bq24010, bq24012
bq24013, bq24014, bq24018
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
Single-Chip, Li-Ion Charge Management IC for
Handheld Applications ( bqTINY™)
Check for Samples: bq24010, bq24012, bq24013, bq24014, bq24018
FEATURES
1
•
•
2
•
•
•
•
•
•
•
•
•
•
•
DESCRIPTION
Small 3-mm × 3-mm MLP (QFN) Package
Ideal for Low-Dropout Designs for Single-Cell
Li-Ion or Li-Pol Packs in Space Limited
Applications
Integrated Power FET and Current Sensor for
Up to 1-A Charge Applications
Reverse Leakage Protection Prevents Battery
Drainage
Integrated Current and Voltage Regulation
±0.5% Voltage Regulation Accuracy
Charge Termination by Minimum Current and
Time
Pre-Charge Conditioning With Safety Timer
Status Outputs for LED or System Interface
Indicates Charge and Fault Conditions
Battery Insertion and Removal Detection
Works With Regulated and Unregulated
Supplies
Short-Circuit Protection
Charge Voltage Options: 4.2 V and 4.36 V
The bqTINY™ series are highly integrated Li-Ion and
Li-Pol linear charge management devices targeted at
space limited portable applications. The bqTINY™
series offer integrated powerFET and current sensor,
reverse blocking protection, high accuracy current
and voltage regulation, charge status, and charge
termination, in a small package.
The bqTINY™ charges the battery in three phases:
conditioning, constant current, and constant voltage.
Charge is terminated based on minimum current. An
internal charge timer provides a backup safety feature
for charge termination. The bqTINY™ automatically
restarts the charge if the battery voltage falls below
an internal threshold. The bqTINY™ automatically
enters sleep mode when VCC supply is removed.
In addition to the standard features, different versions
of the bqTINY™ offer a multitude of additional
features. These include temperature sensing input for
detecting hot or cold battery packs; power good (PG)
output indicating the presence of valid input power; a
TTL-level charge-enable input (CE) used to disable or
enable the charge process; and a TTL-level timer and
termination enable (TTE) input used to disable or
enable the fast-charge timer and charge termination.
APPLICATIONS
•
•
•
•
•
Cellular Phones
PDAs
MP3 Players
Digital Cameras
Internet Appliances
bq24012DRC
AC ADAPTER
1
IN
OUT 10
2
VCC
BAT
3
STAT1
CE 8
4
STAT2
PG 7
5
VSS
PACK+
BATTERY
PACK
SYSTEM
+
9
PACK
SYSTEM
INTERFACE
SET
ISET 6
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
bqTINY is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2014, Texas Instruments Incorporated
bq24010, bq24012
bq24013, bq24014, bq24018
SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage range, (VCC all with respect to VSS)
IN, STAT1, STAT2, TS, PG, CE, TTE
Input voltage range (2)
V
V
–0.3 to 7
VDC
±0.5
V
Output sink/source current
STAT1, STAT2, PG
15
Output current
IN, OUT
1.5
TA
Operating free-air temperature range
TJ
Junction temperature range
Tstg
Storage temperature
(2)
UNIT
–0.3 to VCC
BAT, OUT, ISET
Voltage difference between VCC and IN inputs VCC – VIN
(1)
VALUE
–0.3 to 18
–40 to 125
°C
–65 to 150
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are DC and with respect to VSS.
DISSIPATION RATINGS
(1)
PACKAGE
θJA
TA < 40°C
POWER RATING
DERATING FACTOR
ABOVE TA = 40°C
DRC (1)
47°C/W
1.5 W
0.021 W/°C1
This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is
connected to the ground plane by a 2x3 via matrix.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
(1) (2)
VCC
Supply voltage
VIN
Input voltage (1)
TJ
Operating junction temperature range
(1)
(2)
(2)
NOM
MAX
UNIT
3
16.5
V
3
16.5
V
–40
125
°C
Pins VCC and IN must be tied together.
If Vin is between UVLO and 4.35V, and above the battery voltage, then the IC is active (can deliver some charge to the battery), but the
IC will have limited or degraded performance (some functions may not meet data sheet specifications). The battery may be
undercharged (VO(reg) less than in the specification), but will not be overcharged (VO(reg) will not exceed specification).
ELECTRICAL CHARACTERISTICS
over 0°C ≤ TJ ≤ 125°C and recommended supply voltage, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0
3.5
5
mA
5
μA
500
nA
INPUT CURRENT
ICC(VCC)
VCC current
VCC > VCC(min), STATx pins in OFF state
ICC(SLP)
Sleep current
Sum of currents into OUT and BAT pins, VCC < V(SLP)
IIB(BAT)
Input bias current on BAT pin
IIB(TS)
Input current on TS pin
IIB(CE)
Input current on CE pin
1
IIB(TTE)
Input bias current on TTE pin
1
VI(TS) ≤ 10 V
1
μA
VOLTAGE REGULATION VO(REG) + V(DO–MAX) ≤ VCC, I(TERM) < IO(OUT) ≤ 1 A
bq24010, bq24012, bq24013, bq24014
Output voltage, VO(REG)
2
4.2
bq24018
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V
4.36
Copyright © 2002–2014, Texas Instruments Incorporated
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
ELECTRICAL CHARACTERISTICS (continued)
over 0°C ≤ TJ ≤ 125°C and recommended supply voltage, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Voltage regulation accuracy
V(DO)
Dropout voltage (V(IN) – V(OUT))
MIN
TA = 25°C
TYP
–0.5%
–1%
VO(REG) + V(DO–MAX)) ≤ VCC, IO(OUT) = 1A
MAX
UNIT
0.5%
1%
650
790
mV
CURRENT REGULATION
IO(OUT)
(1)
VCC ≥ 4.5 V, VIN ≥ 4.5 V, VI(BAT) > V(LOWV),
VIN – VI(BAT) > V(DO–MAX)
Output current range
See note
V(SET)
Output current set voltage
K(SET)
Output current ISET factor
(2)
Voltage on ISET pin, VCC ≥ 4.5 V,
VIN ≥ 4.5 V, VI(BAT) > V(LOWV),
VIN – VI(BAT) > V(DO–MAX), VO(REG) = 4.2 V
100
1000
25
100
bq24010,
bq24012,
bq24013,
bq24014
2.45
bq24018
2.50
2.55
V
V
2.548
2.6
2.652
50 mA ≤ IO(OUT) ≤ 1000 mA, V(LOWV) < V(OUT) < V(RCH)
315
335
355
25 mA ≤ IO(OUT) < 50 mA, V(LOWV) < V(OUT) < V(RCH)
315
372
430
10 mA ≤ IO(OUT) < 100 mA, V(OUT) < V(LOWV)
350
2.5 mA ≤ IO(OUT) < 10 mA, V(OUT) < V(LOWV)
mA
1000
450
355 (3)
2.5 mA ≤ IO(OUT) < I(PGM), V(OUT) < V(RCH)
PRE-CHARGE AND SHORT-CIRCUIT CURRENT REGULATION
V(LOWV)
Pre-charge to fast-charge transition
threshold
Voltage on BAT pin
2.80
2.95
3.10
V
V(SC)
Pre-charge to short-charge transition
threshold
Voltage on BAT pin
1
1.4
1.8
V
IO(PRECHG)
(4)
Pre-charge range
V(SC) < VI(BAT) < V(LOWV), t < t(PRECHG)
100
mV
V(PRECHG)
Pre-charge set voltage
Voltage on ISET pin, V(SC) < VI(BAT) < V(LOWV)
225
250
280
mV
ISC
Short circuit current
V(SC) > VI(BAT)
660
900
1200
μA
IO(OUT) =
(1)
(2)
(3)
10
(K(SET) x V(SET) )
R(SET)
Specified by design. Not production tested.
The ISET pin may be used as a current monitor during voltage regulation by applying the following equation:
æ V(ISET)
ö
IO(OUT) = K(ISET) x ç
+ 10 mA ÷
ç R(ISET)
÷
è
ø
This equation is also used for calculating the termination point.
IO(PRECHG) =
(4)
(K(SET) x V(PRECHG) )
R(SET)
Copyright © 2002–2014, Texas Instruments Incorporated
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
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ELECTRICAL CHARACTERISTICS (Continued)
over 0°C ≤ TJ ≤ 125°C and recommended supply voltage, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
100
mA
CHARGE TAPER AND TERMINATION DETECTION
I(TAPER)
(1)
Charge taper detection range
VI(BAT) > V(RCH), t < t(TAPER)
V(TAPER)
Charge taper detection set voltage
Voltage on ISET pin, VI(BAT) > V(RCH), t < t(TAPER),
VI(BAT) = VO(REG)
10
V(TERM)
Charge termination detection set
voltage
Voltage on ISET pin, VI(BAT) = VO(REG),
VI(BAT) >V(RCH),I(TERM) = K(SET) × V(TERM) /R(SET)
225
250
275
mV
5
17.5
50
mV
TEMPERATURE COMPARATOR
V(TS1)
Lower threshold
Voltage on TS pin
29
30
31
V(TS2)
Upper threshold
Voltage on TS pin
60
61
62
Hysteresis
%VCC
1
BATTERY RECHARGE THRESHOLD
V(RCH)
VO(REG)
–0.135
Recharge threshold
VO(REG)
–0.1
VO(REG)
–0.075
V
0.5
V
STAT1, STAT2, AND PG OUTPUTS
VOL
Output (low) saturation voltage
IO = 10 mA
CHARGE ENABLE (CE) AND TIMER AND TERMINATION ENABLE (TTE) INPUTS
VIL
Low-level input voltage
IIL = 1 μA
0
VIH
High-level input voltage
IIL = 1 μA
2.0
0.8
V
TIMERS
t{PRECHG)
Pre-charge time
1 548
2,065
t(TAPER)
Taper time
1 548
2,065
2,581
2,581
t(CHG)
Charge time
15 480
20,650
25,810
s
SLEEP COMPARATOR
VSLP
VCC ≤
VI(BAT)
+30 mV
Sleep mode entry threshold voltage
VPOR ≤ V(IBAT) ≤ VO(REG)
Sleep mode exit threshold voltage
VPOR ≤ V(IBAT) ≤ VO(REG)
Sleep mode deglitch time
VCC decreasing below threshold, 100-ns fall time, 10-mV
overdrive
250
VCC ≥
VI(BAT)
+22 mV
V
650
ms
BATTERY DETECTION THRESHOLDS
I(DETECT)
Battery detection current
2 V ≤ V(IBAT) ≤ V(RCH)
–3.1
–4.6
–6.1
mA
I(DETECT)
battery detection time
2 V ≤ V(IBAT) ≤ V(RCH)
100
125
150
ms
I(FAULT)
Fault current
V(IBAT) < V(RCH) and/or t > t(PRECHG)
660
900
1200
μA
225
2.5
2.75
V
POWER-ON RESET AND INPUT VOLTAGE RAMP RATE
VPOR
(2)
Power-on reset threshold voltage
IO(TAPER) =
(1)
(2)
4
(K(SET) x V(TAPER) )
R(SET)
Specified by design. Not production tested.
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bq24010, bq24012
bq24013, bq24014, bq24018
www.ti.com
SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
DEVICE INFORMATION
DRC PACKAGE
(TOP VIEW)
VSS STAT2 STAT1 VCC
5
4
3
IN
2
1
DRC PACKAGE
(TOP VIEW)
VSS STAT2 STAT1 VCC
5
bq24010DRC
4
3
2
7
8
9
10
6
7
8
9
ISET
PG
TS
BAT
OUT
ISET
PG
CE
BAT
VSS STAT2 STAT1 VCC
3
10
OUT
DRC PACKAGE
(TOP VIEW)
DRC PACKAGE
(TOP VIEW)
4
1
bq24012DRC
6
5
IN
IN
2
1
VSS STAT2 STAT1 VCC
5
bq24013DRC
and
bq24018DRC
4
3
2
IN
1
bq24014DRC
6
7
8
9
10
6
7
8
9
10
ISET
CE
TTE
BAT
OUT
ISET
CE
TS
BAT
OUT
Copyright © 2002–2014, Texas Instruments Incorporated
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5
bq24010, bq24012
bq24013, bq24014, bq24018
SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
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Table 1. TERMINAL FUNCTIONS
TERMINAL
bq24010
bq24012
bq24013
and
bq24018
bq24014
BAT
9
9
9
9
I
Battery voltage sense input
CE
–
8
7
7
I
Charge enable input (active low)
IN
1
1
1
1
I
Charge input voltage. This input must be tied to the VCC pin.
ISET
6
6
6
6
O
Charge current set point
OUT
10
10
10
10
O
Charge current output
PG
7
7
–
–
O
Power good status output (open collector)
STAT1
3
3
3
3
O
Charge status output 1 (open collector)
STAT2
4
4
4
4
O
Charge status output 2 (open collector)
TTE
–
–
8
–
I
Timer and termination enable input (active low)
TS
8
–
–
8
I
Temperature sense input
VCC
2
2
2
2
I
VCC supply input
VSS
5
5
5
5
–
Ground input
–
There is an internal electrical connection between the exposed
thermal pad and VSS pin of the device. The exposed thermal pad
must be connected to the same potential as the Vss pin on the
printed circuit board. Do not use the thermal pad as the primary
ground input for the device. VSS pin must be connected to ground
at all times.
NAME
Exposed
Thermal
PAD
6
Pad
Pad
Pad
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Pad
I/O
DESCRIPTION
Copyright © 2002–2014, Texas Instruments Incorporated
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
FUNCTIONAL BLOCK DIAGRAM
IN
OUT
VCC
VCC
+
VI(BAT)
VO(REG)
ISET
CHG ENABLE
VCC
REFERENCE
AND BIAS
VCC
V(ISET)
VSET
VO(REG)
I(DETECT)
ENABLE
+
I(FAULT)
ENABLE
CHG ENABLE
VI(BAT)
V(SLP)
DEGLITCH
I(FAULT) ENABLE
CE
I(DETECT) ENABLE
TS
CHG ENABLE
THERMAL
SHUTDOWN
VSS
VI(BAT)
CHARGE
CONTROL,
TIMER,
AND
DISPLAY
LOGIC
TTE
VO(REG)
VI(BAT)
DEGLITCH
V(RCH)
VI(BAT)
BAT
PG
PG
RECHARGE
PRECHARGE
STAT1
VSET
V(PRECHG)
V(TAPER)
VI(SET)
DEGLITCH
VI(SET)
DEGLITCH
V(TERM)
TAPER
STAT2
TERM
Dotted lines represent optional features
TYPICAL CHARACTERISTICS
Copyright © 2002–2014, Texas Instruments Incorporated
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
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FUNCTIONAL DESCRIPTION
The bqTINY™ supports a precision Li-Ion, Li-Pol charging system suitable for single-cells. Figure 2 shows a
typical charge profile, application circuit, and Figure 5 shows an operational flow chart.
BATTERY
PACK
bq24010DRC
DC +
1 IN
2 VCC
0.47 mF
PACK+
OUT 10
+
VCC
PACK
BAT 9
0.1 mF
CHARGE
DONE
RT1
3 STAT1
TS 8
4 STAT2
PG 7
5 VSS
RT2
ISET 6
RSET
DCPOWERGOOD
Figure 3. Typical Application Circuit
USB PORT
D+
Dbq24013DRC
bq24018DRC
1
VBUS
IN
OUT 10
2 VCC
BAT 9
3 STAT1
TTE 8
4 STAT2
CE 7
PACK+
BATTERY
PACK
+
GND
PACK-
SYSTEM
and
USB
CONTROLLER
0.47 mF
0.1 mF
2.26 kW
5 VSS
SI1032x
ISET 6
100 mA / 500 mA
9.09 kW
Figure 4. USB Charger Circuit
8
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
POR
SLEEP MODE
VCC > VI(BAT)
checked at
all times
No
Indicate SLEEP
MODE
Yes
Regulate
IO(PRECHG)
VI(BAT) < V(LOWV)
Reset and Start
t(PRECHG) timer
Yes
Indicate
Charge-in-Progress
No
Reset all timers
start t(CHG)
timers
Regulate Current
or Voltage
Indicate
Charge-in-Progress
No
VI(BAT) < V(LOWV)
Suspend charge
TJ < t(SHTDWN)
Yes
No
Indicate
Charge Suspend
Yes
t(PRECHG)
expired?
Yes
No
TJ < t(SHTDWN)
t(CHG)
expired?
No
Yes
No
Yes
Fault Condition
Yes
VI(BAT) < V(LOWV)
Indicate Fault
No
I(TERM)
detection
?
VI(BAT) > V(RCH)
?
No
No
Yes
No
t(TAPER)
expired?
I(TAPER)
detection
?
Enable
I(FAULT)
current?
Yes
No
No
Yes
Yes
VI(BAT) > V(RCH)
?
Turn off charge
Yes
Indicate DONE
No
Disable
I(FAULT)
current?
VI(BAT) < V(RCH)
?
Yes
Enter Battery
Absent
Detection
Figure 5. Operational Flow Chart
Copyright © 2002–2014, Texas Instruments Incorporated
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
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TEMPERATURE QUALIFICATION
NOTE
The temperature qualifications apply only to versions with temperature sense input (TS)
pin option (bq24020 and bq24014).
Versions of the bqTINY with the TS pin option, continuously monitor battery temperature by measuring the
voltage between the TS and VSS pins. A negative temperature coefficient thermistor (NTC) and an external
voltage divider typically develops this voltage (see Figure 3). The bqTINY compare this voltage against the
internal V(TS1) and V(TS2) thresholds to determine if charging is allowed (see Figure 6). The temperature sensing
circuit is immune to any fluctuation in VCC since both the external voltage divider and the internal thresholds are
ratiometric to VCC.
Once a temperature outside the V(TS1) and V(TS2) thresholds is detected the bqTINY immediately suspend the
charge. The bqTINY suspends charge by turning off the power FET and holding the timer value (i.e. timers are
NOT reset). Charge resumes when the temperature returns to the typical range.
VCC
Charge Suspend
V(TS2)
Normal Temperature Range
V(TS1)
Charge Suspend
VSS
Figure 6. TS Pin Thresholds
The resistor values of RT1 and RT2 are calculated by Equation 1 and Equation 2 (for NTC Thermistors).
RT1 =
RT2 =
(5 x RTH x RTC )
(3 x (RTC - RTH ))
(1)
(5 x RTH x RTC )
(2 x RTC ) - (7 x RTH )
(2)
Where RTC is the cold temperature resistance and RTH is the hot temperature resistance of thermistor, as
specified by the thermistor manufacturer.
RT1 or RT2 can be omitted If only one temperature (hot or cold) setting is required. Applying a constant voltage
between the VTS1 and VTS2 thresholds to pin TS disables the temperature-sensing feature.
10
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
BATTERY PRE-CONDITIONING
During a charge cycle, if the battery voltage is below the V(LOWV) threshold, the bqTINY applies a pre-charge
current, IO(PRECHG), to the battery. This feature revives deeply discharged cells. The resistor connected between
the ISET and VSS, RSET, determines the pre-charge rate. The V(PRECHG) and K(SET) parameters are specified in
the specifications table.
IO(PRECHG) =
(V(PRECHG) x K(SET) )
R(SET)
(3)
The bqTINY activates a safety timer, t(PRECHG), during the conditioning phase. If V(LOWV) threshold is not reached
within the timer period, the bqTINY turns off the charger and enunciates FAULT on the STAT1 and STAT2 pins.
Refer to Timer Fault Recovery section for additional details.
BATTERY CHARGE CURRENT
The bqTINY offers on-chip current regulation with programmable set point. The resistor connected between the
ISET and VSS, RSET, determines the charge rate. The V(SET) and K(SET) parameters are specified in the
specifications table.
IO(OUT) =
(K(SET) x V(SET) )
R(SET)
(4)
BATTERY VOLTAGE REGULATION
Voltage regulation feedback is accomplished through the BAT pin. This input is tied directly and close to the
positive side of the battery pack. The bqTINY monitors the battery-pack voltage between the BAT and VSS pins.
When the battery voltage rises to VO(REG) threshold, the voltage regulation phase begins and the charging current
begins to taper down.
As a safety backup, the bqTINY also monitors the charge time in the charge mode. If termination does not occur
within this time period, t(CHG), the bqTINY turns off the charger and enunciates FAULT on the STAT1 and STAT1
pins. Refer to the Timer Fault Recovery section for additional details.
CHARGE TAPER DETECTION, TERMINATION AND RECHARGE
The bqTINY monitors the charging current during the voltage regulation phase. Once the taper threshold, I(TAPER),
is detected the bqTINY initiates the taper timer, t(TAPER). Charge terminates after the timer expires. The resistor
connected between the ISET and VSS, RSET, determines the taper detection level. The V(TAPER) and K(SET)
parameters are specified in the specifications table.
I(TAPER) =
(V(TAPER) x K(SET) )
R(SET)
(5)
The bqTINY resets the taper timer in the event that the charge current returns above the taper threshold, I(TAPER).
In addition to the taper current detection, the bqTINY terminates charge in the event that the charge current falls
below the I(TERM) threshold. This feature allows for quick recognition of a battery removal condition or insertion of
a fully charged battery. Note that taper timer is not used for I(TERM) detection. The resistor connected between the
ISET and VSS, RSET, determines the taper detection level. The V(TERM) and K(SET) parameters are specified in the
specifications table.
I(TERM) =
(V(TERM) x K(SET) )
R(SET)
Copyright © 2002–2014, Texas Instruments Incorporated
(6)
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After charge termination, the bqTINY restarts the charge once the voltage on the BAT pin falls below the V(RCH)
threshold. This feature keeps the battery at full capacity at all times. See the Battery Absent Detection section for
additional details.
SLEEP MODE
The bqTINY enters the low-power sleep mode if the VCC is removed from the circuit (PG pin is high impedance).
This feature prevents draining the battery during the absence of VCC. The status pins do not function when in
sleep mode or when VCC < VPOR and default to the OFF state.
CHARGE STATUS OUTPUTS
The open-collector STAT1 and STAT2 outputs indicate various charger operations as shown in the following
table. These status pins can be used to drive LEDs or communicate to the host processor. Note that OFF
indicates the open-collector transistor is turned off. When VCC < VPOR or VCC < VBAT (Sleep Mode – PG OFF) the
STAT pins default to their OFF state. Note that this STAT1 or STAT2 OFF/OFF state is shared by several
operating conditions. Decode the actual fault condition by monitoring IN, BAT, PG, and TS.
Table 2. Status Pins Summary
CHARGE STATE
Charge-in-progress
Charge done
Battery absent
Charge suspend (temperature)
Timer fault
Sleep mode
(1)
STAT1
STAT2
ON
OFF
OFF (1)
ON
OFF
OFF
OFF means the open-collector output transistor on the STAT1 or
STAT2 pins is in an off state.
PG OUTPUT
The open-collector PG (power good) indicates when the AC adapter (i.e., VCC) is present. The PG bipolar
transistor turns ON when a valid VCC is detected. This output is turned off in the sleep mode. The PG pin can be
used to drive an LED or communicate to the host processor.
CE INPUT (CHARGE ENABLE)
The CE digital input is used to disable or enable the charge process. A low-level signal on this pin enables the
charge and a high-level signal disables the charge. A high-to-low transition on this pin also resets all timers and
fault conditions and starts a new charge cycle.
TTE INPUT (TIMER AND TERMINATION ENABLE)
The TTE digital input is used to disable or enable the fast-charge timer and charge termination. A low-level signal
on this pin enables the fast-charge timer and termination and a high-level signal disables this feature. A high-tolow transition on this pin also resets all timers.
THERMAL SHUTDOWN AND PROTECTION
The bqTINY monitors the junction temperature, TJ, of the die and suspends charging if TJ exceeds 155°C.
Charging resumes when TJ falls below approximately 130°C.
12
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SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
BATTERY ABSENT DETECTION
For applications with removable battery packs, bqTINY provides a battery absent detection scheme to reliably
detect insertion or removal of battery packs, or both.
The voltage at the BAT pin is held above the battery recharge threshold, V(RCH), by the charged battery following
fast charging. When the voltage at the BAT pin falls to the recharge threshold, either by a load on the battery or
due to battery removal, the bqTINY begins a battery absent detection test. This test involves enabling a detection
current, I(DETECT), for a period of t(DETECT) and checking to see if the battery voltage is below the pre-charge
threshold, V(LOWV). Following this, the pre-charge current, IO(PRECHG) is applied for a period of t(DETECT) and the
battery voltage checked again to be above the recharge threshold. The purpose is to attempt to close a battery
pack with an open protector, if one is connected to the bqTINY. Passing both of the discharge and charging tests
indicates a battery absent fault at the STAT pins. Failure of either test starts a new charge cycle. For the absent
battery condition the voltage on the BAT pin rises and falls between the V(LOWV) and VO(REG) thresholds
indefinitely. See Figure 7.
Charge Done
or
Timer Fault
No
VI(BAT) <
V(RCH)
Yes
Enable
I(DETECT) for
t(DETECT)
VI(BAT) <
V(LOWV)
No
BATTERY
PRESENT
Begin Charge
No
BATTERY
PRESENT
Begin
Charge
Yes
Apply
IO(PRECHG) for
t(DETECT)
VI(BAT) >
V(RCH)
Yes
BATTERY
ABSENT
Figure 7. Battery Absent Detection
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TIMER FAULT RECOVERY
As shown in Figure 5, bqTINY provides a recovery method to deal with timer fault conditions. The following
conditions summarize this method.
Condition 1: Charge voltage above recharge threshold (V(RCH)) and timeout fault occurs
Recovery method: bqTINY waits for the battery voltage to fall below the recharge threshold. This could happen
as a result of a load on the battery, self-discharge, or battery removal. Once the battery falls below the recharge
threshold, the bqTINY clears the fault and enters the battery absent detection routine. A POR or CE toggle also
clears the fault.
Condition 2: Charge voltage below recharge threshold (V(RCH)) and timeout fault occurs.
Recovery method: Under this scenario, the bqTINY applies the I(FAULT) current. This small current is used to
detect a battery removal condition and remains on as long as the battery voltage stays below the recharge
threshold. If the battery voltage goes above the recharge threshold, then the bqTINY disables the I(FAULT) current
and executes the recovery method described for condition #1. Once the battery falls below the recharge
threshold, the bqTINY clears the fault and enters the battery absent detection routine. A POR or CE toggle also
clears the fault.
14
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www.ti.com
SLUS530K – SEPTEMBER 2002 – REVISED JANUARY 2014
APPLICATION INFORMATION
SELECTING INPUT CAPACITOR
In most applications, all that is needed is a high-frequency decoupling capacitor. A 0.47-μF ceramic, placed in
close proximity to VCC and VSS pins, works well. The bqTINY is designed to work with both regulated and
unregulated external DC supplies. If a non-regulated supply is chosen, the supply unit should have enough
capacitance to hold up the supply voltage to the minimum required input voltage at maximum load. If not, more
capacitance has to be added to the input of the charger.
SELECTING OUTPUT CAPACITOR
The bqTINY requires only a small output capacitor for loop stability. A 0.1-μF ceramic capacitor placed between
the BAT and ISET pins is typically sufficient for embedded applications (for example non-removable battery
packs). For application with removable battery packs a 1-μF ceramic capacitor ensure proper operation of the
battery detection circuitry. Note that the output capacitor can also be placed between BAT and VSS pins.
THERMAL CONSIDERATIONS
The bqTINY is packaged in a thermally enhanced MLP (also referred to as QFN) package. The package includes
a thermal pad to provide an effective thermal contact between the device and the printed circuit board (PCB).
Full PCB design guidelines for this package are provided in the application note entitled, QFN/SON PCB
Attachment application note (SLUA271).
The most common measure of package thermal performance is thermal impedance (θJA) measured (or modeled)
from the device junction to the air surrounding the package surface (ambient). The mathematical expression for
θJA is:
T x TA
qJA = J
P
(7)
Where:
TJ = device junction temperature
TA = ambient temperature
P = device power dissipation
Factors that can greatly influence the measurement and calculation of θJA include:
• Whether or not the device is board mounted
• Trace size, composition, thickness, and geometry
• Orientation of the device (horizontal or vertical)
• Volume of the ambient air surrounding the device under test and airflown
• Whether other surfaces are in close proximity to the device being tested
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation:
(
)
P = VIN - VI(BAT) x IO(OUT)
(8)
Due to the charge profile of Li-xx batteries, the maximum power dissipation is typically seen at the beginning of
the charge cycle when the battery voltage is at its lowest. See Figure 2.
Copyright © 2002–2014, Texas Instruments Incorporated
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PCB LAYOUT CONSIDERATIONS
It is important to pay special attention to the PCB layout. The following list provides some guidelines:
• To obtain optimal performance, the decoupling capacitor from VCC to VSS and the output filter capacitors from
BAT to ISET should be placed as close as possible to the bqTINY, with short trace runs to both signal and
VSS pins.
• All low-current VSS connections should be kept separate from the high-current charge or discharge paths from
the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
• The BAT pin is the voltage feedback to the device and should be connected with its trace as close to the
battery pack as possible.
• The high current charge paths into IN and from the OUT pins must be sized appropriately for the maximum
charge current in order to avoid voltage drops in these traces.
• The bqTINY is packaged in a thermally enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the device and the printed circuit board (PCB). Full PCB design
guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment
Application Note (SLUA271).
• There is an internal electrical connection between the exposed thermal pad and VSS pin of the device. The
exposed thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do
not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at
all times.
REVISION HISTORY
Changes from Revision J (December 2008) to Revision K
•
16
Page
Updated IO(OUT) equation ....................................................................................................................................................... 3
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ24010DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZN
BQ24010DRCRG4
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZN
BQ24012DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZP
BQ24012DRCRG4
ACTIVE
VSON
DRC
10
TBD
Call TI
Call TI
-40 to 85
BQ24013DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZQ
BQ24013DRCRG4
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZQ
BQ24014DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZR
BQ24014DRCRG4
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AZR
BQ24018DRCR
ACTIVE
VSON
DRC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BZH
BQ24018DRCT
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BZH
BQ24018DRCTG4
ACTIVE
VSON
DRC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
BZH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
7-Nov-2014
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ24010DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24010DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24012DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24012DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24013DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24013DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24014DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24014DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24018DRCR
VSON
DRC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
BQ24018DRCT
VSON
DRC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ24010DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
BQ24010DRCR
VSON
DRC
10
3000
338.0
355.0
50.0
BQ24012DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
BQ24012DRCR
VSON
DRC
10
3000
338.0
355.0
50.0
BQ24013DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
BQ24013DRCR
VSON
DRC
10
3000
338.0
355.0
50.0
BQ24014DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
BQ24014DRCR
VSON
DRC
10
3000
338.0
355.0
50.0
BQ24018DRCR
VSON
DRC
10
3000
367.0
367.0
35.0
BQ24018DRCT
VSON
DRC
10
250
210.0
185.0
35.0
Pack Materials-Page 2
www.ti.com
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