CY7C1041 256K x 16 Static RAM Features written into the location specified on the address pins (A0 through A17). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O 8 through I/O15) is written into the location specified on the address pins (A0 through A17). • High speed — tAA = 15 ns • Low active power — 1430 mW (max.) • Low CMOS standby power (L version) — 2.75 mW (max.) • 2.0V Data Retention (400 µW at 2.0V retention) • Automatic power-down when deselected • TTL-compatible inputs and outputs • Easy memory expansion with CE and OE features Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O0 to I/O 7. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O 8 to I/O15. See the truth table at the back of this data sheet for a complete description of read and write modes. Functional Description The CY7C1041 is a high-performance CMOS static RAM organized as 262,144 words by 16 bits. Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O 7), is The input/output pins (I/O 0 through I/O15) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1041 is available in a standard 44-pin 400-mil-wide body width SOJ and 44-pin TSOP II package with center power and ground (revolutionary) pinout. Logic Block Diagram Pin Configuration SOJ TSOP II Top View 256K x 16 ARRAY 1024 x 4096 SENSE AMPS A0 A1 A2 A3 A4 A5 A6 A7 A8 ROW DECODER INPUT BUFFER A0 A1 A2 A3 A4 CE I/O0 I/O1 I/O2 I/O3 VCC VSS I/O4 I/O5 I/O6 I/O7 WE A5 A6 A7 A8 A9 I/O0 – I/O7 I/O8 – I/O15 A9 A10 A 11 A 12 A 13 A14 A15 A16 A17 COLUMN DECODER BHE WE CE OE BLE 1041–1 1 44 2 3 43 42 4 41 40 39 38 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A17 A16 A15 OE BHE BLE I/O15 I/O14 I/O13 I/O12 VSS VCC I/O11 I/O10 I/O9 I/O8 NC A14 A13 A12 A11 A10 1041–2 Selection Guide 7C1041-12 7C1041-15 7C1041-17 7C1041-20 7C1041-25 Maximum Access Time (ns) 12 15 17 20 25 Maximum Operating Current (mA) 280 260 250 230 220 3 3 3 3 3 0.5 0.5 0.5 0.5 0.5 6 6 6 6 6 Maximum CMOS Standby Current Com’l (mA) Com’l L Ind’l Shaded areas contain preliminary information. Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 October 4, 1999 CY7C1041 DC Input Voltage[1] ................................ –0.5V to VCC + 0.5V Maximum Ratings Current into Outputs (LOW)......................................... 20 mA (Above which the useful life may be impaired. For user guidelines, not tested.) Operating Range Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied ............................................. –55°C to +125°C Range Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V Commercial Industrial DC Voltage Applied to Outputs in High Z State[1] ....................................–0.5V to VCC + 0.5V Ambient Temperature[2] VCC 0°C to +70°C 5V ± 0.5 –40°C to +85°C Electrical Characteristics Over the Operating Range 7C1041-12 Parameter Description Test Conditions Min. VCC = Min., IOH = –4.0 mA VCC = Min., IOL = 8.0 mA Max. 2.4 7C1041-15 Min. Max. VOH Output HIGH Voltage 2.4 VOL Output LOW Voltage VIH Input HIGH Voltage 2.2 VCC + 0.5 2.2 VCC + 0.5 VIL Input LOW Voltage[1] –0.5 0.8 –0.5 0.4 7C1041-17 Min. Max. 2.4 0.4 Unit V 0.4 V 2.2 VCC + 0.5 V 0.8 –0.5 0.8 V IIX Input Load Current GND < VI < VCC –1 +1 –1 +1 –1 +1 µA IOZ Output Leakage Current GND < VOUT < VCC, Output Disabled –1 +1 –1 +1 –1 +1 µA ICC VCC Operating Supply Current VCC = Max., f = fMAX = 1/tRC 280 260 250 mA ISB1 Automatic CE Power-Down Current —TTL Inputs Max. V CC, CE > VIH VIN > V IH or VIN < V IL, f = fMAX 40 40 40 mA ISB2 Automatic CE Power-Down Current —CMOS Inputs Max. V CC, CE > V CC – 0.3V, VIN > V CC – 0.3V, or V IN < 0.3V, f = 0 Com’l Com’l Ind’l Shaded areas contain preliminary information. Notes: 1. VIL (min.) = –2.0V for pulse durations of less than 20 ns. 2. TA is the case temperature. 2 L 3 3 3 mA 0.5 0.5 0.5 mA 6 6 6 mA CY7C1041 Electrical Characteristics Over the Operating Range (continued) Test Conditions Parameter 7C1041-20 Description Min. VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA VIH Input HIGH Voltage VIL Input LOW Voltage[1] IIX Input Load Current GND < VI < VCC IOZ Output Leakage Current GND < VOUT < VCC, Output Disabled ICC VCC Operating Supply Current VCC = Max., f = fMAX = 1/tRC ISB1 Automatic CE Power-Down Current —TTL Inputs Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX ISB2 Automatic CE Power-Down Current —CMOS Inputs Max. VCC, CE > VCC – 0.3V, VIN > VCC – 0.3V, or VIN < 0.3V, f = 0 Min. 2.4 Max. Unit 0.4 V V 2.4 0.4 V 2.2 VCC + 0.5 2.2 VCC + 0.5 –0.5 0.8 –0.5 0.8 V –1 +1 –1 +1 µA –1 +1 –1 +1 µA 230 220 mA 40 40 mA 3 3 mA 0.5 0.5 mA 6 6 mA Com’l Com’l 7C1041-25 Max. L Ind’l Capacitance[3] Parameter Description CIN Input Capacitance COUT I/O Capacitance Test Conditions Max. Unit 8 pF 8 pF TA = 25°C, f = 1 MHz, VCC = 5.0V Note: 3. Tested initially and after any design or process changes that may affect these parameters. AC Test Loads and Waveforms R1 481Ω 5V R1 481 Ω 5V OUTPUT ALL INPUT PULSES 3.0V 90% OUTPUT 30 pF INCLUDING JIG AND SCOPE (a) R2 255Ω R2 255Ω 5 pF INCLUDING JIG AND SCOPE (b) GND ≤ 3 ns 10% 90% 10% ≤ 3 ns 1041–3 1041–4 THÉVENIN EQUIVALENT 167Ω 1.73V OUTPUT Equivalent to: 3 CY7C1041 Switching Characteristics[4] Over the Operating Range 7C1041-12 Parameter Description Min. Max. 7C1041-15 Min. Max. 7C1041-17 Min. Max. Unit READ CYCLE tRC Read Cycle Time tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid 12 tDOE OE LOW to Data Valid 6 tLZOE OE LOW to Low Z 12 15 12 3 tHZOE OE HIGH to High Z tLZCE CE LOW to Low Z[6] 6 CE HIGH to High Z tPU CE LOW to Power-Up ns 15 17 ns 7 7 ns 3 0 ns 0 7 3 6 ns 17 0 3 [5, 6] tHZCE 15 3 0 [5, 6] 17 ns 7 3 7 0 ns ns 7 0 ns ns tPD CE HIGH to Power-Down 12 15 17 ns tDBE Byte Enable to Data Valid 6 7 7 ns tLZBE Byte Enable to Low Z tHZBE Byte Disable to High Z WRITE CYCLE 0 0 6 0 7 ns 7 ns [7, 8] tWC Write Cycle Time 12 15 17 ns tSCE CE LOW to Write End 10 12 14 ns tAW Address Set-Up to Write End 10 12 14 ns tHA Address Hold from Write End 0 0 0 ns tSA Address Set-Up to Write Start 0 0 0 ns tPWE WE Pulse Width 10 12 14 ns tSD Data Set-Up to Write End 7 8 8 ns tHD Data Hold from Write End 0 0 0 ns tLZWE WE HIGH to Low Z[6] 3 3 3 ns [5, 6] tHZWE WE LOW to High Z tBW Byte Enable to End of Write 6 10 7 12 7 12 ns ns Shaded areas contain preliminary information. Notes: 4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 5. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage. 6. At any given temperature and voltage condition, t HZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 7. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 8. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 4 CY7C1041 Switching Characteristics[4] Over the Operating Range (continued) 7C1041-20 Parameter Description Min. 7C1041-25 Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time 20 tAA Address to Data Valid tOHA Data Hold from Address Change tACE CE LOW to Data Valid tDOE OE LOW to Data Valid tLZOE OE LOW to Low Z 25 20 25 ns 20 25 ns 8 10 ns 3 5 0 [5, 6] tHZOE OE HIGH to High Z tLZCE CE LOW to Low Z[6] tHZCE CE HIGH to High Z ns 0 8 ns 10 3 [5, 6] ns 5 8 ns ns 10 ns tPU CE LOW to Power-Up tPD CE HIGH to Power-Down 20 25 ns tDBE Byte Enable to Data Valid 8 10 ns tLZBE Byte Enable to Low Z tHZBE Byte Disable to High Z 0 0 0 ns 0 8 ns 10 ns WRITE CYCLE[7, 8] tWC Write Cycle Time 20 25 ns tSCE CE LOW to Write End 13 15 ns tAW Address Set-Up to Write End 13 15 ns tHA Address Hold from Write End 0 0 ns tSA Address Set-Up to Write Start 0 0 ns tPWE WE Pulse Width 13 15 ns tSD Data Set-Up to Write End 9 10 ns tHD Data Hold from Write End 0 0 ns [6] tLZWE WE HIGH to Low Z tHZWE WE LOW to High Z[5, 6] tBW Byte Enable to End of Write 3 5 8 ns 10 13 15 ns ns Data Retention Characteristics Over the Operating Range Parameter Conditions[10] Description VDR VCC for Data Retention ICCDR Data Retention Current Min. Max. 2.0 Com’l L Unit V µA VCC = VDR = 2.0V, CE > VCC – 0.3V, VIN > VCC – 0.3V or VIN < 0.3V 200 µA µA tCDR[3] Chip Deselect to Data Retention Time tR[9] Operation Recovery Time 0 ns See Note 9 Notes: 9. t r < 100 µs for all speeds. 10. No input may exceed VCC + 0.5V. 5 CY7C1041 Data Retention Waveform DATA RETENTION MODE 3.0V VCC VDR > 2V 3.0V tR tCDR CE 1041–5 Switching Waveforms Read Cycle No.1 [11, 12] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID 1041-6 Read Cycle No.2 (OE Controlled) [12, 13] ADDRESS tRC CE tACE OE tHZOE tDOE BHE, BLE tLZOE tHZCE tDBE tLZBE DATA OUT tHZBE HIGH IMPEDANCE DATA VALID tLZCE V CC SUPPLY CURRENT HIGH IMPEDANCE tPD tPU IICC CC 50% 50% IISB SB 1041-7 Notes: 11. Device is continuously selected. OE, CE, BHE, and/or BHE = VIL. 12. WE is HIGH for read cycle. 13. Address valid prior to or coincident with CE transition LOW. 6 CY7C1041 Switching Waveforms (continued) Write Cycle No. 1 (CE Controlled) [14, 15] tWC ADDRESS CE tSA tSCE tAW tHA tPWE WE tBW BHE, BLE tSD tHD DATAI/O 1041-8 Write Cycle No. 2 (BLE or BHE Controlled) tWC ADDRESS BHE, BLE tSA tBW tAW tHA tPWE WE tSCE CE tSD tHD DATAI/O 1041-9 Notes: 14. Data I/O is high impedance if OE or BHE and/or BLE= VIH. 15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 7 CY7C1041 Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, LOW) tWC ADDRESS tSCE CE tAW tHA tSA tPWE WE tBW BHE, BLE tHZWE tSD tHD DATA I/O tLZWE 1041-10 Truth Table CE OE WE BLE BHE I/O0–I/O7 I/O8–I/O15 H X X X X High Z High Z Power Down Standby (ISB) L L H L L Data Out Data Out Read All Bits Active (ICC) L L H L H Data Out High Z Read Lower Bits Only Active (ICC) L L H H L High Z Data Out Read Upper Bits Only Active (ICC) L X L L L Data In Data In Write All Bits Active (ICC) L X L L H Data In High Z Write Lower Bits Only Active (ICC) L X L H L High Z Data In Write Upper Bits Only Active (ICC) L H H X X High Z High Z Selected, Outputs Disabled Active (ICC) 8 Mode Power CY7C1041 Ordering Information Speed (ns) 15 17 20 25 15 17 20 25 Ordering Code Package Name Package Type CY7C1041-15VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041L-15VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041-15ZC Z44 44-Lead TSOP Type II CY7C1041L-15ZC Z44 44-Lead TSOP Type II CY7C1041-17VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041L-17VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041-17ZC Z44 44-Lead TSOP Type II CY7C1041L-17ZC Z44 44-Lead TSOP Type II CY7C1041-20VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041L-20VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041-20ZC Z44 44-Lead TSOP Type II CY7C1041L-20ZC Z44 44-Lead TSOP Type II CY7C1041-25VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041L-25VC V34 44-Lead (400-Mil) Molded SOJ CY7C1041-25ZC Z44 44-Lead TSOP Type II CY7C1041L-25ZC Z44 44-Lead TSOP Type II CY7C1041-15ZI Z44 44-Lead TSOP Type II CY7C1041-15VI V34 44-Lead (400-Mil) Molded SOJ CY7C1041-17ZI V34 44-Lead TSOP Type II CY7C1041-17VI Z44 44-Lead (400-Mil) Molded SOJ CY7C1041-20ZI Z44 44-Lead TSOP Type II CY7C1041-20VI Z44 44-Lead (400-Mil) Molded SOJ CY7C1041-25ZI Z44 44-Lead TSOP Type II CY7C1041-25VI Z44 44-Lead (400-Mil) Molded SOJ Document #: 38-00644-B 9 Operating Range Commercial Industrial CY7C1041 Package Diagrams 44-Lead (400-Mil) Molded SOJ V34 51-85082-B 44-Pin TSOP II Z44 51-85087-A © Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.