ON NL27WZ126 Dual buffer with 3−state output Datasheet

NL27WZ126
Dual Buffer with 3−State
Outputs
The NL27WZ126 is a high performance dual noninverting buffer
operating from a 1.65 V to 5.5 V supply.
Features
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Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
3−State OE Input is Active−High
Replacement for NC7WZ126
Chip Complexity = 72 FETs
Pb−Free Package is Available
OE1
A1
Y2
GND
8
1
7
2
6
3
5
4
MARKING
DIAGRAM
8
US8
US SUFFIX
CASE 493
8
1
M2 M G
G
1
M2
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
PIN ASSIGNMENT
VCC
OE2
Y1
A2
Pin
Function
1
OE
2
A1
3
Y2
4
GND
5
A2
6
Y1
7
OE2
8
VCC
Figure 1. Pinout (Top View)
FUNCTION TABLE
Input
A1
OE1
1
EN
A2
OE2
Y1
Y2
Figure 2. Logic Symbol
Output
OEn
An
Yn
H
H
H
H
L
L
L
X
Z
X = Don’t Care
n = 1, 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 6
1
Publication Order Number:
NL27WZ126/D
NL27WZ126
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
IIK
DC Input Diode Current
VI < GND
*50
mA
IOK
DC Output Diode Current
VO < GND
*50
mA
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
qJA
260
°C
)150
°C
Thermal Resistance (Note 1)
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Min
Max
Unit
1.65
1.5
5.5
5.5
V
(Note 5)
0
5.5
V
(HIGH or LOW State)
0
5.5
V
*40
)85
°C
0
0
0
20
10
5
ns/V
Operating
Data Retention Only
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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2
NL27WZ126
DC ELECTRICAL CHARACTERISTICS
VCC
Symbol
Parameter
Condition
(V)
Min
0.7 VCC
VIH
High−Level Input Voltage
1.65 to 5.5
VIL
Low−Level Input Voltage
1.65 to 5.5
VOH
High−Level Output Voltage
VIN = VIH
IOH = 100 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.7
3.0
3.0
4.5
VOL
Low−Level Output Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.7
3.0
3.0
4.5
Input Leakage Current
VIN = VCC or GND
IOFF
Power Off−Output
Leakage Current
VOUT = 5.5 V
ICC
Quiescent Supply Current
VIN = VCC or GND
IOZ
3−State Output Leakage
VIN = VIL or VIH
0 V v VOUT v 5.5 V
IIN
*405C v TA v 855C
TA = 255C
Typ
Max
Min
0.7 VCC
0.3 VCC
VCC − 0.1
1.9
2.2
2.4
2.3
3.8
Max
VCC
2.1
2.4
2.7
2.5
4.0
Unit
V
0.3 VCC
VCC − 0.1
1.9
2.2
2.4
2.3
3.8
V
V
0.1
0.3
0.4
0.4
0.55
0.55
0.1
0.3
0.4
0.4
0.55
0.55
V
0 to 5.5
$0.1
$1.0
mA
0
1
10
mA
5.5
1
10
mA
1.65 to 5.5
$0.5
$5
mA
0.20
0.22
0.28
0.38
0.42
AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns)
VCC
Symbol
tPLH
tPHL
Parameter
Propagation Delay
AN to YN
(Figures 3 and 4,
Table 1)
Condition
*405C v TA v 855C
TA = 255C
(V)
Min
Typ
Max
Min
Max
Unit
ns
RL = 1 MW
CL = 15 pF
1.8 $ 0.15
2.5 $ 0.2
2.0
1.0
12
7.5
2.0
1.0
13
8
RL = 1 MW
CL = 15 pF
3.3 $ 0.3
0.8
5.2
0.8
5.5
RL = 500 W
CL = 50 pF
1.2
5.7
1.2
6.0
RL = 1 MW
CL = 15 pF
0.5
4.5
0.5
4.8
RL = 500 W
CL = 50 pF
0.8
5.0
0.8
5.3
5.0 $ 0.5
tOSLH
tOSHL
Output to Output Skew
(Note 6)
RL = 500 W
CL = 50 pF
3.3 $ 0.3
1.0
1.0
RL = 500 W
CL = 50 pF
5.0 $ 0.5
0.8
0.8
tPZH
tPZL
Output Enable Time
(Figures 5, 6 and 7,
Table 1)
RL = 250 W
CL = 50 pF
1.8 $ 0.15
2.5 $ 0.2
3.0
1.8
14
8.5
3.0
1.8
15
9.0
3.3 $ 0.3
1.2
6.2
1.2
6.5
5.0 $ 0.5
0.8
5.5
0.8
5.8
1.8 $ 0.15
2.5 $ 0.2
2.5
1.5
12
8.0
2.5
1.5
13
8.5
3.3 $ 0.3
0.8
5.7
0.8
6.0
5.0 $ 0.5
0.3
4.7
0.3
5.0
tPHZ
tPLZ
Output Enable Time
(Figures 5, 6 and 7,
Table 1)
RL and R1= 500 W CL = 50 pF
ns
ns
ns
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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3
NL27WZ126
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Unit
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 7)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
9
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
11
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
Vmi
OE = GND
VCC
90%
INPUT
Vmi
10%
10%
tPHL
OUTPUT
CL *
GND
RL
tPLH
VOH
OUTPUT Y
Vmo
Vmo
*Includes all probe and jig capacitance.
A 1 MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. tPLH or tPHL
2.7 V
Vmi
Vmi
OE
0V
tPZH
tPHZ
VOH − 0.3 V
Vmo
On
VCC
≈0V
tPZL
tPLZ
≈ 3.0 V
On
Vmo
VOL + 0.3 V
GND
Figure 5. AC Output Enable and Disable Waveform
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4
NL27WZ126
Table 1. Output Enable and Disable Times
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 nsv
VCC
Symbol
3.3 V $ 0.3 V
2.7 V
2.5 V $ 0.2 V
Vmi
1.5 V
1.5 V
VCC/2
Vmo
1.5 V
1.5 V
VCC/2
2
VCC
INPUT
INPUT
R1 = 500 W
VCC
OUTPUT
OUTPUT
RL = 500 W
CL = 50 pF
CL = 50 pF
RL = 250 W
A 1 MHz square input wave is recommended for
propagation delay tests.
A 1 MHz square input wave is recommended for
propagation delay tests.
Figure 6. tPZL or tPLZ
Figure 7. tPZH or tPHZ
DEVICE ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
No. of
Gates per
Package
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Package
Type
Tape and
Reel Size†
NL27WZ126US
NL
2
7
WZ
126
US
US8
178 mm, 3000 Units
NL27WZ126USG
NL
2
7
WZ
126
USG
US8
(Pb−Free)
178 mm, 3000 Units
Device Order
Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NL27WZ126
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
A
8
−Y−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
J
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
D
0.10 (0.004)
M
H
0.10 (0.004) T
K
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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6
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NL27WZ126/D
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