 26. Waveforms for dead time calculation. LED Drive Circuit Considerations for Ultra High CMR Performance Without a detector shield, the dominant cause of optocoupler CMR failure is capacitive coupl-ing from the input side of the optocoupler, through the package, to the detector IC as shown in Figure 16. The HCPL-4506 series improve CMR performance by using a detector IC with an optically transparent Faraday shield, which diverts the capacitively coupled current away from the sensitive IC circuitry. However, this shield does not eliminate the capacitive coupling between the LED and the optocoupler output pins and output ground as shown in Figure 17. This capacitive coupling causes perturbations in the LED current during common mode transients and becomes the major source of CMR failures for a shielded optocoupler. The main design objective of a high CMR LED drive circuit becomes keeping the LED in the proper state (on or off ) during common mode transients. For example, the recommended application circuit (Figure 15), can achieve 15 kV/µs CMR while minimizing component complexity. Note that a CMOS gate is recommended in Figure 15 to keep the LED off when the gate is in the high state. Another cause of CMR failure for a shielded optocoupler is direct coupling to the optocoupler output pins through CLEDO1 and CLEDO2 in Figure 17. Many factors influence the effect and magnitude of the direct coupling including: the use of an internal or external output pull-up resistor, the position of the LED current setting resistor, the connection of the unused input package pins, and the value of the capacitor at the optocoupler output (CL). Techniques to keep the LED in the proper state and minimize the effect of the direct coupling are discussed in the next two sections. CMR with the LED On (CMRL ) A high CMR LED drive circuit must keep the LED on during common mode transients. This is achieved by overdriving the LED current beyond the input threshold so that it is not pulled below the threshold during a transient. The recommended minimum LED current of 10 mA provides adequate margin over the maximum ITH of 5.0 mA (see Figure 1) to achieve 15 kV/µs CMR. Capacitive coupling is higher when the internal load resistor is used (due to CLEDO2) and an IF = 16 mA is required to obtain 10 kV/µs CMR. The placement of the LED current setting resistor effects the ability of the drive circuit to keep the LED on during transients and interacts with the direct coupling to the optocoupler output. For example, the LED resistor in Figure 18 is connected to the anode. Figure 19 shows the AC equivalent circuit for Figure 18 during common mode transients. During a +dVcm/dt in Figure 19, the current available at the LED anode (Itotal) is limited by the series resistor. The LED current (IF) is reduced from its DC value by an amount equal to the current that flows through 20 CLEDP and CLEDO1. The situation is made worse because the current through CLEDO1 has the effect of trying to pull the output high (toward a CMR failure) at the same time the LED current is being reduced. For this reason, the recommended LED drive circuit (Figure 15) places the current setting resistor in series with the LED cathode. Figure 20 is the AC equivalent circuit for Figure 15 during common mode transients. In this case, the LED current is not reduced during a +dVcm/dt transient because the current flowing through the package capacitance is supplied by the power supply. During a ‑dVcm/dt transient, however, the LED current is reduced by the amount of current flowing through CLEDN. But, better CMR performance is achieved since the current flowing in CLEDO1 during a negative transient acts to keep the output low. Coupling to the LED and output pins is also affected by the connection of pins 1 and 4. If CMR is limited by perturbations in the LED on current, as it is for the recommended drive circuit (Figure 15), pins 1 and 4 should be connected to the input circuit common. However, if CMR performance is limited by direct coupling to the output when the LED is off, pins 1 and 4 should be left unconnected. CMR with the LED Off (CMRH) A high CMR LED drive circuit must keep the LED off (VF ≤ VF(OFF)) during common mode transients. For example, during a +dVcm/dt transient in Figure 20, the current flowing through CLEDN is supplied by the parallel combination of the LED and series resistor. As long as the voltage developed across the resistor is less than VF(OFF) the LED will remain off and no common mode failure will occur. Even if the LED momentarily turns on, the 100 pF capacitor from pins 6-5 will keep the output from dipping below the threshold. The recommended LED drive circuit (Figure 15) provides about 10 V of margin between the lowest optocoupler output voltage and a 3 V IPM threshold during a 15 kV/µs transient with VCM = 1500 V. Additional margin can be obtained by adding a diode in parallel with the resistor, as shown by the dashed line connection in Figure 20, to clamp the voltage across the LED below VF(OFF). Since the open collector drive circuit, shown in Figure 21, cannot keep the LED off during a +dVcm/dt transient, it is not desirable for applications requiring ultra high CMRH performance. Figure 22 is the AC equivalent circuit for Figure 21 during common mode transients. Essentially all the current flowing through CLEDN during a +dVcm/dt transient must be supplied by the LED. CMRH failures can occur at dV/dt rates where the current through the LED and CLEDN exceeds the input threshold. Figure 23 is an alternative drive circuit which does achieve ultra high CMR performance by shunting the LED in the off state. IPM Dead Time and Propagation Delay Specifications The HCPL-4506 series include a Propagation Delay Difference specification intended to help designers minimize “dead time” in their power inverter designs. Dead time is the time period during which both the high and low side power transistors (Q1 and Q2 in Figure 24) are off. Any overlap in Q1 and Q2 conduction will result in large currents flowing through the power devices between the high and low voltage motor rails. To minimize dead time the designer must consider the propagation delay characteristics of the optocoupler as well as the characteristics of the IPM IGBT gate drive circuit. Considering only the delay characteristics of the optocoupler (the characteristics of the IPM IGBT gate drive circuit can be analyzed in the same way) it is important to know the minimum and maximum turn-on (tPHL) and turn-off (tPLH) propagation delay specifications, preferably over the desired operating temperature range. The limiting case of zero dead time occurs when the input to Q1 turns off at the same time that the input to Q2 turns on. This case determines the minimum delay between LED1 turn-off and LED2 turn-on, which is related to the worst case optocoupler propagation delay waveforms, as shown in Figure 25. A minimum dead time of zero is achieved in Figure 25 when the signal to turn on LED2 is delayed by (tPLH max - tPHL min) from the LED1 turn off. Note that the propagation For product information and a complete list of distributors, please go to our website: delays used to calculate PDD are taken at equal temperatures since the optocouplers under consideration are typically mounted in close proximity to each other. (Specifically, tPLH max and tPHL min in the previous equation are not the same as the tPLH max and tPHL min, over the full operating temperature range, specified in the data sheet.) This delay is the maximum value for the propaga tion delay difference specification which is specified at 450 ns for the HCPL-4506 series over an operating temperature range of ‑40°C to 100°C. Delaying the LED signal by the maximum propagation delay difference ensures that the minimum dead time is zero, but it does not tell a designer what the maximum dead time will be. The maximum dead time occurs in the highly unlikely case where one optocoupler with the fastest tPLH and another with the slowest tPHL are in the same inverter leg. The maximum dead time in this case becomes the sum of the spread in the tPLH and tPHL propagation delays as shown in Figure 26. The maximum dead time is also equivalent to the difference between the maximum and minimum propagation delay difference specifications. The maximum dead time (due to the optocouplers) for the HCPL-4506 series is 600 ns (= 450 ns - (-150 ns) ) over an operating temperature range of ‑40°C to 100°C. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0551EN AV02-1360EN - June 20, 2008