AXT3, 4 For board-to-board For board-to-FPC P4S Series Narrow pitch connectors (0.4mm pitch) FEATURES 1. Space-saving (3.6 mm widthwise) Smaller compared to P4 series with soldering terminals (30 pin contacts): Socket — 38% smaller, Header — 34% smaller 3. Greater flexibility in connector placement. Pattern wiring to the connector bottom is made possible with a molded covering on the undersurface of the connector. <Header> <Socket> m m 35 2. m 6m 3. Socket Header Pickup cover (Material: SUS) (Both covered and uncovered types are available.) Socket RoHS compliant Soldering terminals at each corner Soldering terminals Soldering terminals at each corner at each corner Connector bottom: Create any thru-hole and pattern wiring. 8.70 (30 pin contacts) 3.60 Pickup cover (Material: LCP) (Both covered and uncovered types are available.) Soldering terminals at each corner Header 7.90 (30 pin contacts) 4. Gull-wing-shaped terminals to facilitate visual inspections. 5. Connectors for inspection available APPLICATIONS Mobile devices, such as cellular phones, digital still cameras and digital video cameras. 2.35 2. Strong resistance to adverse environments! Utilizes “ ” construction for high contact reliability. ORDERING INFORMATION AXT 4 3: Narrow Pitch Connector P4S (0.4 mm pitch) Socket 4: Narrow Pitch Connector P4S (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.5 mm and 2.0 mm 2: For mated height 2.5 mm and 3.0 mm <Header> 1: For mated height 1.5 mm and 2.5 mm 2: For mated height 2.0 mm 3: For mated height 3.0 mm Functions <Socket/Header> 2: Without pickup cover, without positioning bosses 6: With pickup cover, without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 4: Ni plating on base, Au plating on surface Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T AXT3, 4 PRODUCT TYPES Mated height 1.5mm 2.0mm 2.5mm 3.0mm Number of pins 10 16 20 22 24 26 30 32 34 36 38 40 44 46 50 54 60 64 70 80 90 100 40 90 100 20 30 40 60 80 100 20 30 60 80 100 Part number Socket AXT310124 AXT316124 AXT320124 AXT322124 AXT324124 AXT326124 AXT330124 AXT332124 AXT334124 AXT336124 AXT338124 AXT340124 AXT344124 AXT346124 AXT350124 AXT354124 AXT360124 AXT364124 AXT370124 AXT380124 AXT390124 AXT300124 AXT340124 AXT390124 AXT300124 AXT320224 AXT330224 AXT340224 AXT360224 AXT380224 AXT300224 AXT320224 AXT330224 AXT360224 AXT380224 AXT300224 Packing Header AXT410124 AXT416124 AXT420124 AXT422124 AXT424124 AXT426124 AXT430124 AXT432124 AXT434124 AXT436124 AXT438124 AXT440124 AXT444124 AXT446124 AXT450124 AXT454124 AXT460124 AXT464124 AXT470124 AXT480124 AXT490124 AXT400124 AXT440224 AXT490224 AXT400224 AXT420124 AXT430124 AXT440124 AXT460124 AXT480124 AXT400124 AXT420324 AXT430324 AXT460324 AXT480324 AXT400324 Inner carton Outer carton 3,000 pieces 6,000 pieces 3,000 pieces 6,000 pieces 3,000 pieces 6,000 pieces 3,000 pieces 6,000 pieces Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office. Samples: Small lot orders are possible. Please consult us. 2. If you require the pickup cover, change the eighth digit of the part number from “2” to “6” in your order. Note that the pickup cover is not available for some types depending on the number of pins. Check the latest product specifications. 3. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. ACCTB14E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXT3, 4 SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Specifications 0.3A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC Breakdown voltage 150V AC for 1 min. Insulation resistance Min. 1,000MΩ (initial) Contact resistance Max. 90mΩ Composite insertion force Composite removal force Contact holding force (Socket contact) Ambient temperature Max. 0.981N/pin contacts × pin contacts (initial) Min. 0.0588N/pin contacts × pin contacts Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1mA. Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures Min. 0.981N/pin contacts –55°C to +85°C Max. peak temperature of 260°C (on the surface of the PC board around the connector terminals) 300°C within 5 sec. or 350°C within 3 sec. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) Soldering heat resistance Storage temperature Conditions — — Infrared reflow soldering Soldering iron No freezing at low temperatures Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ 24 hours, insulation resistance min. 100MΩ, contact resistance max. 90mΩ Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 90mΩ H2S resistance (header and socket mated) 48 hours, contact resistance max. 90mΩ Insertion and removal life 50 times Time (minutes) 30 Max. 5 30 Max. 5 Temperature 40±2°C, humidity 90 to 95% R.H. Temperature 35±2°C, saltwater concentration 5±1% Temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Mated height 1.5mm, 20 pin contact type: Socket: 0.04 g Header: 0.02 g Unit weight 2. Material and surface treatment Part name Molded portion Material LCP resin (UL94V-0) Contact and Post Copper alloy Panasonic Corporation Surface treatment — Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal) However, the area adjacent to the socket terminal is exposed to Ni on base. Soldering terminals portion; Socket: Ni plating on base, Pd + Au flash plating on surface (Expect for front edge of terminal) Header: Ni plating on base, Au plating on surface (Expect for front edge of terminal) Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T AXT3, 4 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ 1. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm, 3.0mm) • Without pickup cover CAD Data Dimension table (mm) A Terminal coplanarity 0.08 (Contact and soldering terminals) E B±0.1 0.40±0.05 3.60 2.60 (0.50) 3.00 Suction face 0.70 0.15±0.03 Z (Note) 0.55 0.30±0.03 C±0.1 (0.90) 1.80 3.60 (0.66) Y (Note) General tolerance: ±0.2 Number of pins/ dimension 10 16 20 22 24 26 30 32 34 36 38 40 44 46 50 54 60 64 70 80 90 100 Mated height/ dimension 1.5mm 2.0mm 2.5mm 3.0mm A B C 4.70 5.90 6.70 7.10 7.50 7.90 8.70 9.10 9.50 9.90 10.30 10.70 11.50 11.90 12.70 13.50 14.70 15.50 16.70 18.70 20.70 22.70 1.60 2.80 3.60 4.00 4.40 4.80 5.60 6.00 6.40 6.80 7.20 7.60 8.40 8.80 9.60 10.40 11.60 12.40 13.60 15.60 17.60 19.60 3.50 4.70 5.50 5.90 6.30 6.70 7.50 7.90 8.30 8.70 9.10 9.50 10.30 10.70 11.50 12.30 13.50 14.30 15.50 17.50 19.50 21.50 E 1.45 1.45 2.45 2.45 • With pickup cover A B±0.1 2.60 3.00 (0.50) Pickup cover (0.66) 0.30±0.03 C±0.1 0.55 Z (Note) (0.90) 1.80 Y (Note) 3.60 Suction face 2.80 (for 10 pin contacts: 2.60) 0.15±0.03 3.60 Terminal coplanarity 0.08 (Contact and soldering terminals) E 0.40±0.05 General tolerance: ±0.2 Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically. ACCTB14E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXT3, 4 2. Header (Mated height: 1.5mm, 2.5mm) • Without pickup cover CAD Data Suction face 0.54 A 0. 20 0.40±0.05 Dimension table (mm) Number of pins/ dimension 10 3.90 1.60 3.20 5.40 16 20 22 24 26 30 32 34 36 38 40 44 46 50 54 60 64 70 80 90 100 5.10 5.90 6.30 6.70 7.10 7.90 8.30 8.70 9.10 9.50 9.90 10.70 11.10 11.90 12.70 13.90 14.70 15.90 17.90 19.90 21.90 2.80 3.60 4.00 4.40 4.80 5.60 6.00 6.40 6.80 7.20 7.60 8.40 8.80 9.60 10.40 11.60 12.40 13.60 15.60 17.60 19.60 4.40 5.20 5.60 6.00 6.40 7.20 7.60 8.00 8.40 8.80 9.20 10.00 10.40 11.20 12.00 13.20 14.00 15.20 17.20 19.20 21.20 6.60 7.40 7.80 8.20 8.60 9.40 9.80 10.20 10.60 11.00 11.40 12.20 12.60 13.40 14.20 15.40 – 17.40 19.40 21.40 23.40 A B C D 2.35 R (0.45) 0. 25 2.35 R 0.15±0.03 1.45 R Terminal coplanarity 0.08 (Post and soldering terminals) 1.24 B±0.1 0. (0.33) Soldering terminals 0.15±0.03 C±0.1 0.84 1.49 (Soldering terminals portion) 20 General tolerance: ±0.2 D B±0.1 0.40±0.05 1.64 0.15±0.03 Terminal coplanarity 0.08 (Contact and soldering terminals) 2.35 2.05 Suction face 1.75 • With pickup cover C±0.1 A 0.84 0.15±0.03 (0.33) 1.49 Soldering terminals (Soldering terminals portion) Pickup cover General tolerance: ±0.2 Note: The soldering terminal dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T AXT3, 4 3. Header (Mated height: 2.0mm) • Without pickup cover CAD Data Suction face 0.54 A B±0.1 1.74 0.40±0.05 0.15±0.03 20 R R 0. 25 0. 1.45 R Terminal coplanarity 0.08 (Post and soldering terminals) 0. 20 Soldering terminals C±0.1 Number of pins/ dimension 40 0.84 2.35 0.15±0.03 (0.33) Dimension table (mm) General tolerance: ±0.2 90 100 A B 9.90 7.60 C 9.20 11.40 19.90 17.60 19.20 21.40 21.90 19.60 21.20 – • With pickup cover D B±0.1 2.14 Terminal coplanarity 0.08 (Contact and soldering terminals) Suction face 1.75 2.05 0.40±0.05 0.15±0.03 Pickup cover C±0.1 A (0.76) 0.84 2.35 Soldering terminals 0.15±0.03 General tolerance: ±0.2 Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. ACCTB14E 201303-T Panasonic Corporation Automation Controls Business Division D industrial.panasonic.com/ac/e/ AXT3, 4 4. Header (Mated height: 3.0mm) • Without pickup cover CAD Data Suction face 0.54 A 0. 20 0.40±0.05 R (0.45) 0. 25 2.35 R 0.15±0.03 1.45 R Terminal coplanarity 0.08 (Post and soldering terminals) 2.24 B±0.1 0. 20 Soldering terminals Dimension table (mm) Number of pins/ dimension 20 (0.76) 0.84 2.35 0.15±0.03 C±0.1 General tolerance: ±0.2 30 60 80 100 A B C D 5.90 3.60 5.20 – 7.90 5.60 7.20 9.40 13.90 11.60 13.20 – 17.90 15.60 17.20 19.40 21.90 19.60 21.20 – • With pickup cover Suction face 1.75 D B±0.1 Terminal coplanarity 0.08 (Post and soldering terminals) 2.64 0.40±0.05 0.15±0.03 2.05 X X Pickup cover C±0.1 0.84 0.15±0.03 (0.76) 2.35 Soldering terminals A General tolerance: ±0.2 Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T AXT3, 4 Socket and Header are mated Header Header Header Socket 1.50±0.15 2.00±0.15 Socket 2.50±0.15 Socket 3.00±0.15 Header Socket EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header) • Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A±0.3 • Plastic reel dimensions (Conforming to EIAJ ET-7200B) Label B C 8.0 Top cover tape 4 2 Pull out direction 4 2 1.75 380 dia. 1.75 Pull out direction Taping reel D±1 A±0.3 C Embossed carrier tape Embossed mounting-hole 8.0 1.5+0.1 0 dia. 1.5+0.1 0 dia. Dimension table (mm) Mated height Common for socket and header: 1.5mm, 2.0mm, 2.5mm and 3.0mm Number of pins Socket Header (with/without pickup cover) (with pickup cover) Header (without pickup cover) Max. 24 26 to 70 72 to 100 — Max. 24 26 to 64 66 to 90 100 Type of taping A B C D Quantity per reel Tape I Tape I Tape II Tape II 16.00 24.00 32.00 44.00 — — 28.40 40.40 7.50 11.50 14.20 20.20 17.50 25.50 33.50 45.50 3,000 3,000 3,000 3,000 Connector orientation with respect to direction of progress of embossed tape Type Common for P4S Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. ACCTB14E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXT3, 4 For board-to-board For board-to-FPC P4S Series Connectors for inspection usage (0.4mm pitch) m m 35 2. m 6m 3. Socket Header RoHS compliant FEATURES APPLICATIONS 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Note: Mating retention force cannot be warranted. Ideal for module unit inspection and equipment assembly inspection TABLE OF PRODUCT TYPES ✩: Available for sale Product name P4S for inspection 10 ✩ 16 ✩ 20 ✩ 22 ✩ 24 ✩ 26 ✩ 30 ✩ 32 ✩ 34 ✩ Number of pins 36 38 ✩ ✩ 40 ✩ 44 ✩ 50 ✩ 54 ✩ 60 ✩ 70 ✩ 80 ✩ 90 ✩ 100 ✩ Notes: 1. You can use with each mated height in common. 2. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.) 3. Please inquire about number of pins other than those shown above. 4. Please inquire with us regarding availability. 5. Please keep the minimum order quantities no less than 50 pieces per lot. 6. Please inquire if further information is needed. PRODUCT TYPES Socket Specifications With pickup cover Without positioning bosses No pickup cover Without positioning bosses Part No. AXT3E∗∗66 AXT3E∗∗26 Header Specifications With pickup cover Without positioning bosses No pickup cover Without positioning bosses Part No. AXT4E∗∗66 AXT4E∗∗26 Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T AXT3, 4 NOTES 1.65±0.03 0.65±0.03 (0.50) 0.23±0.03 0.40±0.03 Max. 0.90 (0.75) 1.45±0.03 2.95±0.03 0.23±0.03 0.40±0.03 : Insulation area 0.80±0.01 0.45±0.01 1.65±0.01 0.65±0.01 (0.50) 0.95±0.01 0.70±0.01 (0.42) 1.91±0.01 2.75±0.01 Metal mask thickness: When 150 µm (Terminal portion opening area ratio: 49%) (Metal portion opening area ratio: 100%) (0.44) 3.12±0.01 4.00±0.01 Recommended metal mask pattern Metal mask thickness: When 150 µm (Terminal portion opening area ratio: 48%) (Metal portion opening area ratio: 100%) 0.20±0.01 0.40±0.01 0.20±0.01 0.40±0.01 Panasonic Corporation 0.20±0.01 0.40±0.01 Automation Controls Business Division (0.52) 1.71±0.01 2.75±0.01 0.80±0.01 0.45±0.01 1.65±0.01 0.65±0.01 (0.50) 0.95±0.01 0.70±0.01 4.00±0.01 Metal mask thickness: When 120 µm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 2.90±0.01 Recommended metal mask pattern Metal mask thickness: When 120 µm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) (0.55) Recommended metal mask pattern 4.20±0.01 1.80±0.01 (1.20) ACCTB14E 201303-T 0.80±0.03 0.45±0.03 Recommended metal mask pattern Max. 0.03 mm 3. If extra resistance to shock caused by dropping is required, we recommend using P4 Series. 4. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 4.20±0.03 0.95±0.03 0.70±0.03 (0.80) Recommended PC board pattern (TOP VIEW) 2.60±0.03 Recommended PC board pattern (TOP VIEW) 4.20±0.01 1.80±0.01 (1.20) Max. 0.03 mm Header (Mated height: 1.5mm and 2.5mm) (1.20) 2. Keep the PC board warp no more than 0.03mm in relation to the overall length of the connector. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm and 3.0mm) 1.80±0.03 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 0.20±0.01 0.40±0.01 industrial.panasonic.com/ac/e/ AXT3, 4 Header (Mated height: 2.0mm, 3.0mm) 0.80±0.03 0.65±0.03 (1.15) 0.45±0.03 Max. 0.90 (0.75) 1.45±0.03 2.95±0.03 Recommended PC board pattern (TOP VIEW) Please refer to the latest product specifications when designing your product. 0.23±0.03 0.40±0.03 : Insulation area Recommended metal mask pattern 2.95±0.01 0.65±0.01 (1.15) 0.80±0.01 0.45±0.01 (0.42) 1.91±0.01 2.75±0.01 Metal mask thickness: When 150 µm (Terminal portion opening area ratio: 49%) (Metal portion opening area ratio: 100%) 0.20±0.01 0.40±0.01 Recommended metal mask pattern 2.95±0.01 0.65±0.01 (1.15) 0.80±0.01 0.45±0.01 (0.52) 1.71±0.01 2.75±0.01 Metal mask thickness: When 120 µm (Terminal portion opening area ratio: 60%) (Metal portion opening area ratio: 100%) 0.20±0.01 0.40±0.01 Note: The recommended PC board pattern diagrams and metal mask pattern diagrams for headers with mated heights of 1.5 mm/ 2.5 mm and 2.0 mm/3.0 mm are different. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB14E 201303-T Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1) When connecting several connectors together by stacking, make sure to maintain proper accuracy in the design of structure and mounting equipment so that the connectors are not subjected to twisting and torsional forces. 2) With mounting equipment, there may be up to a ±0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 6) Notes when using a FPC. (1) When the connector is soldered to an FPC board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Please make the reinforcement board dimensions bigger than the outer limits of the recommended PC board pattern (should be approximately 1 mm greater than the outer limit). Material should be glass epoxy or polyimide, and the thickness should be between 0.2 and 0.3 mm. (2) Collisions, impacts, or turning of FPC boards, may apply forces on the connector and cause it to come loose. Therefore, make to design retaining plates or screws that will fix the connector in place. 7) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the catching force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. ACCTB48E 201303-T 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. Panasonic Corporation Automation Controls Business Division 6) Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding soldering Terminal Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). • Narrow pitch connectors (except P8 type) Upper limited (Solder heat resistance) Lower limited (Solder wettability) Temperature Peak temperature 260°C 230°C 180°C 150°C 4) Consult us when using a screenprinting thickness other than that recommended. 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) N2 reflow, conducting reflow soldering in a nitrogen atmosphere, increases the solder flow too greatly, enabling wicking to occur. Make sure that the solder feed rate and temperature profile are appropriate. Panasonic Corporation 25 sec. 70 sec. Time • Narrow pitch connector (P8) Table A Product name Soldering iron temperature SMD type connectors 300°C within 5 sec. 350°C within 3 sec. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Temperature 245°C max. Apply the solder wire here Peak temperature 200°C Preheating Terminal 60 to 120 sec. PC board foot pattern 220°C 200°C Preheating 60 to 120 sec. 155 to 165°C Paste solder Peak temperature 2. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. So ld iro erin n g 1. Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) As for cream solder printing, screen printing is recommended. 3) To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. Small angle as possible up to 45 degrees Within 30 sec. Time For products other than the ones above, please refer to the latest product specifications. 7) The temperatures are measured at the surface of the PC board near the connector terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) Consult us when using a screenprinting thickness other than that recommended. 10) Some solder and flux types may cause serious solder or flux creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. Automation Controls Business Division PC board Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) For soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. However, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. Also, be careful not to go too close to the connectors and melt any of the molded components. 8) If an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. Solder reworking 1) Finish reworking in one operation. 2) For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. industrial.panasonic.com/ac/e/ ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Repeated bending of the terminals may cause terminals to break. 4) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 5) Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them. Cleaning flux from PC board 3) Since some powerful cleaning solutions may dissolve molded components of the connector and wipe off or discolor printed letters, we recommend aqua pura electronic parts cleaners. Please consult us if you wish to use other types of cleaning fluids. 4) Please note that the surfaces of molded parts may whiten when cleaned with alcohol. Handling the PC board Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Be sure not to allow external pressure to act on connectors when assembling PCBs or moving in block assemblies. 1) To increase the cleanliness of the cleaning fluid and cleaning operations, prepare equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning, and then vapor cleaning. 2) Carefully oversee the cleanliness of the cleaning fluids to make sure that the contact surfaces do not become dirty from the cleaning fluid itself. • Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. When storing the connectors for more than six months, be sure to consider storage area where the humidity is properly controlled. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Other Notes 1) These products are made for the design of compact and lightweight devices and therefore the thickness of the molded components has been made very thin. Therefore, be careful during insertion and removal operations for excessive forces applied may damage the products. 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB48E 201303-T